JP7597268B1 - Inverter device and rotating machine - Google Patents

Abstract

An object of the present invention is to achieve both improved cooling performance and compact size.
[Solution] The inverter device includes an inverter housing including a first inverter opening, a second inverter opening, and a partition wall separating a first internal space connected to the first inverter opening from a second internal space connected to the second inverter opening, a circuit module arranged in the first internal space and including a functional element, a board connected to the functional element, and a power cable connected to the board, and a heat dissipation member arranged in the second internal space and capable of dissipating heat of the functional element. The partition wall includes a through hole connecting the first internal space and the second internal space. The through hole is arranged in a first direction along the partition wall, in an area opposite to an area where the first inverter opening and the second inverter opening are arranged, sandwiching the functional element therebetween. The power cable is drawn from the first internal space to the second internal space through the through hole.
[Selected Figure] Figure 1

Description

This disclosure relates to an inverter device and a rotating machine.

In recent years, attention has been focused on so-called power semiconductor elements that handle large currents of electricity. Power semiconductor elements generate a large amount of heat due to the magnitude of the current they handle. Therefore, discharging the generated heat from power semiconductor elements is an important issue when handling power semiconductor elements. For example, Patent Documents 1 to 4 disclose techniques related to cooling heat sources such as power semiconductor elements.

JP 2005-044953 A JP 2000-223876 A JP 2004-296748 A Special Publication No. 2012-501045

The power semiconductor elements as described above are housed in the internal space of the inverter housing together with other components such as a circuit board and a power cable. The internal space of the inverter housing is partitioned into an inverter space that houses the power semiconductor elements, the circuit board, the power cable, etc., and a heat dissipation space that houses a heat sink for dissipating heat from the power semiconductor elements. In this configuration, a cooling fan that sends cooling air to the heat dissipation space may be installed. In this case, the cooling air comes into contact with the heat sink, thereby cooling the power semiconductor elements via the heat sink.

However, with this configuration, it is difficult to adequately cool other components such as the board and power cables through which large amounts of power flow and which can generate a large amount of heat. To address this, in addition to the cooling fan that sends cooling air to the heat dissipation space, another cooling fan that sends cooling air to the inverter space may be installed. In this case, it is possible to directly cool other components such as the board and power cables, including the power semiconductor elements. However, installing multiple cooling fans in this way may result in the overall device becoming larger.

This disclosure describes an inverter device and rotating machine that can achieve both improved cooling performance and compact size.

The inverter device according to one embodiment of the present disclosure includes an inverter housing including a first inverter opening through which cooling air can flow in or out, a second inverter opening formed at a position different from the first inverter opening and through which cooling air can flow in or out, and a partition wall separating a first internal space connected to the first inverter opening from a second internal space connected to the second inverter opening, a circuit module arranged in the first internal space and including a functional element, a board connected to the functional element, and a power cable connected to the board, and a heat dissipation member arranged in the second internal space and thermally connected to the functional element via the partition wall and capable of dissipating heat possessed by the functional element, the partition wall including a through hole connecting the first internal space and the second internal space, the through hole being arranged in a region opposite the region in which the first inverter opening and the second inverter opening are arranged in a first direction along the partition wall, sandwiching the functional element, the cooling air can be exchanged between the first internal space and the second internal space, and the power cable is drawn out from the first internal space to the second internal space through the through hole.

In the inverter device, the partition wall separating the first internal space connected to the first inverter opening from the second internal space connected to the second inverter opening includes a through hole connecting the first internal space and the second internal space. The through hole is arranged in a region opposite to the region in which the first inverter opening and the second inverter opening are arranged, across the position of the functional element, in a first direction along the partition wall. Therefore, the cooling air that flows into the first internal space from the first inverter opening is turned back at the through hole, passed to the second internal space, and flows out from the second inverter opening. Alternatively, the cooling air that flows into the second internal space from the second inverter opening is turned back at the through hole, passed to the first internal space, and flows out from the first inverter opening. In this way, the first internal space, the through hole, and the second internal space form a flow path for the cooling air that turns back from the first inverter opening to the second inverter opening via the through hole. When such a turning flow path is formed, it is possible to send the cooling air to both the first internal space and the second internal space using one air source. Therefore, in the above inverter device, both the circuit module arranged in the first internal space and the heat dissipation member arranged in the second internal space can be sufficiently cooled without preparing multiple air blowing sources to send cooling air to both the first internal space and the second internal space, so the entire device can be made compact while still providing sufficient cooling performance. Furthermore, in the above inverter device, the power cable included in the circuit module is pulled out from the first internal space to the second internal space through a through hole. In this case, the power cable, which is one of the heat sources inside the inverter housing, can be effectively cooled by cooling air, further improving cooling performance. In this way, the above inverter device can achieve both improved cooling performance and compact size.

In some embodiments, the power cable may include a first extension portion extending from the substrate along a first direction, a second extension portion extending along a second direction intersecting the first direction and passing through a through hole to be drawn from the first internal space to the second internal space, and a bent portion disposed between the first extension portion and the second extension portion and bent so as to connect the first extension portion and the second extension portion. In this case, the power cable can be disposed along the flow path through which the cooling air flows, so that the power cable can be more effectively cooled by the cooling air, thereby further improving cooling performance.

In some embodiments, the inverter housing includes a cable insertion port through which the power cable drawn from the through hole into the second internal space passes, and the cable insertion port may be formed at a position different from the second inverter opening. In this case, the power cable can be routed so as to follow the shortest possible path to the connection object to which the power cable is connected, so that the power cable can be prevented from becoming unnecessarily long compared to when the power cable is drawn from the second inverter opening.

In some embodiments, the second internal space is a space surrounded by a partition wall and a side wall that faces the partition wall with a gap in a second direction intersecting the partition wall, and the side wall includes a first side wall portion in which the second inverter opening is opened and a second side wall portion in which the cable insertion opening is opened, and the first side wall portion may form a step that is recessed in a direction away from the partition wall relative to the second side wall portion. In this case, a space for the flow of cooling air is secured between the partition wall and the first side wall portion, and a heat dissipation member can be placed in that space, thereby improving cooling performance.

In some embodiments, the cross-sectional area of the second inverter opening may be larger than the cross-sectional area of the cable insertion opening. In this case, a sufficient flow rate of cooling air can be ensured through the second inverter opening, improving cooling performance.

A rotating machine according to one embodiment of the present disclosure includes any one of the inverter devices described above and a motor device to which drive power is supplied from the inverter device. The motor device includes a motor electrically connected to a power cable and capable of rotating a shaft by receiving drive power supplied from the power cable, a cooling fan attached to the shaft, and a motor housing that houses the motor and the cooling fan. The interior of the motor housing is connected to the second internal space through the second inverter opening, and the cooling fan rotates together with the shaft to cause cooling air to flow into the first inverter opening or the second inverter opening.

This rotating machine is equipped with any one of the inverter devices described above, and therefore can achieve the above-mentioned effects. Furthermore, in this rotating machine, the cooling fan housed in the motor housing is used as an air source that blows cooling air into the first inverter opening or the second inverter opening. In other words, the air source for cooling the motor inside the motor housing and the air source for cooling the circuit module inside the inverter housing are shared. In this case, the entire device can be made smaller than when the air source for cooling the motor and the air source for cooling the circuit module are provided separately.

In some embodiments, the inverter housing is connected to the motor housing in a second direction intersecting the first direction, the shaft extends along the first direction, and the motor housing further includes a first motor opening through which another cooling air different from the cooling air can flow in or out, and a second motor opening through which the other cooling air can flow in or out, and when viewed along the second direction, the second inverter opening is disposed between the first motor opening and the second motor opening in the first direction, and at least a part of the motor may be disposed between the first motor opening and the second inverter opening in the first direction. In this case, as the cooling fan rotates, the cooling air that flows in from the first inverter opening passes through the circuit module and the heat dissipation member and flows from the second inverter opening into the inside of the motor housing. Also, as the cooling fan rotates, the other cooling air that flows in from the first motor opening passes through the motor and then merges with the cooling air from the inverter housing at the second inverter opening, and is discharged together with the cooling air from the second motor opening to the outside of the motor housing. Alternatively, the cooling air that flows in from the second motor opening as the cooling fan rotates is branched at the second inverter opening into cooling air that passes through the motor inside the motor housing and cooling air that passes through the circuit module and heat dissipation member inside the inverter housing, and each cooling air flows out from the first motor opening and the first inverter opening. In this way, if the cooling air is configured to merge or branch at the second inverter opening, the main heat source inside the inverter housing and the main heat source inside the motor housing can be efficiently cooled by the low-temperature cooling air before heat exchange with the main heat source inside the rotating machine. In this case, for example, the heat source inside the rotating machine can be cooled more efficiently than when the cooling air after heat exchange with the heat source inside the inverter housing is used directly to cool the heat source inside the motor housing. Therefore, with the above configuration, the cooling performance can be further improved.

According to some aspects of the present disclosure, an inverter device and a rotating machine are provided that can achieve both improved cooling performance and compact size.

FIG. 1 is a cross-sectional view showing a rotary machine according to an embodiment. FIG. 2 is a cross-sectional view showing an inverter device provided in the rotating machine of FIG. FIG. 3 is a cross-sectional view showing a rotary machine according to a modified example. Fig. 4(a) is a cross-sectional view showing a rotary machine according to a comparative example 1. Fig. 4(b) is a cross-sectional view showing a rotary machine according to a comparative example 2.

Embodiments of the present disclosure will be described below with reference to the drawings. In the description of the drawings, the same elements are given the same reference numerals, and duplicate descriptions will be omitted.

In this embodiment, a centrifugal blower 1 will be described as an example of a rotating machine. The centrifugal blower 1 is, for example, an air-cooled electric blower that draws in air and sends it out at a predetermined pressure. The centrifugal blower 1 includes a motor device 10 that rotates a shaft 2 to which an impeller is attached, and an inverter device 30 that supplies driving power to the motor device 10. The motor device 10 and the inverter device 30 are integrated and electrically connected to each other.

[Motor device]
The motor device 10 includes a motor 11, a cooling fan 13, and a motor housing 15 that houses the motor 11 and the cooling fan 13.

[Motor]
The motor 11 is, for example, a brushless AC motor. The motor 11 includes a rotor 11a fixed to the shaft 2 and a stator 11b surrounding the rotor 11a. The rotor 11a includes one or more magnets. The rotor 11a is rotatable around a rotation axis C together with the shaft 2. The rotation axis C is an axis connecting the rotation centers of the shaft 2. The stator 11b has multiple coils and an iron core. The stator 11b faces the rotor 11a with a gap therebetween. The stator 11b rotates the rotor 11a by generating a magnetic field around the shaft 2.

[Cooling fan]
The cooling fan 13 is attached to a first end 2a of the shaft 2 in the axial direction D1 (first direction) along which the rotation axis C extends, and rotates together with the shaft 2 around the rotation axis C. The cooling fan 13 is, for example, a centrifugal fan that draws in air from its center and exhausts it in a direction away from the rotation axis C. A second end 2b of the shaft 2 located on the opposite side to the first end 2a is rotatably supported by a bearing 14. A motor 11 is disposed in the center of the shaft 2 between the cooling fan 13 and the bearing 14. The cooling fan 13 is adjacent to the motor 11 in the axial direction D1 with a gap therebetween. The bearing 14 is disposed on the opposite side of the motor 11 from the cooling fan 13, and is adjacent to the motor 11 in the axial direction D1 with a gap therebetween.

[Motor housing]
The motor housing 15 includes a cylindrical side wall 16 extending along the axial direction D1 around the rotation axis C, a first end wall 17 closing a first end of the side wall 16 in the axial direction D1, and a second end wall 18 closing a second end of the side wall 16 in the axial direction D1. The side wall 16, the first end wall 17, and the second end wall 18 form an internal space that houses the motor 11 and the cooling fan 13. The internal space of the motor housing 15 has a motor space V11 in which the motor 11 is housed, and a fan space V13 in which the cooling fan 13 is housed.

The motor space V11 and the fan space V13 are separated by a partition wall 19 extending along a vertical direction D2 (second direction) perpendicular to the axial direction D1 inside the motor housing 15, and are adjacent to each other in the axial direction D1 across the partition wall 19. The partition wall 19 includes an insertion hole 19a that connects the motor space V11 and the fan space V13. The shaft 2 is inserted into the insertion hole 19a. The inner diameter of the insertion hole 19a is larger than that of the shaft 2. When the shaft 2 is inserted, the insertion hole 19a allows air to pass between the motor space V11 and the fan space V13. The insertion hole 19a faces the cooling fan 13 in the axial direction D1.

The first end wall 17 is disposed at a position facing the cooling fan 13 in the axial direction D1. The first end wall 17 includes an insertion hole 19a through which the first end 2a of the shaft 2 passes. An impeller (not shown) is attached near the first end of the shaft 2 extending from the insertion hole 19a to the outside of the motor housing 15. The second end wall 18 is disposed at a position facing the bearing 14 in the axial direction D1. The second end wall 18 includes an intake port A11 (first motor opening) that takes in outside air as cooling air. The intake port A11 is formed, for example, over the entire second end wall 18. The intake port A11 is provided with a dustproof air filter 18a. The air filter 18a covers, for example, the entire intake port A11. The air filter 18a allows outside air to pass through the intake port A11 while capturing dust. The second end wall 18 may be provided with a holding portion that holds the air filter 18a.

The side wall 16 includes a side wall portion 16a, a side wall portion 16b (first side wall portion), and a side wall portion 16c (second side wall portion). The side wall portion 16a is a portion of the side wall 16 located between the first end wall 17 and the partition wall 19 in the axial direction D1. The side wall portion 16b is a portion of the side wall 16 located between the partition wall 19 and the bearing 14 in the axial direction D1. The side wall portion 16c is a portion of the side wall 16 located between the bearing 14 and the second end wall 18 in the axial direction D1. The side wall portion 16b, the side wall portion 16c, the second end wall 18, and the partition wall 19 form the motor space V11. The side wall portion 16a, the first end wall 17, and the partition wall 19 form the fan space V13.

The side wall portion 16a protrudes from the side wall portion 16b in a direction away from the rotation axis C, forming a step with respect to the side wall portion 16a. An exhaust port A12 (second motor opening) is formed in the step of the side wall portion 16a with respect to the side wall portion 16b. The exhaust port A12 exhausts the cooling air that flows in from the intake port A11. The exhaust port A12 is provided with an air filter 16d having the same function as the air filter 16d described above. The side wall portion 16b includes an exhaust port A22 (second inverter opening) that is connected to the inside of the inverter device 30. The side wall portion 16c forms a step that protrudes from the side wall portion 16b in a direction away from the rotation axis C. The side wall portion 16c includes a cable insertion port 16e through which the power cable 49 described later can pass.

The exhaust port A22 is connected to the middle of the flow path of the cooling air G1 between the intake port A11 and the exhaust port A12. When viewed along the vertical direction D2, the exhaust port A22 is disposed between the intake port A11 and the exhaust port A12 in the axial direction D1. The motor 11 and the bearing 14 are disposed in the flow path of the cooling air G1 between the intake port A11 and the exhaust port A12. More specifically, the motor 11 and the bearing 14 are disposed in the flow path of the cooling air G1 between the exhaust port A22 and the exhaust port A12. When viewed along the vertical direction D2, the motor 11 and the bearing 14 are disposed between the exhaust port A22 and the exhaust port A12 in the axial direction D1. In this embodiment, the entire motor 11 is disposed between the exhaust port A22 and the exhaust port A12, but only a part of the motor 11 may be disposed between the exhaust port A22 and the exhaust port A12.

[Inverter device]
The inverter device 30 is arranged alongside the motor device 10 in a direction D2 perpendicular to the motor device 10. The inverter device 30 includes a circuit module 31, a heat dissipation member 33 for cooling the circuit module 31, and an inverter housing 35 that houses the circuit module 31 and the heat dissipation member 33.

[Circuit module]
The circuit module 31 includes a power semiconductor element 41 (functional element), a main circuit board 43 (board), a connection board 45, a power cable 47, and a power cable 49. The circuit module 31 may include a plurality of power semiconductor elements 41.

The power semiconductor element 41 receives an electrical signal from the outside and performs a desired electrical function. The power semiconductor element 41 is installed on the surface 51a of the partition wall 51 inside the inverter housing 35 and is connected to the back surface 43b of the main circuit board 43 so as to form an electrical circuit that performs a desired function. The power semiconductor element 41 is in contact with the surface 51a of the partition wall 51. The power semiconductor element 41 is, for example, a transistor or a diode. The power semiconductor element 41 shown in FIG. 1 is a so-called MOSFET (Metal Oxide Semiconductor Field Effect Transistor) that combines a field effect transistor with a metal oxide semiconductor. The MOSFET controls the current flowing between the source and drain by controlling the voltage between the gate and source. In other words, the MOSFET is a switching element. The power semiconductor element 41 is the main heat source that generates a large amount of heat during operation of the centrifugal blower 1.

The main circuit board 43 is, for example, a power board through which a large current flows. The main circuit board 43 is fixed to the surface 51a of the partition wall 51 by bolts or the like with a gap in the vertical direction D2 from the surface of the partition wall 51. The back surface 43b of the main circuit board 43 faces the surface 51a of the partition wall 51 in the vertical direction D2, sandwiching the power semiconductor element 41. Therefore, the power semiconductor element 41 is disposed between the back surface 43b of the main circuit board 43 and the surface 51a of the partition wall 51. The power semiconductor element 41 is, for example, in contact with the surface 51a of the partition wall 51 and is separated from the back surface 43b of the main circuit board 43. The power semiconductor element 41 may be in contact with the surface 51a of the partition wall 51 via a heat transfer member such as a heat dissipation sheet. The main circuit board 43 is electrically connected to the power semiconductor element 41 via the connection line 42. The connection board 45 is fixed to the inverter housing 35 with a gap in the vertical direction D2 from the surface 43a of the main circuit board 43. The connection board 45 is electrically connected to the main circuit board 43.

The power cable 47 is connected to the connection board 45. The power cable 47 is electrically connected to the power semiconductor element 41 via the connection board 45 and the main circuit board 43. The power cable 47 extends from the connection board 45 in the axial direction D1, is drawn out to the outside of the inverter housing 35, and is connected to an external power source. The power cable 47 supplies power supplied from the external power source to the power semiconductor element 41 via the connection board 45 and the main circuit board 43. The power cable 49 is connected to the surface 43a of the main circuit board 43. The power cable 49 is electrically connected to the power semiconductor element 41 via the main circuit board 43. The power cable 49 transmits power supplied from the power semiconductor element 41. The power cable 49 extends from the main circuit board 43, is drawn out to the outside of the inverter housing 35, and is connected to the motor device 10. The power cable 49 supplies power from the power semiconductor element 41 to the motor device 10.

In this way, the power cable 47, the connection board 45, the main circuit board 43, and the power cable 49 are directly or indirectly connected to the power semiconductor element 41 to form a path for transmitting large amounts of power. Therefore, the power cable 47, the connection board 45, the main circuit board 43, and the power cable 49 are also the main heat sources that generate large amounts of heat during operation of the centrifugal blower 1.

[Heat dissipation material]
The heat dissipation member 33 dissipates heat generated by the power semiconductor element 41. The heat dissipation member 33 is, for example, a heat sink having a plurality of fins. The heat dissipation member 33 may be another member having a heat dissipation function. The heat dissipation member 33 is installed on the back surface 51b of the partition wall 51 inside the inverter housing 35. The heat dissipation member 33 is in contact with the back surface 51b of the partition wall 51. The heat dissipation member 33 may be in contact with the back surface 51b of the partition wall 51 via a heat transfer member such as a heat dissipation sheet. The heat dissipation member 33 is disposed at a position facing the power semiconductor element 41 in the vertical direction D2 across the partition wall 51. That is, the heat dissipation member 33 is disposed at a position overlapping the power semiconductor element 41 in the vertical direction D2. The heat dissipation member 33 is thermally connected to the power semiconductor element 41 via the partition wall 51.

[Inverter case]
The inverter housing 35 is adjacent to the motor housing 15 in the vertical direction D2 and is connected to the motor housing 15 in the vertical direction D2. The inverter housing 35 includes a top wall 36 arranged on the opposite side of the side wall 16 from the motor device 10 in the vertical direction D2, a first end wall 37 arranged at a first end of the top wall 36 in the axial direction D1, and a second end wall 38 arranged at a second end of the top wall 36 in the axial direction D1. Furthermore, the inverter housing 35 shares the side wall 16 of the motor housing 15. The side wall 16 functions as a bottom wall of the inverter housing 35. The side wall 16 constitutes the inverter housing 35 together with the top wall 36, the first end wall 37, and the second end wall 38.

The side wall 16, the top wall 36, the first end wall 37, and the second end wall 38 form an internal space that houses the circuit module 31 and the heat dissipation member 33. The internal space of the inverter housing 35 has an inverter space V31 (first internal space) that houses the circuit module 31, and a heat dissipation space V33 (second internal space) that houses the heat dissipation member 33. The inverter space V31 and the heat dissipation space V33 are separated by a partition wall 51 that extends along the axial direction D1 inside the motor housing 15, and are adjacent to each other in the vertical direction D2 across the partition wall 51. The partition wall 51 is disposed between the side wall 16 and the top wall 36. The partition wall 51 includes a back surface 51b that faces the side wall 16 in the vertical direction D2, and a front surface 51a that faces the opposite side to the side wall 16. Furthermore, the partition wall 51 includes a through hole A23 that penetrates in the vertical direction D2 from the front surface 51a to the back surface 51b. The through hole A23 connects the inverter space V31 and the heat dissipation space V33.

The first end wall 37 includes a first end wall portion 37a and a second end wall portion 37b. The first end wall portion 37a is a portion of the first end wall 37 located between the top wall 36 and the partition wall 51 in the vertical direction D2. The second end wall portion 37b is a portion of the first end wall 37 located between the partition wall 51 and the side wall 16 in the vertical direction D2. The second end wall portion 37b forms a step recessed toward the second end wall 38 in the axial direction D1 relative to the first end wall portion 37a. The second end wall portion 37b extends from the first end wall portion 37a in the vertical direction D2 and is connected to the side wall portion 16b of the side wall 16. The second end wall portion 37b faces the exhaust port A12 of the motor housing 15 in the axial direction D1 with a gap therebetween. The second end wall 38 extends from the top wall 36 in the vertical direction D2 and is connected to the side wall portion 16c of the side wall 16.

The top wall 36, the first end wall portion 37a, the second end wall 38, and the partition wall 51 form an inverter space V31. The side wall 16, the second end wall portion 37b, the second end wall 38, and the partition wall 51 form a heat dissipation space V33. The power cable 47 is disposed at a position closer to the first end wall 37 than the second end wall 38 in the axial direction D1, and the power cable 49 is disposed at a position closer to the second end wall 38 than the first end wall 37 in the axial direction D1. The power semiconductor element 41 is disposed in the center between the first end wall 37 and the second end wall 38 in the axial direction D1.

The first end wall portion 37a includes an intake port A21 (first inverter opening) that takes in outside air as cooling air G2. The intake port A21 is formed, for example, in a part of the first end wall portion 37a. The intake port A21 is provided with an air filter 37c for dust prevention. The air filter 37c covers, for example, at least a part of the intake port A21. The air filter 37c has the same function as the air filter 18b described above. A power cable 47 is drawn out from the intake port A21. Therefore, the air filter 37c covers the other parts of the intake port A21 except for the part through which the power cable 47 passes. The power cable 47 drawn out from the intake port A21 to the outside of the inverter housing 35 is connected to an external power source. The side wall portion 16b of the side wall 16 includes an exhaust port A22 as described above. The exhaust port A22 exhausts the cooling air G2 drawn in from the intake port A21. The exhaust port A22 is formed, for example, at a position adjacent to the second end wall portion 37b in the axial direction D1.

2, the through hole A23 connecting the inverter space V31 and the heat dissipation space V33 is located in a region R2 opposite to the region R1 in which the intake port A21 and the exhaust port A22 are located, based on the position P of the power semiconductor element 41 in the axial direction D1. The position P of the power semiconductor element 41 is, for example, the position of the center of the power semiconductor element 41 in the axial direction D1. The region R1 is a region of the inverter housing 35 from the first end wall 37 in the axial direction D1 to the position P. The region R2 is a region of the inverter housing 35 from the second end wall 38 in the axial direction D1 to the position P. For example, the through hole A23 is formed in a position away from the main circuit board 43 in the axial direction D1 in the region R2. In one example, the through hole A23 is formed in a position adjacent to the second end wall 38. When viewed along the vertical direction D2, the through hole A23 is disposed between the main circuit board 43 and the second end wall 38 in the axial direction D1.

The through hole A23 is, for example, a circular hole penetrating the bulkhead 51 in the vertical direction D2. The power cable 49 extending from the main circuit board 43 is inserted into the through hole A23. The inner diameter of the through hole A23 is larger than the outer diameter of the power cable 49. In other words, the cross-sectional area of the through hole A23 is larger than the cross-sectional area of the power cable 49. When the power cable 49 is inserted into the through hole A23, air (cooling air G2) passes between the inverter space V31 and the heat dissipation space V33. The cross-sectional area of the through hole A23 means the area of the through hole A23 in a plane perpendicular to the vertical direction D2 in which the through hole A23 extends. The cross-sectional area of the power cable 49 means the area of the power cable 49 in a plane perpendicular to the vertical direction D2.

The power cable 49 includes a first extension portion 49a connected to the main circuit board 43, a second extension portion 49b passing through the through hole A23, and a bent portion 49c disposed between the first extension portion 49a and the second extension portion 49b. The first extension portion 49a extends from the main circuit board 43 toward the second end wall 38 along the axial direction D1. The second extension portion 49b extends from the main circuit board 43 toward the second end wall 38 along the vertical direction D2 at a position away from the axial direction D1. The bent portion 49c connects the first extension portion 49a and the second extension portion 49b while bending.

The power cable 49 drawn from the through hole A23 to the heat dissipation space V33 is drawn to the outside of the inverter housing 35 from a cable insertion port 16e formed in the side wall portion 16c. The cable insertion port 16e is located in an area R2 opposite the area R1 in which the exhaust port A22 is located, across the position P of the power semiconductor element 41. The cable insertion port 16e is formed, for example, in a position facing the through hole A23 in the vertical direction D2. In other words, the cable insertion port 16e is arranged so as to overlap with the through hole A23 in the vertical direction D2. The cable insertion port 16e overlapping with the through hole A23 in the vertical direction D2 means that at least a part of the cable insertion port 16e overlaps with at least a part of the through hole A23 when viewed along the vertical direction D2.

The cable insertion port 16e is, for example, a circular hole through which the power cable 49 can pass. The cross-sectional area of the cable insertion port 16e is the same as the cross-sectional area of the power cable 49. The cross-sectional area of the cable insertion port 16e is smaller than the cross-sectional area of the through hole A23 through which the power cable 49 and the cooling air G2 pass. The cross-sectional area of the cable insertion port 16e is also smaller than the cross-sectional area of the exhaust port A22, for example. As described above, the side wall portion 16c in which the cable insertion port 16e is formed forms a step that protrudes in a direction approaching the partition wall 51 with respect to the side wall portion 16b in which the exhaust port A22 is formed. In other words, the side wall portion 16b forms a step that is recessed in a direction away from the partition wall 51 with respect to the side wall portion 16c. Therefore, the width W1 in the vertical direction D2 between the side wall portion 16b and the back surface 51b of the partition wall 51 is greater than the width W2 in the vertical direction D2 between the side wall portion 16c and the back surface 51b of the partition wall 51.

The power cable 49 extending from the through hole A23 in the vertical direction D2 continues to extend in the vertical direction D2 and passes through the cable insertion port 16e. The power cable 49 that passed through the cable insertion port 16e is drawn out to the motor space V11 of the motor housing 15 and connected to the stator 11b (see FIG. 1). For example, the power cable 49 that passed through the cable insertion port 16e is drawn out between the bearing 14 and the intake port A21 in the motor space V11, and then passes between the bearing 14 and the side wall portion 16b and is connected to the stator 11b. In this way, the power semiconductor element 41 is electrically connected to the motor 11 via the main circuit board 43 and the power cable 49. The motor 11 receives the power transmitted by the power cable 49 and rotates the shaft 2 around the rotation axis C.

[Action]
Next, the operation of the centrifugal blower 1 will be described with reference to FIG.

When power is supplied from the power semiconductor element 41 to the stator 11b through the power cable 49, a rotating magnetic field is generated between the stator 11b and the rotor 11a, causing the shaft 2 to rotate. When the impeller rotates with the rotation of the shaft 2, a main flow is sucked into the impeller housing that houses the impeller. When the centrifugal blower 1 is used for suction, air is sucked from a specified object to be sucked in. When the centrifugal blower 1 is used for blowing, the main flow sucked into the impeller housing passes through the diffuser and scroll and is blown to the specified object to be blown.

When the centrifugal blower 1 is in operation, the cooling fan 13 rotates together with the shaft 2. When the cooling fan 13 rotates, the motor housing 15 and the inverter housing 35 are sucked in through the exhaust port A12. As a result, the motor housing 15 and the inverter housing 35 are placed under negative pressure, and outside air is sucked into the motor housing 15 through the intake port A11 as cooling air G1, and outside air is sucked into the inverter housing 35 through the intake port A21 as cooling air G2.

The cooling air G2 sucked into the inverter space V31 of the inverter housing 35 from the intake port A21 comes into contact with the power cable 47, the main circuit board 43, the connection board 45, the power semiconductor element 41, and the power cable 49. This cools the circuit module 31. The cooling air G2 then flows through the through hole A23 into the heat dissipation space V33. This causes the power cable 49 to be cooled by the cooling air G2 even in the through hole A23. The cooling air G2 that flows into the heat dissipation space V33 comes into contact with the heat dissipation member 33. This causes the power semiconductor element 41 to be further cooled via the heat dissipation member 33. The cooling air G2 that has passed through the heat dissipation member 33 is sucked into the inside of the motor housing 15 from the exhaust port A22.

The inverter space V31 is a space extending from the intake port A21 to the through hole A23 along the axial direction D1. The inverter space V31 functions as a first cooling flow path that passes the cooling air G2 sucked in from the intake port A21 through the through hole A23. The through hole A23 is a space extending along the vertical direction D2 between the inverter space V31 and the heat dissipation space V33. The through hole A23 functions as a second cooling flow path that transfers the cooling air G2 flowing through the inverter space V31 to the heat dissipation space V33. The heat dissipation space V33 is a space extending from the through hole A23 to the exhaust port A22 along the axial direction D1. The through hole A23 functions as a third cooling flow path that exhausts the cooling air G2 that has passed through the through hole A23 from the exhaust port A22. The inverter space V31, the through hole A23, and the heat dissipation space V33 form a flow path that runs from the intake port A21 through the through hole A23 back to the exhaust port A22.

The cooling air G1 sucked into the motor space V11 of the motor housing 15 from the intake port A11 comes into contact with the power cable 49, the bearing 14, and the motor 11. This cools the power cable 49, the bearing 14, and the motor 11. The cooling air G1 that passes through the bearing 14 flows between the stator 11b and the rotor 11a and reaches the exhaust port A22 that connects to the inside of the inverter housing 35. At the exhaust port A22, the cooling air G1 merges with the cooling air G2 discharged from the inverter housing 35. The merged cooling air G3 flows toward the shaft 2 to which the cooling fan 13 is attached, and flows into the fan space V13 through the insertion hole 19a formed in the partition wall 19. The cooling air G3 that flows into the fan space V13 is caused to flow by the cooling fan 13 in a direction away from the rotation axis C, and is discharged to the outside of the motor housing 15 through the exhaust port A12.

The motor space V11 is a space extending in the axial direction D1 from the intake port A11 to the partition wall 19. The motor space V11 functions as a fourth cooling flow path that allows the cooling air G1 drawn in from the intake port A11 to reach the exhaust port A22. Furthermore, the motor space V11 functions as a fifth cooling flow path that allows the cooling air G1 drawn in from the intake port A11 to merge with the cooling air G2 from the inverter housing 35 at the exhaust port A22 and pass through the cooling fan 13. The fan space V13 functions as a sixth cooling flow path that allows the cooling air G3 that has passed through the cooling fan 13 to be discharged from the exhaust port A12.

When the centrifugal blower 1 is in operation, the motor 11 and bearings 14, etc., also generate heat as heat sources, but the motor 11 and bearings 14 are cooled by the cooling air G1 flowing through the motor space V11. As described above, in the inverter device 30, the power semiconductor element 41, the power cable 47, the connection board 45, the main circuit board 43, and the power cable 49 are heat sources, but these are cooled by the cooling air G2. The power semiconductor element 41 is further cooled by the cooling air G2 via the heat dissipation member 33. Therefore, in this embodiment, all of the above-mentioned heat sources are cooled directly or indirectly.

＜Effects＞
The effects obtained by the inverter device 30 and the centrifugal blower 1 described above will be described together with problems of the comparative example.

4A includes a circuit module 131 including a power semiconductor element 141, a substrate 143, a power cable 147, and a power cable 149, a heat dissipation member 133 thermally connected to the power semiconductor element 141, and an inverter housing 135 that houses the circuit module 131 and the heat dissipation member 133. The internal space of the inverter housing 135 is divided into an inverter space V131 in which the circuit module 131 is housed, and a heat dissipation space V133 in which the heat dissipation member 133 is housed. The inverter housing 135 includes an intake port A121 connected to the heat dissipation space V133, and an exhaust port A122 connected to the heat dissipation space V133 on the opposite side to the intake port A121. A cooling fan 113 that sends cooling air G101 to the heat dissipation space V133 is installed in the intake port A121. In this case, the cooling air G101 comes into contact with the heat dissipation member 133, and thereby the power semiconductor element 141 can be cooled through the heat dissipation member 133. However, in the inverter device 130, it is difficult to sufficiently cool other components such as the board 143 and the power cables 147 and 149, which may generate a large amount of heat in response to the heat generated by the power semiconductor element 141.

The inverter device 230 shown in FIG. 4B includes an inverter housing 235 instead of the inverter housing 135 of the inverter device 130. In addition to the intake port A121 and the exhaust port A122, the inverter housing 235 includes an intake port A221 connected to the inverter space V131 and an exhaust port S222 connected to the inverter space V131 on the opposite side to the intake port A221. Furthermore, a cooling fan 213 that sends cooling air G201 to the inverter space V131 is installed in the intake port A221. That is, in the inverter device 230, in addition to the cooling fan 113 that sends cooling air G101 to the heat dissipation space V133, another cooling fan 213 that sends cooling air G201 to the inverter space V131 is further installed. In this case, other members such as the board 143 and the power cables 147 and 149, including the power semiconductor element 141, can be directly cooled. However, installing multiple cooling fans 113, 213 in this way may result in the device as a whole becoming larger.

In contrast, in the inverter device 30 according to the present embodiment, the partition wall 51 separating the inverter space V31 connected to the intake port A21 from the heat dissipation space V33 connected to the exhaust port A22 includes a through hole A23 connecting the inverter space V31 and the heat dissipation space V33. The through hole A23 is disposed in the region R2 opposite the region R1 in which the intake port A21 and the exhaust port A22 are disposed, sandwiching the power semiconductor element 41 in the axial direction D1. Therefore, the cooling air G2 that flows from the intake port A21 into the inverter space V31 is turned back at the through hole A23 and passed to the heat dissipation space V33, and flows out from the exhaust port A22. In this way, the inverter space V31, the through hole A23, and the heat dissipation space V33 form a flow path for the cooling air G2 that turns back from the intake port A21 to the exhaust port A22 via the through hole A23. When such a return flow path is formed, the cooling air G2 can be sent to both the inverter space V31 and the heat dissipation space V33 using one air source. Therefore, in the inverter device 30, even if multiple cooling fans are not prepared to send the cooling air G2 to both the inverter space V31 and the heat dissipation space V33, both the circuit module 31 arranged in the inverter space V31 and the heat dissipation member 33 arranged in the heat dissipation space V33 can be sufficiently cooled, so that the entire device can be made compact while exhibiting sufficient cooling performance. Furthermore, in the inverter device 30, the power cable 49 included in the circuit module 31 is drawn from the inverter space V31 to the heat dissipation space V33 through the through hole A23. In this case, the power cable 49, which is one of the heat sources, can be effectively cooled, so that the cooling performance can be further improved. In this way, according to the inverter device 30 of this embodiment, both improved cooling performance and miniaturization can be achieved.

As in this embodiment, the power cable 49 may include a first extension portion 49a extending from the main circuit board 43 along the axial direction D1, a second extension portion 49b extending along a vertical direction D2 intersecting the axial direction D1 and passing through the through hole A23 to be drawn from the inverter space V31 to the heat dissipation space V33, and a bent portion 49c disposed between the first extension portion 49a and the second extension portion 49b and bent to connect the first extension portion 49a and the second extension portion 49b. In this case, the power cable 49 can be disposed so as to be aligned with the flow path through which the cooling air G2 flows, so that the power cable 49 can be more effectively cooled by the cooling air G2. This can further improve the cooling performance.

As in this embodiment, the inverter housing 35 includes a cable insertion port 16e through which the power cable 49 passes after being pulled out from the through hole A23 into the heat dissipation space V33, and the cable insertion port 16e may be formed at a position different from the exhaust port A22. In this case, the power cable 49 can be routed so as to follow the shortest possible path to the connection object to which the power cable 49 is connected, so that the power cable 49 can be prevented from becoming unnecessarily long compared to when the power cable 49 is pulled out from the exhaust port A22.

As in this embodiment, the side wall 16 includes a side wall portion 16b where the exhaust port A22 opens, and a side wall portion 16c where the cable insertion port 16e opens, and the side wall portion 16b may form a step that is recessed in a direction away from the partition wall 51 relative to the side wall portion 16c. In this case, a flow space for the cooling air G2 is secured between the partition wall 51 and the side wall portion 16b, and the heat dissipation member 33 can be placed in that space, thereby improving the cooling performance.

As in this embodiment, the cross-sectional area of the exhaust port A22 may be larger than the cross-sectional area of the cable insertion port 16e. In this case, the flow rate of the cooling air G2 flowing through the exhaust port A22 can be sufficiently secured, improving the cooling performance.

The centrifugal blower 1 according to this embodiment includes an inverter device 30 and a motor device 10 to which driving power is supplied from the inverter device 30. The motor device 10 includes a motor 11 electrically connected to a power cable 49 and capable of rotating a shaft 2 by receiving driving power supplied from the power cable 49, a cooling fan 13 attached to the shaft 2, and a motor housing 15 that houses the motor 11 and the cooling fan 13. The inside of the motor housing 15 is connected to the heat dissipation space V33 through the exhaust port A22, and the cooling fan 13 rotates together with the shaft 2 to cause cooling air G2 to flow into the intake port A21 through the exhaust port A22. In the centrifugal blower 1, the cooling fan 13 housed in the motor housing 15 is used as a blowing source that causes cooling air G2 to flow into the intake port A21. In other words, a common air source is used to cool the motor 11 and bearings 14 inside the motor housing 15, and a common air source is used to cool the circuit module 31 and heat dissipation member 33 inside the inverter housing 35. In this case, the entire device can be made smaller than when the air source for cooling the motor 11 and bearings 14 and the air source for cooling the circuit module 31 and heat dissipation member 33 are provided separately.

As in this embodiment, the inverter housing 35 is connected to the motor housing 15 in the vertical direction D2, the shaft 2 extends along the axial direction D1, the motor housing 15 includes an intake port A11 through which a cooling air G1 different from the cooling air G2 flows in, and an exhaust port A12 through which the cooling air G1 flows out, and when viewed along the vertical direction D2, the exhaust port A22 is disposed between the intake port A11 and the exhaust port A12 in the axial direction D1, and at least a part of the motor 11 may be disposed between the intake port A11 and the exhaust port A12 in the axial direction D1. In this case, as the cooling fan 13 rotates, the cooling air G2 that flows in from the intake port A21 passes through the circuit module 31 and the heat dissipation member 33 and flows from the exhaust port A22 into the inside of the motor housing 15. In addition, as the cooling fan 13 rotates, the cooling air G1 that flows in from the intake port A11 passes through the motor 11, merges with the cooling air G2 from the inverter housing 35 at the exhaust port A22, and is discharged together with the cooling air G2 from the exhaust port A12 to the outside of the motor housing 15. In this way, if the cooling air G1 and G2 are configured to merge at the exhaust port A22, the main heat source inside the inverter housing 35 and the main heat source inside the motor housing 15 can be efficiently cooled by the low-temperature cooling air G1 and G2 before heat exchange with the heat source inside the centrifugal blower 1. In this case, for example, the heat source inside the centrifugal blower 1 can be cooled more efficiently than when the cooling air after heat exchange with the heat source inside the inverter housing is used directly to cool the heat source inside the motor housing. Therefore, according to the above configuration, the cooling performance can be further improved.

The present disclosure can be implemented in various forms, including the above-described embodiment, with various modifications and improvements based on the knowledge of those skilled in the art. Modifications of the embodiments can be constructed by utilizing the technical matters described in the above-described embodiment.

<Modification>
For example, the flow direction of the cooling air G1, G2, G3 flowing inside the centrifugal blower 1A shown in FIG. 3 may be opposite to the flow direction of the cooling air G1, G2, G3 flowing inside the centrifugal blower 1 according to the above-mentioned embodiment. In the centrifugal blower 1A, the motor housing 15A of the motor device 10A includes an intake port A32 (second motor opening) for sucking in the cooling air G3 instead of the exhaust port A12 of the motor housing 15 described above. The motor housing 15A includes an exhaust port A31 (first motor opening) for discharging the cooling air G1 instead of the intake port A11 of the motor housing 15 described above. The inverter housing 35A of the inverter device 30A includes an intake port A42 (second inverter opening) for sucking in the cooling air G2 instead of the exhaust port A22 of the inverter housing 35 described above. The inverter housing 35A includes an exhaust port A41 (first inverter opening) that exhausts the cooling air G1, instead of the intake port A21 of the above-described inverter housing 35. The cooling fan 13A disposed inside the motor housing 15A is configured, for example, to exhaust air drawn in from its outer periphery to its center.

In the centrifugal blower 1A, the cooling air G3 flowing in from the intake port A32 as the cooling fan 13A rotates is branched at the intake port A42 into cooling air G1 passing through the motor 11 and bearings 14 inside the motor housing 15A, and cooling air G2 passing through the circuit module 31 and heat dissipation member 33 inside the inverter housing 35, and the cooling air G1 and G2 are discharged from the exhaust port A41 and exhaust port A31. In this way, even in a configuration in which the cooling air G1 and G2 are branched at the exhaust port A22, as in the above-mentioned embodiment, the main heat source inside the inverter housing 35 and the main heat source inside the motor housing 15 can be efficiently cooled by the low-temperature cooling air G1 and G2 before heat exchange with the heat source inside the centrifugal blower 1A. This can further improve the cooling performance.

In the above embodiment, a centrifugal blower is described as an example of the "rotating machine" of the present disclosure, but the "rotating machine" of the present disclosure may be a centrifugal compressor or an axial type blower or compressor. In the above embodiment, a centrifugal fan is described as an example of the "cooling fan" of the present disclosure, but the "cooling fan" may be another type of fan, such as an axial fan. In the above embodiment, a power semiconductor element is described as an example of the "functional element" of the present disclosure, but the "functional element" of the present disclosure may be a diode, a resistive element, or a capacitor. The "heat dissipation member" of the present disclosure may be a member other than a heat sink as long as it can dissipate heat from the "functional element". The "circuit module" of the present disclosure may further include elements other than the "functional element", the "substrate", and the "power cable".

<Additional Notes>
The present disclosure provides an inverter housing including: a first inverter opening through which cooling air can flow in or out; a second inverter opening formed at a position different from the first inverter opening through which the cooling air can flow in or out; and a partition wall separating a first internal space connected to the first inverter opening from a second internal space connected to the second inverter opening;
a circuit module disposed in the first internal space, the circuit module including a functional element, a substrate connected to the functional element, and a power cable connected to the substrate;
a heat dissipation member that is disposed in the second internal space, is thermally connected to the functional element via the partition wall, and is capable of dissipating heat generated by the functional element;
Equipped with
The partition wall includes a through hole connecting the first internal space and the second internal space,
the through hole is arranged in a region opposite to a region in which the first inverter opening and the second inverter opening are arranged, across the functional element, in a first direction along the partition wall, and is capable of transferring the cooling air between the first internal space and the second internal space,
The inverter device, wherein the power cable is drawn from the first internal space to the second internal space through the through hole.

The present disclosure provides, [2] "the power cable,
a first extension portion extending from the substrate along the first direction;
A second extension portion that extends along a second direction intersecting the first direction and passes through the through hole and is drawn from the first internal space to the second internal space;
A bending portion is disposed between the first extension portion and the second extension portion and is bent so as to connect the first extension portion and the second extension portion.
The inverter device according to [1].

The present disclosure further provides, [3] "the inverter housing includes a cable insertion port through which the power cable drawn from the through hole into the second internal space passes,
The cable insertion port is formed at a position different from the second inverter opening.
The inverter device according to the present invention is described in [1] or [2].

The present disclosure further provides, [4] "the second internal space is a space surrounded by the partition wall and a side wall facing the partition wall with a gap therebetween in a second direction intersecting the partition wall,
The side wall is
a first side wall portion in which the second inverter opening is opened;
a second side wall portion in which the cable insertion port is open,
The first side wall portion forms a step recessed in a direction away from the partition wall with respect to the second side wall portion.
The inverter device according to [3].

The present disclosure also provides, [5] "the area of the second inverter opening is larger than the area of the cable insertion opening;
The inverter device according to [4].

The present disclosure relates to [6] "an inverter device according to any one of [1] to [5],
a motor device to which drive power is supplied from the inverter device;
Equipped with
The motor device includes:
a motor electrically connected to the power cable and capable of rotating a shaft by receiving the driving power supplied from the power cable;
A cooling fan attached to the shaft;
a motor housing that houses the motor and the cooling fan;
the interior of the motor housing is connected to the second internal space through the second inverter opening,
The cooling fan rotates together with the shaft to cause the cooling air to flow into the first inverter opening or the second inverter opening.
Rotating machinery."

The present disclosure further provides, [7] "the inverter housing is connected to the motor housing in a second direction intersecting the first direction, and the shaft extends along the first direction;
The motor housing includes:
a first motor opening through which a cooling air different from the cooling air can flow in or out;
a second motor opening through which the other cooling air can flow in or out;
When viewed along the second direction, the second inverter opening is disposed between the first motor opening and the second motor opening in the first direction, and at least a portion of the motor is disposed between the first motor opening and the second inverter opening in the first direction.
The rotating machine according to [6].

1. Centrifugal blower (rotary machine)
2 Shaft 10, 10A Motor device 11 Motor 13 Cooling fan (air blowing source)
13A Cooling fan 15, 15A Motor housing 16 Side wall 16b Side wall portion (first side wall portion)
16c Side wall part (second side wall part)
16e Cable insertion port 30 Inverter device 31 Circuit module 33 Heat dissipation member 35, 35A Inverter housing 41 Power semiconductor element (functional element)
43 Main circuit board (board)
47, 49 Power cable 49a First extension portion 49b Second extension portion 49c Bending portion 51 Partition wall 143 Board A11 Air intake (first motor opening)
A12 Exhaust port (second motor opening)
A21 Air intake (first inverter opening)
A22 Exhaust port (second inverter opening)
A23 Through hole A31 Exhaust port (first motor opening)
A32 Intake port (second motor opening)
A41 Exhaust port (first inverter opening)
A42 Air intake (second inverter opening)
D1 Axial direction (first direction)
D2 Vertical direction (second direction)
G1, G2, G3 Cooling air R1, R2 Area V31 Inverter space (first internal space)
V33 Heat dissipation space (second internal space)

Claims (7)

an inverter housing including a first inverter opening through which cooling air can flow in or out, a second inverter opening formed at a position different from the first inverter opening and through which the cooling air can flow in or out, and a partition wall separating a first internal space connected to the first inverter opening from a second internal space connected to the second inverter opening;
a circuit module disposed in the first internal space, the circuit module including a functional element, a substrate connected to the functional element, and a power cable connected to the substrate;
a heat dissipation member that is disposed in the second internal space, is thermally connected to the functional element via the partition wall, and is capable of dissipating heat generated by the functional element;
Equipped with
The partition wall includes a through hole connecting the first internal space and the second internal space,
the through hole is arranged in a region opposite to a region in which the first inverter opening and the second inverter opening are arranged, across the functional element, in a first direction along the partition wall, and is capable of transferring the cooling air between the first internal space and the second internal space,
The power cable is pulled out from the first internal space to the second internal space through the through hole. The power cable includes:
a first extension portion extending from the substrate along the first direction;
A second extension portion that extends along a second direction intersecting the first direction and passes through the through hole and is drawn from the first internal space to the second internal space;
A bending portion is disposed between the first extension portion and the second extension portion and is bent so as to connect the first extension portion and the second extension portion.
The inverter device according to claim 1 . the inverter housing includes a cable insertion port through which the power cable passes after being drawn from the through hole into the second internal space,
The cable insertion port is formed at a position different from the second inverter opening.
The inverter device according to claim 1 or 2. the second internal space is a space surrounded by the partition wall and a side wall facing the partition wall with a gap therebetween in a second direction intersecting the partition wall,
The side wall is
a first side wall portion in which the second inverter opening is opened;
a second side wall portion in which the cable insertion port is open,
The first side wall portion forms a step recessed in a direction away from the partition wall with respect to the second side wall portion.
The inverter device according to claim 3 . The cross-sectional area of the second inverter opening is larger than the cross-sectional area of the cable insertion opening.
The inverter device according to claim 4. The inverter device according to claim 1 or 2;
a motor device to which drive power is supplied from the inverter device;
Equipped with
The motor device includes:
a motor electrically connected to the power cable and capable of rotating a shaft by receiving the driving power supplied from the power cable;
A cooling fan attached to the shaft;
a motor housing that houses the motor and the cooling fan;
the interior of the motor housing is connected to the second internal space through the second inverter opening,
The cooling fan rotates together with the shaft to cause the cooling air to flow into the first inverter opening or the second inverter opening.
Rotating machinery. the inverter housing is connected to the motor housing in a second direction intersecting the first direction, and the shaft extends along the first direction;
The motor housing includes:
a first motor opening through which a cooling air different from the cooling air can flow in or out;
a second motor opening through which the other cooling air can flow in or out;
When viewed along the second direction, the second inverter opening is disposed between the first motor opening and the second motor opening in the first direction, and at least a portion of the motor is disposed between the first motor opening and the second inverter opening in the first direction.
The rotary machine according to claim 6.

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