JP7557820B2 - Component mounting system, inspection device, substrate manufacturing method and inspection method - Google Patents

Description

The present invention relates to a component mounting system, an inspection device, a circuit board manufacturing method, and an inspection method, which are equipped with a component mounting device that picks up components using a mounting head and mounts them on a circuit board, and an inspection device that inspects the components mounted on the circuit board by the component mounting device.

Conventionally, a component mounting system is known that includes a component mounting device that picks up components using a mounting head and mounts them on a board, and an inspection device that inspects the components mounted on the board by the component mounting device. In the component mounting system, the component mounting device mounts components at a target mounting position set on the board, and the inspection device obtains the amount of component positional deviation from the inspection reference position by comparing the position of the component mounted on the board with an inspection reference position set for the board, and judges whether the mounting state is good or bad based on the amount of component positional deviation from the inspection reference position obtained. Since the inspection reference position is usually set to coincide with the target mounting position set on the board, the amount of positional deviation calculated by the inspection device (the amount of component positional deviation from the inspection reference position) is fed back to the component mounting device and used to correct the operating parameters of the mounting head, making it possible to perform component mounting work with high accuracy (for example, see Patent Document 1 below).

However, in a component mounting system such as the one described above, it is possible that the positions of components mounted on the board by the component mounting device may shift in a particular direction over time (as board production is repeated). In such cases, the inspection device will frequently determine mounting defects, reducing productivity. For this reason, conventional inspection devices often have a function that allows them to change the inspection reference position, which is initially set to match the target mounting position, to match the position of the component actually mounted on the board.

JP 2019-134051 A

However, when the inspection reference position is changed as described above, the inspection reference position no longer coincides with the target mounting position. Therefore, if the component position deviation amount calculated by the inspection device is directly fed back to the component mounting device, the correction of the operating parameters when mounting the components will be inaccurate, which may result in a decrease in component mounting accuracy.

The present invention aims to provide a component mounting system, inspection device, board manufacturing method, and inspection method that can improve component mounting accuracy.

A component mounting system according to the present invention is a component mounting system including a component mounting device that uses a mounting head to pick up a component and mount it at a target mounting position set on a board, and an inspection device that inspects the component mounted on the board by the component mounting device, wherein the inspection device includes an inspection reference position changing unit that sets an inspection reference position for the board that is different from the target mounting position, a first positional deviation amount calculation unit that calculates a first positional deviation amount, which is the positional deviation amount of the component from the inspection reference position, by comparing a position of the component mounted on the board with the inspection reference position set by the inspection reference position changing unit, a second positional deviation amount calculation unit that calculates a second positional deviation amount, which is the positional deviation amount of the component from the target mounting position, by comparing the position of the component mounted on the board with a target mounting position of the component on the board, and an output unit that outputs the second positional deviation amount calculated by the second positional deviation amount calculation unit, and the component mounting device calculates a correction value based on the second positional deviation amount output from the output unit, and corrects an operating parameter of the mounting head using the calculated correction value.

The inspection apparatus of the present invention is an inspection apparatus that inspects a component mounted at a target mounting position set on a board, and includes an inspection reference position changing unit that sets an inspection reference position for the board that is different from the target mounting position, a first positional deviation amount calculation unit that calculates a first positional deviation amount, which is the positional deviation amount of the component from the inspection reference position, by comparing the position of the component mounted on the board with the inspection reference position set by the inspection reference position changing unit, a second positional deviation amount calculation unit that calculates a second positional deviation amount, which is the positional deviation amount of the component from the target mounting position, by comparing the position of the component mounted on the board with the target mounting position of the component on the board, and an output unit that outputs the second positional deviation amount calculated by the second positional deviation amount calculation unit.

a first positional deviation amount calculation step of calculating a first positional deviation amount, which is a positional deviation amount of the component from the inspection reference position, by comparing a position of the component mounted on the board with the inspection reference position set in the inspection reference position changing step; a second positional deviation amount calculation step of calculating a second positional deviation amount, which is a positional deviation amount of the component from the target mounting position, by comparing a position of the component mounted on the board with a target mounting position of the component on the board; an output step of outputting the second positional deviation amount calculated in the second positional deviation amount calculation step; and a correction step of calculating a correction value based on the second positional deviation amount output in the output step, and correcting an operating parameter of the mounting head in the component mounting step using the calculated correction value.

The inspection method of the present invention is an inspection method for inspecting a component mounted at a target mounting position set on a board, and includes an inspection reference position changing step of setting an inspection reference position different from the target mounting position for the board, a first positional deviation amount calculation step of calculating a first positional deviation amount, which is the positional deviation amount of the component from the inspection reference position, by comparing the position of the component mounted on the board with the inspection reference position set in the inspection reference position changing step, a second positional deviation amount calculation step of calculating a second positional deviation amount, which is the positional deviation amount of the component from the target mounting position, by comparing the position of the component mounted on the board with a target mounting position of the component on the board, and an output step of outputting the second positional deviation amount calculated by the second positional deviation amount calculation unit.

The present invention makes it possible to improve the accuracy of component mounting.

FIG. 1 is a configuration diagram of a component mounting system according to an embodiment of the present invention. FIG. 1 is a perspective view of a component mounting device constituting a component mounting device system according to an embodiment of the present invention; FIG. 2 is a plan view of a board showing a target mounting position provided in a component mounting device according to an embodiment of the present invention; FIG. 2 is a block diagram showing a control system of the component mounting device according to the embodiment of the present invention. 1A to 1E are diagrams showing an example of a component center detection method used in a component mounting system according to an embodiment of the present invention; FIG. 1 is a perspective view of an inspection device constituting a component mounting system according to an embodiment of the present invention. FIG. 2 is a block diagram showing a control system of an inspection apparatus according to an embodiment of the present invention. FIG. 1 is a diagram showing a relationship between an inspection reference position and a target mounting position according to an embodiment of the present invention; 1A and 1B are diagrams showing a procedure for changing the inspection reference position by an inspection reference position changing unit of an inspection device according to an embodiment of the present invention. FIG. 1 is a diagram showing a positional relationship between an inspection reference position and a mounting component position, and a positional relationship between a target mounting position and a mounting component position in an embodiment of the present invention. FIG. 2 is a block diagram showing a control system of a management device according to an embodiment of the present invention. A flowchart showing the flow of an inspection operation performed by an inspection device according to an embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, a component mounting system 1 includes a component mounting device 11, an inspection device 12, and a management device 13.

The component mounting device 11 performs component mounting work by receiving and positioning the board KB from an upstream device (e.g. a solder printing device), mounting the components BH on the positioned board KB, and transporting it to the downstream inspection device 12. The inspection device 12 performs inspection work by receiving and positioning the board KB from the upstream component mounting device 11, inspecting the mounting state of the components BH mounted on the positioned board KB, and transporting it to the downstream device. The management device 13 is connected to the component mounting device 11 and the inspection device 12 so that it can communicate with them, and obtains information from the component mounting device 11 and the inspection device 12 to manage the operation of each device. Each device is described in detail below.

First, the component mounting device 11 will be described. In Fig. 1 and Fig. 2, the component mounting device 11 is equipped with a board transport path 21, a component supply unit 22, a mounting head 23, a head movement mechanism 24, a component recognition camera 25, a mounting device display input unit 26, and a mounting device control unit 27. The board transport path 21 carries in, positions, and carries out the board KB. The component supply unit 22 is, for example, a tape feeder, and supplies the component BH to a predetermined position.

In FIG. 2, the head movement mechanism 24 is composed of an XY beam mechanism equipped with a fixed beam 24a and a moving beam 24b that is movable relative to the fixed beam 24a, and moves the mounting head 23 in a horizontal plane. The mounting head 23 is equipped with a nozzle 23N equipped with a suction port for the component BH at its lower end, and picks up the component BH supplied by the component supply unit 22 and mounts the picked-up component BH on the board KB.

The component recognition camera 25 has an imaging field of view facing upward, and images the component BH from below as the mounting head 23 with the component BH adsorbed to the nozzle 23N passes above. The image of the component BH captured by the component recognition camera 25 is used to recognize the component BH and to detect the position of the component BH relative to the nozzle 23N (position of the component center). Information on the position of the component BH relative to the nozzle 23N detected here is used when mounting the component BH at the target mounting position MK (Figure 3) on the board KB. The target mounting position MK is defined as coordinates in a coordinate system based on the board KB, as shown in Figure 3.

The mounting device display input unit 26 is composed of, for example, a touch panel. The mounting device display input unit 26 accepts input operations by the worker and notifies the worker of the work to be performed and various information by display, voice, etc.

In FIG. 4, the placement device control unit 27 includes a placement device memory unit 31, a placement processing unit 32, a picked-up component position calculation unit 33, a feedback processing unit 34, and a placement device communication unit 35. The placement device memory unit 31 stores production data 41, and after production starts, position deviation amount data 42 is stored. The production data 41 includes target placement position data 41a, a placement program 41b, component data 41c, and component center detection method data 41d.

The target mounting position data 41a records the target mounting positions MK (Figure 3) set on the board KB. The mounting program 41b is a control program that operates each part of the component mounting device 11 (component supply unit 22, mounting head 23, head movement mechanism 24, component recognition camera 25, etc.) so that the component BH is mounted at each target mounting position MK recorded in the target mounting position data 41a. The component data 41c records the type and mounting direction of the component BH to be mounted at each target mounting position MK.

The part center detection method data 41d records, for example, the methods shown in Fig. 5(a) to (e) as methods for detecting the center (part center) of the part BH required for detecting the position of the part BH. In Fig. 5(a), the midpoint between the center positions of the two electrodes DK of the chip-shaped part BH is the part center. In Fig. 5(b), the center of gravity of the overall outline of the chip-shaped part BH is the part center. In Fig. 5(c), the center of gravity of the body BD of the chip-shaped part BH is the part center. In Fig. 5(d), the center of gravity of the entire set of leads RD calculated from the coordinates of each of the leads RD with specific numbers of the part BH having multiple leads RD is the part center. In Fig. 5(e), the center of gravity of the body BD of the part BH having multiple leads RD is the part center.

The positional deviation data 42 is data of the results detected by the inspection device 12, and is data on the amount of positional deviation from a reference position (the inspection reference position described below) of each component BH mounted on the board KB. The positional deviation data 42 is calculated by the inspection device 12 and sent via the management device 13, as described below.

The mounting processing unit 32 operates each section of the component mounting device 11 (board transport path 21, component supply unit 22, mounting head 23, head movement mechanism 24, component recognition camera 25, etc.) based on the mounting program 41b stored in the mounting device memory unit 31. As a result, the board transport path 21 carries in and positions the board KB, the component supply unit 22 supplies the components BH, and the head movement mechanism 24 and mounting head 23 operate in conjunction to repeatedly perform mounting turns.

In one mounting turn, the mounting head 23 performs the following operations in this order: picking up a component BH (pickup operation), passing above the component recognition camera 25 (camera overpass operation), and mounting the component BH (mounting operation). In the pick-up operation, the mounting head 23 moves above the component supply unit 22 and adsorbs the component BH supplied by the component supply unit 22 to the nozzle 23N. In the camera overpass operation, the mounting head 23 passes above the component recognition camera 25 and causes the component recognition camera 25 to capture an image of the component BH adsorbed to the nozzle 23N. In this camera overpass operation, an image of the component BH adsorbed to the mounting head 23 is acquired, and the component BH is recognized. In the mounting operation, the mounting head 23 moves above the board KB and mounts the component BH at the target mounting position MK on the board KB based on the recognition result of the component BH.

The picked-up component position calculation unit 33 calculates the position of the component center relative to the nozzle 23N based on the image of the component BH acquired when the camera passes above the mounting turn. A detection method selected from the multiple component center detection methods described above is used to calculate the position of the component center relative to the nozzle 23N. In this way, the component recognition camera 25 and the picked-up component position calculation unit 33 form a picked-up component position detection unit 43 (Figure 4) that detects the position of the component center (picked-up component position) relative to the nozzle 23N of the component BH picked up by the mounting head 23.

The feedback processing unit 34 includes a correction unit 44 and an information compilation unit 45. The feedback processing unit 34 performs feedback processing based on the above-mentioned positional deviation amount data 42 output from the inspection device 12 and stored in the mounting device memory unit 31. The main content of the feedback processing is the correction of the operating parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the board KB. The operating parameters here refer to control data for operating the mounting head 23 so that the component BH is mounted at the target mounting position MK on the board KB. The feedback processing unit 34 will be explained after the explanation of the inspection device 12 and the management device 13.

The mounting device communication unit 35 is communicatively connected to both the management device 13 and the inspection device 12 (FIG. 4). The mounting device communication unit 35 receives information such as the aforementioned positional deviation data 42 detected by the inspection device 12 via the management device 13.

Next, the inspection device 12 will be described. In Figs. 1 and 6, the inspection device 12 includes a board transport unit 51, a camera movement mechanism 52, an inspection camera 53, an inspection device display input unit 54, and an inspection device control unit 55. The board transport unit 51 loads, positions, and unloads the board KB. The camera movement mechanism 52 is made up of an XY beam mechanism including a fixed side beam 52a and a movable side beam 52b that is movable relative to the fixed side beam 52a, and moves the inspection camera 53 in a horizontal plane. The inspection camera 53 has an imaging field facing downward, and images from above a specified area on the board KB (the area where the component BH is mounted) that has been positioned by the board transport unit 51.

The inspection device display input unit 54 is composed of, for example, a touch panel. The inspection device display input unit 54 accepts input operations by the worker and notifies the worker of the work that the worker should perform and various information by screen, voice, etc.

As shown in FIG. 7, the inspection device control unit 55 includes an inspection device memory unit 61, an attached component position calculation unit 62, an inspection reference position change unit 63, a first position deviation amount calculation unit 65, a second position deviation amount calculation unit 66, a quality determination unit 67, and an inspection device communication unit 68. The inspection device memory unit 61 stores inspection data 71, target mounting position data 72, and inspection reference position data 73. The inspection data 71 includes an inspection program 71a, inspection component data 71b, and component center detection method data 71c.

The inspection program 71a is a control program that operates each part of the inspection device 12 (such as the board transport unit 51, the camera movement mechanism 52, and the inspection camera 53). Each part of the inspection device 12 operates according to the inspection program 71a to determine whether the mounting state of each component BH mounted on the board KB by the component mounting device 11 is good or bad.

The inspection component data 71b is data on the component BH to be inspected. The inspection component data 71b contains data including the contents of the component data 41c stored in the mounting device memory unit 31.

The component center detection method data 71c contains data on the component center detection method used to detect the center (component center) of the component BH mounted on the board KB. The component center detection method recorded in this component center detection method data 71c is the same as the component center detection method (Figures 5(a) to (e)) used by the picked-up component position detection unit 43 of the component mounting device 11 when detecting the picked-up component position.

The target mounting position data 72 is data on the target mounting position MK set on the circuit board KB. When the inspection device 12 can obtain the target mounting position data 41a from the component mounting device 11, the obtained target mounting position data 41a can be used as the target mounting position data 72 as is.

In contrast, if the inspection device 12 cannot obtain the target mounting position data 41a from the component mounting device 11, the inspection device 12 uses the inspection camera 53 to capture an image of the dummy board KB on which the components BH have been mounted by the component mounting device 11, and creates the target mounting position data 72 by detecting the position corresponding to the target mounting position MK. The former method is often adopted when the component mounting device 11 and the inspection device 12 are manufactured by the same manufacturer, and the latter method is often adopted when the component mounting device 11 and the inspection device 12 are manufactured by different manufacturers.

The inspection reference position data 73 is data on the inspection reference position KK (Figure 8), which is the reference position for inspecting the component BH mounted on the board KB. The inspection reference position KK initially coincides with the target mounting position MK, but as described below, the inspection reference position KK can be changed via the inspection reference position change unit 63, and when the inspection reference position KK is changed, it becomes a position (coordinate) different from the target mounting position MK. Figure 8 shows the state in which the inspection reference position KK has been changed from its initial position.

The mounted component position calculation unit 62 calculates the mounted component position Z (Figure 9(a)), which is the position (position of the component center) on the board KB of the component BH mounted on the board KB, from the image (inspection image) acquired by the inspection camera 53 based on the component center detection method data 71c stored in the inspection device memory unit 61. The component center detection method used to detect the mounted component position Z is determined for each component BH.

In this way, the inspection camera 53 and the mounted component position calculation unit 62 of the inspection device control unit 55 form a mounted component position detection unit 69 (Fig. 7) that detects the position on the board KB of the component BH mounted on the board KB as the mounted component position Z. Here, when the component BH being detected has a lead RD, the mounted component position detection unit 69 detects the component center of the component BH based on the lead measurement standard (such as the coordinates of the lead RD) for measuring the lead RD of the component BH (see Fig. 5(d) above).

The inspection reference position change unit 63 is a functional unit that changes the inspection reference position KK. In the component mounting system 1, before starting board production, components BH are mounted on a dummy board KB prepared to obtain (set) the inspection reference position KK, and the position (position of the component center) of each component BH mounted on the dummy board KB on the dummy board KB is detected by the mounted component position detection unit 69. As described above, the inspection reference position KK is initially the same as the target mounting position MK, but the inspection reference position change unit 63 can set (change) the detected position of the component BH on the board KB (mounted component position Z) as a new inspection reference position KK instead of the target mounting position MK (Figure 9 (a) → Figure 9 (b)). Such an operation to change the inspection reference position KK can be performed from the inspection device display input unit 54.

When the inspection reference position KK is changed (newly set), the data of the changed inspection reference position KK is stored in the inspection device storage unit 61 as inspection reference position data 73. The inspection reference position KK can be changed multiple times.

The first positional deviation calculation unit 65 calculates the first positional deviation ΔZ1, which is the positional deviation of the component BH from the inspection reference position KK, by comparing the position of the component BH mounted on the board KB with the inspection reference position KK set for the board KB. Specifically, the first positional deviation ΔZ1 (ΔX1, ΔY1) is calculated by finding the difference between the mounted component position Z detected by the mounted component position detection unit 69 and the X coordinate and the Y coordinate of the inspection reference position KK for the component BH read from the inspection reference position data 73 (Figure 10).

The second positional deviation calculation unit 66 calculates the second positional deviation ΔZ2 (ΔX2, ΔY2), which is the positional deviation of the component BH from the target mounting position MK. Specifically, the second positional deviation ΔZ2 (ΔX2, ΔY2) is calculated by finding the difference between the position of the component BH mounted on the board KB (the mounting component position Z detected by the mounting component position detection unit 69) and the X coordinate and the Y coordinate of the target mounting position MK read from the target mounting position data 72 (FIG. 10). Note that when the inspection reference position KK is changed, the second positional deviation calculation unit 66 calculates the second positional deviation ΔZ2 (ΔX2, ΔY2) each time the inspection reference position KK is changed.

The quality determination unit 67 performs quality determination of the mounting state of each component BH mounted on the board KB based on the first positional deviation amount ΔZ1 (ΔX1, ΔY1) calculated by the first positional deviation amount calculation unit 65. Specifically, the XY components of the first positional deviation amount ΔZ1 (ΔX1, ΔY1) calculated by the first positional deviation amount calculation unit 65 are compared with the XY components of the allowable value set for the component BH, and it is checked whether the first positional deviation amount ΔZ1 (ΔX1, ΔY1) is equal to or smaller than the allowable value. If the first positional deviation amount ΔZ1 (ΔX1, ΔY1) is equal to or smaller than the allowable value, the mounting state of the component BH is determined to be good, and if the first positional deviation amount ΔZ1 (ΔX1, ΔY1) exceeds the allowable value, the mounting state of the component BH is determined to be bad.

For example, if the X component of the tolerance of the first positional deviation amount ΔZ1 (ΔX1, ΔY1) is RX and the Y component is RY, the quality determination unit 67 determines that the mounting state of the component BH is good if ΔX1≦RX and ΔY1≦RY. On the other hand, the quality determination unit 67 determines that the mounting state of the component BH is bad if ΔX1>RX or ΔY1>RY. The tolerance data for each component BH is stored in the inspection device memory unit 61.

The inspection device communication unit 68 is communicatively connected to both the management device 13 and the component mounting device 11 (FIG. 7). The inspection device communication unit 68 outputs (sends to the management device 13) data on the second misalignment amount ΔZ2 for each component BH calculated by the second misalignment amount calculation unit 66, as well as information on the pass/fail judgment results for each component BH on the board KB judged by the pass/fail judgment unit 67. In this way, the inspection device communication unit 68 is an output unit that outputs the second misalignment amount ΔZ2 calculated by the second misalignment amount calculation unit 66.

In FIG. 11, the management device 13 includes a management device storage unit 81, a management device communication unit 82, and a management device display input unit 83. The management device storage unit 81 stores production master data 91, which is the master data of the production data 41 stored in the mounting device storage unit 31 of the component mounting device 11, and inspection master data 92, which is the master data of the inspection data 71 stored in the inspection device storage unit 61 of the inspection device 12.

As shown in FIG. 11, the management device storage unit 81 stores inspection information 93. The inspection information 93 is data such as the results of inspection by the inspection device 12 (data on the second positional deviation amount ΔZ2 for each component BH and the result of the pass/fail judgment).

The management device communication unit 82 is communicatively connected to both the component mounting device 11 and the inspection device 12. The management device communication unit 82 transmits (transfers) the inspection result data for each component BH sent from the inspection device 12 to the component mounting device 11.

Next, the feedback processing unit 34 provided in the mounting device control unit 27 of the component mounting device 11 will be described. As described above, the feedback processing unit 34 includes a correction unit 44 and an information collection unit 45. The correction unit 44 receives data on the second positional deviation amount ΔZ2 for each component BH that is calculated and output by the inspection device 12 and sent via the management device 13. Then, based on the received data on the second positional deviation amount ΔZ2 for each component BH, it calculates a correction value for the operation parameters of the mounting head 23 and corrects the operation parameters using the calculated correction value. Note that the correction value is calculated by accumulating multiple data (positional deviation data of the component BH) for each target mounting position MK on the board KB and calculating the correction value using a statistical method.

The information compilation unit 45 compiles information about each component BH sent from the inspection device 12 via the management device 13. Specifically, the information compilation unit 45 compiles information about the mounting accuracy of the component BH using the data on the second positional deviation amount ΔZ2 for each component BH sent from the inspection device 12.

Next, a procedure (board manufacturing method) for manufacturing a mounted board (board KB with components BH mounted) by performing a component mounting operation for mounting components BH on board KB using the component mounting system 1 configured as above, and an inspection method included in this board manufacturing method for inspecting components BH mounted at target mounting positions MK set on board KB will be described. When manufacturing a mounted board, the component mounting system 1 first uses the component mounting device 11 to receive the board KB from an upstream device (e.g., a solder printing device) via the board transport path 21 and positions it at a specified component mounting work position (positioning process). Once the board KB is positioned at the component mounting work position, the mounting head 23 moves above the component supply unit 22 and picks up the components BH supplied by the component supply unit 22 with the nozzle 23N (pickup process).

After picking up the component BH with the nozzle 23N, the mounting head 23 moves to pass above the component recognition camera 25, which acquires an image of the component BH (picked-up component image acquisition process). After acquiring an image of the component BH picked up by the mounting head 23, the component mounting device 11 detects the position of the component center (picked-up component position) of the component BH picked up by the mounting head 23 relative to the nozzle 23N based on the component center detection method data 41d included in the production data 41 (picked-up component position detection process). Then, after correcting the operating parameters in a predetermined case (correction process), the component BH picked up by the mounting head 23 is mounted at the target mounting position MK on the board KB (component mounting process). After mounting all the components BH to be mounted on the board KB, the component mounting device 11 transports the board KB to the downstream inspection device 12 (board removal process), and the component mounting work for one board KB is completed.

The flowchart in Figure 12 shows the flow of the inspection work performed by the inspection device 12. When performing inspection work, the inspection device 12 first receives and carries in the board KB from the component mounting device 11 and positions it at a predetermined inspection work position (step ST1, board positioning process). Once the board KB is positioned at the inspection work position, the inspection camera 53 moves above the board KB and acquires images (inspection images) of each component BH mounted on the board KB (step ST2, inspection image acquisition process).

After the inspection device 12 acquires the inspection image of each component BH on the board KB, it detects the mounted component position Z of each component BH mounted on the board KB based on the acquired inspection image (step ST3: mounted component position detection process). In this mounted component position detection process, the inspection device 12 detects the position of the center of the component BH mounted on the board KB based on the component center detection method data 71c included in the inspection data 71.

After detecting the mounted component position Z in step ST3, the inspection device 12 reads out the inspection reference position KK for each component BH from the inspection reference position data 73. Then, for each component BH, the detected mounted component position Z (i.e., the position of the component BH mounted on the board KB) is compared with the inspection reference position KK set for the board KB to calculate a first positional deviation amount ΔZ1, which is the positional deviation amount of the component BH from the inspection reference position KK (step ST4. First positional deviation amount calculation process).

After calculating the first misalignment amount ΔZ1, the inspection device 12 judges the quality of the mounting state of each component BH mounted on the board KB based on the calculated first misalignment amount ΔZ1 (step ST5: quality judgment process). After judging the quality of the mounting state of each component BH, the inspection device 12 calculates a second misalignment amount ΔZ2, which is the misalignment amount of the component BH from the target mounting position MK, by comparing the target mounting position MK read from the target mounting position data 72 with the mounted component position Z detected in step ST3 (step ST6: second misalignment amount calculation process).

After calculating the second positional deviation amount ΔZ2, the inspection device 12 outputs the pass/fail judgment results for each component BH judged in the pass/fail judgment process and the second positional deviation amount ΔZ2 calculated by the second positional deviation amount calculation unit 66 in the second positional deviation amount calculation process as feedback data from the inspection device communication unit 68 to the management device 13 (step ST7, output process). Then, when the inspection of all components BH on the board KB is completed, the board KB is unloaded downstream (step ST8, board unloading process), and the inspection work for each board KB is completed.

When the management device 13 receives data on the second positional deviation amount ΔZ2 for each component BH from the inspection device 12, it stores the received data in the management device memory unit 81 as inspection information 93. Then, it transmits (transfers) the stored data on the second positional deviation amount ΔZ2 for each component BH to the component mounting device 11. When the component mounting device 11 receives data on the second positional deviation amount ΔZ2 from the management device 13, it stores the data on the second positional deviation amount ΔZ2 in the mounting device memory unit 31 as the aforementioned positional deviation amount data 42.

When the component mounting device 11 receives the data of the second positional deviation amount ΔZ2 as feedback data from the inspection device 12 from the management device 13, the data of the second positional deviation amount ΔZ2 is stored in the mounting device storage unit 31 as the positional deviation amount data 42. Then, when the required amount of data is collected, the correction unit 44 of the feedback processing unit 34 calculates the correction value of the operation parameter based on the second positional deviation amount ΔZ2. Once the correction value of the operation parameter is calculated, the component mounting device 11 uses the calculated correction value to correct the operation parameter of the mounting head 23 in the component mounting process (the correction process described above). Therefore, the mounting head 23 uses the corrected operation parameter to mount the component BH on the board KB, and the component BH is mounted on the board KB with high mounting accuracy.

The component mounting device 11 also uses the information collection unit 45 to collect information related to the mounting accuracy of the component BH based on the stored data on the second positional deviation amount ΔZ2 (information collection process). In this information collection process, for example, the change in the second positional deviation amount ΔZ2 is collected over time, and data is created that can confirm the state in which the second positional deviation amount ΔZ2 is gradually reduced by correcting the operating parameters.

In this embodiment, the inspection device 12 not only calculates the first positional deviation amount ΔZ1, which is the positional deviation amount of the component BH from the inspection reference position KK set for the board KB, but also calculates the second positional deviation amount ΔZ2, which is the positional deviation amount of the component BH from the target mounting position MK, by comparing the position of the component BH mounted on the board KB (mounted component position Z) with the target mounting position MK. Then, the inspection device 12 judges whether the mounting state of the component BH mounted on the board KB is good or bad based on the first positional deviation amount ΔZ1, while outputting the calculated second positional deviation amount ΔZ2 to the component mounting device 11 as feedback data. Therefore, the component mounting device 11 can obtain the correction value of the operating parameters of the mounting head 23 based on the positional deviation amount (second positional deviation amount ΔZ2) based on the target mounting position MK, which is the reference when mounting the component BH, and can improve the mounting accuracy of the component BH.

As described above, in the component mounting system 1 of this embodiment, the inspection device 12 calculates the first positional deviation amount ΔZ1, which is the positional deviation amount of the component BH from the inspection reference position KK, to determine the quality of the mounting state of the component BH, while calculating the second positional deviation amount ΔZ2, which is the positional deviation amount of the component BH from the target mounting position MK. The second positional deviation amount ΔZ2 is then output as feedback data to the component mounting device 11, which uses the second positional deviation amount ΔZ2 to calculate a correction value. Therefore, the component mounting device 11 can correct the operating parameters of the mounting head 23 with an appropriate correction value, thereby improving the mounting accuracy of the component BH.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above, and various modifications are possible. For example, in the above embodiment, the component mounting device 11 receives the inspection information output by the inspection device 12 via the management device 13, but it may also receive the information directly from the inspection device 12 without going through the management device 13.

To provide a component mounting system, inspection device, board manufacturing method, and inspection method that can improve component mounting accuracy.

REFERENCE SIGNS LIST 1 Component mounting system 11 Component mounting device 12 Inspection device 23 Mounting head 65 First positional deviation amount calculation unit 66 Second positional deviation amount calculation unit 68 Inspection device communication unit (output unit)
KK Inspection reference position MK Target mounting position ΔZ1 First position deviation amount ΔZ2 Second position deviation amount BH Component RD Lead KB Board

Claims (10)

A component mounting system including a component mounting device that uses a mounting head to pick up components and mount them at target mounting positions set on a board, and an inspection device that inspects the components mounted on the board by the component mounting device,
The inspection device includes:
an inspection reference position changing unit that sets an inspection reference position for the board that is different from the target mounting position;
a first positional deviation amount calculation unit that calculates a first positional deviation amount, which is a positional deviation amount of the component from the inspection reference position by comparing a position of the component mounted on the board with the inspection reference position set by the inspection reference position changing unit;
a second misalignment amount calculation unit that calculates a second misalignment amount, which is a misalignment amount of the component from the target mounting position by comparing a position of the component mounted on the board with a target mounting position of the component on the board;
an output unit that outputs the second positional deviation amount calculated by the second positional deviation amount calculation unit,
The component mounting system, wherein the component mounting device calculates a correction value based on the second positional deviation amount output from the output section, and corrects operating parameters of the mounting head using the calculated correction value. The component mounting system of claim 1, wherein the inspection reference position is changeable. The component mounting system according to claim 1 or 2, wherein the position of the component is detected based on a lead measurement standard relating to the measurement of the leads of the component. The component mounting system of claim 3, wherein the lead measurement criterion includes information regarding the coordinates of the lead. An inspection apparatus for inspecting a component mounted at a target mounting position set on a board, comprising:
an inspection reference position changing unit that sets an inspection reference position for the board that is different from the target mounting position;
a first positional deviation amount calculation unit that calculates a first positional deviation amount, which is a positional deviation amount of the component from the inspection reference position by comparing a position of the component mounted on the board with the inspection reference position set by the inspection reference position changing unit;
a second misalignment amount calculation unit that calculates a second misalignment amount, which is a misalignment amount of the component from the target mounting position by comparing a position of the component mounted on the board with a target mounting position of the component on the board;
an output unit that outputs the second positional deviation amount calculated by the second positional deviation amount calculation unit. The inspection device according to claim 5, wherein the inspection reference position is changeable. A substrate manufacturing method for manufacturing a mounting substrate having components mounted on a substrate, comprising the steps of:
a component mounting process in which a mounting head picks up components and mounts them at target mounting positions set on the board;
an inspection reference position changing step of setting an inspection reference position different from the target mounting position for the board;
a first positional deviation amount calculation step of calculating a first positional deviation amount, which is a positional deviation amount of the component from the inspection reference position by comparing a position of the component mounted on the board with the inspection reference position set in the inspection reference position changing step;
a second positional deviation amount calculation step of calculating a second positional deviation amount, which is a positional deviation amount of the component from the target mounting position by comparing a position of the component mounted on the board with a target mounting position of the component on the board;
an output step of outputting the second positional deviation amount calculated in the second positional deviation amount calculation step;
a correction process of calculating a correction value based on the second positional deviation amount output in the output process, and correcting an operating parameter of the mounting head in the component mounting process using the calculated correction value. The substrate manufacturing method according to claim 7, wherein the inspection reference position is changeable. 1. An inspection method for inspecting a component mounted at a target mounting position set on a board, comprising:
an inspection reference position changing step of setting an inspection reference position different from the target mounting position for the board;
a first positional deviation amount calculation step of calculating a first positional deviation amount, which is a positional deviation amount of the component from the inspection reference position by comparing a position of the component mounted on the board with the inspection reference position set in the inspection reference position changing step;
a second positional deviation amount calculation step of calculating a second positional deviation amount, which is a positional deviation amount of the component from the target mounting position by comparing a position of the component mounted on the board with a target mounting position of the component on the board;
and an output step of outputting the second positional deviation amount calculated by the second positional deviation amount calculation unit. The inspection method according to claim 9, wherein the inspection reference position is changeable.

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