JP7529503B2 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method.

In order to remove a resist film formed on the substrate, a resist stripping liquid is supplied onto the substrate which is rotated in a horizontal position. As the resist stripping liquid, for example, a mixture of _sulfuric acid ( _H2SO4 ) and _hydrogen peroxide ( _H2O2 ) (hereinafter, abbreviated as SPM) is used.

Patent Document 1 describes a substrate processing apparatus equipped with a spin chuck and a blocking plate in a chamber. The blocking plate is provided so as to be movable up and down between a blocking position close to the top surface of the substrate held by the spin chuck and a retracted position retracted significantly above the blocking position. In the SPM process, with the blocking plate in the retracted position, SPM is supplied from an SPM nozzle onto the substrate rotated by the spin chuck. Also, with the blocking plate in the blocking position, a rinsing process and a drying process are performed. After the drying process is completed, the rotation of the spin chuck is stopped and the blocking plate is retracted to the retracted position. The substrate is then removed from the chamber by the hand of a substrate transport robot.

JP 2019-207986 A

In the above-mentioned substrate processing apparatus, if an SPM atmosphere remains in the chamber, there is a possibility that mist or droplets in the SPM atmosphere in the chamber may re-adhere to the substrate after the substrate processing operation is completed.

The object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can improve the cleanliness of a substrate after completion of a substrate processing operation.

(1) The substrate processing apparatus according to the present invention includes a substrate processing section that performs substrate processing operations using a processing liquid on a substrate, a substrate transport section having a transport holding section that holds the substrate and transports the substrate to and from the substrate processing section, and a control section that controls the substrate processing section and the substrate transport section. The substrate processing section includes a substrate holding section that holds the substrate in a horizontal position, an opposing member that has an opposing surface that faces the substrate held in the substrate holding section and is configured to be able to rise and fall between a first height position spaced above the substrate holding section and a second height position that is lower than the first height position, and a lifting and lowering section that lifts and lowers the opposing member. The control section controls the lifting and lowering section so that the opposing member is held at the second height position until a predetermined maintenance time has elapsed from the end of the substrate processing operation, and then the opposing member rises from the second height position to the first height position.

In this substrate processing apparatus, the substrate processing operation is performed with the opposing member at the first height position or the second height position. The opposing member is held at the second height position until a predetermined maintenance time has elapsed from the time the substrate processing operation is completed. After the maintenance time has elapsed, the opposing member rises from the second height position to the first height position. This allows the substrate to be removed by the transport holding section of the substrate transport section.

According to this configuration, the facing surface of the facing member faces closely to the upper surface of the substrate from the end of the substrate processing operation until the maintenance time has elapsed. This prevents mist or droplets in the atmosphere of the processing liquid remaining in the substrate processing unit from re-adhering to the substrate after the substrate processing operation. This makes it possible to improve the cleanliness of the substrate after the substrate processing operation is completed.

(2) The substrate processing unit further includes a processing chamber having an opening and accommodating a substrate holder and an opposing member, a shutter configured to transition between a closed state that blocks the opening of the processing chamber and an open state that opens the opening, and a shutter driver that transitions the shutter between the closed state and the open state, and the control unit may control the shutter driver so that the shutter is in the open state at the end of the substrate processing operation, and control the lift driver so that the opposing member is held at the second height position from the time the shutter is opened until the maintenance time has elapsed.

In this case, when the substrate processing operation is completed, the shutter is opened. This allows the transport holder to enter the processing chamber. With the above configuration, the opposing member is held at the second height position from the time the shutter is opened until the maintenance time has elapsed, preventing mist or droplets in the processing liquid atmosphere that has remained in the processing chamber between the time the shutter is opened and the time the transport holder enters from re-adhering to the substrate.

(3) The control unit may provide an end signal to the substrate transport unit indicating the end of the substrate processing operation, receive an entry start signal from the substrate transport unit indicating the start of entry of the transport holder into the processing chamber through the opening, and control the lift drive unit so that the opposing member starts to rise from the second height position to the first height position in response to the entry start signal.

In this case, after the substrate processing operation is completed, the opposing member begins to rise from the second height position to the first height position in response to the entry start signal. As a result, the opposing member is held at the second height position from the end of the substrate processing operation until the entry start signal is received. Therefore, even if the entry of the transport holding part of the substrate transport part into the processing chamber is delayed, mist or droplets in the atmosphere of the processing liquid remaining in the processing chamber are prevented from re-adhering to the substrate.

(4) The substrate holding unit is a rotating holding unit that rotates the substrate around a vertical axis, and the control unit may control the rotating holding unit so that the rotation of the substrate stops at the end of the substrate processing operation, and control the lifting drive unit so that the opposing member is held stationary at the second height position until a maintenance time has elapsed while the rotation of the substrate held by the rotating holding unit has stopped.

In this case, the substrate processing operation of the substrate processing section ends as the rotation of the substrate held by the rotating holder stops. In addition, since the opposing member is held at the second height position in a stationary state, no flow of the processing liquid atmosphere is formed within the substrate processing section. This prevents the flow of the processing liquid atmosphere from entering between the opposing member and the substrate. As a result, mist or droplets are prevented from re-adhering to the substrate.

(5) The substrate processing unit may further include an inert gas supply unit that supplies an inert gas to the substrate held by the substrate holding unit, and the inert gas supply unit may be configured to be selectable between a first state in which inert gas is supplied to the space between the substrate held by the substrate holding unit and the opposing member during the maintenance time, and a second state in which inert gas is not supplied to the space between the substrate held by the substrate holding unit and the opposing member during the maintenance time.

In this case, in the first state, the atmosphere between the substrate and the opposing member can be blown away. On the other hand, in the second state, the atmosphere between the substrate and the opposing member can be maintained in a static state. With the above configuration, the user can select the first state or the second state depending on the state of the atmosphere of the processing liquid in the substrate processing apparatus.

(6) The control unit may control the substrate processing operation according to a process recipe that includes multiple steps in sequence, and may determine the end of the substrate processing operation upon completion of the final step of the process recipe. In this case, the control unit may, with simple control, hold the opposing member at the second height position from the end of the substrate processing operation until the maintenance time has elapsed, without adding any special determination process.

(7) The control unit may be configured to be able to adjust the second height position. In this case, it is possible to adjust the second height position so that the transport holder can load and unload the substrate in the space between the opposing member held at the second height position and the substrate holder. This allows the substrate to be loaded and unloaded with the opposing member in the second position. As a result, the throughput of the substrate processing apparatus is improved.

(8) The substrate processing method according to the present invention includes the steps of performing a substrate processing operation using a processing liquid on a substrate held by a substrate holding unit in a substrate processing unit, holding an opposing member during the substrate processing operation at a first height position spaced above the substrate holding unit or at a second height position lower than the first height position, holding the opposing member at the second height position from the end of the substrate processing operation until a predetermined maintenance time has elapsed, and, after holding the opposing member at the second height position until the maintenance time has elapsed, raising the opposing member from the second height position to the first height position.

In this substrate processing method, the substrate processing operation is performed with the opposing member at the first height position or the second height position. The opposing member is held at the second height position until a predetermined holding time has elapsed from the time the substrate processing operation is completed. After the holding time has elapsed, the opposing member is raised from the second height position to the first height position. This allows the substrate to be removed by the substrate holder of the transport holder.

According to this method, the opposing surface of the opposing member faces the upper surface of the substrate from the end of the substrate processing operation until the maintenance time has elapsed. This prevents mist or droplets in the atmosphere of the processing liquid remaining in the substrate processing section from re-adhering to the substrate after the substrate processing operation. This makes it possible to improve the cleanliness of the substrate after the substrate processing operation is completed.

(9) The step of performing a substrate processing operation includes performing a substrate processing operation using a processing liquid on a substrate held by a substrate holder in the processing chamber while closing an opening of the processing chamber of the substrate processing unit with a shutter, and opening the opening of the processing chamber by opening the shutter at the end of the substrate processing operation, and the step of holding the opposing member at the second height position may include holding the opposing member at the second height position from the time the shutter is opened until the maintenance time has elapsed.

In this case, when the substrate processing operation is completed, the shutter is opened. This allows the transport holder to enter the processing chamber. The above method holds the opposing member at the second height position from the time the shutter is opened until the maintenance time has elapsed, preventing mist or droplets in the processing liquid atmosphere that has remained in the processing chamber between the time the shutter is opened and the time the transport holder enters from re-adhering to the substrate.

(10) The substrate processing method may further include a step of giving an end signal indicating the end of the substrate processing operation to the substrate transport unit at the end of the substrate processing operation, and a step of receiving an entry start signal indicating the start of entry of the transport holder of the substrate transport unit into the processing chamber through the opening from the substrate transport unit, and the step of raising the opposing member may include starting the raising of the opposing member from the second height position to the first height position in response to the entry start signal.

In this case, after the substrate processing operation is completed, the opposing member begins to rise from the second height position to the first height position in response to the entry start signal. As a result, the opposing member is held at the second height position from the end of the substrate processing operation until the entry start signal is received. Therefore, even if the entry of the transport holding part of the substrate transport part into the processing chamber is delayed, mist or droplets in the atmosphere of the processing liquid remaining in the processing chamber are prevented from re-adhering to the substrate.

(11) The substrate processing method may further include a step of stopping the rotation of the substrate held by the rotating holder at the end of the substrate processing operation, and the step of holding the opposing member at the second height position may include holding the opposing member at the second height position until a maintenance time has elapsed while the rotation of the substrate held by the rotating holder is stopped.

In this case, the substrate processing operation of the substrate processing section ends as the rotation of the substrate held by the rotating holder stops. In addition, since the opposing member is held at the second height position in a stationary state, no flow of the processing liquid atmosphere is formed within the substrate processing section. This prevents the flow of the processing liquid atmosphere from entering between the opposing member and the substrate. As a result, mist or droplets are prevented from re-adhering to the substrate.

(12) The substrate processing method may further include a step of accepting a selection between a first state in which an inert gas is supplied to a space between the substrate held by the substrate holding unit and the opposing member during the maintenance time, and a second state in which an inert gas is not supplied to a space between the substrate held by the substrate holding unit and the opposing member during the maintenance time.

In this case, in the first state, the atmosphere between the substrate and the opposing member can be blown away. On the other hand, in the second state, the atmosphere between the substrate and the opposing member can be maintained in a static state. With the above method, the user can select the first state or the second state depending on the state of the atmosphere of the processing liquid in the substrate processing apparatus.

(13) The substrate processing method may further include a step of determining the end of the substrate processing operation based on the end of a final process of a processing recipe that includes multiple processes in sequence. In this case, the opposing member is held at the second height position until the maintenance time has elapsed from the end of the substrate processing operation by simple control without adding any special determination process.

(14) The substrate processing method may further include a step of adjusting the second height position of the opposing member. In this case, it is possible to adjust the second height position so that the transport holder can load and unload the substrate in the space between the opposing member held at the second height position and the substrate holder. This makes it possible to load and unload the substrate while the opposing member is in the second position. As a result, the throughput of the substrate processing apparatus is improved.

The present invention makes it possible to improve the cleanliness of the substrate after the substrate processing operation is completed.

1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus according to an embodiment of the present invention; 2 is a schematic cross-sectional view showing an example of the configuration of the substrate processing section of FIG. 1 . FIG. 2 is a block diagram showing a configuration of a control unit in FIG. 1 . 3 is a flowchart showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 . 3A to 3C are schematic cross-sectional views showing an example of the operation of the substrate processing section of FIG. 2 .

The substrate processing apparatus and substrate processing method according to the embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

In this embodiment, the processing liquid may be a mixture of sulfuric acid and hydrogen peroxide (SPM), a mixture of ammonia water and hydrogen peroxide (SC1), a mixture of hydrochloric acid and hydrogen peroxide (SC2), dilute hydrofluoric acid (DHF), organic alkali (e.g., tetramethylammonium hydroxide (TMAH)), or buffered hydrofluoric acid (BHF). The rinsing liquid may be, for example, pure water (deionized water), carbonated water, ozone water, magnetic water, functional water (e.g., ultra-diluted ammonia water (1 ppm to 100 ppm), ultra-diluted hydrochloric acid (1 ppm to 100 ppm), reduced water (hydrogen water), or the like), ionized water, or an organic solvent such as IPA (isopropyl alcohol).

(1) Configuration of the Substrate Processing Apparatus Fig. 1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus according to the present embodiment. As shown in Fig. 1, the substrate processing apparatus 100 includes an indexer block ID and a processing block PR. The indexer block ID includes a substrate transport unit (substrate transport robot) IR and a carrier platform CP. A carrier CC that stores a plurality of substrates W in multiple stages is mounted on the carrier platform CP.

The processing block PR includes substrate processing units 1a, 1b, 1c, 1d and a substrate transport unit (substrate transport robot) 2. The substrate processing units 1a, 1b, 1c, 1d are arranged in four directions with the substrate transport unit 2 at the center. The substrate processing units 1a, 1b, 1c, 1d include processing chambers CHa, CHb, CHc, CHd. Inside the processing chambers CHa, CHb, CHc, CHd, a processing liquid is used to remove, rinse, and dry the resist film on the substrate W. In this embodiment, the substrate processing operation includes removing, rinsing, and drying the resist film on the substrate W. Details of the substrate processing operation will be described later.

The processing chambers CHa, CHb, CHc, and CHd have an opening OP (see FIG. 2) on the surface facing the substrate transport unit 2. The shutters SHa, SHb, SHc, and SHd are configured to be able to switch between a state in which the opening OP is closed and a state in which it is open. The substrate transport unit 2 has a transport holder (hand) H that holds and transports the substrate W, and a transport driver 2a (see FIG. 3). The transport holder H transports the substrate W into and out of the substrate processing units 1a, 1b, 1c, and 1d. Details of the substrate W transport operation of the transport holder H will be described later.

A carrier CC containing a substrate W having a resist film is placed on at least one carrier placement part CP of the indexer block ID. The substrate transport part IR transports the substrate W having a resist film from the carrier CC to the placement part PT.

The substrate transport unit 2 of the processing block PR transports the substrate W having a resist film from the placement unit PT to one of the processing chambers CHa, CHb, CHc, or CHd. This allows a substrate processing operation to be performed on the substrate W having the resist film. The substrate transport unit 2 then removes the substrate W after the substrate processing operation from one of the processing chambers CHa, CHb, CHc, or CHd and places it on the placement unit PT.

A carrier CC that contains a processed substrate W is placed on at least one carrier placement part CP of the indexer block ID. The substrate transport part IR transports the processed substrate W from the placement part PT to the carrier CC.

The control unit 110 controls the operation of the substrate processing units 1a, 1b, 1c, and 1d and the substrate transport unit 2. The configuration and operation of the control unit 110 will be described in detail later.

(2) Configuration of the Substrate Processing Unit 1a Fig. 2 is a schematic cross-sectional view showing an example of the configuration of the substrate processing unit 1a in Fig. 1. The configurations of the substrate processing units 1b, 1c, and 1d are the same as that of the substrate processing unit 1a. The substrate processing unit 1a includes a processing chamber CHa, a spin chuck (rotary holding unit) 10, a nozzle driving unit 20, a blocking member 30, and a splash guard 40. The spin chuck 10, the nozzle driving unit 20, the processing liquid supply nozzle 22, the blocking member 30, and the splash guard 40 are accommodated in the processing chamber CHa. The blocking member 30 is provided above the spin chuck 10. The splash guard 40 is provided so as to surround the spin chuck 10. The nozzle driving unit 20 is provided outside the splash guard 40.

The spin chuck 10 is composed of a spin base 11, multiple chuck pins 12, and a spin motor 13. The multiple chuck pins 12 are provided at equal intervals on the periphery of the upper surface of the spin base 11. The outer peripheral edge of the substrate W is held by the multiple chuck pins 12. As a result, the substrate W is held on the spin base 11 in a horizontal position. The spin base 11 is configured to be rotatable around a vertical axis by the spin motor 13. As a result, the substrate W is rotatably held on the spin chuck 10.

The nozzle drive unit 20 includes an arm 21, a processing liquid supply unit 23, and a motor 24. A flow path is formed in the arm 21. A processing liquid supply nozzle 22 is provided at one end of the flow path in the arm 21. The processing liquid supply unit 23 is connected to the other end of the flow path in the arm 21. As a result, processing liquid is supplied from the processing liquid supply nozzle 22 to the upper surface of the substrate W held by the spin chuck 10. The arm 21 is attached to the motor 24. The arm 21 is rotated around a vertical axis by the motor 24. As a result, the processing liquid supply nozzle 22 becomes movable between a position above the center of the substrate W (hereinafter referred to as the processing liquid supply position) and a position outside the spin chuck 10 (hereinafter referred to as the retracted position). In this embodiment, the substrate processing section 1a is provided with one nozzle driving section 20 and one processing liquid supply nozzle 22, but if, for example, multiple processes using multiple chemical liquids are performed on the substrate W, multiple nozzle driving sections 20 and processing liquid supply nozzles 22 may be provided.

The blocking member 30 is composed of a disk-shaped blocking plate 31, a rotating shaft 32, and a support arm 33. The blocking plate 31 has an opposing surface 31a that faces the substrate W held by the spin chuck 10. An outlet 31b is formed in the center of the opposing surface 31a. A substantially cylindrical rotating shaft 32 that extends vertically is provided on the upper surface of the blocking plate 31. The rotating shaft 32 is supported by the support arm 33 so that the blocking plate 31 is held above the substrate W held by the spin chuck 10. The rotating shaft 32 is connected to a blocking plate rotation drive unit 35. This allows the blocking plate 31 to rotate around a vertical axis above the substrate W held by the spin chuck 10.

The support arm 33 is connected to the shield plate lifting drive unit 36. This allows the shield plate 31 to move up and down between a first height position and a second height position. The first height position is a position higher than the processing liquid supply nozzle 22 at the processing liquid supply position. The second height position is a position lower than the first height position and closer to the top surface of the substrate W held by the spin chuck 10. The second height position is 5 mm or less, and preferably 0.3 mm or more and 2.5 mm or less.

A discharge flow path 32a that communicates with the discharge port 31b is formed inside the rotating shaft 32. The discharge flow path 32a is connected to a rinsing liquid supply unit 37 and an inert gas supply unit 38. As a result, the rinsing liquid and the inert gas are supplied from the discharge port 31b toward the upper surface of the substrate W held by the spin chuck 10.

The splash guard 40 includes a first guard 41A, a second guard 41B, a first cup 42A, a second cup 42B, and a peripheral wall member 43. The first guard 41A, the second guard 41B, and the peripheral wall member 43 each have a cylindrical shape. The second cup 42A is formed integrally with the first guard 41A. The first guard 41A and the second guard 41B are configured to be able to move up and down in the vertical direction. The peripheral wall member 43 is configured to surround the first guard 41A, the second guard 41B, the first cup 42A, and the second cup 42B.

During substrate processing operations, the first guard 41A and the second guard 41B are raised to a height that surrounds the substrate W held by the spin chuck 10. The first guard 41A and the second guard 41B catch droplets scattered from the substrate W held by the spin chuck 10. The droplets caught by the first guard 41A and the second guard 41B are guided downward. The first cup 42A catches the droplets guided downward by the first guard 41A. The second cup 42B catches the droplets guided downward by the second guard 41B.

The droplets received by the first cup 42A and the second cup 42B are collected by a collection section (not shown). The inside of the splash guard 40 is evacuated by an exhaust section (not shown). This allows the mist of the processing liquid scattered from the substrate W to be collected.

When the substrate W is loaded before the substrate processing operation and when the substrate W is unloaded after the substrate processing operation, the first guard 41A and the second guard 41B are lowered to a position below the spin base 11 of the spin chuck 10.

The shutter SHa of the processing chamber CHa is configured to be movable up and down by the shutter drive unit Sd. This allows the shutter SHa to transition between a state in which the opening OP is closed and a state in which the opening OP is open.

(3) Configuration and operation of control unit 110 Fig. 3 is a block diagram showing the configuration of the control unit 110 in Fig. 1. The control unit 110 includes a transport control unit 111, a cleaning processing storage unit 112, and a processing operation control unit 113. The control unit 110 is composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The CPU executes a computer program stored in a storage medium such as the ROM or the storage device, thereby realizing the functions of each component of the control unit 110. Note that a part or all of the configuration of the control unit 110 may be realized by hardware such as an electronic circuit.

The substrate transport unit 2 in FIG. 1 includes the transport driver 2a in FIG. 3. The transport controller 111 controls the transport driver 2a so that the transport holder H in FIG. 1 transports the substrate W to and from the substrate processing units 1a, 1b, 1c, and 1d. The cleaning process memory 112 stores a process recipe including a plurality of steps in sequence. The process operation controller 113 controls the shutter driver Sd, the nozzle driver 20, the processing liquid supply unit 23, the rinsing liquid supply unit 37, the inert gas supply unit 38, the shield plate rotation driver 35, the shield plate lift driver 36, and the spin chuck 10 according to the process recipe stored in the cleaning process memory 112. This allows the substrate processing operation to be performed. In addition, the process operation controller 113 controls the shield plate 31 to be held, which will be described later. In the holding operation, the shield plate 31 is held at a second height position. The process operation controller 113 is configured to be able to adjust the second height position based on the user's operation or a control program.

When the substrate processing operation is completed, the processing operation control unit 113 sends a processing operation end signal PE to the transport control unit 111. The transport control unit 111 sends an entry start signal ES to the transport control unit 111, which indicates that the transport holder H of the substrate transport unit 2 has started to enter the processing chamber CHa (CHb, CHb, CHd) of the substrate processing unit 1a (1b, 1c, 1d).

(4) Example of Operation of Substrate Processing Unit 1a Fig. 4 is a flow chart showing an example of the operation of the substrate processing unit 1a of Fig. 2. Figs. 5 to 10 are schematic cross-sectional views showing an example of the operation of the substrate processing unit 1a of Fig. 2. The operations of the substrate processing units 1b, 1c, and 1d are similar to the operation of the substrate processing unit 1a. In this example, a resist stripping liquid (e.g., SPM) is used as the processing liquid.

As shown in FIG. 4, first, the processing operation control unit 113 starts the substrate processing operation (step S1). In this case, the processing operation control unit 113 controls each unit according to the processing recipe stored in the cleaning processing memory unit 112.

Specifically, the shutter SHa is opened by the shutter driver Sd in Fig. 2. The transport holder H of the substrate transport unit 2 in Fig. 1 enters the processing chamber CHa through the opening OP and loads the substrate W onto the spin chuck 10. The spin chuck 10 holds the substrate W by a plurality of chuck pins 12. In this example, a resist film is formed on the substrate W.

After the transport holder H leaves the processing chamber CHa, as shown in FIG. 5, the shutter SHa is closed by the shutter driver Sd of FIG. 2. In addition, the first guard 41A and the second guard 41B of the splash guard 40 are raised. The blocking plate 31 is at the first height position. In this state, the motor 24 of the nozzle driver 20 moves the processing liquid supply nozzle 22 from the retracted position to the processing liquid supply position. In addition, the spin motor 13 rotates the spin base 11. This causes the substrate W to rotate around a vertical axis.

In this state, the processing liquid supply unit 23 supplies resist stripping liquid as processing liquid from the processing liquid supply nozzle 22 to the upper surface of the rotating substrate W, as indicated by the dotted arrow p. This removes the resist film on the substrate W. In this case, the atmosphere of the processing liquid remains in the processing chamber CHa.

After that, as shown in FIG. 6, a rinsing process is performed. In the rinsing process, the motor 24 of the nozzle drive unit 20 moves the processing liquid supply nozzle 22 from the processing liquid supply position to the retracted position. Also, the shield plate lift drive unit 36 lowers the shield plate 31 from the first height position to the second height position. In this state, the shield plate rotation drive unit 35 rotates the shield plate 31 around a vertical axis. At this time, the rinsing liquid supply unit 37 supplies rinsing liquid from the outlet 31b of the shield plate 31 to the upper surface of the rotating substrate W, as indicated by the dotted arrow r. This rinses the upper surface of the substrate W.

Next, as shown in FIG. 7, a drying process is performed. In the drying process, while the spin base 11 and the shield plate 31 are rotating, the inert gas supply unit 38 supplies an inert gas to the upper surface of the rotating substrate W from the discharge port 31b of the shield plate 31 as shown by the dotted arrow g by the inert gas supply unit 38. This dries the upper surface of the substrate W. Then, the rotation of the shield plate 31 by the shield plate rotation drive unit 35 is stopped, and the rotation of the spin base 11 by the spin motor 13 is stopped. In addition, the substrate W is released from the holding by the multiple chuck pins 12 of the spin chuck 10. Furthermore, the first guard 41A and the second guard 41B of the splash guard 40 are lowered. At this point, all the steps (substrate processing operations) of the processing recipe stored in the cleaning processing memory unit 112 are completed. The processing operation control unit 113 determines the end of the substrate processing operation by the end of the final step of the processing recipe.

As shown in FIG. 4, the processing operation control unit 113 determines whether the substrate processing operation has ended (step S2). In this case, the processing operation control unit 113 determines that the substrate processing operation has ended when the final step of the processing recipe has ended. If the substrate processing operation has not ended, the processing operation control unit 113 repeats the determination of step S2.

When the substrate processing operation is completed, the processing operation control unit 113 sends a processing operation end signal PE to the transport control unit 111 (step S3).

Further, as shown in FIG. 4, the processing operation control unit 113 controls the shutter drive unit Sd to open the shutter SHa (step S4). The processing operation control unit 113 measures the elapsed time from the end of the substrate processing operation. At this time, as shown in FIG. 8, the shield plate 31 is held at the second height position. Also, an inert gas is supplied to the upper surface of the substrate W by the inert gas supply unit 38.

The processing operation control unit 113 judges whether the measured time has passed a predetermined maintenance time (step S5). The maintenance time is, for example, 5 to 1800 seconds. If the measured time has not passed the predetermined maintenance time, the processing operation control unit 113 repeats the judgment of step S5. At this time, the transport holder H is outside the processing chamber CHa. When the transport holder H is able to enter the processing chamber CHa, the transport control unit 111 gives an entry start signal ES to the processing operation control unit 113.

When the time measured in step S5 has elapsed the predetermined maintenance time, the processing operation control unit 113 determines whether or not an entry start signal ES has been received from the transport control unit 111 (step S6). If the processing operation control unit 113 has not received the entry start signal ES, it repeats the determination in step S6.

As shown in FIG. 4, when the processing operation control unit 113 receives the entry start signal ES, the processing operation control unit 113 stops the supply of inert gas to the upper surface of the substrate W by the inert gas supply unit 38 (step S7). Steps S3 to S7 are the holding operation of the shield plate 31. When the processing operation control unit 113 receives the entry start signal ES, as shown in FIG. 9, the transport holder H enters the processing chamber CHa through the opening OP. Furthermore, as shown in FIG. 4, the processing operation control unit 113 raises the shield plate 31 from the second height position to the first height position by the shield plate lift drive unit 36 (step S8). Note that the entry of the transport holder H into the processing chamber CHa and the lift of the shield plate 31 may be performed simultaneously, or the transport holder H may enter after the lift of the shield plate 31. In this state, as shown in FIG. 10, the transport holder H carries out the substrate W on the spin chuck 10.

(5) Effects In the substrate processing apparatus 100 of the present embodiment, the facing surface 31a of the blocking plate 31 faces closely to the upper surface of the substrate W from the end of the substrate processing operation until the maintenance time has elapsed. This prevents mist or droplets in the atmosphere of the processing liquid remaining in the processing chamber CHa from re-adhering to the substrate W after the substrate processing operation. This makes it possible to improve the cleanliness of the substrate W after the substrate processing operation is completed.

In addition, in the substrate processing apparatus 100 of this embodiment, when the substrate processing operation is completed, the shutter SHa is opened. This allows the transport holder H to enter the processing chamber CHa. In addition, the shield plate 31 is held at the second height position from the time the shutter SHa is opened until the maintenance time has elapsed, so that mist or droplets in the atmosphere of the processing liquid that has remained in the processing chamber CHa between the time the shutter SHa is opened and the time the transport holder H enters are prevented from re-adhering to the substrate.

Furthermore, after the substrate processing operation is completed, the blocking plate 31 begins to rise from the second height position to the first height position in response to the entry start signal ES. As a result, the blocking plate 31 is held at the second height position from the end of the substrate processing operation until the entry start signal ES is received. Therefore, even if the entry of the transport holding part H of the substrate transport part 2 into the processing chamber CHa is delayed, mist or droplets in the atmosphere of the processing liquid remaining in the processing chamber CHa are prevented from re-adhering to the substrate W.

The substrate processing operation of the substrate processing unit 1a is terminated as the rotation of the substrate W held by the spin chuck 10 stops. Furthermore, since the blocking plate 31 is held stationary at the second height position, no flow of the processing liquid atmosphere is formed in the processing chamber CHa. This prevents the flow of the processing liquid atmosphere from entering between the blocking plate 31 and the substrate W. As a result, mist or droplets are prevented from re-adhering to the substrate.

Furthermore, the processing operation control unit 113 determines the end of the substrate processing operation when the final step of the processing recipe is completed. This allows the blocking plate 31 to be held at the second height position from the end of the substrate processing operation until the maintenance time has elapsed with simple control, without the need to add any special determination process.

In addition, the second height position can be adjusted so that the transport holder H can load and unload the substrate W in the space between the blocking plate 31 held at the second height position and the spin base 11. This allows the substrate W to be loaded and unloaded with the blocking plate 31 in the second position. As a result, the throughput of the substrate processing apparatus 100 is improved.

(6) Other embodiments (a) In the above embodiment, the end of the substrate processing operation is determined by the end of the final step of the processing recipe, but the method of determining the end of the substrate processing operation is not limited to this. For example, the end of the substrate processing operation may be determined based on the transition of the shutter SHa to the open state, or the end of the rotation of the spin base 11 or the rotation of the shield plate 31 at the end of the drying step of the substrate W.

(b) In the above embodiment, when the processing operation control unit 113 receives the entry start signal ES after the maintenance time has elapsed from the end of the substrate processing operation, the blocking plate 31 is raised from the second height position to the first height position, but the present invention is not limited to this. For example, the blocking plate 31 may be raised from the second height position to the first height position when the maintenance time has elapsed from the end of the substrate processing operation.

(c) In the above embodiment, the inert gas supply unit 38 supplies inert gas to the upper surface of the substrate W until the maintenance time has elapsed from the end of the substrate processing operation, but the present invention is not limited to this. The inert gas supply unit 38 may stop supplying inert gas to the upper surface of the substrate W before the maintenance time has elapsed from the end of the substrate processing operation, and the inert gas supply unit 38 may not supply inert gas to the upper surface of the substrate W until the maintenance time has elapsed from the end of the substrate processing operation.

(d) The processing operation control unit 113 may be configured to be selectable between a first state in which the inert gas supply unit 38 supplies inert gas to the upper surface of the substrate W from the end of the substrate processing operation until the maintenance time has elapsed, and a second state in which the inert gas supply unit 38 does not supply inert gas to the upper surface of the substrate W from the end of the substrate processing operation until the maintenance time has elapsed.

In this case, in the first state, the atmosphere between the substrate W and the blocking plate 31 can be blown away. On the other hand, in the second state, the atmosphere between the substrate W and the blocking plate 31 can be maintained in a static state. With the above configuration, the user can select the first state or the second state depending on the state of the atmosphere of the processing liquid in the substrate processing units 1a to 1d.

(e) In the above embodiment, the second height position of the blocking plate 31 is adjustable, but the second height position of the blocking plate 31 may be fixed.

(f) In the above embodiment, a resist stripping liquid is supplied to the substrate W as the processing liquid, but the processing liquid is not limited to a resist stripping liquid. For example, DHF may be used as the processing liquid. In this case, if mist or droplets of DHF reattach to the substrate, unintended etching of the substrate W may proceed. According to the substrate processing unit 1a to 1d of the above embodiment, mist or droplets in the DHF atmosphere remaining in the processing chamber CHa are prevented from reattaching to the substrate W. As a result, unintended etching of the substrate W is prevented from proceeding.

Alternatively, TMAH may be used as the processing liquid. When high-temperature TMAH of 60 to 70°C is used, mist or droplets in the TMAH atmosphere may be dispersed within processing chamber CHa. If the TMAH mist or droplets reattach to the substrate, unintended etching of the substrate W may occur. According to the substrate processing unit 1a to 1d of the above embodiment, the mist or droplets in the TMAH atmosphere dispersed in processing chamber CHa are prevented from reattaching to the substrate W. As a result, unintended etching of the substrate W is prevented.

(7) Correspondence between each component of the claims and each part of the embodiment The following describes an example of the correspondence between each component of the claims and each element of the embodiment. In the above embodiment, the spin chuck 10 is an example of a substrate holding part, the shield plate 31 is an example of an opposing member, the shield plate lifting drive unit 36 is an example of a lifting drive unit, and the processing operation end signal PE is an example of an end signal indicating the end of the substrate processing operation. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

1a, 1b, 1c, 1d...substrate processing section, 2...substrate transport section, 2a...transport drive section, 10...spin chuck, 11...spin base, 12...chuck pin, 13...spin motor, 20...nozzle drive section, 21...arm, 22...processing liquid supply nozzle, 23...processing liquid supply section, 24...motor, 30...blocking member, 31...blocking plate, 31a...opposing surface, 31b...discharge port, 32...rotation shaft, 32a...discharge flow path, 33...support arm, 35...blocking plate rotation drive section, 36...blocking plate lift drive section, 37...rinsing liquid supply section, 38...inert gas supply section, 40...s Splash guard, 41A...first guard, 42A...second guard, 41B...first cup, 42B...second cup, 43...peripheral wall member, 100...substrate processing apparatus, 110...control unit, 111...transport control unit, 112...cleaning processing memory unit, 113...processing operation control unit, CC...carrier, CHa, CHb, CHc, CHd...processing chamber, CP...carrier placement unit, H...transport holding unit, IR...substrate transfer unit, OP...opening, PR...processing block, PT...placement unit, SHa, SHb, SHc, SHd...shutter, Sd...shutter drive unit, W...substrate

Claims (12)

a substrate processing section for performing a substrate processing operation using a processing liquid on a substrate;
a substrate transport unit having a transport holder that holds a substrate and transports the substrate into and out of the substrate processing unit;
a control unit that controls the substrate processing unit and the substrate transport unit,
The substrate processing section includes:
a substrate holder that holds the substrate in a horizontal position;
an opposing member having an opposing surface facing the substrate held by the substrate holding portion, the opposing member being configured to be movable between a first height position spaced above the substrate holding portion and a second height position lower than the first height position;
a lifting drive unit that lifts and lowers the opposing member,
the control unit controls the lifting drive unit so that the opposing member is held at the second height position until a predetermined maintenance time has elapsed from a time point at which the substrate processing operation is ended, and then the opposing member is raised from the second height position to the first height position;
The control unit is configured to be able to adjust the second height position . a substrate processing section for performing a substrate processing operation using a processing liquid on a substrate;
a substrate transport unit having a transport holder that holds a substrate and transports the substrate into and out of the substrate processing unit;
a control unit that controls the substrate processing unit and the substrate transport unit,
The substrate processing section includes:
a substrate holder that holds the substrate in a horizontal position;
an opposing member having an opposing surface facing the substrate held by the substrate holding portion, the opposing member being configured to be movable between a first height position spaced above the substrate holding portion and a second height position lower than the first height position;
a lifting drive unit that lifts and lowers the opposing member,
the control unit controls the lifting drive unit so that the opposing member is held at the second height position until a predetermined maintenance time has elapsed from a time point at which the substrate processing operation is ended, and then the opposing member is raised from the second height position to the first height position;
The substrate processing section includes:
a processing chamber having an opening and housing the substrate holder and the opposing member;
a shutter configured to transition between a closed state that closes the opening of the processing chamber and an open state that opens the opening;
a shutter driver that transitions the shutter between the closed state and the open state,
The control unit controls the shutter drive unit so that the shutter is in the open state at the end of the substrate processing operation, and controls the lift drive unit so that the opposing member is maintained at the second height position from the time the shutter is opened until the maintenance time has elapsed. The substrate processing apparatus of claim 2, wherein the control unit provides the substrate transport unit with an end signal indicating the end of the substrate processing operation, receives from the substrate transport unit an entry start signal indicating the start of entry of the transport holder into the processing chamber through the opening, and controls the lift drive unit to start raising the opposing member from the second height position to the first height position in response to the entry start signal. the substrate holder is a rotary holder that rotates the substrate around a vertical axis,
the control unit controls the rotation holding unit to stop rotation of the substrate at a time point when the substrate processing operation is completed;
The substrate processing apparatus according to any one of claims 1 to 3, wherein the lifting and lowering drive unit is controlled so that the opposing member is held stationary at the second height position until the maintenance time has elapsed with the rotation of the substrate held by the rotating holding unit stopped. the substrate processing unit further includes an inert gas supply unit that supplies an inert gas to the substrate held by the substrate holding unit,
The substrate processing apparatus of any one of claims 1 to 4, wherein the inert gas supply unit is configured to be selectable between a first state in which an inert gas is supplied to a space between the substrate held by the substrate holding unit and the opposing member during the maintenance time, and a second state in which an inert gas is not supplied to the space between the substrate held by the substrate holding unit and the opposing member during the maintenance time. The substrate processing apparatus according to any one of claims 1 to 5, wherein the control unit controls the substrate processing operation according to a processing recipe including multiple steps in sequence, and determines the end of the substrate processing operation upon completion of a final step of the processing recipe. performing a substrate processing operation using a processing liquid on a substrate held by a substrate holding unit in a substrate processing unit;
holding an opposing member at a first height position spaced above the substrate holding part or at a second height position lower than the first height position during the substrate processing operation;
maintaining the opposing member at the second height position for a predetermined period of time from the end of the substrate processing operation;
and after the opposing member is held at the second height position until the maintaining time has elapsed , raising the opposing member from the second height position to the first height position,
The substrate processing method further comprising the step of adjusting the second height position of the opposing member . performing a substrate processing operation using a processing liquid on a substrate held by a substrate holding unit in a substrate processing unit;
holding an opposing member at a first height position spaced above the substrate holding part or at a second height position lower than the first height position during the substrate processing operation;
maintaining the opposing member at the second height position for a predetermined period of time from the end of the substrate processing operation;
and after the opposing member is held at the second height position until the maintaining time has elapsed, raising the opposing member from the second height position to the first height position,
The step of performing the substrate processing operation includes:
performing the substrate processing operation using a processing liquid on a substrate held by the substrate holder in the processing chamber while closing an opening of the processing chamber of the substrate processing unit with a shutter, and opening the shutter at the end of the substrate processing operation to open the opening of the processing chamber;
The step of holding the opposing member at the second height position includes:
the opposing member being held at the second height position from the time the shutter is opened until the maintenance time has elapsed . providing a completion signal indicating completion of the substrate processing operation to a substrate transport section at the completion of the substrate processing operation;
receiving an entry start signal from the substrate transport indicating an initiation of entry of a transport holder of the substrate transport into the processing chamber through the opening;
9. The substrate processing method according to claim 8 , wherein the step of raising the opposing member includes starting to raise the opposing member from the second height position to the first height position in response to the approach start signal. The method further includes a step of stopping the rotation of the substrate held by the rotation holder at a time point when the substrate processing operation is completed,
The step of holding the opposing member at the second height position includes:
The substrate processing method according to claim 7 , further comprising holding the opposing member at the second height position until the maintenance time has elapsed in a state in which rotation of the substrate held by the rotating holder is stopped. The substrate processing method according to any one of claims 7 to 10, further comprising a step of accepting a selection between a first state in which an inert gas is supplied to a space between the substrate held by the substrate holding part and the opposing member during the maintenance time, and a second state in which an inert gas is not supplied to the space between the substrate held by the substrate holding part and the opposing member during the maintenance time. The substrate processing method according to claim 7 , further comprising the step of determining completion of the substrate processing operation based on completion of a final process of a processing recipe including a plurality of processes in sequence.

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