JP7621412B2 - Cured resin layer - Google Patents
Cured resin layer Download PDFInfo
- Publication number
- JP7621412B2 JP7621412B2 JP2023075432A JP2023075432A JP7621412B2 JP 7621412 B2 JP7621412 B2 JP 7621412B2 JP 2023075432 A JP2023075432 A JP 2023075432A JP 2023075432 A JP2023075432 A JP 2023075432A JP 7621412 B2 JP7621412 B2 JP 7621412B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- acrylate
- heating
- meth
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 title claims description 43
- 229920005989 resin Polymers 0.000 title claims description 43
- 239000011342 resin composition Substances 0.000 claims description 207
- 238000010438 heat treatment Methods 0.000 claims description 69
- 239000000178 monomer Substances 0.000 claims description 33
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 18
- 239000004014 plasticizer Substances 0.000 claims description 18
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 12
- -1 isostearyl Chemical group 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 7
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N ortho-phenyl-phenol Natural products OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 claims description 4
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 claims description 3
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 claims description 3
- 235000010292 orthophenyl phenol Nutrition 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 31
- 239000011521 glass Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- 235000007586 terpenes Nutrition 0.000 description 4
- 238000007718 adhesive strength test Methods 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 125000005103 alkyl silyl group Chemical group 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133331—Cover glasses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Laminated Bodies (AREA)
- Mechanical Engineering (AREA)
- Wood Science & Technology (AREA)
- Plasma & Fusion (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Theoretical Computer Science (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Joining Of Glass To Other Materials (AREA)
- Liquid Crystal (AREA)
- Polymerisation Methods In General (AREA)
Description
本技術は、硬化樹脂層に関する。 The present technology relates to a cured resin layer .
従来、部材同士を光硬化性樹脂組成物で貼り合わせ、光透過性樹脂層で固定する技術が知られている。例えば、例えば特許文献１には、画像表示部材と、光透過性部材との間に、光硬化性樹脂組成物を配して樹脂組成物層を形成し、樹脂組成物層に光を照射して硬化樹脂層を形成する方法が記載されている。ここで、画像表示装置における光透過性部材と画像表示部材とは、密着性が良好であることが望ましい。 Conventionally, a technique is known in which members are bonded together with a photocurable resin composition and fixed with a light-transmitting resin layer. For example, Patent Document 1 describes a method in which a photocurable resin composition is placed between an image display member and a light-transmitting member to form a resin composition layer, and the resin composition layer is irradiated with light to form a cured resin layer. Here, it is desirable that the light-transmitting member and the image display member in the image display device have good adhesion.
また、被塗布体（光透過性部材や画像表示部材）からの光硬化性樹脂組成物のはみ出しを抑制する観点から、いわゆるダムフィルプロセスが採用されることがある。ダムフィルプロセスでは、例えば、第１の樹脂組成物（ダム材）を用いて、画像表示部材の表面に、第２の樹脂組成物（フィル材）の塗布領域を形成する。次に、形成した塗布領域に第２の樹脂組成物を塗布し、画像表示部材と光透過性部材とを第２の樹脂組成物を介して貼合せる。そして、第２の樹脂組成物に光を照射して硬化樹脂層を形成する。 In addition, a so-called dam-fill process may be adopted to prevent the photocurable resin composition from spilling out from the object to be coated (light-transmitting member or image-displaying member). In the dam-fill process, for example, a first resin composition (dam material) is used to form a coating area for a second resin composition (fill material) on the surface of the image-displaying member. Next, the second resin composition is applied to the formed coating area, and the image-displaying member and the light-transmitting member are bonded together via the second resin composition. Then, the second resin composition is irradiated with light to form a cured resin layer.
ダムフィルプロセスにおいて、ダム材は、液ダレ防止の観点から、高粘度であることが好ましい。一方、フィル材は、気泡を防止し短いタクトタイムで貼合せする観点から、低粘度であることが好ましい。ここで、ダム材とフィル材の境界部の視認性を良好にする、すなわちダム材とフィル材の境界線が目立たないようにするために、ダム材とフィル材として、同一成分の樹脂組成物を用いる場合がある。しかし、ダム材とフィル材として、同一成分の樹脂組成物を用いると、ダム材の高粘度性、又はフィル材の低粘度性が犠牲になってしまうことが懸念される。 In the dam-fill process, the dam material is preferably high-viscosity from the viewpoint of preventing dripping. On the other hand, the fill material is preferably low-viscosity from the viewpoint of preventing air bubbles and laminating in a short takt time. Here, in order to improve the visibility of the boundary between the dam material and the fill material, that is, to make the boundary line between the dam material and the fill material less noticeable, a resin composition of the same components may be used for the dam material and the fill material. However, if a resin composition of the same components is used for the dam material and the fill material, there is a concern that the high viscosity of the dam material or the low viscosity of the fill material may be sacrificed.
本技術は、このような従来の実情に鑑みて提案されたものであり、ダム材とフィル材として同一成分の樹脂組成物を用いた場合でも、ダム材の高粘度性とフィル材の低粘度性を両立し、部材同士の密着性を良好にできる光硬化性樹脂組成物を提供する。 This technology was proposed in light of the current situation, and provides a photocurable resin composition that achieves both high viscosity for the dam material and low viscosity for the fill material, even when resin compositions of the same components are used for the dam material and fill material, and can provide good adhesion between the components.
本技術は、第１の部材と、第２の部材とが硬化樹脂層を介して積層された積層体に用いられる硬化樹脂層であって、上記硬化樹脂層は、第１の樹脂組成物と第２の樹脂組成物が光硬化したものであり、上記第１の樹脂組成物と上記第２の樹脂組成物は、２５℃における粘度が１００００～５００００ｍＰａ・ｓの範囲であり、上記第２の樹脂組成物は、上記第１の樹脂組成物から形成された液止め部に配置され、上記第２の樹脂組成物は、単官能モノマーを５～６０質量％と、（メタ）アクリレート樹脂を１０～６０質量％と、可塑剤を１０～７０質量％含有し、上記単官能モノマーは、６０℃で３０分間加熱後の加熱残分が９５．０％以上であり、上記第２の樹脂組成物は、８０℃で３時間加熱後の加熱残分が９５．０％以上である。 The present technology relates to a cured resin layer used in a laminate in which a first member and a second member are laminated via a cured resin layer, the cured resin layer being formed by photocuring a first resin composition and a second resin composition, the first resin composition and the second resin composition having a viscosity at 25°C in the range of 10,000 to 50,000 mPa·s, the second resin composition being disposed in a liquid stopping portion formed from the first resin composition, the second resin composition containing 5 to 60% by mass of a monofunctional monomer, 10 to 60% by mass of a (meth)acrylate resin, and 10 to 70% by mass of a plasticizer, the monofunctional monomer having a heating residue of 95.0% or more after heating at 60°C for 30 minutes , and the second resin composition having a heating residue of 95.0% or more after heating at 80°C for 3 hours.
本技術によれば、第１の樹脂組成物（ダム材）と、第２の樹脂組成物（フィル材）として同一成分の樹脂組成物を用いた場合でも、ダム材の高粘度性とフィル材の低粘度性を両立し、部材同士の密着性を良好にできる。 According to this technology, even when the first resin composition (dam material) and the second resin composition (fill material) are made of resin compositions of the same components, it is possible to achieve both the high viscosity of the dam material and the low viscosity of the fill material, thereby achieving good adhesion between the components.
［積層体の製造方法］
本実施の形態に係る積層体の製造方法は、下記工程（Ａ）～（Ｄ）を有し、工程（Ｃ）が第２の樹脂組成物を加熱することを含む。また、本製造方法で用いられる第２の樹脂組成物は、後に詳述するように、６０℃で３０分間加熱後の加熱残分が９５．０％以上である単官能モノマーを含有し、かつ８０℃で３時間加熱後の加熱残分が９５．０％以上である。
[Method of manufacturing laminate]
The method for producing a laminate according to the present embodiment includes the following steps (A) to (D), and step (C) includes heating the second resin composition. The second resin composition used in this production method contains a monofunctional monomer having a heating residue of 95.0% or more after heating at 60°C for 30 minutes, and has a heating residue of 95.0% or more after heating at 80°C for 3 hours, as described in detail below.
工程（Ａ）：第１の部材の表面に、第１の樹脂組成物を用いて光硬化性の第２の樹脂組成物の塗布領域を形成する。
工程（Ｂ）：塗布領域に第２の樹脂組成物を塗布する。
工程（Ｃ）：第１の部材と、第２の部材とを、第２の樹脂組成物を介して貼合せ、第２の樹脂組成物を塗布領域に充填させる。
工程（Ｄ）：第２の樹脂組成物に光を照射して硬化樹脂層を形成する。
Step (A): A coating region of a photocurable second resin composition is formed on a surface of a first member using a first resin composition.
Step (B): A second resin composition is applied to the application area.
Step (C): The first member and the second member are bonded together via the second resin composition, and the second resin composition is filled into the application area.
Step (D): The second resin composition is irradiated with light to form a cured resin layer.
本製造方法によれば、工程（Ｃ）で第２の樹脂組成物を加熱することにより、第２の樹脂組成物の粘度を低くできる。そのため、第１の樹脂組成物と第２の樹脂組成物として同一成分の樹脂組成物を用いた場合でも、第１の樹脂組成物の高粘度性と第２の樹脂組成物の低粘度性とを両立することができる。また、本製造方法では、８０℃で３時間加熱後の加熱残分が９５．０％以上である第２の樹脂組成物を用いることにより、第２の樹脂組成物を加熱する際に第２の樹脂組成物中の成分が揮発するのを抑制できるため、第１の部材と第２の部材との密着性を良好にできる。 According to this manufacturing method, the viscosity of the second resin composition can be reduced by heating the second resin composition in step (C). Therefore, even when resin compositions of the same components are used as the first resin composition and the second resin composition, it is possible to achieve both a high viscosity of the first resin composition and a low viscosity of the second resin composition. In addition, in this manufacturing method, by using a second resin composition whose heating residue after heating at 80°C for 3 hours is 95.0% or more, it is possible to suppress the volatilization of the components in the second resin composition when the second resin composition is heated, and therefore it is possible to improve the adhesion between the first member and the second member.
本製造方法で用いられる第２の樹脂組成物は、８０℃で３時間加熱後の加熱残分が９５．０％以上であり、９７．０％以上が好ましく、９８．０％以上がより好ましく、９９．０％以上がさらに好ましい。加熱残分がより多いことにより、第２の樹脂組成物を加熱する際に第２の樹脂組成物中の成分の揮発をより効果的に抑制できる。また、第２の樹脂組成物の加熱残分の上限値は、特に制限されない。ここで、第２の樹脂組成物の加熱残分は、熱量計測定装置（装置名：Ｑ５０、ＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製）を用いて、樹脂組成物１０ｍｇを８０℃で３時間加熱する前後の質量を測定して求めた値をいう。第２の樹脂組成物の詳細については、後述する。 The second resin composition used in this manufacturing method has a heating residue of 95.0% or more after heating at 80°C for 3 hours, preferably 97.0% or more, more preferably 98.0% or more, and even more preferably 99.0% or more. A larger heating residue can more effectively suppress the volatilization of the components in the second resin composition when the second resin composition is heated. In addition, the upper limit of the heating residue of the second resin composition is not particularly limited. Here, the heating residue of the second resin composition refers to a value obtained by measuring the mass before and after heating 10 mg of the resin composition at 80°C for 3 hours using a calorimeter measuring device (device name: Q50, manufactured by TA Instruments). Details of the second resin composition will be described later.
以下、図面を参照しながら各工程の詳細について説明する。本製造方法では、例えば図１に示すように、画像表示部材２（第１の部材）と、周縁部に遮光層４が形成された光透過性部材３（第２の部材）とが、硬化樹脂層１を介して積層した画像表示装置５（積層体）を得る。 Each step will be described in detail below with reference to the drawings. In this manufacturing method, as shown in FIG. 1, for example, an image display device 5 (laminate) is obtained in which an image display member 2 (first member) and a light-transmitting member 3 (second member) having a light-shielding layer 4 formed on its periphery are laminated via a cured resin layer 1.
硬化樹脂層１は、後述する第１の樹脂組成物６と第２の樹脂組成物８とから形成されている。硬化樹脂層１の屈折率は、画像表示部材２や光透過性部材３の屈折率とほぼ同等とすることが好ましく、例えば１．４５以上１．５５以下であることが好ましい。これにより、画像表示部材２からの映像光の輝度やコントラストを高め、視認性を良好にすることができる。また、硬化樹脂層１の透過率は、９０％を超えることが好ましい。これにより、画像表示部材２に形成された画像の視認性をより良好にすることができる。硬化樹脂層１の厚みは、例えば、５０～２００μｍであることが好ましい。 The cured resin layer 1 is formed from a first resin composition 6 and a second resin composition 8, which will be described later. The refractive index of the cured resin layer 1 is preferably approximately equal to the refractive index of the image display member 2 and the light-transmitting member 3, and is preferably, for example, 1.45 to 1.55. This increases the brightness and contrast of the image light from the image display member 2, and improves visibility. In addition, the transmittance of the cured resin layer 1 is preferably greater than 90%. This improves the visibility of the image formed on the image display member 2. The thickness of the cured resin layer 1 is preferably, for example, 50 to 200 μm.
画像表示部材２は、例えば液晶表示パネル、タッチパネル等を挙げることができる。ここで、タッチパネルとは、液晶表示パネルのような表示素子とタッチパッドのような位置入力装置を組み合わせた画像表示・入力パネルを意味する。 Examples of the image display member 2 include a liquid crystal display panel and a touch panel. Here, a touch panel refers to an image display/input panel that combines a display element such as a liquid crystal display panel with a position input device such as a touch pad.
光透過性部材３は、画像表示部材２に形成された画像が視認可能となるような光透過性を有するものであればよい。例えば、ガラス、アクリル樹脂、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリカーボネート等の板状材料やシート状材料が挙げられる。これらの材料には、少なくとも一方の面にハードコート処理、反射防止処理等が施されていてもよい。光透過性部材３の厚さや弾性率などの物性は、使用目的に応じて適宜決定することができる。 The light-transmitting member 3 may be any material that has light transmittance such that the image formed on the image display member 2 is visible. Examples include plate-like or sheet-like materials such as glass, acrylic resin, polyethylene terephthalate, polyethylene naphthalate, and polycarbonate. At least one surface of these materials may be treated with a hard coat, an anti-reflection treatment, or the like. The physical properties such as the thickness and elastic modulus of the light-transmitting member 3 may be appropriately determined depending on the purpose of use.
遮光層４は、画像のコントラスト向上のために設けられるものであり、例えば、黒色等に着色された塗料をスクリーン印刷法などで塗布し、乾燥・硬化させて形成することができる。遮光層４の厚みは、通常５～１００μｍである。 The light-shielding layer 4 is provided to improve the contrast of the image, and can be formed, for example, by applying a paint colored black or the like using a screen printing method, followed by drying and hardening. The thickness of the light-shielding layer 4 is usually 5 to 100 μm.
［工程（Ａ）］
工程（Ａ）では、例えば図２、３に示すように、画像表示部材２の表面に、第１の樹脂組成物６を用いて第２の樹脂組成物８の塗布領域７を形成する。塗布領域７は、例えば図３、４に示すように、画像表示部材２の表示領域中、第１の樹脂組成物６から形成された枠状の液止め部（ダム）１１で囲まれた領域である。
[Step (A)]
In step (A), as shown in Figures 2 and 3, for example, a coating region 7 of a second resin composition 8 is formed on the surface of an image display member 2 using a first resin composition 6. The coating region 7 is a region surrounded by a frame-shaped liquid stopper (dam) 11 formed from the first resin composition 6 in the display region of the image display member 2, as shown in Figures 3 and 4, for example.
第１の樹脂組成物６は、工程（Ｂ）で塗布領域７に塗布する第２の樹脂組成物８の液ダレ防止のための材料である。第１の樹脂組成物６は、例えば、熱硬化性の樹脂組成物、光硬化性（例えば紫外線硬化性）の樹脂組成物等を用いることができる。第１の樹脂組成物６が光硬化性の樹脂組成物である場合、工程（Ａ）では、例えば図４に示すように、第１の樹脂組成物６に紫外線照射器９から紫外線１０を照射して第１の樹脂組成物６を硬化させ、液止め部１１を形成することにより、塗布領域７を画定できる。 The first resin composition 6 is a material for preventing dripping of the second resin composition 8 to be applied to the application area 7 in step (B). For example, a thermosetting resin composition or a photocurable (e.g., ultraviolet-curable) resin composition can be used as the first resin composition 6. When the first resin composition 6 is a photocurable resin composition, in step (A), for example, as shown in FIG. 4, the first resin composition 6 is irradiated with ultraviolet light 10 from an ultraviolet irradiator 9 to cure the first resin composition 6, thereby forming a liquid stopper 11, thereby defining the application area 7.
第１の樹脂組成物６は、液ダレ防止の観点から高粘度であることが好ましい。例えば、第１の樹脂組成物６は、２５℃における粘度が１００００～５００００ｍＰａ・ｓであることが好ましい。 It is preferable that the first resin composition 6 has a high viscosity in order to prevent dripping. For example, it is preferable that the viscosity of the first resin composition 6 at 25°C is 10,000 to 50,000 mPa·s.
第１の樹脂組成物６の塗布方法は、各種の塗布方法を採用でき、例えば、ディスペンサを用いる方法、コーターを用いる方法、スプレーを用いる方法等が挙げられる。特に、液ダレ抑制の観点からディスペンサを用いる方法が好ましい。第１の樹脂組成物６の塗布厚さは、例えば、本製造方法の工程（Ｂ）で塗布領域７に塗布する第２の樹脂組成物８の厚さ以下とすることができる。 Various coating methods can be used to apply the first resin composition 6, including, for example, a method using a dispenser, a method using a coater, a method using a spray, and the like. In particular, a method using a dispenser is preferred from the viewpoint of suppressing dripping. The coating thickness of the first resin composition 6 can be, for example, equal to or less than the thickness of the second resin composition 8 applied to the coating area 7 in step (B) of this manufacturing method.
［工程（Ｂ）］
工程（Ｂ）では、例えば図５に示すように、塗布領域７に第２の樹脂組成物８を塗布する。第２の樹脂組成物８の塗布方法としては、各種の塗布方法を採用でき、例えば上述した第１の樹脂組成物６の塗布方法が挙げられる。また、第２の樹脂組成物８の塗布量は、例えば、工程（Ｃ）における貼合せの際に、塗布領域７に充填させることができる量とすることが好ましい。
[Step (B)]
In step (B), the second resin composition 8 is applied to the application region 7, for example, as shown in Fig. 5. As a method for applying the second resin composition 8, various application methods can be adopted, for example, the above-mentioned application method for the first resin composition 6. In addition, the application amount of the second resin composition 8 is preferably set to an amount that can fill the application region 7 during lamination in step (C), for example.
第２の樹脂組成物８は、工程（Ｄ）で硬化させたときに、第１の樹脂組成物６から形成された液止め部１１との境界線が目視で目立たないようにすることが好ましい。そのため、第２の樹脂組成物８は、第１の樹脂組成物６と実質的に同一成分であることが好ましい。同一成分とは、少なくとも第１の樹脂組成物６と第２の樹脂組成物８とが光学特性が同じこと、例えば光透過率と屈折率とが実質的に等しいことを意味する。第１の樹脂組成６と第２の樹脂組成物８の光学特性が実質的に等しい場合、例えば第１の樹脂組成物６と第２の樹脂組成物８の粘度が異なっていても、同一成分に含まれるものとする。 It is preferable that the second resin composition 8 is such that the boundary line between the liquid stopping portion 11 formed from the first resin composition 6 is not noticeable when cured in step (D). Therefore, it is preferable that the second resin composition 8 is substantially the same component as the first resin composition 6. The same component means that at least the first resin composition 6 and the second resin composition 8 have the same optical properties, for example, the light transmittance and the refractive index are substantially equal. When the optical properties of the first resin composition 6 and the second resin composition 8 are substantially equal, for example, even if the viscosities of the first resin composition 6 and the second resin composition 8 are different, they are considered to be included in the same component.
また、第２の樹脂組成物８は、気泡を防止し、短いタクトタイムで貼合せする観点から、工程（Ｃ）における貼合せの際に低粘度であることが好ましい。例えば、第２の樹脂組成物８は、貼合せ時の温度における粘度が３０００ｍＰａ・ｓ以下であることが好ましく、１０００～３０００ｍＰａ・ｓであることがより好ましい。 In addition, from the viewpoint of preventing air bubbles and performing lamination in a short takt time, it is preferable that the second resin composition 8 has a low viscosity during lamination in step (C). For example, the viscosity of the second resin composition 8 at the lamination temperature is preferably 3000 mPa·s or less, and more preferably 1000 to 3000 mPa·s.
本製造方法では、以下の工程（Ｃ）において第２の樹脂組成物８を加熱（加温）することにより、第２の樹脂組成物８の粘度を低粘度（例えば３０００ｍＰａ・ｓ以下）に調整ができる。そのため、第１の樹脂組成物６と第２の樹脂組成物８として同一成分の樹脂組成物を用いた場合でも、第１の樹脂組成物６の高粘度性と、第２の樹脂組成物８の低粘度性とを両立できる。 In this manufacturing method, the viscosity of the second resin composition 8 can be adjusted to a low viscosity (for example, 3000 mPa·s or less) by heating (warming) the second resin composition 8 in the following step (C). Therefore, even when resin compositions of the same components are used for the first resin composition 6 and the second resin composition 8, it is possible to achieve both a high viscosity of the first resin composition 6 and a low viscosity of the second resin composition 8.
また、本製造方法では、８０℃で３時間加熱後の加熱残分が９５．０％以上である第２の樹脂組成物８を用いることにより、以下の工程（Ｃ）において第２の樹脂組成物８を加熱する際に、第２の樹脂組成物８中の成分（例えば後述する単官能モノマー）の揮発を抑制できる。そのため、光透過性部材３と画像表示部材２との密着性を良好にできる。 In addition, in this manufacturing method, by using the second resin composition 8 having a heating residue of 95.0% or more after heating at 80°C for 3 hours, it is possible to suppress the volatilization of the components in the second resin composition 8 (e.g., the monofunctional monomer described below) when the second resin composition 8 is heated in the following step (C). Therefore, it is possible to improve the adhesion between the light-transmitting member 3 and the image display member 2.
［工程（Ｃ）］
工程（Ｃ）では、例えば図６に示すように画像表示部材２と光透過性部材３とを第２の樹脂組成物８を介して貼合せ、第２の樹脂組成物８を塗布領域７に充填させる。画像表示部材２と光透過性部材３との貼合せは、例えば、公知の圧着装置を用いて行うことができる。
[Step (C)]
In step (C), for example, as shown in Fig. 6, the image display member 2 and the light transmitting member 3 are bonded together via the second resin composition 8, and the second resin composition 8 is filled into the application region 7. The image display member 2 and the light transmitting member 3 can be bonded together using, for example, a known pressure bonding device.
また、工程（Ｃ）は、上述したように第２の樹脂組成物８を加熱することを含む。第２の樹脂組成物８を加熱することにより、第２の樹脂組成物８が減粘された状態で塗布領域７に充填される。これにより、第２の樹脂組成物８中の気泡を防止し、短いタクトタイムでの貼合せが可能となる。加熱条件は、第２の樹脂組成物８の粘度が低粘度（例えば例えば３０００ｍＰａ・ｓ以下）に調整されるように設定することが好ましい。例えば、加熱温度は、画像表示部材２や光透過性部材３への熱による影響を考慮して、８０℃以下が好ましく、６０～８０℃がより好ましい。加熱時間は、例えば、３０分～３時間程度とすることができる。加熱のタイミングは、画像表示部材２と光透過性部材３との貼合せ前に行ってもよいし、貼合せる際に行ってもよいし、貼合せ後に行ってもよい。加熱方法としては、例えば、加熱ヒータ等を用いる方法等が挙げられる。 Also, step (C) includes heating the second resin composition 8 as described above. By heating the second resin composition 8, the second resin composition 8 is filled into the application area 7 in a reduced viscosity state. This prevents air bubbles in the second resin composition 8, and enables lamination in a short takt time. The heating conditions are preferably set so that the viscosity of the second resin composition 8 is adjusted to a low viscosity (for example, 3000 mPa·s or less). For example, the heating temperature is preferably 80°C or less, more preferably 60 to 80°C, taking into account the influence of heat on the image display member 2 and the light-transmitting member 3. The heating time can be, for example, about 30 minutes to 3 hours. The timing of heating may be before laminating the image display member 2 and the light-transmitting member 3, during lamination, or after lamination. Examples of the heating method include a method using a heater, etc.
［工程（Ｄ）］
工程（Ｄ）では、例えば図７に示すように、第２の樹脂組成物８に紫外線照射器９から紫外線１０を照射し、硬化樹脂層１（図１を参照）を形成する。工程（Ｄ）における光照射は、工程（Ｃ）において加熱した第２の樹脂組成物８を放熱させてから行うことが好ましい。
[Step (D)]
In step (D), for example, as shown in Fig. 7, the second resin composition 8 is irradiated with ultraviolet light 10 from an ultraviolet irradiator 9 to form a cured resin layer 1 (see Fig. 1). The light irradiation in step (D) is preferably performed after the second resin composition 8 heated in step (C) is allowed to dissipate heat.
ここで、第２の樹脂組成物８が第１の樹脂組成物６と実質的に同一成分である場合、光照射後の第２の樹脂組成物８は、液止め部１１と一体化し、光学的に同じ性質を有する単一の硬化樹脂層１となる。これにより、液止め部１１と、硬化後の第２の樹脂組成物８との境界部の視認性をより良好にできる。 Here, when the second resin composition 8 is substantially the same as the first resin composition 6, the second resin composition 8 after light irradiation is integrated with the liquid stopping portion 11 to become a single cured resin layer 1 having the same optical properties. This makes it possible to improve the visibility of the boundary between the liquid stopping portion 11 and the cured second resin composition 8.
以上のように、本製造方法によれば、工程（Ｃ）で第２の樹脂組成物８を加熱することにより、第２の樹脂組成物８の粘度が低くなる。そのため、第１の樹脂組成物６と第２の樹脂組成物８として同一成分の樹脂組成物を用いた場合でも、第１の樹脂組成物６の高粘度性と、第２の樹脂組成物８の低粘度性とを両立できる。また、本製造方法では、第２の樹脂組成物８として、６０℃で３０分間加熱後の加熱残分が９５．０％以上である単官能モノマーを含有し、かつ８０℃で３時間加熱後の加熱残分が９５．０％以上である光硬化性樹脂組成物を用いる。これにより、第２の樹脂組成物８を加熱する際に第２の樹脂組成物８中の成分の揮発を抑制し、光透過性部材３と画像表示部材２との密着性を良好にできる。 As described above, according to the present manufacturing method, the viscosity of the second resin composition 8 is reduced by heating the second resin composition 8 in step (C). Therefore, even when the first resin composition 6 and the second resin composition 8 are made of the same resin composition, the high viscosity of the first resin composition 6 and the low viscosity of the second resin composition 8 can be achieved at the same time. In addition, in the present manufacturing method, a photocurable resin composition is used as the second resin composition 8, which contains a monofunctional monomer having a heating residue of 95.0% or more after heating at 60°C for 30 minutes and has a heating residue of 95.0% or more after heating at 80°C for 3 hours. This suppresses the volatilization of the components in the second resin composition 8 when the second resin composition 8 is heated, and improves the adhesion between the light-transmitting member 3 and the image display member 2.
なお、上述した製造方法は、画像表示部材２の表面に、第１の樹脂組成物６と、第２の樹脂組成物８とを塗布するようにしたが、この方法に限定されるものではない。例えば、光透過性部材３の表面に第１の樹脂組成物６と第２の樹脂組成物８を塗布してもよい。また、上述した製造方法では、遮光層４が形成された光透過性部材３を用いたが、この例に限定されるものではない。例えば、遮光層が形成されていない光透過性部材を用いてもよい。 In the above-mentioned manufacturing method, the first resin composition 6 and the second resin composition 8 are applied to the surface of the image display member 2, but the method is not limited to this method. For example, the first resin composition 6 and the second resin composition 8 may be applied to the surface of the light-transmitting member 3. In addition, in the above-mentioned manufacturing method, the light-transmitting member 3 on which the light-shielding layer 4 is formed is used, but the method is not limited to this example. For example, a light-transmitting member on which no light-shielding layer is formed may be used.
また、上述した工程（Ａ）では、光硬化性の樹脂組成物６を光照射により硬化させて液止め部１１を形成するようにしたが、この方法に限定されるものではない。例えば、工程（Ａ）では、熱硬化性の第１の樹脂組成物６を用いて、第１の樹脂組成物６を加熱し硬化させ、液止め部１１を形成してもよい。また、第１の樹脂組成物６の粘度が、第２の樹脂組成物８の液ダレを防止できる程度に十分高い場合、第１の樹脂組成物６を熱や光により硬化させなくてもよい。 In addition, in the above-mentioned step (A), the photocurable resin composition 6 is cured by light irradiation to form the liquid stopping portion 11, but this method is not limited to the above. For example, in step (A), a thermosetting first resin composition 6 may be used, and the first resin composition 6 may be heated and cured to form the liquid stopping portion 11. In addition, if the viscosity of the first resin composition 6 is high enough to prevent the second resin composition 8 from dripping, the first resin composition 6 does not need to be cured by heat or light.
［光硬化性樹脂組成物］
本実施の形態に係る光硬化性樹脂組成物は、６０℃で３０分間加熱後の加熱残分が９５．０％以上である単官能モノマーと、（メタ）アクリレート樹脂と、光重合開始剤と、可塑剤とを含有し、８０℃で３時間加熱後の加熱残分が９５．０％以上である。ここで、（メタ）アクリレートは、メタクリレートとアクリレートとの両方を包含する。光硬化性樹脂組成物は、上述した第１の樹脂組成物６、及び第２の樹脂組成物８として好ましく用いられる。
[Photocurable resin composition]
The photocurable resin composition according to the present embodiment comprises a monofunctional monomer having a heating residue of 95.0% or more after heating at 60° C. for 30 minutes, a (meth)acrylate resin, and a photopolymerization initiator. and a plasticizer, and the heating residue after heating at 80° C. for 3 hours is 95.0% or more. Here, (meth)acrylate includes both methacrylate and acrylate. The resin composition is preferably used as the first resin composition 6 and the second resin composition 8 described above.
［単官能モノマー］
単官能モノマーは、６０℃で３０分間加熱後の加熱残分が９５．０％以上であることが好ましく、９７．０％以上であることがより好ましく、９８．０％以上であることがさらに好ましく、９９．５０％以上であることが特に好ましい。
[Monofunctional Monomer]
The monofunctional monomer preferably has a heating residue after heating at 60° C. for 30 minutes of 95.0% or more, more preferably 97.0% or more, even more preferably 98.0% or more, and particularly preferably 99.50% or more.
ここで、単官能モノマーの加熱残分は、熱量計測定装置（装置名：Ｑ５０、ＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製）を用いて、単官能モノマー１０ｍｇを６０℃で３０分間加熱する前後の質量を測定して求めた値をいう。 Here, the heating residue of the monofunctional monomer refers to the value obtained by measuring the mass before and after heating 10 mg of the monofunctional monomer at 60°C for 30 minutes using a calorimeter measuring device (device name: Q50, manufactured by TA Instruments).
光硬化性樹脂組成物が上述の単官能モノマーを含有することにより、上述した工程（Ｃ）において第２の樹脂組成物を加熱する際に、この単官能モノマーの揮発をより効果的に抑制できる。そのため、光透過性部材３と画像表示部材２との密着性をより良好にすることができる。 By containing the monofunctional monomer in the photocurable resin composition, the volatilization of the monofunctional monomer can be more effectively suppressed when the second resin composition is heated in the above-mentioned step (C). This makes it possible to improve the adhesion between the light-transmitting member 3 and the image display member 2.
具体的に、単官能モノマーは、単官能（メタ）アクリレートであることが好ましく、例えば、式（Ａ）で表される化合物、及び式（Ｂ）で表される化合物の少なくとも１種であることが好ましい。
式（Ａ）中、Ｒ１は水素原子又はメチル基を表す。Ｒ２は炭素数２又は３のアルキレン基を表す。Ｒ３は炭化水素基を表し、脂肪族炭化水素基であってもよいし、芳香族炭化水素基であってもよい。Ｒ３が脂肪族炭化水素基である場合、炭素数５～１０の脂肪族炭化水素基であることが好ましい。また、Ｒ３が芳香族炭化水素基である場合、炭素数６～１２の芳香族炭化水素基であることが好ましく、炭素数６～８の芳香族炭化水素基であることがより好ましい。また、Ｒ３が芳香族炭化水素基である場合、Ｒ３は置換基を有していてもよい。置換基としては、炭素数１～１０の直鎖状のアルキル基、炭素数３～１０の分岐状のアルキル基、炭素数６～１２の芳香族炭化水素基等が挙げられる。ｎは１～１５の整数を表し、１～１０の整数を表すことが好ましい。 In formula (A), R 1 represents a hydrogen atom or a methyl group. R 2 represents an alkylene group having 2 or 3 carbon atoms. R 3 represents a hydrocarbon group, which may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. When R 3 is an aliphatic hydrocarbon group, it is preferably an aliphatic hydrocarbon group having 5 to 10 carbon atoms. When R 3 is an aromatic hydrocarbon group, it is preferably an aromatic hydrocarbon group having 6 to 12 carbon atoms, and more preferably an aromatic hydrocarbon group having 6 to 8 carbon atoms. When R 3 is an aromatic hydrocarbon group, R 3 may have a substituent. Examples of the substituent include a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, and an aromatic hydrocarbon group having 6 to 12 carbon atoms. n represents an integer of 1 to 15, and preferably an integer of 1 to 10.
式（Ｂ）中、Ｒ４は水素原子又はメチル基を表す。Ｒ５の炭素数は、１１～２０であり、１５～２０であることが好ましい。Ｒ５は直鎖状、分岐状、又は環状のアルキル基のいずれであってもよく、直鎖状又は分岐状のアルキル基であることが好ましく、分岐状のアルキル基であることがより好ましい。 In formula (B), R4 represents a hydrogen atom or a methyl group. The number of carbon atoms in R5 is 11 to 20, and preferably 15 to 20. R5 may be any one of a linear, branched, or cyclic alkyl group, preferably a linear or branched alkyl group, and more preferably a branched alkyl group.
単官能モノマーの具体例としては、イソステアリル（メタ）アクリレート、ノニルフェノールＥＯ変性（メタ）アクリレート、ノニルフェノールＰＯ変性（メタ）アクリレート、２－エチルヘキシルＥＯ変性（メタ）アクリレート、フェノールＥＯ変性（メタ）アクリレート、о－フェニルフェノールＥＯ変性アクリレート、パラクミルフェノールＥＯ変性アクリレート、Ｎ－アクリロイルオキシエチルヘキサヒドロフタルイミド、及び２－ヒドロキシ－３－フェノキシプロピルアクリレート等が挙げられる。 Specific examples of monofunctional monomers include isostearyl (meth)acrylate, nonylphenol EO-modified (meth)acrylate, nonylphenol PO-modified (meth)acrylate, 2-ethylhexyl EO-modified (meth)acrylate, phenol EO-modified (meth)acrylate, o-phenylphenol EO-modified acrylate, paracumylphenol EO-modified acrylate, N-acryloyloxyethylhexahydrophthalimide, and 2-hydroxy-3-phenoxypropyl acrylate.
光硬化性樹脂組成物中、単官能モノマーの含有量は、５～６０質量％が好ましく、５～４０質量％がより好ましく、１０～３０質量％がさらに好ましい。単官能モノマーは、１種単独で用いてもよいし、２種以上を併用してもよい。２種以上の単官能モノマーを併用する場合、その含有量が上記含有量の範囲を満たすことが好ましい。 In the photocurable resin composition, the content of the monofunctional monomer is preferably 5 to 60% by mass, more preferably 5 to 40% by mass, and even more preferably 10 to 30% by mass. The monofunctional monomer may be used alone or in combination of two or more types. When two or more types of monofunctional monomers are used in combination, it is preferable that the content thereof satisfies the above content range.
［（メタ）アクリレート樹脂］
（メタ）アクリレート樹脂は、例えば、光硬化性の（メタ）アクリレート樹脂であり、ポリマーであっても、オリゴマーであってもよい。（メタ）アクリレート樹脂は、例えば、ポリウレタン（メタ）アクリレートオリゴマー、ポリイソプレン（メタ）アクリレートオリゴマー、ポリブタジエン（メタ）アクリレートオリゴマー、及びポリエーテル（メタ）アクリレートオリゴマーの少なくとも１種であることが好ましい。（メタ）アクリレート樹脂の具体例としては、ＵＣ－２０３（クラレ社製）、ＵＶ３７００Ｂ（日本合成化学社製）等が挙げられる。
[(Meth)acrylate resin]
The (meth)acrylate resin is, for example, a photocurable (meth)acrylate resin, and may be a polymer or an oligomer. The (meth)acrylate resin is preferably, for example, at least one of polyurethane (meth)acrylate oligomer, polyisoprene (meth)acrylate oligomer, polybutadiene (meth)acrylate oligomer, and polyether (meth)acrylate oligomer. Specific examples of the (meth)acrylate resin include UC-203 (manufactured by Kuraray Co., Ltd.) and UV3700B (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).
光硬化性樹脂組成物中、（メタ）アクリレート樹脂の含有量は、５～８０質量％が好ましく、１０～７０質量％がより好ましく、１０～６０質量％がさらに好ましく、３０～５０質量％が特に好ましい。（メタ）アクリレート樹脂は、１種単独で用いてもよいし、２種以上を併用してもよい。２種以上の（メタ）アクリレート樹脂を併用する場合、その含有量が上記含有量の範囲を満たすことが好ましい。 In the photocurable resin composition, the content of the (meth)acrylate resin is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, even more preferably 10 to 60% by mass, and particularly preferably 30 to 50% by mass. The (meth)acrylate resin may be used alone or in combination of two or more types. When two or more types of (meth)acrylate resins are used in combination, it is preferable that the content thereof satisfies the above content range.
［光重合開始剤］
光重合開始剤は、光ラジカル重合開始剤が好ましく、アルキルフェノン系光重合開始剤、及びアシルフォスフィンオキサイド系光重合開始剤の少なくとも１種を含有することがより好ましい。アルキルフェノン系光重合開始剤としては、１－ヒドロキシシクロへキシルフェニルケトン（イルガキュア１８４、ＢＡＳＦ社製）、２－ヒドロキシ－１－｛４－[４－（２一ヒドロキシ－２－メチル－プロピロニル）ベンジル]フェニル｝－２－メチル－１－プロパン－１－オン（イルガキュア１２７、ＢＡＳＦ社製）等を用いることができる。アシルフォスフィンオキサイド系光重合開始剤としては、２，４，６－トリメチルベンゾイル－ジフェニル－フォスフィンオキサイド（ＴＰＯ、ＢＡＳＦ社製）等を用いることができる。その他、光重合開始剤としては、ベンゾフェノン、アセトフェノン等を用いることもできる。
[Photopolymerization initiator]
The photopolymerization initiator is preferably a photoradical polymerization initiator, and more preferably contains at least one of an alkylphenone-based photopolymerization initiator and an acylphosphine oxide-based photopolymerization initiator. As the alkylphenone-based photopolymerization initiator, 1-hydroxycyclohexyl phenyl ketone (Irgacure 184, manufactured by BASF), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propylonyl)benzyl]phenyl}-2-methyl-1-propan-1-one (Irgacure 127, manufactured by BASF), etc. can be used. As the acylphosphine oxide-based photopolymerization initiator, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (TPO, manufactured by BASF), etc. can be used. As the other photopolymerization initiator, benzophenone, acetophenone, etc. can also be used.
光硬化性樹脂組成物中、光重合開始剤の含有量は、上述した単官能モノマー、及び（メタ）アクリレート樹脂の合計１００質量部に対し、０．１～５質量部が好ましく、０．２～３質量部がより好ましい。このような範囲にすることにより、光照射時に硬化不足となるのをより効果的に防ぐとともに、開裂によるアウトガスの増加をより効果的に防ぐことができる。光重合開始剤は、１種単独で用いてもよいし、２種以上を併用してもよい。２種以上の光重合開始剤を併用する場合、その合計量が上記範囲を満たすことが好ましい。 In the photocurable resin composition, the content of the photopolymerization initiator is preferably 0.1 to 5 parts by mass, and more preferably 0.2 to 3 parts by mass, per 100 parts by mass of the total of the monofunctional monomer and (meth)acrylate resin described above. By setting the content within this range, it is possible to more effectively prevent insufficient curing during light irradiation and to more effectively prevent an increase in outgassing due to cleavage. The photopolymerization initiator may be used alone or in combination of two or more types. When two or more types of photopolymerization initiators are used in combination, it is preferable that the total amount satisfies the above range.
［可塑剤］
可塑剤は、光照射によりそれ自身が光硬化をせず、光硬化後の硬化樹脂層に柔軟性を与えるものである。例えば、ポリイソプレン系可塑剤、ポリエーテル系可塑剤、ポリブタジエン系可塑剤、フタル酸エステル系可塑剤、アジピン酸エステル系可塑剤等を用いることができる。ポリイソプレン系可塑剤の具体例としては、ＬＩＲ－３０、ＬＩＲ－５０（以上、クラレ社製）、ＥＰＯＬ（出光興産社製）等が挙げられる。ポリエーテル系可塑剤の具体例としては、Ｐ－３０００（ＡＤＥＫＡ社製）等が挙げられる。ポリブタジエン系可塑剤の具体例としては、ＨＬＢＨ－Ｐ２０００、ＨＬＢＨ－Ｐ３０００、ＬＢＨ－Ｐ２０００、ＬＢＨＰ３０００、ＬＢＨ－Ｐ５０００（以上、クレイバレー社製）等が挙げられる。
[Plasticizer]
The plasticizer does not itself undergo photocuring by irradiation with light, but gives flexibility to the cured resin layer after photocuring. For example, polyisoprene-based plasticizers, polyether-based plasticizers, polybutadiene-based plasticizers, phthalate-based plasticizers, adipate-based plasticizers, etc. can be used. Specific examples of polyisoprene-based plasticizers include LIR-30 and LIR-50 (both manufactured by Kuraray Co., Ltd.), EPOL (manufactured by Idemitsu Kosan Co., Ltd.), etc. Specific examples of polyether-based plasticizers include P-3000 (manufactured by ADEKA Co., Ltd.), etc. Specific examples of polybutadiene-based plasticizers include HLBH-P2000, HLBH-P3000, LBH-P2000, LBHP3000, LBH-P5000 (manufactured by Cray Valley Co., Ltd.), etc.
光硬化性樹脂組成物中、可塑剤の含有量は、５～７０質量％が好ましく、１０～７０質量％がより好ましく、１５～５０質量％がさらに好ましい。可塑剤は、１種のみを単独で用いてもよいし、２種以上を併用してもよい。２種以上の可塑剤を併用する場合、その合計量が上記範囲を満たすことが好ましい。 In the photocurable resin composition, the content of the plasticizer is preferably 5 to 70% by mass, more preferably 10 to 70% by mass, and even more preferably 15 to 50% by mass. Only one type of plasticizer may be used alone, or two or more types may be used in combination. When two or more types of plasticizers are used in combination, it is preferable that the total amount satisfies the above range.
［その他の成分］
光硬化性樹脂組成物は、本技術の効果を損なわない範囲で、上述した成分以外の他の成分をさらに含有していてもよい。例えば、無機微粒子、粘着付与剤等が挙げられる。
[Other ingredients]
The photocurable resin composition may further contain other components in addition to the above-mentioned components, as long as the effects of the present technology are not impaired. For example, inorganic fine particles, a tackifier, etc. may be included.
光硬化性樹脂組成物は、上述した第１の樹脂組成物６、及び第２の樹脂組成物８の少なくとも一方の屈折率を調整する目的で、無機微粒子を含有してもよい。無機微粒子は、例えば、表面がアルキルシリル基で修飾されたシリカ粒子を用いることができる。アルキルシリル基としては、モノアルキルシリル基、ジアルキルシリル基、トリアルキルシリル基を用いることができる。無機微粒子の形状は、例えば、球状、楕円形状、扁平状、ロッド状、繊維状などが挙げられる。無機微粒子の平均粒子径は、光硬化性樹脂組成物中での分散性などを考慮して、例えば、１～１０００ｎｍとすることが好ましい。無機微粒子の比表面積（ＢＥＴ吸着法）は、例えば、５０～４００ｍ２／ｇ程度である。 The photocurable resin composition may contain inorganic fine particles for the purpose of adjusting the refractive index of at least one of the first resin composition 6 and the second resin composition 8 described above. For example, the inorganic fine particles may be silica particles whose surfaces are modified with alkylsilyl groups. As the alkylsilyl group, a monoalkylsilyl group, a dialkylsilyl group, or a trialkylsilyl group may be used. The shape of the inorganic fine particles may be, for example, spherical, elliptical, flat, rod-like, or fibrous. The average particle diameter of the inorganic fine particles is preferably, for example, 1 to 1000 nm, taking into consideration dispersibility in the photocurable resin composition. The specific surface area (BET adsorption method) of the inorganic fine particles is, for example, about 50 to 400 m 2 /g.
粘着付与剤は、光硬化性樹脂組成物から形成された硬化樹脂層に柔軟性を与え、硬化樹脂層の初期接着強度（いわゆるタック性）をより向上させる。粘着付与剤としては、例えば、テルペン樹脂、テルペンフェノール樹脂、水素添加テルペン樹脂等のテルペン系樹脂、天然ロジン、重合ロジン、ロジンエステル、水素添加ロジン等のロジン樹脂、ポリブタジエン、ポリイソプレン等の石油樹脂などを使用することができる。 The tackifier imparts flexibility to the cured resin layer formed from the photocurable resin composition, and further improves the initial adhesive strength (so-called tackiness) of the cured resin layer. Examples of tackifiers that can be used include terpene resins such as terpene resins, terpene phenol resins, and hydrogenated terpene resins; rosin resins such as natural rosin, polymerized rosin, rosin ester, and hydrogenated rosin; and petroleum resins such as polybutadiene and polyisoprene.
光硬化性樹脂組成物は、透過率が９０％を超えることが好ましい。これにより、硬化樹脂層１を形成したときに、画像表示部材２に形成された画像の視認性をより良好にすることができる。 It is preferable that the photocurable resin composition has a transmittance of more than 90%. This allows the image formed on the image display member 2 to have better visibility when the cured resin layer 1 is formed.
光硬化性樹脂組成物の屈折率は、画像表示部材２や光透過性部材３の屈折率とほぼ同等であることが好ましく、例えば１．４５以上１．５５以下であることが好ましい。これにより、画像表示部材２からの映像光の輝度やコントラストを高め、視認性を向上させることができる。 The refractive index of the photocurable resin composition is preferably approximately equal to the refractive index of the image display member 2 and the light-transmitting member 3, and is preferably, for example, 1.45 or more and 1.55 or less. This can increase the brightness and contrast of the image light from the image display member 2, improving visibility.
光硬化性樹脂組成物は、上述した各成分を、公知の混合手法に従って均一に混合することにより調製することができる。 The photocurable resin composition can be prepared by uniformly mixing the above-mentioned components according to a known mixing method.
以下、本技術の実施例について説明する。 The following describes an example of this technology.
［（メタ）アクリレート樹脂］
ＵＣ－２０３：イソプレンオリゴマー、クラレ社製
ＵＶ３７００Ｂ：ウレタンアクリレートオリゴマー、日本合成化学社製
[(Meth)acrylate resin]
UC-203: isoprene oligomer, manufactured by Kuraray Co., Ltd. UV3700B: urethane acrylate oligomer, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.
［単官能モノマー］
ＩＳＴＡ：イソステアリルアクリレート、大阪有機化学工業社製
Ｍ－１１１：ノニルフェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１１３：ノニルフェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１１７：ノニルフェノールＰＯ変性アクリレート、東亞合成社製
Ｍ－１２０：２－エチルヘキシルＥＯ変性アクリレート、東亞合成社製
Ｍ－１０１Ａ：フェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１０２：フェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１０６：о－フェニルフェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１１０：パラクミルフェノールＥＯ変性アクリレート、東亞合成社製
Ｍ－１４０：Ｎ－アクリロイルオキシエチルヘキサヒドロフタルイミド、東亞合成社製
Ｍ－５７００：２－ヒドロキシ－３－フェノキシプロピルアクリレート、東亞合成社製
ＩＢＸＡ：イソボルニルアクリレート、大阪有機化学工業社製
ＨＰＡ：ヒドロキシプロピルアクリレート、大阪有機化学工業社製
[Monofunctional Monomer]
ISTA: Isostearyl acrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd. M-111: Nonylphenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-113: Nonylphenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-117: Nonylphenol PO modified acrylate, manufactured by Toagosei Co., Ltd. M-120: 2-ethylhexyl EO modified acrylate, manufactured by Toagosei Co., Ltd. M-101A: Phenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-102: Phenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-106: o-phenylphenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-110: Paracumylphenol EO modified acrylate, manufactured by Toagosei Co., Ltd. M-140: N-acryloyloxyethylhexahydrophthalimide, manufactured by Toagosei Co., Ltd. M-5700: 2-hydroxy-3-phenoxypropyl acrylate, manufactured by Toagosei Co., Ltd. IBXA: isobornyl acrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd. HPA: hydroxypropyl acrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd.
［可塑剤］
ＬＩＲ－３０：イソプレンポリマー、クラレ社製
Ｐ－３０００：ポリエーテルポリオール、ＡＤＥＫＡ社製
[Plasticizer]
LIR-30: isoprene polymer, manufactured by Kuraray Co., Ltd. P-3000: polyether polyol, manufactured by ADEKA Co., Ltd.
［重合開始剤］
Ｉｒｇ１８４：１－ヒドロキシシクロヘキシルフェニルケトン、ＢＡＳＦ社製
[Polymerization initiator]
Irg184: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF
［単官能モノマーの加熱残分］
各単官能モノマーの加熱残分（％）は、熱量計測定装置（装置名：Ｑ５０、ＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製）を用いて求めた。具体的には、図８に示すように、容器１２に、１０ｍｇの単官能モノマー１３を入れ、単官能モノマー１３を６０℃で３０分間加熱する前後の質量を測定することにより求めた。
[Heating residue of monofunctional monomer]
The heating residue (%) of each monofunctional monomer was determined using a calorimeter (device name: Q50, manufactured by TA Instruments). Specifically, as shown in Fig. 8, 10 mg of monofunctional monomer 13 was placed in a container 12, and the mass of monofunctional monomer 13 was measured before and after heating at 60°C for 30 minutes.
［光硬化性樹脂組成物の調製］
表１に示す配合量（質量部）で各成分を均一に混合して光硬化性樹脂組成物を調製した。
[Preparation of photocurable resin composition]
The components were uniformly mixed in the amounts (parts by mass) shown in Table 1 to prepare photocurable resin compositions.
［光硬化性樹脂組成物の粘度］
光硬化性樹脂組成物の２５℃、又は８０℃における粘度を、レオメータ（ＲＳ６００、ＨＡＡＫＥ社製、コーン角度Ｃ３５／２°）で測定した。
[Viscosity of photocurable resin composition]
The viscosity of the photocurable resin composition at 25° C. or 80° C. was measured using a rheometer (RS600, manufactured by HAAKE Corporation, cone angle C35/2°).
［光硬化性樹脂組成物の屈折率］
各光硬化性樹脂組成物を８０℃で３時間加熱した後の屈折率と、加熱する前の屈折率をアッベ屈折率計（ナトリウムＤ線（５８５ｎｍ)、２５℃)を用いて測定した。
[Refractive index of photocurable resin composition]
The refractive index of each photocurable resin composition after heating at 80° C. for 3 hours and the refractive index before heating were measured using an Abbe refractometer (sodium D line (585 nm), 25° C.).
［光硬化性樹脂組成物の加熱残分］
各光硬化性樹脂組成物の加熱残分（％）は、熱量計測定装置（装置名：Ｑ５０、ＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製）を用いて求めた。具体的には、図９に示すように、容器１４に、１０ｍｇの光硬化性樹脂組成物１５を入れ、光硬化性樹脂組成物１５を８０℃で３時間加熱する前後の質量を測定することにより求めた。
[Heating Residue of Photocurable Resin Composition]
The heating residue (%) of each photocurable resin composition was determined using a calorimeter (device name: Q50, manufactured by TA Instruments). Specifically, as shown in Fig. 9, 10 mg of photocurable resin composition 15 was placed in a container 14, and the photocurable resin composition 15 was heated at 80°C for 3 hours, and the mass was measured before and after the heating.
［光硬化性樹脂組成物を加熱しない場合の接着強度］
図１０、図１１に示すように、厚さ１．１ｍｍのガラス板１６の中央部に光硬化性樹脂組成物を滴下し、０．１５ｍｍのスペーサ１９を介して、厚さ１．１ｍｍのガラス板１７を直交するように載置した。これにより、ガラス板１６、１７の間に、直径６ｍｍ、厚さ０．１５ｍｍの樹脂組成物層１８が形成されたガラス接合体２０を得た。
[Adhesion strength when photocurable resin composition is not heated]
10 and 11 , a photocurable resin composition was dropped onto the center of a 1.1 mm thick glass plate 16, and a 1.1 mm thick glass plate 17 was placed perpendicularly to the glass plate 16 via a 0.15 mm spacer 19. In this way, a glass joined body 20 was obtained in which a resin composition layer 18 having a diameter of 6 mm and a thickness of 0.15 mm was formed between the glass plates 16 and 17.
図１２、図１３に示すように、紫外線照射器９を用いて、積算光量が５０００ｍＪ／ｃｍ２となるように、ガラス板１７側から紫外線１０を照射して樹脂組成物層１８を硬化させ、硬化樹脂層２１を形成した。 As shown in Figures 12 and 13, ultraviolet light 10 was irradiated from the glass plate 17 side using an ultraviolet irradiator 9 so that the accumulated light amount was 5000 mJ/ cm2 , thereby curing the resin composition layer 18 and forming a cured resin layer 21.
図１４に示すように、ガラス接合体２０のガラス板１６、１７を治具２２Ａ、２２Ｂで固定するとともに、治具２２Ｂ側から垂直方向に５ｍｍ／分の速度で押し込み、以下の基準で接着状態を評価した。接着強度の測定には、荷重試験機（ＪＳＶ－１０００、日本計測システム社製）を用いた。接着強度は、２５℃においてガラス板１６とガラス板１７とが分離するまでに要した応力を測定し、その応力を硬化樹脂層２１の単位面積で除することにより算出した。 As shown in Figure 14, the glass plates 16 and 17 of the glass bonded body 20 were fixed with jigs 22A and 22B, and were pressed vertically from the jig 22B side at a speed of 5 mm/min, and the bonding state was evaluated according to the following criteria. A load tester (JSV-1000, manufactured by Japan Measurement Systems Co., Ltd.) was used to measure the bonding strength. The bonding strength was calculated by measuring the stress required for the glass plates 16 and 17 to separate at 25°C, and dividing the stress by the unit area of the cured resin layer 21.
［光硬化性樹脂組成物を加熱する場合の接着強度］
ガラス板１６に滴下する光硬化性樹脂組成物として、８０℃で３時間加熱したものを用いたこと以外は、上述した光硬化性樹脂組成物を加熱しない場合の接着強度の測定と同様に行った。
[Adhesion strength when photocurable resin composition is heated]
The adhesive strength was measured in the same manner as in the case where the photocurable resin composition described above was not heated, except that the photocurable resin composition to be dropped onto the glass plate 16 was heated at 80° C. for 3 hours.
［透過率］
紫外可視分光光度計（島津製作所製、ＵＶ－２４５０）を用いて、ガラス接合体２０における硬化樹脂層２１の可視光領域の透過率を測定した。実用上、硬化樹脂層２１の透過率が９０％以上であることが好ましい。
[Transmittance]
A UV-visible spectrophotometer (UV-2450, manufactured by Shimadzu Corporation) was used to measure the transmittance in the visible light region of the cured resin layer 21 in the glass bonded body 20. For practical purposes, it is preferable that the transmittance of the cured resin layer 21 is 90% or more.
実施例の光硬化性樹脂組成物は、加熱することにより粘度が低くなる。そのため、ダムフィルプロセスにおいて、ダム材（第１の樹脂組成物）とフィル材（第２の樹脂組成物）として同一成分の樹脂組成物を用いた場合でも、ダム材の高粘度性と、フィル材の低粘度性とを両立できる。 The photocurable resin composition of the embodiment has a lower viscosity when heated. Therefore, even when resin compositions of the same components are used as the dam material (first resin composition) and the fill material (second resin composition) in the dam-fill process, it is possible to achieve both a high viscosity for the dam material and a low viscosity for the fill material.
また、実施例の光硬化性樹脂組成物は、６０℃で３０分間加熱後の加熱残分が９５．０％以上である単官能モノマーを含有し、かつ８０℃で３時間加熱後の加熱残分が９５．０％以上である。そのため、予め硬化性樹脂組成物を加熱した場合でも、接着強度が良好であることが分かった。これにより、例えばダムフィルプロセスにおいて、フィル材を加熱する際に、フィル材中の成分の揮発を抑制でき、部材同士の密着性を良好にできる。 The photocurable resin composition of the embodiment contains a monofunctional monomer that has a heating residue of 95.0% or more after heating at 60°C for 30 minutes, and has a heating residue of 95.0% or more after heating at 80°C for 3 hours. Therefore, it was found that the adhesive strength is good even when the curable resin composition is heated in advance. This makes it possible to suppress the volatilization of the components in the fill material when the fill material is heated, for example, in a dam-fill process, and to improve the adhesion between the components.
一方、８０℃で３時間加熱後の加熱残分が９５．０％未満の樹脂組成物を用いた比較例１、２では、予め樹脂組成物を加熱した場合、接着強度が良好ではないことが分かった。そのため、例えばダムフィルプロセスにおいて、フィル材を加熱する際に、フィル材中の成分の揮発を抑制できず、部材同士の密着性を良好にすることが困難である。また、比較例３、４では、樹脂組成物として、６０℃で３０分間加熱後の加熱残分が９５．０％以上である単官能モノマーを含有しない樹脂組成物を用いたため、接着強度が良好ではないことが分かった。 On the other hand, in Comparative Examples 1 and 2, which used a resin composition with a heating residue of less than 95.0% after heating at 80°C for 3 hours, it was found that the adhesive strength was not good when the resin composition was heated in advance. Therefore, for example, in a dam-fill process, when the fill material is heated, the volatilization of the components in the fill material cannot be suppressed, making it difficult to improve the adhesion between the components. In Comparative Examples 3 and 4, a resin composition was used that did not contain a monofunctional monomer and had a heating residue of 95.0% or more after heating at 60°C for 30 minutes, and therefore it was found that the adhesive strength was not good.
１ 硬化樹脂層、２ 画像表示部材、３ 光透過性部材、４ 遮光層、５ 画像表示装置、６ 第１の樹脂組成物、７ 第２の樹脂組成物の塗布領域、８ 第２の樹脂組成物、９ 紫外線照射器、１０ 紫外線、１１ 液止め部（ダム）、１２ 容器、１３ 単官能モノマー、１４ 容器、１５ 光硬化性樹脂組成物、１６ ガラス板、１７ ガラス板、１８ 樹脂組成物層、１９ スペーサ、２０ ガラス接合体、２１ 硬化樹脂層、２２Ａ，２２Ｂ 治具 1 Cured resin layer, 2 Image display member, 3 Light-transmitting member, 4 Light-shielding layer, 5 Image display device, 6 First resin composition, 7 Coating area of second resin composition, 8 Second resin composition, 9 Ultraviolet irradiator, 10 Ultraviolet light, 11 Liquid stopper (dam), 12 Container, 13 Monofunctional monomer, 14 Container, 15 Photocurable resin composition, 16 Glass plate, 17 Glass plate, 18 Resin composition layer, 19 Spacer, 20 Glass joint, 21 Cured resin layer, 22A, 22B Jig
Claims (5)
上記硬化樹脂層は、第１の樹脂組成物と第２の樹脂組成物が光硬化したものであり、
上記第１の樹脂組成物と上記第２の樹脂組成物は、２５℃における粘度が１００００～５００００ｍＰａ・ｓの範囲であり、
上記第２の樹脂組成物は、上記第１の樹脂組成物から形成された液止め部に配置され、
上記第２の樹脂組成物は、単官能モノマーを５～６０質量％と、（メタ）アクリレート樹脂を３０～５０質量％と、可塑剤を１５～５０質量％含有し、
上記単官能モノマーは、６０℃で３０分間加熱後の加熱残分が９５．０％以上であり、
上記第２の樹脂組成物は、８０℃で３時間加熱後の加熱残分が９５．０％以上であり、
上記単官能モノマーは、式（Ａ）で表される化合物、及び式（Ｂ）で表される化合物の少なくとも１種である、硬化樹脂層。
The cured resin layer is formed by photocuring a first resin composition and a second resin composition,
The first resin composition and the second resin composition have a viscosity at 25°C in the range of 10,000 to 50,000 mPa·s,
The second resin composition is disposed on a liquid stopping portion formed from the first resin composition,
The second resin composition contains 5 to 60% by mass of a monofunctional monomer, 30 to 50 % by mass of a (meth)acrylate resin, and 15 to 50 % by mass of a plasticizer,
The monofunctional monomer has a heating residue of 95.0% or more after heating at 60° C. for 30 minutes,
The second resin composition has a heating residue of 95.0% or more after heating at 80° C. for 3 hours,
The cured resin layer , wherein the monofunctional monomer is at least one of a compound represented by formula (A) and a compound represented by formula (B) .
上記硬化樹脂層は、第１の樹脂組成物と第２の樹脂組成物が光硬化したものであり、The cured resin layer is formed by photocuring a first resin composition and a second resin composition,
上記第１の樹脂組成物と上記第２の樹脂組成物は、２５℃における粘度が１００００～５００００ｍＰａ・ｓの範囲であり、The first resin composition and the second resin composition have a viscosity at 25°C in the range of 10,000 to 50,000 mPa·s,
上記第２の樹脂組成物は、上記第１の樹脂組成物から形成された液止め部に配置され、The second resin composition is disposed on a liquid stopping portion formed from the first resin composition,
上記第２の樹脂組成物は、単官能モノマーを５～６０質量％と、（メタ）アクリレート樹脂を３０～５０質量％と、可塑剤を１５～５０質量％含有し、The second resin composition contains 5 to 60% by mass of a monofunctional monomer, 30 to 50% by mass of a (meth)acrylate resin, and 15 to 50% by mass of a plasticizer,
上記単官能モノマーは、６０℃で３０分間加熱後の加熱残分が９５．０％以上であり、The monofunctional monomer has a heating residue of 95.0% or more after heating at 60° C. for 30 minutes,
上記第２の樹脂組成物は、８０℃で３時間加熱後の加熱残分が９５．０％以上であり、The second resin composition has a heating residue of 95.0% or more after heating at 80° C. for 3 hours,
上記単官能モノマーは、イソステアリル（メタ）アクリレート、ノニルフェノールＥＯ変性（メタ）アクリレート、ノニルフェノールＰＯ変性（メタ）アクリレート、２－エチルヘキシルＥＯ変性（メタ）アクリレート、フェノールＥＯ変性（メタ）アクリレート、о－フェニルフェノールＥＯ変性アクリレート、パラクミルフェノールＥＯ変性アクリレート、Ｎ－アクリロイルオキシエチルヘキサヒドロフタルイミド、及び２－ヒドロキシ－３－フェノキシプロピルアクリレートの少なくとも１種である、硬化樹脂層。The monofunctional monomer is at least one of isostearyl (meth)acrylate, nonylphenol EO-modified (meth)acrylate, nonylphenol PO-modified (meth)acrylate, 2-ethylhexyl EO-modified (meth)acrylate, phenol EO-modified (meth)acrylate, o-phenylphenol EO-modified acrylate, para-cumylphenol EO-modified acrylate, N-acryloyloxyethylhexahydrophthalimide, and 2-hydroxy-3-phenoxypropyl acrylate.
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