JP7547848B2 - Radiation detector - Google Patents

Description

The present invention relates to a radiation detector. More specifically, the present invention relates to a radiation detector that achieves both a lightweight product and a reduced effect on images of heat and electromagnetic fields caused by electric and electronic components in the internal electronic circuit.

2. Description of the Related Art A radiation detector (Flat Panel Detector: FPD) is known that includes a radiation detection unit including a wavelength conversion element that converts radiation into light and a photoelectric conversion element that converts the light into an electrical signal, and an electronic circuit board.
In conventional radiation detectors, the sensor panel is mainly made of glass.
For this reason, for example, when a radiation detector is placed under a subject lying on a bed and radiation is irradiated from above the subject to take an image, the weight of the subject on the radiation detector can cause the radiation detector to bend and the sensor panel inside to crack.

Furthermore, if the radiation detector is accidentally bumped or dropped while being carried around, the radiation detector may be subjected to a shock, which may result in the sensor panel being broken.
In order to solve the above problems, it is important to reduce the weight of the product and to use flexible materials.

As described above, conventional radiation detectors use glass thin film transistor (TFT) sensor panels in their radiation detection sections. However, by using flexible TFT sensor panels (also called flexible TFT sensor panels), the product can be made lighter, the impact of being dropped can be reduced, and its robustness can be improved.

However, the flexible substrate used in the flexible TFT sensor panel has a characteristic that it has a larger thermal expansion coefficient than the other constituent members because pixels are formed on the surface of the substrate.
Therefore, the inventors' investigations have revealed that when the flexible base material is subjected to heat from electric/electronic components that consume a large current and generate heat, the flexible base material may expand locally and peel off from the wavelength conversion section (e.g., the scintillator) of the radiation detector, and further, problems may arise in that thermal noise and offset occur in the pixels, affecting the image.

Other problems that emerged included:
That is, when the electric/electronic component is, for example, an inductor used in a DC-DC power supply circuit, not only heat but also an AC magnetic field is generated. The AC magnetic field acts on the pixel readout signal line, generating AC noise, and the AC current generates an induced current in the sensor signal line. This is converted into a pixel voltage value due to the impedance of the signal line, and horizontal streaks may appear in the image.
Furthermore, an AC electric field may be generated from the AC magnetic field and transmitted as noise to the pixel readout signal line via parasitic capacitance.

To solve the above problems, measures have generally been taken to reduce heat generation, such as adding a heat diffusion material as a component to diffuse the heat, inserting an insulating material to reduce heat conduction, reducing the charging current and slowing down the communication speed of the communication function, and slowing down the processing speed of the CPU and other calculations, which are trade-offs that result in longer processing times.

In addition, regarding the effects of electromagnetic fields, it has generally been the practice to reduce the adverse effects by adding high-permeability sheets or conductive plates to shield the electromagnetic fields.

Japanese Patent Application Laid-Open No. 2003-233693 discloses a technique for reducing the influence of heat and electromagnetic fields from electric and electronic components on a TFT sensor panel by using a heat insulating material and a shielding material.
However, although the metal housing and other components are used and the product is robust, there is a problem in that the product is heavy.

Patent Document 2 discloses a radiation imager in which a scintillator is optically coupled to an optical sensor array arranged on a flexible substrate, as an imager that is flexible and robust.
However, in the above imager, no consideration is given to reducing the effects of heat and electromagnetic fields.

JP 2000-116633 A JP 2004-64087 A

The present invention was made in consideration of the above problems and circumstances, and the problem to be solved is to provide a radiation detector that achieves both a lightweight product and a reduced effect on images of heat and electromagnetic fields caused by electric and electronic components in the internal electronic circuit.

In the course of investigating the causes of the above problems in order to solve the above problems, the inventors discovered that the arrangement of electric and electronic components provided in the electronic circuit board of a radiation detector has a significant effect on radiographic images, etc., and thus arrived at the present invention.
That is, the above-mentioned problems of the present invention are solved by the following means.

1. A radiation detector comprising at least a wavelength conversion unit that converts radiation into light, a radiation detection unit that is composed of a photoelectric conversion unit that converts the light into an electrical signal, and an electronic circuit board,
the photoelectric conversion unit includes a flexible substrate and has at least a plurality of semiconductor elements on a surface of the flexible substrate;
the plurality of semiconductor elements are arranged on an imaging surface of the flexible substrate that is in contact with the wavelength converting portion,
the radiation detection unit includes a support member formed of a foam on a surface facing the electronic circuit board,
the electronic circuit board having a plurality of layers;
At least one of the layers is a ground layer,
an electric/electronic component that generates heat and an electric/electronic component that generates a magnetic field when driven are provided on the same surface of the electronic circuit board;
the heat-generating electric/electronic component and the magnetic field-generating electric/electronic component are provided on a surface of the electronic circuit board opposite to the radiation detection unit ,
A radiation detector characterized in that the electronic circuit board and the radiation detection unit are fixed to opposite sides of the front and back surfaces of the foam base .

2. The radiation detector according to claim 1, wherein the ground layer is connected to the ground of the housing.

3. The radiation detector according to claim 1 or 2 , wherein the wavelength conversion section includes a scintillator.

4. The radiation detector according to any one of items 1 to 3 , wherein a cesium iodide (CsI) crystal is used for the scintillator.

5. The radiation detector according to any one of paragraphs 1 to 4, characterized in that the photoelectric conversion unit has a configuration of an optical sensor panel in which at least a plurality of photodiodes having a function of an optical sensor and a plurality of addressable thin film transistors (TFTs) are arranged on the surface of the flexible substrate.

The above-mentioned means of the present invention make it possible to provide a radiation detector that achieves both a lightweight product and a reduced effect on the image of heat and electromagnetic fields caused by electric and electronic components in the internal electronic circuit.

Although the mechanism by which the effects of the present invention are expressed or acted upon is not necessarily clear, it is speculated as follows.

In order to reduce the weight of a product, it is generally possible to consider means that do not use heat and electromagnetic field shielding materials, but in the present invention, by arranging electric and electronic components on the side of the electronic circuit board opposite the radiation detection unit, the effect of the heat and electromagnetic fields caused by the electric and electronic components on the image is reduced and it is possible to eliminate the need for heat and electromagnetic field shielding materials, which is thought to have made it possible to achieve weight reduction.
Furthermore, since the above method can reduce the effects of heat caused by electric and electronic components, it is believed that the thermal expansion of the sensor panel including the wavelength conversion unit and photoelectric conversion unit of the radiation detection unit can be reduced, and as a result, peeling of the wavelength conversion unit (e.g., the scintillator) can be prevented.

FIG. 1 is a conceptual diagram showing an example of a radiation detector according to the present invention; Conceptual diagram showing an example of a conventional radiation detector FIG. 1 is a perspective view of a radiation detector according to first and second embodiments of the present invention; 4 is a cross-sectional view taken along line AA of the radiation detector of FIG. 3 (first embodiment); FIG. 4 is a partial cross-sectional view of FIG. 4 is a plan view showing an example of a part (photoelectric conversion unit) of the radiation detector shown in FIG. 3 . FIG. 4 is a side view showing an example of a support member included in the radiation detector shown in FIG. FIG. 4 is a side view showing a state during the manufacture of the radiation detector of FIG. 3 . FIG. 4 is a perspective view showing a state during the manufacturing process of the radiation detector of FIG. 3; FIG. 2A is a perspective view showing an example of a mounting member, and FIG. 2B is a cross-sectional view showing the mounting member of FIG. 2A in a state where it is fixed to a support member. FIG. 2A is a perspective view showing an example of a mounting member, and FIG. 2B is a cross-sectional view showing the mounting member of FIG. 2A in a state where it is fixed to a support member. FIG. 1A is a perspective view showing an example of a mounting member, and FIGS. 1B to 1D are cross-sectional views showing the mounting member of FIG. 1A in a state where it is fixed to a support member. FIG. 1 is a perspective view showing an example of a mounting member; 4 is a cross-sectional view taken along line AA of the radiation detector of FIG. 3 (second embodiment);

The radiation detector of the present invention is a radiation detector comprising at least a radiation detection unit constituted by a wavelength conversion unit that converts radiation into light and a photoelectric conversion unit that converts the light into an electrical signal, and an electronic circuit board, wherein the photoelectric conversion unit comprises a flexible substrate and has at least a plurality of semiconductor elements on a surface of the flexible substrate, the plurality of semiconductor elements being arranged on an imaging surface of the flexible substrate that contacts the wavelength conversion unit, the radiation detection unit comprises a support member formed of a foam on a surface facing the electronic circuit board, the electronic circuit board has a plurality of layers, at least one of the plurality of layers being a ground layer, electric/electronic components that generate heat and electric/electronic components that generate a magnetic field when driven are provided on the same surface of the electronic circuit board, the electric/electronic components that generate heat and the electric/electronic components that generate a magnetic field are provided on a surface of the electronic circuit board opposite to the radiation detection unit side , and the electronic circuit board and the radiation detection unit are fixed to opposite sides, respectively, of a front surface and a back surface of a foam base .
This feature is a technical feature common to or corresponding to each of the following embodiments.

In one embodiment of the present invention, an electric/electronic component that generates heat and an electric/electronic component that generates a magnetic field when driven are provided on the same surface of the electronic circuit board .

In addition, the radiation detection unit is provided with a support member formed of foam on the surface facing the electronic circuit board, and the foam has excellent insulating properties and is also an insulator, which reduces the effects of heat and magnetic fields and makes the unit lighter.

Furthermore, the electronic circuit board has a plurality of layers, at least one of which is a ground layer, thereby providing excellent heat diffusion and magnetic field shielding.
From the viewpoint of electric field shielding, it is preferable that the ground layer is connected to the ground of the housing.

In an embodiment of the present invention, it is preferable that the wavelength conversion unit includes a scintillator from the viewpoint of weight reduction, etc.

From the viewpoint of effective expression, it is preferable that the scintillator uses cesium iodide (CsI) crystals.

Furthermore, from the viewpoints of weight reduction and flexibility, it is preferable that the photoelectric conversion unit has a configuration of an optical sensor panel in which at least a plurality of photodiodes having the function of an optical sensor and a plurality of addressable thin film transistors (TFTs) are arranged on the surface of the flexible substrate.

The present invention, its components, and the form and mode for implementing the present invention are described below. Note that in this application, "~" is used to mean that the numerical values before and after it are included as the lower and upper limits.

[Outline of the radiation detector of the present invention]
The radiation detector of the present invention is a radiation detector comprising at least a radiation detection unit constituted by a wavelength conversion unit that converts radiation into light and a photoelectric conversion unit that converts the light into an electrical signal, and an electronic circuit board, wherein the photoelectric conversion unit comprises a flexible substrate and has at least a plurality of semiconductor elements on a surface of the flexible substrate, the plurality of semiconductor elements being arranged on an imaging surface of the flexible substrate that contacts the wavelength conversion unit, the radiation detection unit comprises a support member formed of a foam on a surface facing the electronic circuit board, the electronic circuit board has a plurality of layers, at least one of the plurality of layers being a ground layer, electric/electronic components that generate heat and electric/electronic components that generate a magnetic field when driven are provided on the same surface of the electronic circuit board, the electric/electronic components that generate heat and the electric/electronic components that generate a magnetic field are provided on a surface of the electronic circuit board opposite to the radiation detection unit side , and the electronic circuit board and the radiation detection unit are fixed to opposite sides, respectively, of a front surface and a back surface of a foam base .

Figure 1 is a conceptual diagram showing an example of a radiation detector of the present invention. Also, Figure 2 is a conceptual diagram showing an example of a conventional radiation detector.

As shown in FIG. 1 , the radiation detector of the present invention differs from conventional radiation detectors in that electric/electronic components that generate heat or magnetic fields when driven are provided on the surface of the electronic circuit board opposite the radiation detection unit, thereby resulting in an arrangement in which the heat and magnetic fields generated by the electric/electronic components are not directly applied to the radiation detection unit.
Therefore, local expansion due to heat of the sensor panel including the wavelength conversion section and the photoelectric conversion section can be suppressed, and peeling at the bonding interface with the wavelength conversion section such as a scintillator can be prevented.

In addition, in Figures 1 and 2, electric/electronic component 1 (E1) is a heat-generating component, and electric/electronic component 2 (E2) is a magnetic field-generating component.

Here, "heat-generating components" refers to electrical and electronic components whose thermal impact on the entire radiation detector is significantly greater than that of other electrical and electronic components, and depending on the situation, heat-generating components can also be considered magnetic field-generating components.

In addition, a "magnetic field generating component" refers to an electric or electronic component whose magnetic field has a significantly greater effect on the entire radiation detector than other electric or electronic components, and depending on the situation, a magnetic field generating component can also be considered a heat generating component.

1. Radiation Detector The radiation detector according to the present invention is characterized by being composed of at least a wavelength conversion section and a photoelectric conversion section.
As described later, a preferred embodiment is one in which panel-shaped wavelength conversion sections and photoelectric conversion sections are stacked to form a laminated sensor panel.
The main components having various functions will be described below.

(1.1) Wavelength Conversion Unit The wavelength conversion unit is required to include an element, such as a scintillator, that has a function of converting radiation into electromagnetic waves (light) of another wavelength, including visible light.
Here, the term "scintillator" is a general term for a material that exhibits the property of emitting fluorescence when excited by radiation.
As the scintillator, various scintillators that have been conventionally used for detecting radiation can be used.
Any material capable of converting radiation such as X-rays into a different wavelength such as visible light can be used as a scintillator.
Among these substances, for example, cesium iodide (CsI) has a relatively high efficiency in converting radiation energy such as X-rays into visible light.
Cesium iodide (CsI) can be used to form a scintillator thin film made up of columnar crystals by vapor deposition.
Although columnar crystals have excellent optical properties, they have a small thermal expansion coefficient (54×10 ⁻⁶ /C).

(1.2) Photoelectric Conversion Section The photoelectric conversion section according to the present invention has a function of converting information carried by light into an electrical signal by utilizing the change in the electrical properties or the state of electrons of a substance caused by the photoelectric effect.
The photoelectric conversion section according to the present invention is characterized in having at least a plurality of semiconductor elements on the surface of a flexible substrate.

The term "semiconductor element" here refers to photoconductive elements, photodiodes (also called "photodiodes"), phototransistors, etc. that can convert light into an electrical signal, as well as transistors that have functions such as amplifying current or acting as a switch in electronic circuits.

As an embodiment of the present invention, for example, the photoelectric conversion unit is preferably a so-called "TFT sensor panel" or "photosensor array" having a configuration of a photo sensor panel in which at least a plurality of photodiodes (photodiodes) having the function of a photo sensor and a plurality of addressable thin film transistors (TFTs) are arranged on the surface of the flexible substrate.

The TFT sensor panel of the radiation detection section in a conventional radiation detector uses a glass substrate.
However, it is preferable to make the TFT sensor panel a flexible TFT sensor panel having the above-mentioned configuration using a flexible substrate, as this prevents glass breakage due to impact from being dropped, etc., increases robustness and flexibility, and enables weight reduction.

On the other hand, a flexible substrate generally has a larger thermal expansion coefficient than other components.
Therefore, when heat is applied from electrical components that consume a large current and generate heat, local expansion may occur, causing the wavelength conversion portion, such as the scintillator, to peel off.

However, in the radiation detector of the present invention, as shown in FIG. 1, by providing electrical and electronic components on the surface opposite the radiation detection section, the effect of heat on the photoelectric conversion section having a flexible substrate can be reduced.
At the same time, the influence of the magnetic field can also be reduced.

Furthermore, the need for conventional heat diffusion materials, insulation materials, high magnetic permeability sheets, etc. to reduce the effects of heat and magnetic fields can be reduced, making the product lighter.

2. Electronic Circuit Boards and Electrical/Electronic Components The term "electronic circuit board" according to the present invention refers to a board equipped with a circuit made up of passive elements (resistors, coils, capacitors, etc.) and active elements (transistors, ICs, diodes, etc.).
Specifically, it refers to a substrate equipped with electronic or electric circuits such as a scanning circuit, a readout circuit, a wireless communication circuit, a control circuit, a power supply circuit, a battery, and a connector.

In the present invention, "electrical/electronic components" refer to electronic and electrical components that constitute or are used in connection with the above-mentioned electronic circuits.

An example of the "electrical/electronic components" is a passive component such as an inductor used in a DC-DC power supply circuit.
When a large current flows, Joule heat is generated due to the resistance component of the inductor.
In addition, when driving a circuit downstream of the DC-DC power supply circuit, the load on the circuit changes over time, generating an AC magnetic field. This AC magnetic field acts on the pixel readout signal line, generating an induced current. This is then converted into a pixel voltage value due to the impedance of the signal line, and horizontal streaks may appear in the image.

Moreover, an example of an active component is a wireless communication LSI.
During transmission, it consumes a large current and becomes a source of heat.
On the other hand, current consumption during reception is relatively small.

When communication is performed using a protocol such as TCP (Transmission Control Protocol), where the sender and receiver confirm the communication status with each other through a handshake, alternating transmission and reception generates a large alternating current, which can cause horizontal streaks to appear on the image due to the same mechanism of action as explained above for the inductor used in the DC-DC power supply circuit.

(Ground layer)
In an embodiment of the present invention, the electronic circuit board has a plurality of layers, and at least one of the plurality of layers is a ground layer, i.e., a solid ground (solid GND) .
Here, the "ground layer" according to the present invention refers to a portion (layer) that serves as a reference potential for operating an electronic circuit.
That is, it is a part in an electronic circuit where the potential difference with respect to the reference potential is 0V.

The "solid ground" is a ground electrode that is provided on an insulating layer among the multiple layers of an electronic circuit board and has a planar extent.
In one embodiment, the ground layer is preferably connected to the ground of the housing from the viewpoint of electric field shielding.

3. Support Member The radiation detection unit according to the present invention is provided with a support member made of foam on the surface facing the electronic circuit board, which is advantageous in terms of reducing the influence of electrical components and reducing the weight of the radiation detector.

The foam is preferably made of polyethylene, polypropylene, polystyrene, modified polyphenylene ether, polyurethane, acrylic, epoxy, or a mixture of at least two of these resins.

Generally, soft resins have lower rigidity than hard resins, whereas it is known that foams made of soft resins have higher rigidity as their expansion ratio decreases.
Therefore, the required rigidity can be obtained by adjusting the expansion ratio when producing the foam.

Since foam is lightweight and has excellent heat insulation properties and is also an insulator, by fixing the electronic circuit board and radiation detection unit of the present invention to the opposite sides of the front and back of a foam base, respectively, it is possible to increase the heat insulation or insulation distance between the heat/magnetic field generation source and the pixels, making it lightweight, capable of heat diffusion, and also capable of electromagnetic field shielding.

4. EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.
However, the invention is not limited to what is illustrated in the drawings.

First Embodiment
A first embodiment of the present invention will be described with reference to FIGS.
FIG. 3 is a perspective view of a radiation detector (hereinafter abbreviated as "detector 100").
As shown in FIG. 3 , the detector 100 according to this embodiment includes, for example, a housing 110 and an internal module 120 .
Furthermore, the detector 100 is also equipped with various switches S (power switch, operation switch, etc.), an indicator I, etc.
Each component of the detector 100 will now be described.

[1] Housing In FIG. 3, housing 110 is an exterior including a frame, that is, a box for accommodating an internal module 120 including a radiation detection unit constituted by a wavelength conversion unit that converts radiation into light and a photoelectric conversion unit that converts the light into an electrical signal, an electronic circuit board, and electrical and electronic components.
FIG. 4 is a cross-sectional view taken along line AA of the radiation detector (first embodiment) of FIG. 3, and as shown in FIG.
The housing 110 according to this embodiment has a rectangular panel shape.

[1.1] Box Body As shown in FIG. 4, the box body 1 has a front surface 11.
The box 1 according to this embodiment further includes a side surface portion 12 .
The front portion 11 and the side portion 12 according to this embodiment are integrally formed.
The front surface portion 11 and the side surface portion 12 may be separate members.

(1.1.1) Front Surface Section As shown in FIG. 4, the front surface section 11 faces an imaging surface 312g (described later) provided in the internal module 120, and extends parallel to the imaging surface 312g (see FIGS. 5 and 6).
FIG. 5 is a partial cross-sectional view of FIG.
Moreover, the outer surface of the front portion 11 becomes a radiation incident surface 11a (front surface) of the detector 100 (housing 110).

The front surface portion 11 according to this embodiment is formed in a rectangular plate shape.
In this embodiment, on the radiation incident surface 11a, the range of the effective image area (the area in which multiple semiconductor elements 312b (see FIG. 6) are arranged) of the sensor panel 31 (see FIG. 4 and FIG. 5) is indicated by a frame (not shown).
FIG. 6 is a plan view showing an example of a part (photoelectric conversion unit) of the radiation detector of FIG.

The front portion 11 is formed from a material that transmits radiation.
The material of the housing 110 according to this embodiment is carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), light metal, or an alloy containing light metal.

The material of the housing 110 may be carbon fiber reinforced thermoplastics (CFRTP) (see FIG. 4).
Furthermore, when the material of the housing 110 is carbon fiber reinforced (thermoplastic) resin or glass fiber reinforced resin, it may be formed using SMC (Sheet Molding Compound), which is a material that contains shorter fibers than prepreg.

Light metals include metals with relatively low specific gravity such as aluminum and magnesium.
This allows the housing 110 to be made lighter while maintaining its rigidity.
In particular, carbon fiber reinforced resin has a high radiation transmittance, so that the radiation that has passed through the subject reaches the inner module 120 without being attenuated on the way.
Therefore, the image quality of the radiation image can be improved as compared to the case where the housing 110 is made of other materials.

(1.1.2) Side Surface Portion As shown in FIG. 4, the side surface portion 12 extends from the peripheral edge of the front surface portion 11 in a direction perpendicular to the radiation entrance surface 11a and toward the rear surface portion 21.
Moreover, the outer surface of the side portion 12 becomes the side of the detector 100 (housing 110).

[1.2] Lid As shown in FIG. 4, the lid 2 has a back surface portion 21 .
The cover body 2 according to this embodiment entirely constitutes the rear surface portion 21 .
The rear surface portion 21 faces the front surface portion 11 of the box body 1 with the internal module 120 interposed therebetween, and extends parallel to the front surface portion 11 .
Moreover, the outer surface of the rear portion 21 becomes the rear surface of the detector 100 (housing 110).

Further, the rear surface portion 21 according to this embodiment is formed in a rectangular shape that is substantially the same as that of the front surface portion 11 .
The material of the rear portion 21 according to the present embodiment is carbon fiber reinforced resin, glass fiber reinforced resin, light metal, or an alloy containing light metal.
The material of the back surface portion 21 may be the same as that of the box body 1 or may be different.

The cover 2 (rear portion 21 ) configured in this manner abuts against the side portion 12 of the box 1 and is attached to the side portion 12 .
As a result, the side portion 12 connects the front portion 11 and the rear portion 21 .

The lid 2 according to this embodiment is fixed to the box 1 with screws.
Therefore, when repairing or maintaining the detector 100, the rear portion 21 can be separated from the front portion 11 and the side portion 12 simply by loosening and removing the screws.
That is, a person performing maintenance on the detector 100 can easily access the internal module 120 housed within the front portion 11 and the side portion 12 .

Moreover, a waterproof structure may be achieved by placing a packing between the lid 2 and the box 1 and screwing or gluing them together.
By preventing moisture from penetrating, the foam can be prevented from absorbing water and affecting the sensor panel and electrical and electronic components.

[1.3] Others Although FIG. 4 illustrates an example of a housing 110 (box body 1) in which the side portion 12 is integrally formed with the front portion 11, the housing 110 may be one in which the side portion 12 is integral with the rear portion 21, or the front portion 11, the side portion 12, and the rear portion 21 may each be separate components.
Also, both the front portion 11 and the rear portion 21 may have side portions.
In addition, while Figure 4 illustrates an example of a housing 110 having a box body 1 and a lid body 2, the housing may also include a cylindrical body having a front portion 11, a rear portion 21, and a pair of side portions 12 connecting both ends of the front portion 11 and both ends of the rear portion 21, and a lid body that closes the opening of the cylindrical body.

Furthermore, the housing 110 may be provided with a recess in the peripheral portion of the rear portion 21 .
With this configuration, the recesses can be hooked with fingers, improving the grip of detector 100 and making it less likely for a person carrying detector 100 to drop it.
Additionally, the housing 110 may be treated with an antibacterial coating, either on the entire surface or incorporated into the material itself.

Furthermore, the housing 110 may be provided with protective members at the corners (at least one of the four corners of the front surface 11 and the four corners of the rear surface 21).
The material of the protective member may be metal, but since the detector 100 according to this embodiment is lightweight and is less susceptible to impact upon collision, it may be made of an elastic material (such as resin, rubber, or elastomer).

At least one of the protective members may be different from the other protective members in at least one of the color and the shape.
In this way, the orientation of the detector 100 can be easily identified based on the position of the protective member that is different from the others in at least one of color and shape.

[2] Internal Module The term "internal module 120" refers to a radiation detection unit, which is composed of a wavelength conversion unit that converts radiation into light and a photoelectric conversion unit that converts the light into an electrical signal, which are contained inside the housing, an electronic circuit board, electrical and electronic components, and supporting members, etc.

As shown in FIG. 4, the internal module 120 is fixed to the inner surface of the front portion 11 of the housing 110.

Methods for fixing the internal module 120 to the housing 110 include bonding using an adhesive, adhesion using an adhesive tape, fitting into a recess or protrusion formed on the inner surface, engaging with an engaging portion formed on the inner surface, etc.
This makes it possible to prevent the internal module 120 from moving when an impact is applied from a direction substantially perpendicular to the side surface of the detector 100 .

As shown in FIG. 4, the internal module 120 according to this embodiment is spaced from the inner surface of the side portion 12 by a predetermined distance d.
That is, there is a gap between the internal module 120 and the side surface portion 12, the width of which is equal to or greater than d.

This prevents the internal module 120 from colliding with the side portion 12 and being damaged when the detector 100 receives an impact from a direction approximately perpendicular to the side of the detector 100.

The internal module 120 includes a radiation detection unit 3, a support member 4, an electronic circuit board 51, and electrical and electronic components 53.

[2.1] Radiation Detection Section The radiation detection section according to the present invention is composed of at least a wavelength conversion section and a photoelectric conversion section.
As shown in FIG. 5 , the radiation detection unit 3 is provided between the front surface 11 of the housing and the support member 4 .
The radiation detection unit 3 according to this embodiment is provided between the front surface portion 11 and the support member 4 via an adhesive layer 6 .

As shown in FIG. 5, the radiation detection unit 3 includes a sensor panel 31 which is a laminate made up of a wavelength conversion unit 311 and a photoelectric conversion unit 312 .
Moreover, the radiation detection unit 3 according to this embodiment may further include a radiation shielding layer 32 , an electromagnetic field shielding layer 33 , and a buffer material 34 .

(2.1.1) Sensor Panel As shown in FIG. 5, a sensor panel 31 according to this embodiment is provided between a radiation shielding layer 32 and an electromagnetic field shielding layer 33 .
The sensor panel 31 according to this embodiment also includes a wavelength conversion section 311 and a photoelectric conversion section 312 .

<Wavelength conversion section>
As shown in FIG. 5, the wavelength conversion section 311 is an element section having a function of converting radiation into electromagnetic waves (light) of another wavelength including visible light, and is required to include, for example, a scintillator.
Here, the term "scintillator" is a general term for a substance (phosphor) that exhibits the property of emitting fluorescence when excited by radiation.

The wavelength conversion section 311 according to this embodiment is provided between the electromagnetic field shield layer 33 and the photoelectric conversion section 312 .
Moreover, the wavelength conversion section 311 according to this embodiment is disposed so as to extend in parallel with the radiation incident surface 11 a of the housing 110 .
Moreover, the wavelength conversion portion 311 according to this embodiment has a support layer and a phosphor layer, which are not shown.

The support layer is made of a flexible material and has a film shape (thin plate shape).
Examples of the flexible material include polyethylene naphthalate, polyethylene terephthalate (PET), polycarbonate, polyimide, polyamide, polyetherimide, aramid, polysulfone, polyethersulfone, fluororesin, polytetrafluoroethylene (PTFE), or a composite material made by mixing at least two or more of these.
Of the above materials, polyimide, polyamide, polyetherimide, PTFE, or a composite material thereof is particularly preferred from the viewpoint of improving heat resistance.
Moreover, the support layer according to this embodiment is formed in a rectangular shape.

The phosphor layer is formed of a phosphor on the surface of the support layer.
A phosphor is a substance that emits light as a result of atoms being excited when irradiated with ionizing radiation such as α-rays, γ-rays, or X-rays.
That is, phosphors convert radiation into ultraviolet light or visible light.
The phosphor may be, for example, columnar crystals of cesium iodide (CsI).

The phosphor layer according to this embodiment is formed on the entire surface of the support layer facing the photoelectric conversion section 312 .
That is, the wavelength converting portion 311 is formed in a rectangular shape.
Moreover, the phosphor layer according to this embodiment has a thickness that allows it to bend (elastically deform) together with the support layer when the support layer is bent.

The wavelength conversion section 311 configured in this manner is in the form of a flexible plate, and the area exposed to radiation emits light with an intensity corresponding to the dose of radiation received.

<Photoelectric conversion unit>
As shown in FIG. 5, the photoelectric conversion unit 312 is an element having a function of converting light into an electrical signal.
The photoelectric conversion section 312 according to this embodiment is provided between the wavelength conversion section 311 and the radiation shielding layer 32 .
Moreover, the photoelectric conversion section 312 according to this embodiment is disposed so as to extend in parallel with the wavelength conversion section 311 .

As shown in FIG. 5 , the photoelectric conversion section 312 is bonded to the wavelength conversion section 311 .
As shown in FIG. 6, the photoelectric conversion unit 312 has a substrate 312a and a plurality of semiconductor elements 312b (for example, photodiodes).
Moreover, the photoelectric conversion portion 312 according to this embodiment has a plurality of scanning lines 312c, a plurality of signal lines 312d, a plurality of switching elements 312e (for example, thin film transistors: TFTs), and a plurality of bias lines 312f.

The substrate 312a is made of a flexible material and has a film shape (thin plate shape).
The front view of the substrate 312 a according to this embodiment has a rectangular shape that is substantially the same as that of the wavelength conversion section 311 .
The substrate 312 a according to this embodiment is made of the same material as the support layer of the wavelength conversion section 311 .

In other words, when the photoelectric conversion section 312 using the flexible substrate according to this embodiment receives heat from an electric/electronic component that consumes a large current and generates heat, it expands locally due to its large thermal expansion coefficient, and may peel off from the wavelength conversion section 311, which has a relatively small thermal expansion coefficient.

Each of the semiconductor elements 312b generates an amount of charge according to the intensity of the light received.
Furthermore, the multiple semiconductor elements 312b are formed so as to be distributed two-dimensionally on the surface of the substrate 312a.

Specifically, the multiple semiconductor elements 312 b are arranged in a matrix on the surface of the substrate 312 a that is in contact with (bonded to) the wavelength conversion portion 311 .
A plurality of semiconductor elements 312b according to this embodiment are arranged in a matrix in the center of an imaging surface 312g.

Specifically, on the surface of the substrate 312a, the scanning lines 312c (not shown) are formed to extend parallel to each other at equal intervals, and the signal lines 312d (not shown) are formed to extend perpendicular to the scanning lines at equal intervals, and are arranged in a rectangular region (corresponding to each pixel of the radiation image).

In addition, a switch element 312e is provided in each rectangular region. The switch element 312e is, for example, a TFT, and the gate of each switch element 312e is connected to the scanning line 312c, the source is connected to the signal line 312d, and the drain is connected to the semiconductor element 312b.

The surface of the substrate 312a on which the semiconductor element 312b is formed is referred to as an "imaging surface 312g."
The photoelectric conversion section 312 configured in this manner has flexibility, and is disposed so that the imaging surface 312 g on which the semiconductor element 312 b is formed faces the wavelength conversion section 311 .

(2.1.2) Radiation Shielding Layer The radiation shielding layer 32 is intended to prevent scattered radiation from reaching the electronic circuit board 51.
The radiation shielding layer 32 according to this embodiment may be configured to be provided between the sensor panel 31 (photoelectric conversion section 312) and the electromagnetic field shielding layer 33, as shown in FIG. 5, for example.
Moreover, the radiation shielding layer 32 according to this embodiment fixes the sensor panel 31 by a mounting portion (not shown).

(2.1.3) Electromagnetic Field Shielding Layer The electromagnetic field shielding layer 33 serves to shield against noise.
The electromagnetic field shield layer 33 is provided on at least one of the imaging surface 312g of the radiation detection unit 3 and the surface opposite to the imaging surface 312g.

The electromagnetic field shield layer 33 according to this embodiment is provided on both the imaging surface 312g side and the opposite surface side.
The electromagnetic field shield layer 33 on the surface opposite to the imaging surface 312 g may be attached to the support member 4 .

The electromagnetic field shield layer 33 is a layer member that partially contains a conductive material.
The electromagnetic field shield layer 33 according to this embodiment includes a resin film having a metal layer formed on the surface thereof, a film made of a transparent conductive material (such as indium tin oxide (ITO)), and the like.

Metals include, for example, aluminum, copper, and the like.
Methods for forming the metal layer include, for example, a method of attaching a metal foil, a method of vapor-depositing a metal, and the like.
For the electromagnetic field shield layer 33, a film such as Alpet (registered trademark, Panac Corporation) is suitable.
At least one electromagnetic shield layer 33 is provided on one surface.

If the electromagnetic field shield layer 33 is provided on the imaging surface 312g side, it is possible to shield external noise entering from the front side.
On the other hand, if an electromagnetic field shielding layer 33 is provided on the side opposite to the imaging surface 312g, noise generated by the electronic circuit board 51 can be shielded.

The electromagnetic shield layer 33 may be connected to, for example, the ground (GND).
In this way, the potential of the electromagnetic field shield layer 33 is kept constant, and the noise shielding effect can be further improved.

In this case, it is preferable to interpose a metal (eg, nickel) whose ionization tendency is small compared to that of aluminum or copper.
The metal with a small difference in ionization tendency is interposed, for example, in the form of an intermediate member plated with a metal with a small difference in ionization tendency, or in the form of a conductive tape containing a metal with a small difference in ionization tendency as a conductive filler.
When metals with a large difference in ionization tendency (for example, aluminum and copper) come into contact with each other, electrolytic corrosion may occur, but by doing so, electrolytic corrosion can be prevented.

(2.1.4) Cushioning Material As shown in FIG. 5, the cushioning material 34 is for absorbing external loads and shocks.
The cushioning material 34 according to this embodiment is provided between the front surface 11 of the housing 110 and the electromagnetic field shielding layer 33 .
This makes it possible to prevent a load or impact received from the front surface portion 11 side from being transmitted to the sensor panel 31 .

[2.2] Support Member The support member 4 supports the radiation detection unit 3 (see FIGS. 4 and 5).
The term "support" here includes not only supporting the radiation detection unit 3 against the load received from the front surface portion 11 side, but also providing the radiation detection unit 3 on the support member 4.

As shown in FIG. 4, the support member 4 is provided between the radiation detection unit 3 and the rear surface unit 21 .
In this way, the support member 4 distributes the load received by the housing 110 from the outside, making it possible to prevent the radiation detection unit 3 (sensor panel 31) from bending.

The support member 4 is made of a foam.
The foam material includes polyethylene, polypropylene, polystyrene, modified polyphenylene ether, polyurethane, acrylic, epoxy, and a mixture of at least two of these resins.

In general, soft resins have lower rigidity than hard resins.
On the other hand, it is known that a foam made of a soft resin has higher rigidity as the expansion ratio decreases.
Therefore, the required rigidity can be obtained by adjusting the expansion ratio when producing the foam.

The expansion ratio is preferably, for example, 30 times or less.
In this way, the support member 4 can be made lighter while still obtaining the necessary rigidity without using a material (e.g., fiber-reinforced resin or metal) that is more rigid than foam for a portion of the support member (e.g., the surface portion).

The support member 4 may be formed from a resin whose thermal expansion coefficient is the same as that of the sensor panel 31 or whose difference therebetween is within a predetermined range.
The support member 4 may also be elastic.

The sensor panel 31 has a larger coefficient of thermal expansion than a conventional panel including a glass substrate.
However, by doing as described above, even if the sensor panel 31 expands, the support member 4 also expands to the same extent or elastically deforms to absorb the expansion of the sensor panel 31, thereby preventing only the sensor panel 31 from expanding and causing wrinkles in the sensor panel 31.

The support member 4 has a first portion 4a and a second portion 4b.

In Figures 4 and 5, the first portion 4a is a portion that is provided without any gaps along the surface of the photoelectric conversion unit 312 of the sensor panel 31 opposite the imaging surface 312g (the surface of the electromagnetic field shield layer 33 or the surface of the adhesive layer 6 on the surface of the photoelectric conversion unit 312 opposite the imaging surface 312g).

The first portion 4a has a predetermined thickness in a direction perpendicular to the surface opposite the imaging surface 312g, and is in the form of a plate extending parallel to that surface.
In this manner, the support member 4 further disperses the load received by the housing 110 from the outside, so that bending of the radiation detection unit 3 can be further suppressed.

The second portion 4 b is a portion that is provided without any gap from the radiation detection unit 3 to the rear surface portion 21 .
In this manner, the support member 4 further disperses the load received by the housing 110 from the outside, so that bending of the radiation detection unit 3 can be further suppressed.

Furthermore, by having the above-mentioned first portion 4 a and second portion 4 b , the support member 4 has a recess 4 c on the surface facing the rear portion 21 of the housing 110 .
The width, depth and length of the recess 4c are large enough to accommodate an electronic circuit board 51, which will be described later.
In the supporting member 4 according to the present embodiment, a plurality of recesses 4c (at least the number of electronic circuit boards 51) are formed.

The support member 4 according to this embodiment is divided into a plurality of members.
That is, the support member 4 according to the present embodiment has a first support portion 41 and a second support portion 42 .

(2.2.1) First Supporting Part One surface of the first supporting part 41 contacts the radiation detecting part 3, and the other surface of the first supporting part 41 contacts the electronic circuit board 51 (see FIG. 4).
The first support portion 41 according to this embodiment corresponds to the above-mentioned first portion 4a.
The first support section 41 according to this embodiment has a flat surface that comes into contact with the radiation detection section 3 .
Hereinafter, one surface of the first support portion 41 that contacts the radiation detection unit 3 will be referred to as a support surface 41a.

The support surface 41 a according to this embodiment is the same as or slightly larger than the sensor panel 31 .
Therefore, the first support portion 41 can support the entire sensor panel 31 .
The thickness of the first support portion 41 (the distance between the support surface 41a and the surface opposite thereto) is preferably within a range of 2 to 5 mm.
In this way, the rigidity of the first support portion 41 can be ensured while a space for mounting an electronic circuit board 51 (described later) can be secured.

FIG. 7 is a side view showing an example of a support member included in the radiation detector of FIG.
The first support portion 41 according to this embodiment includes two types of foam having different rigidities.
The first support portion 41 according to this embodiment has a first foam body _F1 and a second foam body _F2 (see FIG. 7(a)).
The first foam F ₁ forms a surface layer that comes into contact with the radiation detection unit 3 or the second support unit 42 .
The second foam _F2 forms a core portion that contacts the surface layer in the direction in which the radiation detection unit 3 and the second support portion 42 are aligned.

That is, in the first support portion 41, the distribution of the expansion ratio changes along a direction perpendicular to the support surface 41a.
The expansion ratio of the first foam body _F1 is smaller than that of the second foam body _F2 . That is, the first foam body _F1 has a higher rigidity than the second foam body _F2 .
This can improve the bending rigidity of the first support portion 41 .
As a result, the bending rigidity of the detector 100 can be improved.

Note that, although Figures 4 and 7(a) illustrate the first support portion 41 having a uniform thickness (width in the direction perpendicular to the support surface 41a), the first support portion 41 may have a peripheral portion that is thicker than the central portion in the direction along the support surface 41a.
This can further increase the rigidity against loads and shocks.
Moreover, the first support portion 41 may be thicker at its center than at its peripheral edge.

(2.2.2) Second Support Portion As shown in FIG. 4 , the second support portion 42 has one surface in contact with the first support portion 41 and the other surface in contact with the back surface portion 21 .
That is, the second support portion 42 according to the present embodiment is a separate member from the first support portion 41, as shown in FIG.
The second support portion 42 according to the present embodiment extends from an area of the surface of the first support portion 41 opposite the support surface 41 a , which does not contact an electronic circuit board 51 (described later), to the rear surface portion 21 .

In this way, unlike the first support part 41, the second support part 42 is formed to fill a portion of the surface of the photoelectric conversion part 312 opposite the imaging surface 312g (the surface of the electromagnetic field shield layer 33 or the surface of the adhesive layer 6 on the surface of the photoelectric conversion part 312 opposite the imaging surface 312g), so that a recess 4c is formed on the side of the back part 21 (in the direction along the support surface 41a).

The second support portion 42 according to this embodiment includes two types of foam having different rigidities, similar to the first support portion 41 described above.
As shown in FIG. 7A, the second support portion 42 according to this embodiment also has a first foam body F ₁ and a second foam body F ₂ .
The first foam F ₁ in the second support portion 42 forms a surface layer portion extending from the first support portion 41 to the back surface portion 21 .
The second foam F ₂ in the second support portion 42 forms a core portion that contacts the surface layer portion in the direction along the inner surface of the back surface portion 21 .

That is, in the second support portion 42 , the distribution of the expansion ratio changes along the direction along the support surface 41 a , and the manner of distribution is different from that of the first support portion 41 .
This can improve the rigidity of the second support portion 42 against a load applied in a direction perpendicular to the support surface 41a.
As a result, the rigidity against a load applied in a direction perpendicular to the front or rear surface of the detector 100 can be improved.

(2.2.3) Support Members and Others In the case where the first support portion 41 and the second support portion 42 have anisotropic strength (the first foam _F1 and the second foam _F2 are arranged in different directions) as in this embodiment, the strength against loads and impacts received in the thickness direction (direction perpendicular to the support surface 41a) may be made greater than the strength against loads and impacts received in the direction along the support surface (see Figures 4 and 7).

Also, only one of the first support portion 41 and the second support portion 42 may be constituted by the first foam body F ₁ and the second foam body F ₂ .
In this case, the other may be formed only of the first foam _F1 or the second foam _F2 .
Moreover, both the first support portion 41 and the second support portion 42 may be formed of only the first foam body _F1 or the second foam body _F2 .

As shown in FIG. 7B, the support member 4 may be one in which the first support portion 41 and the second support portion 42 are integrally formed from a single foam body.
In this case, the recess 4c may be formed by cutting the area intended to be the recess 4c or by partial pressing, but it is preferable to form the recess 4c by partial pressing.

The portion of the support member 4 where the recess 4c is formed is thinner (has a smaller width in a direction perpendicular to the support surface 41a) than the other portion (the second portion 4b).
However, when the recesses 4c are formed by partial pressing, the foaming ratio of the surface of the recesses 4c decreases and the strength increases.
Therefore, the rigidity of the support member 4 in the recess 4c can be made equal to that of the second portion 4b.
The support member 4 may also be produced by laminating a plurality of foam sheets.

[2.3] Electronic Circuit and Electrical/Electronic Components As shown in FIG. 4, the radiation detector includes an electronic circuit board 51, wiring 52, and electrical/electronic components 53.

The electronic circuit board 51 according to this embodiment is attached to the support member 4 .
That is, the radiation detection unit 3 , the support member 4 , the electronic circuit board 51 and the electric/electronic components 53 are fixed to each other to form an internal module 120 .

(2.3.1) Electronic Circuit Board As shown in FIG. 4, the electronic circuit board 51 is disposed on the surface of the support member 4 opposite to the support surface 41a.
The electronic circuit board 51 is accommodated in the recess 4c of the support member 4 (between the second support portions 42).

The electronic circuit board 51 has electric/electronic components 53 and a ground layer, and the electric/electronic components 53 are provided on the surface of the electronic circuit board opposite to the radiation detection unit 3 side.
The electronic circuit board 51 and the rear portion 21 of the housing 110 are spaced apart.
This makes it possible to prevent the load received from the outside of the housing 110 from being transmitted to the electronic circuit board 51 .

The electronic circuit board 51 includes a scanning circuit, a readout circuit, a wireless communication circuit, a control circuit, a power supply circuit, a battery, a connector, etc.

The scanning circuit is a circuit that controls each switch element.
The readout circuit is a circuit that reads out the electric charge as a signal value.
The wireless communication circuit is a circuit for wirelessly communicating with other devices.
The control circuit is a circuit that controls each circuit to generate image data.
The power supply circuit is a circuit for applying a voltage to a semiconductor element and supplying power to the above-mentioned circuits.

The connector allows a cable to be inserted for wired communication with other devices, as shown in Figure 3.

(2.3.2) Mounting of Electronic Circuit to Support Member The electronic circuit board 51 according to this embodiment is mounted to the support member 4 via a mounting member 7, as shown in FIG.
FIG. 8 is a side view showing the radiation detector of FIG. 3 in the middle of its manufacture.
The mounting member 7 according to this embodiment has a plate portion 71 that is joined to the electronic circuit board 51 , and a protrusion 72 , as shown in FIG. 9 .
FIG. 9 is a perspective view showing the radiation detector of FIG. 3 in the middle of its manufacture.
Further, a fitting hole 41 b having the same contour as the protrusion 72 is formed in the first support portion 41 of the support member 4 .

The protruding portion 72 according to this embodiment is formed with a plurality of radiating portions 72a that radiate from the center of the plate portion 71 in the radial direction of the plate portion 71 (see FIG. 9).
This improves the frictional force between the mounting member 7 and the support member 4 when the mounting member 7 is fitted to the support member 4, making it more difficult for the mounting member 7 to come off the support member 4.

Furthermore, when the electronic circuit board 51 is screwed to the mounting member 7 , a rotational torque acts on the mounting member 7 .
At this time, the presence of a portion such as the radiation portion 72a that protrudes in a direction perpendicular to the rotational torque can prevent the mounting member 7 itself from rotating together with the screw.
Furthermore, by engaging with the support member 4 with an area equal to or greater than a specified value, as in the radial portion 72a, the pressure received by the support member 4 is reduced, and even a foam with low rigidity is not damaged, and the rotational torque when screwed can be increased, thereby preventing the screw from loosening.

The structure of the mounting member 7 is not limited to that described above.
For example, as shown in FIG. 10, the mounting member 7 may include a first member 7a and a second member 7b.
FIG. 10(a) is a perspective view showing an example of a mounting member, and FIG. 10(b) is a cross-sectional view showing the mounting member of FIG. 10(a) in a state where it is fixed to a support member.
The first member 7 a of the mounting member 7 has a cylindrical portion 73 and a flange portion 74 .
The cylindrical portion 73 is adapted to be fitted into a fitting hole 41b formed in the first support portion 41 (see FIGS. 9, 10(a) and 10(b)).
The flange portion 74 is adapted to come into contact with the support surface 41 a of the support member 4 .

The second member 7 b has a female thread portion 75 and a flange portion 76 .
The second member 7 b may be formed from the same foam as the support member 4 .
The female screw portion 75 is adapted to fit into the cylindrical portion 73 .
An insert screw 75 a is embedded in the center of the female screw portion 75 .
The female thread portion 75 may be directly threaded.
The flange portion 76 is adapted to come into contact with the support surface 41 a of the first support portion 41 .
That is, the mounting member 7 is configured to sandwich the support member 4 between the flange portion 74 and the flange portion 76 .

When the second member 7b is made of a foam, it is possible to bond the second member 7b by the heat applied when forming the support member 4.
A screw B that is passed through a screw hole 51 a of the electronic circuit board 51 is adapted to be screwed into the female screw portion 75 .
As a result, the electronic circuit board 51 is fixed to the support member 4 .
The ground wiring of the electronic circuit board 51 extends to the periphery of the screw hole 51a.
Therefore, by fastening the electronic circuit board 51 with the screw B when mounting the electronic circuit board 51, it can be connected to a ground terminal provided in the vicinity of the screw hole 51a.

Also, the mounting member 7 may have a female thread portion 75A and a flange portion 76A, for example, as shown in FIG.
FIG. 11(a) is a perspective view showing an example of a mounting member, and FIG. 11(b) is a cross-sectional view showing the mounting member of FIG. 11(a) in a state where it is fixed to a support member.
The flange portion 76A of the mounting member 7 is adapted to come into contact with the support surface 41a of the support member 4.
The female screw portion 75A is adapted to fit into a fitting hole 41b formed in the first support portion 41.
The female screw portion 75A has a wavy side peripheral surface.
The distance _d2 between the crests of the waves is equal to or greater than the diameter of the foam particles.
By doing this, the foam particles of the support member 4 get into between the waves of the female thread portion 75A, so that when the electronic circuit board 51 is fixed with the screw B, even if a rotational torque acts on the mounting member 7 from the screw B, the mounting member 7 can be prevented from rotating together with the screw B.

As shown in FIG. 12(a), the connector may have a female screw portion 75B and a plate portion 71A.
The female screw portion 75B may be cylindrical as shown in FIG. 12, or may have a wavy side peripheral surface as shown in FIG.
The plate portion 71A has a joint surface 71a that is sufficiently wide relative to the width of the female screw portion 75.
A joint surface 71a of the plate portion 71A is adapted to be bonded to the first support portion 41, as shown in FIG. 12(b).
As shown in FIG. 12( c ), the mounting member 7 may be configured such that the surface of the plate portion 71A opposite to the surface on which the female screw portion 75B is provided is joined to the first support portion 41 .
Furthermore, the mounting member 7 may be joined to a radiation shielding layer 32 as shown in FIG. 12( d ).
FIG. 12(a) is an oblique view showing an example of a mounting member, and FIGS. 12(b), 12(c) and 12(d) are cross-sectional views showing the mounting member of (a) in a state fixed to a support member.

Furthermore, the mounting member 7 may have an engagement portion 77 as shown in FIG.
FIG. 13 is a perspective view showing an example of the mounting member.
The engaging portion 77 is adapted to engage with a screw hole 51a formed in the electronic circuit board 51 by a snap fit method.
Since the foam material from which the support member 4 is made is weak against rotational torque, when attempting to fasten the electronic circuit board 51 with screws, the mounting member 7 is likely to rotate.
However, if the electronic circuit board 51 is engaged in this manner using a snap fit, the electronic circuit board 51 can be easily attached.

It should be noted that the mounting member 7 does not have to be used to mount the electronic circuit board 51 to the support member 4 .
That is, the electronic circuit board 51 may be directly fixed to the support member 4 by an adhesive or an adhesive tape.
In this case, since the wires cannot be fastened together, the terminals may be connected by wiring using, for example, conductive tape.

(2.3.3) Wiring The wiring 52 is formed of, for example, a flexible printed circuit board, and connects the photoelectric conversion unit 312 to the various electronic circuit boards 51 .
Specifically, terminals of each scanning line (switch element) of the photoelectric conversion unit 312 are connected to a scanning circuit, terminals of each signal line (semiconductor element 312b) are connected to a readout circuit, and terminals of each bias line are connected to a power supply circuit.

Second Embodiment
Next, a second embodiment of the present invention will be described.
In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

FIG. 14 is a cross-sectional view taken along the line AA of the radiation detector of FIG. 3 according to this embodiment (hereinafter, detector 100A).
A detector 100A according to this embodiment differs from the first embodiment in the structure of a housing 110A.

[3] Lid The lid 2A according to this embodiment includes a rear surface portion 21A and a cap 22 (see FIG. 14).

[3.1] Rear portion In FIG. 14, the rear portion 21A has a recess 21a.
The recess 21a is recessed from the outer surface of the rear surface 21A toward the inside of the housing 110A.
A slit (not shown) is formed on the side surface of the recess 21a.
The width, depth and length of the recess 21 a are large enough to accommodate the electronic circuit board 51 .
In the present embodiment, the rear surface portion 21A has a plurality of recesses 21a (the number of which corresponds to the number of electronic circuit boards 51).
The bottom surface of the recess 21a according to this embodiment (the surface closest to the front surface 11) is flat.
The portions of the rear surface portion 21A that form the inner walls of the recesses 21a (portions between the recesses 21a) function as ribs formed along the rear surface of the rear surface portion 21A.
This makes it possible to prevent the housing 110A from bending or twisting even if the detector 100 is subjected to a load.

[3.2] Cap In FIG. 14, the cap 22 is adapted to fit into the opening of the recess 21a.
When the cap 22 is fitted into the recess 21a, the electronic circuit board 51 accommodated in the recess 21a is shielded.
When the cap 22 according to this embodiment is fitted into the recess 21a, its outer surface becomes flush with the outer surface of the back surface portion 21A.
The material and thickness of the cap 22 are preferably the same as those of the rear portion 21 A. In this way, the difference in rigidity between the rear portion 21 A and the cap 22 of the lid body 2A can be eliminated.

In addition, in order to eliminate the difference in rigidity between the cap 22 and the rear portion 21A, the cap 22 may be formed thinner and made of a material with higher rigidity than the rear portion 21A, or may be formed thicker and made of a material with lower rigidity.
This makes it possible to use carbon fiber reinforced resin or metal, which have good thermal conductivity and high rigidity, to diffuse heat from electronic circuits, or to use resins with low rigidity but which are transparent to radio waves, making the structure suitable for wireless communication.
The cap 22 may have a packing provided on its periphery.
This prevents dust and liquid from entering the recess 21a, and protects the electronic circuit board 51.
The cap 22 according to this embodiment is detachable from the rear surface portion 21 A. This allows easy access to the electronic circuit board 51 when performing maintenance on the detector 100.

[4] Support Member The support member 4A supports the radiation detection unit 3 on a support surface 41a, and the other opposing surface is in contact with the inner surface of the rear surface portion 21A of the housing 110A.
The support member 4A in this embodiment fills the entire area within the housing 110A that is sandwiched between the radiation detection unit 3 and the back surface portion 21 (excluding the area beyond the direction along the imaging surface 312g of the radiation detection unit 3 and the area near the inner surface of the side surface portion 12) (see FIGS. 4, 5, and 6).
Therefore, the shape of the other surface of the support member 4A (the surface in contact with the rear surface portion 21A) follows the shape of the rear surface portion 21.
The support member 4A may be integrally formed with the rear surface portion 21A, or may be fixed to the rear surface portion 21A.
Methods for fixing the support member 4A to the rear portion 21A include bonding using an adhesive, adhesion using an adhesive tape, fitting its own convex portion into a concave portion of the rear portion 21A, fitting the convex portion of the rear portion 21A into its own concave portion, etc.

[5] Electronic Circuit Board The electronic circuit board 51 according to this embodiment is housed in the recess 21a of the rear surface portion 21A (see FIG. 14).
Moreover, the electronic circuit board 51 according to this embodiment is attached to the bottom surface of the recess 21a.
The electronic circuit board 51 has electric/electronic components 53 and a ground layer, and the electric/electronic components 53 are provided on the surface of the electronic circuit board opposite to the radiation detection unit 3 side.
Methods for fixing the electronic circuit board 51 to the rear surface portion 21A according to this embodiment include fixing using a mounting member 7, adhesion using an adhesive, adhesion using an adhesive tape, and the like.
The electronic circuit board 51 and the cap 22 of the housing 110A are spaced apart from each other.
This makes it possible to prevent the load received from the outside of the housing 110A from being transmitted to the electronic circuit board 51.
The wiring 52 according to this embodiment is passed through the slits in the recess 21a.

Effects of the First and Second Embodiments
Since the electric/electronic components 53 generate heat or a magnetic field when in operation, by providing them on the side of the electronic circuit board opposite the radiation detection unit 3 as in the first and second embodiments, the heat and magnetic fields generated by the electric/electronic components 53 are not directly applied to the radiation detection unit 3.
Therefore, local expansion due to heat of the sensor panel 3 including the wavelength conversion section 311 and the photoelectric conversion section 312 in the radiation detection unit 3 can be suppressed, and peeling at the bonding interface with the wavelength conversion section 311 can be prevented.
In the detectors 100 and 100A, the sensor panel 31 is flexible.
Therefore, even if the housings 110 and 110A are subjected to a load or impact, the sensor panel 31 is less likely to be damaged.
Furthermore, since flexible materials are generally lighter than glass, the sensor panel 31 is lighter than conventional panels.
In addition, since the sensor panel 31 is lightweight and less susceptible to damage, the support members 4 and 4A that support the sensor panel 31 do not need to be as rigid as in the past.
Therefore, the amount of material used to form the support members 4 and 4A can be reduced compared to the conventional method, and there is no need to use high-rigidity materials (metal or fiber-reinforced resin) as in the conventional method.
As a result, the weight of the support members 4 and 4A can be reduced.
Furthermore, the support members 4 and 4A are made of foam and are therefore even lighter.
Therefore, according to the detector 100, it is possible to reduce the weight while maintaining the resistance of the substrate to damage when subjected to a load or impact.

Additionally, the sensor panel 31 (a flexible material) is susceptible to low frequency vibrations.
Therefore, when low-frequency vibrations reach the device, the amplitude becomes large, making it more likely to generate noise.
However, the detectors 100 and 100A support the sensor panel 31 with the support members 4 and 4A made of foam.
Since the foam absorbs low-frequency vibrations, this can prevent the sensor panel 31 from being affected by low-frequency vibrations.
The vibration suppression effect increases as the filling rate of the support members 4 and 4A within the housings 110 and 110A increases.

REFERENCE SIGNS LIST 100, 100A Radiation detector 110, 110A Housing 1, 1C, 1D Box body 11 Front portion 11a Radiation incidence surface 12 Side portion 2, 2A Lid body 21, 21A Rear portion 21a Recess 22 Cap 120 Internal module 3 Radiation detection section 31 Sensor panel 311 Wavelength conversion section 312 Photoelectric conversion section
312a Substrate
312b Semiconductor element
312c Scanning Line
312d Signal line
312e Switch element
312f Bias wire
312g Imaging surface 32 Radiation shielding layer 33 Electromagnetic field shielding layer 34 Cushioning material 4, 4A Support member 4a First portion 4b Second portion 4c Recess 41 First support portion 41a Support surface 41b Fitting hole 42 Second support portion 51 Electronic circuit board 51a Screw hole 52 Wiring 53 Electric/electronic component 6 Adhesive layer 7 Mounting member 7a First member 7b Second member 71, 71A Plate portion 71a Joining surface 72 Convex portion 72a Radiation portion 73 Tube portion 74 Flange portion 75, 75A, 75B Female thread portion 75a Insert screw 76, 76A Flange portion 77 Engagement portion B Screw F ₁ First foam body F ₂ Second foam body I Indicator S Various switches d ₁ Predetermined distance d ₂ Distance 2C Back plate E1 Electrical/electronic component 1 (heat generating component)
E2 Electrical and electronic components 2 (magnetic field generating components)
G: Ground layer g; Glass epoxy layer CB: Electronic circuit board 4C: Support member 1 (foam)
4D support member 2 (made of CFRP)
RH Thermal diffusion sheet 31C Flexible TFT sensor panel 31D Glass TFT sensor panel 311C, 311D Scintillator

Claims (5)

A radiation detector including at least a radiation detection unit including a wavelength conversion unit that converts radiation into light and a photoelectric conversion unit that converts the light into an electrical signal, and an electronic circuit board,
the photoelectric conversion unit includes a flexible substrate and has at least a plurality of semiconductor elements on a surface of the flexible substrate;
the plurality of semiconductor elements are arranged on an imaging surface of the flexible substrate that is in contact with the wavelength converting portion,
the radiation detection unit includes a support member formed of a foam on a surface facing the electronic circuit board,
the electronic circuit board having a plurality of layers;
At least one of the layers is a ground layer,
an electric/electronic component that generates heat and an electric/electronic component that generates a magnetic field when driven are provided on the same surface of the electronic circuit board;
the heat-generating electric/electronic component and the magnetic field-generating electric/electronic component are provided on a surface of the electronic circuit board opposite to the radiation detection unit ,
A radiation detector characterized in that the electronic circuit board and the radiation detection unit are fixed to opposite sides of the front and back surfaces of the foam base . 2. The radiation detector according to claim 1, wherein the ground layer is connected to a ground of a housing. 3. The radiation detector according to claim 1, wherein the wavelength conversion portion comprises a scintillator. 4. The radiation detector according to claim 3 , wherein the scintillator is made of a cesium iodide (CsI) crystal. 5. The radiation detector according to claim 1, wherein the photoelectric conversion unit has a configuration of an optical sensor panel in which at least a plurality of photodiodes having a function of an optical sensor and a plurality of addressable thin film transistors (TFTs) are arranged on a surface of the flexible substrate.

Images