JP7538087B2 - Information and Communication Unit - Google Patents

Description

Article 30, paragraph 2 of the Patent Act applied. From September 22, 2017 to February 21, 2018, the products were wholesaled to each shipping destination (retailer) listed in the attached "List of shipping dates and shipping (sales) locations, etc."

The present invention relates to a heat dissipation structure that transfers heat generated by electronic components mounted on a substrate to a heat dissipation section and dissipates the heat.

In the above-mentioned heat dissipation structure, when the electronic component (the component to be cooled) and the heat dissipation section (heat sink) are provided on the same side of the board in the front-back direction, a heat transfer member (heat transfer gap pad) is placed between the electronic component and the heat dissipation section, and the heat generated by the electronic component is transferred to the heat dissipation section through the heat transfer member and dissipated (see, for example, Patent Document 1).

In addition, in the heat dissipation structure described in Patent Document 1, even if the electronic components are provided on one side of the board in the front-back direction and the heat dissipation section is provided on the other side of the board in the front-back direction, and the electronic components and the heat dissipation section are provided on opposite sides of the board in the front-back direction, a U-shaped heat transfer member (thermal jumper) is provided that extends from one side of the board in the front-back direction around the periphery of the board to the other side, and the heat generated by the electronic components is transferred to the heat dissipation section through the U-shaped heat transfer member and dissipated.

Patent No. 4361310

In the heat dissipation structure described in Patent Document 1, the electronic components and the heat dissipation section are directly connected by a heat transfer member so as to shorten the distance of the heat path from the electronic components to the heat dissipation section, thereby reducing the thermal resistance when the heat generated by the electronic components is transferred to the heat dissipation section. As a result, a large amount of heat is transferred to the heat dissipation section, so unless the heat dissipation capacity of the heat dissipation section is increased, effective heat dissipation cannot be achieved. However, increasing the heat dissipation capacity of the heat dissipation section leads to increased costs and a more complicated configuration.

In view of this situation, the main objective of the present invention is to provide a heat dissipation structure that can effectively dissipate heat generated by electronic components mounted on a substrate.

The present invention provides a heat dissipation structure for dissipating heat generated by an electronic component mounted on a substrate by transferring the heat to a heat dissipation section, comprising:
The electronic component is disposed on one side of the substrate in a front-back direction;
a first heat transfer section that transfers heat generated from the electronic component to the other side in the front-back direction of the substrate;
a second heat transfer section that extends from the other side in the front-rear direction of the substrate to the one side and transfers the heat transferred by the first heat transfer section to the other side in the front-rear direction of the substrate to the heat dissipation section through the periphery of the substrate, and dissipates the heat,
The substrate is provided in a plurality of portions spaced apart from each other in the front-back direction,
The first heat transfer portion is
a thermal conductor disposed between the plurality of substrates and configured to transfer heat to the other side of the substrate in the front-back direction and to transfer heat to another substrate adjacent to the other side of the front-back direction;
and another thermal conductor arranged on the other side of the other substrate in the front-back direction and configured to transfer heat to the other side of the other substrate in the front-back direction,
It is preferable that the second heat transfer section transfers heat transferred to the other side of the other substrate in the front-to-back direction by the other thermal conductor to the heat dissipation section on one side of the front-to-back direction, through the periphery of the multiple substrates.

According to this configuration, the first heat transfer section transfers the heat generated from the electronic components from one side to the other side in the front-back direction of the board, and the second heat transfer section transfers the heat from the other side to one side in the front-back direction of the board in the opposite direction to the first heat transfer section, and dissipates the heat in the heat dissipation section. Therefore, the heat generated from the electronic components moves from one side to the other side in the front-back direction of the board, and then moves from the other side to the one side in the front-back direction of the board, and is then transferred to the heat dissipation section and dissipated. This allows the heat generated from the electronic components to move a large distance until it is transferred to the heat dissipation section. In addition, in the process of heat transfer, not only is heat dissipated with the movement, but for example, thermal energy is converted into kinetic energy, so that by increasing the heat movement distance, more heat can be dissipated. Therefore, even if the heat dissipation capacity of the heat dissipation section is not increased, the heat generated from the electronic components installed on the board can be effectively dissipated.
The present invention provides a heat exchanger including a casing that houses the substrate, the front and back direction of the substrate being a front-rear direction, the first heat transfer section and the second heat transfer section being provided within the casing,
the casing is configured to be freely separable into a front casing made of resin located on a front side in a front-to-rear direction and a rear casing made of metal serving as the heat dissipation portion located on a rear side in the front-to-rear direction,
It is preferable that the casing is installed in a state in which the rear casing side is embedded in the installation target portion and the front casing side bulges forward of the installation target portion.

The present invention is preferably provided with a contact heat transfer section that brings the electronic component into contact with the second heat transfer section on one side of the front-back direction of the substrate, thereby enabling heat generated from the electronic component to be transferred to the second heat transfer section.

According to this configuration, the contact heat transfer section transfers heat generated from the electronic component to the second heat transfer section, so that the heat generated from the electronic component is transferred to the heat dissipation section via the contact heat transfer section and the second heat transfer section and dissipated. As a result, the heat generated from the electronic component is not only transferred to the heat dissipation section via the first heat transfer section and the second heat transfer section and dissipated as described above, but is also transferred to the heat dissipation section via the contact heat transfer section and the second heat transfer section and dissipated, so that the heat can be dissipated more effectively.

The present invention is preferably provided with a third heat transfer section that extends away from the substrate on the other side of the substrate in the front-back direction and transfers the heat transferred by the first heat transfer section to the other side of the substrate in the front-back direction to the tip of the third heat transfer section in the extension direction.

According to this configuration, the third heat transfer section transfers the heat transferred by the first heat transfer section to the side away from the substrate on the other side of the substrate in the front-back direction, so that the heat can be transferred to a heat dissipation section other than the heat dissipation section arranged on the other side of the substrate in the front-back direction and dissipated. This allows heat to be dissipated not only by the heat dissipation section on one side of the substrate in the front-back direction, but also by another heat dissipation section on the other side of the substrate in the front-back direction, and allows the heat generated by the electronic components to be dissipated efficiently.

In the present invention, it is preferable that the second heat transfer section and the third heat transfer section are integrally formed.

According to this configuration, the second heat transfer section and the third heat transfer section are integrally formed, which simplifies the configuration. Moreover, the heat transferred in the first heat transfer section can be transferred to both the second heat transfer section and the third heat transfer section simply by transferring the heat to the integrated body of the second heat transfer section and the third heat transfer section, and the configuration for heat transfer can also be simplified.

The present invention is preferably such that the tip of the third heat transfer section in the extension direction is provided with a cooling section that cools the heat transferred to the tip.

According to this configuration, the cooling section cools the heat transferred to the tip of the third heat transfer section in the extension direction, so that the heat transferred to the third heat transfer section can be effectively dissipated. Therefore, the heat transferred to the third heat transfer section can be effectively dissipated on the other side of the board in the front-back direction as well, so that the heat generated by the electronic components can be dissipated more efficiently.

The present invention is preferably provided with a casing that houses the substrate, the first heat transfer section, the second heat transfer section, and the third heat transfer section within the casing, and a communication section that connects the inside and outside of the casing is provided at an opposing portion of the casing that faces the tip of the third heat transfer section in the extension direction.

According to this configuration, since the casing is provided with a communication section, heat inside the casing can be dissipated to the outside through the communication section. Moreover, since the casing is provided with a communication section at an opposing portion facing the tip end of the third heat transfer section in the extension direction, heat transferred to the tip end of the third heat transfer section in the extension direction is dissipated to the outside of the casing through the communication section. Therefore, the heat transferred to the third heat transfer section can be effectively dissipated on the other side of the board in the front-back direction as well, and heat generated by electronic components can be dissipated more efficiently.

In the present invention, a surface direction heat transfer section is provided on the other side of the front and back direction of the substrate, the surface direction heat transfer section being extended in a first width direction and a second width direction perpendicular to the front and back direction of the substrate, and transferring the heat transferred to the other side of the front and back direction of the substrate along a surface direction of the substrate,
The planar heat transfer portion has a notch formed from one side in the first width direction, and has a high-temperature region portion to which heat from a high-temperature region is transferred and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
It is preferable that the high temperature region is disposed at a position adjacent to the cutout portion in the second width direction, and the low temperature region is disposed at a position adjacent to the cutout portion in the first width direction.

According to this configuration, the high temperature region is adjacent to the notch in the second width direction, and the low temperature region is adjacent to the notch in the first width direction, so that when heat is transferred in the surface direction of the board, a notch can be present between the high temperature region and the low temperature region. This makes it possible to reduce the heat transfer area from the high temperature region to the low temperature region, and to prevent the heat of the high temperature region transferred to the high temperature region from being transferred directly to the low temperature region. This prevents the heat from the high temperature region from being transferred to electronic components arranged in the region of the board that corresponds to the low temperature region, and prevents failure of the electronic components.

In the present invention, a surface direction heat transfer portion is provided on the other side of the front and back direction of the substrate, the surface direction heat transfer portion being extended in a surface direction of the substrate and transferring the heat transferred to the other side of the front and back direction of the substrate along the surface direction of the substrate,
The planar heat transfer portion has a high-temperature region portion to which heat from a high-temperature region is transferred, and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
the high temperature region and the low temperature region are disposed at different positions in the surface direction of the substrate in the surface direction heat transfer portion,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
The second heat transfer section includes a first extension section extending from a side where the high temperature region of the surface direction heat transfer section is located in the surface direction of the substrate to one side in the front-back direction of the substrate, and a second extension section extending from a side where the low temperature region of the surface direction heat transfer section is located in the surface direction of the substrate to one side in the front-back direction of the substrate,
It is preferable that the first extension portion has a smaller heat transfer area through which heat is transferred than the second extension portion.

According to this configuration, the second extension portion has a larger heat transfer area than the first extension portion, so the second extension portion can transfer more heat than the first extension portion. The first extension portion is extended from the side where the high temperature region is located, so it transfers heat in the high temperature region. In contrast, the second extension portion is extended from the side where the low temperature region is located, so it transfers heat in the low temperature region. Therefore, between the first extension portion and the second extension portion, the first extension portion transfers higher temperature heat than the second extension portion, but the second extension portion transfers more heat than the first extension portion. As a result, the amount of heat transferred to the heat dissipation portion by the first extension portion and the amount of heat transferred to the heat dissipation portion by the second extension portion can be equalized, and heat dissipation in the heat dissipation portion can be performed efficiently in a balanced manner.

In the present invention, a surface direction heat transfer portion is provided on the other side of the front and back direction of the substrate, the surface direction heat transfer portion being extended in a surface direction of the substrate and transferring the heat transferred to the other side of the front and back direction of the substrate along the surface direction of the substrate,
The planar heat transfer portion has a high-temperature region portion to which heat from a high-temperature region is transferred, and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
The second heat transfer portion is preferably disposed at a location on the surface direction heat transfer portion that is closer to the high temperature region than to the low temperature region in the surface direction of the substrate.

According to this configuration, since the second heat transfer section is disposed at a position adjacent to the high temperature region in the surface direction of the substrate rather than the low temperature region, the high temperature heat transferred to the high temperature region can be efficiently transferred to the second heat transfer section while suppressing the transfer to the low temperature region. Therefore, the high temperature heat transferred to the high temperature region of the surface direction heat transfer section can be efficiently transferred to the heat dissipation section via the second heat transfer section.
The present invention provides a heat dissipation structure for dissipating heat generated by an electronic component mounted on a substrate by transferring the heat to a heat dissipation section, comprising:
a casing for accommodating the substrate is provided, the front and back direction of the substrate being a front-rear direction;
the casing is configured to be freely separable into a front casing made of resin located on a front side in a front-to-rear direction and a rear casing made of metal serving as the heat dissipation portion located on a rear side in the front-to-rear direction,
The casing is installed in a buried state in which a rear casing side is buried in an installation target portion and a front casing side is bulging forward from the installation target portion,
It is preferable that a second heat transfer section be provided within the casing for transferring heat in front of the substrate to a rear side of the substrate and transferring the heat to the rear casing for dissipation.
In the present invention, it is preferable that the second heat transfer portion extends from the front side to the rear side of the substrate through between the substrate and the inner wall portion of the casing, in a state in which the middle portion is prevented from contacting the inner wall portion of the front casing.
In the present invention, it is preferable that a first heat transfer section is provided within the casing for transferring heat from a rear side of the substrate to a front side of the substrate.
In the present invention, a surface direction heat transfer portion is provided on the front side of the substrate, the surface direction heat transfer portion being extended in a first width direction and a second width direction perpendicular to the front-rear direction and transferring heat transferred to the front side of the substrate along a surface direction of the substrate,
The planar heat transfer portion has a notch formed from one side in the first width direction, and has a high-temperature region portion to which heat from a high-temperature region is transferred and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
It is preferable that the high temperature region is disposed at a position adjacent to the cutout portion in the second width direction, and the low temperature region is disposed at a position adjacent to the cutout portion in the first width direction.
In the present invention, a surface direction heat transfer portion is provided on the front side of the substrate, the surface direction heat transfer portion being extended in a surface direction of the substrate and transferring heat transferred to the front side of the substrate along the surface direction of the substrate,
The planar heat transfer portion has a high-temperature region portion to which heat from a high-temperature region is transferred, and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
The second heat transfer section includes a first extension section extending from a side where the high temperature region of the surface direction heat transfer section is located to a rear side of the substrate in the surface direction of the substrate, and a second extension section extending from a side where the low temperature region of the surface direction heat transfer section is located to a rear side of the substrate in the surface direction of the substrate,
It is preferable that the first extension portion has a smaller heat transfer area through which heat is transferred than the second extension portion.
In the present invention, a surface direction heat transfer portion is provided on the front side of the substrate, the surface direction heat transfer portion being extended in a surface direction of the substrate and transferring heat transferred to the front side of the substrate along the surface direction of the substrate,
The planar heat transfer portion has a high-temperature region portion to which heat from a high-temperature region is transferred, and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
The second heat transfer portion is preferably disposed at a location on the surface direction heat transfer portion that is closer to the high temperature region than to the low temperature region in the surface direction of the substrate.
The present invention is an information and communication unit having the heat dissipation structure according to any one of the above configurations, and preferably includes an antenna element, a component for information and communication, and a power supply component.
The present invention provides a heat dissipation structure that dissipates heat generated by an electronic component mounted on a substrate by transferring the heat to a heat dissipation section,
A surface direction heat transfer section is provided on one side of the substrate in a front-back direction, the surface direction heat transfer section being extended in a first width direction and a second width direction perpendicular to the front-back direction of the substrate, and transferring heat transferred to the one side of the substrate in the front-back direction along a surface direction of the substrate;
The planar heat transfer portion has a notch formed from one side in the first width direction, and has a high-temperature region portion to which heat from a high-temperature region is transferred and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
It is preferable that the high temperature region is disposed at a position adjacent to the cutout portion in the second width direction, and the low temperature region is disposed at a position adjacent to the cutout portion in the first width direction.

The present invention provides a heat dissipation structure that dissipates heat generated by an electronic component mounted on a substrate by transferring the heat to a heat dissipation section,
A surface direction heat transfer section is provided on one side of the substrate in the front-back direction, the surface direction heat transfer section being extended in the surface direction of the substrate and transferring heat transferred to the one side of the substrate in the front-back direction along the surface direction of the substrate;
The planar heat transfer portion has a high-temperature region portion to which heat from a high-temperature region is transferred, and a low-temperature region portion to which heat from a low-temperature region that is lower than the high-temperature region is transferred,
a second heat transfer section that transfers heat from one side of the substrate in a front-back direction to the other side of the substrate in a front-back direction and transfers the heat to the heat dissipation section to dissipate the heat,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
The second heat transfer section includes a first extension section extending from a side where the high temperature region of the surface direction heat transfer section is located in the surface direction of the substrate to the other side in the front-back direction of the substrate, and a second extension section extending from a side where the low temperature region of the surface direction heat transfer section is located in the surface direction of the substrate to the other side in the front-back direction of the substrate,
It is preferable that the first extension portion has a smaller heat transfer area through which heat is transferred than the second extension portion.
In the present invention , the first extension portion has a base end portion on one side in the front-back direction of the substrate, the base end portion having a narrow shape having a narrow width in a direction perpendicular to the extension direction, and a tip end portion on the other side in the front-back direction of the substrate having a larger width in a direction perpendicular to the extension direction than the base end portion;
It is preferable that the second extension portion is formed in a shape having a width in a direction perpendicular to its extension direction from a base end portion on one side of the front-back direction of the substrate to a tip end portion on the other side of the front-back direction of the substrate that is greater than a width of the base end portion of the first extension portion .
In the present invention , a surface direction heat transfer portion is provided on one side of the front and back direction of the substrate, the surface direction heat transfer portion being extended in a surface direction of the substrate and transferring heat transferred to the one side of the front and back direction of the substrate along the surface direction of the substrate,
the planar heat transfer portion includes the high temperature region, the low temperature region, and a second low temperature region to which heat of a second low temperature region that is lower in temperature than the low temperature region is transferred;
a second heat transfer section that transfers heat from one side of the substrate in a front-back direction to the other side of the substrate in a front-back direction and transfers the heat to the heat dissipation section to dissipate the heat,
the second heat transfer section transfers the heat transferred along the surface direction of the substrate by the surface direction heat transfer section to the heat dissipation section through a periphery of the substrate;
It is preferable that the second heat transfer portion is arranged in the planar heat transfer portion at a location adjacent to the low temperature area portion and the high temperature area portion on the hotter side than the second low temperature area portion in the planar direction of the substrate .
(1) A first characteristic configuration of the present invention is a liquid crystal display device comprising: a plurality of substrates; a casing that houses the plurality of substrates; and an exposed portion that is exposed to the outside of the casing.
A heat transfer section is provided for transferring heat from the plurality of substrates to the exposed section and dissipating the heat.
(2) A second characteristic feature of the present invention is that the exposed portion is disposed outwardly of the heat transfer portion in a surface direction of the substrate.
(3) A third characteristic feature of the present invention is that the casing is installed in the installation target portion in an embedded state in which at least a rear portion of the casing is embedded inside the installation target portion.
(4) A fourth characteristic configuration of the present invention is that an information and communication unit having a heat dissipation structure described in any one of claims 1 to 3 is provided with an antenna element, components for information and communication, and power supply components.

Front view showing the information outlet installed A side view showing the information outlet installed FIG. 1 is an exploded perspective view of an information communication unit according to a first embodiment; FIG. 1 is a cross-sectional view of an information communication unit according to a first embodiment; FIG. 1 is a perspective view showing a first plate-shaped body and a second plate-shaped body; FIG. 13 is an exploded perspective view of an information communication unit according to a second embodiment; FIG. 13 is a cross-sectional view of an information communication unit according to the second embodiment; FIG. 13 is an exploded perspective view of an information communication unit according to a third embodiment. 13 is a front view of a fourth plate-shaped body in the third embodiment; FIG. 13 is a right side view of the fourth plate-shaped body in the third embodiment; FIG. 13 is a left side view of the fourth plate-shaped body in the third embodiment;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an information communication unit to which a heat dissipation structure according to the present invention is applied will be described with reference to the drawings.
First Embodiment
1 and 2, this information communication unit 2 is provided in an information outlet 1 that is installed in an installation target location such as a wall W. The information communication unit 2 is installed in a state where most of it is embedded in the wall W, and only a part of its front side bulges forward from the wall W. In the following description, the front side in the front-back direction perpendicular to the wall W will be referred to as the front side in the front-to-back direction, and the back side in the front-to-back direction will be referred to as the rear side in the front-to-back direction.

The information outlet 1 is fixed between an outlet box 11 arranged on the rear side of a rectangular installation hole 10 (see FIG. 2) formed through the wall W, and a decorative cover 12 arranged on the front side of the wall W, via a mounting frame 13 that abuts against the front surface of the wall W between them.

In addition to the information communication unit 2, this information outlet 1 is equipped with a power outlet unit 3. The information communication unit 2 is arranged on one side of the information outlet 1 in the left-right direction (right side in Fig. 1), and the power outlet unit 3 is arranged on the other side of the information outlet 1 in the left-right direction (left side in Fig. 1). The front side of the information communication unit 2 is equipped with a connection port 21 for a LAN modular adapter to which a LAN modular plug can be detachably connected, and a connection port 22 for a telephone line modular adapter to which a telephone line modular plug can be detachably connected. The front side of the power outlet unit 3 is equipped with two sockets 4, one above and one below.

As shown in FIG. 2, the top and bottom of the outlet box 11 are provided with insertion ports 16 into which the ends of cables such as a power cable 14, a telephone cable (not shown), and a WAN-side communication cable 15 that are wired in the rear space (back space) of the wall W are inserted.

The communication cable 15 and the telephone cable are pulled into the outlet box 11 through the upper insertion port 16 and connected to the information and communication unit 2. The power cable has a power cable (not shown) for supplying commercial power to the power outlet unit 3, and a power cable 14 for supplying commercial power from the power outlet unit 3 to the information and communication unit 2. The power cable for supplying commercial power to the power outlet unit 3 is pulled into the outlet box 11 through the upper insertion port 16 and connected to the power outlet unit 3, and the power cable 14 for supplying commercial power from the power outlet unit 3 to the information and communication unit 2 is pulled into the outlet box 11 through the lower insertion port 16 and connected to the information and communication unit 2.

The decorative cover 12 is formed with mounting windows 17 shaped to fit each of the units 2 and 3, and is attached in such a way that the front portions of each of the units 2 and 3 are exposed forward through each mounting window 17.

(Information and Communication Unit)
As shown in Figures 2 to 4, the information communication unit 2 comprises an antenna unit 23 having an antenna element 25 (see Figure 3) built therein, and a main unit 20 containing various components for information communication other than the antenna element 25, and the antenna unit 23 is configured to be freely attached and detached to the front portion of the main unit 20.

The antenna unit 23 is formed in a rectangular ring shape that surrounds the outer periphery of the front part of the main unit 20, and has multiple antenna elements 25 built in. The bottom part of the antenna unit 23 is provided with a power switch 24 (see Figure 2) that can freely switch the power of the information communication unit 2 between ON and OFF. The antenna unit 23 is configured to be freely electrically connected to the main unit 20 by being attached to the front part of the main unit 20.

The main unit 20 is configured to be freely separable into a front casing 26 and a rear casing 27. The front casing 26 is made of, for example, synthetic resin, while the rear casing 27 is made of, for example, metal such as aluminum or zinc steel, and is configured to have good thermal conductivity. Although not shown, the front casing 26 and the rear casing 27 can be attached and detached by, for example, forming an engagement claw on one side of the front casing 26 and the rear casing 27, forming an engagement hole with which the engagement claw engages on the other side of the front casing 26 and the rear casing 27, and engaging or disengaging the engagement claw with the engagement hole. Then, for example, the front casing 26 and the rear casing 27 can be fixed in an engaged state by fastening a screw through a through hole formed in the rear casing 27 and fastening a screw into a screw hole formed in the front casing 26.

The front casing 26 is formed in a box shape with an open rear side, and has a front surface 28 facing forward and a peripheral side surface 29 extending rearward from the outer periphery of the front surface 28. The front casing 26 is provided with a flange portion 30 extending laterally from the rear end portion of the peripheral side surface 29, and this flange portion 30 is configured to be freely fixed to the mounting frame 13.

At the upper part of the front part 28 of the front casing 26, there is disposed a connection port 22 for a modular adapter for a telephone line to which a modular plug for a telephone line is detachably connected. As shown in FIG. 1, in addition to the connection port 22, at the upper part of the front part 28, there are disposed display lamps 31 such as a power indicator showing the power-on state of the information communication unit 2, a LAN indicator showing the availability state of the routing function (information communication function using a wired LAN or wireless LAN), and an access indicator showing the access state of the network, and a reset button part 32 for performing a reset operation. At the lower part of the front part 28 of the front casing 26, there is disposed a connection port 21 for a modular adapter for a LAN to which a modular plug for a LAN is detachably connected.

Returning to Figures 2 to 4, the rear casing 27 is formed in a box shape with an open front side, having a rear surface portion 33 facing the rear side and a peripheral side surface portion 34 extending forward from the outer periphery of the rear surface portion 33. Although not shown, the rear surface portion 33 and the peripheral side surface portion 34 of the rear casing 27 are provided with connection ports for various cables, such as the power cable 14, telephone cable (not shown), and WAN-side communication cable 15.

By assembling the front casing 26 and the rear casing 27, a storage space 35 that is closed in the front-rear, left-right, and top-bottom directions is formed, and the storage space 35 stores various components for information communication other than the antenna element 25. The various components include, for example, a power supply component 36 such as a converter, other electronic components, first to third boards 37 to 39 on which the power supply component 36 and other electronic components are installed, and a connector section 40 that connects the boards 37 to 39 together. In Figs. 3 and 4, only the power supply component 36, the first to third boards 37 to 39, and the connector section 40 are shown, and other electronic components are omitted. Incidentally, the sizes of the front casing 26 and the rear casing 27 in the front-rear, left-right, and top-bottom directions can be changed as appropriate depending on the sizes of the boards 37 to 39.

As shown in Figs. 3 and 4, the boards 37 to 39 are arranged in a stacked structure in which the first board 37, the second board 38, and the third board 39 are stacked at intervals from the front side in the front-rear direction. The second board 38 and the third board 39 have the same length in the left-right direction, and the first board 37 is shorter than the second board 38 and the third board 39. The front part of the first board 37 is provided with a connection port 22 for a telephone line modular adapter and a connection port 21 for a LAN modular adapter, and the rear part of the third board 39 is provided with a power supply component 36. The connector parts 40 are arranged on the rear part of the first board 37, both the front and rear parts of the second board 38, and the front part of the third board 39, and the first board 37 and the second board 38 are electrically connected by the connector parts 40, and the second board 38 and the third board 39 are electrically connected by the connector parts 40.

(Heat dissipation structure)
When the power supply of the information communication unit 2 is switched to the ON state, the power supply component 36 and other electronic components are put into an operating state, and various functions such as information communication are activated. At this time, a large amount of heat is generated from the power supply component 36, and heat is also generated from the other electronic components. In this embodiment, a heat dissipation structure is adopted that dissipates heat generated mainly from the power supply component 36, including heat generated from the other electronic components, and this heat dissipation structure will be described below.

This heat dissipation structure is designed to transfer and dissipate heat generated primarily by the power supply components 36 mounted on the rear surface of the third board 39, as well as heat generated by other electronic components, to the metallic rear casing 27 (corresponding to the heat dissipation section).

In the heat dissipation structure, the first thermal conductor 51 is disposed in the center of the front part of the second substrate 38, and the second thermal conductor 52 is disposed in the center of the front part of the third substrate 39. The first thermal conductor 51 includes, for example, various electronic components installed on the front part of the second substrate 38 and thermally conductive sheets provided on those electronic components, and may be anything that can transfer heat from the rear side of the second substrate 38 to the front side. The second thermal conductor 52 may be anything that has thermal conductivity, such as a thermally conductive sheet, and may be anything that can transfer heat from the rear side of the third substrate 39 to the front side. This allows the heat generated from the power supply component 36 installed on the rear part of the third substrate 39 (including heat generated from other electronic components) to be transferred to the second thermal conductor 52, making it possible to transfer heat to the front side of the third substrate 39. Since the second thermal conductor 52 is in contact with the rear surface of the second substrate 38, the second thermal conductor 52 transfers the heat transferred to the front side of the third substrate 39 to the second substrate 38. The heat transferred to the second substrate 38 is transferred to the first thermal conductor 51, so that the heat can be transferred to the front side of the second substrate 38. The first thermal conductor 51 and the second thermal conductor 52 are configured as a first heat transfer section that transfers heat generated from the power supply component 36 (including heat generated from other electronic components) from the rear side (one side) of the third substrate 39 (corresponding to the substrate) to the front side (the other side).

As shown in Figs. 3 to 5, the heat dissipation structure includes a first plate-like body 53 that extends in the left-right direction between the first board 37 and the second board 38 and extends rearward from both left-right ends of the first plate-like body 53. The first plate-like body 53 is configured as a second heat transfer section that dissipates heat transferred to the front side of the second board 38 and the third board 39 by the first thermal conductor 51, the second board 38, and the second thermal conductor 52 through the periphery of the second board 38 and the third board 39 to the rear casing 27 (corresponding to the heat dissipation section) on the rear side (one side) of the second board 38 and the third board 39.

The first plate-like body 53 is, for example, a metal plate coated with a thermally conductive elastic material, and is configured to have good thermal conductivity and be elastically deformable. The first plate-like body 53 is formed in a U-shape in a plan view, with a first left-right extension portion 53a extending in the left-right direction between the first substrate 37 and the second substrate 38, and a pair of first front-rear extension portions 53b extending rearward from both ends of the first left-right extension portion 53a.

The first left and right extensions 53a are arranged in contact with the front portion of the first thermal conductor 51 so as to be capable of transferring heat from the first thermal conductor 51. Each of the pair of first front-rear extensions 53b is arranged to extend in the front-rear direction from between the first board 37 and the second board 38 through between the left and right ends of the second board 38 and the inner wall portion of the casings 26, 27 (around the second board 38), and between the third board 39 and the inner wall portion of the casings 26, 27 (around the third board 39) to the rear side of the third board 39. The rear end of each of the pair of first front-rear extensions 53b is in contact with a plate-shaped body contact portion 55 formed on the inner wall portion of the rear casing 27.

Here, the pair of first front-rear extensions 53b can be formed, for example, in an outwardly expanding shape in which the rear end side of the first front-rear extensions 53b is curved outward in the left-right direction. Then, in a state in which the rear end side of the first front-rear extensions 53b is elastically deformed inward in the left-right direction, the pair of first front-rear extensions 53b is inserted into the rear casing 27, and the rear end of the first front-rear extensions 53b is brought into contact with the plate-like body contact portion 55 of the rear casing 27 to fix the first front-rear extensions 53b. As a result, an elastic return force acts on the rear end side of the first front-rear extensions 53b outward in the left-right direction, and the elastic return force causes the rear end of the first front-rear extensions 53b to be in contact with the plate-like body contact portion 55 in a state in which it is pressed against the plate-like body contact portion 55, while preventing the middle portion of the first front-rear extensions 53b from contacting the inner wall portion of the front casing 26. As a result, the pair of first front-rear extensions 53b can appropriately transfer heat transferred to the front side of the second board 38 and the third board 39 to the rear casing 27 while preventing the heat from being transferred to the front casing 26. In addition, in order to prevent the middle part of the first front-rear extension 53b from contacting the inner wall of the front casing 26, for example, it is also possible to form notches at both the left and right ends of the second board 38 and the third board 39 and arrange the first front-rear extension 53b so that it extends rearward through the notches.

When the rear end portions of the pair of first front-rear extensions 53b are brought into contact with the plate-like body contact portions 55, for example, a groove portion is formed in the plate-like body contact portion 55 and the groove portion is filled with a filler such as gel, thereby making it possible to bring the rear end portions of the first front-rear extensions 53b into surface contact with the plate-like body contact portions 55, and thus enabling efficient heat transfer from the first front-rear extensions 53b to the plate-like body contact portions 55 of the rear casing 27.

Between the rear side portion of each of the pair of first front-rear extensions 53b and the power supply component 36, a contact heat transfer portion 56 is provided to connect and contact each of the pair of first front-rear extensions 53b and the power supply component 36. The contact heat transfer portion 56 is configured to be able to transfer heat generated from the power supply component 36 to the rear side portion of each of the pair of first front-rear extensions 53b. The contact heat transfer portion 56 is configured to have good thermal conductivity, for example, by using a thermally conductive pad or the like. In addition, for example, the contact heat transfer portion 56 can be configured by the first plate-shaped body 53 by bending the first plate-shaped body 53 to contact the power supply component 36, and various other configurations can be applied.

In this heat dissipation structure, in addition to the first plate-like body 53, a second plate-like body 54 is provided, which extends in the left-right direction between the first substrate 37 and the second substrate 38 and extends forward from both left-right ends. The second plate-like body 54 is configured as a third heat transfer section that transfers heat transferred to the front side of the second substrate 38 and the third substrate 39 by the first thermal conductor 51, the second substrate 38, and the second thermal conductor 52 to the tip end (front end) in the extension direction.

The second plate-like body 54 is, for example, a metal plate coated with a thermally conductive elastic material to have good thermal conductivity and be elastically deformable. The second plate-like body 54 is formed in a U-shape in a plan view, having a second left-right extension portion 54a extending in the left-right direction between the first board 37 and the second board 38, and a pair of second front-rear extension portions 54b extending forward from both ends of the second left-right extension portion 54a. Since the first board 37 is shorter in the left-right direction than the second board 38 and the third board 39, the second left-right extension portion 54a is configured to have a shorter left-right length than the first left-right extension portion 53a of the first plate-like body 53.

The second left-right extension portion 54a is joined to the first left-right extension portion 53a, and the first plate-like body 53 and the second plate-like body 54 are integrally formed. Incidentally, the support of the first plate-like body 53 and the second plate-like body 54 is not shown in the figure, but a support structure such as fixing to the board side of the first board 37 or the second board 38, or to the casing side of the front casing 26 or the rear casing 27 with a fixing device, can be provided. Each of the pair of second front-rear extension portions 54b is arranged to extend from between the first board 37 and the second board 38 in the front-rear direction, through between the left and right ends of the first board 37 and the inner wall portions of the casings 26 and 27 (around the first board 37), to the front side of the first board 37. Each of the pair of second front-rear extensions 54b is disposed at a distance from the inner wall of the peripheral side surface 29 of the front casing 26, and heat transferred to the front side of the second board 38 and the third board 39 is prevented from being transferred to the front casing 26, while being transferred to the tip (front end) of the second front-rear extension 54b.

The front end of each of the pair of second front-rear extensions 54b is provided with a cooling section 57 that cools the heat transferred to the front end. This cooling section 57 is, for example, configured by stacking a plurality of heat dissipation fins at intervals in the vertical direction. Furthermore, a slit section 58 (corresponding to a communication section) that connects the inside and outside of the front casing 26 is provided in a portion of the front casing 26 facing the front end of each of the pair of second front-rear extensions 54b.

The flow of heat generated from the power supply component 36 (including heat generated from other electronic components, the same applies below) will be described with reference to Figure 4. Incidentally, in Figure 4, parts of the front casing 26 and the rear casing 27 are omitted from the illustration in order to make the heat flow easier to understand.

The heat generated from the power supply component 36 is first transferred from the rear side to the front side of the third board 39 by the second thermal conductor 52, as shown by the arrow T1 in the figure. Next, as shown by the arrow T2 in the figure, the heat is transferred from the second thermal conductor 52 to the second board 38 by contact between the second thermal conductor 52 and the second board 38, and is further transferred from the rear side to the front side of the second board 38 by the first thermal conductor 51. In this way, the heat generated from the power supply component 36 is transferred from the rear side to the front side not only to the third board 39 but also to the second board 38, and the heat transfer distance can be made large. Therefore, in the process of heat transfer, not only is heat dissipated as it moves, but for example, thermal energy is converted into kinetic energy, so that the heat generated from the power supply component 36 can be effectively dissipated by making the heat transfer distance large.

The heat transferred to the front side of the second board 38 by the first thermal conductor 51 and the second thermal conductor 52 is transferred to both ends in the left-right direction by the first plate-shaped body 53, as shown by the arrow T3 in the figure, and then transferred from the front side of the second board 38 through the periphery of the second board 38 and the third board 39 to the rear side of the third board 39, and is transferred to the metallic rear casing 27 for dissipation. In this way, the heat generated from the power supply component 36 is not only transferred from the rear side of the third board 39 to the front side of the second board 38, but also from the front side of the second board 38 to the rear side of the third board 39, so that the distance of the heat transfer can be maximized, and the heat generated from the power supply component 36 can be dissipated more effectively. Moreover, the rear casing 27 is made of metal, and by forming multiple grooves on the rear surface 33 and peripheral side surface 34 of the rear casing 27, the surface area is increased, so that the transferred heat can be efficiently dissipated to the outside of the rear casing 27.

When the heat is transferred to the rear casing 27 by the first plate-like body 53 and dissipated, by positioning the rear casing 27 further rearward, the heat can be moved a greater distance, and the heat generated by the power supply components 36 can be dissipated more efficiently. Therefore, for example, only the third board 39 can be accommodated in the accommodation space 35 of the rear casing 27, and the first board 37 and the second board 38 can be accommodated in the accommodation space 35 of the front casing 26, with the rear casing 27 positioned rearward of the third board 39. Incidentally, how the first to third boards 37 to 39 are accommodated in the front casing 26 and the rear casing 27 can be changed as appropriate.

In addition, the heat transferred to the front side of the second substrate 38 by the first thermal conductor 51 and the second thermal conductor 52 is transferred to both ends in the left-right direction by the second plate-like body 54, as shown by the arrow T4 in the figure, and then transferred from the front side of the second substrate 38 through the periphery of the first substrate 37 to the front end of the second front-rear extension portion 54b located on the front side of the first substrate 37. The heat transferred to the front end of the second front-rear extension portion 54b is dissipated and cooled by the cooling portion 57, and is dissipated from the inside of the casings 26, 27 to the outside by the slit portion 58, as shown by the arrow T5 in the figure. Incidentally, the air flowing out of the casings 26, 27 from the slit portion 58 flows out of the information communication unit 2 through the opening of the antenna unit 23, etc., so that the heat inside the casings 26, 27 can be appropriately dissipated to the outside of the information communication unit 2. In this way, the heat inside the main unit 20 can be dissipated to the outside of the information and communication unit 2 not only through the rear casing 27 embedded in the rear side of the wall W, but also through the front part of the front casing 26 that bulges out on the front side of the wall W and the antenna unit 23. Therefore, the information and communication unit 2 has a heat dissipation structure that can effectively dissipate heat by effectively utilizing not only the part embedded in the rear side of the wall W, but also the part that bulges out on the front side of the wall W.

Furthermore, the heat generated by the power supply components 36 is not only transferred to the metallic rear casing 27 via the first thermal conductor 51, the second thermal conductor 52, and the first plate-shaped body 53 as described above, but is also transferred to the metallic rear casing 27 via the first plate-shaped body 53 by the contact heat transfer section 56, as shown by the arrow T6 in the figure, and dissipated.

Second Embodiment
This second embodiment shows another embodiment of the first plate-like body 53 in the first embodiment, and other configurations are similar to those of the first embodiment. Therefore, only the configurations different from the first embodiment will be described, and the description of the other similar configurations will be omitted.

In this second embodiment, instead of the first plate-like body 53, a third thermal conductor 61 and a pair of third plate-like bodies 62 are provided, and the first thermal conductor 51 and the second plate-like body 54 are not provided. The third thermal conductor 61 is configured to have good thermal conductivity, for example, a metal plate or a thermally conductive sheet, and is arranged in contact with the center of the front part of the second substrate 38 by a support structure not shown.

Each of the pair of third plate-like bodies 62 is, for example, a metal plate coated with a thermally conductive elastic material to have good thermal conductivity and be elastically deformable. Each of the pair of third plate-like bodies 62 is joined to the left and right ends of the third thermal conductor 61, and the third thermal conductor 61 and the pair of third plate-like bodies 62 are integrally formed. Each of the pair of third plate-like bodies 62 extends in the left-right direction and is formed in an L-shape in a plan view extending from the left and right ends to the rear side. Each of the pair of third plate-like bodies 62 is arranged so as to extend from between the first board 37 and the second board 38, through between the left and right ends of the second board 38 and the inner wall portion of the casing 26, 27 (around the second board 38), and between the third board 39 and the inner wall portion of the casing 26, 27 (around the third board 39) to the rear side of the third board 39 in the front-rear direction. The rear end of each of the pair of third plate-like bodies 62 is in contact with a plate-like body contact portion 55 formed on the inner wall portion of the rear casing 27.

The flow of heat generated from the power supply component 36 (including heat generated from other electronic components, the same applies below) will be described with reference to FIG.
The heat generated from the power supply components 36 is first transferred from the rear side to the front side of the third board 39 by the second thermal conductor 52, as shown by the arrow T11 in the figure. Next, as shown by the arrow T12 in the figure, the heat is transferred from the second thermal conductor 52 to the second board 38 by contact between the second thermal conductor 52 and the second board 38, and is further transferred from the rear side to the front side of the second board 38 by the third thermal conductor 61. In this second embodiment, the first heat transfer section is composed of the second thermal conductor 52 and the third thermal conductor 61. In this way, the heat generated from the power supply components 36 is transferred from the rear side to the front side not only to the third board 39 but also to the second board 38, so that the moving distance of the heat can be increased, and the heat generated from the power supply components 36 can be effectively dissipated.

The heat transferred to the front side of the second board 38 by the second thermal conductor 52 and the third thermal conductor 61 is transferred to both ends in the left-right direction by the third plate-like body 62, as shown by the arrow T13 in the figure, and then transferred from the front side of the second board 38 through the periphery of the second board 38 and the third board 39 to the rear side of the third board 39, and finally transferred to the metallic rear casing 27 for dissipation. In this way, the heat generated from the power supply component 36 is not only transferred from the rear side of the third board 39 to the front side of the second board 38, but also from the front side of the second board 38 to the rear side of the third board 39, so that the distance of heat transfer can be maximized, and the heat generated from the power supply component 36 can be dissipated more effectively.

Furthermore, the heat generated by the power supply components 36 is not only transferred to the metallic rear casing 27 via the second thermal conductor 52, the third thermal conductor 61, and the third plate-shaped body 62 as described above, but is also transferred to the metallic rear casing 27 via the third plate-shaped body 62 by the contact heat transfer section 56, as shown by the arrow T14 in the figure, and dissipated.

Incidentally, in this second embodiment, the heat on the rear side of the third substrate 39 is transferred to the front side of the second substrate 38 by the second thermal conductor 52 and the third thermal conductor 61, so just like in the first embodiment, the heat is transferred not only to the portion of the information communication unit 2 that is embedded in the rear side of the wall W, but also to the portion that bulges out toward the front side of the wall W that is open to the room, etc., so heat dissipation can also be expected in the bulging portion.

Third Embodiment
This third embodiment shows another embodiment of the first plate-like body 53 etc. in the first embodiment, and only the configurations that are different from the first embodiment will be described, and the description of the configurations that are similar to the first embodiment will be omitted.

As shown in FIG. 8, the second substrate 38 is provided with a first electronic component 64a (e.g., a chip component) that generates heat in a first temperature range (e.g., about 98°C), a second electronic component 64b (e.g., a chip component) that generates heat in a second temperature range (e.g., about 95°C) that is lower than the first electronic component 64a, and a third electronic component 64c (e.g., a chip component) that generates heat in a third temperature range (e.g., about 76°C) that is lower than the second electronic component 64b. In FIG. 8, when viewed from the front, the first electronic component 64a is disposed in the upper right side portion of the second substrate 38, the second electronic component 64b is disposed in the upper left side portion of the second substrate 38, and the third electronic component 64c is disposed in the lower left side portion of the second substrate 38.

The first thermal conductor 51 includes a first conduction region portion 51a that contacts the first electronic component 64a and conducts heat in the first temperature range to the front side of the second board 38, a second conduction region portion 51b that contacts the second electronic component 64b and conducts heat in the second temperature range to the front side of the second board 38, and a third conduction region portion 51c that contacts the third electronic component 64c and conducts heat in the third temperature range to the front side of the second board 38. The first thermal conductor 51 is divided into the first conduction region portion 51a, the second conduction region portion 51b, and the third conduction region portion 51c, and prevents heat transfer between the first to third conduction region portions 51a to 51c.

A fourth plate-like body 63 is provided between the first substrate 37 and the second substrate 38. The fourth plate-like body 63 is configured to have good thermal conductivity, for example, by using a metal plate or a thermally conductive sheet. The fourth plate-like body 63 is formed in a planar shape extending in the left-right width direction and the up-down width direction of the second substrate 38. The fourth plate-like body 63 is configured to transfer heat transferred to the front side of the second substrate 38 by each of the first to third conductive area portions 51a to 51c of the first thermal conductor 51 along the planar direction of the second substrate 38. As a result, the fourth plate-like body 63 corresponds to a planar heat transfer section.

8 and 9, the fourth plate-like body 63 has a wide portion 63d having a width larger than the entire width of the second substrate 38 in the left-right direction (corresponding to the first direction, hereinafter simply referred to as the "left-right direction") of the second substrate 38, and a narrow portion 63e having a width narrower in the left-right direction than the wide portion 63d, and is formed so that the wide portion 63d and the narrow portion 63e are aligned in the up-down direction (corresponding to the second direction, hereinafter simply referred to as the "up-down direction") of the second substrate 38 with the wide portion 63d located on the upper side. In the fourth plate-like body 63, the narrow portion 63e is formed by forming a cutout portion 65 cut out from the right side (one side) in the left-right direction. The width of the cutout portion 65 in the left-right direction is set to, for example, approximately 1/2 or larger than the width of the wide portion 63d, and the narrow portion 63e is formed in a position biased to the left side (the other side) in the left-right direction.

As shown in FIG. 9, the fourth plate-shaped body 63 has, as heat transfer areas, a first temperature area 63a where heat in a first temperature range is transferred in a first conduction area 51a of the first thermal conductor 51, a second temperature area 63b where heat in a second temperature range is transferred in a second conduction area 51b of the first thermal conductor 51, and a third temperature area 63c where heat in a third temperature range is transferred in a third conduction area 51c of the first thermal conductor 51.

The positions of the first to third electronic components 64a to 64c on the second substrate 38 can be changed as appropriate. The positions of the first to third conduction area portions 51a to 51c of the first thermal conductor 51 and the positions of the first to third temperature area portions 63a to 63c of the fourth plate-like body 63 can be changed as appropriate in response to the positions of the first to third electronic components 64a to 64c.

As shown in FIG. 9, in the fourth plate-like body 63, the first temperature zone portion 63a is disposed adjacent to the notch portion 65 in the vertical direction, and the third temperature zone portion 63c is disposed adjacent to the notch portion 65 in the horizontal direction. The second temperature zone portion 63b is disposed adjacent to the third temperature zone portion 63c in the vertical direction and adjacent to the first temperature zone portion 63a in the horizontal direction. The first temperature zone portion 63a and the second temperature zone portion 63b are disposed so as to be aligned in the horizontal direction in the wide portion 63d with the first temperature zone portion 63a located on the right side, and the third temperature zone portion 63c is disposed in the narrow portion 63e.

The third temperature zone portion 63c is located at a different position from the first temperature zone portion 63a in the vertical direction, and is located on the left side opposite the first temperature zone portion 63a in the horizontal direction, and is located at a position away from the first temperature zone portion 63a. Comparing the first temperature zone portion 63a and the third temperature zone portion 63c, the first temperature zone portion 63a is the high temperature zone portion, and the third temperature zone portion 63c is the low temperature zone portion. The notch portion 65 is adjacent to the first temperature zone portion 63a, which is the high temperature zone portion, in the vertical direction, and adjacent to the third temperature zone portion 63c, which is the low temperature zone portion, in the horizontal direction, so that when heat is transferred in the surface direction of the second substrate 38 in the fourth plate-like body 63, the notch portion 65 can be present between the first temperature zone portion 63a, which is the high temperature zone portion, and the third temperature zone portion 63c, which is the low temperature zone portion. This makes it possible to reduce the area over which heat is transferred to the third temperature zone 63c, and to prevent direct transfer of heat from the first temperature zone 63a to the third temperature zone 63c.

Comparing the first temperature zone 63a, the second temperature zone 63b, and the third temperature zone 63c, the first temperature zone 63a is the high temperature zone, the second temperature zone 63b is the medium temperature zone, and the third temperature zone 63c is the low temperature zone. The second temperature zone 63b is adjacent to the first temperature zone 63a in the left-right direction and adjacent to the third temperature zone 63c in the up-down direction, so that not only the notch 65 but also the second temperature zone 63b, which is the medium temperature zone, can be present between the first temperature zone 63a, which is the high temperature zone, and the third temperature zone 63c, which is the low temperature zone. Therefore, direct heat transfer from the first temperature zone 63a to the third temperature zone 63c can be more effectively prevented.

In this way, the heat in the first temperature range transferred to the first temperature range portion 63a, which is the high temperature range portion, can be prevented from being transferred directly to the third temperature range portion 63c, which is the low temperature range portion. This prevents the heat in the first temperature range from being transferred to the third electronic component 64c via the third temperature range portion 63c of the fourth plate-shaped body 63 and the third conduction range portion 51c of the first thermal conductor 51, thereby preventing failure of the third electronic component 64c, etc.

In addition to the notch 65, the fourth plate-shaped body 63 has a first notch 65a formed on the right side and a second notch 65b formed on the left side in the upper part of the third temperature zone part 63c, so that the heat transfer area to the third temperature zone part 63c can be further reduced. The first notch 65a and the second notch 65b are arranged at different positions in the vertical direction with the first notch 65a located on the upper side. In addition, the third notch 65c is formed in the upper part of the first temperature zone part 63a, and the fourth notch 65d is formed in the upper part of the second temperature zone part 63b. In this way, by forming the multiple notches 65a to 65d, when the heat is transferred in the fourth plate-shaped body 63 along the surface direction of the second substrate 38, the heat transfer area is reduced and the heat transfer direction is restricted, so that the heat transfer in the surface direction of the second substrate 38 is favorably performed.

The fourth plate-shaped body 63 is provided with a first extension portion 66 extending rearward from the side (right side) where the first temperature zone portion 63a is located as shown in Figs. 9 and 10, and a second extension portion 67 extending rearward from the side (left side) where the second temperature zone portion 63b is located as shown in Figs. 9 and 11. The first extension portion 66 and the second extension portion 67 are formed by bending the end side portions of the fourth plate-shaped body 63 in the left-right direction rearward, and are provided integrally with the fourth plate-shaped body 63. The rear side portions of the first extension portion 66 and the second extension portion 67 are in contact with the plate-shaped body contact portion 55 of the rear casing 27 as shown in Fig. 8, and the heat transferred to the fourth plate-shaped body 63 is transferred to the rear casing 27 via the first extension portion 66 and the second extension portion 67 to be dissipated. The first extension portion 66 and the second extension portion 67 correspond to the second heat transfer portion.

As shown in FIG. 9, the first extension portion 66 is disposed at a position corresponding to the position of the first temperature zone portion 63a in the vertical direction and adjacent to the first temperature zone portion 63a in the horizontal direction. Moreover, since heat generated from the electronic components 64a to 64c, etc. is not directly transferred to the first extension portion 66, the first extension portion 66 is at a lower temperature than the first temperature zone portion 63a. This allows the heat in the first temperature zone transferred to the first temperature zone portion 63a to be directly transferred to the first extension portion 66. Therefore, the heat in the first temperature zone transferred to the first temperature zone portion 63a can be transferred to the rear casing 27 via the first extension portion 66 and dissipated efficiently.

9, the second extension portion 67 is disposed at a position corresponding to the position of the second temperature region 63b in the vertical direction and adjacent to the second temperature region 63b in the horizontal direction. Comparing the second temperature region 63b and the third temperature region 63c, the second temperature region 63b is the high temperature region and the third temperature region 63c is the low temperature region. As a result, the second extension portion 67 is disposed at a position adjacent to the second temperature region 63b, which is a higher temperature region than the third temperature region 63c, which is a low temperature region, in the surface direction of the second substrate 38. Moreover, since the heat generated from the electronic components 64a to 64c is not directly transferred to the second extension portion 67, the second extension portion 67 is at a lower temperature than the third temperature region 63c. The heat transferred to the second temperature region 63b, which is the high temperature region, can be efficiently transferred to the second extension portion 67 while suppressing the heat transfer to the third temperature region 63c, which is the low temperature region. Therefore, the heat transferred to the second temperature region 63b, which is the high temperature region, can be efficiently dissipated by being transferred to the rear casing 27 via the second extension portion 67.

As mentioned above, the first extension portion 66 is disposed at a position corresponding to the position of the first temperature zone portion 63a in the vertical direction and adjacent to the first temperature zone portion 63a in the horizontal direction. Therefore, even if the first temperature zone portion 63a and the second temperature zone portion 63b are high temperature zone portions, the first extension portion 66 and the second extension portion 67 are disposed at a position adjacent to the first temperature zone portion 63a and the second temperature zone portion 63b, which are high temperature zone portions in the surface direction of the second substrate 38, compared to the third temperature zone portion 63c, which is a low temperature zone portion.

10, the first extension 66 has a narrow shape with a narrow vertical width at the base end portion 66a, and a tip end portion 66b, which is a portion rearward of the base end portion 66a, is extended downward from the base end portion 66a in the vertical direction, and has a shape with a vertical width E1 larger than that of the base end portion 66a. On the other hand, the second extension 67 has a rectangular shape with the same vertical width E2 from the base end portion, which is a portion forward, to the tip end portion, which is a portion rearward, as shown in FIG. 11. As shown in FIG. 10 and FIG. 11, the vertical width E2 of the second extension 67 is set to the same size as the vertical width E1 of the first extension 66, and is larger than the vertical width of the base end portion 66a of the first extension 66. That is, the width of the base end portion of the second extension portion 67 in the vertical direction is larger than the width of the base end portion 66a of the first extension portion 66 in the vertical direction. As a result, the second extension portion 67 has a larger heat transfer area to the rear side than the first extension portion 66, and is configured to transfer more heat to the rear side than the first extension portion 66. The first extension portion 66 is extended from the left side where the first temperature region portion 63a is located in the left-right direction, so that it transfers heat in the first temperature region to the rear side. On the other hand, the second extension portion 67 is extended from the right side where the second temperature region portion 63b is located in the left-right direction, so that it transfers heat at a temperature lower than the first temperature region to the rear side. Therefore, between the first extension portion 66 and the second extension portion 67, the first extension portion 66 transfers higher temperature heat to the rear side than the second extension portion 67, but the second extension portion 67 transfers more heat to the rear side than the first extension portion 66. As a result, the amount of heat transferred to the rear casing 27 by the first extension portion 66 and the amount of heat transferred to the rear casing 27 by the second extension portion 67 can be equalized, and heat dissipation in the rear casing 27 can be performed efficiently in a balanced manner.

As shown in Figure 10, the tip end portion 66b of the first extension portion 66 has a larger vertical width E1 than the base end portion 66a. As shown in Figures 10 and 11, the length of the first extension portion 66 extending rearward from the fourth plate-like body 63 is set to D1, and the length D1 is larger than the length D2 of the second extension portion 67 extending rearward from the fourth plate-like body 63. This allows the area of the tip end portion 66b of the first extension portion 66 to be larger, ensuring an area sufficient to diffuse the heat transferred to the tip end portion 66b. Therefore, even if high-temperature heat such as in the first temperature range is transferred for a long period of time to the tip portion 66b of the first extension portion 66 or the portion of the rear casing 27 that contacts the tip portion 66b, the temperature can be reduced by heat diffusion in the tip portion 66b, and the tip portion 66b of the first extension portion 66 or the portion of the rear casing 27 that contacts the tip portion 66b can be prevented from becoming too hot.

As shown in Figures 10 and 11, in addition to the first extension portion 66 and the second extension portion 67, the fourth plate-like body 63 is integrally provided with a plurality of rearward extension portions 68 formed by bending the left-right end portions rearward. The rearward extension portions 68 are provided in a pair on the left and right sides at positions corresponding to the upper end portions in the vertical direction on the fourth plate-like body 63, and are provided only on the left side at a position corresponding to the lower end portion in the vertical direction.

[Another embodiment]
(1) In the above first embodiment, the first plate-like body 53 and the second plate-like body 54 were positioned so that the first left-right extension portion 53a of the first plate-like body 53 and the second left-right extension portion 54a of the second plate-like body 54 were located between the first substrate 37 and the second substrate 38. However, the positions of the first left-right extension portion 53a and the second left-right extension portion 54a need only be forward of the third substrate 39. For example, the first plate-like body 53 and the second plate-like body 54 can also be positioned so that the first left-right extension portion 53a and the second left-right extension portion 54a are located between the second substrate 38 and the third substrate 39.

(2) In the first to third embodiments, in addition to the third board 39 on which the power supply components 36 that generate a lot of heat are mounted, a total of three boards are provided: the first board 37 and the second board 38. However, it is sufficient to provide the third board 39 on which the power supply components 36 are mounted; the number of additional boards can be changed as appropriate. For example, it is also possible to provide two boards, including one board in addition to the third board 39.

In the first to third embodiments, the first plate-shaped body 53, the third heat conductor 61, and the fourth plate-shaped body 64 are arranged between the first substrate 37 and the second substrate 38. However, for example, the first plate-shaped body 53, the third heat conductor 61, and the fourth plate-shaped body 64 can be arranged between the second substrate 38 and the third substrate 39. As a result, the arrangement positions of the first plate-shaped body 53, the third heat conductor 61, and the fourth plate-shaped body 64 can be changed as appropriate as long as they are on the forward side (the other side) of the third substrate 39. As described above, when a substrate is provided in addition to the third substrate 39, and two substrates are provided, the first plate-shaped body 53, the third heat conductor 61, and the fourth plate-shaped body 64 can be arranged between the third substrate 39 and the other substrate.

(3) The shapes, lengths, etc. of the first plate-like body 53 and the second plate-like body 54 in the first embodiment can be appropriately changed. The first plate-like body 53 may be any body that can transfer heat transferred between the first board 37 and the second board 38 by the first thermal conductor 51 to the rear casing 27 through the periphery of the second board 38 and the third board 39. The second plate-like body 54 may be any body that can transfer heat transferred between the first board 37 and the second board 38 by the first thermal conductor 51 to the front side of the first board 37.
Furthermore, the first plate-like body 53 and the second plate-like body 54 do not necessarily have to be integrally formed, and the first plate-like body 53 and the second plate-like body 54 may be formed separately.

(4) The shape, length, etc. of the third plate-like body 62 in the second embodiment can be changed as appropriate. The third plate-like body 62 may be any body that can transfer heat transferred between the first board 37 and the second board 38 by the third thermal conductor 61 through the periphery of the second board 38 and the third board 39 to the rear casing 27.

(5) The position, shape, thickness, configuration, etc. of the first thermal conductor 51, the second thermal conductor 52, and the contact heat transfer section 56 in the first embodiment and the second thermal conductor 52 and the third thermal conductor 61 in the second embodiment can be changed as appropriate.

(6) In the above first to third embodiments, an example was shown in which the heat dissipation structure according to the present invention was applied to the information and communication unit 2. However, as long as the heat generated by the electronic components mounted on the substrate is transferred to the heat dissipation section and dissipated, the heat dissipation structure can be applied to various devices having a substrate, electronic components, and a heat dissipation section.

(7) In the above third embodiment, an example was shown in which the fourth plate-like body 63 has three temperature zones: the first temperature zone 63a, the second temperature zone 63b, and the third temperature zone 63c. However, it is also possible to have two zones: a high temperature zone where heat from the high temperature zone is transferred, and a low temperature zone where heat from a low temperature zone that is lower than the high temperature zone is transferred. The number of temperature zones can be changed as appropriate.

63 Fourth plate-like body (surface direction heat transfer portion)
66 First extension portion (second heat transfer portion)
67 Second extension portion (second heat transfer portion)

Claims (1)

The substrate supplying device includes a plurality of substrates, a casing for accommodating the plurality of substrates, and an exposed portion exposed to the outside of the casing,
The exposed portion is configured on an outer surface of the casing,
a heat transfer unit that is provided separately from the casing and is disposed inside the casing without being exposed to the outside of the casing;
In the information communication unit, the heat transfer section has a heat dissipation structure that transfers and collects heat from a plurality of substrates to itself, transfers the collected heat from the plurality of substrates along the surface direction of the substrates, and then transfers the heat in the front and back directions of the substrates to the exposed section to dissipate the heat,
The antenna element, the information communication component, and the power supply component are provided,
The casing is installed in the installation target site in an embedded state in which at least a rear part of the casing is embedded inside the installation target site,
The exposed portion is disposed behind a decorative cover that is disposed in front of the installation target portion of the information communication unit.

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