JP7574544B2 - Resin composition, electronic device member, resin additive, and organopolysiloxane composition for use as an additive in resin - Google Patents

Description

The present invention relates to organopolysiloxanes, and in particular to organopolysiloxane compositions that are used in combination with other resins.

In recent years, organic-inorganic composites have been attracting attention, and developments have been made with the aim of improving the properties of resins by mixing silicon materials into them. For example, Patent Document 1 discloses an organopolysiloxane that has a narrow molecular weight distribution and is in a low-viscosity liquid state at room temperature, making it easy to mix with other resins, and does not contain any low-molecular-weight components that may volatilize, making it easy to handle and providing excellent properties when cured. By tinkering with the functional groups of this liquid organopolysiloxane with a low molecular weight and narrow molecular weight distribution, various functions have been imparted to various resins.

International Publication No. 2018/110613

In order to effectively exert the functions of the organopolysiloxane in the resin, it is important to uniformly mix and disperse the resin and the organopolysiloxane, and it is necessary to prepare a composition in a form that allows the organopolysiloxane to be easily mixed and dispersed in the resin prior to molding.
However, problems arise due to the difficulty in uniformly dispersing the organopolysiloxane, such as the precipitation of certain components when the organopolysiloxane is mixed with a resin that has already been mixed with various additives, and the difficulty in diffusing the organopolysiloxane when the organopolysiloxane is mixed with a resin that has been increased in molecular weight due to the high viscosity of the resin, resulting in a concentration gradient of the organopolysiloxane in the composition and resulting in uneven physical properties of the molded product. In such cases, it is possible to improve the dispersibility of the organopolysiloxane by using a liquid organopolysiloxane composition that has a narrow molecular weight distribution and is free of volatile low molecular weight components, diluting it with an organic solvent, and mixing it; however, some of the advantages that were present before the addition of the organopolysiloxane are lost, for example, due to the danger of flammable vapor volatilizing when the mold is released during molding, the condensed organic solvent redissolving the molded product, whitening it and causing a poor appearance, poor curing due to a decrease in temperature caused by the evaporation of the organic solvent, a decrease in the melting point of the resin due to the organic solvent remaining in the molded product, shrinkage over time caused by the gradual evaporation of the organic solvent from the molded product, a decrease in strength due to the generation of voids as the organic solvent volatilizes, and coloring due to the oxidation of the organic solvent, etc.
Furthermore, when an organopolysiloxane having a high viscosity is used to prepare a composition containing the same, the flowability during molding may be poor, leading to insufficient filling of the resin into a mold or the resin may harden in a state in which air is trapped within the resin. In some applications, the high viscosity of the organopolysiloxane may cause various adverse effects.
When used in cosmetics such as hair wax and lip gloss, the viscosity of the organopolysiloxane is an important factor since it greatly affects the texture.

Therefore, the objective of the present invention is to provide an organopolysiloxane composition that has low viscosity and excellent dispersibility in various resins.

The inventors have therefore, through extensive research, discovered that the viscosity can be adjusted by incorporating a specific component into organopolysiloxane, that this specific substance is not easily volatilized even when exposed to high temperatures, and therefore does not cause odor generation, resin shrinkage, poor appearance of molded products, reduced transparency, insufficient curing, etc., and that since it has the same stability as organopolysiloxane, it does not cause pollution of the surrounding environment or coloring due to decomposition in the desired usage environment. In addition, they have discovered that by kneading the raw materials in a temperature range where this specific substance vaporizes and uniformly dispersing this specific substance in the resin, it is possible to reduce the viscosity of the resin and also to promote the dispersibility of the organopolysiloxane. Furthermore, as a benefit of the reduced viscosity of the organopolysiloxane, the amount of adhesion to the kettle, filter, and withdrawal line after production is reduced, improving the recovery rate, and the improved dispersibility in organic solvents reduces the effort required for cleaning. When the composition is made, it is less likely to remain in the container, reducing the burden of cleaning the container after use. When the container is disposed of, a specific substance in the organopolysiloxane composition that has adhered to the container has a similar structure to the other components, so there is no need to secure a new storage space in consideration of the danger of the specific component as a storage space until disposal. In addition, no detoxification or separation treatment is required for disposal, and there is no need to use the associated chemicals or energy, which contributes to reducing the environmental load. These surprising effects were discovered, and the present invention was completed.

That is, the gist of the present invention is as follows.
[1] A composition comprising, as component A, an organopolysiloxane generally represented by the formula [1], and as component B, a substance represented by the following formula [2], and wherein component A and component B satisfy the relationship 0.1≦{(weight of component B)×100}/{(weight of component A)+(weight of component B)}≦9; and
The organopolysiloxane composition is characterized in that the content of substances in which the coefficients T2, M2, and E2 in formula [2] satisfy T2+2-M2+E2=0 is 0.01% by weight or more and 9% by weight or less, and the content of substances in which the coefficients T2, M2, and E2 in formula [2] do not satisfy T2+2-M2+E2=0 is 3% by weight or less, relative to component A.
R _X SiO _(4-X)/2 ...[1]
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2 ...[2]
Here, in the above formula [1],
R are each independently selected from the group consisting of an organic group and a hydrogen atom, and may be the same or different;
The coefficients X each independently satisfy 0<X≦4.
Here, in the above formula [2],
R ¹ to R ³ are each independently selected from the group consisting of an organic group containing a carbon atom and a hydrogen atom, and may be the same or different.
R ⁴ may be the same or different and is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom.
R ⁵ may be the same or different and is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom;
The coefficient M2 is a positive integer between 1 and 5; the coefficient T2 is a positive integer between 1 and 3; and the coefficient E2 is an integer between 0 and 5.
[2] The organopolysiloxane composition according to [1], characterized in that the organopolysiloxane represented by the general formula [1] contains dimethylpolysiloxane or MQ resin.
[3] The organopolysiloxane composition according to [1] or [2], wherein the organopolysiloxane represented by the general formula [1] has a group selected from the group consisting of a trimethylsiloxy group, a dimethylvinyltrimethylsiloxy group, and a dimethylsiloxy group.
[4] The organopolysiloxane composition according to any one of [1] to [3], wherein the organopolysiloxane represented by the general formula [1] has a phenyl group.
[5] The organopolysiloxane composition according to any one of [1] to [4], characterized in that when 200 g of the organopolysiloxane composition is placed in a 1 L eggplant-shaped flask and heated for 2 hours at an internal temperature of 110° C. under reduced pressure using a vacuum pump having an exhaust capacity of a vacuum pressure of 0.15 torr, the organopolysiloxane loses a mass of 10 g or less.
[6] The organopolysiloxane composition according to any one of [1] to [5], wherein the organopolysiloxane represented by the general formula [1] is liquid at 40° C.
[7] The organopolysiloxane composition according to any one of [1] to [6], wherein in the general formula [2], R ⁴ is a phenyl group.
[8] The organopolysiloxane composition according to any one of [1] to [7], wherein in the general formula [2], R ¹ to R ³ are methyl groups.
[9] The organopolysiloxane composition according to any one of [1] to [8], characterized in that the substance represented by the general formula [2] contains a substance whose coefficient T2 is 1.
[10] The organopolysiloxane composition according to any one of [1] to [9], characterized in that the substance represented by the general formula [2] contains a substance in which the coefficient M2 is 3.
[11] The organopolysiloxane composition according to any one of [1] to [10], wherein the content of the substance represented by the general formula [2] in the organopolysiloxane composition is 0.5 to 3 wt %.
[12] A resin composition comprising the organopolysiloxane composition according to any one of [1] to [11].
[13] An organic solvent dilution solution comprising the organopolysiloxane composition according to any one of [1] to [11].
[14] A member for electronic devices, comprising the organopolysiloxane composition according to any one of [1] to [11] or a cured product thereof.

The present invention can provide an organopolysiloxane composition that has a low viscosity and excellent dispersibility in various resins.
The organopolysiloxane composition also has the effect of being excellent in odor resistance and colorability, and capable of maintaining a relatively high flash point.

The following describes in detail the embodiments of the present invention, but these descriptions are merely examples (representative examples) of the embodiments of the present invention, and the present invention is not limited to these contents as long as they do not depart from the gist of the present invention.
In this specification, a numerical range expressed using "to" means a range including the numerical values before and after "to" as the lower and upper limits, and "A to B" means A or more and B or less.
In addition, in this specification, the term "independently" used when describing two or more objects together means that the two or more objects may be the same or different.

1. Organopolysiloxane Composition An organopolysiloxane composition according to one embodiment of the present invention (hereinafter also simply referred to as "organopolysiloxane composition") comprises, as component A, an organopolysiloxane represented by general formula [1] (hereinafter also simply referred to as "organopolysiloxane"), and, as component B, a substance represented by the following general formula [2], wherein component A and component B satisfy the relationship 0.1≦{(weight of component B)×100}/{(weight of component A)+(weight of component B)}≦9, and
The organopolysiloxane composition is characterized in that, relative to component A, the content of substances for which the coefficients T2, M2, and E2 in formula [2] satisfy T2+2-M2+E2=0 is 0.01 part by weight or more and 9 parts by weight or less, and the content of substances for which the coefficients T2, M2, and E2 in formula [2] do not satisfy T2+2-M2+E2=0 is 3 parts by weight or less.
R _X SiO _(4-X)/2 ...[1]
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2
...[2]
Here, in the above formula [1],
Each R is independently selected from the group consisting of an organic group and a hydrogen atom, and may be the same or different; each coefficient X independently satisfies 0≦X≦3 .
Here, in the above formula [2],
R ¹ to R ³ are each independently selected from the group consisting of an organic group containing a carbon atom and a hydrogen atom, and may be the same or different.
R ⁴ may be the same or different and is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom.
^R5 is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom, and may be the same or different; coefficient M2 is a positive integer from 1 to 5, coefficient T2 is a positive integer from 1 to 3, and coefficient E2 is an integer from 0 to 5.

In addition, in the present specification, the organopolysiloxane is a general expression for all of the components that satisfy the above general formula [1] when there are multiple components, and in this case, the content of the organopolysiloxane is a value calculated based on the combined value of the multiple types of organopolysiloxane (combined). Similarly, in the present invention, the substance represented by the above general formula [2] is a general expression for all of the components that satisfy the general formula [] when there are multiple components, and in this case, the content of the substance is a value calculated based on the combined value of the multiple types of the substance (combined).

The substance represented by the above general formula [2] has a low viscosity because it is a substance with a small molecular weight, has good dispersibility in the organopolysiloxane composition represented by general formula [1] and other resins, and compatibility can be ensured by selecting the functional group type of ^R4 according to the organopolysiloxane composition and resin to which it is to be applied. In addition, the substance represented by general formula [2] has Si-C bonds and Si-O-Si-C bonds that are not prone to dehydration condensation reactions with catalysts such as acids and bases used in synthesizing the organopolysiloxane, and water, and can maintain its structure even in the organopolysiloxane composition and resin, and also maintains its structure even at high temperatures exceeding 200°C during molding, so that the quality of the molded product is not affected. Furthermore, when an organic solvent is used in the organopolysiloxane composition or resin, it volatilizes at high temperatures exceeding 200° C. that are applied during molding, which can pose a risk of flammable vapor generation or cause local dissolution of the molded article, resulting in a defective appearance. However, the substance represented by general formula [2] has excellent compatibility with the organopolysiloxane composition and will not volatilize even under temperature and pressure conditions that exceed the boiling point of the substance, making it possible to obtain safe molded articles that are free of defective appearances.

<1.1. Organopolysiloxane represented by general formula [1]>
The organopolysiloxane composition contains, as component A, an organopolysiloxane represented by the above general formula [1].
R _X SiO _(4-x)/2 ...[1]

In the general formula [1], the coefficients X are each independently greater than 0, and represent the content of each component of the organic group bonded to silicon or the organic group bonded to oxygen bonded to silicon, and represent the content of each component of the silicon units of M units, D units, T units, and Q units, and represent an organopolysiloxane composed of each component of the organopolysiloxane. R is an organic group. The wording "independently" in the coefficients X indicates that the organopolysiloxane represented by the general formula [1] may be an organopolysiloxane having a plurality of structures satisfying the general formula [1], and therefore, the plurality of structures may be the same or different.

In this specification, an organic group is a functional group that includes carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, phosphorus atoms, sulfur atoms, and halogen atoms, and is composed of any combination of these atoms, and does not include groups that consist of only one hydrogen atom. In addition, an organic group that includes a carbon atom is a functional group that satisfies the above organic group characteristics and includes at least one carbon atom.

Each R is independently selected from the group consisting of an organic group and a hydrogen atom, and the type is not particularly limited, and is selected in consideration of compatibility and reactivity from the viewpoint of mixing or reacting with the resin to be mixed or with an additive used for any purpose, and examples thereof include vinyl groups, allyl groups, (meth)acrylic groups, carboxyl groups, nitrile groups, formyl groups, carbonyl groups, carbinol groups, amino groups, imino groups, nitro groups, cyano groups, sulfo groups, mercapto groups, thiol bonds, ether bonds, ethylene bonds, etc. A combination of functional groups including a ester bond, an amide bond, an alkyl group having 1 to 20 carbon atoms, an aromatic functional group, etc. is preferred. Specific examples of such combinations include a hydrogen atom, a methyl group, an ethyl group, a propyl group, a hexyl group, a decyl group, an octadecyl group, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl ... butyl group, 1,2-epoxycyclohexyl-3-propyl group, 1,2-epoxycyclohexyl-3-octyl group, phenyl group, phenethylene group, styryl group, vinyl group, and allyl group are preferred, and when the polarity of the components to be mixed is low, hydrogen atom, methyl group, ethyl group, cyclopentyl group, cyclohexyl group, 1,2-epoxycyclohexyl-3-propyl group, 1,2-epoxycyclohexyl-3-octyl group, and 1,2-epoxycyclohexyl-3-octyl group are preferred. , and allyl groups are more preferred, and when the polarity of the components to be mixed is high, ethylene glycol monoethylene ether groups, acryloxypropyl groups, acryloxyoctyl groups, methacryloxypropyl groups, methacryloxyoctyl groups, glycidyl groups, glycidoxypropyl groups, glycidoxyoctyl groups, phenyl groups, phenethylene groups, styryl groups, and vinyl groups are even more preferred, and it is preferable to combine them in any ratio according to the resin or resin composition to be mixed.

The following are suitable examples of R when organopolysiloxane is mixed with other resins.

<When the resin to be mixed is mainly composed of dimethylpolysiloxane>
In this case, the resin corresponds to a resin having low polarity, and each R can be preferably independently a hydrogen atom, a methyl group, or a vinyl group.

<When the resin to be mixed is mainly composed of dimethyldiphenylpolysiloxane and methylphenylpolysiloxane>
In this case, the resin corresponds to both a resin with low polarity and a resin with high polarity, and each R preferably independently has a phenyl group, and it is particularly preferable to use a combination of a methyl group and a phenyl group.

<When the resin to be mixed is a resin containing a (meth)acryloyl group>
In this case, the resin corresponds to a resin having high polarity, and R is preferably a combination of an acryloxypropyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidoxypropyl group, a glycidoxyoctyl group, and a methyl group, each of which is independently selected.

<When the resin to be mixed is polycarbonate>
In this case, the resin corresponds to a resin with high polarity, and R is preferably a combination of an ethylene glycol monoethylene ether group, a glycidoxypropyl group, a glycidoxyoctyl group, a phenyl group, a phenethylene group, a styryl group, a vinyl group, or a methyl group, and from the viewpoints of compatibility and heat resistance to heat exceeding 200° C. when mixed with polycarbonate, it is preferable that R contains a methyl group or a phenyl group.

R is a terminal atom of R, and the atom bonded to the silicon atom may be oxygen. In this case, for example, an oxygen atom may be linked between the terminal atom bonded to silicon in the various functional groups exemplified by R above and the silicon. In this case, R may be a group selected from the group consisting of organic groups having 1 to 20 carbon atoms and hydrogen atoms. From the viewpoint of compatibility with resins, hydrogen atoms, methyl groups, ethyl groups, butyl groups, octyl groups, and octadecyl groups are preferred. From the viewpoint of weight changes and volume changes due to dehydration condensation during heating or changes over time, hydrogen atoms and methyl groups are preferred, and hydrogen atoms are particularly preferred. From the viewpoint of stability, methyl groups are preferred, and a combination of methyl groups and hydrogen atoms is also preferred.

The organopolysiloxane represented by the general formula [1] preferably has a group selected from the group consisting of trimethylsiloxy groups, dimethylvinyltrimethylsiloxy groups, and dimethylsiloxy groups, so that it can be handled as a reactive or non-reactive material with excellent stability.

The organopolysiloxane represented by the general formula [1] may be any of M units, D units, T units, and Q units, and the combination of the respective units may be dimethylsiloxane consisting of M units and D units, MT resin consisting of M units and T units, MQ resin consisting of M units and Q units, and similarly may be organosiloxane consisting of silicon units shown below, but it is preferable that the organopolysiloxane represented by the general formula [1] contains dimethylsiloxane or MQ resin, particularly from the viewpoint of ease of handling at room temperature. MDT units, MDQ units, MDTQ units, DT units, DQ units, DTQ units, TQ units.
The M unit is a structural unit represented by R ¹ 'R ² 'R ³ 'SiO _1/2 , the D unit is a structural unit represented by R ⁴ 'R ⁵ 'SiO _2/2 , the T unit is a structural unit represented by R ¹ 'SiO _1/2 , and the Q unit is a structural unit represented by SiO _4/2 . R ¹ ' to R ¹ ' in these structural units can be the same as the conditions for R described above. Organopolysiloxanes that can have these structural units can be represented by the following general formula [A].
(R ¹ 'R ² 'R ³ 'SiO _1/2 ) _M1' (R ⁴ 'R ⁵ 'SiO _2/2 ) _D1' (R ¹ 'SiO _1/2 ) _T1' (SiO _4/2 ) _Q' ...[A]
Here, in the above general formula [A], the coefficients M1', D1', T1', and Q' are each equal to or greater than 0 and equal to or less than 1, and M1'+D1'+T1'+Q'=1 can be satisfied.

The number average molecular weight Mn of the organopolysiloxane composed of the components of the organopolysiloxane represented by the general formula [1], from the viewpoint of expressing the function of the organopolysiloxane in the resin to be mixed and ensuring compatibility with the resin, is usually more than 100 and less than 200,000, but is usually 750 or more, preferably 1,000 or more, and more preferably 6,000 or more, and is usually 100,000 or less, preferably 20,000 or less, and more preferably 10,000 or less.
The number average molecular weight Mn is measured by the method described below.

The molecular weight distribution (Mw/Mn) of the organopolysiloxane represented by general formula [1] is usually 1.01 or more and 10 or less. From the viewpoint of expressing the function of the organopolysiloxane in the resin to be mixed and ensuring compatibility with the resin, it is preferably 1.01 or more, more preferably 1.07 or more, even more preferably 1.2 or more, and particularly preferably 1.4 or more, and is preferably 5 or less, more preferably 4 or less, even more preferably 3 or less, and particularly preferably 2 or less.
The weight average molecular weight Mw is measured by the method described below.

The content of the organopolysiloxane represented by the general formula [1] in the organopolysiloxane composition is usually 90% by weight or more, preferably 91% by weight or more, more preferably 93% by weight or more, and even more preferably 97% by weight or more, from the viewpoint of ensuring the effect of the organopolysiloxane on the resin to which it is added, and is usually less than 100% by weight, preferably 99.5% by weight or less, more preferably 99.4% by weight or less, and even more preferably 98.7% by weight or less.

The form of the organopolysiloxane represented by general formula [1] is not particularly limited, but it is preferably a liquid, and in particular, from the viewpoint of miscibility with component [2], it is preferably a liquid at 40°C.

<1.2. Method for producing organopolysiloxane>
The method for producing an organopolysiloxane according to another embodiment of the present invention (hereinafter also simply referred to as the "method for producing an organopolysiloxane") can be produced using a known method for producing an organopolysiloxane, and can be easily produced by a person skilled in the art.

<1.3. Substance represented by general formula [2]>
The organopolysiloxane composition contains a substance represented by the following general formula [2] as a viscosity modifier.
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2 ...[2]
In the above formula [2],
R ¹ to R ³ are each independently selected from the group consisting of an organic group containing a carbon atom and a hydrogen atom, and may be the same or different.
R ⁴ may be the same or different and is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom.
^R5 is selected from the group consisting of an organic group having 1 to 20 carbon atoms and a hydrogen atom, and may be the same or different; coefficient M2 is a positive integer from 1 to 5, coefficient T2 is a positive integer from 1 to 3, and coefficient E2 is an integer from 0 to 5.

The coefficients T2 and M2 are both greater than or equal to 1, ie, the T2 and M2 units are required.
T2+2-M2+E2=0 means that no cyclic compounds are contained in the siloxane bond. Cyclic compounds exist at T3 or higher, and even cyclic compounds have a viscosity reducing effect, and can be used in fields where the shelf life of the product is not an issue after mixing with a resin. In addition, the viscosity reducing effect of cyclic compounds may change due to ring opening, and therefore it is desirable not to contain them from the viewpoint of product stability, but a small amount may be contained. For organopolysiloxane (component A) represented by general formula [1] (when component A is 100% by weight), T2, M2, and E2
From the above viewpoints, the content of substances for which T2, M2, and E2 do not satisfy T2+2-M2+E2=0 is 0.01% by weight or more and 9% by weight or less, preferably 0.5% by weight or more, more preferably 0.6% by weight or more, even more preferably 1% by weight or more, and preferably 7% by weight or less, more preferably 5% by weight or less, and even more preferably 4% by weight or less. From the above viewpoints, the content of substances for which T2, M2, and E2 do not satisfy T2+2-M2+E2=0 in the organopolysiloxane represented by general formula [1] (component A) is 3% by weight or less, more preferably 0.1% by weight or less, even more preferably 0.01% by weight or less, and most preferably none (0 ppm), but is usually 0% by weight or more, and may be 0.001% by weight or more.

R ¹ to R ⁴ are each independently selected from the group consisting of an organic group containing a carbon atom and a hydrogen atom, and the atom which is the terminal atom of R ¹ to R ⁴ and is bonded to the silicon atom is not particularly limited as long as it is not an oxygen atom in order to avoid changing the classification of the ^M unit and the T unit. ⁴ is selected in consideration of compatibility and reactivity from the viewpoint of mixing and reacting with the organopolysiloxane to be used as the composition, or with the resin to be mixed, or with additives to be used for any purpose, and for example, a combination of functional groups including a vinyl group, an allyl group, a (meth)acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, a thiol bond, an ether bond, an ester bond, an amide bond, an alkyl group having 1 to 20 carbon atoms, an aromatic functional group, or the like is preferred. Specific examples of the functional groups include a hydrogen atom, a methyl group, an ethyl group, a propyl group, a hexyl group, a decyl group, an octadecyl group, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-dimethylamino-2-propanediyl group, a ... In the case where the polarity of the components to be mixed is low, a hydrogen atom, a methyl group, an ethyl group, a cyclopentyl group, a cyclohexyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a 1,2-epoxycyclohexyl-3-octyl group, a 1,2-epoxycyclohexyl-3-octyl group, a allyl group is more preferable. In the case where the polarity of the components to be mixed is high, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a phenyl group, a phenethylene group, a styryl group, a vinyl group is more preferable. It is preferable to combine them in any ratio according to the resin to be mixed.

^R5 is a group selected from the group consisting of organic groups having 1 to 20 carbon atoms and a hydrogen atom. From the viewpoint of compatibility with the resin, it is preferably a hydrogen atom, a methyl group, an ethyl group, a butyl group, an octyl group, or an octadecyl group. From the viewpoint of weight change or volume change due to dehydration condensation upon heating or changes over time, it is preferably a hydrogen atom or a methyl group, and particularly preferably a hydrogen atom. From the viewpoint of stability, it is preferably a methyl group, and a combination of a methyl group and a hydrogen atom is also preferable.

Considering the case where the organopolysiloxane is mixed with other resins, suitable examples of R ¹ to R ⁴ are shown below.

<When the resin to be mixed is mainly composed of dimethylpolysiloxane>
In this case, the resin corresponds to a resin having low polarity, and R ¹ to R ⁴ can each independently be preferably a hydrogen atom, a methyl group, or a vinyl group. In particular, it is more preferable that one of R ¹ to R ³ is a hydrogen atom or a vinyl group and the remaining two are methyl groups, that R ¹ to R ³ are all methyl groups, or any combination thereof. It is also more preferable that R ⁴ is a hydrogen atom, a methyl group, or a vinyl group. When a reaction such as hydrosilylation is involved, a hydrogen atom or a vinyl group is more preferable, and when a reaction is not desired, a methyl group is more preferable from the viewpoint of stability, and it is even more preferable that R ¹ to R ⁴ are all methyl groups.

<When the resin to be mixed is mainly composed of dimethyldiphenylpolysiloxane and methylphenylpolysiloxane>
In this case, the resin corresponds to both the resin with low polarity and the resin with high polarity among the components to be mixed, and it is preferable that R ¹ to R ⁴ are used in combination with methyl groups and phenyl groups, and in particular, it is more preferable that one of R ¹ to R ³ is a hydrogen atom or a vinyl group and the remaining two are methyl groups, that R ^{1 to R 3 are methyl groups, and combinations thereof, and it is more preferable that R 4 is a phenyl group. It is most preferable that R 1 to R 3 are all methyl} groups and R ⁴ is a phenyl group.

<When the resin to be mixed is a resin containing a (meth)acryloyl group>
In this case, the resin corresponds to the resin having a high polarity among the components to be mixed, ^and a ^combination of an acryloxypropyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidoxypropyl group, a glycidoxyoctyl group, and a methyl group can be suitably used for R ¹ to R ^4. In particular, it is more preferable that one of R 1 to R 3 is a hydrogen atom or a vinyl group and the remaining two are methyl groups, that R ¹ to R ³ are methyl groups, and combinations thereof. It is more preferable that R ⁴ is an acryloxypropyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a phenyl group, and combinations thereof. From the viewpoint of increasing hardness such as pencil hardness and Shore hardness, an acryloxypropyl group, a methacryloxypropyl group, or a glycidoxypropyl group is suitable, and from the viewpoint of flexibility and brittleness, a methacryloxyoctyl group or a glycidoxyoctyl group is suitable.

<When the resin to be mixed is polycarbonate>
In this case, the resin corresponds to the resin having a high polarity among the components to be mixed, ^{and a} combination of an ethylene glycol monoethylene ether group, a glycidoxypropyl group, a glycidoxyoctyl group, a phenyl group, a phenethylene group, a styryl group, a vinyl group, and a methyl group can be suitably used for R 1 to R 4. In particular, it is more preferable that one of R ¹ to R ³ is a hydrogen atom, a vinyl group, an ethylene glycol monoethylene ether group, or a glycidoxypropyl group and the remaining two are methyl groups, that R ¹ to R ³ are methyl groups, and combinations thereof, and it is more preferable that R ³ is a phenyl group. From the viewpoint of compatibility and heat resistance to heat exceeding 200°C when mixed with polycarbonate, it is suitable that R ¹ to R ³ are all methyl groups and R ⁴ is a phenyl group.

The substance represented by the general formula [2] may be used alone or in combination with two or more other substances, in particular those having different values of the coefficient M2 and the coefficient T2, or those having different functional groups R ¹ to R ⁴ .

M2 is 1 or more and 5 or less. In the modification of the bonds of the T units, the alkoxy group and silanol group represented by E2 are likely to change by dehydration condensation, but the M units are less likely to undergo silanolization and dehydration condensation associated with elimination. Therefore, from the viewpoint of stability, it is preferable that M2 is larger. Since the maximum value of T2 is 3, when T2 is 3, M2 is preferably 5, when T2 is 2, M2 is preferably 4, and when T2 is 1, M2 is preferably 3, that is, it is preferable that M2 = T2 + 2.
In addition, in the modification of the bonds of the T units, the M units are unlikely to undergo silanol formation and dehydration condensation accompanying elimination, but the alkoxy group and silanol group represented by E2 are easily reacted by dehydration condensation, so from the viewpoint of reactivity, it is preferable that M2 is small, and since the maximum value of T2 is 3, when T2 is 3, M2 is preferably 4 or less, more preferably 2 or less, and even more preferably 1. Also, when T2 is 0, hydrolysis condensation occurs very easily and the viscosity change over time is large, so from the viewpoint of storage stability, M2 is 1 or more; when T2 is 2, M2 is preferably 3 or less, more preferably 2 or less, and even more preferably 1. Also, when T2 is 0, the viscosity change over time is large, so from the viewpoint of storage stability, M2 is 1 or more; when T2 is 1, M2 is preferably 3 or less, more preferably 2 or less, and even more preferably 1. Also, when T2 is 0, the viscosity change over time is large, so from the viewpoint of storage stability, M2 is 1 or more.

T2 is 1 or more and 3 or less, but from the viewpoint of the molecular weight increasing with the number of T units, the viscosity increasing and thus reducing the viscosity reducing effect, or the molecular size increasing and thus reducing dispersibility in the organopolysiloxane to be mixed, it is preferable that T2 is small, preferably 3 or less, more preferably 2 or less, and even more preferably 1. In addition, since the volatility decreases with an increase in the number of T units, low volatility is preferable when process temperatures such as molding temperature and curing temperature are high, and from the viewpoint of volatility, it is preferable that T2 is large, preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more.

The content of the substance represented by general formula [2] in the organopolysiloxane composition is 0.01% by weight or more and 9% by weight or less; from the viewpoint of the viscosity-reducing effect, it is usually 0.1% by weight or more, preferably 0.5% by weight or more, more preferably 1% by weight or more, and even more preferably 2% by weight or more; and from the viewpoint of volatilization during molding or curing, or volatilization over time, it is usually 9% by weight or less, preferably 7% by weight or less, more preferably 5% by weight or less, and even more preferably 3% by weight or less.
Furthermore, in the organopolysiloxane composition, the ratio of the weight of component B to the sum of the weight of component A (organopolysiloxane represented by the above general formula [1]) and the weight of component B (a substance represented by the above general formula [2]) per 100 ({(weight of component B) × 100}/{(weight of component A) + (weight of component B)}) is, from the viewpoint of reducing the viscosity of the organopolysiloxane and the viewpoint of the volatility of component B, 0.1 or more and 9 or less, but is usually 0.5 or more, preferably 0.6 or more, and more preferably 1.3 or more, and is usually 7 or less, preferably 5 or less, and more preferably 3 or less.
In addition, a component that can be considered as both component A and component B will be considered as component B in this specification.

By improving the compatibility between the substance represented by general formula [2] and the organopolysiloxane represented by general formula [1] above, the substance represented by general formula [2] is dispersed uniformly, and the viscosity of the organopolysiloxane composition containing the substance is reduced. Furthermore, if the compatibility is poor, the substance represented by general formula [2] accumulates locally or is emulsified, so the effect of reducing the viscosity of the organopolysiloxane composition containing the substance is not very noticeable, and furthermore, when emulsified, the viscosity may increase.

<1.4. Method for producing the substance represented by general formula [2]>
The method for producing the substance represented by the general formula [2] is not particularly limited, and it can be produced by a known method, and a commercially available product such as tris(trimethylsiloxy)phenylsilane (PTTSS) can also be used. The substance represented by the general formula [2] is a substance that can be contained in the production stage not only when it is intentionally added, but also when it is produced using a material containing M units and T units as a raw material, and it is possible that it may be contained even without being intentionally added during the production of organopolysiloxane. However, the substance represented by the general formula [2] is hated by the relevant traders as a substance that causes a problem of poor electrode contacts (commonly known as the low volatile problem) when a specific organopolysiloxane other than the organopolysiloxane of the general formula [1] is produced, and has been removed to less than 0.1 wt % by distillation such as thin film distillation. In addition,
When producing an organopolysiloxane of general formula [1], the substance of general formula [2] can be produced, making it possible to include the substance without intentionally adding it. In this case, it is possible to adjust the viscosity by adjusting the content of the substance of general formula [2] depending on the purpose. It is also possible to achieve the purpose by analyzing the organopolysiloxane composition by gas chromatography to quantify the content of the substance of general formula [2], and controlling the content of the substance by distillation such as thin-film distillation.

<1.5. Other ingredients>
The organopolysiloxane composition may contain components other than the organopolysiloxane represented by the general formula [1] and the substance represented by the general formula [2] described above. Examples of the other components include a curing catalyst, a chain polymerization initiator, an antioxidant, a filler, a curing agent, and a curing regulator.
There are no particular limitations on the amount of other components contained in the organopolysiloxane composition, and they may be added as desired depending on the purpose, as long as the effects of the present invention are achieved.

(Curing catalyst)
The type of the curing catalyst is not particularly limited, and examples thereof include addition polymerization catalysts and condensation polymerization catalysts.
Examples of the addition polymerization catalyst include platinum-based catalysts such as platinum black, platinic chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohols, complexes of chloroplatinic acid and olefins, platinum bisacetoacetate, platinum (0) complexes with 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, platinum (0) complexes with 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclosiloxane, palladium catalysts, and rhodium catalysts. The amount of the addition polymerization catalyst is usually 1 ppm or more, preferably 2 ppm or more, and usually 100 ppm or less, preferably 50 ppm or less, and more preferably 20 ppm or less, based on the total weight of the organopolysiloxane. This allows the catalyst to have high catalytic activity and high transparency of the cured product. The addition polymerization catalyst may be used alone or in combination of two or more.

Condensation polymerization catalysts that can be used include acids such as hydrochloric acid, nitric acid, sulfuric acid, and organic acids, bases such as ammonia and amines, and metal chelate compounds. A suitable example is a metal chelate compound containing one or more of Ti, Ta, Zr, Al, Hf, Zn, Sn, Pt, and In. Of these, metal chelate compounds that contain one or more of Ti, Al, Zn, Zr, Pt, and In are preferred, and those containing Zr and Pt are even more preferred.

The amount of the condensation polymerization catalyst is usually 1 ppm or more, preferably 2 ppm or more, and usually 300 ppm or less, preferably 200 ppm or less, and more preferably 150 ppm or less, as metal, based on the total weight of the organopolysiloxane. This allows for high catalytic activity and small weight loss when the cured product is heated. The condensation polymerization catalyst may be used alone or in combination of two or more types.

(Chain Polymerization Initiator)
Examples of the chain polymerization initiator include a radical polymerization initiator, a cationic polymerization initiator, and an anionic polymerization initiator. Generally, a radical polymerization initiator is used.

As the radical polymerization initiator, a photopolymerization initiator and a thermal polymerization initiator can be used.
As the photopolymerization initiator, an alkylphenone-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, an intramolecular hydrogen abstraction type photopolymerization initiator, an oxime ester photopolymerization initiator, or the like can be used, and an alkylphenone-based photopolymerization initiator can be preferably used.

As the thermal polymerization initiator, a conventionally known peroxide or azo compound can be used.
Examples of organic peroxides include diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, and silyl peroxides. More specifically, cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, and t-butyl peroxyneodecanoate. peroxy hexane, t-butyl peroxy pivalate, 1,1,3,3-tetramethylbutyl peroxy 2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, t-hexyl peroxy 2-ethylhexanoate, t-butyl peroxy 2-ethylhexanoate, t-butyl peroxy neoheptanoate, t-amyl peroxy 2-ethylhexanoate, di-t-butyl peroxy hexahydroterephthalate, t-amyl peroxy -3,5,5-trimethylhexanoate, 3-hydroxy-1,1-dimethylbutylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-amylperoxyneodecanoate, t-amylperoxy-2-ethylhexanoate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxymaleic acid, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5- Examples of the peroxyalkylene oxide include dimethyl-2,5-di(3-methylbenzoylperoxy)hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butyl peroxybenzoate, dibutyl peroxytrimethyladipate, t-amyl peroxy normal octoate, t-amyl peroxy isononanoate, t-amyl peroxybenzoate, and lauroyl peroxide.

Examples of azo compounds include 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis(1-acetoxy-1-phenylethane), 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), dimethyl-2,2'-azobisisobutyronitrile, 4,4'-azobis(4-cyanovaleric acid), and 1,1'-azobis(1-cyclohexanecarbonitrile).

The radical polymerization initiator may be used alone or in combination of two or more.

(Antioxidants)
The curable composition preferably further contains an antioxidant, which can suppress discoloration of the cured product due to heat, such as solder reflow.
Specific examples of the antioxidant include phenol-based antioxidants such as 2,6-di-t-butylphenol, 2,6-di-t-butyl-p-cresol, n-octadecyl-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate, tetrakis-[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane, triethylene glycol bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]. antioxidants; phosphorus-based antioxidants such as triphenyl phosphite, tris-isodecyl phosphite, tris-tridecyl phosphite, tris(2,4-di-t-butylphenyl)phosphite, and tetra(C12-15 alkyl)-4,4'-isopropylidenediphenyl diphosphite; and sulfur-based antioxidants such as dilauryl-3,3'-thiodipropionate, ditridecyl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearal-3,3'-thiodipropionate, and pentaerythritol tetrakis(β-laurylthiopropionate). These antioxidants may be used alone or in combination of two or more.

2. Method for Producing Organopolysiloxane Composition
The method for producing the organopolysiloxane composition is not particularly limited, and the organopolysiloxane composition can be produced by mixing the organopolysiloxane represented by the above-mentioned general formula [1], the substance represented by general formula [2], and other components as optional components. In addition, when the substance represented by general formula [2] is produced in the production stage of the organopolysiloxane, it is not necessary to add the substance from the outside, and since the substance is contained in the composition obtained in the final stage of the production of the organopolysiloxane, this can be used as the organopolysiloxane composition.

3. Characteristics of the Organopolysiloxane Composition
The properties of the organopolysiloxane composition will now be described.

(1) ^1H -NMR
The amount of functional groups in the organopolysiloxane can be measured by ¹ H-NMR, using the following method.
Approximately 50 mg of organopolysiloxane or a composition containing it is weighed out and dissolved in approximately 1 g of deuterated acetone or deuterated dichloromethane to prepare a sample for ¹ H-NMR measurement. Using this sample for measurement, a relaxation delay of 20 seconds is measured using a 400 MHz ¹ H-NMR (e.g., AL-400 manufactured by JEOL Ltd.), and the ratio of the signal intensity of each component to the signal intensity of the internal standard and the proportion of functional groups (e.g., phenyl groups, methyl groups, and organoxy groups) are calculated from the weighed values.
In the above measurements, impurities such as organic matter, water, and metals not bonded to organopolysiloxane must be removed to less than 0.1% by weight so as not to affect the measurement results. If the amount exceeds 0.1% by weight, the impurities are removed by distillation, filtration, or other purification methods, and then the sample is prepared and ¹ H-NMR is measured. If it is difficult to remove the impurities, the content of the impurities is calculated by ¹ H-NMR measurement or other analytical methods, and the weight of the impurities is subtracted from the weight of the weighed sample to be used as the true sample amount in the calculations, so as not to calculate the impurities as part of the organopolysiloxane. In addition to toluene, any substance that does not react with organopolysiloxane, such as N,N-dimethylformamide or tetrabromoethane, can be used as the internal standard.

(2) ²⁹ Si-NMR
By using ²⁹ Si-NMR, the values of M, D, T, and Q in the organopolysiloxane represented by the above general formula [1] can be calculated. The calculation method is as follows.
Tris(2,4-pentanedionate)chromium III is added to deuterated chloroform to a concentration of 0.5% by mass to obtain a solvent for ²⁹ Si-NMR measurement. Next, the organopolysiloxane to be measured or a composition containing the same is Approximately 1.5 g was weighed out, and 2.5 mL of the above-mentioned ²⁹ Si-NMR measurement solvent was added to dissolve it ^, and the solution was placed in a 10 mm diameter Teflon (registered trademark) NMR sample tube. The measurement was performed using a 300-millimeter (JNM-ECS400, TUNABLE(10), Si-free, AT10 probe) manufactured by JNM-ECS400 manufactured by JNM-ECS400, TUNABLE(10), Si-free, AT10 probe, under the following measurement conditions. From the signal intensity ratio, M in the organopolysiloxane represented by the above general formula [1], The values of D, T and Q are calculated.
Measurement conditions: Relaxation Delay/15 seconds, SCAN count/1024 times, Measurement mode/Non-gated decoupled pulse method (NNE), Spin/None, Measurement temperature/25° C.

(3) Gel permeation chromatography (GPC)
The number average molecular weight (Mn) and weight average molecular weight (Mw) of the organopolysiloxane can be calculated by gel permeation chromatography (GPC) according to the following method.
Organopolysiloxane or a composition containing the same is measured under the following conditions using GPC (for example, an apparatus such as TOSOH HLC-8420GPC manufactured by Tosoh Corporation, and columns such as KF-G, KF-402.5HQ, KF-402HQ, and KF-401HQ manufactured by Showa Denko K.K.), and the values are calculated in terms of standard polystyrene. The sample used is a tetrahydrofuran solution of about 10% by weight, which is filtered through a 0.45 μm filter before measurement.
Column temperature: 40°C
Eluent: tetrahydrofuran, flow rate 0.3 mL/min

(4) Gas chromatography (GC)
The amount of remaining organic solvent in an organopolysiloxane or a composition containing the same, and the content of the substance represented by general formula [2] can be measured by gas chromatography (GC). The measurement method is as follows.
Organopolysiloxane or a composition containing it is measured under the following conditions using GC (for example, an apparatus such as a 7820A gas chromatograph manufactured by Agilent Technologies, Inc., and a column such as a DB-17ht, 0.25 mm×30 m×0.15 μm, also manufactured by Agilent Technologies, Inc.). A tetrahydrofuran solution of about 50% by mass is used as the sample, and an internal standard substance selected according to the purpose, such as methylcyclopentane, toluene, or tridecane, is used.
<Setting conditions>
Inlet: 290°C
Pressure: 21.76 psi (constant pressure)
Oven program: 65°C (2min Hold) → 20°C/min → 325°C (40min Hold) (Total 55min)
Split ratio: 1/70
Injection volume: 0.5 μL
Detector: 290°C
<Carrier gas>
Air flow rate: 350mL/min
_H2 flow rate: 35ml/mi
He flow rate:

(5) Solvent Turbidity Test The method for evaluating the mixing and dispersibility of an organopolysiloxane or a composition containing the same with a resin is as follows.
As the organic solvent, 11 g of tetraglyme to which water had been added so that the water content was 10.5% by weight was prepared. This organic solvent and 1 g of organopolysiloxane were mixed and stirred at 25° C., and a transparent solution was judged to have good mixing and dispersibility in the resin, while a cloudy solution was judged to have poor mixing and dispersibility in the resin.
The purity of the tetraglyme used is confirmed to be 99.8% or more by gas chromatography, and the water content is confirmed by a Karl Fischer water content analyzer.

(6) Low-boiling point component confirmation test It is preferable that the amount of organopolysiloxane in the organopolysiloxane composition is constant, that is, the organopolysiloxane composition is stable.As a method for evaluating the stability of this organopolysiloxane, a method is adopted in which 200 g of the organopolysiloxane composition is placed in a 1 L eggplant flask, and heated for 2 hours at an internal temperature of 110° C. under reduced pressure using a vacuum pump with an exhaust capacity of a vacuum pressure of 0.15 torr, and the mass loss of the organopolysiloxane is evaluated.The loss is preferably 10 g or less, more preferably 5 g or less, and even more preferably 2 g or less, and it is particularly preferable that no loss is observed (below the detection limit). By making the weight loss amount under the above conditions equal to or less than the upper limit, the amount of volatilization of the substance represented by the general formula [2] during heat kneading with the resin is small, so that the resin and the desired organopolysiloxane composition can be uniformly dispersed, and the fluctuation in the content of the substance represented by the general formula [2] for each product lot can be suppressed. In addition, the flash point of the components contained in the organopolysiloxane can be kept relatively high, and the risk of a low flash point, which is difficult to handle safely under normal conditions, can be avoided. In addition, since the Fire Service Act hazard classification is classified as a lower or higher hazard, the cost of storage and transportation can be reduced. In addition, since the weight loss amount of the cured product during curing is also small, the temperature dependency of the storage elastic modulus of the cured product is small, the usable temperature range is wide, and embrittlement due to thinning is unlikely to occur. In addition, since the smaller the weight loss amount, the easier it is to obtain the above advantages, there is no preferable lower limit for the weight loss amount, but it is usually 0.0001 g or more.

The weight loss upon heating under reduced pressure can be measured as follows.
The organopolysiloxane composition is used as the measurement subject, and ¹ H-NMR is measured to calculate the weight of components other than the organic solvent, organopolysiloxane, and the substance represented by the general formula [2]. Specifically, a rotor is placed in an eggplant-shaped flask, and their weights are measured. Then, the organopolysiloxane composition is placed in the eggplant-shaped flask, and the weight of the organopolysiloxane composition is measured. The eggplant-shaped flask is heated in an oil bath, the rotor is rotated by a magnetic stirrer to stir the liquid surface to a degree that causes it to flow, and the pressure is reduced by an oil-type vacuum pump. After 2 hours, the flask is cooled to room temperature, the pressure is returned to normal pressure, the oil adhering to the eggplant-shaped flask is thoroughly wiped off, and the weight of the organopolysiloxane composition in the eggplant-shaped flask is measured, and the weight of the organopolysiloxane composition that has been previously measured and the rotor weight are subtracted to calculate the weight that has evaporated by this operation. ^{The 1} H-NMR of the organopolysiloxane composition after this operation is measured, and the weight of the organic solvent, organopolysiloxane, and other components is calculated. The amount of components other than organopolysiloxane and the amount of volatilized organopolysiloxane are calculated from the weight loss before and after the procedure and the results of ¹ H-NMR and gas chromatography measurements. Alternatively, the entire amount of the volatilized distillate may be recovered using a cold trap or the like, and the weight and ¹ H-NMR and gas chromatography measurements may be performed.

(7) Colorability when heated at 250° C. Colorability was evaluated by adding 10 mg of a composition containing an organopolysiloxane to a hot plate heated to 250° C. and visually checking the colorability after 10 minutes.

(8) Viscosity The viscosity is measured at a temperature of 25° C. using a viscometer (for example, an RV-type viscometer RVDV-2+Pro manufactured by Brookfield) with the organopolysiloxane composition as the measurement object.

<4. Uses>
The applications of the above-mentioned organopolysiloxane composition and the above-mentioned organopolysiloxane represented by the general formula [1] are not particularly limited, and they can be used, for example, in the applications shown below.

[Resin composition]
The organopolysiloxane composition can be used as a resin composition in combination with other resins. The resin composition may contain the above-mentioned organopolysiloxane composition, and may be, for example, an embodiment in which the organopolysiloxane composition is added to a composition containing a resin, or an embodiment in which a resin is added to an organopolysiloxane composition.
The manner of use of the resin composition is not particularly limited, and the resin composition may be used in the form of a composition itself, or may be used in the form of a cured product obtained by curing the composition.

The type of resin contained in the resin composition containing the organopolysiloxane composition is not particularly limited, and examples include organopolysiloxane composition, acrylic resin, polyolefin resin, polyvinyl chloride resin, polyester resin, polypropylene resin, polyethylene resin, polycarbonate resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polyamide resin, PEEK resin, polyacetal resin, polyvinyl alcohol resin, epoxy resin, etc., but in LED lighting applications that require colorless transparency, heat resistance, light resistance, and low volatile components over time, It is suitable for use in organopolysiloxane compositions and epoxy resins because it can be incorporated without impairing performance, and is suitable for use in acrylic resins for camera lens applications that require colorless transparency, high Abbe and high refractive index, high glass transition temperature, heat resistance, and light resistance because it can be incorporated without impairing performance, and is suitable for use in polycarbonate resins that require colorless transparency, heat resistance during kneading, and flame retardancy due to the promotion of char formation, and is suitable for use in epoxy resins for 3D applications that require colorless transparency, low viscosity, and short-term effectiveness.

The content of the organopolysiloxane composition in the resin composition is not particularly limited, but from the viewpoint of imparting a certain function without changing the basic physical properties of the resin, it is preferable to add a very small amount, usually 0.01% by weight or more, preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and usually 5% by weight or less, preferably 3% by weight or less, and more preferably 1% by weight or less. On the other hand, from the viewpoint of slightly changing the basic physical properties of the resin, it is preferable to add a small amount, usually 5% by weight or more, preferably 7% by weight or more, more preferably 10% by weight or more, and usually 20% by weight or less, preferably 17% by weight or less, and more preferably 15% by weight or less, and from the viewpoint of significantly changing the basic physical properties of the resin, it is 20% by weight or more, preferably 25% by weight or more, more preferably 30% by weight or more, and even more preferably 50% by weight or more, and usually 99% by weight or less, preferably 75% by weight or less, and more preferably 60% by weight or less.

[Organic solvent diluent]
The organopolysiloxane composition can be used as an organic solvent dilution liquid in combination with an organic solvent. The organic solvent dilution liquid may contain the above-mentioned organopolysiloxane composition, and may be, for example, an embodiment in which the organopolysiloxane composition is added to a composition containing an organic solvent, or an embodiment in which an organic solvent is added to the organopolysiloxane composition.
The type of organic solvent contained in the organic solvent dilution solution containing the organopolysiloxane composition is not particularly limited and may be selected arbitrarily. For example, a work-in-progress in which the organic solvent remains or one in which the organic solvent has been intentionally dissolved may be transferred to a container, sold, transported, or introduced into a reactor containing other substances.

[Electronic device components]
The organopolysiloxane composition and its cured product, and the resin containing the organopolysiloxane composition and its cured product can be used in electronic equipment members. Examples of electronic equipment members include LED lighting sealants and LED-related parts in which organopolysiloxane is used, covers for LED lighting, lens and camera members, smartphone cover members, voltage resistance improvers for electrolytic capacitors, members expressing a clicking sensation under the keys of a personal computer keyboard, and sealants for power device modules. The electronic equipment members may be in an embodiment consisting of only the cured product of the organopolysiloxane composition, or may be in an embodiment containing a part of the cured product of the organopolysiloxane composition.
The conditions for curing the organopolysiloxane composition are not particularly limited, and the composition can be cured by a known method.

The content of the organopolysiloxane composition in electronic device components is not particularly limited, but from the viewpoint of imparting certain functions without changing the basic physical properties of the resin used in the components, it is preferable to add a very small amount, which is usually 0.01% by weight or more, preferably 0.1% by weight or more, and more preferably 0.5% by weight or more, and is usually 5% by weight or less, preferably 3% by weight or less, and more preferably 1% by weight or less. Examples of this include cover components for LED lighting and cover components for smartphones. On the other hand, from the viewpoint of slightly changing the basic physical properties of the resin used in the component, it is preferable to add a small amount, usually 5% by weight or more, preferably 7% by weight or more, more preferably 10% by weight or more, and usually 20% by weight or less, preferably 17% by weight or less, more preferably 15% by weight or less, which corresponds to sealing materials for LED lighting and sealing materials for power device modules, and from the viewpoint of significantly changing the basic physical properties of the resin used in the component, it is 20% by weight or more, preferably 25% by weight or more, more preferably 30% by weight or more, even more preferably 50% by weight or more, and usually 99% by weight or less, preferably 75% by weight or less, more preferably 60% by weight or less, which corresponds to lenses and camera components.

<Other uses>
In addition to the uses described above, the organopolysiloxane composition can be used for other uses, such as a non-reactive viscosity modifier, a reactive viscosity modifier, a compatibilizer, a lubricant, a dispersant, a flocculating agent, an adhesive, a pressure-sensitive adhesive, a release agent, a water repellent, an oil repellent, a coating agent, a surface modifier, a metal surface repair agent, a flame retardant, an agent for reducing squeak noise, a sealing material or substrate for semiconductor devices including inorganic or organic light-emitting elements, a coating material, and an optical component.

The present invention will be described in more detail below with reference to examples, but the present invention should not be construed as being limited to the following examples.
In the following description, "parts" refers to "parts by weight" based on weight unless otherwise specified.

<Method of Evaluating Organopolysiloxane Composition>
The organopolysiloxane and/or organopolysiloxane composition were evaluated by the following methods.

(1) ^1H -NMR
Approximately 50 mg of the resulting organopolysiloxane was weighed out and dissolved in approximately 1 g of deuterated acetone or deuterated dichloromethane to prepare a sample for ¹ H-NMR measurement. The relaxation delay was measured with a 400 MHz ¹ H-NMR (AL-400 manufactured by JEOL Ltd.) with a 20 second relaxation delay, and the proportions of phenyl groups, methyl groups, and organoxy groups were calculated from the ratio of the signal intensity of each component to the signal intensity of the internal standard and the weighed values.

(2) ²⁹ Si-NMR
Tris(2,4-pentanedionate)chromium III was added to deuterated chloroform to give a concentration of 0.5% by mass to obtain a solvent for ²⁹ Si-NMR measurement. The mixture was dissolved in 2.5 mL of a solvent for ²⁹ Si-NMR measurement, and placed in a 10 mm diameter Teflon (registered trademark) NMR sample tube. Measurement was performed using the following equipment and conditions, and the compound represented by the above general formula [ The values of M, D, T and Q in the organopolysiloxane represented by the formula [1] were calculated.
Apparatus: JNM-ECS400 manufactured by JEOL Ltd., TUNABLE (10), Si-free, AT10 probe Measurement conditions: Relaxation Delay/15 seconds, SCAN count/1024 times, Measurement mode/non-gated decoupled pulse method (NNE), Spin/ None, measurement temperature: 25°C

(3) Gel permeation chromatography (GPC)
The number average molecular weight (Mn), weight average molecular weight (Mw), and molecular weight distribution (Mw/Mn) of organopolysiloxanes were measured by gel permeation chromatography (GPC) under the following conditions, and are shown as values converted into standard polystyrene. The sample used was a 10% by weight tetrahydrofuran solution, which was filtered through a 0.45 μm filter before measurement.
Apparatus: TOSOH HLC-8420GPC (manufactured by Tosoh Corporation)
Column: KF-G, KF-402.5HQ, KF-402HQ, KF-401HQ (all manufactured by Showa Denko K.K.), column temperature 40°C
Eluent: tetrahydrofuran, flow rate 0.3 mL/min

(4) Gas chromatography (GC)
The amount of organic solvent remaining in the organopolysiloxane and the content of the substance represented by the general formula [2] were measured using gas chromatography (GC) under the following conditions: A tetrahydrofuran solution of about 50% by mass was used as the sample, and methylcyclopentane was used as the internal standard substance.
Apparatus: 7820A gas chromatograph manufactured by Agilent Technologies, Inc. Column: DB-17ht, 0.25 mm x 30 m x 0.15 μm manufactured by Agilent Technologies, Inc.
Set temperature etc.・Inlet: 290℃
Pressure: 21.76 psi (constant pressure)
Oven program: 65°C (2min Hold) → 20°C/min → 325°C (40min Hold) (Total 55min)
Split ratio: 1/70
Injection volume: 0.5 μL
Detector: 290°C
<Carrier gas>
Air flow rate 350ml/min
_H2 flow rate: 35mL/min
He flow rate: 20mL/min

(5) Solvent turbidity test In order to evaluate the mixing and dispersibility of organopolysiloxane with resin, a mixing test with an organic solvent was carried out. As an organic solvent, 11 g of tetraglyme with water added so that the water content was 10.5 wt % was prepared, and the organic solvent and 1 g of organopolysiloxane were mixed and stirred at 25° C. Transparent organic solvents were judged to have good mixing and dispersibility in resin, and cloudy organic solvents were judged to have poor mixing and dispersibility in resin.

(6) Low-boiling point component confirmation test 200 g of the organopolysiloxane composition was placed in a 1 L eggplant-shaped flask and heated for 2 hours at an internal temperature of 110° C. under reduced pressure using a vacuum pump with an exhaust capacity of 0.15 torr, and the mass loss rate was confirmed using a balance. A mass loss rate of 5% by weight or less was determined to have no effect on moldability, and a weight loss rate of more than 5% by weight was determined to have an effect on moldability.
The weight loss during heating under reduced pressure was measured by the following method.
The organopolysiloxane composition was used as the measurement subject, and ¹ H-NMR was measured to calculate the weight of the organic solvent and other components other than the organopolysiloxane. Specifically, a rotor was placed in an eggplant-shaped flask, and their weights were measured. Then, the organopolysiloxane composition was placed in the eggplant-shaped flask, and the weight of the organopolysiloxane composition was measured. The eggplant-shaped flask was heated in an oil bath, the rotor was rotated by a magnetic stirrer to stir the liquid surface to a degree that it flowed, and the pressure was reduced by an oil-type vacuum pump. After 2 hours, the flask was cooled to room temperature, the pressure was returned to normal pressure, the oil adhering to the eggplant-shaped flask was thoroughly wiped off, and the weight of the organopolysiloxane composition in the eggplant-shaped flask was measured, and the weight of the eggplant-shaped flask and the rotor that had been measured earlier was subtracted to calculate the weight that had evaporated by the operation. ^{The 1} H-NMR of the organopolysiloxane composition after the operation was measured, and the weight of the organic solvent and other components other than the organopolysiloxane was calculated. From the weight loss before and after the procedure and the results of ¹ H-NMR measurements, the amounts of components other than organopolysiloxane and the amount of organopolysiloxane that had volatilized were calculated from the weight that had volatilized.

(7) Coloration upon heating at 250° C. 10 mg of organopolysiloxane was added to a hot plate heated to 250° C., and the coloration after 10 minutes was visually confirmed.

(8) Viscosity The viscosity was measured at 25° C. using an RV-type viscometer RVDV-2+Pro manufactured by Brookfield Instruments, with the organopolysiloxane composition as the measurement subject.

<Raw materials used in the production of organopolysiloxane>
The raw materials used in the production of the organopolysiloxane are shown below.
Hexamethyldisiloxane (manufactured by NuSil Technology)
- Phenyltrimethoxysilane (KBM-103, manufactured by Shin-Etsu Chemical Co., Ltd.)
- Toluene (Kishida Chemical Co., Ltd.)
・Methanol (Kishida Chemical Co., Ltd.)
・Heptane (Kishida Chemical Co., Ltd.)
・1N hydrochloric acid (Kishida Chemical Co., Ltd.)
・2N potassium hydroxide aqueous solution (Kishida Chemical Co., Ltd.)

<Production Example 1 (Production Method of Organopolysiloxane Composition 1)>
32 parts of hexamethyldisiloxane, 73 parts of phenyltrimethoxysilane, 19 parts of toluene and 19 parts of methanol as the raw materials for organopolysiloxane 1, 15 parts of 1N hydrochloric acid as the catalyst and reaction substrate were used, and hydrolysis and condensation were carried out at 40°C for 7 hours. 13 parts of 2N potassium hydroxide aqueous solution were added, and the reaction was further carried out at 40°C for 2 hours. After removing the potassium component by washing with hydrochloric acid and demineralized water, low boiling point components such as the solvent were distilled off while heating to 80°C using a diaphragm pump. At this time, toluene, methanol, and water were removed to obtain an organopolysiloxane composition. It was confirmed by gas chromatography that the organopolysiloxane composition contained about 3% by weight of tris(trimethylsilyloxy)phenylsilane, which corresponds to the substance represented by the general formula [2]. Thereafter, while heating to a high temperature of 120 to 140° C., distillation was continued under high vacuum conditions until toluene peaks were no longer detected, yielding Organopolysiloxane Composition 1 which is liquid at room temperature.

The molecular weight of the resulting organopolysiloxane composition 1 was measured, and it was found that the polystyrene-equivalent number average molecular weight (Mn) was 890, the weight average molecular weight (Mw) was 955, and the molecular weight distribution (Mw/Mn) was 1.07.
Furthermore, ^{the 1} H-NMR analysis revealed that the amount of phenyl groups was 5.0 mmol/g, the amount of trimethylsiloxy groups was 4.4 mmol/g, and the amount of methoxy groups was 0.3 mmol/g. The ²⁹ Si-NMR measurement confirmed that the values of the silicon structural units M, D, T, and Q were M=0.46, D=0, T=0.54, and Q=0, respectively.
Furthermore, gas chromatography confirmed that this organopolysiloxane composition contained no detectable amounts of methanol or toluene, which were used as solvents, and contained 2.1% by weight of tris(trimethylsilyloxy)phenylsilane, which was confirmed to contain a substance of general formula [2] in which ^R4 is a phenyl group, ^R1 to ^R3 are methyl groups, and coefficients T2=1, M2=3, and E2=0.

<Production Example 2 (Production Method of Organopolysiloxane Composition 2)>
The distillation operation was continued under high temperature and high vacuum conditions for organopolysiloxane composition 1, to obtain organopolysiloxane composition 2. Tris(trimethylsilyloxy)phenylsilane, which corresponds to the substance of general formula [2], was not detected from organopolysiloxane composition 2 by gas chromatography. The molecular weight of the obtained organopolysiloxane composition 2 was measured, and the polystyrene-equivalent number average molecular weight (Mn) was 901, the weight average molecular weight (Mw) was 960, and the molecular weight distribution (Mw/Mn) was 1.07. Furthermore, the analysis by ¹ H-NMR showed that the amount of phenyl groups was 5.1 mmol/g, the amount of trimethylsiloxy groups was 4.3 mmol/g, and the amount of methoxy groups was 0.26 mmol/g.

<Production Example 3 (Production Method of Organopolysiloxane Composition 3)>
Organopolysiloxane composition 3 was produced under the same production conditions as in Production Example 1, except that the stirring efficiency during the reaction was improved. The molecular weight of the obtained organopolysiloxane composition 3 was measured, and it was confirmed that the number average molecular weight (Mn) was 905, the weight average molecular weight (Mw) was 976, and the molecular weight distribution (Mw/Mn) was 1.08, calculated based on polystyrene. Furthermore, the analysis by ¹ H-NMR revealed that the amount of phenyl groups was 5.2 mmol/g, the amount of trimethylsiloxy groups was 4.2 mmol/g, and the amount of methoxy groups was 0.31 mmol/g. Furthermore, it was confirmed by gas chromatography that methanol and toluene used as the solvent were not detected in this organopolysiloxane composition 3, and that it contained 0.6 wt % of tris(trimethylsilyloxy)phenylsilane. This means that it contains a substance in which, in the general formula [2], R ⁴ is a phenyl group, R ¹ to R ³ are methyl groups, and coefficients T2=1 and M2=3.

<Production Example 4 (Production Method of Organopolysiloxane Composition 4)>
Organopolysiloxane composition 4 was produced under the same production conditions as in Production Example 1, except that the reaction time was 21 hours. The molecular weight of the obtained organopolysiloxane composition 4 was measured, and it was confirmed that the number average molecular weight (Mn) was 926, the weight average molecular weight (Mw) was 1059, and the molecular weight distribution (Mw/Mn) was 1.14, calculated based on polystyrene. In addition, the analysis by ¹ H-NMR showed that the amount of phenyl groups was 5.2 mmol/g, the amount of trimethylsiloxy groups was 4.1 mmol/g, and the amount of methoxy groups was 0.27 mmol/g. In addition, it was confirmed by gas chromatography that the methanol and toluene used as the solvents were not detected in this organopolysiloxane composition, and that the organopolysiloxane composition contained 1.3 wt % tris(trimethylsilyloxy)phenylsilane. This is because, in the general formula [2], R ⁴ is a phenyl group, R ¹ to R ³ are methyl groups, coefficients T2=1, M2=3,
This means that it contains a substance with E2=0.

The evaluation results of the organopolysiloxane and composition produced by the above manufacturing method are shown in the table below. Tris(trimethylsilyloxy)phenylsilane is referred to as PTTSS in the table.

<Production Example 5 (Production Method of Organopolysiloxane Composition 5)>
Organopolysiloxane composition 5 was produced under the same production conditions as in Production Example 1, except that when producing based on Production Example 1, the organopolysiloxane composition prior to the step of distilling off the solvent was designated as work-in-progress 5, and potassium hydroxide was distilled off while still adhering to the inside of the kettle in the step of distilling off the solvent from work-in-progress 5.
The molecular weight of the obtained organopolysiloxane composition 5 was measured, and the polystyrene-equivalent number average molecular weight (Mn) was 937, the weight average molecular weight (Mw) was 1049, and the molecular weight distribution (Mw/Mn) was 1.12. Furthermore, the results of 1H-NMR analysis showed that the amount of phenyl groups was 5.1 mmol/g, the amount of trimethylsiloxy groups was 4.4 mmol/g, and the amount of methoxy groups was 0.31 mmol/g. Furthermore, gas chromatography showed that the organopolysiloxane composition contained 1.8% by weight of tris(trimethylsilyloxy)phenylsilane, and no methanol or toluene was detected as the solvent. This means that the organopolysiloxane composition contains a substance in which, in the general formula [2], R ⁴ is a phenyl group, R ¹ to R ³ are methyl groups, and coefficients T2=1, M2=3, and E2=0.

<Production Example 6 (Production Method of Organopolysiloxane Composition 6)>
To work-in-progress 5, potassium hydroxide was added so that the concentration was 2 ppm, and the steps after distillation were carried out under the same production conditions as in Production Example 1, thereby producing organopolysiloxane composition 6.
The molecular weight of the resulting organopolysiloxane composition 6 was measured, and the polystyrene-equivalent number average molecular weight (Mn) was 963, the weight average molecular weight (Mw) was 1,118, and the molecular weight distribution (Mw/Mn) was 1.16.

<Production Example 7 (Production Method of Organopolysiloxane Composition 7)>
Organopolysiloxane Composition 7 was produced under the same production conditions as in Production Example 6, except that the potassium hydroxide concentration in Work in Process 5 was 0.2 ppm.
The molecular weight of the resulting organopolysiloxane composition 7 was measured, and the polystyrene-equivalent number average molecular weight (Mn) was 899, the weight average molecular weight (Mw) was 965, and the molecular weight distribution (Mw/Mn) was 1.07.

The evaluation results of the organopolysiloxane compositions used in the examples are shown in Tables 2 to 4. In the examples, PTTSS stands for tris(trimethylsiloxy)phenylsilane.

From Table 2, it was suggested that the viscosity can be adjusted by adding a substance represented by general formula [2] to an organopolysiloxane composition consisting of general formula [1], or by leaving it as an organopolysiloxane composition, and that the substance has transparent mixing with resin, no odor, and no coloring when heated. Even if it contains 7.5% by weight, the amount of low-boiling point components volatilized is small, and it does not affect the process during molding or the deterioration of the properties of the molded product, but if it contains 10% by weight or more, the amount of volatilization increases and may become a problem. In addition, when toluene is used as a solvent, even if it is 5% by weight, the entire amount volatilizes, suggesting that the use of a general organic solvent will have a large adverse effect even if the viscosity can be reduced, and it was surprisingly found that the substance represented by general formula [2] has a very low volatilization rate from the organopolysiloxane composition consisting of general formula [1].

Table 3 shows that it is possible to adjust the viscosity by adding a component represented by general formula [2] to a high-viscosity organopolysiloxane composition represented by general formula [1]. In addition, the results of the solvent clouding test suggest that it can be mixed with resin without affecting its mixability.

From Tables 4 and 5, it was found that in the method for producing organopolysiloxane, when potassium hydroxide is included during the heating operation, the molecular weight and molecular weight distribution increase and the compatibility with the resin changes depending on the content. The content of potassium hydroxide in the organopolysiloxane composition is preferably 2 ppm or less, and more preferably 0.2 ppm or less. On the other hand, if it is desired to express the function by adjusting the dispersibility with the resin, it is also possible to adjust the molecular weight by increasing the potassium hydroxide content, and in that case, as shown in Table 3, it was suggested that the substance represented by general formula [2] does not change the mixed dispersibility.

As described above, the present invention can provide an organopolysiloxane composition that has low viscosity and excellent dispersibility in various resins.

Claims (20)

A resin composition comprising an organopolysiloxane composition and another resin,
The organopolysiloxane composition comprises:
Component A is an organopolysiloxane represented by the following general formula [1] and having silicon units selected from the group consisting of MD units, MT units, MQ units, MDT units, MDQ units, MDTQ units, DT units, DQ units, DTQ units, and TQ units;
Component B includes a substance represented by the following general formula [2],
The component A and the component B are
0.1≦{(weight of component B)×100}/{(weight of component A)+(weight of component B)}≦9
and
For component A,
The content of the substance in which the coefficients T2, M2, and E2 in the formula [2] satisfy T2+2-M2+E2=0 is 0.01% by weight or more and 9% by weight or less,
A resin composition, characterized in that the content of a substance in which the coefficients T2, M2, and E2 in the formula [2] do not satisfy T2+2-M2+E2=0 is 3% by weight or less:
R _X SiO _(4-X)/2 ...[1]
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2
...[2]
Here, in the above formula [1],
R each independently has an atom or group selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group; and coefficients X each independently satisfy 0<X≦3;
Here, in the above formula [2],
R ¹ to R ⁴ are each independently selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group, and may be the same or different.
^R5 is selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a butyl group, an octyl group, and an octadecyl group, and may be the same or different;
The coefficient M2 is a positive integer between 1 and 5; the coefficient T2 is a positive integer between 1 and 3; and the coefficient E2 is an integer between 0 and 5. The resin composition according to claim 1, characterized in that the organopolysiloxane contains dimethylpolysiloxane or MQ resin. The resin composition according to claim 1 or 2, characterized in that the organopolysiloxane has a group selected from the group consisting of a trimethylsiloxy group, a dimethylvinyltrimethylsiloxy group, and a dimethylsiloxy group. The resin composition according to any one of claims 1 to 3, characterized in that the organopolysiloxane has a phenyl group. The resin composition according to any one of claims 1 to 4, characterized in that when 200 g of the organopolysiloxane composition is placed in a 1 L eggplant-shaped flask and heated for 2 hours at an internal temperature of 110°C under reduced pressure using a vacuum pump with an exhaust capacity of 0.15 torr, the mass loss of the organopolysiloxane is 10 g or less. The resin composition according to any one of claims 1 to 5, characterized in that the organopolysiloxane is liquid at 40°C. The resin composition according to any one of claims 1 to 6, characterized in that the number average molecular weight Mn of the organopolysiloxane is 750 or more and 10,000 or less. The resin composition according to any one of claims 1 to 7, characterized in that the ratio of the weight average molecular weight Mw to the number average molecular weight Mn of the organopolysiloxane (molecular weight distribution: Mw/Mn) is 1.01 or more and 5 or less. The resin composition according to any one of claims 1 to 8, wherein in the general formula [2], R ⁴ is a phenyl group. The resin composition according to any one of claims 1 to 9, wherein in the general formula [2], R ¹ to R ³ are methyl groups. The resin composition according to any one of claims 1 to 10, characterized in that the substance represented by the general formula [2] contains a substance whose coefficient T2 is 1. The resin composition according to any one of claims 1 to 11, characterized in that the substance represented by the general formula [2] contains a substance in which the coefficient M2 is 3. The resin composition according to any one of claims 1 to 12, characterized in that the content of the substance represented by the general formula [2] in the organopolysiloxane composition is 0.5 to 3 wt %. The resin composition according to any one of claims 1 to 13, characterized in that the content of the organopolysiloxane composition in the resin composition is 15% by weight or less. the other resin is a resin having a (meth)acryloyl group,
R is selected from the group consisting of acryloxypropyl, methacryloxypropyl, methacryloxyoctyl, glycidoxypropyl, glycidoxyoctyl, and methyl;
All of R ¹ to R ³ are methyl groups;
The resin composition according to claim 1, wherein ^R4 is selected from the group consisting of an acryloxypropyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidoxypropyl group, a glycidoxyoctyl group, and a phenyl group. the other resin is polycarbonate,
R is selected from the group consisting of ethylene glycol monoethylene ether, glycidoxypropyl, glycidoxyoctyl, phenyl, phenethylene, styryl, vinyl, and methyl;
All of R ¹ to R ³ are methyl groups;
The resin composition according to claim 1 , wherein R ⁴ is a phenyl group. A component for electronic devices, comprising the resin composition according to any one of claims 1 to 16 or a cured product thereof. A resin additive comprising an organopolysiloxane composition,
The organopolysiloxane composition comprises:
Component A is an organopolysiloxane represented by the following general formula [1] and having silicon units selected from the group consisting of MD units, MT units, MQ units, MDT units, MDQ units, MDTQ units, DT units, DQ units, DTQ units, and TQ units;
Component B includes a substance represented by the following general formula [2],
The component A and the component B are
0.1≦{(weight of component B)×100}/{(weight of component A)+(weight of component B)}≦9
and
For component A,
The content of the substance in which the coefficients T2, M2, and E2 in the formula [2] satisfy T2+2-M2+E2=0 is 0.01% by weight or more and 9% by weight or less,
A resin additive, characterized in that the content of a substance in which the coefficients T2, M2, and E2 in the formula [2] do not satisfy T2+2-M2+E2=0 is 3% by weight or less:
R _X SiO _(4-X)/2 ...[1]
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2
...[2]
Here, in the above formula [1],
R each independently has an atom or group selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group; and coefficients X each independently satisfy 0<X≦3;
Here, in the above formula [2],
R ¹ to R ⁴ are each independently selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group, and may be the same or different.
^R5 is selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a butyl group, an octyl group, and an octadecyl group, and may be the same or different;
The coefficient M2 is a positive integer between 1 and 5; the coefficient T2 is a positive integer between 1 and 3; and the coefficient E2 is an integer between 0 and 5. 1. An organopolysiloxane composition for use in a resin, comprising:
Component A is an organopolysiloxane represented by the following general formula [1] and having silicon units selected from the group consisting of MD units, MT units, MQ units, MDT units, MDQ units, MDTQ units, DT units, DQ units, DTQ units, and TQ units;
Component B includes a substance represented by the following general formula [2],
The component A and the component B are
0.1≦{(weight of component B)×100}/{(weight of component A)+(weight of component B)}≦9
and
For component A,
The content of the substance in which the coefficients T2, M2, and E2 in the formula [2] satisfy T2+2-M2+E2=0 is 0.01% by weight or more and 9% by weight or less,
an organopolysiloxane composition for use as an additive to a resin, characterized in that the content of substances in which the coefficients T2, M2, and E2 in the formula [2] do not satisfy T2+2-M2+E2=0 is 3% by weight or less:
R _X SiO _(4-X)/2 ...[1]
(R ¹ R ² R ³ SiO _1/2 ) _M2 (R ⁴ SiO _3/2 ) _T2 (O _1/2 R ⁵ ) _E2
...[2]
wherein, in the above formula [1], each R independently has an atom or group selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group; each coefficient X independently satisfies 0<X≦3;
Here, in the above formula [2],
R ¹ to R ⁴ are each independently selected from the group consisting of a (meth) acrylic group, a carboxyl group, a nitrile group, a formyl group, a carbonyl group, a carbinol group, an amino group, an imino group, a nitro group, a cyano group, a sulfo group, a mercapto group, an alkyl group having 1 to 20 carbon atoms, a cyclopentyl group, a cyclohexyl group, an ethylene glycol monoethylene ether group, an acryloxypropyl group, an acryloxyoctyl group, a methacryloxypropyl group, a methacryloxyoctyl group, a glycidyl group, a glycidoxypropyl group, a glycidoxyoctyl group, a 1,2-epoxycyclohexyl-3-propyl group, a 1,2-epoxycyclohexyl-3-octyl group, a phenyl group, a phenethylene group, and a styryl group, and may be the same or different.
^R5 is selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a butyl group, an octyl group, and an octadecyl group, and may be the same or different;
The coefficient M2 is a positive integer between 1 and 5; the coefficient T2 is a positive integer between 1 and 3; and the coefficient E2 is an integer between 0 and 5. The organopolysiloxane composition for use as a resin additive is
20. The organopolysiloxane composition for use in a resin according to claim 19, which is added to any resin selected from the group consisting of resins having a (meth)acryloyl group and polycarbonates.