JP7592560B2 - Heat Treatment Equipment - Google Patents

Description

An embodiment of the present invention relates to a heat treatment device.

2. Description of the Related Art There are heat treatment devices that heat a workpiece to form a film or the like on the surface of the workpiece or to treat the surface of the workpiece.
For example, a heat treatment apparatus has been proposed in which a solution containing an organic material and a solvent is applied onto a substrate, and the applied solution is heated to form an organic film on the substrate. In such a heat treatment apparatus, for example, the internal space of a chamber may be reduced in pressure below atmospheric pressure, and the substrate coated with the solution may be heated to a temperature of about 100° C. to 600° C. in an atmosphere reduced in pressure below atmospheric pressure. In this case, a plurality of pin-shaped supports are provided inside the chamber, and the substrate coated with the solution is placed on the tops of the plurality of supports.

The substrate coated with the solution is heated to approximately 100°C to 600°C, so the multiple supports are made from a heat-resistant material. In this case, if the multiple supports are made from a metal such as stainless steel, scratches may occur on the back surface of the substrate where the multiple supports come into contact.

On the other hand, if the multiple support parts are made of ceramics or the like, it is possible to prevent scratches from occurring on the back surface of the substrate. However, if the multiple support parts are made of ceramics or the like, a new problem arises in that manufacturing costs increase.

Also, a support has been proposed that has a tip portion that contacts the rear surface of the substrate and a cylindrical base portion into which the tip portion is inserted (see, for example, Patent Document 1).
By using such a support portion, only the tip portion can be formed from ceramics, etc. Therefore, it is possible to prevent scratches from occurring on the back surface of the substrate and also to prevent an increase in manufacturing costs.

However, simply inserting the tip into the base may cause friction between the tip and base, resulting in the generation of particles. For example, if the tip is made of ceramics and the base is made of stainless steel, which is less expensive than ceramics, friction will occur between the tip and base due to the difference in linear expansion coefficient. This may result in particles being released from between the tip and base.

If the generated particles adhere to at least one of the solution and the formed organic film, the quality of the organic film may be degraded.
Therefore, there has been a demand for development of a heat treatment apparatus capable of reducing the cost of the supporting portion and suppressing generation of particles in the supporting portion.

JP 2006-170534 A

The problem that the present invention aims to solve is to provide a heat treatment device that can reduce the cost of the support part and suppress the generation of particles in the support part.

The heat treatment apparatus according to the embodiment includes a chamber, a support part provided inside the chamber and capable of supporting a workpiece, and a heating part provided inside the chamber and capable of heating the workpiece. The support part has a cylindrical shape and has a tip part whose one end can contact the workpiece, a columnar part whose one end side is provided inside the tip part with a gap therebetween, and a holding part that holds the tip part, the holding part has a first part provided on the tip part and a second part facing the first part with a gap therebetween, the first part and the second part are permanent magnets, and the magnetic pole of the first part facing the second part is the same as the magnetic pole of the second part facing the first part.

According to an embodiment of the present invention, a heat treatment device is provided that can reduce the cost of the support part and suppress the generation of particles in the support part.

1 is a schematic perspective view illustrating a heat treatment apparatus according to an embodiment of the present invention; 5A to 5C are schematic diagrams for illustrating a support portion. 10A to 10C are schematic views illustrating a support portion according to another embodiment. 10A to 10C are schematic views illustrating a support portion according to another embodiment.

Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.
In the following, as an example, a heat treatment apparatus for heating a workpiece in an atmosphere reduced in pressure below atmospheric pressure to form an organic film on the surface of the workpiece will be described. However, the present invention is not limited to this. For example, the present invention can also be applied to a heat treatment apparatus for heating a workpiece to form an inorganic film or the like on the surface of the workpiece or to treat the surface of the workpiece.

The workpiece before heating may, for example, have a substrate and a solution applied to the surface of the substrate, or may be only a substrate. In the following, as an example, a case where the workpiece before heating has a substrate and a solution applied to the surface of the substrate will be described.

FIG. 1 is a schematic perspective view illustrating a heat treatment apparatus 1 according to the present embodiment.
1, the X direction, the Y direction, and the Z direction represent three directions that are perpendicular to one another. In this specification, the up-down direction can be regarded as the Z direction.

Before being heated, the workpiece 100 has a substrate and a solution applied to the surface of the substrate.
The substrate is, for example, a glass substrate, a semiconductor wafer, etc. However, the substrate is not limited to the above examples.
The solution contains, for example, an organic material and a solvent. The organic material is not particularly limited as long as it can be dissolved by the solvent. The solution can be, for example, a varnish containing polyamic acid. However, the solution is not limited to the exemplified ones.

As shown in FIG. 1, the heat treatment apparatus 1 includes, for example, a chamber 10, an exhaust unit 20, a processing unit 30, a cooling unit 40, and a controller 50.
The chamber 10 has a box shape. The chamber 10 has an airtight structure capable of maintaining an atmosphere at a reduced pressure lower than atmospheric pressure. There is no particular limitation on the external shape of the chamber 10. The external shape of the chamber 10 may be, for example, a rectangular parallelepiped or a cylinder. The chamber 10 may be formed from a metal such as stainless steel.

For example, a flange 11 is provided at one end of the chamber 10. A seal 12 such as an O-ring can be provided on the flange 11. The opening on the side of the chamber 10 where the flange 11 is provided can be opened and closed by an opening/closing door 13. A drive device (not shown) presses the opening/closing door 13 against the flange 11 (seal 12), closing the opening of the chamber 10 so that it is airtight. A drive device (not shown) separates the opening/closing door 13 from the flange 11, allowing the workpiece 100 to be carried in or out through the opening of the chamber 10.

A flange 14 may be provided at the other end of the chamber 10. A seal material 12 such as an O-ring may be provided on the flange 14. The opening of the chamber 10 on the side where the flange 14 is provided can be opened and closed by a lid 15. For example, the lid 15 may be detachably attached to the flange 14 using a fastening member such as a screw. When performing maintenance, the lid 15 is removed to expose the opening of the chamber 10 on the side where the flange 14 is provided.

A cooling section 16 can be provided on the outer wall of the chamber 10. A cooling water supply section (not shown) is connected to the cooling section 16. The cooling section 16 can be, for example, a water jacket. If the cooling section 16 is provided, it is possible to prevent the temperature of the outer wall of the chamber 10 from becoming higher than a predetermined temperature.

The exhaust unit 20 evacuates the inside of the chamber 10. The exhaust unit 20 has a first exhaust unit 21 and a second exhaust unit 22.
The first exhaust unit 21 is connected to an exhaust port 17 provided on the bottom surface of the chamber 10. The first exhaust unit 21 includes an exhaust pump 21a and a pressure control unit 21b.
The exhaust pump 21a may be an exhaust pump that performs rough exhaust from atmospheric pressure to a predetermined pressure. Therefore, the exhaust pump 21a has a larger exhaust volume than the exhaust pump 22a described later. The exhaust pump 21a may be, for example, a dry vacuum pump.

The pressure control unit 21b is provided between the exhaust port 17 and the exhaust pump 21a. The pressure control unit 21b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10. The pressure control unit 21b can be, for example, an APC (Auto Pressure Controller).

The second exhaust unit 22 is connected to the exhaust port 18 provided on the bottom surface of the chamber 10. The second exhaust unit 22 includes an exhaust pump 22a and a pressure control unit 22b.
The exhaust pump 22a exhausts the air to a lower predetermined pressure after the rough exhaust by the exhaust pump 21a. The exhaust pump 22a has an exhaust capacity capable of exhausting the air to a molecular flow region of a high vacuum. For example, the exhaust pump 22a may be a turbo molecular pump (TMP).
The pressure control unit 22b is provided between the exhaust port 18 and the exhaust pump 22a. The pressure control unit 22b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10. The pressure control unit 22b can be, for example, an APC.

Exhaust port 17 and exhaust port 18 are disposed on the bottom surface of chamber 10. Therefore, a downflow airflow toward the bottom surface of chamber 10 is formed inside chamber 10 and inside processing section 30 described below. When a downflow airflow is formed, sublimates containing organic materials that are generated when workpiece 100 is heated are carried by the downflow airflow and discharged to the outside of chamber 10. Therefore, it is possible to prevent foreign matter such as sublimates from adhering to workpiece 100.

In the above, the case where the exhaust port 17 and the exhaust port 18 are provided on the bottom surface of the chamber 10 has been exemplified, but the exhaust port 17 and the exhaust port 18 can also be provided on, for example, the ceiling surface or side surface of the chamber 10. If the exhaust port 17 and the exhaust port 18 are provided on the bottom surface or the ceiling surface of the chamber 10, an airflow can be formed inside the chamber 10 that flows toward the bottom surface or the ceiling surface of the chamber 10.

The processing section 30 includes, for example, a frame 31 , a heating section 32 , a support section 33 , a heat equalizing section 34 , a heat equalizing plate support section 35 , and a cover 36 .
The processing section 30 is provided with a processing region 30a and a processing region 30b. The processing regions 30a and 30b are spaces in which the workpiece 100 is processed. The workpiece 100 is supported inside the processing regions 30a and 30b. The processing region 30b is provided above the processing region 30a. Note that, although the case where two processing regions are provided is illustrated, the present invention is not limited to this. Only one processing region may be provided, or three or more processing regions may be provided. In the present embodiment, the case where two processing regions are provided is illustrated as an example, but the case where one processing region and three or more processing regions are provided may be considered in the same manner.

The processing areas 30a and 30b are provided between the heating sections 32. The processing areas 30a and 30b are surrounded by the heat equalizing section 34 (upper heat equalizing plate 34a, lower heat equalizing plate 34b, side heat equalizing plate 34c, side heat equalizing plate 34d).

As described below, the upper heat equalizer plate 34a and the lower heat equalizer plate 34b are plate-shaped and supported by a number of heat equalizer plate supports 35. The processing area 30a and the space inside the chamber 10 are connected via the gaps between the upper heat equalizer plates 34a and the gaps between the lower heat equalizer plates 34b. Therefore, when the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the space inside the processing area 30a is also reduced. Note that the processing area 30b has a similar structure to the processing area 30a, so a description thereof will be omitted.

If the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the heat released from the processing regions 30a, 30b to the outside can be suppressed. In other words, the heating efficiency and heat storage efficiency can be improved. Therefore, the power applied to the heater 32a described below can be reduced. If the power applied to the heater 32a can be reduced, the temperature of the heater 32a can be prevented from exceeding a predetermined temperature, and the life of the heater 32a can be extended.

In addition, if the heat storage efficiency is improved, the temperature of the processing regions 30a, 30b can be increased quickly. This makes it possible to handle processing that requires a rapid increase in temperature. In addition, since the temperature of the outer wall of the chamber 10 can be prevented from becoming too high, the cooling section 16 can be simplified.

The frame 31 has a framework structure using, for example, elongated plate materials or steel sections. The external shape of the frame 31 can be the same as the external shape of the chamber 10. The external shape of the frame 31 can be, for example, a rectangular parallelepiped.

A plurality of heating sections 32 are provided. The heating sections 32 can be provided in the lower and upper parts of the processing regions 30a and 30b. The heating sections 32 provided in the lower parts of the processing regions 30a and 30b are lower heating sections. The heating sections 32 provided in the upper parts of the processing regions 30a and 30b are upper heating sections. The lower heating sections face the upper heating sections. When a plurality of processing regions are provided stacked in the vertical direction, the upper heating section provided in the lower processing region can also serve as the lower heating section provided in the upper processing region.

The heating unit 32 is provided inside the chamber 10 and heats the workpiece 100 .
For example, the back surface (lower surface) of the workpiece 100 supported in the processing region 30a is heated by a heating unit 32 provided below the processing region 30a. The front surface (upper surface) of the workpiece 100 supported in the processing region 30a is heated by a heating unit 32 shared by the processing regions 30a and 30b.

The back surface of the workpiece 100 supported in the processing region 30b is heated by a heating unit 32 shared by the processing regions 30a and 30b. The front surface of the workpiece 100 supported in the processing region 30b is heated by a heating unit 32 provided above the processing region 30b.
In this way, the number of heating parts 32 can be reduced, which leads to reduction in power consumption, reduction in manufacturing costs, and space saving.

Each of the multiple heating units 32 has at least one heater 32a and a pair of holders 32b. In the following, a case where multiple heaters 32a are provided will be described. The heater 32a is rod-shaped and extends in the Y direction between the pair of holders 32b. The multiple heaters 32a can be arranged side by side in the X direction. The multiple heaters 32a can be arranged at equal intervals. The heaters 32a are, for example, sheath heaters, far-infrared heaters, far-infrared lamps, ceramic heaters, cartridge heaters, etc. In addition, the various heaters can be covered with a quartz cover.

In this specification, the term "rod-shaped heater" includes various heaters covered with a quartz cover. There is no limitation on the external shape of the "rod" and it can be, for example, cylindrical or prismatic.

The heater 32a is not limited to the above-mentioned type as long as it can heat the workpiece 100 in an atmosphere that is reduced in pressure below atmospheric pressure. In other words, the heater 32a may be one that utilizes thermal energy by radiation.

The specifications, number, spacing, etc. of the multiple heaters 32a in the upper heating section and the lower heating section can be changed as appropriate depending on the composition of the solution to be heated (heating temperature of the solution), the size of the workpiece 100, etc. The specifications, number, spacing, etc. of the multiple heaters 32a can be appropriately determined by performing simulations, experiments, etc.

The workpiece 100 is heated from both sides in the processing regions 30a and 30b via the upper heat equalizer plate 34a and the lower heat equalizer plate 34b. Here, the vapor containing the sublimates generated when the solution is heated tends to adhere to objects whose temperature is lower than that of the workpiece 100 to be heated. However, since the upper heat equalizer plate 34a and the lower heat equalizer plate 34b are heated, the adhesion of the sublimates to the upper heat equalizer plate 34a and the lower heat equalizer plate 34b is suppressed. In addition, the sublimates are discharged outside the chamber 10 by riding on the downflow air current described above. Therefore, the adhesion of the sublimates to the workpiece 100 can be suppressed.

The pair of holders 32b extend in the X direction (e.g., the longitudinal direction of the processing regions 30a and 30b). The pair of holders 32b face each other in the Y direction. One holder 32b is fixed to the end face of the frame 31 on the opening/closing door 13 side. The other holder 32b is fixed to the end face of the frame 31 opposite the opening/closing door 13 side. The pair of holders 32b are fixed to the frame 31 using fastening members such as screws. The pair of holders 32b hold non-heat generating parts near the ends of the heater 32a. The pair of holders 32b are formed, for example, from elongated metal plates or shaped steel. The material of the pair of holders 32b can be, for example, stainless steel.

The multiple support parts 33 are provided inside the chamber 10 and support the workpiece 100. For example, the multiple support parts 33 support the workpiece 100 between an upper heating part and a lower heating part. The multiple support parts 33 are provided below the processing region 30a and below the processing region 30b. The number, arrangement, spacing, etc. of the multiple support parts 33 can be appropriately changed depending on the size, rigidity (deflection), etc. of the workpiece 100.
The support portion 33 will be described in detail later.

The heat equalizing section 34 has a plurality of upper heat equalizing plates 34a, a plurality of lower heat equalizing plates 34b, a plurality of side heat equalizing plates 34c, and a plurality of side heat equalizing plates 34d. The plurality of upper heat equalizing plates 34a, the plurality of lower heat equalizing plates 34b, the plurality of side heat equalizing plates 34c, and the plurality of side heat equalizing plates 34d are plate-shaped.

The upper heat equalizing plates 34a are provided on the lower heating section side (workpiece 100 side) in the upper heating section. The upper heat equalizing plates 34a are provided at a distance from the heaters 32a. The upper heat equalizing plates 34a are arranged in a line in the X direction. Gaps are provided between the upper heat equalizing plates 34a. The provision of gaps makes it possible to absorb the increase in dimensions of the upper heat equalizing plates 34a due to thermal expansion. This makes it possible to prevent the upper heat equalizing plates 34a from interfering with each other and causing deformation. In addition, as described above, the pressure of the atmosphere in the processing regions 30a and 30b can be reduced through these gaps.

The lower heat equalizing plates 34b are provided on the upper heating section side (workpiece 100 side) in the lower heating section. The lower heat equalizing plates 34b are provided at a distance from the heaters 32a. The lower heat equalizing plates 34b are arranged in the X direction. A gap is provided between the lower heat equalizing plates 34b. If a gap is provided, the increase in the dimensions of the lower heat equalizing plates 34b due to thermal expansion can be absorbed. Therefore, it is possible to prevent the lower heat equalizing plates 34b from interfering with each other and causing deformation. In addition, as described above, the pressure of the atmosphere in the processing regions 30a and 30b can be reduced through this gap. In addition, a hole is provided in a part of the lower heat equalizing plate 34b to prevent interference with the support part 33.

The side heat equalizing plates 34c are provided on both sides of the processing regions 30a and 30b in the X direction. The side heat equalizing plates 34c may be provided inside the cover 36. At least one heater 32a may be provided between the side heat equalizing plates 34c and the cover 36.
The side heat equalizing plates 34d are provided on both sides of the processing regions 30a, 30b in the Y direction.

As described above, the heaters 32a are rod-shaped and arranged at a predetermined interval. When the heaters 32a are rod-shaped, heat is radiated radially from the central axis of the heaters 32a. In this case, the shorter the distance between the central axis of the heaters 32a and the heated part, the higher the temperature of the heated part. Therefore, when the workpiece 100 is held so as to face the heaters 32a, the area of the workpiece 100 located directly above or below the heaters 32a has a higher temperature than the area of the workpiece 100 located directly above or below the space between the heaters 32a. In other words, when the workpiece 100 is directly heated using the heaters 32a that are rod-shaped, the in-plane temperature distribution of the heated workpiece 100 varies.

If there is a distribution of temperature across the surface of the workpiece 100, the quality of the formed organic film may be reduced. For example, bubbles may be generated in areas where the temperature is high, and the composition of the organic film may change.

If multiple upper heat equalizing plates 34a and multiple lower heat equalizing plates 34b are provided, the heat radiated from the multiple heaters 32a is incident on the multiple upper heat equalizing plates 34a and multiple lower heat equalizing plates 34b. The heat incident on the multiple upper heat equalizing plates 34a and multiple lower heat equalizing plates 34b is radiated toward the workpiece 100 while propagating inside them in the planar direction. This makes it possible to suppress the occurrence of in-plane distribution in the temperature of the workpiece 100, and ultimately improves the quality of the organic film that is formed.

The upper heat equalizing plates 34a and the lower heat equalizing plates 34b are preferably made of a material with high thermal conductivity. These materials can be, for example, aluminum, copper, stainless steel, etc. When using a material that is easily oxidized, such as aluminum or copper, a layer containing a material that is less likely to oxidize can be provided on the surface.

A part of the heat radiated from the multiple upper heat equalizer plates 34a and the multiple lower heat equalizer plates 34b is directed toward the side of the processing area. Therefore, the side heat equalizer plates 34c and 34d described above are provided on the sides of the processing area. The heat incident on the side heat equalizer plates 34c and 34d is propagated in the planar direction of the side heat equalizer plates 34c and 34d, and a part of it is radiated toward the workpiece 100. Therefore, the heating efficiency of the workpiece 100 can be improved.
The material of the side heat equalizing plates 34c, 34d can be the same as the material of the upper heat equalizing plate 34a and the lower heat equalizing plate 34b described above.

In the above, an example has been given in which multiple upper heat equalizing plates 34a and multiple lower heat equalizing plates 34b are provided, but at least one of the upper heat equalizing plates 34a and the lower heat equalizing plates 34b can also be a single plate-shaped member.

The multiple heat equalizer plate support parts 35 are arranged in the X direction. The heat equalizer plate support parts 35 are arranged directly below and between the upper heat equalizer plates 34a in the X direction. The multiple heat equalizer plate support parts 35 are fixed to a pair of holders 32b using fastening members such as screws. The pair of heat equalizer plate support parts 35 detachably support both ends of the upper heat equalizer plate 34a. The multiple heat equalizer plate support parts 35 supporting the multiple lower heat equalizer plates 34b can also have a similar configuration.

If the upper heat equalizer plate 34a and the lower heat equalizer plate 34b are supported by a pair of heat equalizer plate supports 35, the dimensional difference caused by thermal expansion can be absorbed. Therefore, deformation of the upper heat equalizer plate 34a and the lower heat equalizer plate 34b can be suppressed.

The cover 36 is plate-shaped and covers the top, bottom, and side surfaces of the frame 31. That is, the inside of the frame 31 is covered by the cover 36. However, the cover 36 on the opening/closing door 13 side may be provided on the opening/closing door 13, for example.
The cover 36 surrounds the processing regions 30 a and 30 b, but there are gaps at the boundaries between the top and sides of the frame 31 , between the sides and bottom of the frame 31 , and near the opening and closing door 13 .

The cover 36 provided on the top and bottom surfaces of the frame 31 is divided into multiple pieces. Gaps are provided between the divided covers 36. That is, the internal space of the processing section 30 (processing regions 30a and 30b) is connected to the internal space of the chamber 10 through these gaps. Therefore, the pressure in the processing regions 30a and 30b can be made the same as the pressure in the space between the inner wall of the chamber 10 and the cover 36. The cover 36 is made of, for example, stainless steel.

The cooling unit 40 supplies cooling gas to the space in which the multiple heaters 32a are provided. The cooling unit 40 may also supply cooling gas to the processing areas 30a, 30b. The cooling unit 40 cools the soaking area 34 surrounding the processing areas 30a, 30b with the cooling gas. By cooling the soaking area 34, the workpiece 100 in a high temperature state is indirectly cooled. In addition, by cooling the soaking area 34, the heat of the soaking area 34 can be prevented from being transferred to the workpiece 100. When the cooling gas is supplied to the processing areas 30a, 30b, the workpiece 100 in a high temperature state is directly cooled.

The cooling section 40 is not necessarily required and can be omitted. However, if the cooling section 40 is provided, the cooling time of the workpiece 100 can be shortened. In addition, when the workpiece 100 is cooled, the heat from the soaking section 34 can suppress the occurrence of in-plane distribution in the temperature of the workpiece 100.

The cooling section 40 includes a nozzle 41 , a gas source 42 , and a gas control section 43 .
The nozzle 41 is connected to a space in which a plurality of heaters 32a are provided. When cooling gas is supplied to the processing regions 30a and 30b, the nozzle 41 is connected to the processing regions 30a and 30b. The nozzle 41 is attached to, for example, a hole provided in the side heat equalizer plate 34c, the frame 31, or the cover 36. The nozzle 41 can be provided, for example, on one side of the processing section 30 in the X direction, or on both sides of the processing section 30. The number and arrangement of the nozzles 41 can be changed as appropriate.

The gas source 42 supplies cooling gas to the nozzle 41. The gas source 42 can be, for example, a high-pressure gas cylinder or factory piping. In addition, multiple gas sources 42 can be provided.

The cooling gas may be a gas that does not easily react with the heated workpiece 100. The cooling gas may be, for example, nitrogen gas, carbon dioxide gas (CO ₂ ), or a rare gas. The rare gas may be, for example, argon gas or helium gas. The temperature of the cooling gas may be, for example, room temperature (for example, 25° C.) or lower.

The gas control unit 43 is provided between the nozzle 41 and the gas source 42. The gas control unit 43 can, for example, supply the cooling gas, stop the supply, and control at least one of the flow rate and flow rate of the cooling gas.

The controller 50 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer. The controller 50 controls the operation of each element provided in the heat treatment device 1 based on a control program stored in the storage unit.

Next, the multiple support portions 33 will be further described.
When forming an organic film, the workpiece 100 having the substrate and the solution applied to the surface of the substrate is heated, for example, to about 100°C to 600°C. For this reason, the support portion 33 is formed from a heat-resistant material. For example, the support portion can be formed from a metal such as stainless steel. However, doing so may cause scratches on the back surface of the substrate with which the support portion comes into contact. The support portion can also be formed from ceramics or the like. If the support portion is formed from ceramics or the like, it is possible to prevent scratches from occurring on the back surface of the substrate. However, doing so increases the manufacturing cost.

In this case, the tip of the support, which comes into contact with the back surface of the substrate, can be made of ceramics or the like, and the base that holds the tip can be made of a metal such as stainless steel. However, if the tip and base are made of different materials, friction occurs between the tip and base due to the difference in linear expansion coefficient. This can cause particles to be released from between the tip and base. If the generated particles adhere to the workpiece 100, the quality of the workpiece 100 may be reduced.

Therefore, the support portion 33 according to this embodiment has the configuration described below.
FIG. 2 is a schematic diagram illustrating the support portion 33. As shown in FIG.
As shown in FIG. 2, the support portion 33 has, for example, a tip portion 33a, a base portion 33b, and a holding portion 33c.

The tip 33a is cylindrical, with one end 33a1 (the end on the back side of the workpiece 100) closed. The end 33a1 comes into contact with the back side of the workpiece 100. For this reason, it is preferable that the shape of the end 33a1 is hemispherical or the like. If the shape of the end 33a1 is hemispherical, damage to the back side of the workpiece 100 can be suppressed. In addition, since the contact area between the back side of the workpiece 100 and the tip 33a can be reduced, the heat transferred from the workpiece 100 to the support portion 33 can be reduced.

The other end 33a2 of the tip 33a is open. In addition, a flange 33a3 can be provided on the end 33a2. The flange 33a3 is annular and protrudes outward from the side of the tip 33a.

The tip 33a is formed, for example, from ceramics such as aluminum oxide or aluminum nitride, or glass. If the tip 33a is formed from ceramics or glass, it is possible to prevent damage to the back surface of the workpiece 100.

The base portion 33b has, for example, a columnar portion 33b1 and an attachment portion 33b2.
One end of the columnar portion 33b1 is provided inside the tip portion 33a with a gap therebetween. For example, a gap is provided between the columnar portion 33b1 and the inner wall of the tip portion 33a. The other end of the columnar portion 33b1 is provided on the attachment portion 33b2. The columnar portion 33b1 and the attachment portion 33b2 may be formed integrally or may be joined by welding or the like. The attachment portion 33b2 is attached to, for example, a bracket 32b1 described later.
The columnar portion 33b1 and the mounting portion 33b2 can be formed from a metal such as stainless steel.

The bracket 32b1 is a member to which the support portion 33 is attached. The bracket 32b1 is, for example, a plate-shaped member, and is fixed to the pair of holders 32b using a fastening member such as a screw. The bracket 32b1 is provided between the lower heat equalizing plate 34b and the heater 32a. In this way, interference between the lower heat equalizing plate 34b and the heater 32a is prevented. However, the mounting position of the bracket 32b1 is not limited to this. For example, the bracket 32b1 may be provided above the lower heat equalizing plate 34b. In this case, the bracket 32b1 is fixed to the pair of holders 32b so as to straddle the lower heat equalizing plate 34b. In addition, there is no need to provide a hole in the lower heat equalizing plate 34b to prevent interference with the support portion 33.
The bracket 32b1 can be made of a metal such as stainless steel.

The holding portion 33c holds the tip portion 33a. One end of the holding portion 33c is attached to the tip portion 33a (flange 33a3). The other end of the holding portion 33c is attached to the base portion 33b (mounting portion 33b2) or the bracket 32b1.

Here, if the holding portion 33c is made of ceramics or the like, the manufacturing cost will increase. If the holding portion 33c is made of a metal such as stainless steel, the increase in manufacturing costs can be suppressed. However, if the holding portion 33c is simply made of a metal, friction will occur between the holding portion 33c and the tip portion 33a due to the difference in linear expansion coefficient. Therefore, there is a risk that particles will be released from between the holding portion 33c and the tip portion 33a.

Therefore, the holding portion 33c is an elastic body containing metal. For example, as shown in FIG. 2, the holding portion 33c can be a coil spring containing metal. The holding portion 33c can be a coil spring made of, for example, stainless steel or inconel. If the holding portion 33c is an elastic body, the holding portion 33c can deform to absorb the misalignment between the holding portion 33c and the tip portion 33a caused by the difference in linear expansion coefficient. Therefore, it is possible to suppress the release of particles from between the holding portion 33c and the tip portion 33a.

Furthermore, if the retaining portion 33c is provided, a gap can be maintained between the base 33b (columnar portion 33b1) and the inner wall of the tip portion 33a, thereby preventing particles from being released from between the base 33b and the tip portion 33a.
In addition, by providing a gap between the base 33b (columnar portion 33b1) and the inner wall of the tip portion 33a, when the workpiece 100 is thermally deformed, the tip portion 33a of the support portion 33 can move in accordance with the thermal deformation of the workpiece 100. In addition, by supporting the tip portion 33a by the holding portion 33c, the tip portion 33a of the support portion 33 can move more easily in accordance with the thermal deformation of the workpiece 100. If the tip portion 33a of the support portion 33 can move in accordance with the thermal deformation of the workpiece 100, it is possible to prevent the back surface of the workpiece 100 from being damaged. Therefore, it is also possible to suppress the generation of particles from the contact portion between the workpiece 100 and the tip portion 33a.
Furthermore, if the holding portion 33c contains metal, an increase in manufacturing costs can be suppressed.

FIG. 3 is a schematic view illustrating a support portion 133 according to another embodiment.
As shown in FIG. 3, the support portion 133 has, for example, a tip portion 133a, a base portion 133b, and a holding portion 133c.

The tip portion 133a is cylindrical and has one end 133a1 (the end on the back side of the workpiece 100) that is closed. The end 133a1 may be the same as the end 33a1 described above, for example.
The other end 133a2 of the tip portion 133a is open. The end 133a2 may or may not be provided with a flange.
The material of the tip portion 133a can be, for example, the same as the material of the tip portion 33a described above.

The base portion 133b has, for example, a columnar portion 133b1 and an attachment portion 133b2.
One end of the columnar portion 133b1 is provided inside the tip portion 133a via a gap. For example, a gap is provided between the columnar portion 133b1 and the inner wall of the tip portion 133a. The other end of the columnar portion 133b1 is provided on the attachment portion 133b2. The columnar portion 133b1 may also be provided with a flange 133b3. The flange 133b3 may be provided near the end 133a2 of the tip portion 133a. The flange 133b3 may also be omitted. However, if the flange 133b3 is provided, the length of the holding portion 133c in the axial direction of the columnar portion 133b1 can be shortened, so that the attitude of the tip portion 133a can be stabilized.

The columnar portion 133b1, the attachment portion 133b2, and the flange 133b3 may be integrally formed or may be joined by welding, etc. The attachment portion 133b2 is attached to, for example, a bracket 32b1 provided on the holder 32b.
The columnar portion 133b1, the mounting portion 133b2, and the flange 133b3 may be formed from a metal such as stainless steel.

The holding portion 133c holds the tip portion 133a. One end of the holding portion 133c is attached to the end portion 133a2 of the tip portion 133a. The other end of the holding portion 133c is attached to the flange 133b3. If the flange 133b3 is not provided, the other end of the holding portion 133c can be attached to the attachment portion 133b2.

The holding portion 133c is an elastic body containing metal. For example, as shown in FIG. 3, the holding portion 133c can be a leaf spring containing metal. The holding portion 133c can be a leaf spring made of, for example, stainless steel or inconel. If the holding portion 133c is an elastic body, the holding portion 133c can deform to absorb the misalignment between the holding portion 133c and the tip portion 133a caused by the difference in linear expansion coefficient. Therefore, it is possible to suppress the release of particles from between the holding portion 133c and the tip portion 133a.

Furthermore, if the retaining portion 133c is provided, a gap can be maintained between the base 133b (columnar portion 133b1) and the inner wall of the tip portion 133a, thereby preventing particles from being released from between the base 133b and the tip portion 133a.
Furthermore, if the holding portion 133c contains a metal, an increase in manufacturing costs can be suppressed.

FIG. 4 is a schematic view illustrating a support portion 233 according to another embodiment.
As shown in FIG. 4, the support portion 233 has, for example, a tip portion 33a, a base portion 33b, and a holding portion 233c.
The holding portion 233c holds the tip portion 33a.
The holding portion 233c has a first portion 233c1 and a second portion 233c2.
The first portion 233c1 is provided, for example, on the tip portion 33a (the flange 33a3). The first portion 233c1 may be made of, for example, a magnetic material having an annular shape.
The second portion 233c2 faces the first portion 233c1 with a gap therebetween. The second portion 233c2 may be provided on the base 33b (the mounting portion 33b2) or the bracket 32b1, for example. The second portion 233c2 may be made of a magnetic material having an annular shape, for example.

In this case, the first portion 233c1 and the second portion 233c2 can be permanent magnets. Also, the magnetic pole of the first portion 233c1 facing the second portion 233c2 is the same as the magnetic pole of the second portion 233c2 facing the first portion 233c1. For example, if the side of the first portion 233c1 facing the second portion 233c2 is an S pole, then the side of the second portion 233c2 facing the first portion 233c1 is an S pole. For example, if the side of the first portion 233c1 facing the second portion 233c2 is an N pole, then the side of the second portion 233c2 facing the first portion 233c1 is an N pole.

In this way, a repulsive force is generated between the first portion 233c1 and the second portion 233c2. Therefore, the misalignment between the holding portion 233c and the tip portion 33a caused by the difference in the linear expansion coefficient can be absorbed. As a result, it is possible to suppress the release of particles from between the holding portion 233c and the tip portion 33a.

Furthermore, if the retaining portion 233c is provided, a gap can be maintained between the base 33b (columnar portion 33b1) and the inner wall of the tip portion 33a, thereby preventing particles from being released from between the base 33b and the tip portion 33a.
Furthermore, if the first portion 233c1 and the second portion 233c2 are permanent magnets, an increase in manufacturing costs can be suppressed.

Although the embodiments have been described above, the present invention is not limited to these descriptions.
Any modifications to the above-described embodiments made by those skilled in the art are also encompassed within the scope of the present invention as long as they incorporate the features of the present invention.
For example, the shape, dimensions, arrangement, etc. of the heat treatment device 1 are not limited to those exemplified, and can be changed as appropriate.

Furthermore, the elements of each of the above-described embodiments can be combined to the greatest extent possible, and combinations of these are also included within the scope of the present invention as long as they include the features of the present invention.
In the present embodiment, the support portion 33 is held by the bracket 32b1, but this is not limited thereto. For example, the width of the heat equalizing plate support portion 35 supporting the lower heat equalizing plate 34b may be increased, and the support portion 33 may be provided on the upper surface of the heat equalizing plate support portion 35. In other words, the heat equalizing plate support portion 35 supporting the lower heat equalizing plate 34b may have the function of the bracket 32b1. In this way, since there is no need to provide the bracket 32b1, the number of parts is reduced and maintenance is made easier. Alternatively, the lower heat equalizing plate 34b and the support portion 33 may be formed integrally.

1 Heat treatment device, 10 Chamber, 20 Exhaust section, 30 Processing section, 30a Processing area, 30b Processing area, 32 Heating section, 33 Support section, 33a Tip section, 33b Base section, 33c Holding section, 50 Controller, 100 Workpiece, 133 Support section, 133a Tip section, 133b Base section, 133c Holding section, 233 Support section, 233c Holding section, 233c1 First section, 233c2 Second section

Claims (3)

A chamber;
A support portion provided inside the chamber and capable of supporting a workpiece;
A heating unit provided inside the chamber and capable of heating the workpiece;
Equipped with
The support portion is
A tip portion having a cylindrical shape and one end of which can contact the workpiece;
A columnar portion having one end provided inside the tip portion with a gap therebetween;
A holding portion for holding the tip portion;
having
The holding portion is
A first portion provided at the tip portion;
a second portion facing the first portion via a gap;
having
the first portion and the second portion are permanent magnets;
A heat treatment apparatus, wherein a magnetic pole of the first portion on a side facing the second portion is the same as a magnetic pole of the second portion on a side facing the first portion.
The heat treatment device according to claim 1, further comprising an exhaust unit capable of exhausting the inside of the chamber. the tip comprises ceramic or glass;
The heat treatment apparatus according to claim 1 , wherein the columnar portion includes a metal.

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