JP7645207B2 - Method, program, recording medium, and apparatus for analyzing resin molded products - Google Patents

Description

This invention relates to a resin molded product analysis method, program, recording medium, and resin molded product analysis device for analyzing the amount of shrinkage of a resin molded product made from a resin material containing fibers.

Conventionally, a shape prediction device that predicts the shape of an injection molded product using fiber-reinforced resin is known (see, for example, Patent Document 1).

The above-mentioned Patent Document 1 discloses a shape prediction device that predicts the shape of an injection molded product using fiber-reinforced resin by analyzing the fiber orientation of the fibers mixed in the resin. In this shape prediction device, a resin flow analysis model corresponding to the shape of an input injection molded product is divided into a finite number of resin flow analysis elements. Then, this shape prediction device acquires fiber orientation data of the fibers mixed in the resin by performing resin flow analysis for each divided resin flow analysis element. Then, in order to acquire fiber orientation data for each structural analysis element that is larger than the resin flow analysis element, this shape prediction device converts the fiber orientation data by determining a composite vector of the fiber orientation data of multiple resin flow analysis elements. The shape prediction device described in the above-mentioned Patent Document 1 predicts the shape of an injection molded product by performing structural analysis using the composite fiber orientation data.

JP 2008-120089 A

Here, although it is not specified in the above Patent Document 1, when predicting the shape of an injection molded product (resin molded product) by synthesizing fiber orientations analyzed in a state where the product is divided into relatively fine elements, as in the shape prediction device described in the above Patent Document 1, it is possible to obtain the distribution of fiber orientation by dividing the resin molded product into relatively fine elements (virtual nodes) along the thickness direction, and to analyze the shrinkage amount while reducing the processing load by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product. However, since the resin molded product solidifies from the surface layer side in the thickness direction as it is cooled in the mold, when the center part in the thickness direction is cooled and solidified, it solidifies while being influenced by the resin on the surface side that has already solidified. Therefore, when analyzing the shrinkage amount of a resin molded product based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product, there is a problem that the shrinkage amount analyzed based on the fiber orientation differs from the actual shrinkage amount because the influence of solidification from the surface layer side in the thickness direction is not taken into account.

This invention has been made to solve the above problems, and one object of the invention is to provide a method, program, recording medium, and device for analyzing a resin molded product that can accurately analyze the amount of shrinkage of a resin molded product when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product.

In order to achieve the above object, a resin molded product analysis method according to a first aspect of the present invention is a resin molded product analysis method for analyzing the amount of shrinkage of a resin molded product molded from a resin material containing fibers, comprising the steps of: dividing the resin molded product into a plurality of microelements; setting a plurality of virtual nodes along the thickness direction of the resin molded product for each of the plurality of microelements or for each of the plurality of nodes constituting the vertices of each microelement; obtaining an analytical orientation by analyzing the orientation of fibers for each of the plurality of virtual nodes of each microelement or for each of the nodes; and obtaining an analytical orientation for each of the plurality of virtual nodes of each microelement or for each of the nodes in order from the surface side of the resin molded product. The method includes the steps of: calculating a correction orientation for analyzing the amount of shrinkage by performing a calculation to correct the amount of shrinkage; analyzing the amount of shrinkage of each of the multiple microelements or multiple nodes based on the correction orientation calculated for each of the multiple virtual nodes of each microelement or each node, and analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage at each of the analyzed multiple microelements or multiple nodes; the step of calculating the correction orientation includes the step of calculating the correction orientation by performing a calculation to correct the analysis orientation at each of the multiple virtual nodes of each microelement or each node based on the correction result at the virtual node on the surface side of the microelement or each node.

In the resin molded product analysis method according to the first aspect, as described above, a correction orientation for analyzing the amount of shrinkage is calculated by performing a calculation to correct the analytical orientation in each of the multiple virtual nodes of each microelement or each node, starting from the surface layer side of the resin molded product. Then, a correction orientation is calculated by performing a calculation to correct the analytical orientation based on the correction result in the virtual node on the surface side of each microelement or each node, starting from the surface side of the resin molded product. As a result, a correction calculation is performed based on the correction result in the virtual node on the surface side of each microelement or each node, starting from the surface side of the resin molded product, for the analytical orientation, which is the fiber orientation analyzed in each of the multiple virtual nodes of each microelement or each node, starting from the surface side of the resin molded product, to correct the analyzed fiber orientation (analysis orientation) taking into account the effect of the resin material solidifying in sequence from the surface side. Therefore, the amount of shrinkage of the resin molded product can be analyzed by synthesizing the distribution of the fiber orientation corrected taking into account the effect of the resin material solidifying in sequence from the surface side. As a result, by synthesizing the distribution of fiber orientation in the thickness direction of a resin molded product, the amount of shrinkage of the resin molded product can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation.

In the resin molded product analysis method according to the first aspect, preferably, the step of acquiring the analysis orientation includes a step of acquiring a target analysis orientation, which is an analysis orientation at a target virtual node, which is one of the multiple virtual nodes, and the step of calculating the correction orientation includes a step of calculating a target correction orientation, which is a correction orientation at the target virtual node, by performing a calculation to correct the target analysis orientation based on an adjacent correction orientation, which is a correction orientation calculated at an adjacent virtual node adjacent to the surface side of the target virtual node among the multiple virtual nodes, and a step of repeating the step of calculating the target correction orientation in order from the surface side of the resin molded product for each of the multiple virtual nodes. With this configuration, it is possible to calculate the correction orientation from the surface side to the inside, layer by layer, using the correction result at the virtual node adjacent to the surface side at each of the multiple virtual nodes set in the thickness direction of the generated resin molded product. Therefore, for each of the multiple virtual nodes, the number of virtual nodes used to calculate the corrected orientation can be reduced compared to when the correction results for all virtual nodes on the surface side of the virtual node itself are used, making it easier to correct the analytical orientation for analyzing the amount of shrinkage. As a result, by using the correction results for the virtual nodes adjacent to the surface side, the amount of shrinkage of the resin molded product can be easily and accurately analyzed based on the composite corrected fiber orientation.

In this case, the step of calculating the target correction orientation preferably includes a step of calculating the target correction orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node. Here, if the layer adjacent to the surface layer side is cooled and solidified first, it is considered that a difference occurs between the actual shrinkage amount and the shrinkage amount calculated based on the analyzed fiber orientation due to the difference in elastic modulus with the adjacent layer that has already solidified. In consideration of this, in the present invention, the target correction orientation is calculated by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node. With this configuration, in addition to the correction orientation at the virtual node adjacent to the surface layer side, the elastic modulus at the virtual node adjacent to the surface layer side can also be taken into consideration to correct the analysis orientation. Therefore, the analysis orientation, which is the fiber orientation analyzed to analyze the shrinkage amount, can be corrected more accurately. As a result, when the shrinkage amount is analyzed based on the correction orientation, which is the corrected fiber orientation, the shrinkage amount can be analyzed more accurately and precisely.

In the resin molding analysis method for calculating the target correction orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node, preferably, the step of calculating the target correction orientation includes a step of calculating a correction coefficient based on the elastic modulus of the resin material at the adjacent virtual node and the temperature difference between the target virtual node and the adjacent virtual node, and a step of performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the correction coefficient. With this configuration, since the elastic modulus of the resin material changes depending on the temperature, the analytical orientation can be corrected more accurately to analyze the amount of shrinkage while considering the influence caused by the difference in the elastic modulus with the adjacent layer that has already solidified by using a correction coefficient calculated based on the temperature difference with the virtual node adjacent to the surface layer side and the elastic modulus at the adjacent virtual node. As a result, when the amount of shrinkage is analyzed by synthesizing the correction orientation, which is the corrected fiber orientation, the amount of shrinkage can be analyzed more accurately and precisely.

In this case, preferably, the step of performing a calculation to correct the target analysis orientation includes a step of performing a calculation to correct the target analysis orientation by calculating an average of the target analysis orientation and an adjacent correction orientation weighted by a correction coefficient. With this configuration, the calculation to correct the analysis orientation can be more easily performed by calculating an average of the target analysis orientation and an adjacent correction orientation weighted by a correction coefficient. As a result, the amount of shrinkage can be more easily analyzed based on the correction orientation, which is the corrected analysis orientation.

In the resin molded product analysis method according to the first aspect, the step of analyzing the shrinkage preferably includes a step of analyzing the shrinkage of each of the multiple microelements or multiple nodes based on the average of the corrected orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzing the shrinkage of the resin molded product based on the shrinkage of each of the analyzed multiple microelements or multiple nodes. With this configuration, the fiber orientation synthesized in the thickness direction can be easily obtained by obtaining the average of the corrected orientation calculated at each virtual node. Therefore, the corrected orientation synthesized for each microelement or each node can be easily obtained based on the corrected orientation, so that the shrinkage of each microelement or each node can be easily analyzed. As a result, the shrinkage of the resin molded product can be easily and accurately analyzed, taking into account the effect of the resin material solidifying in order from the surface side.

In the resin molded product analysis method according to the first aspect, the step of setting a plurality of virtual nodes preferably includes a step of setting an even number of virtual nodes along the thickness direction of the resin molded product for each of a plurality of infinitesimal elements or a plurality of nodes. With this configuration, an even number of virtual nodes are set, and by performing calculations from one side and the other side in the thickness direction the same number of times, it is possible to calculate the correction orientation for all of the plurality of virtual nodes in order from the surface layer side. As a result, unlike the case where an odd number of virtual nodes are set, similar correction calculations can be performed in order from both one side and the other side for all virtual nodes without any remainders, making it easier to perform correction calculations for all virtual nodes.

In the resin molded product analysis method according to the first aspect, the step of analyzing the shrinkage amount preferably includes a step of analyzing the shrinkage amount in the flow direction of the resin material and the orthogonal direction orthogonal to the flow direction in a plane along the surface of the resin molded product at each of the multiple microelements or multiple nodes based on the correction orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzing the shrinkage amount in the flow direction and the orthogonal direction of the resin molded product based on the shrinkage amount in the flow direction and the orthogonal direction at each of the analyzed multiple microelements or multiple nodes. With this configuration, a calculation is performed to correct the fiber orientation in two directions, the flow direction and the orthogonal direction of the resin material, so the processing load required for the correction calculation can be reduced compared to the case where the fiber orientation is corrected in three directions, including the flow direction, the orthogonal direction, and the thickness direction. As a result, the processing load when analyzing the shrinkage amount in the resin molded product can be reduced by analyzing the shrinkage amount in two directions, the flow direction and the orthogonal direction, based on the calculated correction orientation.

A program according to a second aspect of the present invention causes a computer to execute the resin molded product analysis method according to the first aspect.

In the program according to the second aspect of the present invention, the resin molded product analysis method according to the first aspect is executed on a computer, whereby the distribution of fiber orientation in the thickness direction of the resin molded product is synthesized, and when the shrinkage amount of the resin molded product is analyzed based on the synthesized fiber orientation, the shrinkage amount of the resin molded product can be accurately analyzed.

A storage medium according to the third aspect of the present invention has a program according to the second aspect recorded thereon and is computer-readable.

The storage medium according to the third aspect of the present invention has the program according to the second aspect recorded thereon and is computer-readable, so that when the distribution of fiber orientation in the thickness direction of the resin molded product is synthesized and the amount of shrinkage of the resin molded product is analyzed based on the synthesized fiber orientation, the amount of shrinkage of the resin molded product can be accurately analyzed.

The resin molded product analysis device according to a fourth aspect of the present invention is a resin molded product analysis device that analyzes the amount of shrinkage of a resin molded product molded from a resin material containing fibers, and includes a microelement division unit that divides the resin molded product into a plurality of microelements, a virtual node setting unit that sets a plurality of virtual nodes along the thickness direction of the resin molded product in each of the plurality of microelements or in each of the plurality of nodes constituting the vertices of each microelement, an analytical orientation acquisition unit that acquires an analytical orientation by analyzing the orientation of the fibers in each of the plurality of virtual nodes of each microelement or each node, and a correction unit that corrects the analytical orientation in each of the plurality of virtual nodes of each microelement or each node, in order from the surface side of the resin molded product. The apparatus includes a correction orientation calculation unit that calculates a correction orientation for analyzing the amount of shrinkage by performing a calculation to calculate a correction orientation for analyzing the amount of shrinkage, and a shrinkage amount analysis unit that analyzes the amount of shrinkage of each of the multiple microelements or multiple nodes based on the correction orientation calculated at each of the multiple virtual nodes of each microelement or each node, and analyzes the amount of shrinkage of the resin molded product based on the shrinkage amount at each of the analyzed multiple microelements or multiple nodes. The correction orientation calculation unit is configured to calculate the correction orientation by performing a calculation to correct the analysis orientation at each of the multiple virtual nodes of each microelement or each node based on the correction result at the virtual node on the surface side of the microelement or each node.

The resin molded product analysis device according to the fourth aspect of the present invention, as described above, calculates the corrected orientation for analyzing the shrinkage amount by performing a calculation to correct the analytical orientation in each of the multiple virtual nodes of each microelement or each node, starting from the surface side of the resin molded product. Then, in each of the multiple virtual nodes of each microelement or each node, a calculation is performed to correct the analytical orientation based on the correction result in the virtual node on the surface side of the microelement or each node, and the corrected orientation is calculated. As a result, the analytical orientation, which is the fiber orientation analyzed in each of the multiple virtual nodes of each microelement or each node, is corrected based on the correction result in the virtual node on the surface side of the microelement or each node, starting from the surface side of the resin molded product, so that the analyzed fiber orientation (analysis orientation) can be corrected taking into account the effect of the resin material solidifying in sequence from the surface side. Therefore, the shrinkage amount of the resin molded product can be analyzed by synthesizing the distribution of the fiber orientation corrected taking into account the effect of the resin material solidifying in sequence from the surface side. As a result, it is possible to provide a resin molded product analysis device that can accurately analyze the amount of shrinkage of a resin molded product by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product and analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation.

According to the present invention, as described above, by synthesizing the distribution of fiber orientation in the thickness direction of a resin molded product, the amount of shrinkage of the resin molded product can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product based on the synthesized fiber orientation.

1 is a block diagram showing a configuration of an analysis device according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing division of minute elements of a resin molded product. FIG. 13 is a schematic diagram for explaining the setting of a virtual node in one infinitesimal element. FIG. 2 is a schematic diagram showing fiber orientation in a resin molded product. FIG. 13 is a diagram for explaining an analytical orientation and a corrective orientation. FIG. 13 is a diagram for explaining calculation of a corrected orientation. FIG. 1 is a flowchart illustrating a resin molded product analysis method according to an embodiment. FIG. 11 is a flowchart for explaining details of a method for correcting analytical orientation according to one embodiment. FIG. 13 is a schematic diagram for explaining setting of a virtual node at one node according to a modified example of the present invention.

The following describes an embodiment of the present invention with reference to the drawings.

(Configuration of the analysis device)
The configuration of an analysis device 100 according to the present embodiment will be described with reference to Figures 1 to 6. The analysis device 100 is an example of the "resin molding analysis device" and "computer" in the claims.

The analysis device 100 is configured to be able to analyze the shape (warpage) of a resin molded product 1 (see FIG. 2) by analyzing the amount of shrinkage of the resin molded product 1 (see FIG. 2) that is molded from a resin material containing fibers (reinforced fibers). The resin material that molds the resin molded product 1 is, for example, a fiber-reinforced resin that is a composite of thermoplastic resin such as PP resin and ABS resin with fibers such as glass fiber and carbon fiber. The resin molded product 1 is molded by injection molding, in which the resin material is filled into a mold. The resin molded product 1 may also include an insert molded product that is molded integrally with a metal part or the like.

As shown in FIG. 1, the analysis device 100 includes one or more processors 10, such as a CPU (Central Processing Unit), and a storage unit 20 including a ROM (Read Only Memory), a RAM (Random Access Memory), and a storage device. The storage unit 20 is, for example, a hard disk drive or a semiconductor storage device. The analysis device 100 is a personal computer (PC) used by an operator who analyzes the amount of shrinkage of the resin molded product 1. Note that some or all of the processing performed by the analysis device 100 executing the program 21 may be performed by hardware such as a dedicated arithmetic circuit.

The analysis device 100 analyzes the amount of shrinkage of the resin molded product 1 by having the processor 10 execute the program 21 stored in the storage unit 20. The program 21 is CAE (Computer Aided Engineering) software for performing analysis by simulating the molding of a resin material. The program 21 may be read from the recording medium 101, or may be provided from an external server via a transmission path such as a network such as the Internet or a LAN (Local Area Network). The recording medium 101 is a computer-readable recording medium such as an optical disk, a magnetic disk, or a non-volatile semiconductor memory, and the program 21 is recorded therein.

In addition to the program 21, the memory unit 20 stores various analysis data 22 used to analyze the amount of shrinkage. The analysis data 22 includes, for example, thermophysical properties of the resin material, such as viscosity, elastic modulus, and thermal conductivity, and material property data such as a state diagram. The analysis data 22 also includes various parameters used when analyzing the amount of shrinkage. The various parameters of the analysis data 22 include, for example, boundary conditions acquired based on input operations by an operator to an operation unit (not shown). The boundary conditions include the gate position, injection speed, resin temperature, and mold temperature.

The analysis device 100 also includes a display unit 30 such as a liquid crystal display device, and a reading unit 40 for reading the program 21 and various data from the recording medium 101. The reading unit 40 is a reader device or the like according to the type of recording medium 101. The analysis data 22 stored in the memory unit 20 may be read by the reading unit 40 from the recording medium 101 created by the worker, or may be created by the worker on an external server and acquired from the external server via a transmission path.

(Processor Configuration)
In this embodiment, the processor 10 includes an infinitesimal element division unit 11, a virtual node setting unit 12, an analytical orientation acquisition unit 13, a correction orientation calculation unit 14, and a shrinkage amount analysis unit 15. Specifically, the processor 10 as hardware is configured to include the infinitesimal element division unit 11, the virtual node setting unit 12, the analytical orientation acquisition unit 13, the correction orientation calculation unit 14, and the shrinkage amount analysis unit 15 as functional blocks of the software (program 21).

As shown in FIG. 2, in this embodiment, the microelement division unit 11 of the processor 10 divides the resin molded product 1 into a plurality of microelements. Specifically, the analysis device 100 acquires shape data of the resin molded product 1 by acquiring three-dimensional CAD information of the resin molded product 1 based on an input operation by an operator who analyzes the resin molded product 1. The microelement division unit 11 then divides the three-dimensional shape data of the resin molded product 1 into a plurality of microelements (meshes) to generate an analysis model of the resin molded product 1. The microelement division unit 11 also divides the resin molded product 1 in the thickness direction of each part of the resin molded product 1 so that there is one microelement. Each microelement has a rectangular parallelepiped shape.

For example, in the portion of the resin molded product 1 that is shaped to extend along the XY plane (part a in Figure 2), the thickness direction is the Z direction. Therefore, the microelement division unit 11 divides the resin molded product 1 into multiple microelements so that the number in the Z direction is at least one (one layer). Note that the resin molded product 1 of this embodiment is formed by flowing the resin material from one sprue part S. Therefore, in part a, the resin material flows along the X1 direction as it fills the mold that molds the resin molded product 1.

In each part of the resin molded product 1, the flow direction of the resin is defined as MD (Machine Direction), and the orthogonal direction perpendicular to the MD in a plane along the surface of the resin molded product 1 (in a plane perpendicular to the thickness direction) is defined as TD (Transverse Direction). For example, in part a of Figure 2, MD is the X direction in the figure, and TD is the Y direction in the figure. In addition, the processor 10 sets the MD and TD and the thickness direction in each of the multiple microelements based on the acquired shape data of the resin molded product 1.

3, in this embodiment, the virtual node setting unit 12 of the processor 10 sets a plurality of virtual nodes P along the thickness direction of the resin molded product 1 in each of the plurality of microelements divided by the microelement dividing unit 11. Specifically, the virtual node setting unit 12 sets an even number (e.g., 20) of virtual nodes P along the thickness direction of the resin molded product 1 in each of the plurality of microelements of the resin molded product 1. For example, in one microelement 1a of the plurality of microelements included in the portion a of FIG. 2, 20 virtual nodes P ₁ to P ₂₀ are set by the virtual node setting unit 12 along the Z direction. Here, the virtual node P ₁ is set so as to be located on the surface of the resin molded product 1 on the Z2 direction side. And the virtual node P ₂₀ is set so as to be located on the surface of the resin molded product 1 on the Z1 direction side.

Obtaining fiber orientation (analysis orientation)
In this embodiment, the analytical orientation acquisition unit 13 of the processor 10 analyzes the orientation of fibers contained in the resin material at each of the multiple virtual nodes P of each microelement set by the virtual node setting unit 12. Specifically, the analytical orientation acquisition unit 13 executes the program 21 to simulate the flow state of the resin material at each of the multiple virtual nodes P based on the analysis data 22 stored in the storage unit 20. Then, the analytical orientation acquisition unit 13 calculates a three-dimensional fiber orientation tensor at each of the multiple virtual nodes P. The fiber orientations in the MD, TD, and thickness directions are calculated from the three-dimensional fiber orientation tensor. In detail, the analytical orientation acquisition unit 13 executes the program 21 to calculate flow data such as the resin temperature, resin pressure, and flow speed of the resin material during injection molding, thereby calculating (analyzing) the fiber orientation at each of the multiple virtual nodes P. Then, the analytical orientation acquisition unit 13 acquires the analyzed fiber orientation as an analytical orientation Q (see FIG. 5). The analyzed fiber orientation, ie, analyzed orientation Q, is a simulation of the fiber orientation in the actual resin molded product 1.

As shown in FIG. 4, the fiber-containing resin molded product 1 has biased fiber orientation in the flow direction (MD), transverse direction (TD), and thickness direction of the resin material. The fibers (reinforcing fibers) contained in the resin molded product 1 have an elongated shape, and the proportion of fibers oriented in the MD is high due to the shear force of the resin material when it flows through the mold. In addition, in the resin molded product 1, the MD orientation is large (strong) on the surface side (surface side) in the thickness direction, and the fiber orientation (fiber orientation) is random on the center side (inside) in the thickness direction. For example, in the fiber orientation (fiber orientation) of the microelement 1a in FIG. 3, the proportion of fibers arranged along the X direction, which is the MD, is relatively high on the surface side (near the surface).

As shown in FIG. 5, in this embodiment, the analytical orientation Q acquired by the analytical orientation acquisition unit 13 is expressed as a three-dimensional fiber orientation tensor. The fiber orientation vectors in the MD, TD, and thickness directions are calculated from the three-dimensional fiber orientation tensor. The value on the vertical axis in FIG. 5 indicates the magnitude of the fiber orientation vector (MD) in the resin material. In the fiber orientation tensor, the closer the value is to 1.0, the greater the proportion (probability) of fibers that are arranged along the MD (X direction). And the closer the value is to 0.0, the greater the proportion (probability) of fibers that are arranged along the TD (Y direction) or thickness direction.

<Analysis Orientation Correction>
Here, in the molding of the resin molded product 1, the resin material of the resin molded product 1 is gradually cooled and solidified in the mold starting from the surface layer side in the thickness direction. Therefore, in the molding of the resin molded product 1, the surface layer side is cooled and solidified first, and the center side (inner side) part in the thickness direction shrinks while being influenced by the surface layer side part. Therefore, when analyzing the shrinkage amount of the resin molded product 1 based on the fiber orientation (analysis orientation Q), it is necessary to not only analyze the fiber orientation in each part of the resin molded product 1, but also to analyze the shrinkage amount taking into account the influence of the resin material solidifying in order from the surface layer side.

As shown in FIG. 5 and FIG. 6, the corrected orientation calculation unit 14 of the processor 10 is configured to calculate the corrected fiber orientation, that is, the corrected orientation R, at each of the multiple virtual nodes P by correcting the analytical orientation Q acquired by the analytical orientation acquisition unit 13 in order to analyze the amount of shrinkage of the resin molded product 1. Specifically, in this embodiment, the corrected orientation calculation unit 14 calculates the corrected orientation R for analyzing the amount of shrinkage at each of the multiple virtual nodes P of each microelement by performing a calculation to correct the analytical orientation Q in sequence from the surface side of the resin molded product 1. Also, in this embodiment, the corrected orientation calculation unit 14 performs a calculation to correct the analytical orientation Q at each of the multiple virtual nodes P of each microelement based on the correction result at the virtual node P on the surface side of the microelement.

As shown in FIG. 6, as an example, in the infinitesimal element 1a of FIG. 3, a case will be described in which the analytical orientation Q _n acquired at the n-th virtual node P _n from the surface layer is corrected to calculate the corrected orientation R _n . The n-th virtual node P _n is one of the first to tenth virtual nodes P ₁ to P ₁₀ counting from the Z2 direction. That is, the n-1th virtual node P _n-1 is adjacent to the surface layer side of the n-th virtual node P _n . The analytical orientation Q at the n-1th virtual node P _n-1 is the analytical orientation Q _n-1 , and the corrected orientation R is the corrected orientation R _n-1 . The virtual node P _n and the virtual node P _n-1 are examples of the "target virtual node" and the "adjacent virtual node" in the claims, respectively. The analytical orientation Q _n is an example of the "target analytical orientation" in the claims. Moreover, the corrective orientation R _n and the corrective orientation R _n-1 are examples of the "target corrective orientation" and the "adjacent corrective orientation" in the claims, respectively.

すなわち、本実施形態では、補正配向算出部１４は、解析配向Ｑ_ｎと、補正係数ｋによって重み付けされた補正配向Ｒ_ｎ－１との平均を計算することによって、解析配向Ｑ_ｎを補正する計算を行うことによって、補正配向Ｒ_ｎを算出する。 When calculating the correction orientation R _n at the virtual node P _n , the correction orientation calculation unit 14 performs a calculation to correct the analytical orientation Q _n at the virtual node P _n based on the correction orientation R n _{-1, which is the correction result at the virtual node P n-1 adjacent} to the virtual node P _n on the surface side of the virtual node P n itself. The calculation of the correction orientation R _n at the virtual node P _n is expressed as shown in formula (1) by the correction coefficient k and the correction orientation R _n-1 at the virtual node P _n-1 adjacent to the surface side.

That is, in this embodiment, the corrected orientation calculation unit 14 calculates the average of the analytical orientation Q _n and the corrected orientation R _n-1 weighted by the correction coefficient k, thereby performing a calculation to correct the analytical orientation Q _n , thereby calculating the corrected orientation R _n .

固化温度弾性率は、樹脂材料の固化温度における弾性率を示す。また、隣接層弾性率は、樹脂材料の固化温度と隣接層温度差との差の温度における樹脂材料の弾性率を示す。隣接層温度差は、複数の仮想節点Ｐのうちの隣り合う２つの仮想節点Ｐ同士の間の温度差を示す。すなわち、隣接層温度差は、仮想節点Ｐ_ｎと仮想節点Ｐ_ｎ－１との間の温度差を示す。したがって、補正係数ｋは、仮想節点Ｐ_ｎにおいて樹脂材料が固化する時点での弾性率と、その時点においてすでに固化している仮想節点Ｐ_ｎ－１における樹脂材料の弾性率との比率を模擬的に示した値である。 In this embodiment, the correction orientation calculation unit 14 is configured to calculate the correction coefficient k based on the temperature difference between the virtual node P _n-1 and the virtual node P _n and the elastic modulus of the resin material at the virtual node P _n-1 , based on the flow data (resin material analysis results) by the analysis orientation acquisition unit 13. Specifically, in this embodiment, the correction coefficient k is calculated by the calculation of formula (2).

The solidification temperature elastic modulus indicates the elastic modulus at the solidification temperature of the resin material. The adjacent layer elastic modulus indicates the elastic modulus of the resin material at the temperature difference between the solidification temperature of the resin material and the adjacent layer temperature difference. The adjacent layer temperature difference indicates the temperature difference between two adjacent virtual nodes P among the multiple virtual nodes P. In other words, the adjacent layer temperature difference indicates the temperature difference between virtual node P _n and virtual node P _n-1 . Therefore, the correction coefficient k is a value that simulates the ratio between the elastic modulus at the time when the resin material at virtual node P _n solidifies and the elastic modulus of the resin material at virtual node P _n-1 that has already solidified at that time.

In detail, the analysis orientation acquisition unit 13 executes the program 21 to simulate the injection molding of the resin molded product 1 at each of the multiple virtual nodes P, thereby analyzing (calculating) the resin temperature at any of the following points during the molding process: when the pressure holding is completed, when the velocity pressure (VP) is switched from the filling process to the pressure holding process, or when the mold is released. Then, based on the resin temperature calculated at each of the multiple virtual nodes P, the temperature difference between the virtual node P _n and the virtual node P _n-1 is acquired as the adjacent layer temperature difference. In addition, the solidification temperature is a unique value specific to the resin material, and is acquired based on the material property data included in the analysis data 22 stored in the storage unit 20. In addition, the elastic modulus of the resin material is similarly calculated based on the material property data included in the analysis data 22 stored in the storage unit 20. The analysis data 22 stored in the storage unit 20 includes a conditional formula for calculating the elastic modulus of the resin material of the resin molded product 1. The elastic modulus of the resin material forming the resin molded product 1 changes in value so as to increase approximately linearly in proportion to a decrease in temperature. Therefore, the correction coefficient k is a value greater than 1, and increases as the temperature difference between virtual node P _n and virtual node P _n-1 increases (as the difference in elastic modulus increases). In this way, the correction coefficient k is calculated to have a magnitude that takes into account the temperature difference between virtual node P _n and virtual node P _n-1 and the elastic modulus of the adjacent layer (virtual node P _n-1 ).

Although the virtual node _Pn is one of the virtual nodes _P1 to _P10 , the same calculation as for the virtual node _Pn is performed for the virtual nodes _P11 to _P20 . In that case, the virtual node adjacent to the surface side is the virtual node Pn ₊₁ . In this embodiment, the corrected orientation calculation unit 14 is configured to calculate the corrected orientation _R at each of the multiple virtual nodes _P by repeating a calculation similar to the calculation of the corrected orientation Rn at the virtual node Pn for each of the multiple virtual nodes P for each infinitesimal element, in order from the surface side of the resin molded product 1. For example, the correction orientation calculation unit 14 calculates the correction orientations R ₁ to R ₁₀ by performing calculations to correct the analytical orientations Q ₁ to Q ₁₀ in the order of virtual nodes P ₁ , P ₂ , P ₃ , ..., P ₁₀ for the 20 virtual nodes P 1 to P 20 included in the infinitesimal element 1a, and calculates the correction orientations R _{20 to} R ₁₁ by performing calculations to correct the analytical orientations Q ₂₀ to Q ₁₁ in the order of virtual nodes P ₂₀ , P ₁₉ , P ₁₈ , ..., P _11. Since the virtual nodes P ₁ and P ₂ are on the outermost layer side, the analytical orientations Q ₁ and Q ₂₀ are calculated as the correction orientations _{R 1 and} R ₂₀ as they are, respectively. Then, the correction orientation R is calculated by the calculation shown in formula (1) for the virtual nodes P that are second or later from the outermost layer side.

Analysis of shrinkage amount
In this embodiment, the shrinkage amount analysis unit 15 of the processor 10 analyzes the shrinkage amount of each of the multiple microelements based on the average of the corrected orientations R calculated at each of the multiple virtual nodes P of each microelement. The shrinkage amount analysis unit 15 is also configured to analyze the shrinkage amount in at least two directions of the flow direction (MD), the orthogonal direction (TD), and the thickness direction of the resin material for each of the multiple microelements.

For example, the shrinkage amount analysis unit 15 calculates the average value (average fiber orientation tensor) of the corrected orientations R ₁ to R ₂₀ at each of the 20 virtual nodes P ₁ to P ₂₀ in the infinitesimal element 1a. The shrinkage amount analysis unit 15 then calculates the shrinkage amount in the infinitesimal element 1a by taking the calculated average value as the ratio of the shrinkage amount (shrinkage rate) in the flow direction (MD) to the orthogonal direction (TD). For example, when the average value of the calculated corrected orientations R ₁ to R ₂₀ is 0.8, the shrinkage amount in the infinitesimal element 1a is calculated so that the ratio of the shrinkage amount in the MD to the shrinkage amount in the TD is 0.8:0.2.

Then, the shrinkage amount analysis unit 15 (processor 10) analyzes the flow direction (MD) and the orthogonal direction (TD) and the shrinkage amount of the resin molded product 1 based on the shrinkage amount in the flow direction (MD) and the orthogonal direction (TD) of each of the analyzed microelements. In this manner, the processor 10 (shrinkage amount analysis unit 15) of the analysis device 100 analyzes the shape (warpage deformation) of the resin molded product 1 by analyzing the shrinkage amount of the resin molded product 1 taking into account the fiber orientation due to the flow of the resin material and the effect (difference in elastic modulus) due to the solidification of the resin material from the surface side.

The processor 10 is also configured to display the analysis results of the resin molded product 1 on the display unit 30. For example, the processor 10 displays the post-analysis shape (post-deformation shape) of the resin molded product 1 on the display unit 30 as the analysis result. The processor 10 is also configured to display the corrected orientation R calculated by the corrected orientation calculation unit 14 on the display unit 30 so that it is visible.

(Resin molded product analysis method)
Next, a resin molded product analysis method using the analysis device 100 of this embodiment will be described with reference to Fig. 7. The resin molded product analysis method of this embodiment is a method for analyzing the amount of shrinkage of a resin molded product 1 that is molded from a resin material that contains fibers. The resin molded product analysis method of this embodiment is implemented by causing the processor 10 of the analysis device 100 to execute a program 21.

First, in step S1, shape data of the resin molded product 1 is acquired, and various analysis data 22 used to analyze the amount of shrinkage are acquired (stored).

Next, in step S2, the resin molded product 1 is divided into a plurality of minute elements (meshes). Specifically, the shape data of the resin molded product 1 is divided into a plurality of minute elements, and an analytical model of the resin molded product 1 is generated.

Next, in step S3, in each of the plurality of infinitesimal elements, a plurality of virtual nodes P are set along the thickness direction of the resin molded product 1. For example, in the infinitesimal element 1a, an even number (20) of virtual nodes P ₁ to P ₂₀ are set.

Next, in step S4, an analytical orientation Q is obtained by analyzing the orientation of the fiber at each of the multiple virtual nodes P of each microelement. For example, in the microelement 1a, an analytical orientation _Qn is obtained at one virtual node _Pn among the 20 virtual nodes _P1 to _P20 .

Next, in step S5, a calculation is performed to correct the analytical orientation Q at each of the multiple virtual nodes P of each microelement, starting from the surface side of the resin molded product 1, thereby calculating a corrected orientation R for analyzing the amount of shrinkage. Specifically, a calculation is performed to correct the analytical orientation Q at each of the multiple virtual nodes P of each microelement, based on the correction result at the virtual node P on the surface side of the microelement, thereby calculating the corrected orientation R. The method of correcting the analytical orientation Q (method of calculating the corrected orientation R) will be described in detail later.

Next, in step S6, the amount of shrinkage in the flow direction (MD) and orthogonal direction (TD) of each of the microelements is analyzed based on the average of the corrected orientations R calculated at each of the multiple virtual nodes P of each microelement. Then, the amount of shrinkage in the MD and TD of the resin molded product 1 is analyzed based on the amount of shrinkage in the MD and TD of each of the analyzed multiple microelements.

Next, in step S7, the analysis result of the amount of shrinkage of the resin molded product 1 is displayed on the display unit 30. Specifically, the shape of the resin molded product 1 after analysis (shape after deformation) is displayed on the display unit 30. In addition, the calculated corrected orientation R is displayed on the display unit 30 so that it can be seen.

<Method of correcting analytical orientation>
Next, the details of the correction method of the analytical orientation Q will be described with reference to Fig. 8. As an example, the correction method of the analytical orientation _Qn of the virtual node _Pn in one infinitesimal element 1a (see Fig. 3) among the infinitesimal elements will be described. Here, n = 1 to 20.

First, in step S51, the analytical orientations Q1 and _Q20 obtained at the virtual nodes _P1 and P20 on the outermost side (outermost) of the 20 virtual nodes _P1 to _P20 of the infinitesimal element 1a (when n = ₁ and ₂₀ ) are directly obtained as corrective orientations _R1 and _R20 , respectively.

Next, in step S52, for n=2, a correction coefficient _k is calculated for the second virtual node _Pn from the surface side of the 20 virtual nodes _P1 to _P20 , based on the elastic modulus of the resin material at the virtual node Pn _-1 adjacent to the surface side of the virtual node _Pn and the temperature difference between the virtual node Pn and the virtual node _Pn-1 . Similarly, for n=19, a correction coefficient k for the virtual node _Pn is calculated. Note that for n=11 to 19, the adjacent virtual node is the virtual node Pn ₊₁ .

Next, in step S53, a calculation is performed to correct the analytical orientation Q _n based on the correction orientation R _n-1 calculated at the virtual node P _n-1 and the correction coefficient k. Specifically, a calculation is performed to correct the analytical orientation Q _n by calculating the average of the analytical orientation Q n and the correction orientation R _{n-1 weighted} by the calculated correction coefficient k. As a result, a calculation is performed to correct the analytical orientation Q _n based on the correction orientation R n-1 and the elastic modulus of the resin material at the virtual node P _{n -1} , thereby calculating the correction orientation R _n .

Next, in step S54, steps S52 and S53 are repeated for each of the multiple virtual nodes P in order from the surface layer side of the resin molded product 1 (while changing the value of n). Specifically, steps S52 and S53 are repeated for virtual nodes _P2 , _P3 , _P4 , ..., _P10 in this order to calculate corrected orientations _R2 to _R10 . Similarly, steps S52 and S53 are repeated for virtual nodes _P19 , _P18 , _P17 , ..., _P11 in the order from the surface layer on the opposite side to calculate corrected orientations _R11 to _R19 .

As described above, by executing steps S51 to S54, the analytical orientation Q _n (analytical orientation Q 1 to Q ₂₀ ) at each of the 20 virtual nodes P _n (virtual nodes P ₁ to P ₂₀ ) in the infinitesimal element _1a is corrected, and the corrected orientation R _n (corrected orientation R ₁ to R ₂₀ ) is calculated. A similar process is executed in each of the multiple infinitesimal elements of the resin molded product 1.

[Effects of this embodiment]
In this embodiment, the following effects can be obtained.

In the resin molded product analysis method of this embodiment, as described above, a calculation is performed to correct the analytical orientation Q at each of the multiple virtual nodes P of each microelement in order from the surface side of the resin molded product 1, thereby calculating the corrected orientation R for analyzing the amount of shrinkage. Then, at each of the multiple virtual nodes P of each microelement, a calculation is performed to correct the analytical orientation Q based on the correction result (corrected orientation R) at the virtual node P on the surface side of the microelement, thereby calculating the corrected orientation R. As a result, a calculation is performed to correct the analytical orientation Q, which is the fiber orientation analyzed at each of the multiple virtual nodes P of each microelement, in order from the surface side of the resin molded product 1, based on the correction result at the virtual node P on the surface side of the microelement, so that the analyzed fiber orientation (analysis orientation Q) can be corrected taking into account the effect of the resin material solidifying in order from the surface side. Therefore, the amount of shrinkage of the resin molded product 1 can be analyzed by synthesizing the distribution of the fiber orientation corrected in consideration of the effect of the resin material solidifying in order from the surface side. As a result, by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product 1, the amount of shrinkage of the resin molded product 1 can be accurately analyzed when analyzing the amount of shrinkage of the resin molded product 1 based on the synthesized fiber orientation.

In addition, in this embodiment, as described above, an analytical orientation Q _n (target analytical orientation) at one virtual node P _n (target virtual node) among the multiple virtual nodes _P is obtained. Then, a calculation is performed to correct the analytical orientation Q n based on a corrected orientation R _n-1 (adjacent corrected orientation) calculated at a virtual node P _n-1 (adjacent virtual node) adjacent to the surface side of the virtual node P _n among the multiple virtual nodes _P , thereby calculating a corrected orientation _{R n (} target corrected orientation) at the virtual node P n. Then, the calculation of the corrected orientation R _n is repeated in order from the surface side of the resin molded product 1 at each of the multiple virtual nodes P. As a result, in each of the multiple virtual nodes P set in the thickness direction of the generated resin molded product 1, the corrected orientation R can be calculated from the surface side to the inside, layer by layer, using the correction result (corrected orientation R) at the virtual node P adjacent to the surface side. Therefore, for each of the multiple virtual nodes P, the number of virtual nodes P used to calculate the corrected orientation R can be reduced compared to the case where the correction results for all virtual nodes P on the surface layer side of the virtual node P are used, and therefore correction of the analytical orientation Q for analyzing the amount of shrinkage can be easily performed. As a result, by using the correction results for the adjacent virtual nodes P on the surface layer side, the amount of shrinkage of the resin molded product 1 can be easily and accurately analyzed based on the synthesized corrected fiber orientation.

In addition, in this embodiment, as described above, the analytical orientation Q n (target analytical orientation) is corrected based on the correction orientation R _n-1 (adjacent correction orientation) and the elastic modulus of the resin material at the virtual node P _{n -1} (adjacent virtual node), and the correction orientation R _n (target correction orientation) is calculated. Here, when the layer adjacent to the surface layer side is cooled and solidified first, it is considered that a difference occurs between the actual shrinkage amount and the shrinkage amount calculated based on the analyzed fiber orientation due to the difference in elastic modulus with the adjacent layer that has already solidified. In consideration of this, in this embodiment, the correction orientation R n is calculated by performing a calculation to correct the analytical orientation Q _n based on the correction orientation R _{n -1} and the elastic modulus of the resin material at the virtual node P _n-1 . As a result, in addition to the correction orientation R at the virtual node P adjacent to the surface layer side, the elastic modulus at the virtual node P adjacent to the surface layer side can also be taken into consideration to correct the analytical orientation Q. Therefore, the analytical orientation Q, which is the fiber orientation analyzed to analyze the shrinkage amount, can be corrected more accurately. As a result, when the amount of shrinkage is analyzed based on the corrected fiber orientation R, it is possible to analyze the amount of shrinkage more accurately and precisely.

In addition, in this embodiment, as described above, the correction coefficient k is calculated based on the elastic modulus of the resin material at the virtual node P _{n -1} (adjacent virtual node) and the temperature difference between the virtual node P _{n (} target virtual node) and the virtual node P n-1. Then, a calculation is performed to correct the analysis orientation Q _n (target analysis orientation) based on the correction orientation R _n-1 (adjacent correction orientation) and the correction coefficient k. As a result, since the elastic modulus of the resin material changes depending on the temperature, by using the correction coefficient k calculated based on the temperature difference with the adjacent virtual node P on the surface layer side and the elastic modulus at the adjacent virtual node P, it is possible to more accurately correct the analysis orientation Q to analyze the amount of shrinkage while considering the influence caused by the difference in the elastic modulus with the adjacent layer that has already solidified. As a result, when the amount of shrinkage is analyzed by combining the correction orientation R, which is the corrected fiber orientation, it is possible to more accurately analyze the amount of shrinkage.

In addition, in this embodiment, as described above, a calculation for correcting the analytical orientation Q n is performed by calculating the average of the analytical orientation Q _n (target analytical orientation) and the corrected orientation R _n-1 (adjacent corrected orientation) weighted by the correction coefficient _k . This makes it easier to perform a calculation for correcting the analytical orientation Q _n by calculating the average with the corrected orientation R _n-1 weighted by the correction coefficient k. As a result, the amount of shrinkage can be analyzed more easily based on the corrected orientation R (corrected orientation R _n ), which is the corrected analytical orientation Q (analysis orientation Q _n ).

In addition, in this embodiment, as described above, the amount of shrinkage of each of the multiple microelements is analyzed based on the average of the corrected orientation R calculated at each of the multiple virtual nodes P of each microelement, and the amount of shrinkage of the resin molded product 1 is analyzed based on the amount of shrinkage of each of the analyzed multiple microelements. In this way, by obtaining the average of the corrected orientation R calculated at each of the virtual nodes P, the fiber orientation synthesized in the thickness direction can be easily obtained. Therefore, the corrected orientation R synthesized for each microelement can be easily obtained based on the corrected orientation R, so that the amount of shrinkage for each microelement can be easily analyzed. As a result, the amount of shrinkage of the resin molded product 1 can be easily and accurately analyzed, taking into account the effect of the resin material solidifying in sequence from the surface layer side.

In addition, in this embodiment, as described above, an even number (e.g., 20) of virtual nodes P are set along the thickness direction of the resin molded product 1 in each of the multiple infinitesimal elements. As a result, an even number of virtual nodes P are set, and by performing calculations from one side and the other side in the thickness direction an equal number of times, the calculation of the correction orientation R can be performed for all of the multiple virtual nodes P in sequence starting from the surface layer side. As a result, unlike when an odd number of virtual nodes P are set, similar correction calculations can be performed in sequence from both one side and the other side for all of the virtual nodes P without any remainders, making it easier to perform correction calculations for all of the virtual nodes P.

In addition, in this embodiment, as described above, based on the correction orientation R calculated at each of the multiple virtual nodes P of each microelement, the shrinkage amount in the flow direction (MD) of the resin material and the orthogonal direction (TD) perpendicular to the flow direction in the plane along the surface of the resin molded product 1 is analyzed for each of the multiple microelements, and the shrinkage amount in the flow direction and orthogonal direction of the resin molded product 1 is analyzed based on the shrinkage amount in the flow direction and orthogonal direction in each of the analyzed multiple microelements. As a result, since a calculation is performed to correct the fiber orientation (analysis orientation Q) in two directions, the flow direction and the orthogonal direction of the resin material, the processing load required for the correction calculation can be reduced compared to the case where the fiber orientation is corrected in three directions, including the flow direction, the orthogonal direction, and the thickness direction. As a result, by analyzing the shrinkage amount in two directions, the flow direction and the orthogonal direction, based on the calculated correction orientation R, the processing load when analyzing the shrinkage amount in the resin molded product 1 can be reduced.

In addition, in this embodiment, the program 21, recording medium 101, and analysis device 100 can accurately analyze the amount of shrinkage of the resin molded product 1 when analyzing the amount of shrinkage of the resin molded product 1 based on the synthesized fiber orientation by synthesizing the distribution of fiber orientation in the thickness direction of the resin molded product 1, similar to the above-mentioned resin molded product analysis method.

[Modification]
It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

For example, in the above embodiment, an example was shown in which multiple virtual nodes P are set along the thickness direction of the resin molded product 1 in each of multiple microelements, but the present invention is not limited to this. In the present invention, multiple virtual nodes Pa may be set along the thickness direction (Z direction) of the resin molded product 1 in each of multiple nodes 201 that constitute the vertices of multiple microelements, such as the virtual nodes Pa in the modified example shown in Figure 9.

In the above embodiment, when correcting the analytical orientation Q _n (target analytical orientation) at the virtual node P _n (target virtual node), the correction calculation is performed based on the correction orientation R _{n -1 (adjacent correction orientation) calculated at the adjacent virtual node P n-1} (adjacent virtual node) on the surface side, but the present invention is not limited to this. In the present invention, the calculation for correcting the analytical orientation Q may be performed based on the correction results (correction orientations R) not only at the virtual node P adjacent to the surface side but also at multiple virtual nodes P on the surface side.

In the above embodiment, the correction coefficient k is calculated based on the elastic modulus of the resin material at the virtual node P n _{-1 calculated} based on the temperature difference between the virtual node P _n (target virtual node) and the virtual node P n-1 (adjacent virtual node), but the present invention is not limited to this. For example, the correction coefficient k may be calculated based on the temperature difference between the virtual node P _n and the virtual node P _n-1 without calculating the elastic modulus. Also, the correction coefficient k may not be calculated for each of the multiple virtual nodes P, but may be a common value for one infinitesimal element. Also, the correction coefficient k may be a constant characteristic value that is preset for each characteristic of the resin material in the entire resin molded product 1.

In the above embodiment, the analytical orientation Q _n is corrected by calculating the average of the analytical orientation Q n (target analytical orientation) and the correction orientation R _n-1 (adjacent correction orientation) weighted by the correction coefficient k, but the present invention is not limited to this. For example, the analytical orientation Q _n may be corrected by calculating the average of the analytical orientation Q _n and the correction orientation R _{n -1} without using the correction coefficient k. That is, when correcting the analytical orientation Q _n of the virtual node P _n (target virtual node), the specific calculation formula may be in any form as long as it _is configured to perform correction calculation from the surface side based on the elastic modulus or physical property value such as temperature at the virtual node P on the surface side of the virtual node P n itself.

In addition, in the above embodiment, an example was shown in which 20 virtual nodes P were set in one microelement, and the shrinkage amount of the microelement was analyzed based on the average of the calculated correction orientation R for each of the 20 virtual nodes P, but the present invention is not limited to this. For example, the shrinkage amount of the microelement may be analyzed based on the average of the calculated correction orientation R for each of 10 virtual nodes P, which is less than 20. Also, more than 20 virtual nodes P may be set. Also, the number of virtual nodes P in each of the multiple microelements may be made different depending on the size of each of the multiple microelements in the thickness direction.

In the above embodiment, an example is shown in which an even number of virtual nodes P are set in each of a plurality of infinitesimal elements, but the present invention is not limited to this. For example, an odd number of virtual nodes P may be set. In that case, when a calculation is performed to correct the analytical orientation Q from both sides of the surface layer side, one virtual node P at the center will be left over. When a calculation is performed to correct the analytical orientation Q at the remaining one virtual node P at the center, a calculation may be performed to correct the analytical orientation Q based on the correction orientation R at the virtual node P adjacent to one side, or a calculation may be performed to correct the analytical orientation Q based on the correction orientation R at the two virtual nodes P adjacent to both sides.

In the above embodiment, an example was shown in which the amount of shrinkage in two directions, the flow direction (MD) and the perpendicular direction (TD) of the resin material, was analyzed for each of a plurality of microelements based on the calculated corrected orientation R, but the present invention is not limited to this. For example, the fiber orientation in three directions, including the thickness direction, may be analyzed, and the amount of shrinkage in the three directions may be analyzed by correcting the orientation in the three directions.

In the above embodiment, an example was shown in which the resin molded product 1 was divided into multiple infinitesimal elements that are hexahedrons (rectangular parallelepipeds) as an analysis model of the resin molded product 1, but the present invention is not limited to this. For example, the infinitesimal elements may be tetrahedrons. Furthermore, the infinitesimal elements may be two-dimensional elements such as triangles or rectangles.

In addition, in the above embodiment, an example was shown in which the resin molded product 1 was divided into multiple microelements so that the number of microelements divided in the thickness direction of each part of the resin molded product 1 was one (one layer), but the present invention is not limited to this. For example, the number of microelements divided in the thickness direction of the resin molded product 1 may be multiple.

In the above embodiment, when calculating the temperature difference between the target virtual node P _n (target virtual node) and the adjacent virtual node P _n-1 (adjacent virtual node) in order to perform a calculation for correcting the analytical orientation Q _n (target analytical orientation), an example was shown in which the correction coefficient k is calculated by simulating the resin temperature at the time when the pressure retention of the mold is completed, but the present invention is not limited to this. For example, the correction coefficient k may be calculated by simulating the resin temperature at the time when the resin molded product 1 is removed from the mold.

REFERENCE SIGNS LIST 1 resin molded product 11 minute element division unit 12 virtual node setting unit 13 analysis orientation acquisition unit 14 correction orientation calculation unit 15 shrinkage amount analysis unit 21 program 100 analysis device (resin molded product analysis device, computer)
101 Recording medium

Claims (11)

A method for analyzing a resin molded product, which analyzes a shrinkage amount of a resin molded product molded from a resin material containing fiber, comprising the steps of:
Dividing the resin molded product into a plurality of minute elements;
setting a plurality of virtual nodes along a thickness direction of the resin molded product for each of the plurality of microelements or for each of a plurality of nodes constituting vertices of each of the plurality of microelements;
obtaining an analytical orientation by analyzing the orientation of the fiber at each of the plurality of virtual nodes of each of the microelements or each of the nodes;
A step of calculating a correction orientation for analyzing the amount of shrinkage by performing a calculation to correct the analytical orientation in each of the infinitesimal elements or each of the multiple virtual nodes of each of the nodes, starting from the surface layer side of the resin molded product;
analyzing the amount of shrinkage of each of the microelements or each of the nodes based on the corrected orientation calculated for each of the multiple virtual nodes of each of the microelements or each of the nodes, and analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage of each of the analyzed multiple microelements or each of the multiple nodes,
The step of calculating the corrected orientation includes a step of calculating the corrected orientation by performing a calculation to correct the analysis orientation at each of the multiple virtual nodes of each of the infinitesimal elements or each of the nodes based on a correction result at the virtual node on the surface side of the infinitesimal element or each of the nodes. The step of acquiring the analytical orientation includes a step of acquiring, at a target virtual node which is one of the virtual nodes among the plurality of virtual nodes, a target analytical orientation which is the analytical orientation at the target virtual node;
The step of calculating the corrected orientation includes:
A step of calculating a target correction orientation, which is the correction orientation at the target virtual node, by performing a calculation to correct the target analysis orientation based on an adjacent correction orientation, which is the correction orientation calculated at an adjacent virtual node adjacent to the surface side of the target virtual node among the plurality of virtual nodes;
2. The method for analyzing a resin molded product according to claim 1, further comprising: repeating the step of calculating the target corrected orientation for each of the plurality of virtual nodes in order from a surface layer side of the resin molded product. The resin molded product analysis method according to claim 2, wherein the step of calculating the target correction orientation includes a step of calculating the target correction orientation by performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the elastic modulus of the resin material at the adjacent virtual node. The step of calculating the object corrected orientation comprises:
calculating a correction coefficient based on an elastic modulus of the resin material at the adjacent virtual node and a temperature difference between the target virtual node and the adjacent virtual node;
The resin molded product analysis method according to claim 3 , further comprising: performing a calculation to correct the target analysis orientation based on the adjacent correction orientation and the correction coefficient. The resin molded product analysis method according to claim 4, wherein the step of performing a calculation to correct the target analysis orientation includes a step of performing a calculation to correct the target analysis orientation by calculating an average of the target analysis orientation and the adjacent correction orientation weighted by the correction coefficient. The method for analyzing a resin molded product according to any one of claims 1 to 5, wherein the step of analyzing the amount of shrinkage includes a step of analyzing the amount of shrinkage of each of the microelements or each of the nodes based on the average of the corrected orientation calculated for each of the multiple virtual nodes of each of the microelements or each of the nodes, and a step of analyzing the amount of shrinkage of the resin molded product based on the amount of shrinkage of each of the analyzed multiple microelements or each of the multiple nodes. The method for analyzing a resin molded product according to any one of claims 1 to 6, wherein the step of setting the plurality of virtual nodes includes a step of setting an even number of the plurality of virtual nodes along the thickness direction of the resin molded product in each of the plurality of infinitesimal elements or the plurality of nodes. The resin molded product analysis method according to any one of claims 1 to 7, wherein the step of analyzing the shrinkage amount includes a step of analyzing the shrinkage amount between the flow direction of the resin material and an orthogonal direction orthogonal to the flow direction in a plane along the surface of the resin molded product at each of the multiple microelements or multiple nodes based on the corrected orientation calculated at each of the multiple virtual nodes of each of the multiple microelements or each of the nodes, and analyzing the shrinkage amount between the flow direction and the orthogonal direction of the resin molded product based on the shrinkage amount between the flow direction and the orthogonal direction at each of the analyzed multiple microelements or multiple nodes. A program that causes a computer to execute the resin molded product analysis method described in any one of claims 1 to 8. A recording medium on which the program according to claim 9 is recorded and which is readable by the computer. A resin molded product analysis device that analyzes a shrinkage amount of a resin molded product molded from a resin material containing fiber, comprising:
a microelement dividing unit that divides the resin molded product into a plurality of microelements;
a virtual node setting unit that sets a plurality of virtual nodes along a thickness direction of the resin molded product in each of the plurality of infinitesimal elements or in each of a plurality of nodes that constitute the vertices of each of the infinitesimal elements;
an analytical orientation acquisition unit that acquires an analytical orientation by analyzing the orientation of the fiber in each of the infinitesimal elements or each of the plurality of virtual nodes of each of the nodes;
a correction orientation calculation unit that calculates a correction orientation for analyzing the shrinkage amount by performing a calculation to correct the analytical orientation in each of the infinitesimal elements or each of the multiple virtual nodes of each of the nodes, starting from the surface layer side of the resin molded product;
a shrinkage amount analysis unit that analyzes the amount of shrinkage of each of the plurality of infinitesimal elements or each of the plurality of nodes based on the corrected orientation calculated for each of the plurality of virtual nodes of each of the infinitesimal elements or each of the nodes, and analyzes the amount of shrinkage of the resin molded product based on the amount of shrinkage of each of the analyzed plurality of infinitesimal elements or each of the plurality of nodes,
The corrected orientation calculation unit is configured to calculate the corrected orientation at each of the multiple virtual nodes of each of the infinitesimal elements or each of the nodes by performing calculations to correct the analysis orientation based on the correction result at the virtual node that is on the surface side of the infinitesimal element or each of the nodes, in the plastic molded product analysis device.

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