JP7602720B2 - Joint member, liquid ejection head, liquid ejection unit, and liquid ejection device - Google Patents

Description

The present invention relates to a joining member, a liquid ejection head, a liquid ejection unit, and a device for ejecting liquid.

Conventionally, a joining member in which a joining part is joined to a joined part is known. For example, Patent Document 1 discloses a liquid ejection head in which a nozzle plate (joining part) having nozzles is joined to an actuator substrate including a flow path member that forms an individual liquid chamber that communicates with the nozzles. This head has a recess in the joining surface of the actuator substrate to which the nozzle plate is joined, and an ultraviolet-curing adhesive is applied to the bottom surface of this recess so that it protrudes from the opening surface of the recess. The nozzle plate is then aligned with the joining surface of the actuator substrate, and the adhesive is irradiated with ultraviolet light to harden it, thereby joining the nozzle plate to the actuator substrate.

However, as joining components become smaller, the dimensions of the recesses that can be formed on the joining surfaces become smaller, creating the problem that the adhesive may overflow from the recesses and prevent proper joining.

In order to solve the above-mentioned problems, the present invention provides a joining member in which a joining part is joined to a joined part, the joined part having a recess on a joining surface to which the joining part is joined, and a base on a bottom surface of the recess that is lower than the depth of the recess, the joining part is joined to the joined part not only by an adhesive held on the base, but also by another adhesive applied around the recess on the joining surface , the adhesive held on the base is a photocurable adhesive, and the other adhesive held on the joining surface is a thermosetting adhesive .

According to the present invention, even if the dimensions of the recess on the joining surface are small, it is possible to prevent the adhesive from spilling out of the recess and preventing proper joining.

FIG. 2 is an external perspective view of a liquid ejection head according to an embodiment. FIG. FIG. FIG. 2 is an exploded perspective view of the liquid ejection head excluding a frame member. FIG. 2 is a cross-sectional perspective view illustrating a flow path portion of the liquid ejection head. FIG. 2 is an enlarged perspective sectional view of a flow path portion of the liquid ejection head; FIG. 4 is a plan view illustrating a flow path portion of the liquid ejection head. FIG. 2 is a plan view of the liquid ejection head as viewed from the nozzle plate side. 9 is an enlarged plan view of a portion surrounded by a dashed line indicated by reference symbol B in FIG. 8, of the bonding surface of the individual flow path member to which the nozzle plate is bonded. Cross-sectional view taken along the line A-A' in Figure 9. 1A is a cross-sectional view showing a state of the adhesive on the base before bonding, and FIG. 1B is a cross-sectional view showing a state of the adhesive on the base after bonding. FIG. 11 is an enlarged plan view of a portion of a bonding surface of an individual flow path member in a modified example. Cross-sectional view taken along the line A-A' in Figure 12. FIG. 13 is a plan view showing an example in which a protruding portion for preventing adhesive from flowing out is provided on a wall portion of a modified example. FIG. 13 is a plan view showing an example in which a gap is provided between the wall portion and the base portion in a modified example. FIG. 2 is an exploded perspective view of a head module according to the embodiment. FIG. 2 is an exploded perspective explanatory view of the head module according to the embodiment, as viewed from the nozzle surface side. FIG. 1 is a schematic explanatory diagram of a printing apparatus according to an embodiment. FIG. 2 is a plan view illustrating an example of a head unit of a printing device. FIG. 1 is a plan view illustrating a main portion of an example of a printing device. FIG. 2 is a side view illustrating a main part of an example of a printing device. FIG. 2 is a plan view illustrating a main portion of an example of a liquid ejection unit. FIG. 2 is a front view illustrating an example of a liquid ejection unit.

Hereinafter, an embodiment in which the present invention is applied to a liquid ejection head provided in an apparatus for ejecting liquid will be described.
FIG. 1 is an explanatory perspective view showing the appearance of a liquid ejection head according to this embodiment.
FIG. 2 is an exploded perspective view of the liquid ejection head.
FIG. 3 is a cross-sectional perspective view of the liquid ejection head.
FIG. 4 is an exploded perspective view of the liquid ejection head with the frame member removed.
FIG. 5 is a cross-sectional perspective view of a flow path portion of the liquid ejection head.
FIG. 6 is an enlarged perspective sectional view of a flow path portion of the liquid ejection head.
FIG. 7 is a plan view illustrating a flow path portion of the liquid ejection head.

The liquid ejection head 1 of this embodiment includes a nozzle plate 10, a flow path plate (individual flow path member) 20, a vibration plate member 30, a common flow path member 50, a damper member 60, a frame member 80, and a substrate (flexible wiring substrate) 101 on which a drive circuit 102 is mounted.

The nozzle plate 10 is provided with a plurality of nozzles 11 that eject liquid. The nozzles 11 are arranged in a two-dimensional matrix, and are aligned in three directions, a first direction F, a second direction S, and a third direction T, as shown in FIG. 7.

The individual flow path member 20 forms a plurality of pressure chambers (individual liquid chambers) 21 each connected to a plurality of nozzles 11, a plurality of individual supply flow paths 22 each connected to the plurality of pressure chambers 21, and a plurality of individual recovery flow paths 23 each connected to the plurality of pressure chambers 21. A pressure chamber 21 and the individual supply flow paths 22 and individual recovery flow paths 23 connected thereto are collectively referred to as an individual flow path 25.

The vibration plate member 30 forms a vibration plate 31, which is a deformable wall surface of the pressure chamber 21, and a piezoelectric element 40 is integrally provided on the vibration plate 31. The vibration plate member 30 also has a supply side opening 32 that communicates with the individual supply flow path 22 and a recovery side opening 33 that communicates with the individual recovery flow path 23. The piezoelectric element 40 is a pressure generating means that deforms the vibration plate 31 to pressurize the liquid in the pressure chamber 21.

The individual flow path member 20 and the diaphragm member 30 are not limited to being separate members. For example, the individual flow path member 20 and the diaphragm member 30 can be integrally formed from the same member using an SOI (Silicon On Insulator) substrate. That is, an SOI substrate in which a silicon oxide film, a silicon layer, and a silicon oxide film are formed in this order on a silicon substrate can be used, and the silicon substrate can be used as the individual flow path member 20, with the diaphragm 31 being formed from the silicon oxide film, the silicon layer, and the silicon oxide film. In this configuration, the layered configuration of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate becomes the diaphragm member 30. In this way, the diaphragm member 30 includes one made of a material formed on the surface of the individual flow path member 20.

The common flow path member 50 forms multiple common supply flow path tributaries 52 that lead to two or more individual supply flow paths 22 and multiple common recovery flow path tributaries 53 that lead to two or more individual recovery flow paths 23, which are alternately adjacent to each other in the second direction S of the nozzle 11.

The common flow path member 50 has a through hole that serves as a supply port 54 connecting the supply side opening 32 of the individual supply flow path 22 and the common supply flow path branch 52, and a through hole that serves as a recovery port 55 connecting the recovery side opening 33 of the individual recovery flow path 23 and the common recovery flow path branch 53.

The common flow path member 50 also forms one or more common supply flow path main streams 56 that lead to multiple common supply flow path tributaries 52, and one or more common recovery flow path main streams 57 that lead to multiple common recovery flow path tributaries 53.

The damper member 60 has a supply side damper 62 that faces (opposes) the supply port 54 of the common supply flow path branch 52, and a recovery side damper 63 that faces (opposes) the recovery port 55 of the common recovery flow path branch 53.

The common supply flow path tributaries 52 and the common recovery flow path tributaries 53 are formed by sealing the grooves arranged alternately in the common flow path member 50, which is the same member, with the supply side dampers 62 or recovery side dampers 63 of the damper member 60. Note that it is preferable to use a metal thin film or an inorganic thin film that is resistant to organic solvents as the damper material of the damper member 60. The thickness of the supply side damper 62 and recovery side damper 63 of the damper member 60 is preferably 10 μm or less.

Next, the joining member of this embodiment will be described.
In this embodiment, a joining member is constituted by joining a nozzle plate 10, which is a joining component, to an individual flow path member 20, which is a joined component, with an adhesive 90. Here, the surface of the individual flow path member 20 that is joined to the nozzle plate 10 is referred to as a joining surface 20a.

8 is a plan view of the liquid ejection head 1 of this embodiment as viewed from the nozzle plate 10 side. Note that the nozzles 11 are omitted from the illustration.
FIG. 9 is an enlarged plan view of a portion surrounded by a dashed line indicated by reference symbol B in FIG. 8, of the bonding surface 20a of the individual flow path member 20 to which the nozzle plate 10 is bonded.
FIG. 10 is a cross-sectional view taken along the line AA' in FIG.
The member indicated by the reference numeral 15 is a nozzle cover.

The individual flow path member 20 has recesses 24 that open to the joining surface 20a near the four corners of the joining surface 20a with the nozzle plate 10. In this embodiment, the recesses 24 are provided on the outer periphery of the joining surface 20a, and the recess side on the outer periphery side also opens to the side surface 20b of the individual flow path member 20.

When joining the individual flow path member 20 and the nozzle plate 10, in this embodiment, an adhesive 91 for temporary joining is applied to each of the recesses 24 at the four corners of the joining surface 20a, and another adhesive 90 for actual joining is applied to a predetermined location on the joining surface 20a of the individual flow path member 20. For example, a light-curing adhesive, particularly an ultraviolet-curing adhesive, can be suitably used as the adhesive 91 for temporary joining.

When using an ultraviolet-curing adhesive as the adhesive 91 for temporary bonding applied in the recess 24, it is necessary to irradiate the ultraviolet-curing adhesive in the recess 24 with ultraviolet light after positioning the nozzle plate 10 on the bonding surface 20a of the individual flow path member 20. In this embodiment, the recess side is open to the side surface 20b of the individual flow path member 20, so that even after positioning the nozzle plate 10 on the bonding surface 20a of the individual flow path member 20, ultraviolet light can be easily irradiated from the side surface 20b of the individual flow path member 20 to the ultraviolet-curing adhesive in the recess 24.

The adhesive 90 for this bonding can be any adhesive that meets the required mechanical strength, wettability, elastic modulus, and adhesion to the parts. Examples include epoxy resin adhesives, urethane resin adhesives, and elastomer resin adhesives. In particular, it is preferable that the adhesive 90 for this bonding is a thermosetting adhesive. Methods for applying the adhesive 90 include thin film printing, spray application, and dispensing.

After the nozzle plate 10 is temporarily joined to the individual flow path member 20 with the temporary joining adhesive 91, a heat treatment is performed to harden the main joining adhesive 90, which is a thermosetting adhesive. During this heat treatment, it is necessary to prevent the positioned nozzle plate 10 from moving relative to the joining surface 20a of the individual flow path member 20, so in this embodiment, the nozzle plate 10 is temporarily joined in advance with the temporary joining adhesive 91.

For temporary bonding, the adhesive 91 supplied into the recess 24 needs to be held within the recess 24 so that it overflows from the opening surface of the recess 24 (so that it overflows above the bonding surface 20a). In other words, it is necessary to supply a sufficient amount of adhesive 91 into the recess 24 so that the adhesive 91 is held in a state where it overflows from the opening surface of the recess 24.

As the liquid ejection head 1 becomes smaller, the area in which the recess 24 can be formed on the bonding surface 20a of the individual flow path member 20 becomes smaller, so the dimensions of the recess 24 (the opening area of the recess 24 when viewed from the normal direction of the bonding surface 20a) must be reduced. As a result, when attempting to supply a sufficient amount of adhesive 91 into the recess 24 so that the adhesive 91 is held in a state where it protrudes beyond the opening surface of the recess 24, the adhesive droplet 91 becomes larger than the opening of the recess 24, and the adhesive 91 overflows from the recess 24.

When the adhesive 91 is properly supplied onto the bottom surface of the recess 24, the adhesive 91 maintains a rounded, bulging shape due to its own surface tension due to its wettability, and can have a height that protrudes beyond the opening surface of the recess 24. However, if the adhesive 91 overflows from the recess 24, the surface tension of the adhesive 91 collapses, and the adhesive 91 flows inside the recess 24 and out of the side surface 20b of the individual flow path member 20, making it impossible to perform a temporary bond properly. In addition, if the adhesive 91 overflows from the recess 24, the adhesive 91 will be mixed with the adhesive 90 for the actual bond, which may reduce the adhesiveness of the adhesive 90 for the actual bond and reduce the bond strength.

Even if the droplet of adhesive 91 is smaller than the opening of the recess 24, if there is not enough margin in the distance between the inner wall surface of the recess 24 and the adhesive 91, the adhesive 91 may come into contact with the inner wall surface of the recess 24 due to an error in the amount of adhesive 91 supplied or an error in the supply position. In this case, the surface tension of the adhesive 91 collapses, and the adhesive 91 flows inside the recess 24 and out of the side surface 20b of the individual flow path member 20, making it impossible to perform a proper temporary bond.

In this embodiment, as shown in Figures 9 and 10, a base 26 having a height h2 lower than the depth h1 of the recess 24 is provided on the bottom surface of the recess 24, and adhesive 91 is supplied to the upper surface of the base 26 to hold it in place. For example, when the step of forming the recess 24 in the individual flow path member 20 is performed by etching, an example of a method for forming such a base 26 is a method of etching such that the base 26 remains on the bottom surface of the base 26. Another example is a method in which the base 26 is later attached to the bottom surface of the recess 24 after the recess 24 is formed in the individual flow path member 20. Note that the method for forming the base 26 is not limited to these methods.

In the conventional configuration in which adhesive 91 is supplied to and held on the bottom surface of the recess 24 that does not have a base 26, an amount of adhesive 91 is required to make the height of the adhesive 91 higher than the depth h1 of the recess 24. In contrast, in this embodiment, the base 26 is raised by the height h2, and the height required for the adhesive 91 can be reduced by the height of h1-h2. As a result, as shown in FIG. 11(a), a smaller amount of adhesive 91 than in the conventional configuration can be used to hold the adhesive 91 so that it overflows from the opening surface of the recess 24. For example, if the height h2 of the base 26 is 1/2 the depth h1 of the recess (h2=h1/2), the amount (volume) of adhesive 91 required can be approximately 1/8 of that of the conventional configuration.

By reducing the amount of adhesive 91 required in this way, it is possible to prevent the adhesive 91 from spilling out of the recess 24 or flowing out of the recess 24, and an appropriate temporary bond is achieved, as shown in FIG. 11(b). It is also possible to prevent the adhesive 91 from mixing with the adhesive 90 for the actual bond, which would reduce the adhesiveness of the adhesive 90 for the actual bond and thus reduce the bond strength.

It is also possible to achieve a state in which the adhesive 91 protrudes from the opening surface of the recess 24 with a small amount of adhesive 91 by forming the recess 24 shallow without providing a base portion 26 within the recess 24. However, the recess 24 of the individual flow path member 20 is formed in the same process as other processing parts such as the pressure chamber (individual liquid chamber) 21 and the individual flow path 25 provided in the individual flow path member 20, and there are restrictions on changing the depth of the recess 24. Therefore, it is desirable to achieve a state in which the adhesive 91 protrudes from the opening surface of the recess 24 with a small amount of adhesive 91 without changing the depth of the recess 24.

[Modifications]
Next, a modification of the liquid ejection head 1 according to the above-described embodiment will be described.
FIG. 12 is an enlarged plan view of a portion of the bonding surface 20a of the individual flow path member 20 in this modified example.
FIG. 13 is a cross-sectional view taken along the line AA' in FIG.

In this modification, a wall portion 27 is provided on the bottom surface of the recess 24 in the above-described embodiment so as to surround the periphery of the base portion 26. This wall portion 27 has a height equal to or less than the depth h1 of the recess 24, and in this modification, has the same height as the depth h1 of the recess 24. The wall portion 27 having the same height as the depth h1 of the recess 24 has the advantage of simplifying the manufacturing process.

In this modified example, as shown in FIG. 11, the wall 27 is chipped at a portion facing the open recess side (side surface 20b of the individual flow path member 20), and at the other three locations, the wall 27 is interposed between the base 26 and the inner wall surface of the recess 24. As a result, even if an excessive amount of adhesive 91 is supplied to the base 26, the adhesive 91 is blocked by the wall 27 and prevented from flowing beyond the inner wall surface of the recess 24 to the joining surface 20a of the individual flow path member 20. Therefore, it is possible to more stably prevent the adhesive 91 from mixing with the main bonding adhesive 90 on the joining surface 20a, and to stably prevent a situation in which the adhesiveness of the main bonding adhesive 90 is reduced and the joining strength is reduced.

In addition, the wall portion 27 of this modified example is provided so that there is a gap between it and the inner wall surface of the recess 24. As a result, even if the adhesive 91 flows out beyond the wall portion 27, the flowed-out adhesive 91 is held in the gap between the wall portion 27 and the inner wall surface of the recess 24, and is prevented from flowing out beyond the inner wall surface of the recess 24 onto the joining surface 20a.

In addition, the wall portion 27 of this modified example is open at a portion opposite the open recess side (side surface 20b of the individual flow path member 20), so that the wall portion 27 does not get in the way of irradiating the adhesive 91 (ultraviolet-curing adhesive) on the base portion 26 with ultraviolet light.

In addition, because the portion of the wall 27 is missing and open in this manner, if the adhesive 91 leaks out from the base 26, the adhesive 91 will leak out from the missing portion of the wall 27 and flow toward the side surface 20b of the individual flow path member 20. This makes it possible to more reliably prevent the leaked adhesive 91 from mixing with the adhesive 90 for the main bond on the bonding surface 20a, and reliably suppresses the situation in which the adhesiveness of the adhesive 90 for the main bond is reduced, thereby reducing the bonding strength.

In this modified example, as shown in FIG. 14, an outflow suppression portion that suppresses outflow of the adhesive 91 may be provided at the missing portion of the wall portion 27. In the example of FIG. 13, a protruding portion 27a is provided as an outflow suppression portion to block a part of the missing portion of the wall portion 27. With this, when the adhesive 91 leaks out from the base portion 26, the adhesive 91 is less likely to leak out from the missing portion of the wall portion 27, and the amount of adhesive 91 that flows out from the side surface 20b of the individual flow path member 20 can be suppressed. This makes it possible to suppress the adverse effects of the adhesive 91 flowing out from the side surface 20b of the individual flow path member 20 (such as impeding the joining of the nozzle cover 15).

Also, as shown in FIG. 15, a gap may be provided between the wall portion 27 and the base portion 26. In this way, even if the adhesive 91 leaks out from the base portion 26, the leaked adhesive 91 is retained in the gap between the base portion 26 and the wall portion 27, and is prevented from flowing out beyond the wall portion 27.

Next, an example of a head module including the liquid ejection head 1 of this embodiment will be described with reference to FIGS.
FIG. 16 is an exploded perspective view of the head module of the present embodiment.
FIG. 17 is an exploded perspective explanatory diagram of the head module of this embodiment, as viewed from the nozzle surface side.

The head module 100 includes a liquid ejection head (hereinafter simply referred to as a "head") 1 that ejects liquid, a base member 103 that holds the multiple heads 1, and a cover member 113 that serves as a nozzle cover 15 for the multiple heads 1. The head module 100 also includes a heat dissipation member 104, a manifold 105 that forms a flow path that supplies liquid to the multiple heads 1, a printed circuit board (PCB) 106 that connects to the flexible wiring member 101, and a module case 107.

Next, an example of a liquid ejecting device according to the present invention will be described with reference to FIGS.
FIG. 18 is a schematic explanatory diagram of a printing apparatus, which is an inkjet recording apparatus serving as an apparatus for ejecting liquid in this embodiment.
FIG. 19 is an explanatory plan view of an example of a head unit of a printing device of this embodiment.

The printing device 500, which is a device for ejecting this liquid, includes an input means 501 for inputting the continuous body 510, a guide and conveyance means 503 for guiding and conveying the continuous body 510 inputted from the input means 501 to the printing means 505, a printing means 505 for ejecting liquid onto the continuous body 510 to perform printing to form an image, a drying means 507 for drying the continuous body 510, and an ejection means 509 for ejecting the continuous body 510.

The continuous web 510 is sent out from the original winding roller 511 of the carrying-in means 501, guided and transported by the rollers of the carrying-in means 501, the guide transport means 503, the drying means 507, and the carrying-out means 509, and wound up by the winding roller 591 of the carrying-out means 509. In the printing means 505, this continuous web 510 is transported on the transport guide member 559 facing the head unit 550, and an image is printed by liquid ejected from the head unit 550.

In the printing device 500 of this embodiment, the head unit 550 includes the two head modules 100A and 100B according to the embodiment described above on a common base member 552.

When the direction in which heads 1 are arranged in the direction perpendicular to the transport direction of head modules 100A and 100B is defined as the head array direction, head rows 1A1 and 1A2 of head module 100A eject liquid of the same color. Similarly, head rows 1B1 and 1B2 of head module 100A are paired, head rows 1C1 and 1C2 of head module 100B are paired, and head rows 1D1 and 1D2 are paired, and each ejects liquid of the required color.

Next, another example of a printing apparatus as a liquid ejecting apparatus according to the present invention will be described with reference to FIGS. 20 and 21. FIG.
FIG. 20 is an explanatory plan view of the main part of the printing apparatus of this embodiment.
FIG. 21 is an explanatory side view of the main part of the printing apparatus of this embodiment.

The printing device 500 of this example is a serial type device, and the carriage 403 moves back and forth in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is hung between left and right side plates 491A, 491B and holds the carriage 403 movably. The carriage 403 is then moved back and forth in the main scanning direction by the main scanning motor 405 via the timing belt 408 hung between the drive pulley 406 and driven pulley 407.

This carriage 403 is equipped with a liquid ejection unit 440 that integrates head 1, which is a droplet ejection head according to the present invention, and a head tank 441. Head 1 of the liquid ejection unit 440 ejects liquid of each color, for example, yellow (Y), cyan (C), magenta (M), and black (K). The liquid ejection head 1 has a nozzle row made up of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and is mounted with the ejection direction facing downward. The liquid ejection head 1 is connected to a liquid circulation device, and liquid of the required color is circulated and supplied.

The printing device 500 is equipped with a transport mechanism 495 for transporting the paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412 attracts the paper 410 and transports it to a position facing the head 1. The transport belt 412 is an endless belt that is stretched between a transport roller 413 and a tension roller 414. The paper can be attracted by electrostatic attraction or air suction. The transport belt 412 moves in a circular motion in the sub-scanning direction by the transport roller 413 being rotated and driven by the sub-scanning motor 416 via a timing belt 417 and a timing pulley 418.

Furthermore, on one side of the carriage 403 in the main scanning direction, beside the transport belt 412, a maintenance and recovery mechanism 420 that maintains and recovers the liquid ejection head 1 is arranged. The maintenance and recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle surface of the head 1, a wiper member 422 that wipes the nozzle surface, and the like. In addition, the main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the transport mechanism 495 are attached to a housing that includes side plates 491A, 491B, and a back plate 491C.

In the printing device 500 configured in this manner, the paper 410 is fed onto and adsorbed onto the conveyor belt 412, and the paper 410 is conveyed in the sub-scanning direction by the circular movement of the conveyor belt 412. Then, by driving the head 1 in response to an image signal while moving the carriage 403 in the main scanning direction, liquid is ejected onto the stationary paper 410 to form an image.

Next, another example of the liquid discharge unit according to the present invention will be described with reference to FIG.
FIG. 22 is a plan view illustrating the main parts of the liquid discharge unit of this embodiment.

The liquid ejection unit 440 is made up of the following components that make up the device for ejecting the liquid: a housing portion made up of side plates 491A, 491B and a back plate 491C; a main scanning movement mechanism 493; a carriage 403; and a head 1.

It is also possible to configure a liquid ejection unit by further attaching the aforementioned maintenance and recovery mechanism 420 to, for example, the side plate 491B of this liquid ejection unit 440.

Next, still another example of the liquid discharge unit according to the present invention will be described with reference to FIG.
FIG. 23 is a front view illustrating the liquid discharge unit of this embodiment.

This liquid ejection unit 440 is composed of a head 1 to which a flow path part 444 is attached, and a tube 456 connected to the flow path part 444.

The flow path part 444 is disposed inside the cover 442. A head tank 441 may be included instead of the flow path part 444. A connector 443 is provided on the upper part of the flow path part 444 to electrically connect to the liquid ejection head 1.

In the present application, the liquid to be ejected may have a viscosity and surface tension that allows it to be ejected from the head, and is not particularly limited, but it is preferable that the viscosity is 30 mPa·s or less at room temperature and pressure, or by heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, etc. that contains a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a functionalizing material such as a polymerizable compound, a resin, or a surfactant, a biocompatible material such as DNA, amino acids, proteins, or calcium, an edible material such as a natural dye, etc., and these can be used for applications such as inkjet ink, surface treatment liquid, a liquid for forming a component of an electronic element or a light-emitting element, an electronic circuit resist pattern, a material liquid for three-dimensional modeling, etc.

The energy sources for discharging liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators that consist of a vibration plate and an opposing electrode.

A "liquid ejection unit" is a liquid ejection head that is integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, a "liquid ejection unit" includes a liquid ejection head that is combined with at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

Here, integration includes, for example, the liquid ejection head, functional parts, and mechanism being fixed to each other by fastening, bonding, engagement, etc., and one being held movably relative to the other. The liquid ejection head, functional parts, and mechanism may also be configured to be detachable from each other.

For example, some liquid ejection units have a liquid ejection head and a head tank integrated together. Others have a liquid ejection head and a head tank integrated together by connecting them to each other with a tube or the like. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

There are also liquid ejection units in which the liquid ejection head and carriage are integrated.

In some liquid ejection units, the liquid ejection head is movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated. In other liquid ejection units, the liquid ejection head, carriage, and main scanning movement mechanism are integrated.

In some liquid ejection units, a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which the liquid ejection head is attached, integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

In addition, some liquid ejection units have a head tank or a liquid ejection head to which a flow path component is attached, and a tube is connected to the liquid ejection head, integrating the liquid ejection head with a supply mechanism. Liquid from a liquid storage source is supplied to the liquid ejection head via this tube.

The main scanning movement mechanism includes the guide member alone. The supply mechanism also includes the tube alone and the loading unit alone.

Note that, although the "liquid ejection unit" is described here in combination with a liquid ejection head, the "liquid ejection unit" also includes a head module including the liquid ejection head described above, or a head unit that is integrated with the functional parts and mechanisms described above.

"Devices that eject liquid" include devices that are equipped with a liquid ejection head, liquid ejection unit, head module, head unit, etc., and that eject liquid by driving the liquid ejection head. Devices that eject liquid include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

For example, examples of "devices that eject liquid" include image forming devices that eject ink to form an image on paper, and three-dimensional modeling devices that eject modeling liquid onto a powder layer formed by layering powder to form a three-dimensional object.

In addition, a "liquid ejecting device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

The above phrase "something to which liquid can adhere" refers to something to which liquid can adhere at least temporarily, and to which the liquid adheres and sticks, or adheres and penetrates. Specific examples include media such as paper, recording paper, film, and cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all things to which liquid can adhere.

The above-mentioned "materials to which liquid can adhere" include paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, and other materials to which liquid can adhere even temporarily.

In addition, the "liquid ejection device" may be a device in which a liquid ejection head and an object to which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which the liquid ejection head moves, and a line type device in which the liquid ejection head does not move.

Other examples of "liquid ejecting devices" include treatment liquid application devices that eject treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and spray granulation devices that spray a composition liquid in which raw materials are dispersed through a nozzle to granulate the raw material into fine particles.

In this application, the terms image formation, recording, printing, copying, printing, modeling, etc. are all synonymous.

The above description is merely an example, and each of the following aspects provides unique effects.
[First aspect]
The first aspect is a joining member (e.g., liquid ejection head 1) in which a joining part (e.g., nozzle plate 10) is joined to a joined part (e.g., individual flow path member 20), the joined part has a recess 24 on a joining surface (e.g., joining surface 20a) to which the joining part is joined, and has a base 26 on a bottom surface of the recess that is lower than the depth h1 of the recess, and the joining part is joined to the joined part by an adhesive 91 held on the base.
In this embodiment, since the adhesive is held on a pedestal provided on the bottom surface of the recess, a smaller amount of adhesive can be applied so that the adhesive overflows from the opening surface of the recess than in a conventional configuration in which the adhesive is held on the bottom surface of a recess without a pedestal. This eliminates the need for an amount of adhesive so large that the area of the adhesive that is occupied by the adhesive as viewed from the normal direction of the bonding surface exceeds the opening surface of the recess, thereby preventing the adhesive from overflowing from the recess and hindering proper bonding.

[Second aspect]
The second aspect is characterized in that, in the first aspect, the joining part is joined to the joined part not only by adhesive 91 held on the base portion, but also by another adhesive 90 applied around the recess on the joining surface.
When a part is bonded to another part by a separate adhesive applied around a recess on the bonding surface, if the adhesive in the recess overflows from the recess, the adhesive may be mixed with the other adhesive. If such mixing occurs, the adhesiveness of the other adhesive may be reduced, and the bonding strength of the other adhesive may be reduced.
According to this aspect, as described above, the adhesive is held by the pedestal provided on the bottom surface of the recess, which prevents the adhesive from spilling out of the recess. This prevents the adhesiveness of the other adhesive from decreasing, and prevents the bonding strength of the other adhesive from decreasing, thereby preventing proper bonding.

[Third aspect]
A third aspect is the second aspect, characterized in that the adhesive held on the base is a light-curing adhesive, and the other adhesive held on the joining surface is a heat-curing adhesive.
According to this method, after temporary bonding with the light-curing adhesive, the main bonding can be performed with the heat-curing adhesive.

[Fourth aspect]
A fourth aspect is the device according to any one of the first to third aspects, characterized in that the base portion has a height equal to or greater than half the depth of the recessed portion.
This allows the amount of adhesive needed to be applied so that it overflows from the opening surface of the recess to be made sufficiently small, making it possible to reliably avoid a situation in which the adhesive overflows from the recess and prevents proper bonding.

[Fifth aspect]
The fifth aspect is characterized in that, in any of the first to fourth aspects, the recess is provided on the outer peripheral edge portion of the joining surface, and the side of the recess on the outer peripheral edge side opens to a side surface of the joined parts.
According to this, even if the adhesive in the recess flows out, the adhesive can flow to the outer periphery of the joining surface, and can be prevented from flowing onto the joining surface, and it is possible to more stably avoid a situation in which proper joining is hindered. Also, since the side of the recess is open to the side of the joined parts in this way, when a light-curing adhesive is used as the adhesive applied to the base, it is easy to irradiate the adhesive with light, and the manufacturing process can be simplified.

[Sixth aspect]
The sixth aspect is the fifth aspect, characterized in that a wall portion 27 having a height equal to or less than the depth of the recess is provided on the bottom surface of the recess so as to surround the periphery of the base portion, and the wall portion is missing a portion facing the open side of the recess.
According to this, even if the adhesive applied to the base flows out of the base, the adhesive is blocked by the wall and prevented from flowing out of the recess. Therefore, it is possible to more stably avoid a situation in which the adhesive overflows from the recess and prevents proper bonding. In addition, since the wall is missing in this way, when a photocurable adhesive is used as the adhesive applied to the base, it is easy to irradiate the adhesive with light, and the manufacturing process can be simplified.

[Seventh aspect]
A seventh aspect is the sixth aspect, characterized in that the wall portion has an outflow suppression portion (for example, a protruding portion 27a) at the cutout portion for suppressing outflow of the adhesive.
With this, even if adhesive leaks out from the missing portion in the wall portion, the leakage prevention portion prevents the adhesive from leaking out, making it possible to more reliably avoid a situation in which the adhesive overflows from the recess and proper bonding is hindered.

[Eighth aspect]
An eighth aspect is the sixth or seventh aspect, characterized in that there is a gap between the wall portion and the base portion.
With this, even if the adhesive applied to the base flows out of the base, the adhesive is held in the gap between the base and the wall and is less likely to flow out of the recess. This makes it possible to more reliably prevent the adhesive from spilling out of the recess and preventing proper bonding.

[Ninth aspect]
A ninth aspect is a liquid ejection head, characterized in that it comprises the bonding member according to any one of the first to eighth aspects.
According to this aspect, it is possible to provide a liquid ejection head including a joint member that is appropriately joined.

[Tenth Aspect]
The tenth aspect is characterized in that, in the liquid ejection head of the ninth aspect, one of the joining part and the joined part is a nozzle plate 10 having a nozzle for ejecting liquid, and the other is a flow path member (e.g., an individual flow path member 20) that forms an individual liquid chamber communicating with the nozzle.
This makes it possible to provide a liquid ejection head in which the nozzle plate and the flow path member are appropriately joined together.

[Eleventh aspect]
An eleventh aspect is a liquid ejection unit, characterized in that it includes the liquid ejection head of the ninth or tenth aspect.
According to this aspect, it is possible to provide a liquid ejection unit including a joint member that is appropriately joined.

[Twelfth aspect]
A twelfth aspect is a device for ejecting liquid, characterized in that it comprises a joining member according to any one of the first to eighth aspects, a liquid ejection head according to the ninth or tenth aspect, or a liquid ejection unit according to the eleventh aspect.
According to this aspect, it is possible to provide a device for discharging liquid that includes a joint member that is appropriately joined.

1: Liquid ejection head 10: Nozzle plate 11: Nozzle 15: Nozzle cover 20: Individual flow path member 20a: Bonding surface 20b: Side surface 21: Pressure chamber 22: Individual supply flow path 23: Individual recovery flow path 24: Recessed portion 25: Individual flow path 26: Base portion 27: Wall portion 27a: Protruding portion 30: Vibration plate member 31: Vibration plate 32: Supply side opening 33: Recovery side opening 40: Piezoelectric element 50: Common flow path member 52: Common supply flow path branch 53: Common recovery flow path branch 54: Supply port 55: Recovery port 56: Common supply flow path main stream 57: Common recovery flow path main stream 60: Damper member 62: Supply side damper 63: Recovery side damper 80: Frame member 90: Adhesive 91: Adhesive 100: Head module 440: Liquid ejection unit 500: Printing device

JP 2017-74731 A

Claims (12)

A joining member in which a joining part is joined to a joined part,
The joined parts have a recess on a joining surface to which the joining part is joined,
a platform portion on a bottom surface of the recess portion, the platform portion being lower than the depth of the recess portion;
The joining part is joined to the joined part not only by the adhesive held on the base part but also by another adhesive applied around the recess on the joining surface ,
the adhesive held on the base is a light-curing adhesive,
A joining member , wherein the other adhesive held on the joining surface is a thermosetting adhesive . A joining member in which a joining part is joined to a joined part ,
The joined parts have a recess on a joining surface to which the joining part is joined,
a platform portion on a bottom surface of the recess portion, the platform portion being lower than the depth of the recess portion;
The joining part is joined to the joined part by an adhesive held on the base part,
A joining member characterized in that the recess is provided on the outer peripheral edge of the joining surface, and the side of the recess on the outer peripheral edge side opens to a side surface of the joined parts. The joining member according to claim 2 ,
a wall portion having a height equal to or less than the depth of the recess portion is provided on a bottom surface of the recess portion so as to surround the periphery of the base portion;
A joining member, wherein the wall portion is missing a portion facing the side of the open recess. The joining member according to claim 3 ,
A joining member, wherein the wall portion has an outflow suppression portion at the missing portion, which suppresses outflow of adhesive. The joining member according to claim 3 or 4 ,
A joining member having a gap between the wall portion and the base portion. The joining member according to any one of claims 2 to 5,
A joining member characterized in that the joining part is joined to the joined part not only by the adhesive held on the base portion, but also by another adhesive applied around the recess on the joining surface. The joining member according to claim 6,
the adhesive held on the base is a light-curing adhesive,
A joining member, wherein the other adhesive held on the joining surface is a thermosetting adhesive. The joining member according to any one of claims 1 to 7,
A joining member, wherein the base portion has a height equal to or greater than half the depth of the recess. A liquid ejection head comprising the joining member according to any one of claims 1 to 8. 10. The liquid ejection head according to claim 9,
A liquid ejection head, characterized in that one of the joining part and the joined part is a nozzle plate having nozzles for ejecting liquid, and the other is a flow path member that forms individual liquid chambers communicating with the nozzles. A liquid ejection unit comprising the liquid ejection head according to claim 9 or 10. A liquid ejection device comprising the joining member according to any one of claims 1 to 8, the liquid ejection head according to claim 9 or 10, or the liquid ejection unit according to claim 11.

Images