JP7548671B2 - 開閉装置及び搬送室 - Google Patents
開閉装置及び搬送室 Download PDFInfo
- Publication number
- JP7548671B2 JP7548671B2 JP2021043858A JP2021043858A JP7548671B2 JP 7548671 B2 JP7548671 B2 JP 7548671B2 JP 2021043858 A JP2021043858 A JP 2021043858A JP 2021043858 A JP2021043858 A JP 2021043858A JP 7548671 B2 JP7548671 B2 JP 7548671B2
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- Prior art keywords
- opening
- transfer chamber
- chamber
- vacuum transfer
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012546 transfer Methods 0.000 title claims description 105
- 230000000903 blocking effect Effects 0.000 claims description 11
- 238000012545 processing Methods 0.000 description 32
- 238000012423 maintenance Methods 0.000 description 21
- 238000007789 sealing Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 16
- 230000007423 decrease Effects 0.000 description 3
- 238000005339 levitation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
- F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit
- F16K11/20—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit operated by separate actuating members
- F16K11/22—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit operated by separate actuating members with an actuating member for each valve, e.g. interconnected to form multiple-way valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
- F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
- F16K31/0675—Electromagnet aspects, e.g. electric supply therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Linear Motors (AREA)
- Magnetically Actuated Valves (AREA)
- Refuse Collection And Transfer (AREA)
- Paper (AREA)
- Glass Compositions (AREA)
Description
一実施形態に係る基板処理システム100の全体構成の一例について、図1を用いて説明する。図1は、一実施形態に係る基板処理システム100の一例の構成を示す平面図である。
10a コイル
20,20A~20C 移動体
21 弁体
21B 弁体部
22 ベース
22B ベース部
22a,22Ba 永久磁石
211,211B バルブプレート
212,212B シール部材(第1シール部材)
213,213B 拡大部
214,214B シール部材(第2シール部材)
215 支持部
216 固定装置
100 基板処理システム
110 処理室(第2室、室)
111 載置台
120 真空搬送室(第1室)
121 開口部(第1の開口部)
122 開口部(第1の開口部)
123 開口部(第2の開口部)
124 閉塞部材
125 固定装置
126 固定装置
127 ベント装置
128 真空引き装置
130 ロードロック室(第2室、室)
131 載置台
140 大気搬送室(第1室)
150 制御部
Claims (4)
- 第1室と前記第1室に隣接する第2室とを連通する開口部を開閉する開閉装置であって、
前記第1室に配列されたコイルを有する平面モータと、
前記平面モータ上を移動し、前記開口部を閉塞する弁体を有する移動体と、
前記コイルの通電を制御する制御部と、を備え、
前記弁体は、
第1のシール部材が設けられ、前記開口部を閉塞するバルブプレートと、
第2のシール部材が設けられ、前記バルブプレートよりも拡大する拡大部と、を有する、
開閉装置。 - 隣接する室と連通する第1の開口部と、
外部と連通する第2の開口部と、
前記第2の開口部を閉塞する閉塞部材と、
配列されたコイルを有する平面モータと、
前記平面モータ上を移動し、前記第1の開口部を閉塞する弁体を有する移動体と、
前記コイルの通電を制御する制御部と、を備え、
前記弁体は、
第1のシール部材が設けられ、前記第1の開口部を閉塞するバルブプレートと、
第2のシール部材が設けられ、前記第2の開口部を閉塞する拡大部と、を有する、
搬送室。 - 前記拡大部で前記第2の開口部を閉塞する際、前記バルブプレートは前記第2の開口部に挿通される、
請求項2に記載の搬送室。 - 前記搬送室は、
前記拡大部で前記第2の開口部を閉塞する際に、前記弁体を固定する固定装置を更に備える、
請求項2または請求項3に記載の搬送室。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021043858A JP7548671B2 (ja) | 2021-03-17 | 2021-03-17 | 開閉装置及び搬送室 |
KR1020220027979A KR102676994B1 (ko) | 2021-03-17 | 2022-03-04 | 개폐 장치 및 반송실 |
CN202210223312.3A CN115116892A (zh) | 2021-03-17 | 2022-03-07 | 开闭装置和输送室 |
US17/692,754 US20220301911A1 (en) | 2021-03-17 | 2022-03-11 | Opening/closing apparatus and transport chamber |
KR1020240075524A KR20240093414A (ko) | 2021-03-17 | 2024-06-11 | 개폐 장치 및 반송실 |
JP2024137761A JP2024161527A (ja) | 2021-03-17 | 2024-08-19 | 開閉装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021043858A JP7548671B2 (ja) | 2021-03-17 | 2021-03-17 | 開閉装置及び搬送室 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024137761A Division JP2024161527A (ja) | 2021-03-17 | 2024-08-19 | 開閉装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022143380A JP2022143380A (ja) | 2022-10-03 |
JP7548671B2 true JP7548671B2 (ja) | 2024-09-10 |
Family
ID=83284119
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021043858A Active JP7548671B2 (ja) | 2021-03-17 | 2021-03-17 | 開閉装置及び搬送室 |
JP2024137761A Pending JP2024161527A (ja) | 2021-03-17 | 2024-08-19 | 開閉装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024137761A Pending JP2024161527A (ja) | 2021-03-17 | 2024-08-19 | 開閉装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220301911A1 (ja) |
JP (2) | JP7548671B2 (ja) |
KR (2) | KR102676994B1 (ja) |
CN (1) | CN115116892A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2025057798A1 (ja) * | 2023-09-14 | 2025-03-20 | 東京エレクトロン株式会社 | 基板処理システム及び可動式メンテナンス装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018504784A (ja) | 2015-01-23 | 2018-02-15 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 半導体処理設備 |
JP2018198305A (ja) | 2017-05-23 | 2018-12-13 | 東京エレクトロン株式会社 | 真空搬送モジュール及び基板処理装置 |
JP2019523367A (ja) | 2017-06-08 | 2019-08-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 閉鎖装置、閉鎖装置付き真空システム、及び閉鎖装置の操作方法 |
JP2023130880A (ja) | 2022-03-08 | 2023-09-21 | 東京エレクトロン株式会社 | 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法 |
Family Cites Families (16)
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JPH07190228A (ja) * | 1993-12-27 | 1995-07-28 | Ulvac Japan Ltd | 無摺動ゲートバルブ |
JP2000294509A (ja) * | 1999-04-08 | 2000-10-20 | Sony Corp | 半導体真空装置 |
WO2002005330A2 (en) * | 2000-07-08 | 2002-01-17 | Applied Materials, Inc. | Door assembly for sealing an opening of a chamber |
US20030102721A1 (en) * | 2001-12-04 | 2003-06-05 | Toshio Ueta | Moving coil type planar motor control |
US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
EP1535313B1 (en) * | 2002-07-22 | 2018-10-31 | Brooks Automation, Inc. | Substrate processing apparatus |
EP1788694A4 (en) * | 2004-07-15 | 2014-07-02 | Nikon Corp | EQUIPMENT FOR PLANAR MOTOR, STAGE EQUIPMENT, EXPOSURE EQUIPMENT AND METHOD OF MANUFACTURING THE DEVICE |
JP4010314B2 (ja) * | 2004-12-17 | 2007-11-21 | 東京エレクトロン株式会社 | ゲートバルブ装置、処理システム及びシール部材の交換方法 |
CN203627863U (zh) * | 2013-08-29 | 2014-06-04 | 昆山工研院新型平板显示技术中心有限公司 | 门阀阀板 |
JP6293499B2 (ja) * | 2014-01-27 | 2018-03-14 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP2018170347A (ja) * | 2017-03-29 | 2018-11-01 | 株式会社ダン・タクマ | ウェハー搬送装置及びウェハー搬送方法 |
WO2019058735A1 (ja) * | 2017-09-19 | 2019-03-28 | パナソニックIpマネジメント株式会社 | 平面モータ |
CN209747467U (zh) * | 2019-04-11 | 2019-12-06 | 德淮半导体有限公司 | 半导体设备 |
JP7296862B2 (ja) * | 2019-11-29 | 2023-06-23 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理システム |
JP7519923B2 (ja) * | 2021-01-12 | 2024-07-22 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法、および基板処理システム |
JP2022107898A (ja) * | 2021-01-12 | 2022-07-25 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法、および基板処理システム |
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2021
- 2021-03-17 JP JP2021043858A patent/JP7548671B2/ja active Active
-
2022
- 2022-03-04 KR KR1020220027979A patent/KR102676994B1/ko active Active
- 2022-03-07 CN CN202210223312.3A patent/CN115116892A/zh active Pending
- 2022-03-11 US US17/692,754 patent/US20220301911A1/en active Pending
-
2024
- 2024-06-11 KR KR1020240075524A patent/KR20240093414A/ko active Pending
- 2024-08-19 JP JP2024137761A patent/JP2024161527A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018504784A (ja) | 2015-01-23 | 2018-02-15 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 半導体処理設備 |
JP2018198305A (ja) | 2017-05-23 | 2018-12-13 | 東京エレクトロン株式会社 | 真空搬送モジュール及び基板処理装置 |
JP2019523367A (ja) | 2017-06-08 | 2019-08-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 閉鎖装置、閉鎖装置付き真空システム、及び閉鎖装置の操作方法 |
JP2023130880A (ja) | 2022-03-08 | 2023-09-21 | 東京エレクトロン株式会社 | 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2024161527A (ja) | 2024-11-19 |
US20220301911A1 (en) | 2022-09-22 |
CN115116892A (zh) | 2022-09-27 |
KR102676994B1 (ko) | 2024-06-24 |
KR20220130014A (ko) | 2022-09-26 |
JP2022143380A (ja) | 2022-10-03 |
KR20240093414A (ko) | 2024-06-24 |
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