JP7571210B1 - Connection structure for electronic module - Google Patents

Abstract

An electronic module connection structure capable of satisfactorily connecting an electronic module to a substrate is provided.
[Solution] The connection structure for an electronic module has a first edge on which a group of terminals are arranged and a second edge opposite the first edge on which a semicircular recess is formed, and includes an electronic module having a GND terminal provided in the recess, a substrate, and an intermediary part that electrically connects the GND terminal and the substrate, the intermediary part having an expansion and contraction part that is expandable and contractible in a direction intersecting with the substrate.
[Selected figure] Figure 2

Description

The present invention relates to a connection structure for an electronic module.

Conventionally, there is known an electronic module having a first edge on which a group of terminals is arranged and a second edge on the opposite side of the first edge on which a semicircular recess is formed, and in which a GND terminal is provided in the recess (see, for example, Patent Document 1). An example of such an electronic module is an electronic module that complies with the M.2 standard.

Patent No. 7208553

Incidentally, electronic modules such as those described above (compliant with the M.2 standard, etc.) may be used by connecting them to a board. As a result of extensive research by the inventors of the present application, it was found that some ingenuity is required to successfully connect such electronic modules to a board.

The present invention has been made in consideration of these circumstances, and aims to provide a connection structure for an electronic module that can satisfactorily connect the electronic module to a substrate.

To solve the above problem, the connection structure of an electronic module according to aspect 1 of the present invention comprises an electronic module having a first edge on which a group of terminals is arranged and a second edge opposite the first edge on which a semicircular recess is formed, the electronic module having a GND terminal provided in the recess, a substrate, and an intermediate part that electrically connects the GND terminal and the substrate, the intermediate part having an expandable part that can expand and contract in a direction intersecting with the substrate.

According to aspect 1 of the present invention, it is possible to provide a connection structure for an electronic module that can satisfactorily connect the electronic module to a substrate.

In addition, in the electronic module connection structure of aspect 1, the electronic module of aspect 2 of the present invention complies with the M.2 standard.

The connection structure according to the above aspect of the present invention can be suitably applied to electronic modules that comply with the M.2 standard, for example.

In addition, in the connection structure of the electronic module of aspect 1 or aspect 2, the electronic module of the present invention is compliant with the WWAN communication standard.

As a result of thorough investigations by the inventors of the present application, it was found that, for example, compared to when the electronic module is an SSD module, when the electronic module is a WWAN communication module, a higher level of GND stability is required. The connection structure according to the above aspect of the present invention makes it easier to ensure the high level of GND stability required when the electronic module is a WWAN communication module.

In addition, in a fourth aspect of the present invention, in the connection structure of any one of the electronic modules of the first to third aspects, the substrate has a connection portion to which the intermediate portion is connected, a first fixing portion disposed at a position different from the connection portion and to which the first edge is fixed, and a second fixing portion located between the connection portion and the first fixing portion and capable of fixing the second edge, and the intermediate portion has an extension portion extending from the second fixing portion toward the connection portion when viewed from a direction intersecting the substrate.

According to aspect 4 of the present invention, multiple electronic modules of different sizes can be connected to a substrate.

In addition, in aspect 5 of the present invention, in the electronic module connection structure of aspect 4, the extension portion has an extension portion that extends parallel to the substrate and an upright portion that extends in a direction intersecting the substrate.

According to aspect 5 of the present invention, even if the attachment positions of the second edges of multiple electronic modules of different sizes are shifted in a direction intersecting the substrate, the GND terminals of each electronic module can be easily connected to the substrate.

According to the above aspect of the present invention, it is possible to provide a connection structure for an electronic module that can satisfactorily connect the electronic module to a substrate.

1 is a perspective view showing a connection structure according to an embodiment of the present invention; 2 is a cross-sectional view taken along line II-II shown in FIG. 1 is a perspective view illustrating an electronic module according to an embodiment of the present invention. FIG. 4 is a perspective view showing the periphery of an extension portion according to an embodiment of the present invention. FIG. 5 is a diagram showing a state in which an extension portion is removed from FIG. 4 . 2 shows a state in which an electronic module having a different size from the electronic module of FIG. 1 is connected to a substrate.

The connection structure of an electronic module according to an embodiment of the present invention will be described below with reference to the drawings.

As shown in Figures 1 and 2, the electronic module connection structure 1 according to this embodiment (hereinafter simply referred to as "connection structure 1") includes an electronic module 10, a substrate 20, an intermediate portion 30, a fixing means 41, and pressing means 42 and 43.

The connection structure 1 may be housed in, for example, an electronic device. The electronic device in which the connection structure 1 is housed may be, for example, a so-called clamshell-type notebook computer. However, the type of electronic device is not limited to this. For example, the electronic device may be a desktop computer, a smartphone, a tablet terminal, a game console, etc.

(Direction definition)
Here, in this specification, a direction that intersects (e.g., perpendicular to) the substrate 20 is referred to as a first direction Z. A direction that intersects (e.g., perpendicular to) the first direction Z is referred to as a second direction X. A direction that intersects (e.g., perpendicular to) both the first direction Z and the second direction X is referred to as a third direction Y. The second direction X and the third direction Y may be parallel to the substrate 20.

As shown in FIG. 3, the electronic module 10 has a mounting substrate 11 and electronic components 12. The electronic module 10 according to this embodiment is a module that complies with the M.2 standard.

The electronic module 10 may be, for example, a communication module that complies with the WWAN (Wireless Wide Area Network) communication standard. Alternatively, the electronic module 10 may be a SSD (Solid State Drive) module. In this case, the electronic component 12 may have a memory or the like. However, the type of the electronic module 10 is not limited to these and can be changed as appropriate.

The mounting board 11 may be, for example, a PCB (Printed Circuit Board). The mounting board 11 has a flat plate shape. Specifically, the mounting board 11 has a mounting surface 11a, a back surface 11b, and multiple (four in the illustrated example) side edges 11c. An electronic component 12 is mounted on the mounting surface 11a. The back surface 11b is located opposite the mounting surface 11a. When the electronic module 10 is connected to the substrate 20, the mounting surface 11a and the back surface 11b may face the first direction Z.

The multiple side edges 11c connect the outer periphery of the mounting surface 11a to the outer periphery of the back surface 11b. The electronic module 10 (mounting board 11) according to this embodiment has a rectangular shape. The multiple side edges 11c include a first edge 10a and a second edge 10b located on the opposite side to the first edge 10a.

In this embodiment, the first edge 10a and the second edge 10b correspond to a pair of short sides of the electronic module 10 (mounting board 11). That is, the first edge 10a and the second edge 10b are both ends of the electronic module 10 (mounting board 11) in the longitudinal direction of the electronic module 10 (mounting board 11). As shown in FIG. 2, when the electronic module 10 is connected to the board 20, the longitudinal direction of the electronic module 10 (mounting board 11) may coincide with the second direction X. That is, when the electronic module 10 is connected to the board 20, the first edge 10a and the second edge 10b may be aligned in the second direction X.

As shown in FIG. 3, a terminal group 13 having a plurality of terminals 13a is arranged on the first edge 10a. The terminal group 13 complies with the M.2 standard.

A semicircular recess 14 is formed on the second edge 10b. A GND terminal 14a is provided in the recess 14. The GND terminal 14a is exposed to the outside of the mounting substrate 11 (electronic module 10).

As shown in FIG. 2, the intermediate portion 30 according to this embodiment has an extension portion (bracket) 31, a stud 32, an expandable portion (floating connection portion) 33, and a screw receiving portion (first screw receiving portion) 34. The intermediate portion 30 (extension portion 31, stud 32, expandable portion 33, and screw receiving portion 34) are formed of a conductive material. The intermediate portion 30 electrically connects the GND terminal 14a of the electronic module 10 and the board 20. In other words, the intermediate portion 30 mediates the electrical connection between the GND terminal 14a and the board 20.

The screw receiving portion 34 includes a flange portion 34a and a cylindrical portion 34b. The flange portion 34a has an annular shape when viewed from the first direction Z. The flange portion 34a is mechanically and electrically connected to the substrate 20 (connection portion 23). The method for mechanically and electrically connecting the screw 43a to the substrate 20 is not particularly limited, but for example, a connection by solder may be adopted. The cylindrical portion 34b protrudes from the inner peripheral edge of the flange portion 34a in a direction away from the substrate 20 in the first direction Z. Although detailed illustration is omitted, a helical protrusion into which the screw 43a screws is formed on the inner peripheral surface of the cylindrical portion 34b. The flange portion 34a and the cylindrical portion 34b may be formed integrally.

The expandable portion 33 is configured to be expandable and contractible in the first direction Z. The expandable portion 33 protrudes from the flange portion 34a in a direction away from the substrate 20 in the first direction Z. The expandable portion 33 is mechanically and electrically connected to the flange portion 34a. The expandable portion 33 may have, for example, a ring shape when viewed from the first direction Z. Note that the screw receiving portion 34 may not have the flange portion 34a, and the expandable portion 33 may be mechanically and electrically connected to the substrate 20 (connection portion 23).

When viewed from the first direction Z, the extension portion 31 extends from the second fixing portion 22 toward the connection portion 23. In this embodiment, the extension portion 31 includes a first extension portion 31a, a standing portion 31b, and a second extension portion 31c.

The first extension portion 31a extends from near the second fixed portion 22 toward the extension portion 31 along the second direction X. When the electronic module 10 is connected to the substrate 20, the first extension portion 31a is mechanically and electrically connected to the GND terminal 14a of the electronic module 10. The standing portion 31b extends from the tip of the first extension portion 31a (the right end in the illustrated example) in a direction away from the substrate 20 in the first direction Z. The second extension portion 31c extends from the tip of the standing portion 31b (the upper end in the illustrated example) toward the extension portion 31 along the second direction X.

The extension portion 31 having the first extension portion 31a, the standing portion 31b, and the second extension portion 31c has a Z-shape when viewed from the third direction Y. The first extension portion 31a has a first through hole 31d that penetrates the first extension portion 31a in the first direction Z.

The stud 32 has an annular shape when viewed from the first direction Z. The stud 32 is fixed (e.g., crimped) to the inner circumferential surface of the second through hole 31e. The inner diameter of the stud 32 is larger than the outer diameter of the tube portion 34b.

The stud 32 is mechanically and electrically connected to the expandable portion 33 by a pressing means (first pressing means) 43. The pressing means 43 in this embodiment has a screw 43a and the aforementioned screw receiving portion 34 (tubular portion 34b).

In this embodiment, when the cylindrical portion 34b of the screw receiving portion 34 is inserted into the stud 32, the stud 32 and the expandable portion 33 face each other in the first direction Z. When the screw 43a is screwed into the cylindrical portion 34b in this state, the head of the cylindrical portion 34b presses the tip of the second extension portion 31c and the stud 32 toward the expandable portion 33 in the first direction Z. As a result, the tip of the second extension portion 31c and the stud 32 are sandwiched between the head of the screw 43a and the expandable portion 33 and are mechanically and electrically connected to the expandable portion 33. At this time, the expandable portion 33 biases the tip of the second extension portion 31c and the stud 32 in a direction away from the substrate 20 in the first direction Z. The biasing force exerted by the expandable portion 33 and the pressing force exerted by the screw 43a keep the tip of the second extension portion 31c and the stud 32 in a floating state. In other words, the tip of the second extension portion 31c and the stud 32 are kept elastically supported by the elastic portion 33.

2, the substrate 20 has a first fixing portion 21, a second fixing portion 22, and a connection portion 23. The substrate 20 may be, for example, a PCB. The first fixing portion 21, the second fixing portion 22, and the connection portion 23 are arranged at different positions. More specifically, the first fixing portion 21, the second fixing portion 22, and the connection portion 23 are arranged in this order in the second direction X (i.e., the direction in which the first edge 10a and the second edge 10b are arranged).

The first edge 10a of the electronic module 10 is fixed to the first fixing portion 21 by the fixing means 41. The first edge 10a is fixed to the substrate 20 (first fixing portion 21) via the fixing means 41, thereby electrically connecting the substrate 20 and the terminal group 13 of the electronic module 10. Note that the structure of the fixing means 41 is not particularly limited, and can be appropriately selected from known structures, as long as it is possible to fix the first edge 10a to the substrate 20 while electrically connecting the substrate 20 and the terminal group 13.

The second edge 10b of the electronic module 10 can be fixed to the second fixing portion 22. The second fixing portion 22 is located between the connection portion 23 and the first fixing portion 21. In the illustrated example, the second fixing portion 22 is a through hole that penetrates the substrate 20 in the first direction Z. A pressing means (second pressing means) 42 for fixing the second edge 10b of the electronic module 10 to the substrate 20 is provided in the through hole.

The pressing means 42 according to this embodiment includes a screw (second screw) 42a and a screw receiving portion (second screw receiving portion) 42b. The screw receiving portion 42b has a cylindrical shape. The screw receiving portion 42b is fixed (for example, by crimping) to the inner peripheral surface of the second fixing portion 22, which is a through hole formed in the substrate 20, and to the first through hole 31d of the extension portion 31. In other words, the screw receiving portion 42b fixes the extension portion 31 (first extension portion 31a) to the substrate 20 (second fixing portion 22). Although detailed illustration is omitted, a helical protrusion into which the screw 42a screws is formed on the inner peripheral surface of the screw receiving portion 42b.

When the screw 42a is screwed into the screw receiving portion 42b with the recess 14 (GND terminal 14a) of the electronic module 10 engaged with the screw receiving portion 42b, the head of the screw 42a presses the second edge 10b of the electronic module 10 toward the first extension portion 31a and the board 20 in the first direction Z. As a result, the second edge 10b of the electronic module 10 is sandwiched between the extension portion 31 (first extension portion 31a) and the head of the screw 42a, and is fixed to the second fixing portion 22 of the board 20.

The intermediate portion 30 is mechanically and electrically connected to the connection portion 23. In the illustrated example, the flange portion 34a of the screw receiving portion 34 is mechanically and electrically connected to the connection portion 23.

Next, a method for connecting the electronic module 10 to the substrate 20 using the components configured as described above will be described. In other words, a method for manufacturing the connection structure 1 according to this embodiment will be described.

First, the substrate 20 is prepared (see FIG. 2). The screw receiving portion 34 is fixed to the connection portion 23 of the substrate 20. The expandable portion 33 is fixed to the screw receiving portion 34.

Next, the extension 31 to which the screw receiving portion 42b and the stud 32 are fixed is prepared. Then, the extension 31 is placed on the substrate 20 so that the tubular portion 34b of the screw receiving portion 34 is inserted into the stud 32. In this state, the screw 43a is screwed into the tubular portion 34b (see Figures 2 and 4). This mechanically and electrically connects the stud 32 to the expandable portion 33. At this time, the tip of the second extension 31c and the stud 32 are kept floating. The screw receiving portion 42b is fixed to the second fixing portion 22 (through hole) of the substrate 20. In other words, the extension 31 (first extension 31a) is fixed to the substrate 20 (second fixing portion 22) by the screw receiving portion 42b.

Next, the electronic module 10 is prepared. Then, the first edge 10a of the electronic module 10 is fixed to the fixing means 41 (see FIG. 2). This causes the terminal group 13 of the electronic module 10 to be electrically connected to the substrate 20.

Next, the screw receiving portion 42b is fitted into the recess 14 of the electronic module 10 (see FIG. 1). In this state, the screw 42a is screwed into the screw receiving portion 42b. As a result, the second edge 10b of the electronic module 10 is sandwiched between the first extension portion 31a and the head of the screw 42a, and is fixed to the second fixing portion 22 of the board 20 (see FIGS. 1 and 2). At this time, the GND terminal 14a of the electronic module 10 is mechanically and electrically connected to the first extension portion 31a.

Through the above steps, the electronic module 10 is fixed to the substrate 20, and the electronic module 10 and the substrate 20 are electrically connected. More specifically, the first edge 10a and the second edge 10b of the electronic module 10 are fixed to the first fixing portion 21 and the second fixing portion 22 of the substrate 20 by the fixing means 41 and the pressing means 42, respectively. In addition, the GND terminal 14a of the electronic module 10 is electrically connected to the connection portion 23 of the substrate 20 via the intermediate portion 30. At this time, at least a portion of the intermediate portion 30 (the tip of the second extension portion 31c and the stud 32) is kept in a floating state.

As shown in FIG. 5, the extension 31 may be omitted from the connection structure 1 according to this embodiment. In other words, the extension 31 may be configured to be removable from the substrate 20. The screw receiving portion 42b fixed to the extension 31 may also be omitted together with the extension 31.

Incidentally, there are cases where an electronic module 10A having a larger dimension in the second direction X than the electronic module 10 shown in FIG. 1 is used (see FIG. 6). In the connection structure 1 according to this embodiment, by removing the extension portion 31, such an electronic module 10A of a different size can be connected to the substrate 20.

Specifically, the extension 31 is not provided on the substrate 20 (see FIG. 5), and the screw receiving portion 34 (tubular portion 34b) is fitted into the recess 14 of the electronic module 10. Then, in this state, the screw 43a is screwed into the tubular portion 34b (see also FIG. 2). As a result, the GND terminal 14a of the electronic module 10 is sandwiched between the head of the screw 43a and the expandable portion 33, and is mechanically and electrically connected to the expandable portion 33 (see also FIG. 2). At this time, the GND terminal 14a of the electronic module 10 is maintained in a floating state. In other words, the GND terminal 14a is maintained in a state in which it is elastically supported by the expandable portion 33.

The electronic module 10 does not have to comply with the M.2 standard. The electronic module 10 may be an electronic module similar to an electronic module that complies with the M.2 standard. Specifically, the electronic module 10 has a first edge 10a on which the terminal group 13 is arranged, and a second edge 10b on the opposite side to the first edge 10a on which a semicircular recess 14 is formed, and the type of electronic module 10 can be changed as appropriate as long as a GND terminal 14a is provided in the recess 14.

As described above, the connection structure 1 according to this embodiment has a first edge 10a on which the terminal group 13 is arranged, and a second edge 10b opposite the first edge 10a on which a semicircular recess 14 is formed, and is equipped with an electronic module 10 in which a GND terminal 14a is provided in the recess 14, a substrate 20, and an intermediate part 30 that electrically connects the GND terminal 14a and the substrate 20, and the intermediate part 30 has an expandable part 33 that can expand and contract in a direction intersecting with the substrate 20 (first direction Z).

According to this configuration, the path electrically connecting the GND terminal 14a and the substrate 20 includes a floating portion in the first direction Z. In an example using the extension 31, at least a part of the intermediate portion 30 (the tip of the second extension 31c and the stud 32) corresponds to the "floating portion". In an example not using the extension 31, the GND terminal 14a corresponds to the "floating portion". The presence of the floating portion stabilizes the electrical connection between the GND terminal 14a and the substrate 20. That is, even if the positional relationship between the electronic module 10, the substrate 20, and the intermediate portion 30 is slightly shifted due to an external force or the like, the electrical connection by the intermediate portion 30 is easily maintained. In addition, damage to the terminal 13a can be reduced compared to when the GND terminal 14a is fixed to the substrate 20 inelastically (without a floating portion). If the GND terminal 14a is fixed to the substrate 20 without a floating portion, the second edge 10b of the electronic module 10 is firmly fixed to the substrate 20 by a screw or the like. When an external force strong enough to warp the substrate 20 or the like is repeatedly applied in this state, the second edge 10b and the substrate 20 are unlikely to be misaligned, while the first edge 10a and the fixing means 41 are repeatedly misaligned. Such misalignment between the first edge 10a and the fixing means 41 causes damage (wear and tear) to the terminal 13a provided on the first edge 10a. This problem is likely to occur in a configuration in which the first edge 10a is gripped only by the spring structure of the connector pin in the fixing means 41. Instead of firmly fixing the second edge 10b to the substrate 20, a floating portion is provided between the second edge 10b (GND terminal 14a) and the substrate 20 as in this embodiment, so that the influence of the bending of the substrate 20 or the like can be absorbed by the floating portion. This prevents misalignment between the first edge 10a and the fixing means 41, reducing damage (wear) to the terminal 13a.

The electronic module 10 may also be compliant with the M.2 standard.

The connection structure 1 according to this embodiment can be suitably applied to, for example, an electronic module 10 that complies with the M.2 standard.

The electronic module 10 may also be compatible with the WWAN communication standard.

As a result of careful consideration by the inventors of the present application, it was found that, for example, compared to when the electronic module 10 is an SSD module, a higher level of GND stability is required when the electronic module 10 is a WWAN communication module. The connection structure 1 according to this embodiment makes it easier to ensure the high level of GND stability required when the electronic module 10 is compatible with the WWAN communication standard.

The substrate 20 also has a connection portion 23 to which the intermediate portion 30 is connected, a first fixing portion 21 arranged at a position different from the connection portion 23 and to which the first edge 10a is fixed, and a second fixing portion 22 located between the connection portion 23 and the first fixing portion 21 and capable of fixing the second edge 10b, and the intermediate portion 30 has an extension portion 31 extending from the second fixing portion 22 toward the connection portion 23 when viewed from the first direction Z.

This configuration allows multiple electronic modules 10, 10A of different sizes to be connected to the board 20. In other words, by switching between the presence or absence of the extension 31, it is possible to switch between a case where the second edge 10b (of the electronic module 10) is located near the second fixing portion 22 and a case where the second edge 10b (of the electronic module 10A) is located near the connection portion 23. Furthermore, by configuring the extension 31 to be pre-fixed to the board 20, the electronic modules 10, 10A can be easily connected to the board 20 compared to a configuration in which, for example, a bracket or the like must be attached to the electronic modules 10, 10A in advance.

In addition, the extension portion 31 has extension portions 31a and 31c that extend parallel to the substrate 20, and an upright portion 31b that extends in the first direction Z.

With this configuration, even if the attachment positions of the second edges 10b are misaligned in the first direction Z between electronic modules 10 and 10A of different sizes, the GND terminals 14a of each electronic module 10 and 10A can be easily connected to the board 20.

The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, the configuration and shape of the intermediate portion 30 can be changed as appropriate as long as it has an expandable portion 33 that can expand and contract in the first direction Z and can electrically connect the GND terminal 14a and the substrate 20. For example, if the screws 42a and 43b are made of a conductive material, the intermediate portion 30 that electrically connects the GND terminal 14a and the substrate 20 may include the screws 42a and 43b.

In addition, the components in the above-described embodiments may be replaced with well-known components as appropriate without departing from the spirit of the present invention, and the above-described embodiments and variations may be combined as appropriate.

1...Connection structure 10, 10A...Electronic module 10a...First edge 10b...Second edge 13...Terminal group 14...Recess 14a...GND terminal 20...Substrate 21...First fixing part 22...Second fixing part 23...Connection part 30...Intermediate part 31...Extension part 31a...First extension part 31b...Rising part 31c...Second extension part 33...Expandable part

Claims (4)

an electronic module having a first edge on which a terminal group is arranged and a second edge opposite to the first edge and having a semicircular recess formed therein, the second edge being provided with a GND terminal in the recess;
A substrate;
an intermediate portion that electrically connects the GND terminal and the substrate;
the intermediate portion has an expandable portion that is expandable in a direction intersecting with the substrate,
the substrate has a connection portion to which the intermediate portion is connected, a first fixing portion disposed at a position different from the connection portion and to which the first edge is fixed, and a second fixing portion located between the connection portion and the first fixing portion and capable of fixing the second edge;
the intermediate portion has an extension portion extending from the second fixed portion toward the connection portion when viewed in a direction intersecting the board,
The extension is configured to be removable from the substrate;
When the extension portion is attached to the board, the intermediate portion electrically connects the GND terminal of the electronic module to the connection portion;
When the extension portion is detached from the substrate, the intermediate portion electrically connects the connection portion to the GND terminal of a second electronic module, the second electronic module having a dimension larger than that of the electronic module in a direction in which the first edge and the second edge are aligned.
A connection structure for an electronic module. The electronic module is compliant with the M.2 standard.
The connection structure of the electronic module according to claim 1 . The electronic module is compliant with the WWAN communication standard;
3. A connection structure for electronic modules according to claim 1 or 2. The extension portion has an extension portion extending parallel to the substrate and an upright portion extending in a direction intersecting the substrate.
3. A connection structure for electronic modules according to claim 1 or 2 .

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