JP7554168B2 - Cleaning Equipment - Google Patents

Description

The present invention relates to a cleaning device.

In the manufacturing process of semiconductor devices, it is sometimes required to clean the surface of the semiconductor wafer, which is the substrate, with a high degree of cleanliness. For example, after chemical mechanical polishing (CMP) is performed to flatten the surface of the substrate, particles such as polishing debris containing organic matter and metals and slurry residue (hereinafter referred to as contaminants) adhere to the surface of the substrate.

Contaminants can cause defects in products because they can hinder even film formation and lead to short circuits in circuit patterns. For this reason, they must be removed by cleaning the substrate with a cleaning solution. A cleaning device that uses a rotating brush is known as a device for performing this type of cleaning (see Patent Document 1).

This cleaning device rotates the substrate and moves a rotating brush in a direction parallel to the substrate, contacting the substrate surface with the cleaning liquid. This causes contaminants adhering to the substrate surface to float in the cleaning liquid and are then removed from the substrate by the brush, cleaning the entire substrate.

The substrate is held at its periphery by multiple circular rollers, and is rotated by driving the rollers to rotate in the same direction. The rollers have a large-diameter base section below a transmission section that comes into contact with the substrate to rotate it. The upper surface of the base section has a tapered surface that is inclined so that it becomes higher from the periphery toward the center of rotation. When the rollers, which are waiting at a distance from the substrate, move in a direction to come into contact with the substrate, the periphery on the back side of the substrate comes into contact with the tapered surface and is guided upward until it reaches a position where it comes into contact with the transmission section, thereby holding the substrate.

JP 2013-089797 A

Here, the cleaning liquid that adheres to the rotating roller during cleaning is expelled outward by centrifugal force. However, the outer periphery of the back side of the substrate that contacts the transmission part and the tapered surface are located close to each other, creating a very narrow space between them. For this reason, the cleaning liquid that enters the space between the outer periphery of the back side of the substrate and the tapered surface of the roller tends to remain in the space due to surface tension, and becomes a liquid pool. Since liquid pools are constantly occurring in this area, the cleaning liquid is not easily discharged. For this reason, the cleaning liquid is not expelled little by little by centrifugal force, but rather, when the amount accumulates to the point where it can no longer be retained, it splashes outward, causing redeposition to the substrate.

Furthermore, because the roller's transmission part rotates while in contact with the outer peripheral edge of the substrate, the part of the roller that comes into contact with the substrate is scraped off, generating dust (hereafter referred to as particles). These particles accumulate in the liquid pool on the tapered surface of the roller as described above along with the cleaning liquid. Then, when the cleaning liquid splashes outward, the particles also splash and adhere to the back side of the substrate, deteriorating the cleanliness of the substrate.

The embodiment of the present invention has been proposed to solve the problems described above, and its purpose is to provide a cleaning device that can reduce redeposition of cleaning liquid onto a substrate and keep the substrate clean.

In order to solve the above problems, a cleaning apparatus according to an embodiment of the present invention comprises a plurality of rollers each having a transmission section which contacts a substrate to rotate the substrate, a base section whose diameter is expanded from the transmission section and which has an upper surface located below the substrate, a cleaning liquid ejection section which ejects a cleaning liquid onto the substrate, and a cleaning section which cleans the surface of the substrate by contacting a brush with at least one surface of the rotating substrate, wherein a groove is formed on the upper surface which extends from the center of rotation of the roller to the outer periphery , and the groove is curved .

Embodiments of the present invention can provide a cleaning apparatus that can reduce redeposition of cleaning liquid onto a substrate and keep the substrate clean.

1 is a perspective view showing a schematic configuration of a cleaning device according to an embodiment; 1A is a plan view and FIG. 1B is a side view showing the shape of a roller. FIG. 1A shows a state in which a roller of an embodiment is in contact with a substrate, and FIG. 1B shows a state in which a roller without grooves is in contact with the outer circumference of a substrate, where the right figure is a plan view and the left figure is a vertical cross-sectional view taken along the arrows D-D in the right figure. FIG. 13 is a side view showing the roller (A) in a released position and the roller (B) in a held position. 1A is a plan view showing the roller in a released position and FIG. 1B is a plan view showing the roller in a held position. FIG. 1A is a plan view showing a cleaning section at a start position of cleaning, (B) a cleaning section during cleaning, and (C) a cleaning section at an end position. 13A and 13B are a plan view and a side view showing a modified example of the roller of the embodiment.

Below, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, this embodiment is a cleaning apparatus 1 that cleans a substrate W using cleaning liquid L and a brush 25 (see FIGS. 4 and 6) while rotating the substrate W. The substrate W to be cleaned is typically a semiconductor wafer, but may also be a substrate for a display device, etc. The substrate W is circular, and its outer periphery is beveled. In other words, the corners are chamfered by grinding.

[composition]
As shown in FIG. 1 , the cleaning device 1 includes a rotation drive unit 10, a cleaning unit 20, a brush drive unit 30, and a cleaning liquid discharge unit 40.

(Rotation drive unit)
The rotation drive unit 10 rotates a plurality of rollers 100 that hold the outer periphery of the substrate W, thereby rotating the substrate W. The rotation drive unit 10 has a first holding unit 11, a second holding unit 12, a first drive unit 13, and a second drive unit 14. The first holding unit 11 and the second holding unit 12 are disposed at positions facing each other with the substrate W in between.

The first holding unit 11 and the second holding unit 12 each have a pair of rollers 100. The rollers 100 are arranged to be rotatable around an axis perpendicular to the substrate W. As shown in Figures 2(A) and (B), each roller 100 in the first holding unit 11 and the second holding unit 12 has a transmission unit 101 and a base unit 102. The transmission unit 101 contacts the substrate W to rotate it (see Figure 3(A)). The transmission unit 101 is cylindrical, and its side surface abuts against the outer periphery of the substrate W to hold the substrate W.

The base part 102 is concentric with the transmission part 101 and has a cylindrical shape with a diameter expanded from that of the transmission part 101. The upper surface 102a of the base part 102 is an inclined surface located below the substrate W held by the transmission part 101. This upper surface 102a forms an umbrella-shaped tapered surface, which is the side shape of a cone, around the entire circumference, so that it becomes higher from the outer periphery toward the transmission part 101. The side surface 102b of the base part 102 is parallel to the axis of rotation and is continuous with the upper surface 102a by a curved surface.

On the upper surface 102a, a plurality of grooves 103 are formed, which extend from the center of rotation of the roller 100 to the outer periphery. The grooves 103 are arranged at equal intervals along the circumference. For example, in this embodiment, the number of grooves 103 is 18. The grooves 103 increase in width from the center of rotation to the outer periphery. The grooves 103 are also curved. More specifically, the grooves 103 are curved to form a spiral shape that follows the rotation direction (curves in a direction that does not oppose the rotation direction). For this reason, the inner wall of each groove 103 is a curved surface that becomes convex toward the rotation direction from the center of rotation of the roller 100 to the outer periphery. In each groove 103, the curvature of the inner wall at the rear in the rotation direction may be made larger than the curvature of the inner wall at the front, so that the width of the groove 103 increases toward the outer periphery. Furthermore, the grooves 103 are formed continuously from the upper surface 102a to the side surface 102b. Because the groove 103 is formed in this way, the width of the upper surface 102a (the surface other than the groove 103) also increases from the center of rotation toward the outer periphery, and the boundary with the groove 103 is curved.

The roller 100 is formed of a material that is resistant to the cleaning liquid L, such as PCTFE or PEEK. It is more preferable to use PCTFE, which has excellent abrasion resistance and is less likely to generate particles when it comes into contact with the substrate W.

As shown in FIG. 1, the first drive unit 13 and the second drive unit 14 support the first holding unit 11 and the second holding unit 12, respectively, and rotate the roller 100 about its axis while moving the roller 100 in a direction toward and away from the substrate W. A rotation mechanism (not shown) that drives the roller 100 is housed inside the first drive unit 13 and the second drive unit 14.

The rotation mechanism is, for example, a belt drive mechanism. In other words, a belt that transmits a driving force is stretched between the drive shaft of a motor, which is the drive source, and a pulley provided on the drive shaft of one of the rollers 100, and between the pulleys provided on the drive shafts of the pair of rollers 100, so that the pair of rollers 100 can be rotated by the drive source. Note that the rotation mechanism is not limited to this, and for example, each roller 100 may be configured to rotate by a motor provided on each roller 100.

As described above, the first drive unit 13 and the second drive unit 14 are configured to be movable in a direction toward and away from the substrate W. That is, a drive mechanism (not shown) is provided at the lower end of each of the first drive unit 13 and the second drive unit 14, and this drive mechanism moves the first drive unit 13 and the second drive unit 14 in a direction toward and away from the substrate W. As a result, the first holding unit 11 and the second holding unit 12 also move in a direction toward and away from the substrate W. For example, the drive mechanism can be a rotary cylinder that moves drive shafts provided at the lower ends of the first drive unit 13 and the second drive unit 14 in opposite directions along a direction parallel to the surface of the substrate W.

The drive mechanism moves the first holding portion 11 and the second holding portion 12 in directions away from each other, so that the transmission portion 101 of the roller 100 is in a release position away from the substrate W, as shown in Figs. 4(A) and 5(A). The drive mechanism moves the first holding portion 11 and the second holding portion 12 in directions toward each other, so that the transmission portion 101 of the roller 100 is in a holding position in which it contacts and holds the substrate W, as shown in Figs. 4(B) and 5(B). Note that Fig. 4 shows a pair of rollers 100 positioned opposite each other, arranged along the left-right direction in the figure, and the other rollers 100 are not shown.

(Cleaning section)
The cleaning unit 20 cleans the surface of the substrate W by bringing a rotating brush 25 into contact with the surface of the rotating substrate W. Note that the contact referred to here includes both the case where the brush 25 comes into direct contact with the surface of the substrate W and the case where the cleaning liquid L is interposed therebetween. As shown in the side view of Fig. 6, the cleaning unit 20 has a body 21, a brush holder 23, a support 24, and a brush 25. The body 21 is a cylindrical container and houses a motor (not shown) therein. The motor is a drive source for rotating the brush 25.

The brush holder 23 is a disk-shaped member attached to the drive shaft of the motor and to which the support 24 is removably attached. The brush holder 23 is rotatable independently of the body 21. The support 24 is a disk-shaped member to which the brush 25 is fixed and which is attached and detached to the brush holder 23 by a chuck mechanism or the like.

The brush 25 is a cylindrical member made of a flexible and elastic material. In this embodiment, the brush 25 is made of a spongy resin such as PVA (nylon resin) or PTFE (fluororesin). A similar resin bristle brush may also be used. In other words, the brush 25 in this embodiment includes a spongy mass and a mass of many densely packed hairs. The spongy mass of the brush 25 includes a mass of multiple densely packed fibrous bodies. The number of brushes 25 provided on the support 24 may be one or more.

(Brush drive unit)
1, the brush driving unit 30 moves the cleaning unit 20 in a direction parallel to the surface of the substrate W. The brush driving unit 30 has an arm 31 and a driving mechanism 32. The arm 31 is a member extending in a direction parallel to the substrate W, and has the cleaning unit 20 attached to one end thereof. The driving mechanism 32 has a swinging mechanism and a lifting mechanism.

As shown in Figures 7(A) to (C), the swing mechanism reciprocates the arm 31 parallel to the substrate W from the outer periphery of the substrate W to the outer periphery on the opposite side in an arc trajectory with the end opposite the cleaning unit 20 as its axis. The swing mechanism also reciprocates the arm 31 from a standby position to the outer periphery of the substrate W. The swing mechanism has a support shaft extending from the arm 31 in a direction perpendicular to the surface of the substrate W, and a motor (not shown) that is a drive source for swinging the support shaft. When the substrate W is not being cleaned, the arm 31 is positioned in a standby position (not shown) outside the substrate W.

As shown in Figures 4(A) and (B), the lifting mechanism moves the arm 31 in a direction in which the cleaning unit 20 moves toward and away from the substrate W. As the lifting mechanism, a ball screw mechanism, cylinder, or the like that raises and lowers the support shaft of the arm 31 can be used.

(Cleaning liquid discharge part)
The cleaning liquid discharge unit 40 discharges the cleaning liquid L onto the substrate W. The cleaning liquid discharge unit 40 has a nozzle 41, and discharges the cleaning liquid L from a discharge port 41a at the tip of the nozzle 41 toward both sides of the rotating substrate W (see FIGS. 7A to 7C). The cleaning liquid L in this embodiment is ozone water, pure water, SC-1 (a cleaning liquid made by mixing ammonia water and hydrogen peroxide water), or an acid-based chemical liquid (hydrofluoric acid, nitric acid, hydrochloric acid, etc.). For example, when the brush 25 is made of PVA, cleaning is performed with pure water. Also, when the brush 25 is made of PTFE, ozone water, SC-1, or an acid-based chemical liquid is used. Since PTFE is liquid-resistant, cleaning liquids L such as ozone water, SC-1, and an acid-based chemical liquid can be used in combination.

The nozzles 41 are a pair of cylindrical bodies arranged above and below the substrate W. One end of the nozzle 41 is bent, for example, at 45° with respect to the surface of the substrate W, and has an outlet 41a that ejects the cleaning liquid L toward the surface of the substrate W. The nozzle 41 ejects the cleaning liquid L from the outside of the substrate W toward the center of the surface of the substrate W, that is, in a spraying manner toward the middle of the movement path of the brush 25.

The other end of the nozzle 41 is connected via piping to a cleaning liquid L supply device (not shown). The supply device has a liquid delivery device, valves, etc. connected to a pure water production device (pure water storage tank), an ozone water production device (ozone water storage tank), and an SC-1 supply device or an acid-based chemical supply device, and can switch between supplying pure water, ozone water, and SC-1 or an acid-based chemical. Note that one nozzle 41 may be provided for each surface of the substrate W, or multiple nozzles may be provided for each surface. Furthermore, the number of nozzles provided for one surface of the substrate W may be different from the number provided for the other surface.

As shown in FIG. 4, the cleaning unit 20, brush drive unit 30, and cleaning liquid discharge unit 40 as described above are provided in pairs above and below the substrate W so that the top and bottom surfaces (also called the front and back surfaces) of the substrate W can be cleaned. In other words, the pair of cleaning units 20 are arranged with the pair of arms 31 of the brush drive unit 30 above and below the substrate W so that their respective brushes 25 and discharge ports 41a face the substrate W. The drive mechanism 32 moves the pair of arms 31 between a contact position (FIG. 4(B)) where the pair of brushes 25 are in contact with the substrate W so as to sandwich it, and a separated position (FIG. 4(A)) where they are separated from the substrate W.

The drive mechanism 32 also swings the pair of arms 31, thereby moving the pair of brushes 25 at the contact position along an arcuate trajectory, as shown in Figures 7(A) to (C). When viewed in a plan view, the contact position is the start point of the swinging of the brushes 25, as shown in Figure 7(A), and the separation position is the end point of the swinging of the brushes 25, as shown in Figure 7(C). The contact position is on the outer periphery of the substrate W, and the separation position is on the outer periphery of the substrate W opposite the contact position.

[Action]
The operation of the cleaning device 1 having the above configuration will be described.
(Carrying in the board)
First, the operation of carrying in the substrate W will be described. That is, in the previous step, ozone water is applied to the surface of the processed substrate W, and an oxide film is formed, thereby making the surface hydrophilic. The surface of the substrate W on which this oxide film is formed has organic contaminants (slurry, etc.) and metal contaminants remaining from the CMP step before the previous step attached thereto. This means that the substrate W is in a state in which the ozone water is supplied with the contaminants still attached to the front and back surfaces thereof, that is, the oxide film is formed with the contaminants still attached. Although ozone water has the ability to remove organic matter, this previous step is not a step for removing organic matter, but rather a step aimed at making the front and back surfaces of the substrate W hydrophilic.

The transport robot transports the substrate W from the previous process to the cleaning device 1, and as shown in Fig. 4(A) and Fig. 5(A), transports it between the rollers 100 of the first holding unit 11 and the second holding unit 12. The transported substrate W is placed on the upper surface 102a of the rollers 100. The first holding unit 11 and the second holding unit 12 move in a direction approaching each other, as shown in Fig. 4(B) and Fig. 5(B). Then, the four rollers 100 move toward the substrate W, so that the inclination of the upper surface 102a of the base unit 102 pushes up the outer periphery of the substrate W, and the side of the transmission unit 101 comes into contact with the outer periphery of the substrate W, thereby holding the substrate W.

(Cleaning of the substrate)
Next, the cleaning operation of the substrate W will be described. As shown in Figures 2(A) and 5(B), the roller 100 rotates clockwise in the figures, causing the substrate W to rotate counterclockwise. For example, the roller 100 rotates at a low speed of 20 to 60 rpm. As shown in Figure 2(A), when the side surface of the transmission portion 101 of the roller 100 is in contact with the outer periphery of the substrate W, the rotation of the roller 100 is transmitted to the substrate W, and the rotation of the substrate W is maintained.

The upper and lower arms 31 are initially in a standby state in a standby position outside the substrate W. The upper and lower arms 31 in the standby position swing to the outer periphery of the substrate W as shown in FIG. 7(A) while rotating the brushes 25 by the motor 22, and then stop. Then, as the upper and lower arms 31 move toward the substrate W, the brushes 25 of the upper and lower cleaning units 20 come into contact with the front and back surfaces of the substrate W as shown in FIG. 4(B), thereby sandwiching the substrate W. The black arrows in the figure indicate the direction of rotation of the substrate W.

The upper and lower arms 31 rotate, causing the upper and lower brushes 25 to move horizontally. At this time, the nozzle 41's outlet 41a is discharging cleaning liquid L, so that cleaning liquid L flows between the brush 25 and the substrate W. That is, as shown in Figures 7(A) and (B), the brush 25 starts moving from one side of the outer periphery of the substrate W, and while moving along an arc trajectory indicated by the white arrow in the figure, pushes out contaminants together with the cleaning liquid L to the outer periphery of the substrate W. As shown in Figure 7(C), when the brush 25 moves beyond the other side of the outer periphery of the substrate W and leaves the substrate W, the brush 25 stops rotating, stops discharging cleaning liquid L from the outlet 41a, and ends the cleaning process.

The upper and lower arms 31 then move away from each other, causing the upper and lower brushes 25 to move away from each other, and the arms 31 then swing to retreat to a standby position outside the outer periphery of the substrate W. Note that the above operation may then be repeated to perform multiple cleaning operations using the brushes 25. In this case, after each cleaning, the arms 31 return to the position where the cleaning starts (see Figures 4(A) and 7(A)).

Although not shown, a groove is provided on the side of the transmission part 101 into which the end face of the substrate W fits, so that when the end face of the substrate W is held in contact with the rotating transmission part 101, the end face of the substrate W fits into the groove, causing it to float slightly above the upper surface 102a, as shown in FIG. 3(A). The upper surface 102a of the base part 102 of the roller 100 has a groove 103 that serves as a path for the cleaning liquid L to pass through, which reaches the side surface 102b, so that the cleaning liquid L flowing between the substrate W and the upper surface 102a falls from the upper surface 102a into the groove 103, moves to the side surface 102b, and is discharged. As a result, the amount of cleaning liquid L (cleaning liquid L in a state of tension due to surface tension) between the substrate W and the upper surface 102a is extremely smaller than that of a conventional roller 100 without a groove 103.

In addition, by providing the grooves 103 on the upper surface 102a, the area of the upper surface 102a becomes smaller than when the grooves 103 are not provided, so the amount of cleaning liquid L that adheres to the upper surface 102a is less than before. In other words, the cleaning liquid L that adheres to the upper surface 102a of the roller 100 exposed from the substrate W is discharged from the grooves 103 by the centrifugal force caused by the rotation of the roller 100. As a result, the cleaning liquid L is almost completely discharged without stagnating, so that when the upper surface 102a of the roller 100 penetrates into the back surface of the substrate W, the amount of cleaning liquid L that adheres to the upper surface 102a is reduced. Therefore, even if the cleaning liquid L is mixed with the substrate W and the cleaning liquid L flowing into the upper surface 102a, the amount of liquid that splashes onto the substrate W is also reduced because the amount of liquid is small to begin with.

Furthermore, since the distance between the groove 103 and the back surface of the substrate W is wider than the distance between the upper surface 102a and the back surface of the substrate W, the cleaning liquid L that has flowed into the groove 103 is easily discharged by the centrifugal force of the roller 100 rotating. That is, as described above, the area of the upper surface 102a of the present embodiment having the groove 103 is smaller than the area of the upper surface 102a of the conventional roller 100 without the groove 103. Therefore, the area (area) of contact with the outer peripheral surface on the back surface side of the substrate W is smaller than that of the conventional roller 100. If the area of the upper surface 102a is small, the amount of cleaning liquid L that flows in and remains between the upper surface 102a and the back surface of the substrate W is very small compared to the conventional roller 100. Therefore, even if the cleaning liquid L flows in between the upper surface 102a and the back surface of the substrate W, the amount of cleaning liquid L that remains is reduced by discharging the cleaning liquid L from between the upper surface 102a and the back surface of the substrate W into the groove 103. As a result, particles generated by scraping the portion of the roller 100 that comes into contact with the edge of the substrate W, i.e., the transmission portion 101, will not continue to accumulate with the liquid pool between the upper surface 102a and the rear surface of the substrate W, and the amount of cleaning liquid L that splashes from the roller 100 can be reduced, so less cleaning liquid L splashes toward the substrate W and re-adhesion to the substrate W is reduced.

As shown in FIG. 3B, if the groove 103 does not exist, a pool of cleaning liquid L always occurs in the narrow space between the upper surface 102a and the back surface of the substrate W, where particles generated by the abrasion of the transfer part 101 that contacts the edge surface of the substrate W accumulate. Therefore, when an amount of cleaning liquid L accumulates to the extent that it can no longer be retained, it will splash outward all at once and reattach to the substrate W. It is also possible to make it difficult for pools to occur by making the angle of the inclined surface of the upper surface 102a steeper. However, in this case, it becomes difficult for the outer periphery of the substrate W to move along the inclined surface during the holding operation of the substrate W. In other words, the inclination angle of the upper surface 102a must be shallow, so the gap with the substrate W becomes narrow and pools of liquid are more likely to occur.

(Action and Effect)
(1) The cleaning apparatus 1 of this embodiment as described above comprises a plurality of rollers 100 each having a transmission section 101 that contacts the substrate W to rotate the substrate W, a base section 102 whose diameter extends from the transmission section 101 and has an upper surface 102a located below the substrate W, a cleaning liquid ejection section 40 that ejects a cleaning liquid L onto the substrate W, and a cleaning section 20 that cleans the surface of the substrate W by bringing a brush 25 into contact with at least one surface of the rotating substrate W, and a groove 103 is formed on the upper surface 102a of the base section 102, the groove 103 extending from the center of rotation of the roller 100 to the outer periphery.

As a result, the cleaning liquid L adhering to the rotating roller 100 is prevented from pooling between the roller and the substrate W, and the cleaning liquid L is efficiently discharged together with particles through the groove 103, reducing re-adhesion to the substrate W and enabling the substrate W to be kept clean.

(2) Multiple grooves 103 are provided. Therefore, by providing multiple grooves 103, the area of the upper surface 102a is narrowed and the gap between the upper surface 102a and the rear surface of the substrate W is increased, making it more difficult for liquid to accumulate.

(3) The groove 103 widens from the rotation center toward the outer periphery. The groove 103 is also curved. Moreover, it widens in a curved state so as to form a spiral that follows the rotation direction (curves in a direction that does not oppose the rotation direction). This allows the cleaning liquid L that flows into the groove 103 to be discharged smoothly without opposing the rotation direction of the roller 100. Furthermore, by making the curved surface more steeply curved, the cleaning liquid L that has entered the groove 103 can be discharged more easily. Also, the fact that the groove 103 widens from the rotation center toward the outer periphery and that the curved shape is longer than a straight line narrows the area of the upper surface 102a, making it less likely for liquid to pool.

The smaller the area of the upper surface 102a, the more effective it is in preventing liquid pooling, but the fewer points of contact between the outer circumferential surface on the back side of the substrate W and the upper surface 102a. This increases the resistance to the upper surface 102a, making it difficult for the substrate W to slide up along the upper surface 102a when held, and the friction between the upper surface 102a and the substrate W causes the upper surface 102a to be scraped, making it easier for scrapings to be produced. For this reason, it is preferable to determine the optimal width of the upper surface 102a, the number of upper surfaces 102a or the number of grooves 103, the curvature of the curve, etc., through experiments, etc.

(5) The base portion 102 has a side surface 102b that is continuous with the outer periphery of the upper surface 102a, and the groove 103 is formed on the side surface 102b that is continuous with the upper surface 102a. Therefore, the cleaning liquid L that flows into the groove 103 on the side surface 102b is discharged from a position separated from the substrate W, thereby preventing reattachment of the substrate W.

(Modification)
This embodiment is not limited to the above-described embodiment, and the following modified examples are also possible.
(1) The number of grooves 103 may be one or more. For example, as shown in Figures 8(A) and (B), the number may be four. Note that the more the number of grooves 103 is increased, the more the free space under the substrate W can be increased, which can suppress liquid accumulation and further facilitate the discharge of the cleaning liquid L.

(2) The shape of the grooves 103 may be linear. In this case as well, it is possible to create an empty space under the substrate W and generate an outward flow. However, by making the grooves 103 curved, and in particular by having multiple grooves 103 curved to form a vortex that follows the direction of rotation, it is possible to promote an outward flow even better.

(3) The number of rollers 100 is not limited to the above embodiment. Furthermore, the configuration of the cleaning unit 20 is not limited to the above embodiment. For example, it may be configured to clean only one side of the substrate W with a brush 25. It may be configured to use a cylindrical brush 25 with an axis parallel to the surface of the substrate W, and to clean the substrate W by bringing the side of the brush 25 into contact with the substrate W.

[Other embodiments]
Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims.

REFERENCE SIGNS LIST 1 cleaning device 10 rotation drive unit 11 first holding unit 12 second holding unit 13 first drive unit 14 second drive unit 20 cleaning unit 21 body unit 22 motor 23 brush holder 24 support unit 25 brush 30 brush drive unit 31 arm 32 drive mechanism 40 cleaning liquid discharge unit 41 nozzle 41a discharge port 100 roller 101 transmission unit 102 base unit 102a upper surface 102b side surface 103 groove

Claims (7)

a plurality of rollers each having a transmission section that contacts a substrate to rotate the substrate, and a base section whose diameter is expanded from the transmission section and has an upper surface located below the substrate;
a cleaning liquid discharge unit that discharges a cleaning liquid onto the substrate;
a cleaning unit that cleans a surface of the substrate by bringing a brush into contact with at least one surface of the rotating substrate;
having
a groove is formed on the upper surface of the roller from the rotation center side to the outer periphery of the roller ,
The cleaning device according to claim 1, wherein the groove is curved . The cleaning device according to claim 1, characterized in that a plurality of the grooves are provided. The cleaning device according to claim 1 or 2, characterized in that the grooves increase in width from the center of rotation of the roller toward the outer periphery. a plurality of rollers each having a transmission section that contacts a substrate to rotate the substrate, and a base section whose diameter is expanded from the transmission section and has an upper surface located below the substrate;
a cleaning liquid discharge unit that discharges a cleaning liquid onto the substrate;
a cleaning unit that cleans a surface of the substrate by bringing a brush into contact with at least one surface of the rotating substrate;
having
a groove is formed on the upper surface of the roller from the rotation center side to the outer periphery of the roller,
the base portion has a side surface continuous with an outer periphery of the upper surface,
The cleaning device according to claim 1, wherein the groove is formed continuously from the upper surface to the side surface. 5. The cleaning device according to claim 4, wherein a plurality of said grooves are provided. 6. The cleaning device according to claim 4, wherein the groove has a width increasing from the rotation center of the roller toward the outer periphery. 7. The cleaning apparatus according to claim 4, wherein the groove formed on the upper surface is curved.

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