JPH01105544A - Paper drying method and its device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to vapor drying of wafers.

[Conventional technology]

Regarding paper drying technology for sea urchins, see Japanese Patent Application Laid-open No. 58-2.
It is disclosed in Japanese Patent No. 07638. The outline of this method is to dry the wafer by placing it in a deep burial chamber that creates a steam atmosphere by heating a drying chemical. In this method, the vapor of a drying chemical solution (hereinafter simply referred to as vapor), such as isopropyl alcohol vapor, which easily evaporates, is condensed on the wafer surface, and the wafer is dried by flowing down together with moisture and foreign matter on the wafer surface.

[Problem that the invention seeks to solve]

However, with conventional equipment, the moisture on the wafer surface may not be completely removed, resulting in water marks (marks of dried moisture).The inventors of the present invention have conducted extensive studies on this problem, and have found that with conventional equipment, water marks (marks of dried moisture) are left on the wafer surface. It has been found that there are cases in which a sufficient amount of condensation does not occur on the wafer surface. moreover,
When we investigated the cause of this, we found that the amount of vapor condensing on the wafer surface varies depending on the wafer temperature.

An object of the present invention is to provide a paper drying technique that can dramatically improve wafer drying and cleaning capabilities.

Another object of the present invention is to provide a technique that can stabilize paper drying of wafers.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, before the wafer is housed in a vapor atmosphere of a drying chemical and dried, the wafer is cooled to facilitate condensation of the vapor onto the wafer surface.

[Effect]

According to the above-mentioned means, the amount of steam condensed on the wafer surface can be increased, so that the moisture on the wafer surface can be easily replaced, and the formation of watermarks can be effectively prevented.

〔Example〕

The figure is a schematic explanatory diagram of a paper drying device which is an embodiment of the present invention. A detailed explanation will be given below according to the drawings. The apparatus of this embodiment has a loader section 3 which accommodates a cartridge 1 containing a large number of unprocessed Uninows 2. A cooling unit 4 for cooling the wafer 2 to a constant temperature. Drying section 5 for removing moisture from the surface of the wafer 2. The main components include an unloader section that stores the dried Uni-Noh while being set in the IJ joint 1, and a transport means 7 for transporting the cartridge 1 between them. Each of these configurations will be explained in detail below. First, the cooling section 4 will be explained. 8 is a cooling tank containing pure water or other material that does not contaminate the wafer 2;
Pure water or the like cooled to a constant temperature is supplied to the cooling tank 8 in an overflow state. Reference numeral 11 denotes a recovery tank for recovering overflowing cooling water 10, and the recovered pure water is regenerated in a regeneration processing section 11a, cooled again, and supplied to the cooling tank 8.

The drying section 5 includes a steam tank 13 containing a drying chemical solution (hereinafter referred to as "chemical solution") 12 which is an easily vaporized substance such as isopropyl alcohol (IPA), a heater 14 for evaporating the chemical solution 12, and a steam tank 13. a vertically movable arm 15 for moving the cartridge l transferred therein to the vicinity of the chemical solution 12; and a cooling pipe for cooling and recovering the steam 16 that has been heated by the heater 14 and has reached the upper part of the steam tank 13. 17
It consists of Note that 18 is a shutter that opens and closes when loading and unloading the cartridge l, and is synchronized with the operation of the conveying means 7.

The conveyance means 7 is composed of a flexible moving bar 19 that can slide up and down, right and left, and forward and backward, and a holding arm 20 that is connected to the bar 19 and that hooks and holds the nose portion 1a of the cartridge 1.

Next, the operation of this embodiment will be explained. First, the bar 19 is moved and one of the cartridges 10 in which the untreated Unino S2 stored in the loader section 3 is set is lifted by the holding arm 20 and immersed in the cooling tank 8.

The cooling water 10 is kept at a constant temperature (for example, 15C) by the temperature controller 9.
(below), each wafer has a uniform Kpj without variation between wafers, within wafer 1, and between batches.
The temperature will be set at a constant low temperature.

Note that the effect can be obtained if the temperature of the cooling water IO is set at least to a temperature lower than room temperature or to a temperature of wafer cleaning water. .

Next, when the steam tank 13 is empty, the transport means 7 is operated and the cartridge 1 is transferred from the cooling tank 8 into the steam tank 13 using the holding arm 20. At this time,
The shutter 18 is in an open state, and the vertically movable arm 15 is at the upper limit position, and is controlled to descend when the vertically movable arm 15 receives the cartridge 1 from the holding arm 20.

The shutter 18 is closed after the holding arm 20 has retreated to the outside of the steam tank 13. Incidentally, since each wafer 2 is inserted into the steam bath 13 while being cooled to a low temperature, the steam 16 quickly condenses in a large amount at K on the wafer surface.

Therefore, moisture and foreign matter adhering to the wafer surface are absorbed into the large amount of condensed chemical solution, fall from the wafer, and are removed. After performing the drying process for a certain period of time, the wafer 2 housed in the cartridge 1 is transferred from the drying section 5 to the unloader section 6 by the moving means 7 and stored therein.

Next, the functions and effects of this embodiment will be explained.

(1) By cooling the wafer to at least a temperature lower than room temperature and then supplying it to a steam bath for drying, the amount of vapor condensation on the wafer surface can be dramatically increased, ensuring that moisture is removed. This has the effect of being able to remove.

(2) By cooling the wafer to at least a temperature lower than room temperature and then supplying it to a steam bath for drying, the amount of vapor condensation on the wafer surface can be dramatically increased. The flow of steam condensed water has the effect of removing foreign matter.

(3) By cooling the wafer to a constant temperature and then supplying it to a steam bath for drying, there is no variation in wafer temperature within the wafer, between wafers, or between batches, and a stable amount of condensation is achieved. When it occurs on the wafer surface, it becomes K,
This provides the effect that water and foreign matter can be removed reliably.

(4) Since the wafer is cooled to a low temperature, a sufficient amount of steam can be condensed just by placing it in the steam bath for a short time, so the drying speed can be significantly improved, and therefore the throughput can be improved.

(5) (1) and (21) provide the effect of preventing watermark defects on the wafer surface.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, in this example, cooling is performed using cooling water, but the cooled gas (
(dry ice, etc.) may also be used.

The above explanation has mainly been about the application of the invention made by the present inventor to wafer drying technology, which is the background field of application, but is not limited to this; for example, application to the surface of a semiconductor package. It can be applied to cleaning before marking and cleaning various other items.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, moisture on the wafer surface can be removed reliably and in a short time.

[Brief explanation of the drawing]

The figure is an overall configuration diagram of a paper drying apparatus which is an embodiment of the present invention.

Claims (1)

[Claims] 1. In a paper drying method in which a wafer is placed in a drying chemical vapor and moisture and foreign matter adhering to the wafer surface are removed, the wafer is cooled before being supplied into the vapor. A paper drying method characterized by keeping the paper dry. 2. A paper drying device that has a cooling section that accommodates and cools the wafer, and a drying section that has a vapor atmosphere of a drying chemical. 3. The paper drying apparatus according to claim 2, wherein the wafer cooling section is maintained at a constant temperature.