JP7533340B2 - Parts to be mounted on wiring board - Google Patents

Description

The present invention relates to components mounted on a wiring board.

Patent Document 1 discloses a hybrid IC in which multiple surface-mounted components mounted on a wiring board are covered with a covering member. This covering member has a ceiling portion formed of a flat ceramic member and multiple legs that are approximately the same height as the surface-mounted components. The lower ends of the multiple legs are fixed to the wiring board with solder or the like.

International Publication No. 2006/059556

When the covering member is mounted on the wiring board, the covering member and the wiring board are heated, causing warping of the wiring board. This warping can change the contact state between the tips of the legs of the covering member and the wiring board, which can cause poor connection between the wiring board and the legs. The object of the present invention is to provide a component that can be mounted on the wiring board with good reproducibility even if warping occurs in the wiring board, etc.

According to one aspect of the present invention,
a main member including a first surface facing the wiring board when mounted on the wiring board;
a plurality of legs disposed on a periphery of the first surface and protruding from the first surface;
The tip ends of the plurality of legs are fixed to the wiring board, whereby the device is mounted on the wiring board;
each of the plurality of legs includes a side surface perpendicular to the first surface, a tip surface facing the wiring board when mounted on the wiring board, and a slope connected to the tip surface and sloped with respect to the tip surface, an interior angle between the tip surface and the slope being 120° or more and 170° or less;
The inclined surface of each of the plurality of legs is provided at a position farther from the edge of the first surface closest to the leg than the tip surface, and a component is provided in which the inclined surface is not provided on the outer circumferential side of the first surface relative to the tip surface .

By providing a slope at the tip of the leg, it is possible to prevent poor connection between the wiring board and the leg.

FIG. 1 is a perspective view of a component according to a first embodiment. FIG. 2 is a bottom view of the component according to the first embodiment. FIG. 3 is a cross-sectional view of a module including components according to a first embodiment. FIG. 4A is a cross-sectional view showing a component according to the first embodiment mounted on a wiring board in which warping has occurred, FIG. 4B is a cross-sectional view of the tip of the leg, land, and solder of the component according to the first embodiment, and FIG. 4C is a cross-sectional view of the tip of the leg, land, and solder of the component according to the comparative example. 5A and 5B are cross-sectional views of a component and a wiring board at an intermediate stage in the process of mounting a component on a wiring board according to a comparative example, and FIG. 5C is a cross-sectional view of a component and a wiring board at an intermediate stage in the process of mounting a component on a wiring board according to the first embodiment. 6A and 6B are cross-sectional views showing the vicinity of the leg portion when the components according to the comparative example and the first embodiment are mounted on a wiring board, respectively. FIG. 7 is a cross-sectional view of the legs, lands, and solder of the components according to the first embodiment and the comparative example. 8A and 8B are side views of the tip of a leg of a component according to the first embodiment and a modified example of the first embodiment, respectively. FIG. 9 is a side view and a cross-sectional plan view of the tip of the leg of the component according to the first embodiment. FIG. 10 is a side view and a cross-sectional plan view of the tip of a leg of a component according to a modification of the first embodiment. FIG. 11 is a side view and a cross-sectional plan view of the tip of a leg of a component according to another modified example of the first embodiment. FIG. 12 is a perspective view of a leg portion of a component according to still another modified example of the first embodiment. FIG. 13 is a perspective view of a part according to the second embodiment. FIG. 14 is a cross-sectional view showing a state in which the component according to the second embodiment is mounted on a warped wiring board. 15A and 15B are perspective views of legs of a component according to the third embodiment and a modification thereof, respectively. 16A and 16B are side and bottom views, respectively, of a component according to the fourth embodiment. FIG. 17A is a perspective view of a component according to the fifth embodiment, and FIG. 17B is a cross-sectional view of a module including the component according to the fifth embodiment. FIG. 18 is a cross-sectional view of a module including components according to the sixth embodiment. FIG. 19 is a perspective view of a part according to the seventh embodiment.

[First embodiment]
A component according to a first embodiment mounted on a wiring board will be described with reference to Figures 1 to 11. The component according to the first embodiment is mounted on the wiring board so as to cover a plurality of surface-mount electronic circuit components mounted on the wiring board. The component according to the first embodiment is sometimes called a covering component or covering member because it is used to cover electronic circuit components.

Figure 1 is a perspective view of a component 20 according to a first embodiment. The component 20 according to the first embodiment includes a main member 21 and multiple legs 22. The main member 21 is a flat metal member including a first surface 21A that faces the wiring board when mounted on the wiring board. In this specification, the direction in which the first surface 21A faces is defined as downward. According to this definition, Figure 1 corresponds to a perspective view of the component 20 viewed diagonally from below. The multiple legs 22 protrude downward from the first surface 21A of the main member 21. The multiple legs 22 are also arranged on the periphery of the first surface 21A, and are arranged at intervals from each other along the edge of the first surface 21A around almost the entire circumference.

The surface of each leg 22 includes a tip surface 22A that faces the wiring board when mounted on the wiring board, a sloped surface 22B that is continuous with the tip surface 22A, and a side surface 22C. The tip surface 22A is parallel to the first surface 21A, and the side surface 22C is approximately perpendicular to the first surface 21A. The tip surfaces 22A of the multiple legs 22 are located on a common imaginary plane. The sloped surface 22B is inclined relative to the tip surface 22A. In other words, the tip of the leg 22 has a shape in which part of the edge of the tip surface 22A is beveled. The "chamfered shape" represents the shape of the result obtained by some manufacturing method, and is not limited to the manufacturing method being chamfering.

Figure 2 is a bottom view of the part 20 according to the first embodiment. Each of the legs 22 includes a tip surface 22A and a sloped surface 22B. The sloped surface 22B of each of the multiple legs 22 is located farther from the edge of the first surface 21A that is closest to the leg 22 than the tip surface 22A. The intersection line between the tip surface 22A and the sloped surface 22B is a straight line.

Figure 3 is a cross-sectional view of a module including a component 20 according to the first embodiment. A semiconductor chip 31 and a surface-mount type passive component 32 are mounted on the component mounting surface of a wiring board 50. The component 20 according to the first embodiment is mounted on the wiring board 50 so as to cover the semiconductor chip 31 and the passive component 32, with the first surface 21A of the main member 21 facing the wiring board 50. In other words, the semiconductor chip 31 and the passive component 32 are contained in the main member 21 in a plan view, and are disposed between the wiring board 50 and the main member 21 in the thickness direction of the wiring board 50.

A number of lands 51 are provided on the component mounting surface of the wiring board 50. Figure 3 shows an outline of the positional relationship between the surface of the wiring board 50 and the lands 51.

Some of the lands 51 are positioned so as to overlap multiple legs 22 of the component 20 in a plan view. The multiple legs 22 are each fixed to the land 51 by solder 60. The legs 22 are connected to a ground conductor (not shown) in the wiring board 50 via the solder 60 and the land 51. The main member 21 of the component 20 is electrically connected to the ground conductor via the legs 22. The component 20 has the function of high-frequency shielding circuit components such as the semiconductor chip 31 and passive components 32 mounted on the wiring board 50.

Next, one advantageous effect of the first embodiment will be described with reference to Figures 4A, 4B, and 4C.

Figure 4A is a cross-sectional view showing the state in which the component 20 according to the first embodiment is mounted on a warped wiring board 50. Warping may occur in the wiring board 50 due to a rise in temperature caused by heating during the mounting process. In the example shown in Figure 4A, warping has occurred such that the component mounting surface of the wiring board 50 has become convex. When mounting the component 20 on the wiring board 50, solder paste is printed on the top surface of the land 51, and the tip of the leg 22 of the component 20 is placed on top of it. In this state, the solder paste is melted and then solidified.

Figure 4B is a cross-sectional view of the tip of the leg 22, the land 51, and the solder 60 of the component 20 according to the first embodiment. When the wiring board 50 is not warped, the tip surface 22A of the leg 22 and the upper surface of the land 51 face each other almost parallel to each other. When the wiring board 50 is warped, the tip surface 22A and the upper surface of the land 51 deviate from the parallel relationship. When the component mounting surface is warped in a convex shape, the distance between the tip surface 22A and the upper surface of the land 51 becomes wider from the innermost part of the wiring board 50 toward the outer periphery. The angle between the two is represented as θa. The angle between the slope 22B and the upper surface of the land 51 is represented as θb. When the component mounting surface is warped in a convex shape, the angle θb becomes smaller than when no warp occurs.

When the solder melts, the tip surface 22A and the slope 22B are wetted with the molten solder. When the solder solidifies, the tip surface 22A and the slope 22B are in contact with the solidified solder 60.

Figure 4C is a cross-sectional view of the tip of leg 22, land 51, and solder 60 of a component according to a comparative example. In the comparative example, the tip of leg 22 does not have a slope 22B. When wiring board 50 has the same amount of warping as in Figure 4B, angle θa between tip surface 22A and the top surface of land 51 is equal to angle θa in Figure 4B. The angle between the region of side surface 22C of leg 22 facing the innermost part of wiring board 50 and the top surface of land 51 is denoted as θc. Angle θc is greater than angle θb.

Some of the solder between the tip surface 22A and the land 51 flows around to the side surface 22C on the innermost side, and the area near the lower end of the side surface 22C becomes wet with the molten solder. The amount of solder between the tip surface 22A and the land 51 is reduced by the solder that flows around to the side surface 22C, and some areas on the outer periphery of the tip surface 22A are no longer wet with the solder.

Because angle θc is greater than angle θb, side surface 22C (FIG. 4C) is less likely to become wet with solder than inclined surface 22B (FIG. 4B). In addition, the amount of solder between tip surface 22A and land 51 is reduced due to solder that has wound around side surface 22C. This makes it easier for poor electrical continuity to occur between leg 22 and land 51. If poor electrical continuity occurs, the shielding function of component 20 will be reduced.

In the first embodiment, the angle θb (FIG. 4B) is smaller than the angle θc (FIG. 4C) in the component according to the comparative example, so the slope 22B is more easily wetted by solder than the side surface 22C (FIG. 4C). This makes it less likely that poor electrical continuity will occur between the leg 22 and the land 51. In this way, by providing the slope 22B at the tip of the leg 22, it is possible to suppress the occurrence of poor electrical continuity between the leg 22 and the land 51.

Next, other advantageous effects of the first embodiment will be described with reference to Figures 5A, 5B, and 5C.

Figures 5A and 5B are cross-sectional views of component 20 and wiring board 50 in the middle of a process of mounting component 20 on wiring board 50 according to a comparative example. In the component according to the comparative example, slope 22B (Figure 1) is not provided at the tip of leg 22. Paste-like solder 60 is printed on the upper surface of land 51. If the temperature of wiring board 50 varies depending on the position on the surface during solder reflow, the timing at which solder 60 printed on each of the multiple lands 51 begins to melt will vary.

Figure 5A shows a state in which the solder 60 in contact with the left leg 22 is molten, and the solder 60 in contact with the right leg 22 is not molten. The molten solder 60 wraps around to the outer side surface 22C of the leg 22. The surface tension of the molten solder 60 applies a force to the component 20 that brings the outer side surface 22C of the leg 22 closer to the top surface of the wiring board 50. Since the solder 60 under the right leg 22 is not molten, the right leg 22 is not attached to the land 51, and no surface tension acts on it. As shown in Figure 5B, the surface tension of the solder 60 may cause the right end of the component 20 to lift up. If the solder 60 solidifies with one side of the component 20 lifted up, the yield of the mounting process of the component 20 will decrease.

Figure 5C is a cross-sectional view of the component 20 and the wiring board 50 in the middle of the process of mounting the component 20 on the wiring board 50 according to the first embodiment. As in the case of Figure 5A, the solder 60 in contact with the left leg 22 in Figure 5C is melted, and the solder 60 in contact with the right leg 22 is not melted. In the first embodiment, a slope 22B is provided at the tip of the leg 22. The slope 22B is more easily wetted by the molten solder 60 than the outer side surface 22C of the leg 22. Therefore, the molten solder 60 fills the space between the slope 22B and the land 51 before wrapping around the outer side surface 22C. Since the molten solder 60 is less likely to wrap around the outer side surface 22C of the leg 22, the phenomenon of one side of the component 20 lifting up is less likely to occur.

Next, referring to Figures 6A and 6B, we will explain further advantages of the first embodiment.

Figures 6A and 6B are cross-sectional views showing the vicinity of leg 22 when component 20 according to the comparative example and the first embodiment are mounted on wiring board 50, respectively. Land 51 is provided on the component mounting surface of wiring board 50. The component mounting surface of wiring board 50 is covered with solder resist film 52. An opening is provided in solder resist film 52 to expose the upper surface of land 51. In a plan view, the opening in solder resist film 52 is slightly smaller than land 51, and solder resist film 52 covers the peripheral portion of the upper surface of land 51. This configuration is called an over resist.

In the comparative example (FIG. 6A), excess solder may overflow outside the openings of the solder resist film 52 during solder reflow. When the solder that overflows outside the openings solidifies, it becomes a spherical solder ball 60A. Solder ball 60A that remains in the final product can cause a short circuit in the electronic circuit.

In the first embodiment (FIG. 6B), the tip of the leg 22 is provided with a slope 22B, so the volume of the solder containing space between the leg 22 and the land 51 is larger than in the comparative example. This makes it difficult for excess solder to spill out of the opening provided in the solder resist film 52. As a result, the occurrence of solder balls can be suppressed.

In Figures 6A and 6B, an example is shown in which the opening in the solder resist film 52 is slightly smaller than the land 51, but the opening in the solder resist film 52 may be slightly larger than the land 51. This type of configuration is called a clearance resist. In this case, too, the effect of suppressing the occurrence of solder balls can be obtained, just like in the case of the over resist.

Next, still another excellent effect of the first embodiment will be described with reference to FIG.
Fig. 7 is a cross-sectional view of the leg 22, land 51, and solder 60 of the component 20 according to the first embodiment and a comparative example. The leftmost drawing in Fig. 7 shows an example in which no slope is provided at the tip of the leg 22, while the central and right drawings show examples in which a slope 22B is provided at the tip of the leg 22. The slope 22B of the leg 22 in the right drawing is larger than the slope 22B of the leg 22 in the central drawing.

By providing a slope 22B at the tip of the leg 22 and reducing the area of the tip surface 22A, the amount of sinking of the leg 22 into the solder 60 increases. When the amount of sinking increases, the contact area between the leg 22 and the solder 60 increases, and the leg 22 is more strongly fixed to the land 51. In this way, by providing a slope 22B at the tip of the leg 22, the fixing strength of the leg 22 to the land 51 can be increased.

As shown in the drawing on the right, if the inclined surface 22B becomes too large, the contact area between the leg 22 and the solder 60 becomes small. From the viewpoint of increasing the bonding strength, there is a preferred range for the size of the inclined surface 22B.

When the interior angle between the tip surface 22A and the inclined surface 22B approaches 90°, it becomes difficult to distinguish between the inclined surface 22B and the side surface 22C, and the excellent effect of the first embodiment described with reference to the drawings from FIG. 4A to FIG. 7 is diminished. Conversely, when the interior angle between the tip surface 22A and the inclined surface 22B approaches 180°, it becomes difficult to distinguish between the inclined surface 22B and the tip surface 22A, and the excellent effect of the first embodiment described with reference to the drawings from FIG. 4A to FIG. 7 is diminished.

Next, the preferred shape of the tip of the leg 22 to obtain the above-mentioned sufficiently excellent effect will be described with reference to Figures 8A to 11.

Figure 8A is a side view of the tip of the leg 22 of the part 20 according to the first embodiment. The surface of the leg 22 is composed of a tip surface 22A, a slope 22B, and a side surface 22C. The size of the interior angle between the tip surface 22A and the slope 22B is denoted as θ. The side surface 22C is approximately perpendicular to the tip surface 22A.

If the interior angle θ is too close to 90°, it becomes difficult to distinguish between the slope 22B and the side surface 22C, and the effect of providing the slope 22B is reduced. In order to distinguish the slope 22B from the side surface 22C and to obtain the full effect of providing the slope 22B, it is preferable to set the interior angle θ to 120° or more.

If the interior angle θ is too close to 180°, it becomes difficult to distinguish between the inclined surface 22B and the tip surface 22A, and the effect of providing the inclined surface 22B is reduced. In order to distinguish the inclined surface 22B from the tip surface 22A and to obtain a sufficient effect of providing the inclined surface 22B, it is preferable to set the interior angle θ to 170° or less.

Figure 8B is a side view of the tip of leg 22 of part 20 according to a modified example of the first embodiment. In this modified example, inclined surface 22B of leg 22 includes a curved area around it, and inclined surface 22B is smoothly connected to tip surface 22A and side surface 22C. In this case, the size of the interior angle between tip surface 22A and flat area 22BF other than the curved area of inclined surface 22B may be defined as the size of the interior angle θ between tip surface 22A and inclined surface 22B. In this modified example, it is preferable that the interior angle θ between tip surface 22A and inclined surface 22B is greater than or equal to 120° and less than or equal to 170°.

Figure 9 shows a side view and a planar cross-sectional view of the tip of the leg 22 of the part 20 according to the first embodiment. The area of the planar cross section of the leg 22 at the position 42 of the slope 22B where the height h from the tip surface 22A is the highest is denoted as Sa. Here, a planar cross section means a cross section parallel to the tip surface 22A. The area of the image of the slope 22B projected perpendicularly onto this cross section is denoted as So. In Figure 9, the image of the slope 22B is hatched.

If the area So of the image of the slope 22B is too small, the effect obtained by providing the slope 22B will be small. As the area So increases, as shown in the center and right figures of Figure 7, the amount of sinking of the leg 22 increases and the contact area between the leg 22 and the solder increases. If the area So exceeds a certain size and becomes even larger, the contact area between the leg 22 and the solder decreases as the area So increases. To further increase the effect of increasing the adhesion strength, it is preferable to set the area So to be 10% to 50% of the area Sa of the planar cross section of the leg 22.

10 shows a side view and a planar cross-sectional view of the tip of the leg 22 of the part 20 according to a modification of the first embodiment. In this modification, a curved area is provided around the inclined surface 22B of the leg 22, and the inclined surface 22B is smoothly connected to the tip surface 22A and the side surface 22C. In this case, the intersection line 43 between the imaginary plane 41 including the flat area 22BF of the inclined surface 22B and the imaginary plane 40 including the tip surface 22A may be defined as the imaginary boundary line between the tip surface 22A and the inclined surface 22B. That is, in the planar cross-section of the leg 22 at the position 42 where the height h of the inclined surface 22B from the tip surface 22A is the highest, the area of the area on the flat area 22BF side of the inclined surface 22B from the vertical projection image of the intersection line 43 may be defined as the area So of the image of the inclined surface 22B.

In this modified example, in order to obtain the full effect of providing the inclined surface 22B, it is preferable to set the area So to 10% to 50% of the area Sa of the planar cross section of the leg portion 22.

Figure 11 shows a side view and a cross-sectional plan view of the tip of the leg 22 of the part 20 according to another modification of the first embodiment. In the first embodiment (Figure 8A), the side surface 22C of the leg 22 is nearly perpendicular to the tip surface 22A. In contrast, in this modification, the side surface 22C of the leg 22 is inclined relative to the tip surface 22A. For example, the side surface 22C is inclined so as to become thinner from the base of the leg 22 toward the tip.

Since the lower limit of the preferred range of the interior angle θ between the tip surface 22A and the slope 22B is 120°, the surface that the angle between the tip surface 22A and the side surface 22C or its extension surface is smaller than 120° can be considered as the side surface 22C. The area of the planar cross section of the leg 22 at the position 42 of the slope 22B where the height h from the tip surface 22A is the highest can be adopted as the area Sa of the planar cross section of the leg 22. In this modified example, in order to obtain a sufficient effect of providing the slope 22B, it is preferable that the area So of the vertical projection image of the slope 22B onto the planar cross section be 10% to 50% of the area Sa of the planar cross section of the leg 22.

Next, a component according to yet another modified example of the first embodiment will be described with reference to FIG.
12 is a perspective view of the leg 22 of the part 20 according to yet another modification of the first embodiment. In the first embodiment (FIG. 1), the leg 22 has a shape of a cylinder with a part of the edge of the tip end chamfered, but the leg 22 of the part 20 according to this modification has a shape of a quadrangular prism with a square or rectangular base with one edge of the tip end chamfered. The tip surface 22A and the inclined surface 22B are rectangular.

As in this modified example, the shape of the leg 22 is not limited to a cylindrical shape, but may be a rectangular prism shape. It may also be a polygonal prism, an elliptical prism, or the like.

[Second embodiment]
Next, components according to a second embodiment will be described with reference to Figures 13 and 14. Below, a description of configurations common to the components according to the first embodiment and its modified example described with reference to Figures 1 to 11 will be omitted.

Figure 13 is a perspective view of a part 20 according to the second embodiment. In the first embodiment (Figures 1 and 2), the inclined surface 22B of the leg 22 is located farther from the nearest edge of the first surface 21A than the tip surface 22A. In contrast, in the second embodiment, the inclined surface 22B of the leg 22 is located closer to the outer periphery of the first surface 21A than the tip surface 22A.

Next, the advantageous effects of the second embodiment will be described with reference to FIG.
14 is a cross-sectional view showing a state in which the component 20 according to the second embodiment is mounted on a warped wiring board 50. In the first embodiment, as described with reference to FIGS. 4A and 4B, when the component mounting surface of the wiring board 50 is warped in a convex shape, an excellent effect of suppressing the occurrence of a conduction failure is obtained. In contrast, in the second embodiment, when the wiring board 50 is warped in a concave shape, an excellent effect of suppressing the occurrence of a conduction failure is obtained. Depending on the shape of the warp occurring in the wiring board 50 on which the component 20 is mounted, it is possible to determine whether to adopt the component 20 according to the first embodiment or the component 20 according to the second embodiment.

Also, in the second embodiment, the excellent effect of suppressing the generation of solder balls 60A described with reference to Figures 6A and 6B can be obtained. Furthermore, the excellent effect of increasing the adhesion strength described with reference to Figure 7 can be obtained.

[Third Example]
Next, components according to the third embodiment and its modified examples will be described with reference to Figures 15A and 15B. Below, a description of configurations common to the components according to the first embodiment and its modified examples described with reference to Figures 1 to 11 will be omitted.

Figure 15A is a perspective view of the leg 22 of a part according to the third embodiment. In the first embodiment (Figure 1), the slope 22B is continuous with a portion of the outer periphery of the tip surface 22A. In contrast, in the third embodiment shown in Figure 15A, the slope 22B is provided around the entire edge of the tip surface 22A. For example, the leg 22 has a shape in which one circular end face of a cylinder is beveled around the entire circumference.

Figure 15B is a perspective view of leg 22 of part 20 according to a modified example of the third embodiment. Leg 22 of part 20 according to this modified example has a shape in which the four edges of the end face of a quadrangular prism with a square or rectangular base are beveled.

Next, the advantageous effects of the third embodiment and its modified example will be described.
The components according to the third embodiment and its modified examples also provide the same excellent effects as those of the first embodiment, such as the effect of suppressing the occurrence of poor electrical continuity between the leg 22 and the land 51 described with reference to Figures 4A and 4B, the effect of suppressing the occurrence of solder balls 60A described with reference to Figures 6A and 6B, and the effect of increasing the fixing strength of the leg 22 to the land 51 described with reference to Figure 7.

[Fourth embodiment]
Next, components according to the fourth embodiment and its modified examples will be described with reference to Figures 16A and 16B. Below, a description of configurations common to the components according to the first embodiment and its modified examples described with reference to Figures 1 to 11 will be omitted.

Figures 16A and 16B are a side view and a bottom view, respectively, of a component 20 according to the fourth embodiment. The component 20 according to the first embodiment (Figure 3) is used to cover and shield at high frequencies a semiconductor chip 31, passive components 32, etc. mounted on a wiring board 50. In contrast, the component 20 according to the fourth embodiment is a surface-mount type passive component such as a capacitor or inductor. A capacitor or inductor is formed within the main member 21. The legs 22 function as terminals for external connection of the capacitor or inductor.

The leg 22 used as a terminal for external connection includes a tip surface 22A and a sloped surface 22B, similar to the leg 22 of the part 20 (FIG. 1) according to the first embodiment. The main member 21 has a rectangular shape in a plan view. The two leg portions 22 are disposed at both ends of the rectangular bottom surface of the main member 21. The sloped surface 22B is provided on the innermost side of the bottom surface (closer to the geometric center) than the tip surface 22A.

Next, the advantageous effects of the fourth embodiment will be described.
The component according to the fourth embodiment also provides the same excellent effects as those of the first embodiment. For example, the effect of suppressing lifting of one side of the component 20 during solder reflow, as described with reference to Figures 5A, 5B, and 5C, is obtained. In addition, the effect of suppressing the generation of solder balls 60A, as described with reference to Figures 6A and 6B, and the effect of increasing the fixing strength of the leg 22 to the land 51, as described with reference to Figure 7, are obtained.

Next, a modified example of the fourth embodiment will be described. The component 20 according to the fourth embodiment is an individual surface-mount type passive component such as a capacitor or an inductor. Alternatively, legs 22 having a shape similar to the legs 22 of the component 20 according to the first embodiment may be attached to an integrated passive device (IPD).

[Fifth Example]
Next, components according to the fifth embodiment will be described with reference to Figures 17A and 17B. Below, a description of the components common to the first embodiment described with reference to Figures 1 to 11 will be omitted.

Figure 17A is a perspective view of a part 20 according to the fifth embodiment. In the first embodiment (Figure 1), the first surface 21A of the main member 21 is configured as a single plane. In contrast, the first surface 21A of the main member 21 of the part 20 according to the fifth embodiment has a convex portion 23 that protrudes in the direction in which the leg portion 22 protrudes (downward). The first surface 21A includes a top surface 21AB of the convex portion 23 and a surface area 21AA that surrounds the convex portion 23 in a plan view. The top surface 21AB of the convex portion 23 is parallel to the surrounding surface area 21AA, and the side surface of the convex portion 23 is approximately perpendicular to the surface area 21AA.

The multiple legs 22 are arranged on the periphery of the first surface 21A so as to surround the protrusion 23 in a plan view. Here, the "periphery of the first surface 21A" means a frame-like region of a certain width whose outer periphery is the edge that defines the outline of the first surface 21A when the first surface 21A is viewed in a plan view. Each of the legs 22 includes a tip surface 22A, a slope 22B, and a side surface 22C, similar to the legs 22 of the part 20 according to the first embodiment (FIG. 1).

Using the surface area 21AA as the height reference, the protrusion 23 is lower than the legs 22. In other words, the top surface 21AB of the protrusion 23 is located at a position lower than an imaginary plane that includes the tip surfaces 22A of the multiple legs 22.

Figure 17B is a cross-sectional view of a module including a component 20 according to the fifth embodiment. A semiconductor chip 31 and a passive component 32 are surface-mounted on the component mounting surface of a wiring board 50. Taking the component mounting surface of the wiring board 50 as the height reference, the top surface of the semiconductor chip 31 is positioned higher than the top surfaces of the passive components 32. In a plan view, the protrusion 23 and the passive components 32 overlap, and the surface area 21AA and the semiconductor chip 31 overlap.

Next, the excellent effects of the fifth embodiment will be described.
The component according to the fifth embodiment also provides the same excellent effects as those of the first embodiment, namely, the effect of suppressing lifting of one side of the component 20 during solder reflow, the effect of suppressing the generation of solder balls 60A, and the effect of increasing the fixing strength of the leg 22 to the land 51.

The first surface 21A of the main member 21 of the component 20 does not need to be a single plane, and may be composed of a surface area 21AA and a top surface 21AB of the protrusion 23, as in the component 20 of the fifth embodiment. By arranging the top surface of the passive component 32, which is relatively low above the component mounting surface of the wiring board 50, facing the top surface 21AB of the protrusion 23, the distance from the passive component 32 to the main member 21 can be narrowed. This can improve the shielding effect.

Next, a modification of the fifth embodiment will be described.
In the fifth embodiment, the component mounting surface of wiring board 50 is used as the height reference, and the top surface of passive component 32 is disposed at a position lower than the top surface of semiconductor chip 31. Conversely, when the top surface of semiconductor chip 31 is disposed at a position lower than the top surface of passive component 32, convex portion 23 may be provided in an area overlapping semiconductor chip 31 in a plan view. Also, in the fifth embodiment, the side surface of convex portion 23 is approximately perpendicular to surface area 21AA, but the side surface of convex portion 23 may be inclined with respect to surface area 21AA.

[Sixth Example]
Next, components according to the sixth embodiment will be described with reference to Fig. 18. Below, a description of configurations common to the components according to the fifth embodiment described with reference to Figs. 17A and 17B will be omitted.

Figure 18 is a cross-sectional view of a module including a component 20 according to the sixth embodiment. The component 20 according to the fifth embodiment (Figure 17B) is mounted on a wiring board 50 with a flat component mounting surface. In contrast, the component 20 according to the sixth embodiment is mounted on a cavity board 53 with a cavity 54 provided on its surface. A semiconductor chip 31 is housed in the cavity 54.

A number of lands 51 are arranged on the upper surface of the cavity substrate 53 so as to surround the cavity 54 in a plan view. A number of legs 22 of the component 20 are fixed to these lands 51 via solder 60.

In the fifth embodiment (FIG. 17B), the height from the surface area 21AA of the main member 21 of the component 20 to the top surface 21AB of the protrusion 23 is lower than the height to the tip surface 22A of the leg 22. In contrast, in the sixth embodiment, the height from the surface area 21AA of the main member 21 of the component 20 to the top surface 21AB of the protrusion 23 is higher than the height to the tip surface 22A of the leg 22. Therefore, when the component 20 is mounted on the cavity substrate 53, a part of the protrusion 23 is inserted into the cavity 54, and the top surface 21AB is located within the cavity 54. The top surface 21AB faces the top surface of the semiconductor chip 31 housed in the cavity 54.

Next, the excellent effects of the sixth embodiment will be described. As with the fifth embodiment, the sixth embodiment also provides the effects of suppressing lifting of one side of the component 20 during solder reflow, suppressing the generation of solder balls 60A, and increasing the adhesive strength of the leg 22 to the land 51. Furthermore, in the sixth embodiment, the top surface 21AB of the protruding portion 23 of the component 20 is located within the cavity 54, narrowing the gap between the protruding portion 23 and the semiconductor chip 31. This improves the shielding effect.

[Seventh Example]
Next, components according to the seventh embodiment will be described with reference to Fig. 19. Below, a description of configurations common to the components according to the fifth embodiment described with reference to Figs. 17A and 17B will be omitted.

Figure 19 is a perspective view of a part 20 according to the seventh embodiment. In the fifth embodiment (Figure 17A), the protrusion 23 is provided at the innermost part of the first surface 21A. In contrast, in the seventh embodiment, the protrusion 23 is arranged at a position where it contacts part of the edge of the first surface 21A. Some of the multiple legs 22 are arranged on the top surface 21AB of the protrusion 23. Even in this case, it is similar to the fifth embodiment (Figure 17A) in that the multiple legs 22 are arranged on the peripheral part of the first surface 21A.

The heights of the multiple legs 22 are set so that the tip surfaces 22A of all the legs 22 are located on a common imaginary plane. In other words, the height of the legs 22 arranged on the top surface 21AB of the convex portion 23 is lower than the height of the legs 22 arranged on the surface area 21AA.

Next, the advantageous effects of the seventh embodiment will be described. As in the fifth embodiment, the seventh embodiment also provides the effects of suppressing lifting of one side of the component 20 during solder reflow, suppressing the generation of solder balls 60A, and increasing the adhesive strength of the legs 22 to the lands 51. As in the seventh embodiment, the multiple legs 22 may be disposed in areas of the first surface 21A at different heights.

The above-described embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Similar effects due to similar configurations in multiple embodiments will not be mentioned one after another. Furthermore, the present invention is not limited to the above-described embodiments. For example, it will be obvious to those skilled in the art that various modifications, improvements, combinations, etc. are possible.

20 Component 21 Main member 21A First surface of main member 21AA Surface area around convex portion 21AB Top surface of convex portion 22 Leg 22A Tip surface of leg 22B Slope of leg 22BF Flat area of slope 22C Side surface of leg 23 Convex portion 31 Semiconductor chip 32 Passive component 40 Imaginary plane including tip surface of leg 41 Imaginary plane including flat area of slope of leg 42 Highest position of slope 43 Intersection line 50 Wiring board 51 Land 52 Solder resist film 53 Cavity board 54 Cavity 60 Solder 60A Solder ball

Claims (3)

a main member including a first surface facing the wiring board when mounted on the wiring board;
a plurality of legs disposed on a periphery of the first surface and protruding from the first surface;
The tip ends of the plurality of legs are fixed to the wiring board, whereby the device is mounted on the wiring board;
each of the plurality of legs includes a side surface perpendicular to the first surface, a tip surface facing the wiring board when mounted on the wiring board, and a slope connected to the tip surface and sloped with respect to the tip surface, an interior angle between the tip surface and the slope being 120° or more and 170° or less;
A component in which the inclined surface of each of the plurality of legs is provided at a position farther from the edge of the first surface that is closest to the leg than the tip surface, and the inclined surface is not provided on the outer circumferential side of the first surface than the tip surface . The part according to claim 1, wherein in each of the plurality of legs, the area of an image of the slope projected perpendicularly onto a cross section parallel to the tip surface at the point where the slope is at its highest from the tip surface is 10% to 50% of the area of the cross section. The component according to claim 1 or 2 , wherein the plurality of legs are arranged on a peripheral portion of the first surface, along an edge of the first surface, over the entire periphery.

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