JP7560899B2 - Bonding device, bonding method, and bonding program - Google Patents

Description

The present invention relates to a bonding device, a bonding method, and a bonding program.

The bonding device includes a bonding tool that picks up electronic components and bonds them to a substrate, a drive unit that moves the bonding tool, and a control unit that controls the drive unit so that the bonding tool moves along a predetermined trajectory.

For example, Patent Document 1 discloses a numerical control method for moving a controlled object along a predetermined trajectory. Here, the trajectory is first approximated by a spatial polynomial, and the polynomial is converted into a polynomial as a function of time. Next, the converted polynomial as a function of time is distributed to each control axis, and a control command for each control axis is generated based on the polynomial as a function of time distributed to each axis. Next, each control axis is controlled based on the control command to move the controlled object along the trajectory.

JP 2002-175105 A

When moving the holding tool in at least two directions simultaneously based on a position command generated by a time function polynomial, there are cases where a time difference is provided for the start and end points of the movement in each of the two directions. If such a time difference for the start and end of the movement is set to a constant, a problem occurs in that the trajectory of the holding tool fluctuates when the total movement time of the bonding tool is changed.

The present invention has been made in consideration of these circumstances, and aims to provide a bonding device, a bonding method, and a bonding program that can optimally adjust the trajectory of the bonding tool.

A bonding apparatus according to one aspect of the present invention is a bonding apparatus for bonding an electronic component to an object, and includes a bonding tool that picks up an electronic component at an initial position and bonds it at a target position on the object, a driving unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction, a control unit that controls the driving unit based on a position command generated by a time-variable polynomial, and a storage unit that stores control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, the control parameters including at least one of a total travel time required for the bonding tool to move from the initial position to the target position, a reference total travel time that serves as a reference for the total travel time, a travel start time difference between the start point of the movement of the bonding tool in the first direction and the start point of the movement of the bonding tool in the second direction, and a travel end time difference between the end point of the movement of the bonding tool in the first direction and the end point of the movement of the bonding tool in the second direction, and a reference time difference that serves as a reference for at least one of the time differences, and the ratio of at least one of the time differences to the reference time difference is set according to the ratio of the total travel time to the reference total travel time.

A bonding method according to another aspect of the present invention is a bonding method using a bonding apparatus that bonds an electronic component to an object, the bonding apparatus comprising: a bonding tool that picks up an electronic component at an initial position and bonds it at a target position on the object; a driving unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction; a control unit that controls the driving unit based on a position command generated by a time-variable polynomial; and a storage unit that stores control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, the control parameters being determined by the position command generated by the time-variable polynomial. The bonding method includes a total movement time required to move to the target position, a reference total movement time serving as a reference for the total movement time, at least one of a movement start time difference between a movement start time in a first direction and a movement start time in a second direction of the bonding tool, and a movement end time difference between a movement end time in the first direction and a movement end time in the second direction of the bonding tool, and a reference time difference serving as a reference for at least one of the time differences, and includes setting a ratio of at least one of the time differences to the reference time difference according to the ratio of the total movement time to the reference total movement time, and moving the bonding tool from the initial position to the target position based on at least one of the time differences.

A bonding program according to another aspect of the present invention is a bonding program for operating a bonding device that bonds an electronic component to an object, the bonding device including a bonding tool that picks up an electronic component at an initial position and bonds it at a target position on the object, a drive unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction, a control unit that controls the drive unit based on a position command generated by a time-variable polynomial, and a memory unit that stores control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, the control parameters being a control parameter for controlling the initial position of the bonding tool, The system includes a total travel time required for the bonding tool to move from the initial position to the target position, a reference total travel time serving as a reference for the total travel time, at least one of a travel start time difference between a start time of the bonding tool's movement in a first direction and a start time of the movement in a second direction, and a travel end time difference between a end time of the bonding tool's movement in the first direction and a end time of the movement in the second direction, and a reference time difference serving as a reference for at least one of the time differences, and causes the computer to set a ratio of at least one of the time differences to the reference time difference in accordance with the ratio of the total travel time to the reference total travel time, and to move the bonding tool from the initial position to the target position based on at least one of the time differences.

The present invention provides a bonding device, a bonding method, and a bonding program that can optimally adjust the trajectory of the bonding tool.

1 is a diagram showing a configuration of a bonding apparatus according to an embodiment; 13 is a graph showing the change in speed of a suction collet over time. 4 is a flowchart illustrating a bonding method according to an embodiment.

The following describes an embodiment of the present invention with reference to the drawings. The drawings of this embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to this embodiment.

<Bonding equipment>
First, the configuration of a bonding apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a diagram showing the configuration of a bonding apparatus according to an embodiment. Figure 2 is a graph showing the change in speed of a suction collet over time. In the graph shown in Figure 2, the vertical axis shows values normalized to speed at 1, and the horizontal axis shows values normalized to time at 1.

For the sake of convenience, Fig. 1 uses an orthogonal coordinate system consisting of the X-axis, Y-axis, and Z-axis to explain the positional relationships and movement directions. The directions parallel to the X-axis, Y-axis, and Z-axis are the X-axis, Y-axis, and Z-axis directions, respectively. The X-axis direction is perpendicular to the paper surface, the Y-axis direction is the left-right direction on the paper surface, and the Z-axis direction is the up-down direction on the paper surface.

The bonding device 1 is a bonding device that bonds a die (semiconductor chip) 12 to a lead frame 21. The die 12 corresponds to an example of an electronic component, and the lead frame 21 corresponds to an example of an object. The bonding device 1 is used so that the Z-axis direction is the vertical direction, and the X-axis direction and the Y-axis direction are the horizontal directions.

The electronic components are not limited to these, and may be, for example, active elements, passive elements, or MEMS devices. The target object is not limited to the lead frame 21, which is a type of substrate, and may be, for example, a substrate such as an interposer substrate, a semiconductor substrate, or a carrier plate, or may be an electronic component such as a die.

The bonding device 1 includes a pickup unit 10, a bonding stage 20, a bonding head 30, an imaging unit 40, a driving unit 50, and a control device 90.

The pickup unit 10 transports a wafer 11, which is a substrate for assembling dies 12, and supplies the dies 12 to the bonding head 30. The pickup unit 10 corresponds to an example of an electronic component supply unit that supplies electronic components. The electronic component supply unit may be, for example, a tray feeder, a parts feeder, or a tape feeder.

The bonding stage 20 supplies the lead frame 21. The bonding stage 20 is a stage for bonding the die 12 to the lead frame 21 that has been transported. The bonding stage 20 may also serve as a moving stage for transporting the lead frame 21. The bonding stage 20 is provided alongside the pickup unit 10 in the Y-axis direction. The bonding stage 20 corresponds to an example of a bonding unit in which bonding of electronic components to an object is performed. When the object is a substrate, the bonding device 1 may have components (not shown) such as a substrate supply unit that supplies substrates stored in a magazine, a loader that removes the substrate from the magazine and transports it to the bonding unit, an unloader that transports the substrate on which the electronic components are mounted from the bonding unit and stores it in the magazine, a guide rail that slides and transports the substrate, or a substrate index that aligns the substrate.

The bonding head 30 picks up and releases the die 12. The bonding head 30 also bonds the die 12 to the lead frame 21. The bonding head 30 reciprocates between an initial position P1 above the pickup unit 10 and a target position P2 above the bonding stage 20. The bonding head 30 is connected to a drive unit 50 at its upper portion. The bonding head 30 is equipped with a suction collet 33.

The suction collet 33 is a holding tool that suctions and holds the die 12. The suction collet 33 is provided at the end of the bonding head 30 opposite the drive unit 50. The suction collet 33 picks up the die 12 at the initial position P1, bonds it at the target position P2 on the lead frame 21, and releases it. The suction collet 33 corresponds to an example of a bonding tool.

The bonding tool is not limited to a suction collet as long as it is capable of picking up and bonding electronic components. The bonding tool may be, for example, an electrostatic chuck that electrically attracts electronic components, or a mechanical chuck that mechanically supports electronic components.

Although not shown in the figure, the bonding head 30 may further include a suction tool that sucks in air to adsorb the die 12, a heating tool that heats the die 12, a cooling tool that cools the die 12, and a purge gas supply tool that supplies a purge gas that forms a non-oxidizing atmosphere.

The imaging unit 40 is a type of image sensor that captures an image of the tip of the suction collet 33 that reciprocates between the initial position P1 and the target position P2. The imaging unit 40 acquires captured images for evaluating the state in which the suction collet 33 holds the die 12 while the die 12 is being transported. The captured images captured by the imaging unit 40 are sent to the image analysis unit 95, which will be described later.

The driving unit 50 is an orthogonal robot that moves the bonding head 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The driving unit 50 has an X-axis actuator 51, a Y-axis actuator 52, and a Z-axis actuator 53. The X-axis actuator 51 moves the bonding head 30 along the X-axis direction, the Y-axis actuator 52 moves the bonding head 30 along the Y-axis direction, and the Z-axis actuator 53 moves the bonding head 30 along the Z-axis direction. The driving unit 50 independently controls the movement of the bonding head 30 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.

Between the time when the bonding head 30 picks up the die 12 at the initial position P1 and the time when it bonds the die 12 at the target position P2, the driving unit 50, for example, fixes the bonding head 30 in the X-axis direction and moves it along the Y-axis direction and the Z-axis direction. At this time, the driving unit 50 moves the bonding head 30 along a predetermined trajectory that passes through the focal point or the vicinity of the focal point on the optical axis of the imaging unit 40. In order to prevent the picked-up die 12 from contacting other dies 12 on the pickup unit 10, the bonding head 30 starts moving in the Z-axis direction first, and then starts moving in the Y-axis direction with a time lag. Similarly, in order to prevent the die 12 from contacting the lead frame 21 or other dies 12 that have already been bonded during bonding, the bonding head 30 finishes moving in the Y-axis direction first, and then finishes moving in the Z-axis direction with a time lag.

In addition, between picking up and bonding, the drive unit 50 may move the bonding head 30 in the X-axis direction in addition to the Y-axis and Z-axis directions. Even in this case, the direction in which the bonding head 30 first starts moving and the direction in which the bonding head 30 finally stops moving between picking up the die 12 and bonding is the Z-axis direction.

The drive unit is not limited to an orthogonal robot, but may be, for example, a robot manipulator.

The control device 90 controls the bonding head 30, the imaging unit 40, and the drive unit 50. The control device 90 includes, for example, a memory unit 91, a calculation unit 92, a command generation unit 93, a control unit 94, and an image analysis unit 95. Each unit of the control device 90 is configured by computer hardware, software, or a combination of these. That is, the control device 90 is executed by computer hardware, software, or a collaboration of these. The computer includes a CPU (Central Processing Unit) and a memory. The memory stores the program of the present invention. The CPU is configured to realize the functions of the memory unit 91, the calculation unit 92, the command generation unit 93, the control unit 94, and the image analysis unit 95 by executing the program stored in the memory.

The memory unit 91 stores a time-variable polynomial that generates a position command for the control unit 94 to control the drive unit 50. The position command is information that commands the position of the suction collet 33 with respect to the elapsed time from the movement start time.

The time variable type polynomial includes a first time variable type polynomial and a second time variable type polynomial that are independent of each other. The first time variable type polynomial is a function for generating a position command that commands the position of the suction collet 33 in the Z-axis direction. The first time variable type polynomial uses the time from the movement start time Tz1 in the Z-axis direction as a variable, and derives the position of the suction collet 33 in the Z-axis direction at that time. Based on the position command generated by the first time variable type polynomial, the control unit 94 controls the Z-axis actuator 53 of the drive unit 50. The second time variable type polynomial is a function for generating a position command that commands the position of the suction collet 33 in the Y-axis direction. The first time variable type polynomial uses the time from the movement start time Ty1 in the Y-axis direction as a variable, and derives the position of the suction collet 33 in the Y-axis direction at that time. Based on the position command generated by the second time variable type polynomial, the control unit 94 controls the Y-axis actuator 52 of the drive unit 50.

For example, the maximum degree of the first time variable type polynomial is greater than the maximum degree of the second time variable type polynomial. This is because the movement in the Z-axis direction controlled based on the position command generated by the first time variable type polynomial is more complex than the movement in the Y-axis direction controlled based on the position command generated by the second time variable type polynomial. Specifically, when moving from the initial position P1 to the target position P2, the movement of the suction collet 33 in the Y-axis direction is unidirectional, in the +Y-axis direction, but the movement of the suction collet 33 in the Z-axis direction is bidirectional, in the +Z-axis direction and the -Z-axis direction. In this way, by increasing the degree of the time variable type polynomial in a direction with a complex movement path, the trajectory of the suction collet 33 can be made smooth.

The first time variable type polynomial is expressed, for example, by the following formula: As an example, the first time variable type polynomial is a ninth degree formula with n=9 in the following formula.

Z: position in the first direction at time t _z S _z : coordinate of final arrival position in the Z-axis direction C _z0 , C _z1 , . . . , C _z(n−1) , C _zn : coefficients (n is a coefficient of 2 or more)
t _z : Elapsed time from the movement start time Tz1 in the Z-axis direction T _z : Movement time from the movement start time Tz1 to the movement end time Tz2 in the Z-axis direction

The second time variable type polynomial is expressed, for example, by the following formula: As an example, the second time variable type polynomial is a seventh degree formula with m=7 in the following formula.

Y: position in the second direction at time t _y S _y : coordinate of final arrival position in the Y-axis direction C _y0 , C _y1 , . . . , C _y(m-1) , C _ym : coefficients (m is a coefficient of 2 or more)
t _y : Elapsed time from the movement start time Ty1 in the Y-axis direction T _y : Movement time from the movement start time Ty1 to the movement end time Ty2 in the Y-axis direction

The memory unit 91 further stores control parameters of the control unit 94 for moving the suction collet 33 from the initial position P1 to the target position P2 along a predetermined trajectory. The control parameters include, for example, the coefficients of the first and second time-variable polynomials, the total movement time T, the reference total movement time, the reference movement time difference, the size and shape of the die 12, and the size and bonding position of the lead frame 21.

The coefficients of the first and second time variable type polynomials stored in the storage unit 91 are a coefficient data set of coefficients _Cz0 , _Cz1 , ..., _{Cz (n-1)} , _Czn and coefficients _Cy0 , _Cy1 , ..., Cy _(m-1) , _Cym . The trajectory of _the suction collet 33 is determined by a combination of the _{coefficients Cz0} , _Cz1 , ..., _Cz(n-1) , _Czn and coefficients Cy0, Cy1, ..., _Cy(m-1) , Cym. The coefficient data set stored in the storage unit 91 may be one set of coefficient data sets or may be multiple sets of coefficient data sets.

The total movement time T is the length of time required for the suction collet 33 to move from the initial position P1 to the target position P2. In other words, it is the length of time that the suction collet 33 moves in at least one of the Z-axis direction and the Y-axis direction between picking up the die 12 and bonding it. As shown in FIG. 2, in this embodiment, in which the movement starts first and ends last in the Z-axis direction, the total movement time T is expressed as the length of time Tz2-Tz1 from the start point Tz1 of the movement in the Z-axis direction to the end point Tz2 of the movement in the Z-axis direction. Instead of the total movement time T, the movement speed of the suction collet 33 may be input as a control parameter.

The reference total travel time is the length of time that serves as the reference for the total travel time T. The reference total travel time is the standard total travel time that is set, for example, during mass production, taking into account production efficiency and the rate of defective products.

Instead of the total movement time and the reference total movement time, the average movement speed and the reference average movement speed of the suction collet may be input as control parameters. In this case, the total movement time and the reference total movement time may be calculated based on the input average movement speed and the reference average movement speed.

The reference time difference is the length of time that serves as the basis for the movement start time difference ΔT1 and the movement end time difference ΔT2 described below. The reference time difference includes a reference movement start time difference that serves as the basis for the movement start time difference ΔT1, and a reference movement end time difference that serves as the basis for the movement end time difference ΔT2. The reference movement start time difference and the reference movement end time difference are standard movement start time difference and movement end time difference that are set, for example, taking into consideration the production efficiency and the occurrence rate of defective products when the bonding device 1 is operated at the reference total movement time.

The first time variable type polynomial, the second time variable type polynomial, the coefficients of the first and second time variable type polynomials, the total travel time T, the reference total travel time, and the reference time difference are input, for example, by an input unit (not shown) of the control device 90. The input unit is, for example, a keyboard, a mouse, or a touch panel.

The calculation unit 92 calculates the movement start time difference ΔT1 and the movement end time difference ΔT2.

The movement start time difference ΔT1 is the time difference between the movement start time Tz1 in the Z-axis direction and the movement start time Ty1 in the Y-axis direction when the suction collet 33 starts moving from the initial position P1. As shown in FIG. 2, in this embodiment, where movement starts first in the Z-axis direction, the movement start time difference ΔT1 is expressed as the length of time Ty1-Tz1 from the movement start time Tz1 in the Z-axis direction to the movement start time Ty1 in the Y-axis direction.

The movement end time difference ΔT2 is the time difference between the movement end point Tz2 in the Z-axis direction and the movement end point Ty2 in the Y-axis direction when the suction collet 33 ends its movement at the target position P2. As shown in FIG. 2, in this embodiment, in which the movement ends last in the Z-axis direction, the movement end time difference ΔT2 is expressed as the length of time Tz2-Ty2 from the movement end point Ty2 in the Y-axis direction to the movement end point Tz2 in the Z-axis direction.

The calculation unit 92 calculates the movement start time difference ΔT1 and the movement end time difference ΔT2 so that the ratio of the movement start time difference ΔT1 and the movement end time difference ΔT2 to the reference time difference corresponds to the ratio of the total movement time T to the reference total movement time. That is, if the total movement time T is short relative to the reference total movement time, the movement start time difference ΔT1 and the movement end time difference ΔT2 are shortened relative to the reference time difference. Also, if the total movement time T is long relative to the reference total movement time, the movement start time difference ΔT1 and the movement end time difference ΔT2 are lengthened relative to the reference time difference. In particular, it is desirable that the movement start time difference ΔT1 and the movement end time difference ΔT2 are calculated to have a proportional relationship to the total movement time T.

The movement start time difference ΔT1 and the movement end time difference ΔT2 calculated by the calculation unit 92 are stored in the memory unit 91 as part of the control parameters.

The command generation unit 93 generates a position command in the Z-axis direction of the suction collet 33 using the first time variable type polynomial and control parameters stored in the memory unit 91. The command generation unit 93 generates a position command in the Y-axis direction of the suction collet 33 using the second time variable type polynomial and control parameters stored in the memory unit 91.

The control unit 94 controls the bonding head 30, the imaging unit 40, and the driving unit 50.

The control unit 94 controls the suction collet 33 of the bonding head 30 to cause the suction collet 33 to pick up or release the die 12. Specifically, when the bonding head 30 arrives at the initial position P1, the control unit 94 starts suction of the suction collet 33 and causes the die 12 to be adsorbed to the suction collet 33. When the bonding head 30 arrives at the target position P2, the control unit 94 stops suction of the suction collet 33 and causes the die 12 to be released from the suction collet 33.

The control unit 94 controls the imaging unit 40 to capture a video or still image of the suction collet 33 when the suction collet 33 passes through or near the focal point on the optical axis of the imaging unit 40. The control unit 94 captures images of the suction collet 33 on both the forward and return paths. The forward path is the path along which the suction collet 33 moves from the initial position P1 to the target position P2, and corresponds to a predetermined trajectory of the suction collet 33. The return path is the path along which the suction collet 33 moves from the target position P2 onto the next die 12.

The control unit 94 controls the X-axis actuator 51 to move the suction collet 33 in the X-axis direction. The control unit 94 controls the Y-axis actuator 52 to move the suction collet 33 in the Y-axis direction. The control unit 94 controls the Z-axis actuator 53 to move the suction collet 33 in the Z-axis direction. Specifically, the control unit 94 controls the Z-axis actuator 55 based on the Z-axis direction position command generated by the command generation unit 93 using the first time variable type polynomial to move the suction collet 33 in the Z-axis direction. The control unit 94 also controls the Y-axis actuator 52 based on the Y-axis direction position command generated by the command generation unit 93 using the second time variable type polynomial to move the suction collet 33 in the Y-axis direction.

The image analysis unit 95 analyzes the images captured by the imaging unit 40. The image analysis unit 95 analyzes the images of the suction collet 33 on both the outward and return paths.

When analyzing the image of the adsorption collet 33 on the outward path, the image analysis unit 95 evaluates the state of holding the die 12 by the adsorption collet 33. The image analysis unit 95 evaluates whether or not the die 12 is held by the adsorption collet 33 on the outward path. If the image analysis unit 95 evaluates that the die 12 is not held by the adsorption collet 33 on the outward path, it determines that the adsorption collet 33 failed to pick up the die 12 at the initial position P1. In this case, the control unit 94 moves the adsorption collet 33 to the initial position P1 and causes the adsorption collet 33 to pick up the die 12. If the image analysis unit 95 evaluates that the die 12 is held by the adsorption collet 33 on the outward path, it evaluates the presence or absence and the degree of deviation of the die 12 from the normal holding position of the adsorption collet 33. Depending on the degree of deviation of the die 12 from the normal holding position of the adsorption collet 33, the command generation unit 93 corrects the position command of the adsorption collet 33.

When analyzing the image of the return suction collet 33, the image analysis unit 95 evaluates whether or not the die 12 is being held. If the image analysis unit 95 evaluates that the return suction collet 33 is holding the die 12, it determines that the suction collet 33 failed to release the die 12 at the target position P2. In this case, the control unit 94 moves the suction collet 33 to the target position P2 and causes the suction collet 33 to release the die 12 again. Alternatively, the control unit 94 stops the operation of the bonding device 1 and notifies the operator to prompt the operator to discard the die. If the image analysis unit 95 evaluates that the return suction collet 33 is not holding the die 12, the control unit 94 moves the suction collet 33 above the pickup unit 10 to have the suction collet 33 pick up the next die 12.

In this embodiment, both the movement start time difference and the movement end time difference are set, but only the movement start time difference may be set, or only the movement end time difference may be set. In addition, the movement start time difference and the movement end time difference are not limited to being calculated by the calculation unit, and may be input from the outside like other control parameters.

<Bonding method>
Next, a bonding method using the bonding apparatus 1 according to an embodiment of the present invention will be described with reference to Fig. 3. Fig. 3 is a flowchart showing the bonding method according to an embodiment.

First, the first time variable type polynomial and the second time variable type polynomial are stored (S11), and the reference total travel time and the reference time difference are stored (S12). The first time variable type polynomial, the second time variable type polynomial, the reference total travel time, and the reference time difference are input by an input unit (not shown) and stored in the storage unit 91. The input data such as the first time variable type polynomial, the second time variable type polynomial, the reference total travel time, and the reference time difference are input according to the bonding conditions, for example, after the bonding conditions such as the types of the die 12 and the lead frame 21 are determined. However, multiple input data corresponding to multiple bonding conditions may be input before the bonding conditions are determined, and the input data may be appropriately selected from the multiple stored input data after the bonding conditions are determined.

Next, the total travel time T is stored (S13). The total travel time T is input by an input unit (not shown) and stored in the memory unit 91. For example, when changing from the first total travel time to the second total travel time, the second total travel time is input. However, the second total travel time may be appropriately selected from a plurality of total travel times input before operating the bonding apparatus 1 with the first total travel time. Note that if the total travel time T is the same as the reference total travel time, input and storage of the total travel time T may be omitted.

Next, the movement start time difference ΔT1 and the movement end time difference ΔT2 are calculated (S14). The movement start time difference ΔT1 and the movement end time difference ΔT2 are calculated by the calculation unit 92 based on the total movement time T. For example, the movement start time difference ΔT1 is calculated so that the ratio of the movement start time difference ΔT1 to the reference movement start time difference is equal to the ratio of the total movement time T to the reference total movement time. Similarly, the movement end time difference ΔT2 is calculated so that the ratio of the movement end time difference ΔT2 to the reference movement end time difference is equal to the ratio of the total movement time T to the reference total movement time. In other words, the movement start time difference ΔT1 and the movement end time difference ΔT2 are proportional to the total movement time T. The calculated movement start time difference ΔT1 and movement end time difference ΔT2 are sent to the storage unit 91 and stored.

Note that, if the ratio of the movement start time difference ΔT1 to the reference movement start time difference is set according to the ratio of the total movement time T to the reference total movement time, the relationship between the movement start time difference ΔT1 and the total movement time T is not limited to a proportional relationship. However, in order to suppress fluctuations in the trajectory of the suction collet 33 caused by the total movement time and the movement start time difference, when the total movement time T is smaller than the reference total movement time, it is desirable to set the movement start time difference ΔT1 to be smaller than the reference movement start time difference. Conversely, when the total movement time T is larger than the reference total movement time, it is desirable to set the movement start time difference ΔT1 to be larger than the reference movement start time difference. The same applies to the movement end time difference ΔT2.

Next, a position command is generated (S15), and the suction collet 33 is moved (S16). The command generation unit 93 generates a Z-axis position command and a Y-axis position command based on the first time variable type polynomial, the second time variable type polynomial, the total movement time T, the movement start time difference ΔT1, and the movement end time difference ΔT2 stored in the memory unit 91. The control unit 94 controls the Z-axis actuator 53 of the drive unit 50 based on the Z-axis position command generated by the command generation unit 93, and moves the suction collet 33 in the Z-axis direction. The control unit 94 controls the Y-axis actuator 52 of the drive unit 50 based on the Y-axis position command generated by the command generation unit 93, and moves the suction collet 33 in the Y-axis direction.

As described above, in the bonding device 1, the ratio of the movement start time difference ΔT1 and the movement end time difference ΔT2 to the reference time difference is set according to the ratio of the total movement time to the reference total movement time.

According to this aspect, the movement start time difference ΔT1 and the movement end time difference ΔT2, which are factors that determine the trajectory of the suction collet 33 when a position command is generated in response to a change in the total movement time T, can be set in response to the total movement time T, thereby making it possible to suitably adjust the trajectory of the suction collet 33. For example, the trajectory of the suction collet 33 when the total movement time T is shortened or extended from the reference total movement time can be approximated to the trajectory of the suction collet 33 when moved based on the reference total movement time. Therefore, it is possible to avoid collisions between the suction collet 33 and other components of the bonding device 1 caused by fluctuations in the trajectory of the suction collet 33 when the total movement time T is changed.

In addition, when evaluating the state of holding the die 12 by the suction collet 33 based on the captured image captured by the imaging unit 40, it is possible to suppress evaluation failures caused by fluctuations in the trajectory of the suction collet 33. Specifically, it is possible to suppress the passing position of the suction collet 33 on the optical axis of the imaging unit 40 from moving away from the focal point of the imaging unit 40 due to fluctuations in the trajectory of the suction collet 33. This makes it possible to avoid a situation in which the captured image becomes unclear and sufficient image analysis cannot be performed, and suppresses evaluation failures of the state of holding the die 12 by the suction collet 33.

In one embodiment, the movement start time difference ΔT1 and the movement end time difference ΔT2 are proportional to the total movement time T.

This makes it possible to make the trajectory of the suction collet 33 when the total movement time T is changed more approximate to the trajectory of the suction collet 33 when moved based on the reference total movement time.

In one embodiment, the control unit 94 controls the Z-axis actuator 53 based on a position command in the Z-axis direction generated by the first time variable type polynomial, and controls the Y-axis actuator 52 based on a position command in the Y-axis direction generated by the second time variable type polynomial. The first time variable type polynomial and the first time variable type polynomial are independent of each other, and the maximum degree of the first time variable type polynomial is greater than the maximum degree of the second time variable type polynomial.

This allows smooth movement of the suction collet 33 in the Z-axis direction, which is more complicated than the Y-axis direction.

The start time Tz1 of the suction collet 33's movement in the Z-axis direction is set earlier than the start time Ty1 of the suction collet's movement in the Y-axis direction, and the end time Tz2 of the suction collet 33's movement in the Z-axis direction is set later than the end time Ty2 of the suction collet's movement in the Y-axis direction.

According to this aspect, when picking up the die 12, the suction collet 33 starts moving in the Z direction before it starts moving in the Y direction, and when bonding, the suction collet 33 finishes moving in the Y direction before it finishes moving in the Z direction. Therefore, when picking up or bonding the die 12 with the suction collet 33, damage to the die 12 due to collision with other dies 12 or the lead frame 21 can be avoided. In this way, even when the suction collet 33 is moved along a trajectory that sets a time difference between both the start and end of movement, according to this embodiment, the trajectory of the suction collet 33 can be suitably adjusted.

The following describes some or all of the embodiments of the present invention. Note that the present invention is not limited to the following descriptions.

[Appendix 1]
a control unit that controls the driving unit based on a position command generated by a time-variable polynomial; and a memory unit that stores control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, wherein the control parameters include a total movement time required for the bonding tool to move from the initial position to the target position, a reference total movement time that serves as a reference for the total movement time, at least one of a movement start time difference between a movement start time in the first direction and a movement start time in the second direction of the bonding tool, and a movement end time difference between a movement end time in the first direction and a movement end time in the second direction of the bonding tool, and a reference time difference that serves as a reference for at least one of the time differences, wherein a ratio of at least one of the time differences to the reference time difference is set according to the ratio of the total movement time to the reference total movement time.

According to this aspect, the trajectory of the bonding tool can be suitably adjusted by setting at least one of the time differences, which is one of the factors that determine the trajectory of the bonding tool, according to the total movement time. For example, the trajectory of the bonding tool when the total movement time is shortened or extended from the reference total movement time can be approximated to the trajectory of the bonding tool when moved based on the reference total movement time. Therefore, when the total movement time is changed, it is possible to avoid collisions between the bonding tool and other components of the bonding device caused by fluctuations in the trajectory of the bonding tool. Furthermore, when the holding state of an electronic component by the bonding tool is evaluated during transportation, it is possible to suppress evaluation failures caused by fluctuations in the trajectory of the bonding tool.

[Appendix 2]
A bonding apparatus as described in [Supplementary Note 1], wherein at least one of the time differences is set to have a proportional relationship to the total movement time.

According to this aspect, the trajectory of the bonding tool when the total movement time is changed can be made to more closely resemble the trajectory of the bonding tool when moved based on the reference total movement time.

[Appendix 3]
The bonding apparatus according to claim 1 or 2, wherein the control unit controls the drive unit based on a position command in a first direction generated by a first time-variable polynomial, and controls the drive unit based on a position command in a second direction generated by a second time-variable polynomial independent of the first time-variable polynomial.

[Appendix 4]
4. The bonding apparatus according to claim 3, wherein a maximum degree of the first time-variable polynomial is greater than a maximum degree of the second time-variable polynomial.

According to this aspect, the movement of the bonding tool in the first direction can be made more complex and smoother than the movement in the second direction.

[Appendix 5]
The bonding apparatus according to claim 3 or 4, wherein the control unit controls the drive unit based on a position command in a first direction generated as a first time-variable polynomial by the following equation:

Z: position in the first direction at _time tZ S _z : coordinates of the final arrival position in the first direction C _z0 , C _z1 , . . . , C _z(n-1) , C _zn : coefficients (n is an integer of 2 or more)
t _z : Elapsed time from the start of movement in the first direction T _z : Movement time from the start to the end of movement in the first direction

[Appendix 6]
A bonding apparatus according to any one of [Appendix 3] to [Appendix 5], wherein the control unit controls the drive unit based on a position command in a second direction generated as a second time-variable polynomial by the following equation:

Y: position in the second direction at time t _Y ; S _y : coordinates of the final arrival position in the second direction; C _y0 , C _y1 , . . . , C _y(m−1) , C _ym : coefficients (m is an integer of 2 or more);
t _y : Elapsed time from the start of movement in the second direction T _y : Movement time from the start of movement in the second direction to the end of movement

[Appendix 7]
A bonding apparatus described in any one of [Appendix 1] to [Appendix 6], wherein the start point of the bonding tool movement in a first direction is set earlier than the start point of the bonding tool movement in a second direction, and the end point of the bonding tool movement in the first direction is set later than the end point of the bonding tool movement in the second direction.

[Appendix 8]
A bonding apparatus according to any one of [Appendix 1] to [Appendix 7], wherein the first direction is a vertical direction and the second direction is a horizontal direction.

According to this aspect, when picking up an electronic component, the bonding tool starts moving in the vertical direction before it moves in the horizontal direction, and when bonding, the bonding tool stops moving in the horizontal direction before it moves in the vertical direction. Therefore, when picking up or bonding an electronic component with the bonding tool, damage to the electronic component due to collision with other electronic components or objects can be avoided. In this way, even when the bonding tool is moved along a trajectory that sets a time difference between both the start and end of the movement, the trajectory of the bonding tool can be suitably adjusted.

[Appendix 9]
A bonding apparatus described in any one of [Appendix 1] to [Appendix 8], wherein the driving unit moves the bonding tool in a third direction that intersects both the first and second directions in addition to the first and second directions, and the reference time difference is a reference for at least one of at least one movement start time difference between the start points of movement of the bonding tool in each of the first, second and third directions, and at least one movement end time difference between the end points of movement of the bonding tool in each of the first, second and third directions.

According to this aspect, the trajectory of the bonding tool can be appropriately adjusted even when the bonding tool is moved in three directions.

[Appendix 10]
A bonding method using a bonding apparatus for bonding an electronic component to an object, the bonding apparatus comprising: a bonding tool for picking up an electronic component at an initial position and bonding the electronic component at a target position on the object; a driving unit for moving the bonding tool in at least a first direction and a second direction intersecting the first direction; a control unit for controlling the driving unit based on a position command generated by a time-variable polynomial; and a storage unit for storing control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, the control parameters being a total movement required for moving the bonding tool from the initial position to the target position. the bonding tool includes a time, a reference total movement time serving as a reference for the total movement time, at least one of a movement start time difference between a movement start time in a first direction and a movement start time in a second direction of the bonding tool and a movement end time difference between an end time of the movement of the bonding tool in the first direction and an end time of the movement of the bonding tool in the second direction, and a reference time difference serving as a reference for at least one of the time differences, the bonding method including: setting a ratio of at least one of the time differences to the reference time difference in accordance with the ratio of the total movement time to the reference total movement time; and moving the bonding tool from an initial position to a target position based on the at least one of the time differences.

[Appendix 11]
A bonding program for operating a bonding apparatus for bonding an electronic component to an object, the bonding apparatus comprising: a bonding tool for picking up an electronic component at an initial position and bonding the electronic component at a target position on the object; a driving unit for moving the bonding tool in at least a first direction and a second direction intersecting the first direction; a control unit for controlling the driving unit based on a position command generated by a time-variable polynomial; and a storage unit for storing control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory, the control parameters being a total movement required for moving the bonding tool from the initial position to the target position. a reference total movement time serving as a reference for the total movement time, at least one of a movement start time difference between a movement start point in a first direction and a movement start point in a second direction of the bonding tool and a movement end time difference between an end point in the first direction and an end point in the second direction of the bonding tool, and a reference time difference serving as a reference for at least one of the time differences, and the bonding program causes a computer to set a ratio of at least one of the time differences to the reference time difference in accordance with the ratio of the total movement time to the reference total movement time, and to move the bonding tool from an initial position to a target position based on the at least one of the time differences.

As described above, according to one aspect of the present invention, it is possible to provide a bonding device, a bonding method, and a bonding program that can appropriately adjust the trajectory of the bonding tool.

The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those exemplified, and may be modified as appropriate. In addition, configurations shown in different embodiments may be partially substituted or combined.

LIST OF SYMBOLS 1 Bonding device 10 Pickup unit 11 Wafer 12 Die 20 Bonding stage 21 Lead frame 30 Bonding head 33 Vacuum collet 40 Imaging unit 50 Drive unit 51 X-axis actuator 52 Y-axis actuator 53 Z-axis actuator 90 Control device 91 Memory unit 92 Calculation unit 93 Command generation unit 94 Control unit 95 Image analysis unit ΔT1 Movement start time difference ΔT2 Movement end time difference T Total movement time Tz1, Ty1 Movement start time Tz2, Ty2 Movement end time

Claims (10)

A bonding apparatus for bonding an electronic component to an object, comprising:
a bonding tool that picks up the electronic component at an initial position and bonds it at a target position on the object;
a driving unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction;
A control unit that controls the drive unit based on a position command generated by a time-variable polynomial;
a storage unit configured to store control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory;
The control parameters are:
a total movement time required for the bonding tool to move from the initial position to the target position;
A reference total travel time serving as a reference for the total travel time;
at least one of a movement start time difference between a movement start time point of the bonding tool in the first direction and a movement start time point of the bonding tool in the second direction, and a movement end time difference between a movement end time point of the bonding tool in the first direction and a movement end time point of the bonding tool in the second direction;
a reference time difference that is a reference for the at least one of the time differences,
a ratio of the at least one time difference to the reference time difference is set according to a ratio of the total travel time to the reference total travel time ;
The at least one time difference is set to have a proportional relationship with the total travel time.
Bonding equipment. The control unit is
controlling the actuator based on a position command in the first direction generated by a first time-variant polynomial;
controlling the drive unit based on a position command in the second direction generated by a second time-variant polynomial independent of the first time-variant polynomial;
2. The bonding apparatus according to claim 1. the maximum degree of the first time-variant polynomial is greater than the maximum degree of the second time-variant polynomial;
3. The bonding apparatus according to claim 2 . The control unit controls the drive unit based on a position command in the first direction, the position command being generated as the first time-variable polynomial by the following equation:
3. The bonding apparatus according to claim 2 .

Z: position in the first direction at time _{tZ Sz :} coordinates of the final arrival position in the first direction _Cz0 , _Cz1 , ..., _Cz(n-1) , _Czn : coefficients (n is an integer of 2 or more)
t _z : Elapsed time from the start of movement in the first direction T _z : Movement time from the start of movement in the first direction to the end of movement The control unit controls the drive unit based on a position command in the second direction generated by the following equation as the second time variable type polynomial:
3. The bonding apparatus according to claim 2 .

Y: position in the second direction at time _tY ; S _y : coordinates of the final arrival position in the second direction; C _y0 , C _y1 , . . . , C _y(m-1) , C _ym : coefficients (m is an integer of 2 or more);
t _y : Elapsed time from the start point of movement in the second direction T _y : Movement time from the start point to the end point of movement in the second direction a movement start time of the bonding tool in the first direction is set earlier than a movement start time of the bonding tool in the second direction;
The end point of movement of the bonding tool in the first direction is set to be later than the end point of movement of the bonding tool in the second direction.
The bonding apparatus according to any one of claims 1 to 5 . the first direction is a vertical direction,
The second direction is a horizontal direction.
7. The bonding apparatus according to claim 6 . the driving unit further moves the bonding tool in a third direction intersecting both the first direction and the second direction in addition to the first direction and the second direction;
the reference time difference is a reference for at least one of at least one movement start time difference between movement start points in the first direction, the second direction, and the third direction of the bonding tool, and at least one movement end time difference between movement end points in the first direction, the second direction, and the third direction of the bonding tool;
2. The bonding apparatus according to claim 1. A bonding method using a bonding apparatus for bonding an electronic component to an object, comprising the steps of:
The bonding apparatus includes:
a bonding tool that picks up the electronic component at an initial position and bonds it at a target position on the object;
a driving unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction;
A control unit that controls the drive unit based on a position command generated by a time-variable polynomial;
a storage unit configured to store control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory;
The control parameters are:
a total movement time required for the bonding tool to move from the initial position to the target position;
A reference total travel time serving as a reference for the total travel time;
at least one of a movement start time difference between a movement start time point of the bonding tool in the first direction and a movement start time point of the bonding tool in the second direction, and a movement end time difference between a movement end time point of the bonding tool in the first direction and a movement end time point of the bonding tool in the second direction;
a reference time difference that is a reference for the at least one of the time differences,
The bonding method includes:
setting a ratio of the at least one time difference to the reference time difference in accordance with a ratio of the total travel time to the reference total travel time;
and moving the bonding tool from the initial position to the target position based on the at least one time difference ;
The at least one time difference is set to have a proportional relationship with the total travel time.
Bonding method. A bonding program for operating a bonding device that bonds an electronic component to an object, comprising:
The bonding apparatus includes:
a bonding tool that picks up the electronic component at an initial position and bonds it at a target position on the object;
a driving unit that moves the bonding tool in at least a first direction and a second direction intersecting the first direction;
A control unit that controls the drive unit based on a position command generated by a time-variable polynomial;
a storage unit configured to store control parameters of the control unit for moving the bonding tool from the initial position to the target position along a predetermined trajectory;
The control parameters are:
a total movement time required for the bonding tool to move from the initial position to the target position;
A reference total travel time serving as a reference for the total travel time;
at least one of a movement start time difference between a movement start time point of the bonding tool in the first direction and a movement start time point of the bonding tool in the second direction, and a movement end time difference between a movement end time point of the bonding tool in the first direction and a movement end time point of the bonding tool in the second direction;
a reference time difference that is a reference for the at least one of the time differences,
On the computer,
setting a ratio of the at least one time difference to the reference time difference in accordance with a ratio of the total travel time to the reference total travel time;
moving the bonding tool from the initial position to the target position based on the at least one time difference ;
The at least one time difference is set to have a proportional relationship with the total travel time.
Bonding program.

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