[go: up one dir, main page]

JP7565807B2 - Resin member for plating and its manufacturing method - Google Patents

Resin member for plating and its manufacturing method Download PDF

Info

Publication number
JP7565807B2
JP7565807B2 JP2021008134A JP2021008134A JP7565807B2 JP 7565807 B2 JP7565807 B2 JP 7565807B2 JP 2021008134 A JP2021008134 A JP 2021008134A JP 2021008134 A JP2021008134 A JP 2021008134A JP 7565807 B2 JP7565807 B2 JP 7565807B2
Authority
JP
Japan
Prior art keywords
resin member
grooves
resin
plated
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021008134A
Other languages
Japanese (ja)
Other versions
JP2022112335A (en
Inventor
友美 香村
光晴 草谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Priority to JP2021008134A priority Critical patent/JP7565807B2/en
Publication of JP2022112335A publication Critical patent/JP2022112335A/en
Application granted granted Critical
Publication of JP7565807B2 publication Critical patent/JP7565807B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Description

本発明は、メッキ処理用樹脂部材およびその製造方法に関する。 The present invention relates to a resin member for plating treatment and a method for manufacturing the same.

近年、樹脂部材に金属をメッキする用途が増加しており、そのメッキと樹脂部材との密着性の要求が厳しくなっている。例えば、スマホ等の携帯機器では、樹脂部材にメッキにより直接電極を形成し軽量化を図ることや(特許文献1)、メッキした樹脂部材が電磁シールドとして使用されている(特許文献2)。 In recent years, the number of applications in which resin members are plated with metal has increased, and the requirements for adhesion between the plating and the resin member have become stricter. For example, in mobile devices such as smartphones, electrodes are formed directly on the resin member by plating to reduce weight (Patent Document 1), and plated resin members are used as electromagnetic shields (Patent Document 2).

特開2020-184090号公報JP 2020-184090 A 特開2020-195105号公報JP 2020-195105 A 特開2019-131839号公報JP 2019-131839 A

これらの携帯機器は、多様な取り扱い方がされることから、樹脂部材からメッキがはがれることがあり、これが携帯機器の直接の故障原因となることがあった。メッキ処理の前に樹脂部材のメッキする表面をレーザーで粗化したのち薬剤で処理すること等が行われていたが、それだけでは十分ではなかった(特許文献3)。 Because these mobile devices are handled in a variety of ways, the plating can peel off from the resin components, which can be a direct cause of malfunction of the mobile devices. Prior to plating, the surface of the resin component to be plated was roughened with a laser and then treated with a chemical, but this alone was not sufficient (Patent Document 3).

本発明は、密着性のよいメッキを施すための樹脂部材およびその製造方法を提供することを目的とする。 The present invention aims to provide a resin member for plating with good adhesion and a method for manufacturing the same.

本発明の目的は、下記によって達成された。 The object of the present invention has been achieved by the following:

1. アルミニウムメッキ処理用の樹脂部材であって、該樹脂部材はメッキ処理する面に深さ1~15μmの複数の溝を有し、該複数の溝の間隔bが10~500μmであり、該溝は開口部周辺に5~30μmの高さaを有するバリを有し、該バリの高さaは該複数の溝の間隔bと下記式(1)の関係を有し、
式(1) b≦35a-24
前記樹脂部材が、ポリブチレンテレフタレート、ポリフェニレンサルファイド及び液晶ポリマーからなる群より選ばれる何れかの樹脂により形成されている、樹脂部材。
2.記溝の開口部の幅cが50~200μmである前記1に記載の樹脂部材。
. 樹脂部材にアルミニウムメッキしたメッキ処理樹脂部材を製造する方法であって、該製造方法が、該樹脂部材のメッキ処理する表面に、深さ1~15μmの複数の溝であって、該複数の溝の間隔bが10~500μmであり、該溝が開口部周辺に5~30μmの高さaのバリを有し、該バリの高さaが該複数の溝の間隔bと下記式(1)の関係を有する溝をレーザー光の照射により形成する工程を有し、
式(1) b≦35a-24
前記樹脂部材が、ポリブチレンテレフタレート、ポリフェニレンサルファイド及び液晶ポリマーからなる群より選ばれる何れかの樹脂により形成されている、メッキ処理樹脂部材の製造方法。
1. A resin member for aluminum plating, the resin member having a surface to be plated with a plurality of grooves having a depth of 1 to 15 μm, the interval b between the plurality of grooves being 10 to 500 μm, the grooves having burrs around openings having a height a of 5 to 30 μm, the height a of the burrs and the interval b between the plurality of grooves satisfy the following formula (1):
Formula (1) b≦35a-24
The resin member is formed from any resin selected from the group consisting of polybutylene terephthalate, polyphenylene sulfide, and liquid crystal polymer.
2. The resin member according to 1 above , wherein the width c of the opening of the groove is 50 to 200 μm.
3. A method for manufacturing a plated resin member by plating a resin member with aluminum , the method comprising the steps of: forming, on a surface to be plated of the resin member, a plurality of grooves each having a depth of 1 to 15 μm, the plurality of grooves having a spacing b of 10 to 500 μm, the grooves having burrs with a height a of 5 to 30 μm around openings, the height a of the burrs satisfying the following formula (1) with the spacing b of the plurality of grooves, by irradiating the surface with laser light ;
Formula (1) b≦35a-24
The method for producing a plated resin member, wherein the resin member is made of any resin selected from the group consisting of polybutylene terephthalate, polyphenylene sulfide, and liquid crystal polymer.

本発明によれば、密着性のよいメッキを施すための樹脂部材およびその製造方法を提供することができる。 The present invention provides a resin member for plating with good adhesion and a manufacturing method thereof.

本発明の複数の溝を示す断面概略図である。FIG. 2 is a cross-sectional schematic diagram showing multiple grooves of the present invention. 本発明の式(1)を算出した実験結果を示すグラフである。1 is a graph showing experimental results obtained by calculating formula (1) of the present invention.

以下、本発明の実施形態について詳細に述べる。 The following describes an embodiment of the present invention in detail.

<樹脂部材>
本発明の樹脂部材は、メッキ処理用の樹脂部材であって、該樹脂部材はメッキ処理する面に深さ1~15μmの複数の溝を有し、該溝は開口部周辺に5μm以上の高さaを有するバリを有し、該バリの高さaは該複数の溝の間隔bと下記式(1)の関係を有することを特徴とする。
式(1) b≦35a-24
<Resin material>
The resin member of the present invention is a resin member for plating treatment, characterized in that the resin member has a plurality of grooves with a depth of 1 to 15 μm on a surface to be plated, the grooves have burrs with a height a of 5 μm or more around openings, and the height a of the burrs and the interval b between the plurality of grooves satisfy the following formula (1):
Formula (1) b≦35a-24

<樹脂>
本発明の樹脂部材を形成する樹脂としては、メッキすることができるものであれば特に限定はない。例えばポリエチレンテレフタレート(PET),ポリブチレンテレフタレート(PBT)、脂肪族ポリアミド、芳香族ポリアミド、ポリフェニレンサルファイド(PPS)、液晶ポリマー(LCP)、ポリエーテルエーテルケトン(PEEK)、ポリイミド、ポリアセタール(POM)、ABS樹脂、環状ポリオレフィン(COC)等の熱可塑性樹脂を用いることができる。
<Resin>
The resin forming the resin member of the present invention is not particularly limited as long as it can be plated. For example, thermoplastic resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), aliphatic polyamide, aromatic polyamide, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyether ether ketone (PEEK), polyimide, polyacetal (POM), ABS resin, and cyclic polyolefin (COC) can be used.

これらの樹脂は、ガラスフィラーやミネラルフィラー等の無機フィラーを含有してもよい。また、これらの樹脂は、単独で用いてもよいし、2種類以上を混合して用いてもよい These resins may contain inorganic fillers such as glass fillers and mineral fillers. These resins may be used alone or in combination of two or more types.

<溝>
本発明の樹脂部材のメッキ処理する面には、深さ1~15μmの溝を複数有する。図1の断面概略図を使用して説明する。
<Groove>
The surface of the resin member of the present invention to be plated has a plurality of grooves having a depth of 1 to 15 μm.

本発明の樹脂部材のメッキ処理する面には、深さ1~15μmの複数の溝が形成されている。図1中のaは、溝の開口部周辺に形成された樹脂部材の平坦部からのバリの高さを示す。bは、複数の溝の間隔を、cは、溝の幅を、dは複数の溝のピッチを各々示す。 The surface of the resin member of the present invention to be plated has multiple grooves with a depth of 1 to 15 μm formed thereon. In FIG. 1, a indicates the height of the burrs formed around the opening of the groove from the flat part of the resin member. b indicates the spacing between the multiple grooves, c indicates the width of the groove, and d indicates the pitch between the multiple grooves.

溝の開口部周辺とは、溝開口部から平坦部に向けて30μm程度の範囲を示す。バリの高さaは溝開口部から平坦部に向けて30μm程度の範囲の中で最も高い位置を示す。バリは溝の開口部の周囲全てに形成されていなくても良いが、少なくとも開口部の周囲の60%以上、より好ましくは70%以上、特に好ましくは80%以上の部分に形成されることで良好なメッキ密着性が得られる。 The periphery of the groove opening refers to a range of about 30 μm from the groove opening toward the flat portion. The height a of the burr refers to the highest point within a range of about 30 μm from the groove opening toward the flat portion. The burr does not have to be formed all around the periphery of the groove opening, but good plating adhesion can be obtained by forming the burr on at least 60% or more of the periphery of the opening, more preferably 70% or more, and particularly preferably 80% or more.

バリの高さaは5μm以上であり、5~30μmであることが好ましく、5~20μmがさらに好ましい。複数の溝は、間隔b毎に形成されており、溝の数はメッキ処理する面積によって適宜定められる。間隔bはメッキ処理する面においてすべて同じでなくてもよい。バリの高さaが30μmを超えると、外観不良に加え、バリ側面のメッキの定着不良などで電磁波シールド性が低下することがある。 The height a of the burr is 5 μm or more, preferably 5 to 30 μm, and more preferably 5 to 20 μm. The grooves are formed at intervals b, and the number of grooves is determined appropriately depending on the area to be plated. The intervals b do not have to be the same on all surfaces to be plated. If the height a of the burr exceeds 30 μm, in addition to poor appearance, the electromagnetic shielding properties may be reduced due to poor adhesion of the plating on the side of the burr.

複数の溝は両端が繋がった溝を等高線のように並べて設けても良いし、交差しない縞状に形成されても、溝が交差する格子状に形成されてもよく、水玉状に形成されてもよい。溝を格子状に形成する場合は、ひし形状であっても良い。 The grooves may be arranged in a line like contour lines with both ends connected, or may be formed in stripes that do not intersect, or in a grid pattern where the grooves intersect, or in polka dots. If the grooves are formed in a grid pattern, they may be diamond shaped.

溝の長さは特に限定されるものでなく、溝が短い場合、開口部の形状は四角形であってもよいし、丸形や楕円形であってもよい。アンカー効果を得るためには、溝は長い方が好ましい。 The length of the groove is not particularly limited, and if the groove is short, the shape of the opening may be rectangular, round, or elliptical. To obtain an anchor effect, it is preferable that the groove is long.

本発明の隣り合う溝の間隔bは、溝の幅cの0.5倍以上4倍以下、すなわち溝の幅cが100μmであれば50μm以上400μm以下、であることが好ましく、溝の幅の1倍以上2倍以下、すなわち溝の幅が100μmであれば100μm以上200μm以下、であることがより好ましい。 In the present invention, the spacing b between adjacent grooves is preferably 0.5 to 4 times the groove width c, i.e., if the groove width c is 100 μm, then 50 μm to 400 μm, and more preferably 1 to 2 times the groove width, i.e., if the groove width is 100 μm, then 100 μm to 200 μm.

隣り合う溝の間隔bは、600μm以下であることが好ましく、500μ以下が更に好ましく、300μm以下が特に好ましい。
本発明において、バリの高さaと溝の間隔bとは式(1)の関係を有する。
式(1) b≦35a-24
式(1)は、図2に示す実験データによって得られたバリの高さaと溝の間隔bとの関係式である。
The distance b between adjacent grooves is preferably 600 μm or less, more preferably 500 μm or less, and particularly preferably 300 μm or less.
In the present invention, the burr height a and the groove interval b have the relationship expressed by formula (1).
Formula (1) b≦35a-24
Equation (1) is a relational expression between the burr height a and the groove interval b obtained from the experimental data shown in FIG.

<溝の形成方法>
本発明の樹脂部材の溝の形成は、溝を形成する前の樹脂部材の表面にレーザー光を照射して、樹脂を一部除去することにより行うのが好ましい。レーザー光の種類や波長、出力や照射時間などの条件は、対象となる樹脂部材を構成する樹脂組成物に応じて適宜選択すればくよく、バリを平坦部から5μm以上、溝の深さを1~15μmとなるように調節することが好ましい。
<Method of forming grooves>
The grooves in the resin member of the present invention are preferably formed by irradiating the surface of the resin member before the grooves are formed with a laser beam to partially remove the resin. The conditions such as the type, wavelength, output, and irradiation time of the laser beam can be appropriately selected according to the resin composition constituting the target resin member, and it is preferable to adjust the burrs to 5 μm or more from the flat portion and the groove depth to 1 to 15 μm.

形成する溝の面積は、画質及び密着強度を確保する意味で、メッキの面積に対し20%以上であることが好ましく、30%以上であることがより好ましく、40%以上であることがさらに好ましく、50%以上であることが特に好ましい。バリが形成されることで密着性が向上するため、上限は90%以下が好ましく、80%以下が更に好ましく、70%以下が特に好ましい。 In order to ensure image quality and adhesion strength, the area of the grooves to be formed is preferably 20% or more of the plating area, more preferably 30% or more, even more preferably 40% or more, and especially preferably 50% or more. Because the formation of burrs improves adhesion, the upper limit is preferably 90% or less, more preferably 80% or less, and especially preferably 70% or less.

特に無機繊維を含む樹脂部材はメッキ部全面にわたってレーザー光照射による溝が形成されると、レーザー処理により無機繊維が剥き出しとなり、メッキ処理をした場合、剥き出しとなった無機繊維部から剥がれてしまうことがある。また、レーザー処理時間を短縮させる意味でもメッキ部の全面処理は避けるべきである。 In particular, when grooves are formed over the entire surface of a plated resin part by irradiating it with laser light, the inorganic fibers become exposed by the laser treatment, and if plating is performed, they may peel off from the exposed inorganic fiber part. Also, in order to shorten the laser treatment time, treatment of the entire surface of the plated part should be avoided.

なお、溝部のラマン分光分析によって、樹脂の炭化層が存在することが確認できれば、溝がレーザー光照射によって形成されたものであると判断することができる。 If the presence of a carbonized layer of resin can be confirmed by Raman spectroscopic analysis of the groove, it can be determined that the groove was formed by irradiation with laser light.

本発明の樹脂部材にはレーザー光を効率的に吸収させるため染料や顔料などの着色剤(光吸収剤)、樹脂への色相に影響を与えない透明な近赤外吸収剤などを添加することも好ましく、有機系の着色剤よりも無機系の着色剤(例えばカーボンブラック)を添加することがより好ましい。 It is also preferable to add colorants (light absorbers) such as dyes and pigments to the resin workpiece of the present invention in order to efficiently absorb laser light, and transparent near-infrared absorbers that do not affect the hue of the resin, and it is more preferable to add inorganic colorants (e.g., carbon black) rather than organic colorants.

以下実施例をもって、本発明を詳細に説明する。なお評価は、特に断りのない限り23℃、50%RHの雰囲気下で行った。 The present invention will be described in detail below with reference to examples. The evaluations were carried out in an atmosphere of 23°C and 50% RH unless otherwise specified.

<試験体の形成>
≪溝形成のための樹脂部材の形成≫
ポリプラスチックス株式会社製の下記樹脂を用いて、100mm×100mm×3mmの平板状の樹脂部材の試験体を射出成形により形成した。
1.LCP樹脂 ラペロス(製品名)LCP E130i(ガラス繊維 30%)
2.PPS樹脂 ジュラファイド(製品名)PPS 1140A6(ガラス繊維 40%)
3.PBT樹脂 ジュラネックス(製品名)PBT 733LD(ガラス繊維 30%)
[成形条件]
・LCP樹脂 シリンダー温度CT350℃ 金型温度100℃ 射出速度1m/min
・PPS樹脂 シリンダー温度CT320℃ 金型温度140℃ 射出速度1m/min
・PBT樹脂 シリンダー温度CT260℃ 金型温度80℃ 射出速度1m/min
<Formation of test specimen>
<Formation of resin member for forming groove>
Using the following resin manufactured by Polyplastics Co., Ltd., a test specimen of a flat resin member having dimensions of 100 mm x 100 mm x 3 mm was formed by injection molding.
1. LCP resin LAPEROS (product name) LCP E130i (glass fiber 30%)
2. PPS resin DURAFIDE (product name) PPS 1140A6 (glass fiber 40%)
3. PBT resin: Duranex (product name) PBT 733LD (glass fiber 30%)
[Molding conditions]
・LCP resin Cylinder temperature CT 350℃ Mold temperature 100℃ Injection speed 1m/min
PPS resin Cylinder temperature CT 320℃ Mold temperature 140℃ Injection speed 1m/min
PBT resin, cylinder temperature CT 260℃, mold temperature 80℃, injection speed 1m/min

≪樹脂部材のバリの形成:レーザー処理≫
射出成形した試験体のメッキ処理を施す面の任意の20mm×20mm部分に、キーエンス製レーザーマーカ:MD-X1520を用いて、波長1064nmにてレーザー光を照射し、幅80μm、長さ20mm、深さ10μm、ピッチ200、300、500μmの格子状の溝を形成した。
<<Formation of burrs on resin parts: Laser processing>>
Any 20 mm x 20 mm portion of the surface to be plated of the injection-molded test specimen was irradiated with laser light at a wavelength of 1064 nm using a Keyence laser marker: MD-X1520, to form lattice-shaped grooves with a width of 80 μm, a length of 20 mm, a depth of 10 μm, and pitches of 200, 300, and 500 μm.

≪バリの高さa及び間隔bの測定≫
レーザー顕微鏡を用いて測定した。
≪試験体の形成:メッキ処理≫
溝を形成した樹脂部材に、真空蒸着(アルミメッキ)によりメッキを行い、メッキ処理を施した試験体を形成した。メッキの厚みは80nmである。
<Measurement of burr height a and spacing b>
The measurements were made using a laser microscope.
<Test specimen preparation: plating process>
The resin member having the groove formed therein was plated by vacuum deposition (aluminum plating) to form a plated test piece. The plating thickness was 80 nm.

<密着性試験:碁盤目剥離試験(クロスカット法)>
JIS K-5600-5-6に準じて、メッキした試験体のメッキ面にカッターナイフを使用して、縦及び横方向に1mm間隔でそれぞれ6本の傷を入れ、合計25個の1mm四方のマス目を形成し、そのマス目の上に市販のセロハンテープを貼り付け、上から指で良くこすって塗装面に密着させた後、セロハンテープの一端を指でつまんで一挙にテープを剥がし、メッキ面の剥離状況を観察した。試験は23℃50%RHの雰囲気下で行った。JIS K-5600-5-6の0~5点までの分類うち、2点以下を合格とした。結果を表1に示す。
<Adhesion test: Cross-cut peel test (cross-cut method)>
In accordance with JIS K-5600-5-6, a cutter knife was used to make six cuts at 1 mm intervals in the vertical and horizontal directions on the plated surface of the plated specimen, forming a total of 25 1 mm squares, and commercially available cellophane tape was attached to the squares and rubbed well with fingers from above to adhere to the painted surface. One end of the cellophane tape was then pinched with fingers and peeled off in one go, and the peeling state of the plated surface was observed. The test was conducted in an atmosphere of 23°C and 50% RH. Of the JIS K-5600-5-6 classification of 0 to 5 points, a score of 2 or less was considered to be a pass. The results are shown in Table 1.

Figure 0007565807000001
Figure 0007565807000001

表1の結果をグラフにしたのが、図2である。合格を●、不合格を×としたa(横軸、単位μm)とb(縦軸、単位μm)の関係をグラフで示す。図2中の直線が式(1)の等号数式である。この結果から判るように、式(1)の関係を満たす範囲では、密着性が良好である。 Figure 2 shows the results of Table 1 in a graph. The graph shows the relationship between a (horizontal axis, unit μm) and b (vertical axis, unit μm), with ● indicating pass and × indicating fail. The straight line in Figure 2 is the mathematical equation with the equal sign of formula (1). As can be seen from these results, adhesion is good within the range that satisfies the relationship of formula (1).

式(1)は、実験データからの臨界点5点から導かれる回帰式であり、相関係数は85%を超えている。 Equation (1) is a regression equation derived from five critical points from experimental data, and the correlation coefficient is greater than 85%.

a バリの高さ
b 溝の間隔
c 溝の開口部の幅
d 溝のピッチ
a Burr height b Groove spacing c Groove opening width d Groove pitch

Claims (3)

アルミニウムメッキ処理用の樹脂部材であって、該樹脂部材はメッキ処理する面に深さ1~15μmの複数の溝を有し、該複数の溝の間隔bが10~500μmであり、該溝は開口部周辺に5~30μmの高さaを有するバリを有し、該バリの高さaは該複数の溝の間隔bと下記式(1)の関係を有し、
式(1) b≦35a-24
前記樹脂部材が、ポリブチレンテレフタレート、ポリフェニレンサルファイド及び液晶ポリマーからなる群より選ばれる何れかの樹脂により形成されている、樹脂部材。
A resin member for aluminum plating treatment, the resin member having a surface to be plated with a plurality of grooves each having a depth of 1 to 15 μm, a distance b between the plurality of grooves being 10 to 500 μm, the grooves having burrs around openings each having a height a of 5 to 30 μm, the height a of the burrs and the distance b between the plurality of grooves satisfy the following formula (1):
Formula (1) b≦35a-24
The resin member is formed from any resin selected from the group consisting of polybutylene terephthalate, polyphenylene sulfide, and liquid crystal polymer.
前記溝の開口部の幅cが50~200μmである請求項1に記載の樹脂部材。 2. The resin member according to claim 1 , wherein the width c of the opening of the groove is 50 to 200 μm. 樹脂部材にアルミニウムメッキしたメッキ処理樹脂部材を製造する方法であって、該製造方法が、該樹脂部材のメッキ処理する表面に、深さ1~15μmの複数の溝であって、該複数の溝の間隔bが10~500μmであり、該溝が開口部周辺に5~30μmの高さaのバリを有し、該バリの高さaが該複数の溝の間隔bと下記式(1)の関係を有する溝をレーザー光の照射により形成する工程を有し、
式(1) b≦35a-24
前記樹脂部材が、ポリブチレンテレフタレート、ポリフェニレンサルファイド及び液晶ポリマーからなる群より選ばれる何れかの樹脂により形成されている、メッキ処理樹脂部材の製造方法。
A method for producing a plated resin member by plating a resin member with aluminum , the method comprising the steps of: forming, on a surface to be plated of the resin member, a plurality of grooves each having a depth of 1 to 15 μm, the plurality of grooves having a spacing b of 10 to 500 μm, the grooves having burrs with a height a of 5 to 30 μm around openings, the height a of the burrs satisfying the relationship between the spacing b of the plurality of grooves and the following formula (1) by irradiating the surface with laser light :
Formula (1) b≦35a-24
The method for producing a plated resin member, wherein the resin member is made of any resin selected from the group consisting of polybutylene terephthalate, polyphenylene sulfide, and liquid crystal polymer.
JP2021008134A 2021-01-21 2021-01-21 Resin member for plating and its manufacturing method Active JP7565807B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021008134A JP7565807B2 (en) 2021-01-21 2021-01-21 Resin member for plating and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021008134A JP7565807B2 (en) 2021-01-21 2021-01-21 Resin member for plating and its manufacturing method

Publications (2)

Publication Number Publication Date
JP2022112335A JP2022112335A (en) 2022-08-02
JP7565807B2 true JP7565807B2 (en) 2024-10-11

Family

ID=82655952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021008134A Active JP7565807B2 (en) 2021-01-21 2021-01-21 Resin member for plating and its manufacturing method

Country Status (1)

Country Link
JP (1) JP7565807B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005007738A (en) 2003-06-19 2005-01-13 Toray Advanced Film Co Ltd Metallized plastic film
JP2015091642A (en) 2013-02-12 2015-05-14 ポリプラスチックス株式会社 Grooved resin molded product
JP2016132131A (en) 2015-01-19 2016-07-25 ヤマセ電気株式会社 Metallic material joined with dissimilar material having airtightness in phase boundary between dissimilar material and metallic material, material joined with dissimilar material having airtightness in phase boundary between dissimilar materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005007738A (en) 2003-06-19 2005-01-13 Toray Advanced Film Co Ltd Metallized plastic film
JP2015091642A (en) 2013-02-12 2015-05-14 ポリプラスチックス株式会社 Grooved resin molded product
JP2016132131A (en) 2015-01-19 2016-07-25 ヤマセ電気株式会社 Metallic material joined with dissimilar material having airtightness in phase boundary between dissimilar material and metallic material, material joined with dissimilar material having airtightness in phase boundary between dissimilar materials

Also Published As

Publication number Publication date
JP2022112335A (en) 2022-08-02

Similar Documents

Publication Publication Date Title
KR102031105B1 (en) Laser direct structured materials and their methods of making
KR101970373B1 (en) Composition set, electroconductive substrate and manufacturing method thereof, and electroconductive binding material composition
Wang et al. Picosecond laser micro/nano surface texturing of nickel for superhydrophobicity
Moradi et al. Femtosecond laser irradiation of metallic surfaces: effects of laser parameters on superhydrophobicity
White et al. Environmentally benign metallization of material extrusion technology 3D printed acrylonitrile butadiene styrene parts using physical vapor deposition
EP3168843B1 (en) Silver nanowires, production methods thereof, conductors and electronic devices including the same
KR20120007381A (en) Pattern manufacturing method
EP3049193B1 (en) Solid plasma polymer body (in particular plasma polymer layer)
WO2011064072A1 (en) Housing for an opto-electronic component and method for producing a housing
JP7565807B2 (en) Resin member for plating and its manufacturing method
KR20160113216A (en) Electroconductive pattern, substrate with electroconductive pattern, method for manufacturing substrate with electroconductive pattern, structure having on-surface electroconductive pattern, and method for manufacturing said structure
DE112015001385T5 (en) Composite molded article and method of making the same
WO2020157155A1 (en) Method for producing a glass-plastic connection
EP1802185B1 (en) Method to apply material to a component
JP2016150473A (en) Rough-surfaced film and production method therefor
CN114450332B (en) Resin molded article having matte surface and method for forming matte surface on resin molded article
JPH06112626A (en) Method of forming a conductive circuit on the surface of a molded product
JP7560962B2 (en) Composite molded products and grooved plastic molded products
CN109803499B (en) Method for preparing electronic circuit on substrate
TWI775175B (en) Lift-off structure for sprayed layer on substrate and method thereof
RU2397583C1 (en) Method of making reflector of reflecting element
Shea et al. Fine tuning the stencil manufacturing process and other stencil printing experiments
JP6101589B2 (en) Fine processing method
Huang et al. Effect of Contact Angle on Friction Properties of Superhydrophobic Nickel Surface. Photonics 2023, 10, 829
WO2023213625A1 (en) Additive manufacturing method involving modification of sublayers

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231017

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240514

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240710

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241001

R150 Certificate of patent or registration of utility model

Ref document number: 7565807

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150