JP7547867B2 - Resin composition, resin film with carrier using same, resin substrate, prepreg, metal-clad laminate, printed wiring board, and semiconductor device - Google Patents

Description

The present invention relates to a resin composition, a resin film with a carrier, a resin substrate, a prepreg, a metal-clad laminate, a printed wiring board, and a semiconductor device that use the resin composition.

Various developments have been made so far regarding resin compositions for use in printed wiring boards. For example, the technology described in Patent Document 1 is known as an example of this type of technology. Patent Document 1 describes a polyphenylene ether resin composition that contains a modified polyphenylene ether copolymer, a crosslinking curing agent, and an inorganic filler (Table 1 of Patent Document 1).

JP 2016-113543 A

However, as a result of the inventor's investigations, it was found that there is room for improvement in terms of high flame retardancy and low linear expansion in the resin composition described in Patent Document 1.

In the resin composition of Patent Document 1, a general phosphorus-based flame retardant is used to improve flame retardancy. However, when a phosphorus-based flame retardant is used, there is a risk that phosphoric acid may be eluted from the component using the resin composition, which may cause wiring corrosion and reduce the insulation reliability of the printed wiring board.

In view of the above circumstances, the present inventors have investigated flame retardants that can replace phosphorus-based flame retardants and have found that by using an appropriate nitrogen-based flame retardant, it is possible to obtain a desired flame retardancy while suppressing phosphoric acid elution.
As a result of further intensive research based on this knowledge, the inventors discovered that by using a methylolmelamine-based compound as a nitrogen-based flame retardant, it is possible to improve the flame retardancy of the cured product of a resin composition for circuit boards while reducing its linear expansion coefficient, thereby completing the present invention.

According to the present invention,
A resin composition for a circuit board, comprising:
Polyphenylene ether,
a crosslinking agent reactive with the polyphenylene ether;
A filler material;
A nitrogen-based flame retardant,
The nitrogen-based flame retardant contains one or more selected from the group consisting of methylolmelamine compounds, derivatives thereof, and condensates thereof.
A resin composition is provided.

Further, according to the present invention,
A carrier substrate;
There is provided a resin film with a carrier, comprising: a resin film formed on the carrier base material and made of the above-mentioned resin composition.

Further, according to the present invention,
There is provided a resin substrate having an insulating layer made of a cured product of the above-mentioned resin composition.

Further, according to the present invention,
A prepreg is provided which comprises a fibrous substrate in the above resin composition.

Further, according to the present invention,
There is provided a metal-clad laminate comprising a resin film made of the above resin composition, the above resin substrate, or the above prepreg, and a metal layer disposed on at least one surface of the resin film.

Further, according to the present invention,
A printed wiring board is provided in which a circuit layer is formed on the surface of the metal-clad laminate.

Further, according to the present invention,
The above printed wiring board;
and a semiconductor element mounted on a circuit layer of the printed wiring board or embedded in the printed wiring board.

The present invention provides a resin composition having excellent flame retardancy and low linear expansion, and a resin film with a carrier, a resin substrate, a prepreg, a metal-clad laminate, a printed wiring board, and a semiconductor device using the resin composition.

FIG. 2 is a cross-sectional view showing an example of the configuration of a resin film with a carrier in the present embodiment. 1 is a cross-sectional view showing an example of a configuration of a printed wiring board according to an embodiment of the present invention. 1 is a cross-sectional view showing an example of a configuration of a semiconductor device according to an embodiment of the present invention.

The following describes an embodiment of the present invention with reference to the drawings. Note that in all drawings, similar components are given similar reference symbols and descriptions are omitted where appropriate. Also, the drawings are schematic and do not correspond to the actual dimensional ratios.

The resin composition of this embodiment is outlined below.

The resin composition of the present embodiment contains polyphenylene ether, a crosslinking agent reactive with the polyphenylene ether, a filler, and a nitrogen-based flame retardant, and is configured so that the nitrogen-based flame retardant contains one or more members selected from the group consisting of methylol melamine compounds, derivatives thereof, and condensates thereof.
Such a resin composition is a resin composition for circuit boards, which is used to form a member that constitutes at least a part of a circuit board.

According to the findings of the present inventors, it has been found that by using a methylolmelamine-based compound (a general term for methylolmelamine compounds, their derivatives, and condensates thereof) as a nitrogen-based flame retardant in a resin composition containing polyphenylene ether, a crosslinking agent, and a filler, it is possible to improve the flame retardancy of the cured product of the flame-retardant resin composition and reduce the linear expansion coefficient.

Although the detailed mechanism is unclear, the above methylolmelamine compounds are moderately compatible with polymer components such as polyphenylene ether, and undergo crosslinking reactions with hydroxyl groups and the like generated by ring-opening of hydroxyl groups and epoxy groups contained in polyphenylene ether and crosslinking agents, so that they remain without volatilizing even in high-temperature environments, and because they contain a relatively large amount of residual nitrogen atoms, it is believed that the flame retardancy of the cured product of the resin composition to which they are added is increased, and the linear expansion coefficient is reduced even at relatively high temperatures.

In this embodiment, the insulating layer in the printed wiring board may be an insulating member that constitutes the printed wiring board, such as a core layer, a build-up layer (interlayer insulating layer), or a solder resist layer.

Examples of the printed wiring board include a printed wiring board having a core layer, a build-up layer (interlayer insulating layer), and a solder resist layer, a printed wiring board without a core layer, a coreless substrate used in a panel package process (PLP), and a MIS (molded interconnect substrate) substrate.

The cured resin film made of the resin composition of this embodiment can be suitably used for build-up layers such as build-up layers in printed wiring boards that do not have a core layer, build-up layers in coreless substrates used in PLP, build-up layers in MIS substrates, etc. In addition, it may be used for build-up layers that constitute a large-area printed wiring board used to simultaneously create multiple semiconductor packages, and can also be applied to build-up layers that constitute a printed wiring board in a system to which a large current is supplied.

Each component of the resin composition of this embodiment is described in detail below.

(Polyphenylene ether)
The resin composition contains polyphenylene ether, which makes it possible to realize an insulating layer having a low dielectric constant and a low dielectric loss tangent, thereby making it possible to provide a circuit board having excellent high frequency characteristics.
The polyphenylene ether is not particularly limited as long as it contains, in the molecule, one or more functional groups capable of undergoing a crosslinking reaction with a crosslinking agent.

An example of a polyphenylene ether may include one or more polymers having a structural unit represented by the following general formula (1):

In the above general formula (1), R ₁ , R ₂ , R ₃ , and R ₄ may be the same or different and represent any one selected from the group consisting of a hydrogen atom, a halogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, an optionally substituted alkynyl group, an optionally substituted aryl group, an optionally substituted aralkyl group, and an optionally substituted alkoxy group.

The halogen atom may be, for example, a fluorine atom, a chlorine atom, or a bromine atom. Chlorine and bromine atoms are preferred.

The "alkyl group" in the above-mentioned optionally substituted alkyl group is, for example, a linear or branched alkyl group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms. More specifically, examples include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, and a hexyl group, and more preferably a methyl group or an ethyl group.

The "alkenyl group" of the above-mentioned optionally substituted alkenyl group includes, for example, ethenyl group, 1-propenyl group, 2-propenyl group, 3-butenyl group, pentenyl group, and hexenyl group, with ethenyl group and 1-propenyl group being more preferred.

The "alkynyl group" of the above-mentioned optionally substituted alkynyl group includes, for example, an ethynyl group, a 1-propynyl group, a 2-propynyl (propargyl) group, a 3-butynyl group, a pentynyl group, and a hexynyl group, and is more preferably an ethynyl group, a 1-propynyl group, or a 2-propynyl (propargyl) group.

The "aryl group" of the above-mentioned optionally substituted aryl group includes, for example, a phenyl group, a naphthyl group, etc., and a phenyl group is more preferable.

The "aralkyl group" of the above-mentioned optionally substituted aralkyl group includes, for example, a benzyl group, a phenethyl group, a 2-methylbenzyl group, a 4-methylbenzyl group, an α-methylbenzyl group, a 2-vinylphenethyl group, a 4-vinylphenethyl group, etc., with a benzyl group being more preferred.

The "alkoxy group" of the above-mentioned alkoxy group which may be substituted is, for example, a linear or branched alkoxy group having from 1 to 6 carbon atoms, preferably from 1 to 3 carbon atoms. Examples include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a sec-butoxy group, a tert-butoxy group, a pentyloxy group, a hexyloxy group, etc., and a methoxy group or an ethoxy group is more preferable.

When the above alkyl groups, aryl groups, alkenyl groups, alkynyl groups, aralkyl groups and alkoxy groups are substituted, they may have one or more substituents.
Examples of such a substituent include halogen atoms (e.g., fluorine, chlorine, and bromine atoms), alkyl groups having 1 to 6 carbon atoms (e.g., methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, and hexyl), aryl groups (e.g., phenyl and naphthyl groups), alkenyl groups (e.g., ethenyl, 1-propenyl, and 2-propenyl groups), alkynyl groups (e.g., ethynyl, 1-propynyl, and 2-propynyl groups), aralkyl groups (e.g., benzyl and phenethyl groups), and alkoxy groups (e.g., methoxy and ethoxy groups).

The polyphenylene ether may also have a structural unit represented by the following general formula (1a):

In the above general formula (1a), R ₁₁ , R ₁₂ , R ₁₃ , R ₁₄ , R ₁₅ , R ₁₆ , R ₁₇ and R ₁₈ may be the same or different and are a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and -A- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

The polyphenylene ether may include modified polyphenylene ethers that are functionalized in whole or in part with ethylenically unsaturated groups such as vinylbenzyl groups, epoxy groups, amino groups, hydroxyl groups, mercapto groups, carboxyl groups, silyl groups, and the like.

In addition, it is preferable that the polyphenylene ether has a hydroxy group, an epoxy group, or an ethylenically unsaturated group at both ends. Examples of the ethylenically unsaturated group include alkenyl groups such as ethenyl, allyl, methacrylic, propenyl, butenyl, hexenyl, and octenyl groups, cycloalkenyl groups such as cyclopentenyl and cyclohexenyl groups, and alkenylaryl groups such as vinylbenzyl and vinylnaphthyl groups. In addition, both ends may be the same functional group or different functional groups.

The weight average molecular weight of the polyphenylene ether is preferably 500 to 5000, more preferably 1000 to 4000. By making the weight average molecular weight of the polyphenylene ether equal to or greater than the lower limit, the flexibility of the resulting resin layer can be improved. On the other hand, by making the weight average molecular weight of component (A) equal to or less than the upper limit, the solubility in the chemical solution can be improved.

The polyphenylene ether content is 2 to 30% by weight, preferably 2.5 to 25% by weight, and more preferably 3 to 20% by weight, based on 100% by weight of the solid content of the resin composition. By making the content equal to or greater than the lower limit, low dielectric properties can be achieved. By making the content equal to or less than the upper limit, resin residue can be suppressed.

In this embodiment, the solid content of the resin composition refers to the non-volatile content in the resin composition, and refers to the remainder excluding volatile components such as water and solvent. When a solvent is included, the content relative to the total solid content of the resin composition refers to the content relative to the total solid content (100% by weight) of the resin composition excluding the solvent.

(Crosslinking Agent)
The resin composition includes a crosslinking agent that reacts with the polyphenylene ether. The crosslinking agent may include at least one of an addition polymerization type and a radical polymerization type.

The crosslinking agent includes at least one or more selected from the group consisting of maleimide compounds, cyanate ester resins, phenolic resins, epoxy resins, and compounds having two or more carbon-carbon unsaturated double bonds in one molecule.

Maleimide compounds, cyanate ester resins, phenolic resins, and epoxy resins can form crosslinks between the functional groups contained in these molecules and the functional groups of polyphenylene ether.

For example, a maleimide compound may be used in combination with a polyphenylene ether having an ethylenically unsaturated group at both ends and/or in -A- in general formula (1a).
Also, at least one of a cyanate ester resin, a phenol resin and an epoxy resin may be used in combination with a polyphenylene ether having hydroxy groups at both ends and/or in -A- in general formula (1a).

The maleimide group of the maleimide compound has a planar structure of a five-membered ring, and the double bond of the maleimide group is highly polar and prone to intermolecular interactions, so it exhibits strong intermolecular interactions with maleimide groups, benzene rings, and other compounds having planar structures, and can suppress molecular motion. Therefore, by including a maleimide compound in a resin composition, the linear expansion coefficient of the resulting insulating layer can be reduced, the glass transition temperature can be improved, and the heat resistance can be further improved.

The maleimide compound is preferably a bismaleimide compound having at least two maleimide groups in the molecule.
Examples of maleimide compounds having at least two maleimide groups in the molecule include compounds having two maleimide groups in the molecule, such as 4,4'-diphenylmethane bismaleimide, m-phenylene bismaleimide, p-phenylene bismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane, 4-methyl-1,3-phenylene bismaleimide, N,N'-ethylene dimaleimide, N,N'-hexamethylene dimaleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, and bisphenol A diphenyl ether bismaleimide; and polymaleimide compounds having three or more maleimide groups in the molecule, such as polyphenylmethane maleimide.
These may be used alone or in combination of two or more.

The bismaleimide compound may include, for example, a compound shown in the following general formula (10). These may be used alone or in combination of two or more types.

（上記一般式（１０）中、ｎ_１は０以上１０以下の整数であり、Ｘ_１はそれぞれ独立に炭素数１以上１０以下のアルキレン基、下記式（１０ａ）で表される基、下記（１０ｂ）で表される基、式「－ＳＯ_２－」で表される基、「－ＣＯ－」で表される基、酸素原子または単結合であり、Ｒ_１はそれぞれ独立に炭素数１以上６以下の炭化水素基、又はフェニル基であり、ａはそれぞれ独立に０以上４以下の整数であり、ｂはそれぞれ独立に０以上３以下の整数である。）

(In the above general formula (10), n ₁ is an integer of 0 or more and 10 or less, X ₁ is each independently an alkylene group having 1 to 10 carbon atoms, a group represented by the following formula (10a), a group represented by the following formula (10b), a group represented by the formula "-SO ₂ -", a group represented by the formula "-CO-", an oxygen atom or a single bond, R ₁ is each independently a hydrocarbon group having 1 to 6 carbon atoms or a phenyl group, a is each independently an integer of 0 to 4, and b is each independently an integer of 0 to 3.)

（式（１０ａ）中、Ｙは芳香族環を有する炭素数６以上３０以下の炭化水素基であり、ｎ_２は０以上の整数である。

In formula (10a), Y is a hydrocarbon group having an aromatic ring and having 6 to 30 carbon atoms, and _n2 is an integer of 0 or more.

The bismaleimide compound may include a bismaleimide having a biphenylaralkyl skeleton, such as the compound represented by the above general formula (10) in which X ₁ has the above (10b).

The cyanate ester resin is not particularly limited, but can be obtained, for example, by reacting a halogenated cyanide compound with a phenol or naphthol, and prepolymerizing it by a method such as heating as necessary. Commercially available products prepared in this manner can also be used.

Examples of cyanate ester resins include bisphenol cyanate ester resins such as novolac cyanate ester resins, bisphenol A cyanate ester resins, bisphenol E cyanate ester resins, and tetramethyl bisphenol F cyanate ester resins; naphthol aralkyl cyanate ester resins obtained by reacting naphthol aralkyl phenol resins with cyanogen halides; dicyclopentadiene cyanate ester resins; and biphenyl alkyl cyanate ester resins. Among these, it is preferable to have a bisphenol A skeleton or a novolac skeleton, and specifically, bisphenol A cyanate ester resins, novolac cyanate ester resins, and naphthol aralkyl cyanate ester resins are preferred, and novolac cyanate ester resins are more preferred. Among these, the use of bisphenol A cyanate ester resins provides a good low dielectric tangent. The reason for this is that bisphenol A-type cyanate ester resin has few crosslinking points, so when the triazine ring is formed, unreacted cyanate groups are less likely to remain, making it easier to maintain good dielectric properties.

Examples of phenolic resins include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, bisphenol A novolac resin, and triazine skeleton-containing phenol novolac resin; aralkyl-type phenolic resins such as biphenyl aralkyl-type phenolic resin; and resol-type phenolic resins such as unmodified resol phenolic resin and oil-modified resol phenolic resin modified with tung oil, linseed oil, walnut oil, etc.

Epoxy resins include, for example, bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylenediisopridiene) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisopridiene) bisphenol type epoxy resin), and bisphenol Z type epoxy resin (4,4'-cyclohexydiene bisphenol type epoxy resin); phenol novolac type epoxy resin, cresol novolac type epoxy resin, and tetraphenol group ethane type novolac type epoxy resin. resins, novolac-type epoxy resins such as novolac-type epoxy resins having a condensed ring aromatic hydrocarbon structure; biphenyl-type epoxy resins; aralkyl-type epoxy resins such as xylylene-type epoxy resins and biphenylaralkyl-type epoxy resins; naphthalene-type epoxy resins such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene diol-type epoxy resins, difunctional to tetrafunctional naphthalene-type epoxy resins, binaphthyl-type epoxy resins, and naphthalenearalkyl-type epoxy resins; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; and fluorene-type epoxy resins.

Compounds having two or more carbon-carbon unsaturated double bonds in one molecule that have a melting point of 30°C or less and are compatible with polyphenylene ether can be used.

An example of a compound having two or more carbon-carbon unsaturated double bonds in one molecule may include a compound represented by the following general formula (2). These may be used alone or in combination of two or more types.

In the above formula (2), m is an integer of 1 to 3, n is 0 or 1, and R ¹ to R ³ independently represent a hydrogen atom or an alkyl group. X represents an arylene group, a dicyclopentadienyl group, or an isocyanurate group. Y represents a group represented by the following (2a) or (2b).

Examples of compounds having two or more carbon-carbon unsaturated double bonds in one molecule include trialkenyl isocyanurate compounds such as triallyl isocyanurate (TAIC), polyfunctional methacrylate compounds having two or more methacrylic groups in the molecule, polyfunctional acrylate compounds having two or more acrylic groups in the molecule, and vinylbenzyl compounds such as styrene and divinylbenzene having vinylbenzyl groups in the molecule. Among these, preferred are trialkenyl isocyanurate compounds, polyfunctional acrylate compounds, polyfunctional methacrylate compounds, and divinylbenzene compounds.

A compound having two or more carbon-carbon unsaturated double bonds in the molecule may be used in combination with a compound having one carbon-carbon unsaturated double bond in the molecule. Specific examples of compounds having one carbon-carbon unsaturated double bond in the molecule include compounds having one vinyl group in the molecule (monovinyl compounds).

The content of the crosslinking agent is, for example, 10 to 70% by weight, preferably 15 to 60% by weight, and more preferably 20 to 50% by weight, based on 100% by weight of the solid content of the resin composition. By making the content equal to or greater than the lower limit, low dielectric properties can be achieved. By making the content equal to or less than the upper limit, resin residue can be suppressed.

The content of at least one of the maleimide compound, cyanate ester resin, phenolic resin, and epoxy resin is, for example, 10 to 50% by weight, preferably 11 to 40% by weight, and more preferably 12 to 30% by weight, based on 100% by weight of the solid content of the resin composition. By making it equal to or greater than the lower limit, low dielectric properties can be achieved. By making it equal to or less than the upper limit, resin residue can be suppressed.

The content of the compound having two or more carbon-carbon unsaturated double bonds in the molecule is, for example, 10 to 50% by weight, preferably 11 to 40% by weight, and more preferably 12 to 30% by weight, based on 100% by weight of the solid content of the resin composition. By making the content equal to or greater than the lower limit, low dielectric properties can be achieved. By making the content equal to or less than the upper limit, resin residue can be suppressed.

(Reaction initiator)
The resin composition may contain a reaction initiator as necessary.
The reaction initiator is not particularly limited as long as it can promote the reaction between the polyphenylene ether and the crosslinking agent. The reaction initiator can promote the polymerization reaction of the radical polymerization type crosslinking agent.

Reaction initiators include organic peroxides, dihalogens, azo compounds, and combinations of oxidizing and reducing agents.

Examples of reaction initiators include organic peroxides such as α,α'-bis(t-butylperoxy-m-isopropyl)benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, 3,3',5,5'-tetramethyl-1,4-diphenoquinone, chloranil, 2,4,6-tri-t-butylphenoxyl, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile. If necessary, a carboxylate metal salt or the like can be used in combination. By doing so, the curing reaction can be further accelerated. Among these, α,α'-bis(t-butylperoxy-m-isopropyl)benzene is preferably used. Since α,α'-bis(t-butylperoxy-m-isopropyl)benzene has a relatively high reaction initiation temperature, it can suppress the acceleration of the curing reaction at the time when curing is not required, such as when drying the prepreg, and can suppress the deterioration of the storage stability of the polyphenylene ether resin composition. Furthermore, α,α'-bis(t-butylperoxy-m-isopropyl)benzene has low volatility and does not volatilize during drying or storage of the prepreg, providing good stability. The reaction initiator may be used alone or in combination of two or more types.

The content of the reaction initiator is 0.2 to 5% by weight, preferably 0.25 to 3% by weight, and more preferably 0.3 to 2% by weight, based on 100% by weight of the solid content of the resin composition. By making the content equal to or greater than the lower limit, low dielectric properties can be achieved. By making the content equal to or less than the upper limit, resin residue can be suppressed.

(Filling material)
The resin composition includes a filler. The filler includes at least one of an organic filler and an inorganic filler.
From the viewpoint of obtaining an appropriate elastic modulus and a low dielectric tangent, an inorganic filler may be used.

Examples of inorganic fillers include silicates such as talc, calcined clay, uncalcined clay, mica, and glass; oxides such as titanium oxide, alumina, boehmite, silica, and fused silica; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; and titanates such as strontium titanate and barium titanate.
Among these, talc, alumina, glass, silica, mica, aluminum hydroxide, and magnesium hydroxide are preferable, and from the viewpoint of achieving both an elastic modulus, a low dielectric tangent, and a reduction in resin residue, silica is more preferable.
Among these, one type may be used alone, or two or more types may be used in combination.

The average particle diameter of the inorganic filler is preferably 0.01 μm or more, and more preferably 0.05 μm or more. When the average particle diameter of component (C) is equal to or more than the above lower limit, the viscosity of the varnish can be prevented from increasing, and the workability during the preparation of the insulating layer can be improved. In addition, the average particle diameter of the inorganic filler is preferably 5.0 μm or less, more preferably 2.0 μm or less, and even more preferably 1.5 μm or less. When the average particle diameter of component (C) is equal to or less than the above upper limit, phenomena such as settling of component (C) in the varnish can be prevented, and a more uniform resin layer can be obtained.

The average particle size of the inorganic filler can be determined by measuring the particle size distribution of the particles on a volume basis using, for example, a laser diffraction particle size distribution measuring device (LA-500, manufactured by HORIBA), and taking the median diameter (D ₅₀ ) as the average particle size.

The inorganic filler may have a monodisperse average particle size, or may have a polydisperse average particle size. Furthermore, one or more types of monodisperse and/or polydisperse average particle sizes may be used in combination.

As the inorganic filler, silica particles are preferred, with silica particles having an average particle size of 5.0 μm or less being preferred, silica particles having an average particle size of 0.1 μm to 4.0 μm being more preferred, and silica particles having an average particle size of 0.2 μm to 2.0 μm being even more preferred. This can further improve the filling property of component (C).

The content of the filler is 45 to 70% by weight, preferably 48 to 68% by weight, and more preferably 50 to 65% by weight, based on 100% by weight of the solid content of the resin composition. By making the content equal to or greater than the lower limit, low dielectric properties and good elastic modulus can be achieved. By making the content equal to or less than the upper limit, the handleability of the composition can be improved.
The content of the inorganic filler may be in the same range as the above-mentioned range of the content of the filler.

(Nitrogen-based flame retardant)
The resin composition contains a nitrogen-based flame retardant.
The nitrogen-based flame retardant includes one or more selected from the group consisting of methylolmelamine compounds, derivatives thereof, and condensates thereof. Among these, it is preferable to use a methylolmelamine compound and/or a condensate thereof.

The methylolmelamine compound contains one or more methylolmelamines having 1 to 6 methylol groups in one molecule, that is, melamine-formaldehyde initial condensates.
The methylolmelamine compound may be a mixture containing two or more methylolmelamines selected from the group consisting of monomethylolmelamine, dimethylolmelamine, trimethylolmelamine, tetramethylolmelamine, pentamethylolmelamine, and hexamethylolmelamine.
The methylol melamine compound may be constituted in a powder form at 25°C.

Methylolmelamine is obtained by addition reaction of 1 to 6 formaldehyde groups with 1 to 3 amino groups in melamine to replace at least one H of _--NH.sub.2 with _--CH.sub.2OH , that is, by methylolation of melamine.

In the case of derivatives of methylol melamine compounds, the melamine may have a functional group other than the methylol group, for example, an alkyl ether group formed by adding an alcohol to the methylol group.

Condensates of methylol melamine compounds include melamine-formaldehyde resins obtained by polycondensation of one or more methylol melamines (melamine-formaldehyde initial condensates) with formaldehyde.

The methylol melamine compound, its derivative, and its condensate may be composed of a simple substance such as the methylol melamine compound, its derivative, or its condensate, or may be composed of a composite with another material.
An example of a composite material is an inorganic material such as silica.
For example, a composite of a condensate of a methylolmelamine compound (melamine resin) and silica may be in the form of particles. A part or the entire surface layer of the composite particle may be composed of the condensate of a methylolmelamine compound.

The condensation product of the methylolmelamine compound may be constituted in a particulate form at 25°C.
The particulate condensate may have an average particle size of, for example, 0.1 μm to 50 μm, preferably 0.1 μm to 10 μm.

The lower limit of the content of the methylolmelamine compound and/or its condensate is, for example, preferably 1.0% by mass or more, more preferably 2.0% by mass or more, and even more preferably 3.5% by mass or more, based on 100% by mass of the solid content of the resin composition. This makes it possible to improve the flame retardancy of the insulating layer while reducing the linear expansion coefficient. It is also possible to increase the hot elastic modulus.
On the other hand, the upper limit of the content of the methylolmelamine compound and/or its condensate is, for example, preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, based on 100% by mass of the solid content of the resin composition. This allows for a balance of various physical properties such as low dielectric properties. In addition, when the resin composition is in the form of a varnish, the deterioration of its coatability can be suppressed.

The resin composition of the present embodiment may contain other additives, if necessary, in addition to the above components.
Examples of other additives include curing accelerators, silane coupling agents, tackifiers, surfactants, thermoplastic resins, pigments, dyes, defoamers, leveling agents, UV absorbers, foaming agents, antioxidants, heat stabilizers, antistatic agents, other flame retardants, ion traps, lubricants, dispersants, etc. These may be used alone or in combination of two or more kinds, as long as the object of the present invention is not impaired.
The resin composition may be configured so as not to contain a phosphorus-based flame retardant.

The characteristics of the resin composition of this embodiment are described below.

The dielectric loss tangent of the cured resin composition measured at 25°C and 1 GHz is, for example, 0.0050 or less, preferably 0.0045 or less, and more preferably 0.0040 or less. This makes it possible to realize an insulating layer with excellent low dielectric properties.

The dielectric constant of the cured resin composition measured at 25°C and 1 GHz is, for example, 3.90 or less, preferably 3.80 or less, and more preferably 3.75 or less. This makes it possible to realize an insulating layer with excellent low dielectric properties.

The dielectric loss tangent of the cured resin composition measured at 25°C and 10 GHz is, for example, 0.0080 or less, preferably 0.0070 or less, and more preferably 0.0060 or less. This makes it possible to realize an insulating layer with excellent low dielectric properties.

The resin composition of this embodiment may be a varnish-like composition containing a solvent, or a film-like composition. For example, a film-like composition can be obtained by applying a varnish-like resin composition to a coating film obtained by performing a solvent removal process.

Examples of the above solvents include organic solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethylsulfoxide, ethylene glycol, cellosolve-based solvents, carbitol-based solvents, anisole, and N-methylpyrrolidone. These may be used alone or in combination of two or more.

When the resin composition is in the form of a varnish, the solid content of the resin composition may be, for example, 30% by weight or more and 80% by weight or less, and more preferably 40% by weight or more and 70% by weight or less. This results in a resin composition with excellent workability and film-forming properties.

The varnish-like resin composition can be prepared by dissolving, mixing, and stirring the above-mentioned components in a solvent using various mixers, such as those using ultrasonic dispersion, high-pressure collision dispersion, high-speed rotation dispersion, bead mill, high-speed shear dispersion, and rotation-revolution dispersion.

The resin composition of the present embodiment may be used in a form that is not particularly limited, but may be used in a resin film made of the resin composition, a resin film with a carrier in which the resin film is provided on a carrier substrate, a resin substrate having an insulating layer made of a cured product of the resin composition, a prepreg made by impregnating a fiber substrate with the resin composition, a metal-clad laminate having a metal layer disposed on one surface of the prepreg, a resin substrate having an insulating layer made of a cured product of the resin composition, a printed wiring board having a circuit layer formed on the surface of the metal-clad laminate, and the like.

(Resin film with carrier)
FIG. 1 is a cross-sectional view showing an example of the configuration of a carrier-attached resin film 100 in this embodiment.
1, the resin film 100 with a carrier of this embodiment can include a carrier base material 12 and a resin film 10 made of the above-mentioned resin composition provided on the carrier base material 12. This can improve the handleability of the resin film 10.

The resin film 100 with carrier may be in a roll shape that can be wound up, or in a rectangular or other discrete (sheet) shape.

The carrier substrate 12 may be, for example, a polymer film or a metal foil.
Examples of polymer films include, but are not limited to, polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polycarbonates, release papers such as silicone sheets, and heat-resistant thermoplastic resin sheets such as fluorine-based resins and polyimide resins.
The metal foil is not particularly limited, but may be, for example, copper and/or copper-based alloys, aluminum and/or aluminum-based alloys, iron and/or iron-based alloys, silver and/or silver-based alloys, gold and/or gold-based alloys, zinc and/or zinc-based alloys, nickel and/or nickel-based alloys, tin and/or tin-based alloys, etc. Among these, a sheet made of polyethylene terephthalate is most preferable because it is inexpensive and the peel strength can be easily adjusted. This makes it easy to peel off the sheet from the resin film 100 with the carrier with a moderate strength.

The lower limit of the thickness of the resin film 10 is not particularly limited, but may be, for example, 1 μm or more, 3 μm or more, or 5 μm or more. This allows the mechanical strength of the resin film 10 to be increased. On the other hand, the upper limit of the thickness of the resin film 10 is not particularly limited, but may be, for example, 500 μm or less, 300 μm or less, or 100 μm or less. This allows the semiconductor device to be made thinner.

The thickness of the carrier substrate 12 is not particularly limited, but may be, for example, 10 to 100 μm, or 10 to 70 μm. This provides good handleability when manufacturing the carrier-attached resin film 100, which is preferable.

The resin film 100 with a carrier may be a single layer or a multilayer, and may contain one or more types of resin film 10. When the resin sheet is a multilayer, it may be composed of the same type or different types. In addition, the resin film 100 with a carrier may have a protective film on the outermost layer side on the resin film 10.

In this embodiment, the method for forming the carrier-attached resin film 100 is not particularly limited, but for example, a method can be used in which a coating film is formed by applying a varnish-like resin composition onto the carrier substrate 12 using various coater devices, and then the coating film is appropriately dried to remove the solvent.

The resin film of this embodiment can be obtained by forming the above-mentioned resin composition in a varnish form into a film. For example, the resin film of this embodiment can be obtained by removing the solvent from a coating film obtained by applying the resin composition in a varnish form. In such a resin film, the solvent content can be 5% by weight or less based on the entire resin film. In this embodiment, the step of removing the solvent can be carried out under conditions of, for example, 100°C to 150°C and 1 minute to 5 minutes. This makes it possible to sufficiently remove the solvent while suppressing the progress of curing of the resin film containing the thermosetting resin.

(Resin substrate)
The resin substrate of the present embodiment includes an insulating layer made of the cured product of the resin composition. Such a resin substrate can be used as a printed wiring board as a coreless substrate that does not contain glass fibers.

(Prepreg)
The prepreg of the present embodiment contains a fiber base material in the above-mentioned resin composition.
The prepreg can be formed, for example, by impregnating a fiber base material with a resin composition.
Prepregs can be used as semi-cured sheet-like materials. Sheet-like materials with such structures have excellent properties such as dielectric properties and mechanical and electrical connection reliability under high temperature and humidity, and are suitable for producing insulating layers for printed wiring boards.

The method of impregnating the fiber substrate with the resin composition is not particularly limited, but examples include a method of dissolving the resin composition in a solvent to prepare a resin varnish and immersing the fiber substrate in the resin varnish, a method of applying the resin varnish to the fiber substrate using various coaters, a method of spraying the resin varnish onto the fiber substrate using a sprayer, and a method of laminating both sides of the fiber substrate with the resin film made of the resin composition.

The fiber substrate may be, but is not limited to, a glass fiber substrate such as a woven glass fabric or a nonwoven glass fabric; a polyamide resin fiber such as a polyamide resin fiber, an aromatic polyamide resin fiber, or a wholly aromatic polyamide resin fiber; a polyester resin fiber such as a polyester resin fiber, an aromatic polyester resin fiber, or a wholly aromatic polyester resin fiber; a synthetic fiber substrate made of a woven or nonwoven fabric mainly composed of a polyimide resin fiber or a fluororesin fiber; a paper substrate mainly composed of a kraft paper, a cotton linter paper, or a mixed paper of a linter and a kraft pulp; etc. Any of these may be used. Among these, a glass fiber substrate is preferable. This allows a resin substrate to be obtained that is low in water absorption, high in strength, and low in thermal expansion.

The thickness of the fiber base material is not particularly limited, but is preferably 5 μm to 150 μm, more preferably 10 μm to 100 μm, and even more preferably 12 μm to 90 μm. By using a fiber base material having such a thickness, the handleability during prepreg production can be further improved.
When the thickness of the fiber substrate is equal to or less than the upper limit, the impregnation of the resin composition in the fiber substrate is improved, and the occurrence of strand voids and deterioration of insulation reliability can be suppressed. In addition, the formation of through holes by carbon dioxide, UV, excimer, or other lasers can be facilitated. In addition, when the thickness of the fiber substrate is equal to or more than the lower limit, the strength of the fiber substrate and prepreg can be improved. As a result, the handling property can be improved, the preparation of prepreg can be facilitated, and warping of the substrate can be suppressed.

As the glass fiber substrate, for example, a glass fiber substrate formed from one or more types of glass selected from E glass, S glass, D glass, T glass, NE glass, UT glass, L glass, HP glass, and quartz glass is preferably used.

In this embodiment, the prepreg can be used to form, for example, an insulating layer in a core layer or a build-up layer in a printed wiring board.
When the prepreg is used to form an insulating layer in a core layer of a printed wiring board, for example, two or more prepregs can be stacked and the resulting laminate can be heat-cured to form an insulating layer for the core layer.

(Metal-clad laminate)
The metal-clad laminate of the present embodiment has a structure in which a metal layer is disposed on at least one surface of the resin film made of the resin composition, the resin substrate, or the prepreg.

A method for producing a metal-clad laminate using a prepreg is, for example, as follows.
A metal foil is placed on both the upper and lower sides or one side of the outer side of a prepreg or a laminate of two or more prepregs, and these are bonded under high vacuum conditions using a laminator or Becquerel device, or a metal foil is placed on both the upper and lower sides or one side of the outer side of the prepreg as is. When two or more prepregs are laminated, a metal foil is placed on both the upper and lower sides or one side of the outermost side of the laminated prepregs. Next, the laminate of the prepreg and the metal foil is heated and pressurized to obtain a metal-clad laminate. Here, it is preferable to continue pressing until the end of cooling during the heating and pressurizing.
The above-mentioned metal-clad laminate manufacturing method may employ a method of hot-press molding using the above-mentioned resin film or the above-mentioned resin substrate instead of the above-mentioned prepreg.

Examples of metals constituting the metal foil include copper, copper-based alloys, aluminum, aluminum-based alloys, silver, silver-based alloys, gold, gold-based alloys, zinc, zinc-based alloys, nickel, nickel-based alloys, tin, tin-based alloys, iron, iron-based alloys, Fe-Ni-based alloys such as Kovar (trade name), 42 alloy, Invar, and Super Invar, W, and Mo. Among these, the metal constituting the metal foil 105 is preferably copper or a copper alloy because it has excellent conductivity, is easy to form a circuit by etching, and is inexpensive. That is, copper foil is preferable as the metal foil 105.
As the metal foil, a metal foil with a carrier or the like can also be used.
The thickness of the metal foil is preferably 0.5 μm or more and 20 μm or less, and more preferably 1.5 μm or more and 18 μm or less.

(Printed wiring board)
The printed wiring board of the present embodiment may include the above-mentioned metal-clad laminate having a circuit layer formed on the surface thereof.
Specifically, the printed wiring board may include an insulating layer constituted by the cured product of the resin composition, the cured product of the resin film, the resin substrate, and the cured product of the prepreg, and a circuit pattern (circuit layer) formed on the insulating layer.

An example of a printed wiring board 300 according to the present embodiment will be described with reference to FIG.
2 includes an insulating layer 301 (core layer) and a metal layer 303 (circuit layer) formed on the insulating layer 301. This printed wiring board 300 may have a multilayer circuit structure in which a plurality of circuit layers are stacked with an interlayer insulating layer interposed therebetween.
The printed wiring board 300 may further include an insulating layer 401 (solder resist layer).

In the printed wiring board 300, the core layer and the interlayer insulating layer are composed of either the cured product of the resin composition, the cured product of the resin film, the resin substrate, or an insulating layer composed of the cured product of the prepreg.

The printed wiring board 300 may be a single-sided printed wiring board, a double-sided printed wiring board, or a multi-layer printed wiring board. A double-sided printed wiring board is a printed wiring board in which metal layers 303 are laminated on both sides of an insulating layer 301. A multi-layer printed wiring board may be a printed wiring board in which two or more build-up layers are laminated on an insulating layer 301, which is a core layer, by a plated through-hole method, a build-up method, or the like.

In this embodiment, the metal layer 303 may be, for example, a circuit pattern or an electrode pad. The metal layer 303 may have, for example, a metal laminate structure of a metal foil 105 and an electrolytic metal plating layer 309.

The metal layer 303 is formed by, for example, a SAP (semi-additive process) method on the surface of the metal foil 105 that has been treated with a chemical solution or plasma, or an insulating layer (e.g., insulating layer 301) made of the cured resin film of this embodiment. For example, after applying an electroless metal plating film 308 to the metal foil 105 or insulating layers 301, 305, non-circuit forming portions are protected with a plating resist, and an electrolytic metal plating layer 309 is formed by electrolytic plating, and the plating resist is removed and the electrolytic metal plating layer 309 is patterned by flash etching to form the metal layer 303.

In this embodiment, the via holes 307 may be holes for electrically connecting layers, and may be either through holes or non-through holes. The via holes 307 may be formed by embedding a metal. This embedded metal may have a structure covered with an electroless metal plating film 308.

The printed wiring board 300 of this embodiment can be a resin board that does not contain glass fibers. For example, the insulating layer 301, which is the core layer, can be configured not to contain glass fibers. Even in a semiconductor package using such a resin board, the linear expansion coefficient of the cured resin film can be reduced, so package warpage can be sufficiently suppressed.

(Semiconductor Package)
Next, a description will be given of the semiconductor device 400 of this embodiment.
The semiconductor device 400 of this embodiment can include a printed wiring board 300 and a semiconductor element 407 mounted on a circuit layer of the printed wiring board 300 or embedded in the printed wiring board 300 .
The semiconductor element 407 may be, for example, a light emitting diode (LED).

For example, a semiconductor device 400 shown in FIG. 3 has a structure in which a semiconductor element 407 is mounted on a circuit layer (metal layer 303) of a printed wiring board 300.
The semiconductor package may have a flip-chip structure in which the semiconductor element 407 is electrically connected to the printed wiring board 300 via the solder bumps 410 and the metal layer 303 .

The above describes the embodiments of the present invention, but these are merely examples of the present invention, and various configurations other than those described above can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of the present invention are included in the present invention.

The present invention will be described in detail below with reference to examples, but the present invention is not limited to the description of these examples.

<Preparation of Resin Composition>
Raw material components such as polyphenylene ether, crosslinking agent, filler, nitrogen-based flame retardant, and reaction initiator were dissolved or dispersed in the solid content ratio shown in Table 1 below, and the non-volatile content was adjusted to 70 mass % with methyl ethyl ketone. The mixture was then stirred using a high-speed stirrer to prepare a resin varnish.

The information on the raw material components in Table 1 is shown below.
(Filling material)
Silica particles 1 (manufactured by Admatechs Co., Ltd., SC4050-KNT, average particle size: 1.1 μm)
(Silane coupling agent)
Silane coupling agent 1: vinyltrimethoxysilane (manufactured by Shin-Etsu Silicones, KBM-1003)
(Polyphenylene ether)
Polyphenylene ether 1: polyphenylene ether resin having methacrylate groups at both ends (SABIC Japan, SA9000, weight average molecular weight Mw = 1,700)
(Adhesiveness imparting agent)
Adhesive agent 1: Coumarone resin (manufactured by Nippon Paint Chemical Co., Ltd., V-120S)
Adhesion promoter 2: vinyl group-containing polybutadiene (manufactured by Nippon Soda Co., Ltd., B-1000)
(Crosslinking Agent)
Maleimide compound 1: bismaleimide having a biphenylaralkyl skeleton (manufactured by Nippon Kayaku Co., Ltd., MIR-3000-70T)
Compound 1 having two or more carbon-carbon unsaturated double bonds in one molecule: Triallyl isocyanurate (manufactured by Mitsubishi Chemical Corporation, TAIC)
(Surfactant)
Surfactant 1: Acrylic surfactant (BYK-361N, manufactured by BYK-Chemie)
(Reaction initiator)
Organic peroxide 1: 1,3-bis(butylperoxyisopropyl)benzene (Perbutyl P, manufactured by NOF Corporation)
(Nitrogen-based flame retardant)
Methylolmelamine 1: Water-soluble methylolmelamine (Nippon Carbide Industries, R-260, powder form)

The resulting resin composition (resin varnish) was evaluated for the following items:

<UL94V Test>
(Preparation of prepregs)
The obtained resin varnish was impregnated into a glass woven fabric (cloth type #1078, E glass, basis weight 47.5 g/m ² ) using a coating device, and dried for 4 minutes in a hot air dryer at 150° C. to obtain a prepreg with a thickness of 80 μm.
The obtained prepreg was heated at 255° C. for 2 hours to be cured, and a resin plate (test piece) having a thickness of 80 μm was obtained.
The obtained test pieces were cut to 127 mm x 12.7 mm, and then measured in accordance with the UL-94 vertical test. The number of test pieces that were completely burned out of the five pieces was counted.

(Preparation of copper-clad laminate)
Ultra-thin copper foil (Microthin FL, 1.5 μm, manufactured by Mitsui Mining & Smelting Co., Ltd.) was laminated on both sides of the prepreg obtained above (Preparation of prepreg), and heated and pressurized for 2 hours at a pressure of 3 MPa and a temperature of 225° C. to obtain a laminate with metal foil. The thickness of the core layer (portion consisting of the resin substrate) of the obtained laminate with metal foil was 0.080 mm.

<Copper peel strength>
A 30 μm-thick copper plating film was formed by electroplating on a metal foil-attached laminate, and the copper peel strength (kN/m) was measured when the copper plating film was peeled off at 90 degrees in accordance with JIS C6481.

<Dielectric constant, dielectric loss tangent>
The copper foil of the metal foil-attached laminate was removed by etching, and the resulting sample was used to measure the dielectric constant (Dk) and dielectric loss tangent (Df) at frequencies of 1 GHz and 10 GHz by a cavity resonator method.

<Elastic modulus>
The laminate with the metal foil was etched to remove the copper, and the elastic modulus (GPa) was measured at a frequency of 1 GHz and a temperature of 250° C. using a dynamic viscoelasticity device in accordance with JIS C-6481 (DMA method).

<Coefficient of Linear Expansion (CTE)>
The laminate with the metal foil was etched to remove the copper, and a test piece of 4 mm x 20 mm was prepared. This was used as a sample, and the linear expansion coefficient (ppm/°C) in the ranges of 50°C to 100°C and 50°C to 150°C in the second cycle was measured using a TMA (thermal mechanical analysis) device (TA Instruments, Q400) under conditions of a heating rate of 5°C/min, a temperature range of 30 to 300°C, 10°C/min, and a load of 5 g.

The resin compositions of Examples 1 to 3 showed superior results in terms of high flame retardancy and low linear expansion compared to Comparative Example 1. The resin compositions of these Examples can be suitably used for components that constitute circuit boards.

Reference Signs List 10 Resin film 12 Carrier substrate 100 Resin film with carrier 105 Metal foil 300 Printed wiring board 301 Insulating layer 303 Metal layer 307 Via hole 308 Electroless metal plating film 309 Electrolytic metal plating layer 400 Semiconductor device 401 Insulating layer 407 Semiconductor element 410 Solder bump

Claims (13)

A resin composition for a circuit board, comprising:
Polyphenylene ether,
a crosslinking agent reactive with the polyphenylene ether;
A filler material;
A nitrogen-based flame retardant,
The nitrogen-based flame retardant contains one or more selected from the group consisting of methylolmelamine compounds, derivatives thereof, and condensates thereof.
Resin composition. The resin composition according to claim 1,
The resin composition, wherein the polyphenylene ether contains a polymer having a structural unit represented by the following general formula (1):

(In the above general formula (1), R ₁ , R ₂ , R ₃ and R ₄ may be the same or different and represent any one selected from the group consisting of a hydrogen atom, a halogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, an optionally substituted alkynyl group, an optionally substituted aryl group, an optionally substituted aralkyl group and an optionally substituted alkoxy group.) The resin composition according to claim 1 or 2,
The resin composition, wherein the crosslinking agent comprises at least one selected from the group consisting of a maleimide compound, a cyanate ester resin, a phenolic resin, an epoxy resin, and a compound having two or more carbon-carbon unsaturated double bonds in one molecule. The resin composition according to any one of claims 1 to 3,
A resin composition comprising a reaction initiator. The resin composition according to claim 4,
The resin composition, wherein the reaction initiator comprises an organic peroxide. The resin composition according to any one of claims 1 to 5,
A resin composition, in which a cured product of the resin composition has a dielectric loss tangent of 0.0050 or less, as measured at 25°C and 1 GHz. The resin composition according to any one of claims 1 to 6,
A resin composition, wherein a cured product of the resin composition has a dielectric loss tangent of 0.0080 or less, as measured at 25°C and 10 GHz. A carrier substrate;
A resin film with a carrier, comprising: a resin film formed on the carrier base material and made of the resin composition according to any one of claims 1 to 7. A resin substrate having an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 7. A prepreg comprising a fiber substrate in the resin composition according to any one of claims 1 to 7. A metal-clad laminate comprising a resin film made of the resin composition according to any one of claims 1 to 7, a resin substrate according to claim 9, or a prepreg according to claim 10, on at least one surface of which a metal layer is disposed. A printed wiring board having a circuit layer formed on the surface of the metal-clad laminate according to claim 11. The printed wiring board according to claim 12;
a semiconductor element mounted on a circuit layer of the printed wiring board or embedded in the printed wiring board.

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