JPH01108934U - - Google Patents
Info
- Publication number
- JPH01108934U JPH01108934U JP447188U JP447188U JPH01108934U JP H01108934 U JPH01108934 U JP H01108934U JP 447188 U JP447188 U JP 447188U JP 447188 U JP447188 U JP 447188U JP H01108934 U JPH01108934 U JP H01108934U
- Authority
- JP
- Japan
- Prior art keywords
- circuit tape
- positioning
- flexible circuit
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案にかかるフレキシブル回路テ
ープの平面図、第２図は、従来のフレキシブル回
路テープの平面図である。
１…フレキシブル回路テープ、２…インナーリ
ード、３…位置決めマーク、４…抜き穴、５…回
路パターン。
FIG. 1 is a plan view of a flexible circuit tape according to the present invention, and FIG. 2 is a plan view of a conventional flexible circuit tape. 1... Flexible circuit tape, 2... Inner lead, 3... Positioning mark, 4... Punch hole, 5... Circuit pattern.
Claims (1)
ブル回路テープにおいて、回路テープの抜き穴に
突出するインナーリードの近傍で対角線上の二カ
所に位置決め基準となる複数の位置決めマークを
設けてなることを特徴とするフレキシブル回路テ
ープ。 A flexible circuit tape subjected to inner lead bonding, characterized in that a plurality of positioning marks serving as positioning standards are provided at two diagonal locations near the inner leads protruding into punch holes in the circuit tape. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP447188U JPH01108934U (en) | 1988-01-18 | 1988-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP447188U JPH01108934U (en) | 1988-01-18 | 1988-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01108934U true JPH01108934U (en) | 1989-07-24 |
Family
ID=31207015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP447188U Pending JPH01108934U (en) | 1988-01-18 | 1988-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01108934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992000603A1 (en) * | 1990-06-26 | 1992-01-09 | Seiko Epson Corporation | Semiconductor device and method of manufacturing the same |
-
1988
- 1988-01-18 JP JP447188U patent/JPH01108934U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992000603A1 (en) * | 1990-06-26 | 1992-01-09 | Seiko Epson Corporation | Semiconductor device and method of manufacturing the same |