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JPH01101002A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH01101002A
JPH01101002A JP62259021A JP25902187A JPH01101002A JP H01101002 A JPH01101002 A JP H01101002A JP 62259021 A JP62259021 A JP 62259021A JP 25902187 A JP25902187 A JP 25902187A JP H01101002 A JPH01101002 A JP H01101002A
Authority
JP
Japan
Prior art keywords
diode
electrodes
pairs
capacitor
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62259021A
Other languages
Japanese (ja)
Inventor
Isamu Nagameguri
長廻 勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62259021A priority Critical patent/JPH01101002A/en
Publication of JPH01101002A publication Critical patent/JPH01101002A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Tone Control, Compression And Expansion, Limiting Amplitude (AREA)

Abstract

PURPOSE:To improve a diode element characteristic by connecting two pairs of external leads to be faced to two pairs of electrodes on an insulator, connecting one pair of the electrodes among the two pairs by means of a diode and a fine metallic line, mounting and connecting a capacitor to one side of the pair of the electrodes, and connecting the counter electrode of the capacitor to the electrode pair of the other side. CONSTITUTION:When an input power is made sufficiently large and a current flows to a PIN diode 1, the resistance of the diode is lowered, and it is considered to be a short circuit. At such a time, when a capacitor 2 of a capacity C1 to generate a serial resonance with an L1 to a signal frequency is inserted in series to the L1. Since an impedance to see the diode from an input port is made into the short circuit, a total reflection is executed. When the input power is sufficiently small, the PIN diode 1 is made into a high resistance, and a signal is transmitted from a line 12 to a line 13. One part of the signal flows into the side of the diode element 1. In order to prevent it, a parallel resonance with the capacity in a diode vicinity is made to occur by the circuit of an inductance L3 and a capacitance C2. Thus, a high impedance can be realized, and losses can be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置に関し、特にレーダ装置で使用され
る過入力電力保護用ダイオードリミッタの構造に関する
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to the structure of a diode limiter for over-input power protection used in a radar device.

〔従来の技術〕[Conventional technology]

一般に、過入力保護用リミッタ回路は、低入力電力レベ
ルでは入力を損失なく、伝播させ過入力電力時にはでき
るだけ伝播させないようにして、低雑音増幅器への過入
力を抑える必要がある。このため、従来PIN構造のダ
イオードを用いダイオードに流れる電流により、ダイオ
ードの直列抵抗が変化することを利用して、リミッタ回
路を構成していた。
Generally, an over-input protection limiter circuit needs to propagate the input without loss at low input power levels, and prevent the input from propagating as much as possible at over-input power levels, thereby suppressing over-input to the low-noise amplifier. For this reason, a limiter circuit has conventionally been constructed using a diode having a PIN structure and utilizing the fact that the series resistance of the diode changes depending on the current flowing through the diode.

第4図(a)、(b)は従来のリミッタ回路の一例の回
路図および・その等価回路図を示す。すなわち、線路2
5の中央にダイオードlが接続され、線路25の両端に
、信号源抵抗21をもつ信号源20と、負荷抵抗22と
が接続されている。
FIGS. 4(a) and 4(b) show a circuit diagram of an example of a conventional limiter circuit and its equivalent circuit diagram. That is, line 2
A diode l is connected to the center of the line 25, and a signal source 20 having a signal source resistance 21 and a load resistance 22 are connected to both ends of the line 25.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前述したように過入力保護用リミッタ回路では、この回
路の後段に低雑音増幅器又はミキサ等の回路が接続され
るため、リミッタ回路に損失があると、これが入力回路
損となり低雑音増幅器の受信感度を悪くする。
As mentioned above, in the over-input protection limiter circuit, a circuit such as a low-noise amplifier or mixer is connected after this circuit, so if there is a loss in the limiter circuit, this becomes an input circuit loss and the receiving sensitivity of the low-noise amplifier is affected. make things worse.

今、信号周波数を10GHzとした場合、入力信号が微
弱でダイオードには電流が流れず、高抵抗を呈する場合
、仮にケース容量が0.2PFとすると、第4図の場合
負荷に供給される電力は0.4dBの透過損を生じる。
Now, if the signal frequency is 10 GHz, and the input signal is weak and no current flows through the diode, and it exhibits high resistance, and if the case capacitance is 0.2 PF, the power supplied to the load in the case shown in Figure 4 is produces a transmission loss of 0.4 dB.

一方、過入力時には、ダイオード1は低抵抗を呈し、第
4図の場合に入力電力は反射されて負荷には伝播されな
いはずである。しかしこの等価回路として第4図(b)
を考えた場合、内部のインダクタンスLsが0.2nH
程度であっても、10Ghzでは12.6Ωになる。そ
のため信号は、信号源側に反射して戻らず、負荷側に通
過されてくる。この場合、ダイオードの抵抗がOΩでも
、入力信号が負荷側に約7dB減衰して現われる。この
ようにダイトート素子の抵抗値が十分高抵抗、あるいは
低抵抗になっていても外部回路の影響で十分な特性が得
られない欠点があった。すなわち、従来の構成では、ダ
イオード近傍のワイヤインダクタンスやケース容量など
の寄生素子により、マイクロ波帯ではダイオード自身の
もつ低損失、高アイソレーションが損われてしまう問題
があった。
On the other hand, at the time of excessive input, the diode 1 exhibits a low resistance, and in the case of FIG. 4, the input power is reflected and should not be propagated to the load. However, as this equivalent circuit, Fig. 4(b)
When considering, the internal inductance Ls is 0.2nH
Even if the resistance is only 12.6Ω at 10GHz. Therefore, the signal is not reflected back to the signal source side, but is passed to the load side. In this case, even if the resistance of the diode is OΩ, the input signal appears on the load side attenuated by about 7 dB. As described above, even if the resistance value of the Daitoto element is sufficiently high or low, there is a drawback that sufficient characteristics cannot be obtained due to the influence of the external circuit. That is, in the conventional configuration, there was a problem in that the low loss and high isolation of the diode itself was impaired in the microwave band due to parasitic elements such as wire inductance and case capacitance near the diode.

本発明の目的は、このような問題を解決し、素子近傍に
配した直・並列共振回路で寄生素子の付加がインピーダ
ンスをキャンセルし、素子特性を改善した半導体装置を
提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve such problems and provide a semiconductor device in which impedance is canceled by the addition of parasitic elements using a series/parallel resonant circuit placed near the element, and element characteristics are improved.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の構成は、金属ベースと、この金属ベースを一電
極としてこの金属ベース上に載置されたダイオード素子
と、このダイオード素子の周囲で前記金属ベース上に配
設された二対の絶縁体と、これら絶縁体上にそれぞれ配
置された電極と、これら電極と前記ダイオードとを接続
する金属細線とを含む半導体装置において、前記絶縁体
上の電極に対向して二対の外部リードが接続され、この
二対のうち一対の電極が前記ダイオードと金属細線で接
続され、この一対の電極の一方に前記金属細線のインダ
クタンスと使用周波数で共振する容量をもつキャパシタ
が載置されて接続され、このキャパシタの対向電極が前
記外部リード対と直交するもう一方の電極対に接続され
たことを特徴とする。
The structure of the present invention includes a metal base, a diode element placed on the metal base using the metal base as one electrode, and two pairs of insulators placed on the metal base around the diode element. In a semiconductor device including electrodes respectively arranged on these insulators and thin metal wires connecting these electrodes and the diode, two pairs of external leads are connected opposite to the electrodes on the insulators. Of these two pairs, one pair of electrodes is connected to the diode with a thin metal wire, and a capacitor having a capacitance that resonates at the inductance of the thin metal wire and the frequency used is mounted on one of the pair of electrodes and connected to the diode. The capacitor is characterized in that a counter electrode thereof is connected to another pair of electrodes orthogonal to the pair of external leads.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図(a)、’(b)は本発明の一実施例の一部破断
平面図および内部断面図、第2図は第1図の等価回路図
である。本実施例は、ヒートシンク6と取付ネジ7を設
けた金属ベース5上に、表面に電極8を形成した絶縁体
4を端部の4個所と中央部に設けている。中央の絶縁体
4上にはダイオード素子1が設けられ、このダイオード
素子1の一方の電極が金属ベース5と接合されている。
1(a) and 1(b) are a partially cutaway plan view and internal sectional view of an embodiment of the present invention, and FIG. 2 is an equivalent circuit diagram of FIG. 1. In this embodiment, on a metal base 5 provided with a heat sink 6 and mounting screws 7, insulators 4 having electrodes 8 formed on their surfaces are provided at four locations at the ends and at the center. A diode element 1 is provided on the central insulator 4, and one electrode of the diode element 1 is joined to the metal base 5.

図の上側の電極8上にはコンデンサ(素子)2が載置さ
れて外部リード11と接続され、下側電極8には外部リ
ード14が接続され、これら上下の電極8とダイオード
1とが金属細線3で接続されている。また、左右の電極
8とはダイオード12゜13とそれぞれ接続され、これ
ら電極8とコンデンサ2の上側電極とが金属細線3で接
続されている。
A capacitor (element) 2 is placed on the upper electrode 8 in the figure and connected to an external lead 11, an external lead 14 is connected to the lower electrode 8, and these upper and lower electrodes 8 and the diode 1 are connected to a metal They are connected by thin wire 3. Further, the left and right electrodes 8 are connected to diodes 12 and 13, respectively, and these electrodes 8 and the upper electrode of the capacitor 2 are connected by a thin metal wire 3.

第3図は本実施例の半導体装置10の使用回路の一例の
回路図およびその等価回路図を示している。
FIG. 3 shows a circuit diagram of an example of a circuit used in the semiconductor device 10 of this embodiment and its equivalent circuit diagram.

第3図を参照しながら動作を説明する。まず、入力電力
が十分大きくなりPINダイオード1に電流が流れると
、ダイオードの抵抗は低下してショートとみなせる。こ
の時外部ダイオード11と接続された金属細線8のイン
ダクタンスL1のインピーダイスが大きいとショートに
ならない。信号周波数に対しLlと直列共振を生ずるよ
うな容量C1のコンデンサ2を、このLlと直列に挿入
すると、入力ボートからダイオードをみ゛たインピーダ
ンスはショートとなるので全反射される。
The operation will be explained with reference to FIG. First, when the input power becomes sufficiently large and current flows through the PIN diode 1, the resistance of the diode decreases and it can be considered as a short circuit. At this time, if the impedance of the inductance L1 of the thin metal wire 8 connected to the external diode 11 is large, a short circuit will not occur. When a capacitor 2 having a capacitance C1 that causes series resonance with Ll at the signal frequency is inserted in series with Ll, the impedance seen from the input port to the diode becomes short-circuited and is totally reflected.

一方、入力電力が十分小さい時には、PINダイオード
1は高抵抗となっており、信号は線路12から13へ伝
達される。しかし、ダイオードの接合容量あるいは容器
の電極間容量があるために、この容量により入力ボート
からみたインピーダンスが十分高インピーダンスになら
ない。このため信号の一部が線路13へ伝達されずにダ
イオード素子1の側へ流れ込む。これを防止するため、
第3図のインダクタンス上3.キヤパシタンスC2の回
路でダイオード近傍の容量と並列共振を生ずるようにす
ることにより、高インピーダンスを実現し低損失を実現
できる。
On the other hand, when the input power is sufficiently small, the PIN diode 1 has a high resistance, and the signal is transmitted from the lines 12 to 13. However, due to the junction capacitance of the diode or the capacitance between the electrodes of the container, the impedance seen from the input port does not become sufficiently high due to this capacitance. Therefore, a part of the signal is not transmitted to the line 13 and flows into the diode element 1 side. To prevent this,
3. Above the inductance in Figure 3. By creating parallel resonance with the capacitance near the diode in the circuit with capacitance C2, high impedance and low loss can be achieved.

今、インダクタンスL1を0.2nHとすると、10G
Hzの信号周波数の場合、C1は1.27PFになる。
Now, if the inductance L1 is 0.2nH, 10G
For a signal frequency of Hz, C1 will be 1.27PF.

L3と02の回路で調整することになるが、第4の外部
導出リード14がダイオード1から直接接続されている
ため、ダイオードの近傍に入る容量値すべてと共振をと
ることができる利点がある。
Adjustment will be made using the L3 and 02 circuits, but since the fourth external lead 14 is directly connected to the diode 1, it has the advantage of being able to resonate with all capacitance values that enter the vicinity of the diode.

なお、本実施例ではPINダイオードについて述べたが
、本発明はスイッチングダイオードについても応用が可
能であり、またそのダイオードの極性については逆極性
でも使用可能であることはいうまでもない。
In this embodiment, a PIN diode has been described, but the present invention can also be applied to a switching diode, and it goes without saying that the polarity of the diode can be reversed.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、従来使用されていたPI
Nダイオードだけでは得られなかった特性が得られるよ
うになる。即ち、10 G Hzにおいてダイオード単
独ではアイソし−ションが7dB程度しか得られなかっ
たものが、20dBへと改善でき、さらに損失は0.8
dBから0.4dBへと改善することができた。
As explained above, the present invention is applicable to conventionally used PI
Characteristics that could not be obtained with just an N diode can now be obtained. In other words, at 10 GHz, isolation was only about 7 dB obtained with a diode alone, but it was improved to 20 dB, and the loss was further reduced to 0.8 dB.
We were able to improve it from dB to 0.4dB.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、(b)は本発明の一実施例の一部破断平
面図および内部詳細図、第2図は第1図の等価回路図、
第3図(a)、(b)は第1図の使用例の回路図および
等価回路図、第4図(a)。 (b)は従来のリミッタ回路の一例の回路図および等価
回路図である。 1・・・ダイオード(素子)、2・・・コンデンサ(素
子)、3・・・金属細線、4・・・絶縁体、5・・・金
属ベース、6・・・ヒートシンク、7・・・取付ネジ、
8・・・電極、10・・・半導体装置、11〜14・・
・外部リード。
FIGS. 1(a) and (b) are a partially cutaway plan view and internal details of an embodiment of the present invention, FIG. 2 is an equivalent circuit diagram of FIG. 1,
3(a) and 3(b) are a circuit diagram and an equivalent circuit diagram of the usage example of FIG. 1, and FIG. 4(a). (b) is a circuit diagram and an equivalent circuit diagram of an example of a conventional limiter circuit. 1... Diode (element), 2... Capacitor (element), 3... Metal thin wire, 4... Insulator, 5... Metal base, 6... Heat sink, 7... Installation screw,
8... Electrode, 10... Semiconductor device, 11-14...
・External lead.

Claims (1)

【特許請求の範囲】[Claims]  金属ベースと、この金属ベースを一電極としてこの金
属ベース上に載置されたダイオード素子と、このダイオ
ード素子の周囲で前記金属ベース上に配設された二対の
絶縁体と、これら絶縁体上にそれぞれ配置された電極と
、これら電極と前記ダイオードとを接続する金属細線と
を含む半導体装置において、前記絶縁体上の電極に対向
して二対の外部リードが接続され、この二対のうち一対
の電極が前記ダイオードと金属細線で接続され、この一
対の電極の一方に前記金属細線のインダクタンスと使用
周波数で共振する容量をもつキャパシタが載置されて接
続され、このキャパシタの対向電極が前記外部リード対
と直交するもう一方の電極対に接続されたことを特徴と
する半導体装置。
A metal base, a diode element placed on the metal base with the metal base as one electrode, two pairs of insulators placed on the metal base around the diode element, and a diode element placed on the metal base around the diode element, and In a semiconductor device including electrodes disposed on each side and a thin metal wire connecting these electrodes and the diode, two pairs of external leads are connected opposite to the electrodes on the insulator, and one of the two pairs A pair of electrodes are connected to the diode by a thin metal wire, a capacitor having a capacitance that resonates with the inductance of the thin metal wire at the frequency used is mounted on one of the electrodes, and the opposite electrode of this capacitor is connected to the diode. A semiconductor device characterized in that the external lead pair is connected to another electrode pair orthogonal to the external lead pair.
JP62259021A 1987-10-13 1987-10-13 Semiconductor device Pending JPH01101002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62259021A JPH01101002A (en) 1987-10-13 1987-10-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62259021A JPH01101002A (en) 1987-10-13 1987-10-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH01101002A true JPH01101002A (en) 1989-04-19

Family

ID=17328249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62259021A Pending JPH01101002A (en) 1987-10-13 1987-10-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH01101002A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008022255A (en) * 2006-07-12 2008-01-31 Japan Radio Co Ltd Limiter circuit
JP2011160262A (en) * 2010-02-02 2011-08-18 Mitsubishi Electric Corp Limiter circuit
CN110476353A (en) * 2017-03-28 2019-11-19 三菱电机株式会社 Diode linearizer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027450A (en) * 1983-07-26 1985-02-12 Ishikawajima Harima Heavy Ind Co Ltd Continuous casting method for steel plates
JPS6139701A (en) * 1984-07-31 1986-02-25 Nec Corp Hybrid integrated circuit device
JPS6245838B2 (en) * 1977-12-28 1987-09-29 Dainippon Printing Co Ltd

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245838B2 (en) * 1977-12-28 1987-09-29 Dainippon Printing Co Ltd
JPS6027450A (en) * 1983-07-26 1985-02-12 Ishikawajima Harima Heavy Ind Co Ltd Continuous casting method for steel plates
JPS6139701A (en) * 1984-07-31 1986-02-25 Nec Corp Hybrid integrated circuit device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008022255A (en) * 2006-07-12 2008-01-31 Japan Radio Co Ltd Limiter circuit
JP2011160262A (en) * 2010-02-02 2011-08-18 Mitsubishi Electric Corp Limiter circuit
CN110476353A (en) * 2017-03-28 2019-11-19 三菱电机株式会社 Diode linearizer
CN110476353B (en) * 2017-03-28 2024-02-20 三菱电机株式会社 Diode linearization circuit

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