JP7588943B2 - ウエハ治具、ロボットシステム、通信方法、及びロボット教示方法 - Google Patents
ウエハ治具、ロボットシステム、通信方法、及びロボット教示方法 Download PDFInfo
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- JP7588943B2 JP7588943B2 JP2022571972A JP2022571972A JP7588943B2 JP 7588943 B2 JP7588943 B2 JP 7588943B2 JP 2022571972 A JP2022571972 A JP 2022571972A JP 2022571972 A JP2022571972 A JP 2022571972A JP 7588943 B2 JP7588943 B2 JP 7588943B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/006—Controls for manipulators by means of a wireless system for controlling one or several manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/163—Programme controls characterised by the control loop learning, adaptive, model based, rule based expert control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
Description
Claims (9)
- ウエハを搬送可能なハンドと、
前記ハンドがウエハを保持する部材の状態、又は、前記ハンドがウエハを吸着する負圧の状態を検出する状態検出部と、
を備えるロボットに用いられるウエハ治具であって、
前記ハンド側へ情報を出力するための情報出力部を備え、
前記情報出力部は、前記状態検出部の検出結果を変化させることにより、当該状態検出部を介して、前記ハンド側へ情報を出力し、
前記ハンドは、前記ウエハを押圧する押圧部材を備え、
前記状態検出部は、前記押圧部材の位置を検出する位置センサであり、
前記情報出力部は、前記押圧部材を押圧に抗して退避させるアクチュエータを備えることを特徴とするウエハ治具。 - ウエハを搬送可能なハンドと、
前記ハンドがウエハを保持する部材の状態、又は、前記ハンドがウエハを吸着する負圧の状態を検出する状態検出部と、
を備えるロボットに用いられるウエハ治具であって、
前記ハンド側へ情報を出力するための情報出力部を備え、
前記情報出力部は、前記状態検出部の検出結果を変化させることにより、当該状態検出部を介して、前記ハンド側へ情報を出力し、
前記ハンドには、ウエハを吸着可能な吸引口が形成され、
前記状態検出部は、前記吸引口と負圧源とを繋ぐ経路の負圧を検出する負圧センサであり、
前記ウエハ治具は、前記ハンドによって吸着されるときに前記吸引口に接続される接続室を備え、
前記情報出力部は、前記接続室の容積を変更するアクチュエータを備えることを特徴とするウエハ治具。 - ウエハを搬送可能なハンドと、
前記ハンドがウエハを保持する部材の状態、又は、前記ハンドがウエハを吸着する負圧の状態を検出する状態検出部と、
を備えるロボットに用いられるウエハ治具であって、
前記ハンド側へ情報を出力するための情報出力部を備え、
前記情報出力部は、前記状態検出部の検出結果を変化させることにより、当該状態検出部を介して、前記ハンド側へ情報を出力し、
前記情報出力部は、電動アクチュエータの動作によって情報を出力することを特徴とするウエハ治具。 - 請求項1から3までの何れか一項に記載のウエハ治具であって、
対象物を検出する対象物検出センサを備え、
前記情報出力部は、前記対象物検出センサが前記対象物を検出したか否かを、前記情報として出力することを特徴とするウエハ治具。 - 請求項4に記載のウエハ治具であって、
前記対象物検出センサは、当該ウエハ治具の中心に設けられていることを特徴とするウエハ治具。 - 請求項5に記載のウエハ治具であって、
前記ハンドにより前記ウエハ治具が保持された状態において、前記対象物検出センサは、前記ハンドの中心に位置することを特徴とするウエハ治具。 - 請求項1から3までの何れか一項に記載のウエハ治具と、
前記ハンドによって前記ウエハ治具を保持可能なロボットと、
前記ロボットに指令を与えて制御する制御部と、
を備え、
前記制御部は、前記状態検出部を介して、前記ウエハ治具側から情報を受信することを特徴とするロボットシステム。 - ウエハを搬送可能なハンドがウエハを保持する部材の状態、又は、前記ハンドがウエハを吸着する負圧の状態を検出可能な状態検出部を備えるロボットと、
前記ハンドにより保持されることが可能なウエハ治具と、
の間で、前記ウエハ治具が前記ハンド側へ情報を送信する通信方法であって、
前記ウエハ治具が前記ハンドにより保持された状態とする第1工程と、
前記ウエハ治具が備える情報出力部が、前記情報に応じて、前記状態検出部の検出結果を変化させる第2工程と、
を含み、
前記ハンドは、前記ウエハを押圧する押圧部材を備え、
前記状態検出部は、前記押圧部材の位置を検出する位置センサであり、
前記情報出力部は、前記押圧部材を押圧に抗して退避させるアクチュエータを備えることを特徴とする通信方法。 - 請求項8に記載の通信方法により、前記ウエハ治具から得られた前記情報に基づいて、前記ロボットへの指令位置を補正することを特徴とするロボット教示方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/131,082 US11845179B2 (en) | 2020-12-22 | 2020-12-22 | Wafer jig, robot system, communication method, and robot teaching method |
US17/131,082 | 2020-12-22 | ||
PCT/JP2021/042427 WO2022137918A1 (ja) | 2020-12-22 | 2021-11-18 | ウエハ治具、ロボットシステム、通信方法、及びロボット教示方法 |
Publications (2)
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JPWO2022137918A1 JPWO2022137918A1 (ja) | 2022-06-30 |
JP7588943B2 true JP7588943B2 (ja) | 2024-11-25 |
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Country Status (6)
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US (1) | US11845179B2 (ja) |
JP (1) | JP7588943B2 (ja) |
KR (1) | KR20230144527A (ja) |
CN (1) | CN116918055A (ja) |
TW (1) | TWI791355B (ja) |
WO (1) | WO2022137918A1 (ja) |
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US11654578B2 (en) * | 2020-09-17 | 2023-05-23 | Kawasaki Jukogyo Kabushiki Kaisha | Robot system and offset acquisition method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006332543A (ja) | 2005-05-30 | 2006-12-07 | Dainippon Screen Mfg Co Ltd | 基板搬送教示方法および基板搬送装置 |
JP2010137300A (ja) | 2008-12-09 | 2010-06-24 | Yaskawa Electric Corp | 教示治具によって教示する基板搬送用マニピュレータ |
WO2020137991A1 (ja) | 2018-12-27 | 2020-07-02 | 川崎重工業株式会社 | 基板搬送ロボット及び自動教示方法 |
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-
2020
- 2020-12-22 US US17/131,082 patent/US11845179B2/en active Active
-
2021
- 2021-11-18 WO PCT/JP2021/042427 patent/WO2022137918A1/ja active Application Filing
- 2021-11-18 JP JP2022571972A patent/JP7588943B2/ja active Active
- 2021-11-18 CN CN202180085676.3A patent/CN116918055A/zh active Pending
- 2021-11-18 KR KR1020237023408A patent/KR20230144527A/ko active Pending
- 2021-12-22 TW TW110148038A patent/TWI791355B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332543A (ja) | 2005-05-30 | 2006-12-07 | Dainippon Screen Mfg Co Ltd | 基板搬送教示方法および基板搬送装置 |
JP2010137300A (ja) | 2008-12-09 | 2010-06-24 | Yaskawa Electric Corp | 教示治具によって教示する基板搬送用マニピュレータ |
WO2020137991A1 (ja) | 2018-12-27 | 2020-07-02 | 川崎重工業株式会社 | 基板搬送ロボット及び自動教示方法 |
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Publication number | Publication date |
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KR20230144527A (ko) | 2023-10-16 |
CN116918055A (zh) | 2023-10-20 |
US11845179B2 (en) | 2023-12-19 |
JPWO2022137918A1 (ja) | 2022-06-30 |
TW202228948A (zh) | 2022-08-01 |
WO2022137918A1 (ja) | 2022-06-30 |
TWI791355B (zh) | 2023-02-01 |
US20220193917A1 (en) | 2022-06-23 |
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