JP7542144B2 - Parts transfer device - Google Patents

Description

The present invention relates to a component transfer device that includes a head unit for picking components from a component placement area and a camera unit for capturing images of the components in the component placement area.

A component mounting device is known that picks up dies (components) from a diced wafer and mounts them on a substrate. In this component mounting device, a camera unit captures images of components on a wafer that has been brought into a predetermined position (component placement area) in the device by a wafer feeder, performs component recognition, and then picks up the components using a head unit equipped with a component suction and holding function. This operation is repeated. In other words, the camera unit moves horizontally along the camera movement axis to capture an image of the component, thereby recognizing the position of the component to be suction-held by the head unit, and the head unit moves horizontally along the head movement axis toward the recognized position to pick up the component. Therefore, in order to prevent the occurrence of defects such as component suction errors by the head unit, the movement position of the camera unit during component recognition by the image capture of the camera unit must match the movement position of the head unit.

Patent Document 1 discloses a technology for creating data for correcting the control of the movement of a head unit and a camera unit. This technology creates correlation data that indicates the correlation between the coordinate systems of the head unit and the camera unit. Then, the amount of movement when moving the head unit to the position of a part recognized by the camera unit is corrected based on the correlation data. This allows the head unit to be accurately moved to the position of the part recognized by the camera unit.

However, there are cases where a parallel misalignment occurs between the head movement axis and the camera movement axis, and in this case, with the technology of Patent Document 1, there is a risk of a positional misalignment occurring between the movement position of the camera unit when recognizing parts and the movement position of the head unit.

JP 2009-10167 A

The object of the present invention is to suppress misalignment of the moving positions of the head unit and the camera unit in a component transfer device having a head unit that picks components from a component placement area and a camera unit that captures images of the components in the component placement area.

A component transfer device according to one aspect of the present invention comprises a component supply unit having a component placement area in which a plurality of components are placed, a head unit which is movable horizontally along a head movement axis within a predetermined head movement area in the space above the component placement area and is equipped with a head camera for picking up the components in the component placement area, a camera unit which is movable horizontally along a camera movement axis within a predetermined camera movement area in the space above the component placement area and has a component camera for capturing images of the components in the component placement area, a mark unit which is positioned at a predetermined position below a common area where the head movement area and the camera movement area overlap and is provided with a mark recognizable by each of the head camera and the component camera, a movement control unit which controls the movement of the head unit and the movement of the camera unit, and a correction data creation unit which creates data for correcting control by the movement control unit. The correction data creation unit performs a mark position recognition process to generate first mark position recognition data indicating a recognition result of the position of the mark based on first mark image data obtained by imaging the mark by the head camera, and to generate second mark position recognition data indicating a recognition result of the position of the mark based on second mark image data obtained by imaging the mark by the component camera. The correction data creation unit also performs a parallel deviation correction process to generate parallel deviation correction data for correcting parallel deviation between the head movement axis and the camera movement axis based on the first mark position recognition data and the second mark position recognition data.

The objects, features and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings.

1 is a plan view seen from above showing an overall configuration of a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a schematic perspective view showing a head unit and a push-up unit. FIG. 2 is a diagram showing areas in which a head unit and a camera unit move. FIG. 2 is a block diagram showing a control configuration of the component mounting apparatus. 11A to 11C are diagrams illustrating the operations of the head unit, the camera unit, and the push-up unit when the control unit executes component suction and mounting control. 13A to 13C are diagrams illustrating operations of the head unit and the camera unit when the control unit executes first correction data generation control. 11A to 11C are diagrams for explaining the mark position recognition process and the position calculation process in the correction data creation unit when the control unit executes the first correction data generation control. 11A to 11C are diagrams for explaining a parallel deviation correction process in the correction data creation unit when the control unit executes first correction data generation control. 11A to 11C are diagrams for explaining head axis correction processing and camera axis correction processing in the correction data creation unit when the control unit executes first correction data generation control. 13A to 13C are diagrams illustrating the operations of the camera unit and the thrust-up unit when the control unit executes second correction data generation control. 11A to 11C are diagrams for explaining a pin position recognition process, a thrust-up position calculation process, and a thrust-up axis correction process in the correction data creation unit when the control unit executes second correction data generation control.

Below, an embodiment of the present invention will be described in detail with reference to the drawings. In the following, directional relationships will be described using XYZ orthogonal coordinate axes. The X and Y directions are perpendicular to each other on a horizontal plane, and the Z direction is a direction extending vertically perpendicular to both the X and Y directions. Furthermore, one side of the X direction will be referred to as the "+X side", and the other side opposite the one side of the X direction will be referred to as the "-X side". Similarly, one side of the Y direction will be referred to as the "+Y side", and the other side opposite the one side of the Y direction will be referred to as the "-Y side".

The component transfer device of the present invention can be applied to various devices, such as a taping device that stores dies diced from a wafer on tape, a die bonder that wire bonds the dies to a substrate, or a component mounting device that mounts the dies on a substrate. Here, we will explain an example in which the component transfer device of the present invention is applied to a component mounting device.

[Overall configuration of component mounting device]
1, the component mounting device 1 according to the present embodiment is a device that loads (mounts) a die 7a (component) diced from a wafer 7 onto a substrate P (a predetermined component transfer section). As shown in Fig. 1 and Fig. 2, the component mounting device 1 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a wafer supply device 6, a camera unit 32U, and a push-up unit 40.

The base 2 is a mounting base for various devices equipped in the component mounting device 1. The conveyor 3 is a transport line for the substrate P, installed on the base 2 to extend in the X direction. The conveyor 3 transports the substrate P from outside the machine to a predetermined mounting work position, and after mounting work, transports the substrate P from the mounting work position to outside the machine. The conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting work position. The position where the substrate P is shown in Figure 1 is the mounting work position.

The component supply unit 5 supplies a plurality of dies 7a in a diced arrangement from the wafer 7. The component supply unit 5 includes a wafer supply device 6 that supplies the wafer 7 divided into a plurality of dies 7a while being held on a pallet 8 to the wafer stage 10 (component arrangement area). The wafer 7 is a disk-shaped semiconductor wafer on which a circuit pattern or the like has already been formed. The pallet 8 holds a wafer sheet 8a. A collection of a number of dies 7a, 7a... formed by dicing the wafer 7 into a checkerboard pattern is attached to the wafer sheet 8a. In other words, the wafer supply device 6 supplies the wafer 7 with a plurality of dies 7a attached to the wafer sheet 8a while being held on the pallet 8 to the wafer stage 10. In addition to the wafer supply device 6, the component supply unit 5 may include a tape feeder that supplies components in the form of a component-containing tape containing electronic components.

The wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10, and a wafer conveyor 11. The wafer storage elevator 9 stores wafers 7, each having a plurality of dies 7a attached to a wafer sheet 8a, in multiple vertical stages, held on a pallet 8. The wafer stage 10 is installed on the base 2 at a position on the -Y side of the wafer storage elevator 9. The wafer stage 10 is positioned on the +Y side of the loading operation position, which is the stopping position of the substrate P. In this embodiment, the wafer stage 10, which is the area where the diced wafer 7 is placed on the base 2, is the component placement area. The wafer conveyor 11 pulls out the pallet 8 from the wafer storage elevator 9 onto the wafer stage 10.

The head unit 4 picks up the die 7a from the wafer 7 on the wafer stage 10, moves to the mounting operation position, and mounts the die 7a on the substrate P. The head unit 4 has a plurality of heads 4H that adsorb and hold the die 7a when picking it, and releases the held die 7a when mounting it on the substrate P. The heads 4H can move forward and backward (up and down) in the Z direction relative to the head unit 4, and can rotate around an axis. The head unit 4 is equipped with a head camera 31 that images the substrate P. The feudal mark affixed to the substrate P is recognized from the image captured by the head camera 31. This allows any misalignment of the substrate P to be recognized, and the misalignment is corrected when mounting components on the substrate P.

A component recognition camera 30 is mounted on the base 2. The component recognition camera 30 captures an image of the die 7a that is adsorbed to the head 4H of the head unit 4 from below before the die 7a is mounted on the substrate P. Based on this captured image, any abnormalities or errors in adsorption of the die 7a by the head 4H are determined.

The component mounting device 1 is provided with a first drive mechanism D1 that allows the head unit 4 to move in the horizontal direction (X direction and Y direction) at least in the space above the wafer stage 10 and the substrate P held at the mounting work position. The first drive mechanism D1 is provided with a pair of Y-axis fixed rails 13, a head Y-axis servo motor 14, and a head Y moving shaft 15 on the +X side and -X side, respectively, as a Y-direction moving mechanism for the head unit 4. The pair of Y-axis fixed rails 13 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined interval in the X direction. The head Y moving shaft 15 is a ball screw shaft arranged to extend in the Y direction at a position close to the Y-axis fixed rails 13. The head Y-axis servo motor 14 rotates and drives the head Y moving shaft 15. A support frame 16 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 13. Nuts 17 that are screwed onto the head Y moving shafts 15 are attached to the +X side end and the −X side end of the support frame 16 .

The first drive mechanism D1 comprises a guide member (not shown) mounted on the support frame 16, a head X-axis servomotor 18, and a head X moving shaft 19 as an X-direction movement mechanism for the head unit 4. The guide member is a member that guides the movement of the head unit 4 in the X direction, and is fixed to the +Y side surface of the support frame 16 so as to extend in the X direction. The head X moving shaft 19 is a ball screw shaft arranged to extend in the X direction close to the guide member. The head X-axis servomotor 18 rotates and drives the head X moving shaft 19. A nut (not shown) is attached to the head unit 4, and the nut is screwed onto the head X moving shaft 19.

According to the first drive mechanism D1 having the above configuration, the head Y-axis servo motor 14 is operated to rotate the head Y movement axis 15, so that the head unit 4 moves in the Y direction together with the support frame 16. In addition, the head X-axis servo motor 18 is operated to rotate the head X movement axis 19, so that the head unit 4 moves in the X direction relative to the support frame 16.

3, the head unit 4 can move horizontally along the head Y movement axis 15 and the head X movement axis 19 within a predetermined head movement area A1 in the space above the wafer stage 10 of the component supply unit 5. The head movement area A1 is an area corresponding to the installation range of the head Y movement axis 15 extending in the Y direction and the head X movement axis 19 extending in the X direction. The head movement area A1 has a size in the Y direction from the space above the wafer stage 10 through the conveyor 3 to the space above the component recognition camera 30. The head Y movement axis 15 and the head X movement axis 19 that define the head movement area A1 define an XY coordinate system when the head unit 4 moves. In other words, the movement position of the head unit 4 can be expressed by the XY coordinates of the XY coordinate system defined by the head Y movement axis 15 and the head X movement axis 19.

The head Y-axis servo motor 14 is provided with a head Y movement amount detection unit 14A (FIG. 4) composed of an encoder or the like. The head Y movement amount detection unit 14A detects the amount of movement of the head unit 4 in the Y direction along the head Y movement axis 15 by detecting the drive amount of the head Y-axis servo motor 14. Similarly, the head X-axis servo motor 18 is provided with a head X movement amount detection unit 18A (FIG. 4) composed of an encoder or the like. The head X movement amount detection unit 18A detects the amount of movement of the head unit 4 in the X direction along the head X movement axis 19 by detecting the drive amount of the head X-axis servo motor 18. Based on the detection results of the movement amount of the head unit 4 by the head Y movement amount detection unit 14A and the head X movement amount detection unit 18A, the theoretical movement position of the head unit 4 (XY coordinates in the XY coordinate system) can be obtained.

The camera unit 32U is a unit that can move in the X and Y directions, and is equipped with a wafer camera 32 (component camera). The wafer camera 32 captures an image of a portion of the wafer 7 positioned on the wafer stage 10, i.e., the die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized. The component mounting device 1 is equipped with a second drive mechanism D2 that can move the camera unit 32U in the horizontal direction (X direction and Y direction) at least in the upper space between the wafer stage 10 and a predetermined waiting position. This second drive mechanism D2 is a drive system that is separate and independent from the first drive mechanism D1 that drives the head unit 4. In this embodiment, the waiting position is a position separated from the wafer stage 10 on the +Y side.

The second drive mechanism D2 includes a pair of Y-axis fixed rails 33 on the +X side and the -X side, and a camera Y-axis servo motor 34 and a camera Y moving shaft 35 arranged on the +X side as a Y-direction moving mechanism for the camera unit 32U. The pair of Y-axis fixed rails 33 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined interval in the X direction. The camera Y moving shaft 35 is a ball screw shaft arranged to extend in the Y direction at a position close to the Y-axis fixed rail 33 on the +X side. The camera Y-axis servo motor 34 rotates and drives the camera Y moving shaft 35. A support frame 36 that supports the camera unit 32U is installed between the pair of Y-axis fixed rails 33. A nut 37 that is screwed onto the camera Y moving shaft 35 is attached to the +X side end of the support frame 36.

The second drive mechanism D2 comprises a guide member (not shown) mounted on the support frame 36, a camera X-axis servo motor 38, and a camera X movement shaft 39 as an X-direction movement mechanism for the camera unit 32U. The guide member is a member that guides the movement of the camera unit 32U in the X direction, and is fixed to the -Y side surface of the support frame 36 so as to extend in the X direction. The camera X movement shaft 39 is a ball screw shaft arranged to extend in the X direction close to the guide member. The camera X-axis servo motor 38 rotates and drives the camera X movement shaft 39. A nut (not shown) is attached to the camera unit 32U, and the nut is screwed onto the camera X movement shaft 39.

According to the second drive mechanism D2 having the above configuration, the camera Y-axis servo motor 34 is actuated to rotate the camera Y movement axis 35, so that the camera unit 32U moves in the Y direction together with the support frame 36. In addition, the camera X-axis servo motor 38 is actuated to rotate the camera X movement axis 39, so that the camera unit 32U moves in the X direction relative to the support frame 36.

3, the camera unit 32U can move horizontally along the camera Y movement axis 35 and the camera X movement axis 39 within a predetermined camera movement area A2 in the space above the wafer stage 10 of the component supply unit 5. The camera movement area A2 is an area corresponding to the installation range of the camera Y movement axis 35 extending in the Y direction and the camera X movement axis 39 extending in the X direction. The camera movement area A2 has a size in the Y direction from the space above the wafer stage 10 to the space above the wafer storage elevator 9 on the +Y side. The camera Y movement axis 35 and the camera X movement axis 39 that define the camera movement area A2 define the XY coordinate system when the camera unit 32U moves. In other words, the movement position of the camera unit 32U can be expressed by the XY coordinates of the XY coordinate system defined by the camera Y movement axis 35 and the camera X movement axis 39.

The camera Y-axis servo motor 34 is provided with a camera Y movement amount detection unit 34A (FIG. 4) composed of an encoder or the like. The camera Y movement amount detection unit 34A detects the amount of movement of the camera unit 32U in the Y direction along the camera Y movement axis 35 by detecting the drive amount of the camera Y-axis servo motor 34. Similarly, the camera X-axis servo motor 38 is provided with a camera X movement amount detection unit 38A (FIG. 4) composed of an encoder or the like. The camera X movement amount detection unit 38A detects the amount of movement of the camera unit 32U in the X direction along the camera X movement axis 39 by detecting the drive amount of the camera X-axis servo motor 38. Based on the detection results of the movement amount of the camera unit 32U by the camera Y movement amount detection unit 34A and the camera X movement amount detection unit 38A, the theoretical movement position of the camera unit 32U (XY coordinates in the XY coordinate system) can be obtained.

The push-up unit 40 is disposed below the wafer stage 10 and pushes up the die 7a to be picked by the head unit 4 from the underside of the wafer sheet 8a. The push-up unit 40 is disposed on the base 2 so as to be movable in the XY directions over a range corresponding to the wafer stage 10. The push-up unit 40 is supported movably in the X direction by a support frame 42 which is movable along a pair of guide rails 41 extending in the Y direction.

The push-up Y-axis moving shaft 43, which is a ball screw shaft that screws into a nut portion (not shown) provided inside the support frame 42, is rotated and driven by the push-up Y-axis servo motor 44. As a result, the push-up unit 40 moves in the Y direction together with the support frame 42. In addition, the support frame 42 is provided with a push-up X-axis moving shaft 45, which is a ball screw shaft that screws into a nut portion (not shown) provided inside the push-up unit 40. The push-up X-axis moving shaft 45 is rotated and driven by the push-up X-axis servo motor 46, so that the push-up unit 40 moves in the X-axis direction. The push-up unit 40 has a push-up pin 47 that pushes up the die 7a. When the head 4H adsorbs the die 7a, the push-up pin 47 rises and pushes up the die 7a through the wafer sheet 8a. The push-up pin 47 is raised and lowered by the pin lift motor 48 (FIG. 4).

The push-up unit 40 is movable horizontally below the wafer stage 10 along the push-up Y movement axis 43 and the push-up X movement axis 45. The push-up Y movement axis 43 and the push-up X movement axis 45 define an XY coordinate system along which the push-up unit 40 moves. In other words, the movement position of the push-up unit 40 can be expressed by the XY coordinates of the XY coordinate system defined by the push-up Y movement axis 43 and the push-up X movement axis 45.

The thrust Y-axis servo motor 44 is provided with a thrust Y movement amount detection unit 44A (FIG. 4) composed of an encoder or the like. The thrust Y movement amount detection unit 44A detects the amount of movement of the thrust unit 40 in the Y direction along the thrust Y movement axis 43 by detecting the drive amount of the thrust Y-axis servo motor 44. Similarly, the thrust X-axis servo motor 46 is provided with a thrust X movement amount detection unit 46A (FIG. 4) composed of an encoder or the like. The thrust X movement amount detection unit 46A detects the amount of movement of the thrust unit 40 in the X direction along the thrust X movement axis 45 by detecting the drive amount of the thrust X-axis servo motor 46. Based on the detection results of the movement amount of the thrust unit 40 by the thrust Y movement amount detection unit 44A and the thrust X movement amount detection unit 46A, the theoretical movement position of the thrust unit 40 (XY coordinates in the XY coordinate system) can be obtained.

Also, as shown in FIG. 3, in the component mounting device 1 according to this embodiment, multiple mark sections 50 are arranged at predetermined positions below a common area CA where the head movement area A1 and the camera movement area A2 overlap in the space above the wafer stage 10. The number of mark sections 50 arranged is not particularly limited as long as it is two or more. Furthermore, the location of the mark sections 50 is not particularly limited as long as it is below the common area CA. Each mark section 50 is provided with a mark 50M that can be recognized by the head camera 31 mounted on the head unit 4 and the wafer camera 32 mounted on the camera unit 32U.

[Control configuration of component mounting device]
Next, the control configuration of the component mounting device 1 will be described with reference to the block diagram of Fig. 4. The component mounting device 1 includes a control unit 20 that comprehensively controls the operation of each unit of the component mounting device 1. The control unit 20 is electrically connected to each device of the head unit 4, the camera unit 32U, and the push-up unit 40, the wafer supply device 6, and the component recognition camera 30. The control unit 20 operates to functionally include a wafer supply control unit 21, a movement control unit 22, a correction data creation unit 23, and a storage unit 24 by executing a predetermined program.

The memory unit 24 stores various programs such as an implementation program and various data. In this embodiment, the memory unit 24 stores correction data created by the correction data creation unit 23 described later.

The wafer supply control unit 21 controls the wafer supply device 6 so that the wafer 7 divided into multiple dies 7a is supplied to the wafer stage 10 while being held on a pallet 8.

The movement control unit 22 controls the movement of the head unit 4 in the XY directions along the head Y movement axis 15 and head X movement axis 19 by controlling the drive of the head Y-axis servo motor 14 and head X-axis servo motor 18 with respect to the head unit 4. The movement control unit 22 also controls the drive of the Z-axis servo motor 401 to control the movement of the head 4H in the Z direction (up and down movement), and controls the drive of the R-axis servo motor 402 to control the rotational movement of the head 4H around its own axis. When the head Y-axis servo motor 14 and head X-axis servo motor 18 are driven under the control of the movement control unit 22, the movement amount of the head unit 4 is detected by the head Y movement amount detection unit 14A and head X movement amount detection unit 18A.

In addition, the movement control unit 22 controls the movement of the camera unit 32U in the X and Y directions along the camera Y movement axis 35 and the camera X movement axis 39 by controlling the driving of the camera Y-axis servo motor 34 and the camera X-axis servo motor 38 with respect to the camera unit 32U. When the camera Y-axis servo motor 34 and the camera X-axis servo motor 38 are driven under the control of the movement control unit 22, the movement amount of the camera unit 32U is detected by the camera Y movement amount detection unit 34A and the camera X movement amount detection unit 38A.

In addition, the movement control unit 22 controls the movement of the push-up unit 40 in the XY directions along the push-up Y movement axis 43 and the push-up X movement axis 45 by controlling the drive of the push-up Y-axis servo motor 44 and the push-up X-axis servo motor 46 with respect to the push-up unit 40. In addition, the movement control unit 22 controls the lifting and lowering movement of the push-up pin 47 by controlling the drive of the pin lifting and lowering motor 48. When the push-up Y-axis servo motor 44 and the push-up X-axis servo motor 46 are driven under the control of the movement control unit 22, the movement amount of the push-up unit 40 is detected by the push-up Y movement amount detection unit 44A and the push-up X movement amount detection unit 46A.

The correction data creation unit 23 creates data for correcting the control by the movement control unit 22. The correction data creation unit 23 includes, as functional components, a head position calculation unit 231, a camera position calculation unit 232, a thrust-up position calculation unit 233, a mark position recognition processing unit 234, a pin position recognition processing unit 235, a parallel deviation correction processing unit 236, a head axis correction processing unit 237, a camera axis correction processing unit 238, and a thrust-up axis correction processing unit 239. Details of the processing performed by each functional component in the correction data creation unit 23 will be described later.

[Control operation of the control unit]
In this embodiment, the control unit 20 executes component suction and mounting control, first correction data generation control, and second correction data generation control. The component suction and mounting control is a control for performing an operation of suctioning the die 7a by the head 4H of the head unit 4 and mounting it on the substrate P. The first correction data generation control and the second correction data generation control are controls that are executed before the component suction and mounting control, and data for correcting the control of the movement control unit 22 is created by the correction data creation unit 23.

<Component pickup and placement control>
The operation of the component mounting apparatus 1 when the control unit 20 executes the component suction and mounting control will be described with reference to FIG.

The movement control unit 22 controls the movement of the camera unit 32U in the XY directions so that the camera unit 32U is positioned at the position of the die 7a to be picked up by the head 4H on the wafer 7. At this time, the wafer camera 32 mounted on the camera unit 32U captures an image of the die 7a. The movement control unit 22 recognizes the position (pickup position) of the die 7a to be picked up by the head 4H based on image data acquired by the wafer camera 32 capturing an image of the die 7a.

After recognizing the suction position, the movement control unit 22 controls the movement of the push-up unit 40 in the XY directions so that the push-up unit 40 is positioned below the suction position. With the push-up unit 40 positioned below the suction position, the movement control unit 22 controls the lifting and lowering movement of the push-up pins 47. As a result, the push-up pins 47 push up the die 7a that is the target of suction by the head 4H.

When the die 7a is pushed up by the push-up pins 47, the movement control unit 22 controls the movement of the head unit 4 in the XY directions so that the head unit 4 is positioned above the recognized suction position. With the head unit 4 positioned above the suction position, the movement control unit 22 controls the movement of the head 4H in the Z direction and also controls the rotational movement of the head 4H about its own axis. As a result, the head 4H suctions and holds the die 7a.

When the die 7a is adsorbed and held by the head 4H, the movement control unit 22 controls the movement of the head unit 4 in the XY directions so that the head unit 4 is positioned above the substrate P. At this time, the head camera 31 mounted on the head unit 4 captures an image of the substrate P. The feudal marks affixed to the substrate P are recognized from the image captured by the head camera 31. This allows any misalignment of the substrate P to be recognized, and the misalignment is corrected when components are mounted on the substrate P. With the head unit 4 positioned above the substrate P, the movement control unit 22 controls the movement of the head 4H in the Z direction and also controls the rotational movement of the head 4H around its own axis. As a result, the head 4H mounts the die 7a on the substrate P.

As described above, when the control unit 20 executes the component suction and mounting control, the camera unit 32U moves in the XY direction along the camera Y movement axis 35 and the camera X movement axis 39 under the control of the movement control unit 22 to capture an image of the die 7a with the wafer camera 32, thereby enabling the position of the die 7a to be picked up by the head 4H of the head unit 4 to be recognized. Then, under the control of the movement control unit 22, the head unit 4 moves in the XY direction along the head Y movement axis 15 and the head X movement axis 19 toward the recognized position to pick up the die 7a. At this time, since the camera unit 32U and the head unit 4 are provided separately and independently, the camera unit 32U can recognize the next die 7a to be picked up in parallel with the picking operation of the die 7a by the head unit 4. This allows the work cycle from capturing an image of the die 7a by the wafer camera 32 of the camera unit 32U to picking up the die 7a by the head unit 4 to be accelerated.

<First Correction Data Generation Control>
The operation of the component mounting apparatus 1 when the control unit 20 executes the first correction data generation control will be described with reference to Fig. 6 to Fig. 9. The first correction data generation control is a control executed when the correction data creation unit 23 creates data for correcting the control of the movement control unit 22 in the component suction and mounting control described above. When the control unit 20 executes the first correction data generation control, the correction data creation unit 23 creates data for correcting parallel deviations regarding the head Y movement axis 15 and the head X movement axis 19, and the camera Y movement axis 35 and the camera X movement axis 39, as well as data for correcting distortion.

As shown in Figure 6, the movement control unit 22 controls the movement of the head unit 4 in the XY directions so that the head camera 31 is positioned above the mark section 50 installed below the common area CA. At this time, the head camera 31 mounted on the head unit 4 captures an image of each mark 50M of the multiple mark sections 50. By capturing an image of each mark 50M, the head camera 31 obtains, for each mark 50M, first mark image data MGD1 indicating image data of each mark 50M.

When the head unit 4 moves in response to the imaging of the mark 50M by the head camera 31, the head Y movement amount detection unit 14A detects the amount of movement of the head unit 4 in the Y direction along the head Y movement axis 15 by detecting the drive amount of the head Y axis servo motor 14. The head Y movement amount detection unit 14A obtains head Y movement amount data HMDY indicating the detection result for each mark 50M. In other words, the head Y movement amount data HMDY is data indicating the theoretical movement amount of the head unit 4 along the head Y movement axis 15 based on the drive amount of the head Y axis servo motor 14 corresponding to the imaging of the mark 50M by the head camera 31. Similarly, the head X movement amount detection unit 18A detects the drive amount of the head X axis servo motor 18 to detect the amount of movement of the head unit 4 in the X direction along the head X movement axis 19. The head X movement amount detection unit 18A obtains head X movement amount data HMDX indicating the detection result for each mark 50M. In other words, the head X movement amount data HMDX is data that indicates the theoretical movement amount of the head unit 4 along the head X movement axis 19 based on the drive amount of the head X-axis servo motor 18 corresponding to the image of the mark 50M by the head camera 31.

Movement control unit 22 also controls movement of camera unit 32U in the XY directions so that wafer camera 32 is positioned above mark section 50 installed below common area CA. At this time, wafer camera 32 mounted on camera unit 32U captures an image of each mark 50M of multiple mark sections 50. By capturing an image of each mark 50M, wafer camera 32 acquires second mark image data MGD2 indicating image data of each mark 50M for each mark 50M.

When the camera unit 32U moves in response to the imaging of the mark 50M by the wafer camera 32, the camera Y movement amount detection unit 34A detects the amount of movement of the camera unit 32U in the Y direction along the camera Y movement axis 35 by detecting the drive amount of the camera Y axis servo motor 34. The camera Y movement amount detection unit 34A acquires the camera Y movement amount data CMDY indicating the detection result for each mark 50M. In other words, the camera Y movement amount data CMDY is data indicating the theoretical movement amount of the camera unit 32U along the camera Y movement axis 35 based on the drive amount of the camera Y axis servo motor 34 corresponding to the imaging of the mark 50M by the wafer camera 32. Similarly, the camera X movement amount detection unit 38A detects the drive amount of the camera X axis servo motor 38 to detect the movement amount of the camera unit 32U in the X direction along the camera X movement axis 39. The camera X movement amount detection unit 38A acquires the camera X movement amount data CMDX indicating the detection result for each mark 50M. In other words, the camera X movement amount data CMDX is data that indicates the theoretical movement amount of the camera unit 32U along the camera X movement axis 39 based on the drive amount of the camera X-axis servo motor 38 corresponding to the imaging of the mark 50M by the wafer camera 32.

7, the first mark image data MGD1 acquired by the head camera 31 and the second mark image data MGD2 acquired by the wafer camera 32 are input to the mark position recognition processing unit 234 of the correction data creation unit 23. The mark position recognition processing unit 234 performs a mark position recognition process to recognize the position of the mark 50M affixed to the mark unit 50 within the common area CA based on the first mark image data MGD1 and the second mark image data MGD2.

Specifically, the mark position recognition processing unit 234 generates, for each mark 50M, first mark position recognition data MRD1 indicating the recognition result of the position of the mark 50M according to the image captured by the head camera 31 mounted on the head unit 4, based on the first mark image data MGD1. The first mark position recognition data MRD1 is data indicating the actual movement position of the head unit 4 when the image of the mark 50M is captured by the head camera 31. In other words, the first mark position recognition data MRD1 is data indicating the actual position of the head unit 4 in the XY coordinate system defined by the head Y movement axis 15 and the head X movement axis 19 when the image of the mark 50M is captured by the head camera 31.

Furthermore, the mark position recognition processing unit 234 generates, for each mark 50M, second mark position recognition data MRD2 indicating the recognition result of the position of the mark 50M according to the image captured by the wafer camera 32 mounted on the camera unit 32U, based on the second mark image data MGD2. The second mark position recognition data MRD2 is data indicating the actual movement position of the camera unit 32U when the image of the mark 50M is captured by the wafer camera 32. In other words, the second mark position recognition data MRD2 is data indicating the actual position of the camera unit 32U in the XY coordinate system defined by the camera Y movement axis 35 and the camera X movement axis 39 when the image of the mark 50M is captured by the wafer camera 32.

7, the head Y movement amount data HMDY acquired by the head Y movement amount detection unit 14A and the head X movement amount data HMDX acquired by the head X movement amount detection unit 18A are input to the head position calculation unit 231 of the correction data creation unit 23. The head position calculation unit 231 performs a position calculation process to calculate the theoretical position of the head unit 4 when the mark 50M is imaged by the head camera 31 based on the head Y movement amount data HMDY and the head X movement amount data HMDX. Then, the head position calculation unit 231 generates head position data HPD indicating the result of the calculation process. The head position data HPD is data indicating the theoretical movement position of the head unit 4 when the mark 50M is imaged by the head camera 31. In other words, the head position data HPD is data indicating the theoretical position of the head unit 4 in the XY coordinate system defined by the head Y movement axis 15 and the head X movement axis 19 when the mark 50M is imaged by the head camera 31.

7, the camera Y movement amount data CMDY acquired by the camera Y movement amount detection unit 34A and the camera X movement amount data CMDX acquired by the camera X movement amount detection unit 38A are input to the camera position calculation unit 232 of the correction data creation unit 23. The camera position calculation unit 232 performs a position calculation process to calculate the theoretical position of the camera unit 32U when the wafer camera 32 captures the image of the mark 50M based on the camera Y movement amount data CMDY and the camera X movement amount data CMDX. The camera position calculation unit 232 then generates camera position data CPD indicating the result of the calculation process. The camera position data CPD is data indicating the theoretical movement position of the camera unit 32U when the wafer camera 32 captures the image of the mark 50M. That is, the camera position data CPD is data indicating the theoretical position of the camera unit 32U in the XY coordinate system defined by the camera Y movement axis 35 and the camera X movement axis 39 when the wafer camera 32 images the mark 50M.

In order to prevent the occurrence of defects such as a picking error of the die 7a by the head unit 4 during the execution of the component suction and mounting control by the control unit 20 described above, the movement position of the camera unit 32U when recognizing the position of the die 7a by the image of the wafer camera 32 must match the movement position of the head unit 4. In this case, if a parallel shift occurs between the head Y movement axis 15 and the camera Y movement axis 35 and a parallel shift occurs between the head X movement axis 19 and the camera X movement axis 39, there is a risk of a position shift occurring between the movement position of the camera unit 32U and the movement position of the head unit 4. For example, as shown in FIG. 8, a situation may occur in which the first mark position recognition data MRD1 indicating the actual movement position of the head unit 4 when the mark 50M is imaged by the head camera 31 does not match the second mark position recognition data MRD2 indicating the actual movement position of the camera unit 32U when the mark 50M is imaged by the wafer camera 32.

8, the parallel deviation correction processing unit 236 of the correction data creation unit 23 performs parallel deviation correction processing. The first mark position recognition data MRD1 and the second mark position recognition data MRD2 for each mark 50M generated by the mark position recognition processing unit 234 are input to the parallel deviation correction processing unit 236. Based on the first mark position recognition data MRD1 and the second mark position recognition data MRD2, the parallel deviation correction processing unit 236 corrects the parallel deviation between the head Y movement axis 15 and the camera Y movement axis 35, and creates parallel deviation correction data PDCD for correcting the parallel deviation between the head X movement axis 19 and the camera X movement axis 39. The parallel deviation correction processing unit 236 virtually rotates the head Y movement axis 15 and the camera Y movement axis 35 around an axis extending in the Z direction so that the first mark position recognition data MRD1 and the second mark position recognition data MRD2 coincide with each other, thereby creating the parallel deviation correction data PDCD. The parallel deviation correction data PDCD is stored in the storage unit 24 .

When the control unit 20 executes the component suction and placement control, the parallel deviation correction data PDCD is read from the memory unit 24. As a result, when the control unit 20 executes the component suction and placement control, the movement amount of the head unit 4 and the camera unit 32U can be corrected based on the parallel deviation correction data PDCD when the movement control unit 22 controls the movement of the head unit 4 and the camera unit 32U. As a result, even if a parallel deviation occurs between the head Y movement axis 15 and the camera Y movement axis 35 and a parallel deviation occurs between the head X movement axis 19 and the camera X movement axis 39, the positional deviation between the movement position of the camera unit 32U and the movement position of the head unit 4 can be suppressed. Therefore, it is possible to suppress the occurrence of defects such as a picking error of the die 7a by the head unit 4 due to the parallel deviation between the head Y movement axis 15 and the head X movement axis 19 and the camera Y movement axis 35 and the camera X movement axis 39.

Furthermore, if distortion occurs in the head Y movement axis 15 and head X movement axis 19, causing distortion in the XY coordinate system defined by the head Y movement axis 15 and head X movement axis 19, there is a risk of a positional deviation occurring between the actual movement position and the theoretical movement position of the head unit 4. For example, as shown in Figure 9, when the head camera 31 captures an image of the mark 50M, a situation may arise in which the first mark position recognition data MRD1 indicating the actual movement position of the head unit 4 and the head position data HPD indicating the theoretical movement position of the head unit 4 do not match.

9, the head axis correction processing unit 237 of the correction data creation unit 23 performs head axis correction processing. The head axis correction processing unit 237 receives the first mark position recognition data MRD1 for each mark 50M generated by the mark position recognition processing unit 234 and the head position data HPD for each mark 50M generated by the head position calculation unit 231. The head axis correction processing unit 237 generates head axis correction data HACD for correcting the distortion of the head Y movement axis 15 and the head X movement axis 19 based on the first mark position recognition data MRD1 and the head position data HPD. The head axis correction processing unit 237 creates the head axis correction data HACD by virtually adjusting the orthogonality of the head X movement axis 19 with respect to the head Y movement axis 15 so that the first mark position recognition data MRD1 and the head position data HPD match. The head axis correction data HACD is stored in the memory unit 24.

When component suction and loading control is being executed by the control unit 20, the head axis correction data HACD is read from the memory unit 24. As a result, when component suction and loading control is being executed by the control unit 20, the amount of movement of the head unit 4 can be corrected based on the head axis correction data HACD when the movement control unit 22 controls the movement of the head unit 4. Therefore, even if distortion occurs in the head Y movement axis 15 and the head X movement axis 19, the head unit 4 can be moved to the correct position.

Furthermore, if distortion occurs in the camera Y movement axis 35 and the camera X movement axis 39, causing distortion in the XY coordinate system defined by the camera Y movement axis 35 and the camera X movement axis 39, there is a risk of a positional deviation occurring between the actual movement position and the theoretical movement position of the camera unit 32U. For example, as shown in Figure 9, when the wafer camera 32 captures an image of the mark 50M, a situation may arise in which the second mark position recognition data MRD2 indicating the actual movement position of the camera unit 32U does not match the camera position data CPD indicating the theoretical movement position of the camera unit 32U.

9, the camera axis correction processing unit 238 of the correction data creation unit 23 performs a camera axis correction process. The camera axis correction processing unit 238 receives the second mark position recognition data MRD2 for each mark 50M generated by the mark position recognition processing unit 234 and the camera position data CPD for each mark 50M generated by the camera position calculation unit 232. The camera axis correction processing unit 238 generates camera axis correction data CACD for correcting the distortion of the camera Y movement axis 35 and the camera X movement axis 39 based on the second mark position recognition data MRD2 and the camera position data CPD. The camera axis correction processing unit 238 creates the camera axis correction data CACD by virtually adjusting the orthogonality of the camera X movement axis 39 with respect to the camera Y movement axis 35 so that the second mark position recognition data MRD2 and the camera position data CPD match. The camera axis correction data CACD is stored in the storage unit 24.

When the control unit 20 is executing component suction and loading control, the camera axis correction data CACD is read from the memory unit 24. As a result, when the control unit 20 is executing component suction and loading control, the movement amount of the camera unit 32U can be corrected based on the camera axis correction data CACD when the movement control unit 22 controls the movement of the camera unit 32U. Therefore, even if distortion occurs in the camera Y movement axis 35 and the camera X movement axis 39, the camera unit 32U can be moved to an appropriate position.

It has been described that the head axis correction processing unit 237 performs the head axis correction processing using the first mark position recognition data MRD1 corresponding to the mark 50M of the mark unit 50, and the camera axis correction processing unit 238 performs the camera axis correction processing using the second mark position recognition data MRD2 corresponding to the mark 50M of the mark unit 50, but this is not limited to the above. The mark position recognition data used by the head axis correction processing unit 237 and the camera axis correction processing unit 238 during the axis correction processing may correspond to a mark attached to a jig that is detachably set on the wafer stage 10. The jig is a rectangular flat glass plate on which a large number of marks are attached at predetermined intervals in the XY direction. In this case, the first mark position recognition data MRD1 used by the head axis correction processing unit 237 during the head axis correction processing is data indicating the recognition result of the position of the mark attached to the jig according to the image captured by the head camera 31 mounted on the head unit 4. Similarly, the second mark position recognition data MRD2 used by the camera axis correction processing unit 238 during camera axis correction processing is data indicating the recognition result of the position of the mark affixed to the jig in accordance with the image captured by the wafer camera 32 mounted on the camera unit 32U.

In addition, the head axis correction processing by the head axis correction processing unit 237 and the camera axis correction processing by the camera axis correction processing unit 238 are performed before the parallel shift correction processing by the parallel shift correction processing unit 236.

That is, the parallel deviation correction processing unit 236 performs the parallel deviation correction processing after the head axis correction processing by the head axis correction processing unit 237 and the camera axis correction processing by the camera axis correction processing unit 238 are performed. In this case, when the parallel deviation correction processing unit 236 performs the parallel deviation correction processing, the movement control unit 22 controls the movement of the head unit 4 using the head axis correction data HACD and controls the movement of the camera unit 32U using the camera axis correction data CACD. Specifically, the movement control unit 22 controls the movement of the head unit 4 in the XY direction so that the head camera 31 is positioned above the mark unit 50 installed below the common area CA, with the amount of movement of the head unit 4 corrected based on the head axis correction data HACD. Similarly, the movement control unit 22 controls the movement of the camera unit 32U in the XY direction so that the wafer camera 32 is positioned above the mark unit 50, with the amount of movement of the camera unit 32U corrected based on the camera axis correction data CACD.

<Second Correction Data Generation Control>
The operation of the component mounting apparatus 1 when the control unit 20 executes the second correction data generation control will be described with reference to Figs. 10 and 11. The second correction data generation control is a control executed when the correction data creation unit 23 creates data for correcting the control of the movement control unit 22 in the component suction and mounting control described above. The control unit 20 executes the second correction data generation control after the first correction data generation control described above. When the control unit 20 executes the second correction data generation control, the correction data creation unit 23 creates data for correcting distortions of the push-up Y movement axis 43 and the push-up X movement axis 45.

10, the movement control unit 22 controls the movement of the camera unit 32U and the push-up unit 40 in the XY direction so that the push-up unit 40 moves in conjunction with the movement of the camera unit 32U. In other words, the movement control unit 22 controls the movement of the camera unit 32U and the push-up unit 40 in the XY direction so that the camera unit 32U moves in the XY direction and the push-up unit 40 moves while maintaining a state in which it is arranged below the camera unit 32U. Note that, when controlling the movement of the camera unit 32U, the movement control unit 22 uses the camera axis correction data CACD stored in the storage unit 24. In other words, the movement control unit 22 controls the movement of the camera unit 32U in a state in which the movement amount of the camera unit 32U is corrected based on the camera axis correction data CACD. At this time, the wafer camera 32 mounted on the camera unit 32U captures images of the push-up pins 47 of the push-up unit 40, which moves in conjunction with the camera unit 32U, at multiple movement points. The wafer camera 32 captures an image of the push-up pin 47 to obtain pin image data PGD representing image data of the push-up pin 47 for each of the plurality of movement points.

When the push-up unit 40 moves in conjunction with the movement of the camera unit 32U, the push-up Y movement amount detection unit 44A detects the amount of movement of the push-up unit 40 in the Y direction along the push-up Y movement axis 43 by detecting the drive amount of the push-up Y-axis servo motor 44. The push-up Y movement amount detection unit 44A acquires the push-up Y movement amount data PMDY indicating the detection result for each of the multiple movement points. In other words, the push-up Y movement amount data PMDY is data indicating the theoretical movement amount of the push-up unit 40 along the push-up Y movement axis 43 based on the drive amount of the push-up Y-axis servo motor 44 corresponding to the image of the push-up pin 47 by the wafer camera 32. Similarly, the push-up X movement amount detection unit 46A detects the drive amount of the push-up X-axis servo motor 46 to detect the movement amount of the push-up unit 40 in the X direction along the push-up X movement axis 45. The push-up X movement amount detection unit 46A obtains the push-up X movement amount data PMDX indicating the detection result for each of the plurality of movement points. That is, the push-up X movement amount data PMDX is data indicating the theoretical movement amount of the push-up unit 40 along the push-up X movement axis 45 based on the drive amount of the push-up X-axis servo motor 46 corresponding to the image of the push-up pin 47 captured by the wafer camera 32.

11, the pin image data PGD acquired by the wafer camera 32 is input to the pin position recognition processing unit 235 of the correction data creation unit 23. The pin position recognition processing unit 235 performs pin position recognition processing based on the pin image data PGD to recognize the positions of the push-up pins 47 in the push-up unit 40, which moves in conjunction with the camera unit 32U.

Specifically, the pin position recognition processing unit 235 generates, for each of the multiple movement points, pin position recognition data PRD indicating the recognition result of the position of the push-up pin 47 when the push-up unit 40 moves in conjunction with the camera unit 32U, based on the pin image data PGD. The pin position recognition data PRD is data indicating the actual movement position of the push-up unit 40 when the wafer camera 32 captures an image of the push-up pin 47. In other words, the pin position recognition data PRD is data indicating the actual position of the push-up unit 40 in the XY coordinate system defined by the push-up Y movement axis 43 and the push-up X movement axis 45 when the wafer camera 32 captures an image of the push-up pin 47.

11, the push-up Y movement amount data PMDY acquired by the push-up Y movement amount detection unit 44A and the push-up X movement amount data PMDX acquired by the push-up X movement amount detection unit 46A are input to the push-up position calculation unit 233 of the correction data creation unit 23. The push-up position calculation unit 233 performs a push-up position calculation process to calculate the theoretical position of the push-up unit 40 when moving in conjunction with the camera unit 32U based on the push-up Y movement amount data PMDY and the push-up X movement amount data PMDX. The push-up position calculation unit 233 then generates push-up position data PPD indicating the result of the calculation process. The push-up position data PPD is data indicating the theoretical movement position of the push-up unit 40 when moving in conjunction with the camera unit 32U. That is, the push-up position data PPD is data indicating the theoretical position in the XY coordinate system defined by the push-up Y movement axis 43 and the push-up X movement axis 45 of the push-up unit 40 when moving in conjunction with the camera unit 32U.

When distortion occurs in the push-up Y movement axis 43 and the push-up X movement axis 45, causing distortion in the XY coordinate system defined by the push-up Y movement axis 43 and the push-up X movement axis 45, there is a risk of a positional deviation occurring between the actual movement position and the theoretical movement position of the push-up unit 40. For example, as shown in Figure 11, when the wafer camera 32 captures an image of the push-up pin 47, a situation may arise in which the pin position recognition data PRD indicating the actual movement position of the push-up unit 40 does not match the push-up position data PPD indicating the theoretical movement position of the push-up unit 40.

Therefore, as shown in FIG. 11, the push-up axis correction processing unit 239 of the correction data creation unit 23 performs push-up axis correction processing. The push-up axis correction processing unit 239 receives the pin position recognition data PRD for each of the multiple movement points generated by the pin position recognition processing unit 235 and the push-up position data PPD for each of the multiple movement points generated by the push-up position calculation unit 233. The push-up axis correction processing unit 239 generates push-up axis correction data PACD for correcting the distortion of the push-up Y movement axis 43 and the push-up X movement axis 45 based on the pin position recognition data PRD and the push-up position data PPD. The push-up axis correction processing unit 239 creates the push-up axis correction data PACD by virtually adjusting the orthogonality of the push-up X movement axis 45 with respect to the push-up Y movement axis 43 so that the pin position recognition data PRD and the push-up position data PPD match. The push-up axis correction data PACD is stored in the memory unit 24.

When the control unit 20 is executing component suction and loading control, the push-up axis correction data PACD is read from the memory unit 24. As a result, when the control unit 20 is executing component suction and loading control, the amount of movement of the push-up unit 40 can be corrected based on the push-up axis correction data PACD when the movement of the push-up unit 40 is controlled by the movement control unit 22. Therefore, even if distortion occurs in the push-up Y movement axis 43 and the push-up X movement axis 45, the push-up unit 40 can be moved to an appropriate position.

The specific embodiments described above primarily include inventions having the following configurations:

A component transfer device according to one aspect of the present invention comprises a component supply unit having a component placement area in which a plurality of components are placed, a head unit which is movable horizontally along a head movement axis within a predetermined head movement area in the space above the component placement area and is equipped with a head camera for picking up the components in the component placement area, a camera unit which is movable horizontally along a camera movement axis within a predetermined camera movement area in the space above the component placement area and has a component camera for capturing images of the components in the component placement area, a mark unit which is positioned at a predetermined position below a common area where the head movement area and the camera movement area overlap and is provided with a mark recognizable by each of the head camera and the component camera, a movement control unit which controls the movement of the head unit and the movement of the camera unit, and a correction data creation unit which creates data for correcting control by the movement control unit. The correction data creation unit performs a mark position recognition process to generate first mark position recognition data indicating a recognition result of the position of the mark based on first mark image data obtained by imaging the mark by the head camera, and to generate second mark position recognition data indicating a recognition result of the position of the mark based on second mark image data obtained by imaging the mark by the component camera. The correction data creation unit also performs a parallel deviation correction process to generate parallel deviation correction data for correcting parallel deviation between the head movement axis and the camera movement axis based on the first mark position recognition data and the second mark position recognition data.

With this part transfer device, the camera unit moves horizontally along the camera movement axis under the control of the movement control unit to capture an image of the part with the part camera, thereby enabling the position of the part to be picked by the head unit to be recognized. Then, under the control of the movement control unit, the head unit moves horizontally along the head movement axis toward the recognized position to pick up the part. At this time, because the camera unit and head unit are provided separately and independently, the camera unit can recognize the position of the next part to be picked in parallel with the part picking operation by the head unit. This makes it possible to speed up the work cycle from capturing an image of the part with the part camera of the camera unit to picking the part by the head unit.

To prevent problems such as the head unit picking up a part incorrectly, the movement position of the camera unit when recognizing the position of the part by capturing an image with the part camera must match the movement position of the head unit. In this case, if there is a parallel deviation between the head movement axis and the camera movement axis, there is a risk of a positional deviation occurring between the movement position of the camera unit and the movement position of the head unit.

Therefore, the component mounting device includes a correction data creation unit that creates data for correcting the control of the movement of the head unit and the camera unit by the movement control unit. This correction data creation unit generates first mark position recognition data based on first mark image data obtained by imaging the mark with the head camera mounted on the head unit, and generates second mark position recognition data based on second mark image data obtained by imaging the mark with the component camera mounted on the camera unit. Furthermore, the correction data creation unit creates parallel deviation correction data for correcting parallel deviation between the head movement axis and the camera movement axis based on the first mark position recognition data and the second mark position recognition data.

When the movement of the head unit and the camera unit is controlled by the movement control unit, the amount of movement of the head unit and the camera unit can be corrected based on the parallel deviation correction data. This makes it possible to suppress positional deviation between the movement position of the camera unit and the movement position of the head unit, even if parallel deviation occurs between the head movement axis and the camera movement axis. This makes it possible to suppress malfunctions such as component picking errors by the head unit caused by parallel deviation between the head movement axis and the camera movement axis.

The above-mentioned component transfer device may further include a push-up unit that is movable horizontally along a push-up movement axis below the component placement area and has a push-up pin that pushes up the component to be picked by the head unit from below, and a push-up movement amount detection unit that detects the movement amount of the push-up unit along the push-up movement axis. In this case, the movement control unit is configured to control the movement of the push-up unit in addition to the head unit and the camera unit. Then, the correction data creation unit performs a pin position recognition process to generate pin position recognition data indicating the recognition result of the position of the push-up pin when the push-up unit moves, based on pin image data obtained by imaging the push-up pin by the component camera, while the push-up unit is moving in conjunction with the movement of the camera unit. In addition, the correction data creation unit performs a push-up axis correction process to create push-up axis correction data for correcting distortion of the push-up movement axis, based on the push-up movement amount data acquired by the push-up movement amount detection unit when the push-up unit moves in conjunction with the movement of the camera unit and the pin position recognition data.

In this embodiment, the push-up unit pushes up the part to be picked by the head unit from below by moving horizontally along the push-up movement axis under the control of the movement control unit. Also, the theoretical movement position of the push-up unit can be obtained based on the push-up movement amount data indicating the detection result of the movement amount of the push-up unit by the push-up movement amount detection unit.

Here, if the push-up movement axis is distorted, there is a risk that the push-up unit cannot be moved to an appropriate position. Therefore, the correction data creation unit generates pin position recognition data indicating the recognition result of the position of the push-up pin when the push-up unit moves based on the pin image data obtained by imaging the push-up pin with the component camera while the push-up unit moves in conjunction with the movement of the camera unit. Furthermore, the correction data creation unit creates push-up axis correction data for correcting the distortion of the push-up movement axis based on the push-up movement amount data acquired by the push-up movement amount detection unit when the push-up unit moves in conjunction with the movement of the camera unit and the pin position recognition data. As a result, when the movement of the push-up unit is controlled by the movement control unit, the movement amount of the push-up unit can be corrected based on the push-up axis correction data. Therefore, even if the push-up movement axis is distorted, the push-up unit can be moved to an appropriate position.

As described above, according to the present invention, in a component transfer device equipped with a head unit that picks components from a component placement area and a camera unit that captures images of the components in the component placement area, it is possible to suppress positional deviations in the movement positions of the head unit and the camera unit.

Claims (3)

a component supply unit having a component placement area in which a plurality of components are placed;
a head unit that is movable horizontally along a head movement axis within a predetermined head movement area in a space above the component placement area, has a head camera mounted thereon, and picks up the component in the component placement area;
a head movement amount detection unit that detects the amount of movement of the head unit along the head movement axis;
a camera unit that is movable horizontally along a camera movement axis within a predetermined camera movement area in a space above the component placement area, the camera unit having a component camera that captures an image of the component in the component placement area;
a camera movement amount detection unit that detects the amount of movement of the camera unit along the camera movement axis;
a mark section provided with a mark that can be recognized by each of the head camera and the part camera, the mark section being disposed at a predetermined position below a common area where the head movement area and the camera movement area overlap;
a movement control unit that controls movement of the head unit and movement of the camera unit;
A correction data creation unit that creates data for correcting the control by the movement control unit,
the movement control unit controls the movement of the head unit so that the head camera is positioned above the mark portion when the correction data creation unit creates data, and controls the movement of the camera unit so that the part camera is positioned above the mark portion;
The correction data creation unit
a mark position recognition process for generating first mark position recognition data indicating a recognition result of the position of the mark based on first mark image data obtained by imaging the mark with the head camera that is placed at a position above the mark portion by movement of the head unit, and generating second mark position recognition data indicating a recognition result of the position of the mark based on second mark image data obtained by imaging the mark with the part camera that is placed at a position above the mark portion by movement of the camera unit;
a head axis correction process for creating head axis correction data for correcting distortion of the head movement axis so that head position data indicating a movement position of the head unit based on head movement amount data acquired by the head movement amount detection unit when the head unit moves in response to the image capture of the mark by the head camera coincides with the first mark position recognition data;
a camera axis correction process for creating camera axis correction data for correcting distortion of the camera movement axis so that camera position data indicating a movement position of the camera unit based on camera movement amount data acquired by the camera movement amount detection unit when the camera unit moves in response to capturing an image of the mark by the component camera coincides with the second mark position recognition data;
a component transfer device which performs, after the head axis correction process and the camera axis correction process, a parallel deviation correction process which creates parallel deviation correction data for correcting parallel deviation between the head movement axis and the camera movement axis so that the first mark position recognition data and the second mark position recognition data coincide with each other. the correction data creation unit performs the mark position recognition process in response to each of the head axis correction process, the camera axis correction process, and the parallel deviation correction process;
When the correction data creation unit performs the mark position recognition process in response to the parallel deviation correction process, the movement control unit:
controlling the movement of the head unit while correcting the amount of movement of the head unit based on the head axis correction data so that the head camera is positioned above the mark portion;
2. The component transfer device according to claim 1 , wherein the movement of the camera unit is controlled while the movement amount of the camera unit is corrected based on the camera axis correction data so that the component camera is positioned above the mark portion. a push-up unit that is movable horizontally along a push-up movement axis below the component placement area and has a push-up pin that pushes up the component to be picked by the head unit from below;
a push-up movement amount detection unit that detects a movement amount of the push-up unit along the push-up movement axis,
The movement control unit is configured to control the movement of the thrust unit in addition to the head unit and the camera unit,
The correction data creation unit
a pin position recognition process for generating pin position recognition data indicating a recognition result of a position of the push-up pin when the push-up unit is moved based on pin image data obtained by imaging the push-up pin with the component camera while the push-up unit is moved in conjunction with the movement of the camera unit under the control of the movement control unit;
2. The component transfer device according to claim 1, further comprising: a push-up axis correction process for creating push-up axis correction data for correcting distortion of the push-up movement axis so that push-up position data indicating the movement position of the push-up unit based on push-up movement amount data acquired by the push-up movement amount detection unit when the push-up unit moves in conjunction with the movement of the camera unit coincides with the pin position recognition data.

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