JP7580228B2 - Teaching apparatus, substrate transport apparatus, substrate processing apparatus, teaching method, and method for manufacturing electronic device - Google Patents

Description

The present invention relates to a substrate processing apparatus and a transport robot that loads and unloads substrates into the apparatus.

In Patent Document 1, a teaching jig having a position detection means is placed on a transport robot, and teaching is performed by detecting a positioning mark provided in advance on the placement section inside the device. The position detection means is generally a distance sensor or other device having an input/output cable. When placing such a jig having a distance sensor on the robot, the sensor cable is routed and fixed outside the robot so as not to interfere with the operation of the robot. The cable is twisted and slid as the robot moves during teaching, which can cause contamination. Such contamination effects are undesirable in substrate processing equipment that requires a highly clean environment.

JP 2004-50306 A

In the method of Patent Document 1, providing a position detection means on the transport robot raises concerns about contamination and other effects caused by twisting and sliding of the distance sensor cable as the robot moves during teaching.

The present invention solves the above problems by providing a simple teaching method that can complete teaching work quickly and accurately, even if there is no imaging means at the placement position, and without using the actual substrate to be processed, while still ensuring a cleanliness level within the device.

In order to achieve the above object, a teaching device of the present invention comprises:
A teaching device that teaches a control unit that controls a robot a path to be followed by a support unit of the robot that supports a substrate during a substrate transport operation of the robot to a substrate mounting unit provided in a mounting chamber, the teaching device comprising:
A teaching jig supported by the support portion;
a first positioning means for positioning the teaching jig with respect to the support portion;
A feature for indicating the position of the teaching jig;
a detection tool provided on the substrate placement part, the detection tool having a position detection means for detecting a position of the characteristic portion relative to the substrate placement part;
a second positioning means for positioning the detection jig with respect to the substrate placement portion;
an acquisition unit that acquires the path to be stored in the control unit based on the position of the characteristic portion acquired from the position detection means;
Equipped with
The second positioning means has an abutted portion provided on the substrate placement portion, and an abutting portion provided on the detection jig and abutting against the abutted portion .

Even if there is no imaging means at the placement position, it is possible to complete the teaching work accurately and quickly without using the actual substrate to be processed, and it is possible to provide a simple teaching method that can ensure cleanliness within the apparatus.

1 is a schematic diagram showing an overall configuration of a film forming apparatus according to an embodiment of the present invention; FIG. 1 is a schematic top view showing a configuration of a processing chamber according to an embodiment of the present invention. FIG. 1 is a schematic side view showing a configuration of a processing chamber according to an embodiment of the present invention. FIG. 1 is a schematic diagram showing a configuration of a transport robot according to an embodiment of the present invention; FIG. 1 is a schematic top view showing a configuration of a mounting chamber according to an embodiment of the present invention. FIG. 1 is a schematic side view showing a configuration of a mounting chamber according to an embodiment of the present invention. FIG. 1 is a schematic diagram showing a configuration during teaching using an imaging means according to an embodiment of the present invention; FIG. 13 is a schematic diagram showing an image captured by an imaging means during teaching according to an embodiment of the present invention. FIG. 1 is a schematic diagram showing a configuration during teaching using a detection jig according to an embodiment of the present invention; FIG. 1 is a schematic diagram showing a configuration of a substrate placement unit on which a detection jig is placed according to an embodiment of the present invention; FIG. 2 is a block diagram showing a control configuration of a film forming apparatus according to an embodiment of the present invention. 1 is a flow chart of a teaching process according to an embodiment of the present invention; Flowchart of a deposition process according to an embodiment of the present invention An explanatory diagram of an organic EL display device

Preferred embodiments and examples of the present invention will be described below with reference to the drawings. However, the embodiments and examples described below are merely illustrative of preferred configurations of the present invention, and do not limit the scope of the present invention to those configurations. Furthermore, unless otherwise specified, the hardware and software configurations, manufacturing conditions, dimensions, materials, shapes, etc. of the device in the following description are not intended to limit the scope of the present invention to those alone. In addition, identical components are generally given the same reference numbers, and repeated explanations will be omitted.

The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and in particular to a technology for highly accurate transport and position adjustment of the substrate. The present invention is preferably applicable to an apparatus for forming a thin film (material layer) of a desired pattern on the surface of a parallel plate substrate by vacuum deposition. Any material such as glass, resin, or metal can be selected as the substrate material, and any material such as organic material or inorganic material (metal, metal oxide, etc.) can be selected as the deposition material. The technology of the present invention is specifically applicable to manufacturing equipment for organic electronic devices (e.g., organic EL display devices, thin film solar cells), optical components, etc. In particular, manufacturing equipment for organic EL display devices is one of the preferred application examples of the present invention, since further improvement in the substrate transport accuracy and the alignment accuracy between the substrate and the mask is required due to the increase in substrate size or the increase in the resolution of the display panel.

[Example 1]
<Manufacturing equipment and manufacturing process>
Fig. 1 is a top view schematic diagram showing the overall configuration of an electronic device manufacturing apparatus. The manufacturing apparatus (substrate processing apparatus) 100 in Fig. 1 is used, for example, to manufacture a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, an organic EL film is formed on a substrate having a size of about 1800 mm x about 1500 mm and a thickness of about 0.5 mm, and then the substrate is diced to produce a plurality of small panels.

As shown in FIG. 1, the substrate processing apparatus (substrate transfer apparatus) 100 according to the present embodiment includes a processing chamber (film formation chamber) 1, a transfer chamber 2, a placement chamber (loading chamber) 3, a placement chamber (unloading chamber) 4, and a transfer robot 5. The processing chamber 1 as a substrate processing chamber is provided with a substrate placement unit 11 on which a substrate W to be processed is placed. The transfer chamber 2 is provided with a transfer robot 5 for holding and transferring the substrate W. The transfer robot 5 is, for example, a robot having a structure in which a robot hand 6 as a means for supporting the substrate W is attached to a multi-joint arm (details will be described later), and transfers the substrate W into and out of each chamber. For example, the substrate W placed in the placement chamber 3 as a substrate placement chamber is transferred to the processing chamber 1 and the placement chamber 4 as a substrate placement chamber by the robot hand 6 of the transfer robot 5. The substrate W can be freely moved between each chamber in the apparatus via the transfer robot 5.

The processing chamber 1 is provided with a film forming apparatus (also called a deposition apparatus). As shown in FIG. 12, a series of film forming processes, such as the transfer of the substrate W between the transport robot 5 and the substrate placement unit 11 (S402), adjustment (alignment) of the relative positions of the substrate W and the mask (not shown) (S403), fixing of the substrate W on the mask, and film formation (deposition) (S404), are automatically performed by the film forming apparatus. Note that the transfer of the substrate W into the processing chamber 1 (movement to the substrate transfer position) (S401) in the film forming process of FIG. 12 is controlled based on a teaching path acquired by the teaching process of this embodiment, which will be described later in detail (details will be described later).

The configuration of the substrate processing apparatus 100 shown in FIG. 1 is merely an example, and is not limited to such a configuration. For example, two or more processing chambers 1 may be provided in one substrate processing apparatus 100. In addition, another processing chamber equipped with a sputtering device as a film forming device may be provided in the substrate processing apparatus 100. In addition, two or more substrate placement units 11 may be provided in one processing chamber. In addition, only one of the loading chamber and the discharge chamber may be provided, and a placement chamber may be provided in addition to the loading chamber and the discharge chamber. In addition, in this embodiment, the transport robot 5 has two robot hands 6, but the number of transport robots 5 may be one or three or more. In addition, the robot hand 6 as a substrate support unit is preferably installed near the arm tip of the transport robot 5 in order to make the most of the operating area of the transport robot 5. Furthermore, in order to minimize the bending of the tip due to its own weight, it is preferable to make it out of a lightweight material such as CFRP.

The configuration of the processing chamber 1 according to this embodiment will be described with reference to Figures 2 and 3. Figure 2 is a schematic diagram of the processing chamber 1 according to this embodiment as viewed from above. Figure 3 is a schematic diagram of the processing chamber according to this embodiment as viewed from the side.

2 and 3, the processing chamber 1 is provided with a substrate placement section 11 and a deposition device 8. The processing chamber 1 is a part of a film formation apparatus (deposition apparatus), and when a film formation process is performed on the substrate W, the processing chamber 1 is a vacuum chamber, and the interior of the chamber is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. The processing chamber 1 is provided with a substrate holding unit, a mask, a mask placement section, a cooling plate (all not shown), a deposition device 8, and the like. The substrate holding unit is a means for holding and transporting the substrate W received from the transport robot 5, and is also called a substrate holder. The substrate placement section 11 forms a part of the substrate holding unit. The mask is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate W, and is fixed on a frame-shaped mask table. During film formation, the substrate W is placed on the mask. The cooling plate is a member that is in close contact with the substrate W (the surface opposite to the surface facing the mask) during film formation, and suppresses the temperature rise of the substrate W, thereby suppressing the alteration and deterioration of the organic material. The cooling plate may also serve as a magnet plate. The magnetic plate is a member that attracts the mask with magnetic force, thereby increasing the adhesion between the substrate W and the mask during film formation. The deposition device 8 is composed of a deposition material, a container (crucible) for storing the deposition material, a heater, a shutter, a drive mechanism for the evaporation device, an evaporation rate monitor, etc. (all not shown).

The processing chamber 1 is further provided with an imaging means (camera) 12 for imaging an alignment mark W1 of a substrate W placed on the robot hand 6 that has entered the processing chamber 1, or of a substrate W placed on the substrate mounting portion 11, and a position correction means 13 for correcting the position of the substrate W placed on the substrate mounting portion 11.

The position correction means 13 includes a plurality of actuators, each of which is composed of, for example, a motor and a ball screw, or a motor and a linear guide, as means for adjusting the positions of the substrate W and the mask when aligning the substrate W with the mask. The position correction means 13 includes, for example, an actuator for raising and lowering (moving in the Z direction) the entire substrate holding unit including the substrate placement part 11, an actuator for opening and closing the substrate clamping mechanism of the substrate holding unit, an actuator for raising and lowering the cooling plate, an actuator for moving the entire substrate holding unit and cooling plate in the X direction, Y direction, and θ rotation, etc. The position correction means 13 may also include an actuator for adjusting the position of the mask, or for aligning the substrate W and the mask by adjusting the positions of both the substrate W and the mask.

Above (outside) the processing chamber 1, an imaging means (camera) 12 is provided to measure the positions of the substrate W and mask for alignment of the substrate W and mask. The imaging means 12 captures images of the substrate W and mask through a window provided in the wall (ceiling) of the processing chamber 1. By recognizing the alignment mark W1 on the substrate W and the alignment mark on the mask from the image captured by the imaging means 12, it is possible to measure their respective XY positions and relative misalignment within the XY plane.

To correct the position of the substrate W in the horizontal and rotational directions, at least two imaging means 12 are provided, but the number of imaging means 12 may be one or three or more. The imaging means 12 is installed and adjusted so that the alignment mark W1 when the substrate W is placed in the ideal position and the alignment mark of the mask (not shown) are within its angle of view and depth of field.

To achieve high-precision alignment in a short time, it is preferable to perform a two-stage alignment: a first alignment (also called "rough alignment") that performs rough alignment, and a second alignment (also called "fine alignment") that performs high-precision alignment. In this case, two types of cameras may be used as the imaging means 12: a low-resolution but wide-field-of-view camera for the first alignment, and a narrow-field-of-view but high-resolution camera for the second alignment.

The configuration of the transport robot 5 will be described with reference to Fig. 4. Fig. 4(a) is a schematic plan view of the transport robot 5. Fig. 4(b) is a schematic side view of the transport robot 5. Note that the configuration of the transport robot (the configuration of the robot arm and the robot hand) described here is merely an example, and the transport robot is not limited to this configuration.
The transport robot 5 generally comprises a robot hand 6 for carrying the substrate W, and a robot arm 51 for freely moving the robot hand 6 to any position on the XYZ orthogonal coordinate system.

The robot arm 51 has a base 510 fixedly installed on the installation surface of the transfer chamber 2, and arms 511, 512, and 513 sequentially connected to the base 510 via joints 520, 521, and 522. The first arm 511 is connected to the base 510 via a first joint 520 so as to be rotatable about a rotation axis extending in a direction perpendicular to the installation surface (Z direction). The second arm 512 is connected to the first arm 511 via a second joint 521 and to the third arm 513 via a third joint 522 so as to be rotatable about a rotation axis extending in a direction perpendicular to the installation surface (Z direction). The robot hands 6 are connected in pairs to the tip (both ends) of the third arm 513. The horizontal position (XY coordinates) of the robot hand 6 can be arbitrarily displaced by combining the rotation of each arm 511 to 513.
The first arm 511 is configured to be movable up and down in a direction along the joint 520 relative to the base 510 (the direction of the arrow Z in the figure). By raising and lowering the first arm 511, the second arm 512 and the third arm 513 are also raised and lowered, whereby the height of the robot hand 6 can be changed and the height of the substrate W can be changed (the direction of the arrow Z in the figure).

Each joint of the robot arm 51 is provided with a motor and an encoder. The teaching data acquisition unit, which will be described later, can obtain the required amount of movement of the robot hand 6 (the amount of movement of each arm) from the amount of rotation and lift height of each arm, or from the three-dimensional coordinates obtained by converting this information.

The robot hand 6 has a pair of spine rods 16 extending from the tip of the third arm 513, and a number of rib rods 26 extending from the side of the spine rod 16 in a direction perpendicular to the spine rod 16. A pad 36 is provided on the upper surface of the tip of the rib rod 26 to support the underside of the substrate W. The pad 36 is made of an elastic material such as silicone rubber so that it can support the substrate W without damaging its surface, and a number of pads are provided in a position (along the outer periphery of the substrate W) that takes into account the deflection of the substrate W. The rib rods 26 arranged at both ends in the direction in which the spine rod 16 extends are provided with a number of second rib rods 46 extending in the direction in which the spine rod 16 extends, and pads 36 are also provided on the upper surfaces of the tips of these pads.

When the transport robot 5 places the substrate W placed on the robot hand 6 on the substrate placement part 11 in the processing chamber 1, the robot hand 6 is moved to a predetermined placement position where the alignment mark W1 of the substrate W is within the angle of view of the imaging means 12 in the horizontal direction. Next, the robot hand 6 moves in the vertical direction to place the substrate W on the substrate placement part 11, and then the alignment mark W1 of the placed substrate W and the alignment mark of the mask are imaged by the imaging means 12 to measure the relative position of the substrate W and the mask. The position correction amount of the substrate W is calculated based on the measured numerical value, and the position correction means 13 moves the substrate W. Then, the imaging means 12 images the substrate W again, and the relative position of the substrate W and the mask is measured. This is repeated a predetermined number of times until it falls within a certain tolerance range. Note that the alignment mark W1 of the substrate W and the alignment mark of the mask may be imaged by the imaging means 12 when the substrate W is placed on the robot hand 6, that is, before the substrate W is placed on the substrate placement part 11.

The configuration of the loading chamber will be explained using Figures 5 and 6. Figure 5 is a schematic diagram of the loading chamber configuration according to this embodiment as viewed from above. Figure 6 is a schematic diagram of the loading chamber configuration according to this embodiment as viewed from the side.

As shown in Figures 5 and 6, at least one of the loading chambers 3 and 4 is provided with a substrate loading section 11b. At least one of the loading chambers 3 and 4 is a part of a film forming apparatus (evaporation apparatus) and serves as a vacuum chamber, with the interior maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. At least one of the loading chambers 3 and 4 is provided with a substrate holding unit (not shown). The substrate holding unit is a means for holding the substrate W received from the transport robot 5, and is also called a substrate holder. The substrate holder has a means for moving the substrate W as necessary. The substrate loading section 11b forms part of the substrate holding unit.

10 is a block diagram showing an outline of the control configuration of the film forming apparatus according to this embodiment. A control unit 200 includes various functional units.
The chamber pressure control unit 201 controls the chamber pressure of the processing chamber 1 , which is equipped with a vacuum gauge 211 and a vacuum pump 212 .
The actuator control unit 202 controls various actuators of the position correction unit 13 .
The image processing unit 204 extracts and acquires the amount of deviation between the alignment marks described above from the image captured by the imaging unit 12 , and displays it on the monitor 213 .
The teaching data acquisition unit 203 acquires teaching data in a teaching process, which will be described later.
The memory unit 205 stores teaching data including coordinate information of the robot hand 6 and various other information.
The robot control unit 206 controls the transport robot 5 .
The monitor control unit 208 controls the operation of the film thickness monitor 217 and measures and acquires the film formation rate.
The heating control unit 207 controls the power supplied to the heater 215 based on the temperature of the temperature sensor 214 , thereby controlling the heating of the crucible 216 that contains the deposition material in the deposition device 8 .

The control unit 200 can be configured, for example, by a computer having a processor, memory, storage, I/O, etc. In this case, the functions of the control unit 200 are realized by the processor executing a program stored in the memory or storage. The computer may be a general-purpose personal computer, an embedded computer, or a PLC (programmable logic controller). Alternatively, some or all of the functions of the control unit 200 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 200 may be provided for each film forming apparatus, or one control unit 200 may control multiple film forming apparatuses.

After the transfer of the substrate W to the substrate placement part 11 of the processing chamber 1 is completed, the deposition device 8 is used to perform deposition processing on the substrate W through a mask. The processed substrate W is then received by the robot hand 6 from the substrate placement part 11 of the processing chamber 1 and transported to the next process.

The above series of operations are all carried out in a substrate processing apparatus that ensures a vacuum and clean environment. In addition, all of the means within the substrate processing apparatus mentioned above can ensure a clean environment within the apparatus, meaning there is no risk of contamination or other effects.

(Features of this embodiment)
A configuration (teaching device) for teaching the transport robot 5 a substrate transport path, which is a feature of this embodiment, will be described with reference to Figures 4, 7, and 9A. Figure 7 is a schematic diagram showing the configuration (teaching device) for teaching the transport robot 5 in the processing chamber 1 according to this embodiment, as viewed from above. Figure 9A is a schematic diagram showing the configuration (teaching device) for teaching the transport robot 5 in the placement chamber 3 (or 4) according to this embodiment, as viewed from above.

4A, a reference 6a and a sub-reference 6b are provided on the robot hand 6 of the transport robot 5. The reference 6a and the sub-reference 6b are placement references for placing a teaching jig or the like (described later) with good positional repeatability. In this embodiment, the reference 6a and the sub-reference 6b are cylindrical holes, but they may be shapes other than cylindrical or may be protruding.
7, the teaching jig T is provided with protrusions that fit into the reference 6a and sub-reference 6b as positioning mechanisms Ta and Tb corresponding to the reference 6a and sub-reference 6b of the robot hand 6. In this embodiment, the positioning mechanism Ta is a cylindrical protrusion and the positioning mechanism Tb is a diamond-shaped protrusion, but other mechanisms may be used as long as the teaching jig T can be placed on the transport robot, that is, the reference 6a and sub-reference 6b with good positional repeatability. Note that the positioning mechanism Tb does not have to be provided if it is not necessary.

As a positioning means (first positioning means) between the teaching jig T supported by the robot hand 6 and the robot hand 6, a configuration consisting of a convex part provided on one side and a concave part provided on the other side into which it fits is preferable in terms of cost and ease of handling, but is not limited to such a configuration. For example, positioning may be performed using separate members that engage with both of them.
The reference 6a and the sub-reference 6b may be provided on the transport robot 5, but are preferably provided in the vicinity of where the substrate W is placed. When the transport robot 5 has a plurality of robot hands, the reference 6a and the sub-reference 6b are provided for each robot hand 6. The sub-reference 6b does not have to be provided if it is not necessary.

7, the teaching jig T has a positioning mark T1. The positioning mark T1 is provided at a position that is within the angle of view and the depth of field of the imaging means 12 when the teaching jig T is transported to a predetermined substrate transfer position in the substrate placement unit 11. Furthermore, it is desirable that the positioning mark T1 is provided at the same horizontal position as the alignment mark W1 when the substrate W is placed in the ideal position of the robot hand 6. That is, it is preferable that the position of the positioning mark T1 when the teaching jig T is transported to the substrate placement unit 11 overlaps with the position of the alignment mark W1 when the substrate W is transported to the substrate placement unit 11. In addition, the positioning mark T1 is a cylindrical hole in this embodiment, but may be any other shape as long as it has a characteristic shape that allows the operator or image processing unit to accurately recognize the position when imaged by the imaging means 12. It is also desirable that the teaching jig T has approximately the same weight and approximately the same center of gravity as the substrate W. In other words, the overall shape is not limited to a specific shape as long as it is configured to reproduce the same weight balance as when the actual substrate W is placed on the robot hand 6. For example, it may be configured to be divided into multiple parts rather than being a single unit.

As an alternative, it is possible to provide a positioning mark T1 directly on the tip of the robot hand 6 or the transport robot 5. However, such parts are generally constructed of a material such as CFRP to reduce weight, which is close to black in color. Even if the positioning mark T1 is provided directly, it is difficult to create a contrast difference with the surrounding area of the positioning mark T1, and it is often very difficult to detect the position with the imaging means 12. It would also be very difficult to ensure the cleanliness of the inside of the device.

As shown in Fig. 9A, the detection jig K is placed on the substrate placement portion 11b. The detection jig K is provided with positioning mechanisms Ka, Kb, and Kc for placing the detection jig K on the substrate placement portion 11b with good positional repeatability. In the example shown in Fig. 9A, the positioning mechanisms Ka to Kc are all cylindrical, but other mechanisms may be used as long as the detection jig K can be placed on the substrate placement portion 11b with good positional repeatability. Note that if it is not necessary to place the detection jig K on the substrate placement portion 11b with good positional repeatability in the Y direction, the positioning mechanisms Kb and Kc do not need to be provided.
9B is a schematic diagram showing the configuration of the substrate placement section 11b on which the detection jig K is placed, as viewed from above. The substrate placement section 11b is provided with placement references Ra to Rc for placing the detection jig K and the like with good positional repeatability. The detection jig K can be placed with good positional repeatability by butting the positioning mechanisms Ka to Kc of the detection jig K against the placement references Ra to Rc of the substrate placement section 11b and placing the detection jig K on the substrate placement section 11b. The positioning mechanisms Ka to Kc of the detection jig K are an example of an butting section. The placement references Ra to Rc of the substrate placement section 11b are an example of an butted section. The detection jig K can be positioned in the X direction with respect to the substrate placement section 11b by butting the positioning mechanism Ka of the detection jig K against the placement reference Ra of the substrate placement section 11b. By abutting the positioning mechanisms Kb, Kc of the detection jig K against the placement references Rb, Rc of the substrate placement portion 11b, the detection jig K can be positioned relative to the substrate placement portion 11b in the Y direction. In this manner, by abutting the positioning mechanisms Ka-Kc of the detection jig K against the placement references Ra-Rc of the substrate placement portion 11b, the detection jig K can be easily positioned relative to the substrate placement portion 11b. Note that by placing the detection jig K on the substrate placement portion 11b, the detection jig K can be easily positioned relative to the substrate placement portion 11b in the Z direction.
b. After the detection jig K is placed on the substrate placement portion 11b, the detection jig K is fixed to the substrate placement portion 11b using members that engage with both of them. In this embodiment, the placement references Ra to Rc are formed by the outer shape of the structure of the substrate placement portion 11b, but they may be formed by something other than the outer shape, and may be cylindrical holes (concave portions) or protruding portions (convex portions) corresponding to the positioning mechanisms Ka to Kc.

In the above, an example is shown in which the positioning mechanisms Ka to Kc of the detection jig K are aligned in the horizontal direction (X direction and Y direction) relative to the mounting references Ra to Rc of the substrate mounting portion 11b. In this example, the detection jig K can be placed with good position reproducibility in the horizontal direction. This is not limited to this example, and the positioning mechanisms of the detection jig K may be aligned in the vertical direction (Z direction) relative to the mounting references of the substrate mounting portion 11b. With the positioning mechanisms of the detection jig K aligned in the vertical direction relative to the mounting references of the substrate mounting portion 11b, the detection jig K can be positioned in the Z direction relative to the substrate mounting portion 11b by abutting the positioning mechanisms of the detection jig K against the mounting references of the substrate mounting portion 11b. This allows the detection jig K to be placed with good position reproducibility in the vertical direction. As the positioning means (second positioning means) between the detection jig K and the substrate mounting part 11b, a configuration consisting of a protrusion provided on one side and a corresponding protrusion provided on the other side is preferable in terms of cost and ease of handling, but is not limited to such a configuration. For example, positioning may be performed using separate members that engage with both. In addition, the positioning means between the detection jig K and the substrate mounting part 11b may be configured to consist of a convex portion provided on one side and a corresponding concave portion provided on the other side.

As shown in FIG. 9A and FIG. 9B, the detection jig K has a position detection means K1. There are a plurality of position detection means K1, each having a predetermined detection range. The position detection means K1 is a non-contact type displacement sensor. Examples of the non-contact type displacement sensor include an optical displacement sensor, an ultrasonic displacement sensor, a laser focus type displacement sensor, and an eddy current type displacement sensor. This makes it possible to detect the outer position of the teaching jig T when the teaching jig T is transported to a predetermined substrate transfer position in the substrate placement unit 11b. The position detection means K1 may be disposed around the corners of the teaching jig T. The position detection means K1 detects the position of a characteristic part for indicating the position of the teaching jig T in a non-contact manner. The position detection means K1 detects the position of the characteristic part relative to the substrate placement unit 11b, thereby detecting the outer position of the teaching jig T. The first detection direction (X direction) of the position detection means K1 coincides with the abutting direction (X direction) of the positioning mechanism Ka of the detection jig K against the placement reference Ra of the substrate placement unit 11b. The second detection direction (Y direction) of the position detection means K1 coincides with the abutting direction (Y direction) of the positioning mechanisms Kb and Kc of the detection jig K against the placement references Rb and Rc of the substrate placement unit 11b. FIGS. 9A and 9B show an example in which the position detection means K1 is aligned horizontally with respect to the teaching jig T. In this example, the position detection means K1 can detect the position of the characteristic part in the horizontal direction. Not limited to this example, the position detection means K1 may be aligned vertically with respect to the teaching jig T. This allows the position detection means K1 to detect the position of the characteristic part in the vertical direction. In this case, the third detection direction (Z direction) of the position detection means K1 and the abutting direction (Z direction) of the positioning mechanism of the detection jig K with respect to the placement reference of the substrate placement unit 11b coincide with each other. As shown in FIG. 9B, the characteristic portion may be a characteristic shape of the teaching jig T. Also, the characteristic portion may be a protruding convex portion or a concave portion such as a cylindrical hole provided on the teaching jig T. It is preferable that the outer shape of the teaching jig T detected by the detection jig K is the same as the outer shape of the substrate W when the substrate W is placed at the ideal position of the robot hand 6 in the horizontal direction in terms of design. Also, in this embodiment, the outer position of the teaching jig T is detected, but the shape of the teaching jig T may be other than the above as long as it is a characteristic shape that allows the position to be detected with high accuracy by the position detection means K1. It is also preferable that the detection jig K has a shape and arrangement that does not hinder the placement operation of the substrate W on the substrate placement unit 11b by the robot hand 6. The detection jig K may be provided in a sealed space (atmospheric BOX) K2 in which an atmospheric pressure environment is maintained. For example, the atmospheric BOX K2 may be formed by surrounding the detection jig K with a sealed case. Since the detection jig K is isolated from the outside of the atmospheric BOX K2 and an atmospheric pressure environment is maintained, teaching using the detection jig K is possible even in a vacuum environment.

As an alternative, the position detection means K1 may be provided directly in at least one of the placement chambers 3 and 4. In this case, the position detection means K1 may be provided in a sealed space (atmospheric box) in which an atmospheric pressure environment is maintained.

(Pattern 1)
A teaching method for the transfer robot 5 in the processing chamber 1 will be described with reference to Figures 7, 8, and 11. Figure 11(a) is a flowchart of the teaching process in pattern 1, and the teaching method for pattern 1 will be described below in conjunction with the explanation of each step in Figure 11(a). Note that the teaching jig T is placed on the robot hand 6 in an atmospheric pressure environment before a series of teaching processes.

As shown in FIG. 7, the robot hand 6 is moved to a predetermined position where the positioning mark T1 is within the angle of view of the imaging means 12 in the processing chamber 1, that is, to the substrate transfer position (S101). The movement path of the robot hand 6 at this time is a tentative path and does not necessarily match the movement path (path that the substrate W should follow) when transporting the substrate W during the actual film formation process. The positioning mark T1 is imaged by the imaging means 12 (S102). The image processing unit 204 acquires the amount of deviation of the positioning mark T1 from the reference position based on the image captured by the imaging means 12 (S103). The image captured by the imaging means 12 when the robot hand 6 moves to the predetermined substrate transfer position is shown in FIG. 8(a) in schematic form. The coordinate system shown in FIG. 8(a) is the same as the coordinate system shown in FIG. 1 to FIG. 5, and the image processing unit 204 displays the amount of deviation from the reference position on the monitor in an easy-to-understand manner. FIG. 8(a) shows a state where the positioning mark T1 is not within a certain tolerance range 12b from the reference position R in the angle of view of the imaging means 12. The image processing unit 204 judges whether the amount of deviation is equal to or less than a predetermined threshold (S104). Then, based on the image capture screen, the robot hand 6 is moved in the horizontal and rotational directions so that the positioning mark T1 is within a certain tolerance range 12b from the reference position R in the angle of view of the imaging means 12 (S104: No, S106). FIG. 8(b) shows an outline of an image captured by the imaging means 12 at that time. FIG. 8(b) shows a state where the positioning mark T1 is within a certain tolerance range 12b from the reference position R in the angle of view of the imaging means 12. The coordinate system shown in FIG. 8(b) is the same as the coordinate system shown in FIG. 1 to FIG. 5. Then, the point of the above position is recorded in the operation data storage means of the transport robot 5 (S104: Yes, S105). That is, the teaching data acquisition unit 203 acquires the movement amount and elevation amount of each arm when the robot hand 6 is in the above position, or the coordinates of the robot hand 6 acquired by converting them, and stores them in the memory unit 205. If all necessary coordinates have been acquired (S107: YES), the image processing unit 204 creates a movement path (path to be followed) for the robot hand 6 (S108). On the other hand, if necessary coordinates are insufficient (S107: NO), the process returns to S101. Note that it is desirable to operate the transport robot 5 at a low speed during teaching. This series of teaching processes may be performed either in an atmospheric pressure environment or in a vacuum environment.

The above is the teaching of the path for carrying the substrate W into the processing chamber 1, but the teaching of the path for carrying the substrate W out is similar.
1, if the loading chambers 3 and 4 are equipped with imaging means for detecting the positions of the alignment marks W of the substrate W. That is, by obtaining ideal transport positions at each point on the movement path of the substrate W, it is possible to obtain an ideal transport path for the substrate W in the entire substrate processing apparatus 100 (S101 to S108).

When the mask is also transported by the transport robot 5, teaching of the mask placement position, etc. can be performed using the same means as described above.

(Pattern 2)
A teaching method for the transport robot 5 in the placement chamber 3 (or 4) will be described with reference to Figures 9A and 11. Figure 11(b) is a flowchart of the teaching process in pattern 2, and the teaching method for pattern 2 will be described below in conjunction with the explanation of each step in Figure 11(b). Note that before a series of teaching processes, a teaching jig T is placed on the robot hand 6 in an atmospheric environment, and a detection jig K is placed on the substrate placement part 11b.

9A, the robot hand 6 is moved to a predetermined position where the outer shape of the teaching jig T falls within the measurement range of the position detection means K1, that is, to the substrate transfer position (S201). The movement path of the robot hand 6 at this time is a tentative path and does not necessarily coincide with the movement path (path that the substrate W should follow) when transporting the substrate W during the actual film formation process. When the robot hand 6 moves to the predetermined substrate transfer position, the outer shape position (position of the characteristic part) of the teaching jig T is detected by the position detection means K1 (S202). There are multiple position detection means K1, and the deviation amount of the outer shape position (position of the characteristic part) of the teaching jig T from the reference position within the detection range of the position detection means K1 is calculated using the detection values of each of them (S203). The image processing unit 204 determines whether the deviation amount is equal to or less than a predetermined threshold (S204). Then, based on the calculated deviation amount, the robot hand 6 is moved horizontally and in the rotational direction so that the external position (position of the characteristic part) of the teaching jig T falls within a certain tolerance range from the reference position within the detection range of the position detection means K1 (S204: No, S206). After that, the above-mentioned position point (movement information of the robot hand 6) is recorded in the operation data storage means of the transport robot 5 (S204: Yes, S205). That is, the teaching data acquisition unit 203 acquires the movement amount and lift amount of each arm when the robot hand 6 is in the above-mentioned position, or the coordinates of the robot hand 6 acquired by converting them, and stores them in the storage unit 205. If all the necessary coordinates have been acquired (S207: YES), the image processing unit 204 creates a movement path (path to be followed) of the robot hand 6 (S208). On the other hand, if the necessary coordinates are insufficient (S207: NO), the process returns to S201. It is preferable to operate the transport robot 5 at a low speed during teaching.

This series of teaching processes may be performed either in an atmospheric pressure environment or in a vacuum environment. Also, imaging means 12 are not provided in the loading chambers 3 and 4, but imaging means 12 may be provided in the loading chambers 3 and 4. Also, in the teaching method for pattern 2, a teaching jig T without a positioning mark T1 is used.

The above is the teaching of the loading path for the substrate W into the loading chamber 3 (or 4), but the same applies to teaching the unloading path.

When the mask is also transported by the transport robot 5, teaching of the mask placement position, etc. can be performed using the same means as described above.

(Advantages of this embodiment)
According to this embodiment, it is possible to accurately teach the operating points of the transport robot to the substrate placement part in the processing chamber and the placement chamber without using a substrate that is an actual object to be processed (object to be film-formed). In addition, since the imaging means for detecting the position of the alignment mark on the substrate is used for teaching at a location where the imaging means is provided, a position detection means dedicated to teaching is not required. In addition, by installing a dedicated detection jig as necessary for teaching at a location where the imaging means is not provided, it is possible to realize a teaching jig with a simple and relatively inexpensive means. In addition, since no positioning marks are provided on the placement part or the transport robot in the processing chamber and the placement chamber, there is no influence of contamination, and it is possible to ensure the cleanliness of the device.
In addition, the positioning mechanism of the teaching jig allows the jig to be placed on the conveying means with good position repeatability, making it possible to perform teaching with high accuracy. This makes it possible to significantly reduce the time and labor required for teaching work.
In addition, the positioning mechanism of the detection jig allows the jig to be placed on the placement section with good position repeatability, making it possible to perform teaching with high accuracy. This allows for a significant reduction in time and labor required for teaching work.
Furthermore, by detecting the position of the transport robot by the imaging means, teaching can be performed without the operator having to approach the teaching position, making it possible to significantly reduce the time and labor required for teaching work.
Furthermore, by installing the detection means in advance, teaching can be performed without the operator having to approach the teaching position, making it possible to significantly reduce the time and labor required for teaching work.
Furthermore, because teaching can be performed with high accuracy, it is possible to reliably place the alignment mark of the substrate supplied to the processing chamber within the angle of view and depth of field of the imaging means. This eliminates error shutdowns of the device due to failure to detect the alignment mark, improving yields and reducing manual checking work.

<Example of a method for manufacturing an electronic device>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described below. As an example of the electronic device, the configuration of an organic EL display device and a method for manufacturing the same will be described.
First, the organic EL display device to be manufactured will be described below: Fig. 13A is an overall view of an organic EL display device 60, and Fig. 13B shows a cross-sectional structure of one pixel.

As shown in FIG. 13(a), a plurality of pixels 62 each including a plurality of light-emitting elements are arranged in a matrix in a display area 61 of an organic EL display device 60. As will be described in detail later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is configured by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B that emit light different from each other. The pixel 62 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

13(b) is a schematic partial cross-sectional view taken along line A-B in FIG. 13(a). The pixel 62 has an organic EL element on a substrate 63, the organic EL element including a first electrode (anode) 64, a hole transport layer 65, any one of the light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68. Among these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers (organic films). In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 64 is formed separately for each light-emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 66G, and 66B, or may be formed for each light emitting element. In order to prevent the first electrode 64 and the second electrode 68 from being shorted by foreign matter, an insulating layer 69 is provided between the first electrodes 64. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

To form the organic EL layer in units of light-emitting elements, a method of film formation through a mask is used. In recent years, display devices have become increasingly finer, and masks with openings several tens of micrometers wide are used to form the organic EL layer. When forming a film using such a mask, if the mask is subjected to heat from the evaporation source during film formation and is thermally deformed, the positions of the mask and the substrate will shift, and the thin film pattern formed on the substrate will be formed in a position that is shifted from the desired position. For this reason, the film formation device (vacuum deposition device) according to the present invention is preferably used to form these organic EL layers.

Next, we will explain in detail an example of a manufacturing method for an organic EL display device.

First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.
An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 64 is formed, thereby forming an insulating layer 69. This opening corresponds to a light-emitting region where the light-emitting element actually emits light.
The substrate 63 on which the insulating layer 69 has been patterned is carried into a first film forming apparatus, and the substrate is held by a substrate holding unit, and a hole transport layer 65 is formed as a common layer on the first electrodes 64 in the display area. The hole transport layer 65 is formed by vacuum deposition. In practice, the hole transport layer 65 is formed to be larger than the display area 61, so that a high-definition mask is not required.

Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into a second film forming apparatus and held by a substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 66R is formed on the portion of the substrate 63 where the red light emitting element is to be disposed. According to this example, the mask and the substrate can be well aligned, and high-precision film formation can be performed.
Similar to the formation of the light-emitting layer 66R, a third film-forming apparatus forms a light-emitting layer 66G that emits green light, and a fourth film-forming apparatus forms a light-emitting layer 66B that emits blue light. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, a fifth film-forming apparatus forms an electron transport layer 67 over the entire display area 61. The electron transport layer 67 is formed as a layer common to the three light-emitting layers 66R, 66G, and 66B.
The substrate on which the electron transport layer 67 has been formed is transferred to a sputtering device, where the second electrode 68 is formed, and then transferred to a plasma CVD device, where the protective layer 70 is formed, thereby completing the organic EL display device 60 .

If the substrate 63 on which the insulating layer 69 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when the substrate 63 is carried into the film-forming apparatus until the formation of the protective layer 70 is completed, the light-emitting layer made of an organic EL material may be deteriorated by the moisture or oxygen. Therefore, in this example, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere.
In the organic EL display device obtained in this manner, the light-emitting layer is formed with high precision for each light-emitting element, and therefore, by using the above-described manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to misalignment of the light-emitting layer.

100...substrate processing apparatus, 1...processing chamber, 2...transport chamber, 3...mounting chamber (loading chamber), 4...mounting chamber (discharge chamber), 5...transport robot, 6...robot hand, 6a...robot hand reference, 6b...robot hand sub-reference, 11, 11b...substrate placement section, 12...imaging means, 13...substrate position correction means, W...substrate, W1...alignment mark, T...teaching jig, T1...
Positioning mark, Ta...jig reference, Tb...jig sub-reference, K...detection jig, K1...position detection means, Ka, Kb, Kc...positioning mechanism, Ra, Rb, Rc...placement reference

Claims (23)

A teaching device that teaches a control unit that controls a robot a path to be followed by a support unit of the robot that supports a substrate during a substrate transport operation of the robot to a substrate mounting unit provided in a mounting chamber, the teaching device comprising:
A teaching jig supported by the support portion;
a first positioning means for positioning the teaching jig with respect to the support portion;
A feature for indicating the position of the teaching jig;
a detection tool provided on the substrate placement part, the detection tool having a position detection means for detecting a position of the characteristic portion relative to the substrate placement part;
a second positioning means for positioning the detection jig with respect to the substrate placement portion;
an acquisition unit that acquires the path to be stored in the control unit based on the position of the characteristic portion acquired from the position detection means;
Equipped with
A teaching device characterized in that the second positioning means has an abutted portion provided on the substrate placement portion, and an abutting portion provided on the detection jig, which abuts against the abutted portion . The teaching device according to claim 1, characterized in that the position detection means is a displacement sensor that detects the position of the characteristic part in a non-contact manner. 3. The teaching device according to claim 1, wherein the detection tool is disposed in a sealed space in which an atmospheric pressure environment is maintained. 4. The teaching device according to claim 1, wherein the characteristic portion is provided on the teaching jig. 5. The teaching device according to claim 1, wherein the first positioning means has a convex portion provided on one of the teaching jig and the support portion, and a concave portion provided on the other of them into which the convex portion fits. 6. The teaching device according to claim 1, wherein the teaching jig has substantially the same weight and center of gravity as the substrate. When the control unit controls the robot so that the support unit moves along a tentative path in a state in which the teaching jig is positioned and supported by the support unit by the first positioning means,
the position detection means detects a position of the characteristic portion when the support portion is at a predetermined position on the virtual path;
The teaching device according to any one of claims 1 to 6, characterized in that the acquisition unit acquires the path to be stored in the control unit based on a deviation between the position of the characteristic part acquired from the position detection means and a reference position at the specified position. 8. The teaching device according to claim 7 , wherein the predetermined position is a transfer position where the substrate is transferred to and from the substrate placement unit. A robot that supports and transports the substrate;
A control unit for controlling the robot;
Equipped with
The substrate transport device according to claim 1, wherein the control unit controls the robot based on the path stored by a teaching device according to any one of claims 1 to 8 . a substrate processing chamber having a substrate placement portion;
A substrate transport device according to claim 9 ;
Equipped with
The substrate processing apparatus performs processing on a substrate transported by the substrate transport device and placed on the substrate placement part. 11. The substrate processing apparatus according to claim 10 , wherein the processing is a film forming process by deposition or sputtering. A teaching method for teaching a control unit that controls a robot, the robot supporting and transporting a substrate, a path to be followed by a support unit of the robot that supports the substrate, the support unit including:
a jig transport process in which the control unit controls the robot so that a teaching jig is supported by the support unit and the support unit moves along a tentative path in a state in which the teaching jig is positioned with respect to the support unit;
a detection step of detecting a position of a characteristic portion indicating a position of the teaching jig relative to the substrate mounting portion, using a position detection means provided on the detection jig, while the detection jig is supported on the substrate mounting portion and positioned relative to the substrate mounting portion;
an acquisition step of acquiring the path to be stored in the control unit based on the position of the characteristic part acquired from the position detection means;
a teaching step of causing the control unit to store the path acquired by the acquisition step;
Including,
A teaching method characterized in that the detection jig is positioned relative to the substrate mounting portion by a positioning means having an abutment portion provided on the substrate mounting portion and an abutment portion provided on the detection jig that abuts against the abutment portion . 13. The teaching method according to claim 12 , wherein the position detection means is a displacement sensor that detects the position of the characteristic portion in a non-contact manner. 14. The teaching method according to claim 12 , wherein the characteristic portion is provided on the teaching jig. The teaching method according to any one of claims 12 to 14, characterized in that the teaching jig is positioned relative to the support part by a positioning means having a convex portion provided on one of the teaching jig and the support part, and a concave portion provided on the other of the teaching jig and into which the convex portion fits. 16. The teaching method according to claim 12 , wherein the teaching jig has substantially the same weight and center of gravity as the board. 17. The teaching method according to claim 12 , wherein the detection tool is disposed in an enclosed space in which an atmospheric pressure environment is maintained. A teaching method as described in any one of claims 12 to 17, characterized in that in the acquisition process, when the support part is at a predetermined position on the virtual path, the path to be stored in the control unit is acquired based on the deviation between the position of the characteristic part acquired from the position detection means and a reference position at the predetermined position . 20. The teaching method according to claim 18 , wherein the predetermined position is a transfer position where the substrate is transferred to and from the substrate placement part. 1. A film formation method for performing a film formation process on a substrate placed on a substrate placement part of a substrate processing chamber, comprising:
A teaching step of causing the control unit to store the path by the teaching method according to any one of claims 12 to 19 ;
a transport step in which the control unit controls the robot based on the path to transport the substrate to the substrate mounting part and place the substrate on the substrate mounting part;
a film forming step of performing a film forming process on the substrate placed on the substrate placement part by deposition or sputtering;
A film forming method comprising the steps of: 1. A method for manufacturing an electronic device having an organic film formed on a substrate, comprising:
A method for manufacturing an electronic device, comprising forming the organic film by the film forming method according to claim 20 . 1. A method for manufacturing an electronic device having a metal film formed on a substrate, comprising:
A method for manufacturing an electronic device, comprising forming the metal film by the film forming method according to claim 20 . 23. The method for producing an electronic device according to claim 21 , wherein the electronic device is a display panel of an organic electroluminescence display device.

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