JP7564747B2 - Processing device and manufacturing method of processed products - Google Patents

Description

The present invention relates to a processing device and a method for manufacturing processed products.

As shown in Patent Document 1, in a conventional cutting device, when cutting a rectangular sealed substrate, a camera is moved along the longitudinal direction for each sealed substrate to perform an alignment operation (positioning operation) before cutting, and then the sealed substrate is rotated 90 degrees and the camera is moved along the lateral direction to perform an alignment operation before cutting.

However, in the above-mentioned cutting device, alignment operations are performed in both the longitudinal and lateral directions, and the alignment operations take time. As a result, the productivity of the cutting device decreases.

JP 2015-128122 A

Therefore, the present invention was made to solve the above problems, and its main objective is to shorten the time required for alignment operations.

In other words, the processing device according to the present invention is characterized in that it comprises a rotatable processing table that holds a processing object having an alignment mark, a processing mechanism that processes the processing object held on the processing table, a reference mark that is provided on the processing table and whose relative position with respect to the center of rotation of the processing table is known, and an imaging camera that images the reference mark and the alignment mark, and images the alignment mark while moving the imaging camera in one direction relative to the processing object, and aligns the processing object and the processing mechanism in the one direction and in a direction perpendicular to the one direction based on the captured alignment mark and reference mark.

The present invention configured in this way can reduce the time required for alignment operations.

1 is a diagram showing a schematic configuration of a cutting device according to an embodiment of the present invention; FIG. 2 is a perspective view showing a schematic diagram of a cutting table and its surrounding structure in the embodiment. FIG. 2 is a diagram (plan view) showing a schematic configuration of the cutting table and its peripheral structure in the embodiment as viewed from the Z direction. FIG. 2 is a diagram (front view) seen from the Y direction, which diagrammatically illustrates the configuration of the cutting table and its peripheral structure in the embodiment. 13 is a diagram (front view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment as viewed from the Y direction. FIG. 13 is a diagram (side view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment when viewed from the X direction. FIG. 13 is a diagram (front view) showing a schematic configuration of a second holding mechanism and a transport moving mechanism of the embodiment as viewed from the Y direction. FIG. FIG. 2 is a cross-sectional view showing a schematic configuration of the rack and pinion mechanism of the embodiment. 5A to 5C are schematic diagrams illustrating the operation of the cutting device according to the embodiment. 11 is a plan view showing a state in which a sealed substrate is placed on the cutting table of the embodiment. FIG. 5A and 5B are schematic diagrams showing the configuration of a holding plate and a holding base part of the embodiment. 10A to 10C are diagrams illustrating an operation of capturing an image of a reference mark and an alignment mark in the embodiment; 11A and 11B are diagrams illustrating an operation for determining a rotation center of the cutting table in the embodiment. 4 is a flowchart of an alignment operation and a cutting operation in the embodiment. 10A and 10B are diagrams illustrating a method for calculating the distance from the center of rotation to a reference mark in the embodiment.

Next, the present invention will be described in more detail using examples. However, the present invention is not limited to the following description.

As described above, the processing apparatus of the present invention comprises a rotatable processing table that holds a workpiece having an alignment mark, a processing mechanism that processes the workpiece held on the processing table, a reference mark that is provided on the processing table and whose relative position with respect to the center of rotation of the processing table is known, and an imaging camera that images the reference mark and the alignment mark, and is characterized in that the imaging camera images the alignment mark while moving in one direction relative to the workpiece, and aligns the workpiece and the processing mechanism in the one direction and in a direction perpendicular to the one direction based on the imaged alignment mark and reference mark.
This processing device captures the alignment marks while moving the imaging camera in one direction relative to the workpiece without rotating the workpiece, and aligns the workpiece and the processing mechanism in one direction and a direction perpendicular to the one direction (i.e., two directions) based on the captured alignment marks and reference marks. Therefore, it is not necessary to capture images of the alignment marks of the workpiece before and after rotating the workpiece. As a result, the number of times the alignment marks are captured is reduced, and the time required for the alignment operation can be shortened.

As a specific embodiment of the processing device, it is desirable that the workpiece to be processed is rectangular, the image of the alignment mark is captured while the imaging camera is moved in one of the longitudinal or lateral directions of the workpiece, and the alignment between the workpiece and the processing mechanism in the longitudinal and lateral directions is performed based on the captured alignment mark and reference mark.

The processing table has a holding plate for holding the workpiece, and a holding base to which the holding plate is removably attached and which holds the workpiece using the holding plate, and it is desirable that the reference mark be provided on the holding plate or the holding base.

To perform alignment control with precision, it is desirable for the processing device to correct the amount of misalignment of the imaging camera by having the imaging camera capture an image of the reference mark.

Then, the imaging camera with the misalignment corrected captures an image of the alignment mark, allowing accurate alignment between the workpiece and the machining mechanism.

As a specific embodiment for determining the relative position between the rotation center of the processing table and the reference mark, it is desirable that the processing table is provided with a center calculation mark for calculating the rotation center of the processing table, the center of rotation is calculated by capturing an image of the center mark with the imaging camera before and after rotating the processing table by a predetermined angle, and the relative position between the reference mark and the rotation center is calculated based on the calculated rotation center.

The processing apparatus of the present invention further includes a processing movement mechanism that moves the processing mechanism in X and Y directions perpendicular to each other in a horizontal plane, and it is preferable that the processing movement mechanism has a pair of X-direction guide rails provided along the X direction across the processing table, and a support that moves along the pair of X-direction guide rails and supports the processing mechanism movably along the Y direction.
With this configuration, the processing mechanism is moved by the processing movement mechanism in each of the X and Y directions perpendicular to each other on a horizontal plane, so the workpiece can be processed without moving the processing table in the X and Y directions. This makes it possible to eliminate the need for a movement mechanism for moving the processing table, simplifying the device configuration and reducing the footprint.

In this configuration, it is preferable that the imaging camera moves in the Y direction along the support body together with the processing mechanism.
With this configuration, the imaging camera can be moved using the processing movement mechanism.

An aspect of the present invention is also a method for manufacturing processed products using the above processing device.

<One embodiment of the present invention>
Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate and schematic drawings are shown. The same components are given the same reference numerals and the description thereof is omitted as appropriate.

<Overall configuration of processing device>
The processing apparatus 100 of the present embodiment is a cutting apparatus that cuts a sealed substrate W, which is an object to be processed, to separate the sealed substrate W into a plurality of products P, which are processed items.

Specifically, as shown in FIG. 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, a first holding mechanism 3 that holds the sealed substrate W to transport it to the cutting tables 2A and 2B, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, a transfer table 5 to which multiple products P are transferred, a second holding mechanism 6 that holds multiple products P to transport them from the cutting tables 2A and 2B to the transfer table 5, a transport moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 that moves the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin to encapsulate at least the electronic elements. The substrate constituting the encapsulated substrate W may be a lead frame or a printed wiring board, and other substrates such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrate constituting the encapsulated substrate W may or may not be wired.

In the following description, the directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are referred to as the X and Y directions, respectively, and the vertical direction perpendicular to the X and Y directions is referred to as the Z direction. Specifically, the left-right direction in FIG. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. As will be described later, the X direction is the direction in which the support 812 moves, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam section (beam section) that spans a pair of legs in the gate-shaped support 812 (see FIG. 2).

<Cutting table>
The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A, 2B are arranged along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (same height in the Z direction) (see FIG. 4), and the centers of their upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

The two cutting tables 2A, 2B are used to suction and hold the sealed substrate W, and as shown in FIG. 1, two vacuum pumps 10A, 10B for suction and holding are arranged in correspondence with the two cutting tables 2A, 2B. Each vacuum pump 10A, 10B is, for example, a water-sealed vacuum pump.

Here, because the cutting tables 2A, 2B are fixed in the XYZ directions, the piping (not shown) connecting the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction power. As a result, even extremely small packages, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, because a decrease in suction power due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

<First Retention Mechanism>
As shown in Fig. 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in Figs. 5 and 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction parts 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction parts 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

As shown in FIG. 1, the substrate supply mechanism 11 has a substrate accommodation section 111 in which a plurality of sealed substrates W are accommodated from outside, and a substrate supply section 112 that moves the sealed substrate W accommodated in the substrate accommodation section 111 to a holding position RP where the sealed substrate W is adsorbed and held by the first holding mechanism 3. This holding position RP is set so as to be aligned in the same row in the X direction as the two cutting tables 2A, 2B. The substrate supply mechanism 11 may also have a heating section 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 to make it flexible and facilitate adsorption.

<Cutting mechanism (processing mechanism)>
As shown in Figures 1, 2 and 3, the cutting mechanism 4 has two rotary tools 40 each consisting of a blade 41A, 41B and two spindles 42A, 42B. The blades 41A and 41B are arranged so that their rotation axes are aligned along the Y direction, and the blades 41A and 41B attached thereto are arranged so as to face each other (see FIG. 3). The blade 41B of the cutting apparatus 100 of the present embodiment rotates in a plane including the X direction and the Z direction to cut the sealed substrate W held on each of the cutting tables 2A and 2B. 4, a liquid supply mechanism 12 having an injection nozzle 121 for injecting cutting water (machining fluid) to suppress frictional heat generated by the blades 41A and 41B is provided. 121 is supported by, for example, a Z-direction moving unit 83 which will be described later.

<Transfer table>
As shown in FIG. 1, the transfer table 5 in this embodiment is a table to which a plurality of products P inspected by the inspection unit 13 described later are transferred. This transfer table 5 is a so-called index table, on which a plurality of products P are temporarily placed before sorting the plurality of products P into various trays 21. The transfer table 5 is arranged in a line along the X direction on a horizontal plane together with the two cutting tables 2A and 2B. Furthermore, the transfer table 5 can move back and forth along the Y direction, and can move to the sorting mechanism 20. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13.

The various trays 21 are transported to the desired position by a tray transport mechanism 22 that moves along the transfer shaft 71, and the products P to be sorted by the sorting mechanism 20 are placed on them. After sorting, the various trays 21 are stored in the tray storage section 23 by the tray transport mechanism 22. In this embodiment, the tray storage section 23 is configured to store three types of trays, for example, trays 21 before storing products P, trays 21 storing good products P, and trays 21 storing defective products P that require rework.

<Inspection Department>
1, the inspection unit 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects a plurality of products P held by the second holding mechanism 6. The inspection unit 13 in this embodiment has a first inspection unit 131 that inspects the sealing surface (package surface) of the product P, and a second inspection unit 132 that inspects the lead surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. The first inspection unit 131 and the second inspection unit 132 may be a common unit.

In the present embodiment, the sealed substrate W and the product P are configured such that one surface of the substrate is resin-molded. In such a configuration, the resin-molded surface is the surface on which the electronic elements connected to the substrate are resin-molded, and is called the "sealing surface" or "package surface". On the other hand, the non-resin-molded surface opposite the resin-molded surface is called the lead surface because the leads that usually function as the external connection electrodes of the product are exposed. In the case where the leads are protruding electrodes used in electronic components such as BGA (Ball Grid Array), they are sometimes called the "ball surface". Furthermore, the non-resin-molded surface opposite the resin-molded surface may be called the "substrate surface" because there are some forms in which no leads are formed. In the description of this embodiment, the resin-molded surface is referred to as the "sealing surface" or "package surface", and the non-resin-molded surface opposite the resin-molded surface is referred to as the "lead surface".

In addition, in order to enable the inspection unit 13 to inspect both sides of the multiple products P, an inversion mechanism 14 is provided that inverts the multiple products P (see FIG. 1). This inversion mechanism 14 has a holding table 141 that holds the multiple products P, and an inversion unit 142 such as a motor that inverts the holding table 141 so that the front and back are reversed.

When the second holding mechanism 6 holds multiple products P from the cutting tables 2A, 2B, the package surfaces of the products P face downward. In this state, while the multiple products P are being transported from the cutting tables 2A, 2B to the inversion mechanism 14, the package surfaces of the products P are inspected by the first inspection unit 131. The multiple products P held by the second holding mechanism 6 are then inverted by the inversion mechanism 14. In this state, the lead surfaces of the products P face downward, and the lead surfaces of the products P are inspected by moving the inversion mechanism 14 to the second inspection unit 132.

<Second Retention Mechanism>
As shown in Fig. 1, the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B to the transfer table 5. As shown in Fig. 8, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction sections 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction sections 611 of the suction head 61. The suction head 61 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A and 2B to the holding table 141 or the transfer table 5.

<Transportation movement mechanism>
As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the holding table 141.

The transport movement mechanism 7, as shown in FIG. 1, extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

The transfer shaft 71 is provided in a range that allows the first holding mechanism 3 to move above the substrate supply section 112 of the substrate supply mechanism 11, and allows the second holding mechanism 6 to move above the transfer table 5 (see FIG. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (near side) of the transfer shaft 71 in a plan view. In addition, the inspection section 13, the reversing mechanism 14, the various trays 21, the tray transport mechanism 22, the tray storage section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the collection container 172 are also provided on the same side (near side) of the transfer shaft 71.

Furthermore, as shown in Figures 5, 6 and 8, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

As shown in Figures 5 to 8, the main movement mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and is provided in a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 can move above the transfer table 5, just like the transfer shaft 71. A slide member 723 is slidably provided on this guide rail 721, on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

The rack and pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided to each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on a common transfer shaft 71, and can be changed to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on a slide member 723 and is a so-called roller pinion. As shown in FIG. 7, it has a pair of roller bodies 722b1 that rotate with the rotation shaft of the motor, and multiple roller pins 722b2 that are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are provided to be able to roll on the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion described above, so two or more roller pins 722b2 come into contact with the cam rack 722a, which prevents backlash from occurring in the forward and reverse directions, improving positioning accuracy when moving the first holding mechanism 3 and second holding mechanism 6 in the X direction.

As shown in Figs. 5 and 8, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in Fig. 8.

As shown in Figs. 5, 6 and 8, the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and has a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

The horizontal movement mechanism 74 of the second holding mechanism 6 is configured similarly to the lifting movement mechanism 73 of the first holding mechanism 3, as shown in FIG. 8. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

<Cutting movement mechanism (processing movement mechanism)>
The cutting movement mechanism 8 linearly moves each of the two spindle portions 42A, 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in Figures 2, 3, and 9, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindles 42A and 42B linearly in the X direction, a Y-direction movement unit 82 that moves the spindles 42A and 42B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindles 42A and 42B linearly in the Z direction.

The X-direction moving part 81 is common to the two cutting tables 2A and 2B, and as shown in particular in FIG. 2 and FIG. 3, has a pair of X-direction guide rails 811 arranged along the X direction between the two cutting tables 2A and 2B, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindle parts 42A and 42B via the Y-direction moving part 82 and the Z-direction moving part 83. The pair of X-direction guide rails 811 are arranged on the sides of the two cutting tables 2A and 2B arranged along the X direction. The support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam part (beam part) that is bridged across the pair of legs, and the beam part extends in the Y direction.

The support 812 moves linearly back and forth along the X direction on a pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. This ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another linear motion mechanism such as a linear motor.

As shown in FIG. 3, the Y-direction moving unit 82 has a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle units 42A, 42B. This allows the two spindle units 42A, 42B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

As shown in Figures 2 to 4, the Z-direction moving unit 83 has a Z-direction guide rail 831 provided along the Z direction on each Y-direction slider 822, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindle units 42A and 42B. In other words, the Z-direction moving unit 83 is provided corresponding to each spindle unit 42A and 42B. The Z-direction slider 832 is driven, for example, by an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth by another linear motion mechanism such as a ball screw mechanism.

As shown in Figures 1 and 4, the positional relationship between the cutting movement mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the cutting movement mechanism 8 and crosses the cutting movement mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

<Processing waste storage section>
As shown in FIG. 1, the cutting apparatus 100 of this embodiment further includes a processing waste storage section 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W.

As shown in Figures 2 to 4, the processing debris storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 with an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects processing debris S guided by the guide chute 171. By providing the processing debris storage section 17 below the cutting tables 2A, 2B, the collection rate of processing debris S can be improved.

The guide chute 171 guides the machining scraps S that have scattered or fallen from the cutting tables 2A, 2B to the collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it difficult for the machining scraps S to be missed, and the collection rate of the machining scraps S can be further improved. In addition, the guide chute 171 is configured to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining scraps S and cutting water.

In this embodiment, the processing waste storage section 17 is common to the two cutting tables 2A and 2B, but it may be provided for each cutting table 2A and 2B.

The collection container 172 collects the processing scraps S that have passed through the guide chute 171 under their own weight, and in this embodiment, as shown in FIG. 4 etc., is provided for each of the two cutting tables 2A, 2B. The two collection containers 172 are arranged on the front side of the transfer shaft, and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration improves the ease of maintenance, such as disposal of the processing scraps S. Note that the collection container 172 may be provided in one place under all the cutting tables, or may be divided into three or more, taking into consideration the size of the sealed substrate W, the size and amount of the processing scraps S, and workability.

As shown in FIG. 4 and other figures, the processing debris storage section 17 also has a separation section 173 that separates the cutting water from the processing debris. One possible configuration for this separation section 173 is to provide a filter such as a porous plate that allows the cutting water to pass through the bottom surface of the collection container 172. This separation section 173 allows the processing debris S to be collected without the cutting water accumulating in the collection container 172.

<First cleaning mechanism>
1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 for cleaning the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. The first cleaning mechanism 18 cleans the upper surfaces of the products P by using an injection nozzle 18a (see FIG. 5) that injects cleaning liquid and/or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

As shown in FIG. 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, a lifting movement mechanism 181 for lifting and moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. This lifting movement mechanism 181 may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, or one that uses an air cylinder.

<Second Cleaning Mechanism>
1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the bottom surfaces (package surfaces) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and cleans the bottom surfaces of the multiple products P held by the second holding mechanism 6 by spraying cleaning liquid and/or compressed air onto the bottom surfaces of the multiple products P. In other words, the second cleaning mechanism 19 cleans the bottom surfaces of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

<Example of the operation of the cutting device>
Next, an example of the operation of the cutting apparatus 100 will be described. Fig. 9 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 in the operation of the cutting apparatus 10. In this embodiment, all operations and controls of the cutting apparatus 100, such as transporting the sealed substrate W, cutting the sealed substrate W, and inspecting the product P, are performed by the controller CTL (see Fig. 1).

The substrate supply section 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation section 111 toward the holding position RP held by the first holding mechanism 3.

Next, the transport movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transport movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the adsorption and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B adsorb and hold the sealed substrate W.

When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and moving mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retracted from the cutting table 2B to the transfer table 5 side, there is no need to raise and lower the first holding mechanism 3 as described above.

In this state, the cutting movement mechanism 8 sequentially moves the two spindle parts 42A, 42B in the X direction and Y direction, while the cutting tables 2A, 2B rotate, cutting the sealed substrate W into individual pieces in a lattice pattern.

After cutting, the transport movement mechanism 7 moves the first cleaning mechanism 18 to clean the top surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport movement mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Next, the transport movement mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 suctions and holds the multiple products P. After that, the transport movement mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. This causes the second cleaning mechanism 19 to clean the underside (package surface) of the multiple products P held by the second holding mechanism 6.

After cleaning, the multiple products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the inversion mechanism 14. The transport movement mechanism 7 then moves the second holding mechanism 6 to the transfer table 5, which then releases the suction hold and places the multiple products P on the transfer table 5. The multiple products P placed on the transfer table 5 are sorted by the sorting mechanism 20 into various trays 21 according to the inspection results (good products, defective products, etc.) by the inspection unit 13.

For double-sided inspection, for example, first, one side of the product P is inspected while it is held by suction with the second holding mechanism 6. Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the inversion mechanism 14, and the other side of the product P is inspected while it is held by suction with the holding table 141 after inversion, thereby performing double-sided inspection. The product P can then be transported from the inversion table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6. In addition, the holding table 141 can be configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 can be configured to be movable in the Z direction, and the product P can be transported and transferred to the transfer table 5 by moving the holding table 141 above the transfer table 5.

<Cutting device alignment function>
The cutting device 100 of this embodiment has an alignment function for aligning the sealed substrate W held on the cutting tables 2A, 2B and the blades 41A, 41B of the cutting mechanism 100 in two directions, the X direction and the Y direction, without rotating the cutting tables 2A, 2B (sealed substrate W).

Specifically, as shown in FIG. 10, the cutting device 100 includes a reference mark M1 that is provided on the cutting tables 2A and 2B and whose relative position with respect to the rotation center RC of the cutting tables 2A and 2B is known, and an imaging camera 24 that captures an image of the reference mark M1 and the alignment mark AM.

As shown in Figures 10 and 11, the cutting tables 2A and 2B of this embodiment have an exchangeable holding plate 201 and a holding base portion 202 to which the holding plate 201 is removably attached and which holds the sealed substrate W using the holding plate 201. The holding plate 201 is a jig for holding the sealed substrate W.

The reference mark M1 is provided on the upper surface of the holding plate 201 of the cutting tables 2A and 2B. This holding plate 201 holds the rectangular sealed substrate W, and two reference marks M1 are provided at locations corresponding to the short sides of the sealed substrate W. Note that there may be one reference mark M1, or three or more reference marks M1.

A center calculation mark M2 for finding the center of rotation RC of the cutting tables 2A and 2B is provided on the upper surface of the holding base portion 202 of the cutting tables 2A and 2B. This center calculation mark M2 is provided at a position where it can be imaged by the imaging camera 24 with the holding plate 201 attached to the holding base portion 202. In this embodiment, the center calculation mark M2 is provided so as to be located on the same straight line in the X direction as the center of rotation RC when the cutting tables 2A and 2B are used to align the longitudinal direction of the sealed substrate W with the Y direction (see FIG. 10).

As shown in Figures 1 to 3 and 10, the imaging camera 24 is provided on one of the two spindle parts 42A, 42B (here, spindle part 42A) and moves together with the spindle part 42A. In other words, the imaging camera 24 is movable in the X direction along the X direction guide rail 811 of the cutting movement mechanism 8, and is movable in the Y direction along the support body 812. The imaging camera 24 of this embodiment has a wide field of view and high resolution, and is capable of detecting multiple marks in a single imaging session.

The cutting device 100 then captures an image of the alignment mark AM on the sealed substrate W while moving the imaging camera 24 in one direction (here, the longitudinal direction) relative to the sealed substrate W, and aligns the sealed substrate W with the blades 41A and 41B of the cutting mechanism 4 in the longitudinal and lateral directions based on the captured alignment mark AM and reference mark M1.

Specifically, the cutting device 100 aligns the longitudinal direction of the sealed substrate W held on the cutting tables 2A and 2B along the Y direction, and in this state moves the imaging camera 24 in the Y direction along the support 812 to capture images of each of the multiple alignment marks AM provided on the sealed substrate W.

In this embodiment, multiple alignment marks AM are provided on each of two opposing sides along the longitudinal direction of the sealed substrate W, and as shown in FIG. 12, the multiple alignment marks AM on one opposing side (the left side in FIG. 12) are imaged while being moved along the Y direction (longitudinal direction), and then the support 812 is moved in the X direction to image the multiple alignment marks AM on the other opposing side (the right side in FIG. 12) while being moved along the Y direction (longitudinal direction).

In the alignment operation of the sealed substrate W in FIG. 12, a total of 12 operations are performed, including two operations for imaging the reference mark M1 and 10 operations for imaging the alignment marks AM. That is, in each imaging operation, the imaging camera 24 is positioned at a predetermined imaging position. Note that the sealed substrate W shown in FIG. 12 has 12 alignment marks AM, but the imaging camera 24 of this embodiment images two alignment marks AM at each of the four corners in one imaging operation. Specifically, the point where the cutting lines indicated by the two alignment marks AM intersect is positioned in the center of the image, an image is taken, and the position of the alignment marks AM is detected.

The cutting device 100 of this embodiment also has a function of calculating the rotation center RC of the cutting tables 2A and 2B using the center calculation mark M2. Specifically, the center calculation mark M2 is imaged in the state of FIG. 13(a), that is, in the state where the center calculation mark M2 is on the left side, and the center calculation mark M2 is imaged in the state of FIG. 13(b), that is, in the state where the cutting tables 2A and 2B are rotated by a predetermined angle (180 degrees in this embodiment) and the center calculation mark M2 is on the right side. The coordinates of the rotation center RC of the cutting tables 2A and 2B are calculated from the position of the imaging camera 24 when these two captured images were taken, the coordinates of the center calculation mark M2 before rotation, and the coordinates of the center calculation mark M2 after rotation.

In addition, the cutting device 100 of this embodiment captures an image of the reference mark M1 using the imaging camera 24 before capturing an image of the alignment mark AM of the sealed substrate W, and calculates the amount of misalignment of the imaging camera 24 (particularly the amount of misalignment in the Y direction). The cutting device 100 then captures an image of the multiple alignment marks AM while correcting the amount of misalignment of the imaging camera 24. By correcting the amount of misalignment of the imaging camera 24 using the reference mark M1 in this manner, a high-precision linear scale is not required, and a rotary encoder built into a servo motor, for example, can be used.

<Details of alignment and cutting operations>
Next, the alignment operation and cutting operation of the cutting device 100 of this embodiment will be described with reference to Fig. 14. The following alignment operation and cutting operation are controlled by the control unit CTL.

(Step S1: Determination of rotation center RC)
First, the center calculation mark M2 provided on the cutting tables 2A and 2B is captured by the imaging camera 24 before and after rotating the cutting tables 2A and 2B by a predetermined angle (here, 180 degrees) (see FIG. 13). Then, the control unit CTL calculates the coordinates of the rotation center RC of the cutting tables 2A and 2B from the coordinates of the center calculation mark M2 before rotation obtained from the captured image before rotation and the coordinates of the center calculation mark M2 obtained from the captured image after rotation. Note that the above operation is performed for each of the two cutting tables 2A and 2B, and the coordinates of the rotation center RC of each of the two cutting tables 2A and 2B are calculated.

(Step S2: Calculate the distances L1 and L2 between the reference mark M1 and the rotation center RC)
Next, the image of each of the reference marks M1 provided on the holding plate 201 is captured by the imaging camera 24. Then, the longitudinal distance L1 and the lateral distance L2 between the reference mark M1 and the rotation center RC of the cutting tables 2A and 2B are calculated from the captured image (see FIG. 15). This determines the relative position between the reference mark M1 and the rotation center RC. Note that these distances L1 and L2 may be measured using a linear scale (not shown) provided on the support 812.

(Step S3: Calculation of ideal cutting line)
Then, using the rotation center RC of the cutting tables 2A, 2B as a reference, the controller CTL calculates ideal cutting lines in the longitudinal and lateral directions of the sealed substrate W. Note that the ideal cutting lines are determined according to the type of the sealed substrate W, and the above steps S1 to S3 are performed every time the type of the sealed substrate W is changed.

(Step S4: Holding the Sealed Substrate W)
The sealed substrate W is placed on the holding plate 201, and the sealed substrate W is held on the cutting tables 2A and 2B. At this time, the cutting tables 2A and 2B are in a state in which the longitudinal direction of the held sealed substrate W coincides with the Y direction (the longitudinal direction of the support 812). Note that, from the following steps S5 to S8, the cutting tables 2A and 2B are fixed without being rotated.

(Step S5: Calculate the amount of deviation of the imaging camera 24)
The image of the reference mark M1 provided on the holding plate 201 is captured by the image capturing camera 24. Then, the amount of deviation of the position of the image capturing camera 24 is calculated from the captured image and the position of the image capturing camera 24.

(Step S6: Imaging of alignment mark AM)
The control unit CTL corrects the calculated amount of deviation in the position of the imaging camera 24, and moves the imaging camera 24 in the longitudinal direction (Y direction) of the sealed substrate W, capturing an image of each of the alignment marks AM of the sealed substrate W (see FIG. 12). The imaging of the alignment marks AM is performed without rotating the cutting tables 2A, 2B (sealed substrate W), that is, with the longitudinal direction of the sealed substrate W fixed and aligned with the Y direction.

(Step S7: Are all alignment marks photographed?)
When all of the alignment marks AM on the sealed substrate W have been imaged in step S6, the process proceeds to step S8. On the other hand, when all of the alignment marks AM on the sealed substrate W have not been imaged, the process returns to step S6.

(Step S8: Calculation of measured cutting line)
Based on the captured images of the alignment marks AM and the reference mark M1, the controller CTL calculates measured cutting lines in the longitudinal and lateral directions of the sealed substrate W. That is, by capturing images of the alignment marks AM only in the longitudinal direction of the sealed substrate W without rotating the sealed substrate W, the controller CTL calculates both the measured cutting lines in the longitudinal direction and the measured cutting lines in the lateral directions.

(Step S9: Calculation of deviation of measured cutting line)
The control unit CTL calculates the amount of deviation between the ideal cutting line obtained in the above step S3 and the actually measured cutting line obtained in the above step S8.

(Step S10: Correction of deviation amount)
Based on the amount of deviation calculated in step S9, the control unit CTL rotates the cutting tables 2A, 2B and moves the spindles 42A, 42B to correct the amount of deviation.

(Step S11: Cutting in the short direction)
After the deviation amount is corrected by step S10, the spindle parts 42A, 42B are moved in the X direction (cutting feed direction) to cut the lateral direction of the sealed substrate W, and the spindle parts 42A, 42B are moved in the Y direction (pitch feed direction) to cut the sealed substrate W into a plurality of pieces. Note that the cutting tables 2A, 2B are fixed during this cutting in the lateral direction.

(Step S12: Rotation of Sealed Substrate W)
After cutting of the sealed substrate W in the short-side direction is completed in step S11, the cutting tables 2A and 2B are rotated by 90 degrees, and the sealed substrate W is rotated by 90 degrees.

(Step S13: Cutting in the Longitudinal Direction)
The spindle parts 42A, 42B are moved in the X direction (cutting feed direction) to cut the encapsulated substrate W in the longitudinal direction, and the spindle parts 42A, 42B are moved in the Y direction (pitch feed direction) to cut the encapsulated substrate W into a plurality of pieces. Note that the cutting tables 2A, 2B are fixed during this cutting in the longitudinal direction.

<Effects of this embodiment>
According to the cutting device 100 of this embodiment, the alignment mark AM is imaged while the imaging camera 24 is moved in the longitudinal direction relative to the sealed substrate W without rotating the sealed substrate W, and alignment between the sealed substrate W and the blades 41A, 41B of the cutting mechanism 4 in two directions, the longitudinal direction and the lateral direction, can be performed based on the imaged alignment mark AM and reference mark M1. In other words, according to the cutting device 100 of this embodiment, since alignment operation is required only in the longitudinal direction, it is not necessary to image the alignment mark AM of the sealed substrate W before and after rotating the sealed substrate W. As a result, the number of times the alignment mark AM is imaged is reduced, and the time required for the alignment operation can be shortened.

In addition, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5, and the cutting mechanism 4 is moved by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 in a horizontal plane and in the Y direction perpendicular to the X direction, so that the sealed substrate W can be processed without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, the cutting tables 2A, 2B do not need to be moved by the ball screw mechanism, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the device configuration of the cutting device 100 can be simplified. In addition, the cutting tables 2A, 2B can be configured not to move in the X direction and the Y direction, and the footprint of the cutting device 100 can be reduced.

<Other Modified Embodiments>
The present invention is not limited to the above-described embodiment.

For example, in the above embodiment, the operation of imaging the alignment mark AM only in the longitudinal direction of the sealed substrate W is performed without rotating the sealed substrate W, but the operation of imaging the alignment mark AM only in the lateral direction of the sealed substrate W may also be performed without rotating the sealed substrate W. When performing the operation of imaging the alignment mark AM only in the lateral direction, cutting may be performed first in the longitudinal direction, and then the cutting table may be rotated 90 degrees before cutting in the lateral direction.

In addition, the workpiece in the above embodiment was a rectangular sealed substrate W, but the workpiece may be of a shape other than rectangular, such as circular.

In the above embodiment, a cutting device with a twin cut table system and a twin spindle configuration has been described, but the present invention is not limited to this, and may be a cutting device with a single cut table system and a single spindle configuration, or a cutting device with a single cut table system and a twin spindle configuration.

In addition, the transfer table 5 in the above embodiment was an index table on which the items were temporarily placed before being sorted into the various trays 21, but the transfer table 5 may also be the holding table 141 of the inversion mechanism 14.

In addition, in the above embodiment, the product P is sorted from the transfer table 5 to the tray 21, but the product P may be transported and attached to an adhesive tape placed inside the frame-shaped member.

Furthermore, in the configuration of the above embodiment, the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B. In this case, for example, the sealed substrate W that has been grooved on the cutting tables 2A and 2B may be returned to the substrate supply unit 112 by the first holding mechanism 3 and the transport movement mechanism 7. The sealed substrate W returned to the substrate supply unit 112 may also be accommodated in the substrate accommodation unit 111.

In addition, since the cam rack elements that make up the transfer shaft 71 can be configured by connecting multiple elements, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module that performs a type of inspection different from the inspection at the inspection unit 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Note that in addition to the configurations exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) anywhere, and the added module may be a module with various functions other than inspection.

The processing device of the present invention may also perform processing other than cutting, for example, other mechanical processing such as cutting and grinding.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the invention.

100...Cutting device (processing device)
W: Sealed substrate (object to be processed)
AM: Alignment mark P: Product (processed product)
2A, 2B...Cutting table (processing table)
201: Holding plate 202: Holding base portion 4: Cutting mechanism (processing mechanism)
8... Cutting movement mechanism (processing movement mechanism)
811: X-direction guide rail 812: Support body 24: Image capture camera M1: Reference mark M2: Center calculation mark

Claims (9)

a processing table that holds an object to be processed having an alignment mark and is rotatable;
a processing mechanism that processes the object held on the processing table; and
a reference mark provided on the processing table, the relative position of which with respect to a rotation center of the processing table is known;
an imaging camera for imaging the reference mark and the alignment mark,
A processing device that images the alignment mark while moving the imaging camera in one direction relative to the workpiece, and aligns the workpiece and the processing mechanism in the one direction and in a direction perpendicular to the one direction by correcting the amount of deviation between a measured cutting line calculated based on the imaged alignment mark and reference mark and an ideal cutting line calculated based on the rotation center. The object to be processed has a rectangular shape,
2. The processing apparatus of claim 1, wherein the alignment mark is imaged while the imaging camera is moved in one of the longitudinal or lateral directions of the workpiece, and alignment between the workpiece and the processing mechanism in the longitudinal direction and the lateral direction is performed by correcting the amount of deviation between a measured cutting line calculated based on the imaged alignment mark and reference mark and an ideal cutting line calculated based on the center of rotation . the processing table includes a holding plate for holding the workpiece, and a holding base portion to which the holding plate is detachably attached and which holds the workpiece by using the holding plate;
The processing device according to claim 1 or 2, wherein the reference mark is provided on the holding plate or the holding base portion. The processing device according to claim 1 , wherein the imaging camera captures an image of the reference mark, thereby correcting a camera deviation amount that is a deviation amount of the imaging camera. The processing device according to claim 4 , wherein the imaging camera, in which the camera misalignment amount has been corrected, images the alignment mark. the processing table is provided with a center calculation mark for calculating a rotation center of the processing table,
6. The processing device according to claim 1, wherein the rotation center is calculated by capturing an image of the center calculation mark with the imaging camera before and after rotating the processing table by a predetermined angle, and the relative position of the reference mark and the rotation center is calculated based on the calculated rotation center. Further, a processing movement mechanism is provided which moves the processing mechanism in an X direction and a Y direction perpendicular to each other on a horizontal plane,
7. The processing device according to claim 1, wherein the processing movement mechanism includes a pair of X-direction guide rails arranged along the X-direction on either side of the processing table, and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism movably along the Y-direction. The processing device according to claim 7, wherein the imaging camera moves in the Y direction along the support together with the processing mechanism. A method for manufacturing a processed product using the processing device according to any one of claims 1 to 8.