JP7764542B2 - Imprinting apparatus and article manufacturing method - Google Patents

Description

The present invention relates to an imprinting apparatus and an article manufacturing method.

One known method for manufacturing articles such as semiconductor devices and MEMS is the imprinting method, in which the imprint material on a substrate is brought into contact with a mold and then cured while in contact with the mold, thereby forming the imprint material.

Patent Document 1 describes an imprinting apparatus that drops resist onto a pattern formation area on a substrate, presses a template against the resist, irradiates a light irradiation area including the boundary between the pattern formation area and the area outside it with light, and then irradiates the pattern formation area with light. Irradiating the light irradiation area with light hardens the resist on the light irradiation area, preventing the resist from entering the pattern formation area. Patent Document 2 describes an imprinting apparatus that includes a heating mechanism that heats and deforms the pattern area on the substrate, and a shape correction mechanism that deforms the pattern area on the mold. It also describes the use of a digital mirror device as a means for forming the heating distribution.

JP 2013-069918 A JP 2013-102132 A

In an imprinting apparatus, various devices can be placed above the mechanism that holds and drives the mold. For example, devices such as a curing unit that hardens the imprinting material on the substrate, a deformation unit that deforms the substrate by irradiating it with light and heating it, and a detection system that detects the relative position between the substrate and mold can be placed. However, the area in which these devices can be placed is limited, making it very difficult to place various devices. Furthermore, placing various devices could increase the size of the apparatus.

The present invention aims to provide an advantageous technology for simplifying the structure of an imprinting device.

The imprinting apparatus of the present invention is an imprinting apparatus that hardens an imprinting material supplied onto a substrate while the imprinting material is in contact with a mold, and is equipped with a modulator that modulates first light from a first light source and guides it to the substrate, and modulates second light from a second light source, the second light having a different wavelength from the first light, and guides it to the imprinting material; a first optical system that guides the first light and the second light to the modulator; and a control unit that switches between control of the modulator that forms a first light intensity distribution with the first light and control of the modulator that forms a second light intensity distribution with the second light, wherein the first light modulated by the modulator deforms the substrate, and the second light modulated by the modulator increases the viscosity of the imprinting material.

The present invention provides an advantageous technique for simplifying the structure of an imprinting apparatus.

1 is a diagram showing the configuration of an imprint apparatus according to an embodiment of the present invention; FIG. 2 is a diagram illustrating an example of the configuration of a light source unit. 5A and 5B are views showing a first operation example and a second operation example of a light source unit in an imprint process executed by the imprint apparatus according to an embodiment of the present invention; 10A and 10B are diagrams showing changes over time in the amount of deformation (amount of thermal deformation) in a pattern area of a substrate. 1A and 1B are diagrams illustrating a method for manufacturing an article. 1A and 1B are diagrams illustrating a method for manufacturing an article.

A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Note that identical components in each drawing will be designated by the same reference numerals, and duplicate descriptions will be omitted.

(First embodiment)
1 shows the configuration of an imprint apparatus 1 according to one embodiment of the present invention. The imprint apparatus 1 performs an imprint process, thereby forming a pattern made of a cured product of an imprint material IM on a substrate S. The imprint process can include a contact step of bringing the imprint material IM on the substrate S into contact with a mold M, an alignment step of aligning the substrate S with the mold M after the contact step, and a curing step of curing the imprint material IM after the alignment step.

The imprint material IM uses a curable composition (sometimes called an uncured resin) that hardens when curing energy is applied. The curing energy may be electromagnetic waves, heat, or other such light. The electromagnetic waves may be, for example, infrared light, visible light, ultraviolet light, or other light with a wavelength selected from the range of 10 nm to 1 mm.

A curable composition is a composition that cures when irradiated with light or when heated. Photocurable compositions that cure when irradiated with light contain at least a polymerizable compound and a photopolymerization initiator, and may also contain a non-polymerizable compound or solvent, as needed. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, polymer components, etc.

The imprint material may be applied to the substrate in the form of a film using a spin coater or slit coater. Alternatively, the imprint material may be applied to the substrate in the form of droplets, or in the form of islands or a film formed by connecting multiple droplets, using a liquid ejection head. The viscosity of the imprint material (at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

The substrate may be made of, for example, glass, ceramics, metal, semiconductor, or resin. If necessary, a member made of a material other than the substrate may be provided on the surface of the substrate. The substrate may be, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the direction parallel to the surface of the substrate S being the XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, Y axis, and Z axis are referred to as θX, θY, and θZ, respectively. Control or drive along the X, Y, and Z axes refers to control or drive along the direction parallel to the X axis, Y axis, and Z axis, respectively. Control or drive along the θX, θY, and θZ axes refers to control or drive along the axis parallel to the X axis, Y axis, and Z axis, respectively. Position is information that can be determined based on coordinates of the X, Y, and Z axes, and orientation is information that can be determined by values of the θX, θY, and θZ axes. Alignment between the substrate or a region thereof and the mold M or a region thereof may include control of the position and/or orientation of at least one of the substrate S and the mold M. Alignment may also include control to correct or change the shape of at least one of the substrate S and the mold M.

The imprint apparatus 1 may include a substrate driving mechanism SD that holds and drives the substrate S, a base frame BF that supports the substrate driving mechanism SD, and a mold driving mechanism MD that holds and drives the mold M. The substrate driving mechanism SD and the mold driving mechanism MD constitute a drive mechanism DRV that drives at least one of the substrate driving mechanism SD and the mold driving mechanism MD so that the relative position between the substrate S and the mold M is adjusted. Adjustment of the relative position by the drive mechanism DRV includes driving the mold M to contact the imprint material IM on the substrate S and to separate the mold M from the hardened imprint material IM (pattern of the hardened material).

The imprinting method of this embodiment involves supplying an imprint material onto a substrate S and bringing the supplied imprint material into contact with a mold (imprinting). The imprint material is then cured while in contact with the mold, and the mold is then separated from the cured imprint material (demolding), thereby forming a pattern of the imprint material on the substrate. The imprinting apparatus of this embodiment brings the imprint material on the substrate into contact with the mold, thoroughly fills the recesses of the concave-convex pattern formed on the mold with the imprint material, and then irradiates it with ultraviolet light to cure the imprint material. In this way, the imprinting apparatus is an apparatus that brings the imprint material supplied onto the substrate into contact with the mold and applies curing energy to the imprint material, thereby forming a pattern in a cured product to which the concave-convex pattern of the mold has been transferred.

The substrate driving mechanism SD may include a substrate holder SH that holds the substrate S, a substrate stage SS that supports the substrate holder SH, and a substrate driving actuator SM that drives the substrate stage SS to drive the substrate S. The substrate driving mechanism SD may be configured to drive the substrate S about multiple axes (e.g., three axes: X-axis, Y-axis, and θZ-axis, or preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The position and orientation of the substrate S may be measured by a measuring instrument 29, and controlled based on the measurement results.

The mold driving mechanism MD may include a mold holding part MH that holds the mold M, and a mold driving actuator MM that drives the mold holding part MH to drive the mold M. The mold holding part MH may include a mold deformation mechanism that deforms the mold M. The mold deformation mechanism may deform the mold M, for example, by applying force to the side of the mold M. The mold driving mechanism MD may be configured to drive the mold M about multiple axes (e.g., three axes: the Z axis, the θX axis, and the θY axis; preferably, six axes: the X axis, the Y axis, the Z axis, the θX axis, the θY axis, and the θZ axis). The mold M has a pattern area in which a pattern to be transferred to the imprint material IM on the substrate S by the imprint process is formed. The mold driving mechanism MD may include a pressure regulator PC that adjusts the pressure in the space SP on the back side of the mold M (opposite the pattern area PR) to deform the mold M (pattern area PR) into a convex shape toward the substrate S or flatten it. With the mold M deformed into a convex shape toward the substrate S, contact between the imprint material IM on the substrate S and the pattern region PR begins, and then the pressure regulator PC can adjust the pressure in the space SP so that the contact area between the imprint material IM and the pattern region PR gradually expands.

The imprinting apparatus 1 may be equipped with a dispenser 5 (supply unit) that supplies, applies, or places the imprinting material IM on the substrate S. However, the imprinting material IM may also be supplied, applied, or placed on the substrate S by an external device to the imprinting apparatus 1.

The imprint apparatus 1 may include a light source 2 (curing light source) for irradiating the imprint material IM between the substrate S (shot area) and the mold M (pattern area PR) with light 9 (curing light) along a light path LP in the curing process to cure the imprint material IM. The light path LP is an optical path that leads to the substrate S via the mold M and the imprint material IM. The imprint apparatus 1 may further include a detector 12 that detects the relative positions of the alignment marks on the substrate S and the alignment marks on the mold M. The detector 12 may illuminate the alignment marks on the substrate S and the alignment marks on the mold M with detection light 15 and capture images formed by these alignment marks. The detection light 15 may also be understood as light irradiated along the light path LP. The detector 12 may detect light from the alignment marks.

The mold M is a mold for molding the imprint material on the substrate S. The mold may also be called a template or original. The mold M has a rectangular outer shape and a pattern surface (first surface) 11a on which a pattern (convex/concave pattern) to be transferred to the substrate S (the imprint material thereon) is formed. The mold M may be made of a material that transmits ultraviolet light (curing light) for curing the imprint material on the substrate S, such as quartz. In addition, a mold-side mark that functions as an alignment mark is formed in the pattern region PR of the mold M.

The imprinting apparatus 1 may further include an imaging unit 6 for detecting the contact state between the imprinting material IM on the substrate S and the mold M (pattern area PR), or the filling state of the imprinting material IM in the space between the substrate S and the mold M (pattern area PR). The imaging unit 6 may also be used to detect foreign matter between the substrate S and the mold M. The imaging unit 6 may illuminate the layered structure consisting of the substrate S, imprinting material IM, and mold M with observation light 18, and capture an image formed by this layered structure. The observation light 18 may also be understood as light irradiated along the optical path LP.

The imprinting apparatus 1 may further include a light source unit 20 that irradiates modulated light 21 onto the light path LP. As described below, the light source unit 20 includes a spatial light modulator and irradiates modulated light 21, which is incident light modulated by the spatial light modulator, onto the light path LP. The modulated light 21 may include first modulated light that deforms the substrate S to align the substrate S (shot area) with the mold M (pattern area PR) and second modulated light that partially hardens the imprint material IM. When the first modulated light is irradiated onto the light path LP, it is preferable that the second modulated light is not irradiated onto the light path LP, and when the second modulated light is irradiated onto the light path LP, it is preferable that the first modulated light is not irradiated onto the light path LP. However, both the first modulated light and the second modulated light may be irradiated onto the light path LP for a sufficiently short period during which the modulated light 21 is irradiated onto the light path LP. The first modulated light and the second modulated light are light whose wavelength ranges do not overlap with each other. Alternatively, the first modulated light and the second modulated light may be light having peaks at different wavelengths. Alternatively, the first modulated light and the second modulated light may be light having different intensities.

The first modulated light may be light modulated so as to form a light intensity distribution (illuminance distribution) on the substrate S that deforms the substrate S, more specifically the pattern formation area (shot area) of the substrate S, into a target shape. Irradiating the substrate S with the first modulated light forms a temperature distribution on the substrate S, and this temperature distribution deforms the pattern formation area of the substrate S into the target shape. Once the pattern formation area of the substrate S has deformed into the target shape and alignment between the pattern formation area of the substrate S and the pattern area PR of the mold M has been completed, a curing process (a process in which the curing light source 2 irradiates the imprint material IM with curing light and hardens the imprint material IM) is performed. The first modulated light is light having a wavelength that does not harden the imprint material IM.

The second modulated light has a wavelength that hardens the imprint material IM, in other words, a wavelength that increases the viscosity (viscoelasticity) of the imprint material IM. The second modulated light can be, for example, light modulated to harden the imprint material IM on the substrate S in the peripheral portion (frame-shaped region) of the pattern formation region of the substrate S. Irradiation with such second modulated light can be called frame exposure, and is performed in the contact process and/or alignment process. It is advantageous for preventing the imprint material IM from being pushed out of the pattern formation region of the substrate S. The mold M used in the imprint apparatus has a region called a mesa portion, and the pattern region PR is formed in the mesa portion. By performing frame exposure, it is possible to reduce adhesion of the imprint material to the side surface of the mesa portion, which is convex relative to the substrate.

The optical axes of the curing light source 2, detector 12, imaging unit 6, and light source unit 20 share the optical path LP. To achieve this, a combining mirror 22 and dichroic mirrors 23 and 24 are provided. The combining mirror 22 transmits the observation light 18 and reflects the modulated light 21. The dichroic mirror 23 transmits the observation light 18 and modulated light 21 and reflects the detection light 15. The dichroic mirror 24 transmits the observation light 18, modulated light 21, and detection light 15 and reflects the curing light 9.

The imprinting apparatus 1 may further include a control unit 7 that controls the substrate driving mechanism SD, mold driving mechanism MD, pressure regulator PC, dispenser 5, measuring instrument 29, curing light source 2, detector 12, imaging unit 6, light source unit 20, etc. The control unit 7 may be configured, for example, as a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these. The control unit 7 may be provided within the imprinting apparatus 1, or may be provided in a location separate from the imprinting apparatus 1 and controlled remotely.

(Configuration of light source unit)
2 shows an example configuration of the light source unit 20. The light source unit 20 may include a first light source 121 that generates first light having a first wavelength range for generating first modulated light and a second light source 122 that generates second light having a second wavelength range for generating second modulated light. The light source unit 20 may also include a DMD (digital mirror device) 133 as a spatial light modulator (modulator) that generates first modulated light obtained by modulating the first light (incident light) and second modulated light obtained by modulating the second light (incident light). The light source unit 20 may also include a first optical system (125, 126, 111, 132) that causes the first light from the first light source 121 and the second light from the second light source 122 to be incident on the DMD 133 as a spatial light modulator.

In one example, the light source unit 20 may be configured by connecting the illumination section 120 and the modulation section 130 via an optical fiber 110. The illumination section 120 may include a first light source 121, a second light source 122, a first controller 123, a second controller 124, and mirrors 125 and 126. The optical path of the first light generated by the first light source 121 and the optical path of the second light generated by the second light source 122 are shared by the mirrors 125 and 126 and connected to the input section 111 of the optical fiber 110. The output section 112 of the optical fiber 110 is connected to the modulation section 130.

The first controller 123 controls the first light source 121 in accordance with commands from the control unit 7. Control of the first light source 121 may include control of turning the first light source 121 on and off. Control of the first light source 121 may further include control of the intensity of the first light emitted by the first light source 121. For example, the first controller 123 may include a constant current circuit that supplies the first light source 121 with a current having a current value in accordance with a command value from the control unit 7. Alternatively, the first controller 123 may include a drive circuit that drives the first light source 121 in accordance with the command value, and a photoelectric conversion sensor that receives a portion of the first light emitted by the first light source 121, and may be configured to feed back the output of the photoelectric conversion sensor to the drive circuit.

The second controller 124 controls the second light source 122 in accordance with commands from the control unit 7. Control of the second light source 122 may include control of turning the second light source 122 on and off. Control of the second light source 122 may further include control of the intensity of the second light emitted by the second light source 122. For example, the second controller 124 may include a constant current circuit that supplies the second light source 122 with a current having a current value in accordance with a command value from the control unit 7. Alternatively, the second controller 124 may include a drive circuit that drives the second light source 122 in accordance with the command value, and a photoelectric conversion sensor that receives a portion of the second light emitted by the second light source 122, and may be configured to feed back the output of the photoelectric conversion sensor to the drive circuit.

The control unit 7 can individually control the first light source 121 and the second light source 122. For example, the control unit 7 can control the first light source 121 and the second light source 122 so that when one of the first light source 121 and the second light source 122 is turned on, the other is turned off. From another perspective, a configuration can be adopted in which when one of the first light from the first light source 121 and the second light from the second light source 122 is incident on the spatial light modulator (DMD 133), the other of the first light and the second light is not incident on the spatial light modulator. This can be achieved, for example, by control of the first and second light sources 121 and 122 by the first and second controllers 123 and 124, or by a mechanism that selectively blocks one of the first light and the second light.

(for each wavelength of light)
Here, an example of wavelength allocation for the curing light 9, detection light 15, observation light 18, and modulated light 21 (first modulated light, second modulated light) will be described. The curing light 9 is light that cures the imprint material IM and, in one example, can have any wavelength range within the range of 300 nm to 380 nm, but may also have a wavelength range of 300 nm or less. The detection light 15 is light for detecting alignment marks and, in one example, has a wavelength range of 550 nm to 750 nm. The observation light 18 is light for observing the contact state between the imprint material IM and the mold M, the filling state of the imprint material IM into the space between the substrate S and the mold M, and the like. For the observation light 18, a wavelength range that does not overlap with the wavelength ranges of the curing light 9 and the detection light 15 can be selected, for example, from the wavelength range of 400 nm to 480 nm. The modulated light 21 includes a first modulated light having a wavelength range that does not cure the imprint material IM, and a second modulated light having a wavelength range that cures the imprint material IM.

The modulated light 21 can be selected from the same wavelength range as the observation light 18, for example, the wavelength range of 400 nm to 480 nm, so as not to overlap with the wavelength ranges of the curing light 9 and the detection light 15. The first modulated light is generated by the modulation unit 130 (DMD 133) modulating the first light emitted by the first light source 121. The second modulated light is generated by the modulation unit 130 (DMD 133) modulating the second light emitted by the second light source 122. The wavelengths of the first light emitted by the first light source 121 and the second light emitted by the second light source 122 can be determined based on the upper limit of the wavelength range in which the imprint material IM cures. For example, if the upper limit of the wavelength range in which the imprint material IM cures is 440 nm, the wavelength of the first light emitted by the first light source 121 can be approximately 460 nm, and the wavelength of the second light emitted by the second light source 122 can be approximately 410 nm. The first light source 121 and the second light source 122 are preferably light sources that emit single-wavelength light with a narrow wavelength range, and laser diodes, for example, are suitable. Laser diodes are also advantageous in that they can be switched on and off quickly.

Light transmitted to the modulation unit 130 via the optical fiber 110 enters the DMD 133, which functions as a spatial light modulator, via the optical system 132. The optical system 132 may include, for example, a focusing optical system and an illumination system (e.g., a microlens array) that homogenizes the light from the focusing optical system and illuminates the DMD 133. The DMD 133 includes multiple micromirrors (not shown) that reflect light and actuators that drive each of the multiple micromirrors. Each actuator controls the corresponding micromirror to an angle of -12 degrees (ON state) or +12 degrees (OFF state) relative to the array surface of the multiple micromirrors in accordance with commands from the control unit 7. Light reflected by the micromirrors in the ON state forms an image on the substrate S as modulated light via the projection optical system 134 (second optical system), which places the DMD 133 and the substrate S in a conjugate optical system. Light reflected by the micromirrors in the OFF state is reflected in a direction that does not reach the substrate S. The area projected onto the substrate S when all micromirrors are turned on (maximum irradiation area) is larger than the size of the maximum pattern formation area (shot area) of the substrate S. Taking into account that the second modulated light is irradiated onto the periphery (frame-shaped area) of the pattern formation area of the substrate S, the maximum irradiation area can be set to an area that is 1 mm or more larger than the maximum pattern formation area. Instead of the DMD 133, another spatial light modulator, for example, a liquid crystal display (LCD), may be used.

The optical system constituting the modulation unit 130 must transmit both first light (first modulated light) with a wavelength that does not cure the imprint material IM and second light (second modulated light) with a wavelength that cures the imprint material IM. Furthermore, with a typical DMD, the maximum light intensity that can be irradiated onto the micromirror array decreases at wavelengths of 420 nm or less. Furthermore, near 400 nm, which is the boundary between ultraviolet light and visible light, the maximum light intensity that can be irradiated onto the micromirror array drops dramatically to about 1/1000. Therefore, it is desirable to use a laser diode with a narrow wavelength range, or the like, to bring the wavelengths of the first light source 121 and the second light source 122 close to the upper limit of the wavelength range in which the imprint material IM cures.

The control unit 7 may generate control data that controls the switching of each micromirror of the DMD 133 between the ON and OFF states, based on, for example, data on the light intensity distribution (illuminance distribution) to be formed on the surface of the substrate S. The light intensity distribution data may include, for example, information regarding the time for which each micromirror is turned ON and information regarding the time for which each micromirror is turned OFF. The more micromirrors that are turned ON and the longer they are turned ON, the greater the exposure dose that can be applied to the pattern formation area of the substrate S.

The control unit 7 may include a memory that stores light intensity distribution data for modulating the first light to generate first modulated light and light intensity distribution data for modulating the second light to generate second modulated light. The light intensity distribution data for modulating the first light to generate first modulated light may include light intensity distribution data for deforming the pattern formation area (shot area) of the substrate S into a target shape. The light intensity distribution data for modulating the second light to generate second modulated light may include light intensity distribution data for hardening (increasing viscosity) the imprint material IM on the substrate S in the peripheral portion (frame-shaped area) of the pattern formation area of the substrate S.

A configuration in which the modulation unit 130 is shared by the first light source 121 and the second light source 122 is advantageous for reducing the size of the modulation unit 130 or the light source unit 20, thereby simplifying the structure of the imprinting apparatus 1. This makes it easier to position the modulation unit 130 near the light path LP. A configuration in which the illumination unit 120 and modulation unit 130 are separated from each other is advantageous for positioning the illumination unit 120, which serves as a heat source, far from the light path LP of the imprinting apparatus 1. However, the illumination unit 120 and modulation unit 130 may be positioned close to each other without using the optical fiber 110. Alternatively, the illumination unit 120 may be incorporated into the modulation unit 130. Furthermore, the first light source 121 and modulation unit 130 may be connected by a first optical fiber, and the second light source 122 and modulation unit 130 may be connected by a second optical fiber. In this case, the optical path of the first light emitted from the first optical fiber and the optical path of the second light emitted from the second optical fiber may be coupled.

(Light source unit operation)
FIG. 3A shows a first operation example of the light source unit 20 in the imprint process executed by the imprint apparatus 1. In FIG. 3A, "imprint process" indicates the progress of the imprint process. The imprint process may include a contacting step of bringing the imprint material IM on the substrate S into contact with the mold M, an alignment step of aligning the substrate S and the mold M after the contacting step, and a curing step of curing the imprint material IM after the alignment step. The contacting step is a step of bringing the imprint material IM on the substrate S into contact with (the pattern region PR of) the mold M by the driving mechanism DRV. This contacting step may be a period that begins, for example, when the imprint material IM on the substrate S begins to contact the pattern region PR of the mold M that has been deformed into a convex shape, and ends when the entire area of the pattern region PR is flattened. The imprint process includes a driving step, which is an accompanying step to the contact step, in which the imprint material IM on the substrate S and the mold M are brought closer to each other by the driving mechanism DRV, and this step is described as "driving" in Figure 3(a).

In the alignment process, based on the results detected by the detector 12, at least one of the substrate S and the mold M is driven by the drive mechanism DRV so that the pattern formation area of the substrate S is aligned with the pattern area PR of the mold M. Also, in the alignment process, based on the results detected by the detector 12, the mold drive mechanism can deform the mold M so that the pattern formation area (shot area) of the substrate S is aligned with the pattern area PR of the mold M. Also, in the alignment process, based on the results detected by the detector 12, a deformation process described below can be performed so that the pattern formation area of the substrate S is aligned with the pattern area PR of the mold M.

The filling process proceeds in parallel with the alignment process. In the filling process, the imprint material IM between the substrate S and the pattern region PR of the mold M fills the recesses that form the pattern of the pattern region PR, and also eliminates any gaps that exist between the substrate S and the pattern region PR of the mold M. The alignment process and filling process are described as "filling and alignment" in FIG. 3(a). In one example, the filling process can begin before the alignment process. Also, in FIG. 3(a), the hardening process is described as "hardening" and the separation process is described as "separation."

In Figure 3(a), "Light modulation by DMD" indicates modulation of light by the DMD 133 of the light source unit 20. "C" indicates a partial curing process in which second modulated light generated by modulating second light, which is light in a wavelength range that hardens (increases viscosity of) the imprint material IM, is irradiated onto the light path LP. In the partial curing process C in the first embodiment, the imprint material IM in the aforementioned frame-shaped region is hardened (so-called frame exposure). "D" indicates a deformation process in which first modulated light generated by modulating first light, which is light in a wavelength range that does not harden the imprint material IM, is irradiated onto the light path LP. In the deformation process D, the pattern formation region of the substrate S is deformed to align the pattern formation region of the substrate S with the pattern region PR of the mold M. "OFF" indicates that neither the first modulated light nor the second modulated light is irradiated onto the light path PL. During the "OFF" period, the DMD 133 is controlled to switch from the first modulated light to the light intensity distribution of the second modulated light.

The period (timing, length of time) of the partial curing process C, which performs frame exposure, can be determined so as to harden the imprint material IM in the frame-shaped region and prevent the imprint material IM from being pushed out of the pattern formation region of the substrate S. The period (timing, length of time) of the deformation process D can be determined so that the pattern formation region of the substrate S has the target shape when the imprint material IM is hardened by the curing light 9 from the curing light source 2 in the hardening process. It is desirable to deform the substrate S at least during the alignment period and complete this before the hardening process begins.

In the first embodiment, the partial hardening process C is performed first, followed by the deformation process D, but the order of the processes is not limited to this; they may be performed in the opposite order, or may be repeated multiple times.

Figure 3(b) shows a second example of the operation of the light source unit 20 in the imprint process performed by the imprint apparatus 1. The marking method follows the marking method of Figure 3(a). In the second example shown in Figure 3(b), the "OFF" period in the example shown in Figure 3(a) is omitted or shortened. The period of the partial curing process C and the period of the deformation process D cannot overlap. Under one possible constraint, the partial curing process C is not performed in the contact process. This is because even partial curing of the imprint material IM in the contact process would prevent the imprint material IM from spreading and prevent filling in the subsequent filling process. Under such constraints, when the deformation process D is performed after the partial curing process C, the time required for the alignment process and the filling process, which proceed in parallel with each other, cannot be shorter than the total time of the partial process C and the deformation process D.

As described above, the partial curing process C involves frame exposure. The period during which frame exposure is performed is determined so as to prevent the imprint material IM from being pushed out of the pattern formation area of the substrate S (the pattern area of the mold M).

As described above, vibration-damping exposure is performed in the partial curing process C. The duration of the vibration-damping exposure is determined so as to reduce relative vibration between the substrate S and the mold M and improve alignment convergence.

Figure 4 illustrates the temporal change in the amount of deformation (amount of thermal deformation) of the substrate S (pattern area thereof) during the deformation process D in the first and second operation examples shown in Figures 3(a) and (b). The change in the amount of deformation can be expressed, for example, by a function including an exponential function. By determining the time constant of this exponential function in advance, the time for each deformation process D and the start timing of the deformation process D can be determined. The intensity of the first light may also be adjusted.

In this way, by using a common modulation unit 130 (DMD 133) for light sources of different wavelengths, it is possible to arrange multiple functions in the imprinting device without complicating the device structure.

Second Embodiment
In the first embodiment, a case has been described in which light for increasing the viscosity of the imprint material in the periphery of the shot area is irradiated as the second modulated light.

In the second embodiment, the second modulated light may be light modulated to increase the viscosity of the imprint material IM at any location in the pattern formation region of the substrate S, thereby increasing the bonding strength between the substrate S and the mold M due to the imprint material IM. Irradiation of such second modulated light can be referred to as vibration-damping exposure and is performed in the alignment process to improve alignment accuracy. When the bonding strength between the substrate S and the mold M due to the imprint material IM is weak (before irradiation of the second modulated light), the substrate S and the mold M may vibrate individually due to external disturbances, etc. (i.e., the relative vibration between the substrate S and the mold M is large). Irradiating the imprint material IM with the second modulated light partially increases the viscosity of the imprint material IM and increases the bonding strength between the substrate S and the mold M, thereby reducing the relative vibration between the substrate S and the mold M and improving the convergence of the alignment. In one example, increasing the viscosity (viscoelasticity) of the imprint material IM by irradiating it with second modulated light so that the magnitude of the shear force generated by the relative movement between the substrate S and the mold M is within the range of 0.5 to 1.0 N is effective in improving the convergence of alignment.

In addition, the control unit 7 in the second embodiment may include a memory that stores light intensity distribution data for modulating the first light to generate first modulated light and light intensity distribution data for modulating the second light to generate second modulated light. The light intensity distribution data for modulating the second light to generate second modulated light may include light intensity distribution data for increasing the viscosity of the imprint material IM at any location in the pattern formation region of the substrate S, thereby increasing the bonding strength between the substrate S and the mold M via the imprint material IM.

In the partial curing process C in the second embodiment, the viscosity of the imprint material IM is increased at any location in the pattern formation area of the substrate S (so-called vibration-damping exposure).

The period (timing, length) of the partial curing process C in which vibration-damping exposure is performed can be determined so as to reduce relative vibration between the substrate S and the mold M by partially increasing the viscosity of the imprint material IM and increasing the bonding force between the substrate S and the mold M.

In this way, by using a common modulation unit 130 (DMD 133) for light sources of different wavelengths, it is possible to arrange a mechanism for deforming the substrate and a mechanism for increasing the viscosity of the imprint material (vibration-damping exposure) without complicating the device structure.

(Third embodiment)
In the first embodiment, a case was described in which the first modulated light is irradiated to the substrate S so that a light intensity distribution (illuminance distribution) that deforms the pattern formation area (shot area) of the substrate S into a target shape is formed on the substrate S.

In the third embodiment, the first modulated light may be light modulated to increase the viscosity of the imprint material IM at any location in the pattern formation region of the substrate S, thereby increasing the bonding strength between the substrate S and the mold M due to the imprint material IM. Irradiation of such first modulated light can be referred to as vibration-damping exposure and is performed in the alignment process to improve alignment accuracy. When the bonding strength between the substrate S and the mold M due to the imprint material IM is weak (before irradiation of the first modulated light), the substrate S and the mold M may vibrate individually due to external disturbances, etc. (i.e., the relative vibration between the substrate S and the mold M is large). Irradiating the imprint material IM with the first modulated light partially increases the viscosity of the imprint material IM and increases the bonding strength between the substrate S and the mold M, thereby reducing the relative vibration between the substrate S and the mold M and improving the convergence of alignment. In one example, increasing the viscosity (viscoelasticity) of the imprint material IM by irradiating it with second modulated light so that the magnitude of the shear force generated by the relative movement between the substrate S and the mold M is within the range of 0.5 to 1.0 N is effective in improving the convergence of alignment.

In addition, the control unit 7 in the third embodiment may include a memory that stores light intensity distribution data for modulating the first light to generate the first modulated light and light intensity distribution data for modulating the second light to generate the second modulated light. The light intensity distribution data for modulating the first light to generate the first modulated light may include light intensity distribution data for increasing the viscosity of the imprint material IM at any location in the pattern formation region of the substrate S, thereby increasing the bonding strength between the substrate S and the mold M via the imprint material IM.

In the partial curing process C in the third embodiment, light is irradiated to increase the viscosity of the imprint material in the peripheral portion of the shot area (so-called frame exposure). On the other hand, instead of the deformation process D in the first embodiment, in the third embodiment, light is irradiated onto the shot area to reduce relative vibration between the substrate S and the mold M.

The period (timing, length) of the vibration-damping exposure process in which vibration-damping exposure is performed can be determined so as to reduce relative vibration between the substrate S and the mold M by partially increasing the viscosity of the imprint material IM and increasing the bonding force between the substrate S and the mold M.

In this way, by sharing the modulation unit 130 (DMD 133) for light sources with different distributions of irradiation areas on the substrate, it is possible to arrange a mechanism that increases the viscosity of the imprint material in the periphery of the shot area (frame exposure) without complicating the device structure.

(Fourth embodiment)
In the first embodiment, the case where a substrate is irradiated with two types of light having different wavelengths or distributions, i.e., first modulated light and second modulated light, has been described. In the fourth embodiment, the light source unit 20 may be provided with a mechanism for irradiating the substrate with third modulated light in addition to the first modulated light and second modulated light.

For example, the light source unit in FIG. 2 can be equipped with a third light source capable of emitting third light in a third wavelength range. The third light source can be controlled by a third controller. In this case, the first modulated light can be light with a light intensity distribution that deforms the shot area into a target shape, the second modulated light can be light that increases the viscosity of the imprint material in the periphery of the shot area, and the third modulated light can be light that improves the convergence of the alignment.

When the substrate is sequentially irradiated with light from these multiple light sources, both frame exposure and vibration-damping exposure can be performed in the partial curing process C in Figure 3. When both frame exposure and vibration-damping exposure are performed in the partial curing process C, frame exposure is typically performed before vibration-damping exposure. This is because it is desirable to perform vibration-damping exposure during the alignment process and complete it immediately before the curing process.

In this way, by sharing the modulation unit 130 (DMD 133) for light sources of different wavelengths, it is possible to arrange a mechanism for deforming the substrate and a mechanism for increasing the viscosity of the imprint material (vibration-damping exposure) without complicating the structure of the device. It is also possible to share the modulation unit 130 for light sources with different distributions of irradiation areas on the substrate. It is also possible to add additional light sources to configure the light source unit 20.

(Production method of article)
The pattern of the cured product formed using the imprinting apparatus is used permanently on at least a portion of various articles, or temporarily when manufacturing various articles. Examples of articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSIs, CCDs, image sensors, and FPGAs. Examples of optical elements include microlenses, light guides, waveguides, anti-reflection films, diffraction gratings, polarizing elements, color filters, light-emitting elements, displays, and solar cells. Examples of MEMS include DMDs, microchannels, and electromechanical conversion elements. Examples of recording elements include optical disks such as CDs and DVDs, magnetic disks, magneto-optical disks, and magnetic heads. Examples of sensors include magnetic sensors, optical sensors, and gyro sensors. Examples of molds include imprint molds.

The pattern of the cured product is used as is as at least part of the component of the above-mentioned article, or is used temporarily as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

Next, we will explain a method for manufacturing an article in which a pattern is formed on a substrate using an imprinting device, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in Figure 5(a), a substrate 1z such as a silicon wafer is prepared, on whose surface a workpiece 2z such as an insulator is formed. Next, an imprinting material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, multiple droplets of the imprinting material 3z are shown applied to the substrate.

As shown in Figure 5(b), the imprinting mold 4z is placed facing the side on which the concave-convex pattern is formed toward the imprinting material 3z on the substrate. As shown in Figure 5(c), the substrate 1 to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as hardening energy, the imprinting material 3z hardens.

As shown in Figure 5(d), after the imprint material 3z has hardened, the mold 4z and substrate 1z are separated, forming a pattern of the cured imprint material 3z on the substrate 1z. This cured material pattern has a shape in which the recesses of the mold correspond to the protrusions of the cured material, and the protrusions of the mold correspond to the recesses of the cured material. In other words, the recess and protrusion pattern of the mold 4z has been transferred to the imprint material 3z.

As shown in Figure 5(e), when etching is performed using the cured material pattern as an etching-resistant mask, portions of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains are removed, forming grooves 5z. As shown in Figure 5(f), when the cured material pattern is removed, an article is obtained in which grooves 5z are formed on the surface of the workpiece 2z. Here, the cured material pattern was removed, but it may also be used as an interlayer insulating film included in semiconductor elements, etc., i.e., a component of an article, without being removed after processing.

Next, another method for manufacturing an article will be described. As shown in Figure 6(a), a substrate 1y made of quartz glass or the like is prepared, and then an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of another material, such as a metal or metal compound, may be provided on the surface of the substrate 1y.

As shown in Figure 6(b), the imprinting mold 4y is placed facing the side on which the concave-convex pattern is formed toward the imprint material 3y on the substrate. As shown in Figure 6(c), the substrate 1y to which the imprint material 3y has been applied is brought into contact with the mold 4y, and pressure is applied. The imprint material 3y fills the gap between the mold 4y and the substrate 1y. When light is irradiated through the mold 4y in this state, the imprint material 3y hardens.

As shown in Figure 6(d), after the imprint material 3y is cured, the mold 4y and substrate 1y are separated, forming a pattern of the cured imprint material 3y on the substrate 1y. In this way, an article having the pattern of the cured material as a constituent member is obtained. Furthermore, if the substrate 1y is etched using the pattern of the cured material as a mask in the state shown in Figure 6(d), an article in which the concave and convex portions are inverted compared to the mold 4y, such as a mold for imprinting, can also be obtained.

1 Imprinting apparatus S Substrate 121 First light source 122 Second light source 133 DMD
130 Modulation section

Claims (13)

1. An imprinting apparatus that hardens an imprinting material supplied onto a substrate while bringing the imprinting material into contact with a mold, comprising:
a modulator that modulates first light from a first light source and guides the modulated first light to the substrate, and modulates second light from a second light source, the second light having a wavelength different from that of the first light, and guides the modulated second light to the imprint material;
a first optical system that guides the first light and the second light to the modulator;
a control unit that switches between control of the modulator that forms a first light intensity distribution with the first light and control of the modulator that forms a second light intensity distribution with the second light,
the first light modulated by the modulator deforms the substrate;
the second light modulated by the modulator increases the viscosity of the imprint material;
An imprinting apparatus comprising: The imprint apparatus according to claim 1 , wherein one of the first light and the second light is selectively incident on the modulator. 3. The imprinting apparatus according to claim 1, wherein the viscosity of the imprinting material is increased during a period in which alignment between the mold and the substrate is being performed. 4. The imprint apparatus according to claim 1, further comprising an optical element in an optical path between the first light source and the modulator, the optical element directing the second light from the second light source to the modulator. The imprint apparatus according to claim 4 , wherein the optical element is a mirror. 6. The imprint apparatus according to claim 1, wherein the first light and the second light have different intensities. 7. The imprint apparatus according to claim 1, wherein the first optical system includes a mirror that guides the first light from the first light source and the second light from the second light source to an optical fiber, and an optical system that guides the first light and the second light from the optical fiber to the modulator. The imprinting apparatus according to claim 1 , wherein the modulator includes a digital mirror device. further comprising a curing light source that irradiates light for curing the imprint material,
An imprinting apparatus according to any one of claims 1 to 8, characterized in that after alignment of the mold and the substrate is completed, the imprinting material is hardened by irradiating the imprinting material with light for hardening the imprinting material. The imprint apparatus according to claim 9 , further comprising a combining mirror that transmits one of the light from the curing light source and the light modulated by the modulator and reflects the other light. An imprint apparatus according to any one of claims 1 to 10, characterized in that switching between control of the modulator that forms the first light intensity distribution and control of the modulator that forms the second light intensity distribution is performed during a period when neither the first light nor the second light is irradiated onto the substrate. An imprinting method comprising curing an imprinting material supplied onto a substrate while the imprinting material is in contact with a mold, the method comprising:
a deformation step of guiding a first light from a first light source to a modulator, and guiding the first light modulated by the modulator to the substrate, thereby deforming the substrate;
a viscosity increasing step of increasing the viscosity of the imprint material by guiding second light from a second light source, the second light having a wavelength different from that of the first light, to the modulator and guiding the second light modulated by the modulator to the imprint material;
an imprinting method comprising: a switching step of switching between control of the modulator that forms a first light intensity distribution with the first light and control of the modulator that forms a second light intensity distribution with the second light. a forming step of forming a pattern on a substrate by the imprint apparatus according to any one of claims 1 to 11 ;
a processing step of processing the substrate on which the pattern has been formed in the forming step;
and manufacturing an article from the substrate.