JP7624915B2 - Electrical Equipment Unit - Google Patents

Description

The present invention relates to an electrical equipment unit.

For example, an electrical equipment unit such as a power conversion device includes a housing and multiple electrical equipment mounted in the housing. The electrical equipment includes multiple electronic elements that generate heat. To cool these electronic elements, it is generally known to provide a fan in the housing and circulate cooling air within the housing. In addition, various technologies have been proposed to further improve the cooling effect within the housing.

For example, a technique has been disclosed in which a heat exchanger is provided inside a housing, and the heat exchanger cools the warm cooling air inside the housing (see, for example, Patent Document 1).
Also, a technique has been disclosed in which an air tunnel is provided inside a housing and a heat exchanger is provided inside the air tunnel to regulate the flow of cooling air (see, for example, Patent Documents 2 and 3). This technique aims to efficiently cool electronic elements by regulating the flow of cooling air.

However, it is difficult to efficiently blow the cooling air cooled by the heat exchanger onto the electronic elements. This leaves room for improvement in efficiently cooling the electronic elements. Also, if an air tunnel is provided inside the housing, the number of parts in the electrical equipment unit increases, raising manufacturing costs and making the housing larger.

JP 2020-129923 A International Publication No. 2018/047229 JP 2020-31169 A

The problem that this invention aims to solve is to provide an electrical equipment unit that can efficiently cool electronic elements while being inexpensive and preventing the unit from becoming too large.

The electric equipment unit of the embodiment includes a heat exchanger, a fan, an electric equipment, a first wind shielding plate, and a second wind shielding plate . The heat exchanger is provided in the housing and has an intake port through which air is drawn and an air outlet port through which air is sent out. The fan supplies cooling air into the housing through the heat exchanger. The electric equipment is provided in the housing and has a conductor plate on both sides of which electronic elements are mounted. The conductor plate forms a flow path so that the cooling air is circulated within the housing. The heat exchanger and the fan are disposed midway through the flow path. The first wind shielding plate extends from the conductor plate and has insulating properties. The second wind shielding plate is provided so as to separate the outer periphery of the conductor plate and the housing. The first wind shielding plate is in contact with the heat exchanger. The first wind shielding plate separates the intake port and the air outlet of the heat exchanger. Cooling air for cooling the electronic elements flows on both sides of the conductor plate.

FIG. 2 is a schematic configuration diagram showing an electric device unit according to the embodiment.

The electrical equipment unit of the embodiment is described below with reference to the drawings.

FIG. 1 is a schematic diagram of an electrical device unit 1. As shown in FIG.
The electric equipment unit 1 is, for example, a panel provided in an electric facility, etc. The panel is a switchboard, a distribution board, a control board, etc. that constitutes a power conversion device, a power supply device, a motor drive device, etc.
1, the electric equipment unit 1 includes a housing 2, and electric equipment 3 and an air-cooling unit 4 provided in the housing 2. In the following description, the up-down direction when the housing 2 is installed on an installation surface F is simply referred to as the up-down direction or Z direction, the left-right direction on the paper surface is referred to as the X direction, and the depth direction on the paper surface is referred to as the Y direction.

The housing 2 is formed in a box shape and has an opening/closing door (not shown) provided on one of its sides. When the opening/closing door is closed, the inside of the housing 2 is completely isolated from the outside.
The electric device 3 includes a power converter 5 that constitutes a main circuit, a cooling unit 6 for cooling the power converter 5, and a support frame 7 that supports the power converter 5 at approximately the center of the housing 2. The power converter 5 includes a plurality of semiconductor elements (an example of the electronic elements in the claims) 8, a plurality of smoothing capacitors (an example of the electronic elements in the claims) 9, and a conductor plate 10 on which the semiconductor elements 8 and the smoothing capacitors 9 are mounted.

The power converter 5 is, for example, an inverter. The semiconductor element 8 is, for example, a transistor which is a switching element for switching current flow and a diode for rectification. The conductor plate 10, for example, performs at least one of the input and output of current flow to the power converter 5. The conductor plate 10 is formed of metal in a plate shape along, for example, the Z-Y plane. Such a conductor plate 10 is supported by the support frame 7 via an insulating material such as an insulator (not shown).

The conductor plate 10 is placed in a large part of the center of the housing 2 while ensuring an insulating distance from the housing 2. The conductor plate 10 divides the inside of the housing 2 on both sides in the X direction with a gap on both sides in the vertical direction. This forms a flow path 14 between the conductor plate 10 and the housing 2, running along both sides 10b, 10c (one side 10b, the other side 10c) of the conductor plate 10 in the thickness direction and the inner surface 2a of the housing 2.

The conductor plate 10 may be made up of multiple plates. The interior of the housing 2 may be partitioned in the X direction by multiple conductor plates 10. It is desirable to provide an insulating windshield plate 11 between both Y direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2 to close the gap between both Y direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. For example, a semiconductor element 8 is mounted on one surface 10b in the thickness direction of such a conductor plate 10. For example, a smoothing capacitor 9 is mounted on the other thickness direction surface 10c of the conductor plate 10.

The cooling unit 6 is intended to mainly cool the semiconductor elements 8 of the power converter 5 that generate a large amount of heat. The cooling unit 6 includes cooling pipes 12 routed around the semiconductor elements 8, and a pump 13 that sends a coolant to the cooling pipes 12. For example, water is used as the coolant. However, the coolant is not limited to water, and various fluids can be used. The cooling pipes 12 are routed to the outside via the housing 2, and are connected to the pump 13 outside the housing. The cooling pipes 12 are also routed to the air-cooling unit 4.

The air-cooling unit 4 is disposed at the bottom of the housing 2, near the side where the smoothing capacitor 9 is disposed, for example. That is, the air-cooling unit 4 is disposed midway through the flow path 14. The air-cooling unit 4 includes a heat exchanger 15 and a fan 16 that supplies cooling air into the housing 2 through the heat exchanger 15. The heat exchanger 15 includes a heat exchange housing 17 having an intake port 17a and an air outlet 17b, and a heat exchange pipe 18 routed within the heat exchange housing 17. The heat exchange pipe 18 is formed by extending the cooling pipe 12 of the cooling unit 6 and routing it within the heat exchange housing 17. That is, the cooling pipe 12 also serves as the heat exchange pipe 18.

The intake port 17a is formed, for example, on the top surface 17c of the heat exchange housing 17. The air outlet 17b is formed, for example, on one of the side surfaces 17d of the heat exchange housing 17 along the Z direction, on the side surface 17d on which the semiconductor element 8 is arranged. A fan 16 is provided in the air outlet 17b. The fan 16 draws air into the housing 2 from the intake port 17a. This air is cooled by passing through the heat exchange pipe 18 in the heat exchange housing 17, and the cooled air becomes cooling air and is blown out from the air outlet 17b (see also the arrow in FIG. 1).

Here, an insulating windshield plate 20 is provided at the lower end of the conductor plate 10. The lower part of the windshield plate 20 is in contact with the space between the intake port 17a and the air outlet 17b of the heat exchange housing 17. The windshield plate 20 blocks the space between the conductor plate 10 and the heat exchange housing 17. The windshield plate 20 also separates the space between the intake port 17a and the air outlet 17b of the heat exchange housing 17.

With this configuration, the air in the housing 2 is circulated along the flow path 14 by driving the fan 16 of the air-cooling unit 4. During this, the cooling air blown from the air outlet 17b of the heat exchanger 15 first passes around the semiconductor element 8. This cools the semiconductor element 8. Heat exchange occurs between the semiconductor element 8 and the warmed cooling air, which then flows to the smoothing capacitor 9 and is sucked into the intake port 17a of the heat exchanger 15. The cooling air is then cooled again by the heat exchanger 15, and is then blown out from the air outlet 17b. By repeating this process, the cooling air is circulated in the flow path 14, and the semiconductor element 8 is efficiently cooled. In addition, the semiconductor element 8 is also cooled by the cooling unit 6, so it is reliably cooled.

Here, heat is exchanged between the semiconductor element 8 and the warmed cooling air, which keeps the temperature low enough to cool the smoothing capacitor 9. Therefore, even the cooling air that has passed through the semiconductor element 8 is able to sufficiently cool the smoothing capacitor 9.

As described above, the above-mentioned electric equipment unit 1 includes an electric equipment 3, a heat exchanger 15, and a fan 16 provided in the housing 2. The conductor plate 10 of the electric equipment 3 forms a flow path 14 so that cooling air is circulated inside the housing 2. The heat exchanger 15 and the fan 16 are disposed in the middle of this flow path 14. Therefore, by circulating the cooling air through the flow path 14, the cooling air can be effectively blown continuously onto the semiconductor element 8, smoothing capacitor 9, etc., which are heat generating elements of the electric equipment 3. Therefore, the semiconductor element 8, smoothing capacitor 9, etc. can be efficiently cooled.

Furthermore, no separate member for forming an air tunnel is required to form the flow path 14, and the conductor plate 10 that is already provided is used as the member for forming the flow path 14. Therefore, the number of parts of the electric equipment unit 1 is not increased, and the electric equipment unit 1 can be manufactured at low cost. Furthermore, since the number of parts of the electric equipment unit 1 is not increased, the number of parts that block the flow path 14 can also be reduced. As a result, the pressure loss of the cooling air flowing through the flow path 14 can be reduced, and the cooling efficiency of the semiconductor element 8, smoothing capacitor 9, etc. can be further improved.
Moreover, since no additional members are required, there is no need to provide a separate space for providing the flow path 14 within the housing 2. This makes it possible to prevent the electric device unit 1 from becoming large in size.

The electrical equipment unit 1 has an insulating windshield 20 blocking the space between the conductor plate 10 and the heat exchanger 15. The windshield 20 separates the intake port 17a and the outlet port 17b of the heat exchanger 15. This prevents a shortcut path for the cooling air from being formed between the intake port 17a and the outlet port 17b of the heat exchanger 15. In other words, it prevents the cooling air blown from the outlet port 17b from returning to the intake port 17a without passing through the flow path 14. This ensures that the cooling air cooled by the heat exchanger 15 can be efficiently blown onto the semiconductor elements 8, smoothing capacitors 9, etc. This further increases the cooling efficiency of the air-cooling unit 4 for the semiconductor elements 8, smoothing capacitors 9, etc.

The electrical equipment unit 1 has an insulating windshield 11 provided between both Y-direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. The windshield 11 closes the gap between both Y-direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. This prevents the cooling air from leaking out of the flow path 14, and allows the cooling air to circulate more efficiently within the flow path 14. This further improves the cooling efficiency of the air-cooled unit 4 for the semiconductor elements 8, smoothing capacitors 9, etc.

The cooling pipes 12 of the cooling unit 6 for cooling the semiconductor elements 8 also serve as the heat exchange pipes 18 of the heat exchanger 15. This allows the number of parts in the electrical equipment unit 1 to be further reduced. In addition, the refrigerant for the cooling unit 6 and the refrigerant for the heat exchanger 15 can be shared, allowing the cooling system to be unified.

In the above embodiment, the electronic elements mounted on the conductor plate 10 are the semiconductor element 8 and the smoothing capacitor 9. However, the present invention is not limited to this, and various elements can be mounted as the electronic elements.
In the above embodiment, a case has been described in which an insulating windshield plate 11 is provided between both Y-direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. However, this is not limited to this, and if an insulation distance between the housing 2 and the conductor plate 10 can be ensured and leakage of cooling air from between the housing 2 and the conductor plate 10 is negligible in terms of cooling the semiconductor element 8, the smoothing capacitor 9, etc., the windshield plate 11 does not have to be provided.

In the above embodiment, a case has been described in which the power converter 5 is provided as the electric device 3 inside the housing 2. However, this is not limited to this, and various electric devices 3 other than the power converter 5 may be provided inside the housing 2.
In the above embodiment, the air-cooling unit 4 is disposed, for example, near the side where the smoothing capacitor 9 is disposed, at the bottom inside the housing 2. However, the present invention is not limited to this, and the air-cooling unit 4 may be disposed anywhere in the flow path 14.

In the above embodiment, a case where a fan 16 is provided at the air outlet 17b of the heat exchange housing 17 has been described. However, this is not limited to this, and the fan 16 may be provided at the air inlet 17a of the heat exchange housing 17, and the fan 16 may blow air into the heat exchange housing 17.

According to at least one embodiment described above, the device includes an electric device 3, a heat exchanger 15, and a fan 16 provided within the housing 2. The conductor plate 10 of the electric device 3 forms a flow path 14 so that cooling air can be circulated within the housing 2. The heat exchanger 15 and the fan 16 are disposed in the middle of this flow path 14. Therefore, by circulating the cooling air through the flow path 14, the cooling air can be effectively and continuously blown onto the semiconductor element 8, smoothing capacitor 9, etc., which are heat generating elements of the electric device 3. Therefore, the semiconductor element 8, smoothing capacitor 9, etc. can be efficiently cooled.

Furthermore, no separate member for forming an air tunnel is required to form the flow path 14, and the conductor plate 10 that is already provided is used as the member for forming the flow path 14. Therefore, the number of parts of the electric equipment unit 1 is not increased, and the electric equipment unit 1 can be manufactured at low cost. Furthermore, since the number of parts of the electric equipment unit 1 is not increased, the number of parts that block the flow path 14 can also be reduced. As a result, the pressure loss of the cooling air flowing through the flow path 14 can be reduced, and the cooling efficiency of the semiconductor element 8, smoothing capacitor 9, etc. can be further improved.
Moreover, since no additional members are required, there is no need to provide a separate space for providing the flow path 14 within the housing 2. This makes it possible to prevent the electric device unit 1 from becoming large in size.

The electrical equipment unit 1 has an insulating windshield 20 blocking the space between the conductor plate 10 and the heat exchanger 15. The windshield 20 separates the intake port 17a and the outlet port 17b of the heat exchanger 15. This prevents a shortcut path for the cooling air from being formed between the intake port 17a and the outlet port 17b of the heat exchanger 15. In other words, it prevents the cooling air blown from the outlet port 17b from returning to the intake port 17a without passing through the flow path 14. This ensures that the cooling air cooled by the heat exchanger 15 can be efficiently blown onto the semiconductor elements 8, smoothing capacitors 9, etc. This further increases the cooling efficiency of the air-cooling unit 4 for the semiconductor elements 8, smoothing capacitors 9, etc.

The electrical equipment unit 1 has an insulating windshield 11 provided between both Y-direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. The windshield 11 closes the gap between both Y-direction sides 10a of the conductor plate 10 and the inner surface 2a of the housing 2. This prevents the cooling air from leaking out of the flow path 14, and allows the cooling air to circulate more efficiently within the flow path 14. This further improves the cooling efficiency of the air-cooled unit 4 for the semiconductor elements 8, smoothing capacitors 9, etc.

The cooling pipes 12 of the cooling unit 6 for cooling the semiconductor elements 8 also serve as the heat exchange pipes 18 of the heat exchanger 15. This allows the number of parts in the electrical equipment unit 1 to be further reduced. In addition, the refrigerant for the cooling unit 6 and the refrigerant for the heat exchanger 15 can be shared, allowing the cooling system to be unified.

Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are within the scope of the invention and its equivalents as set forth in the claims, as well as the scope and gist of the invention.

1...electrical equipment unit, 2...housing, 3...electrical equipment, 4...air-cooling unit, 5...power converter (
Electrical equipment), 6...cooling unit, 8...semiconductor element (electronic element), 9...smoothing capacitor (electronic element), 10...conductor plate, 11 ...second wind shield (wind shield), 20... first wind shield (wind shield ), 12...cooling pipe, 14...flow path, 15...heat exchanger, 16...fan, 18...heat exchange pipe

Claims (2)

a heat exchanger provided within the housing and having an intake port through which air is drawn and an air outlet through which air is blown out;
a fan for supplying cooling air into the housing through the heat exchanger;
an electric device provided in the housing and having a conductor plate on both sides of which electronic elements are mounted;
A first insulating wind shielding plate extending from the conductor plate;
A second wind shielding plate provided to separate an outer circumferential edge of the conductive plate from the housing;
Equipped with
the conductive plate forms a flow path for circulating the cooling air within the housing,
The heat exchanger and the fan are disposed midway through the flow path,
The first wind shield is in contact with the heat exchanger,
The first wind shielding plate separates the intake port and the exhaust port of the heat exchanger,
An electric equipment unit in which the cooling air flows on both sides of the conductor plate to cool the electronic elements. the electrical device includes a cooling pipe through which a refrigerant for cooling the electronic element passes,
2. The electric equipment unit according to claim 1, wherein the cooling pipe also serves as a heat exchange pipe for heat exchange in the heat exchanger.

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