JP7525850B2 - SiOx layer-equipped substrate - Google Patents

Description

The present invention relates to members of various shapes, such as roll, sheet, and plate shapes, and more specifically to a member (hereinafter referred to as an "SiO _X layer-containing substrate") having a layer containing amorphous SiO _X formed by a compound of silicon and oxygen on the surface layer of _a substrate.

Conventionally, rollers have been used in a variety of situations, such as film production lines, semiconductor production lines, printing machines, and office equipment. Rollers used include rubber rolls, metal rolls, resin rolls, and plated rolls (for example, Patent Document 1).

JP 2015-113919 A

However, components such as siloxane can seep out from inside the rubber base material of the rubber roll and onto the surface. The seeped components can adhere to the film or printed circuit board, causing insulation breakdown.

In addition, metal rolls can cause problems due to metal ions eluting from inside the metal substrate (for example, when manufacturing positive plates for lithium-ion secondary batteries, metal ions eluted during application of active material to a current collector can adhere to the current collector, reducing the performance of the battery). Resin rolls can also cause components such as dispersants to seep out from inside the resin substrate, causing the above problems.

In addition to metal rolls, resin rolls, and rubber rolls, there are also rolls that have a plated layer on the surface through plating treatment (plated rolls). However, even in the case of plated rolls, it is not possible to prevent components seeping out from inside the rubber or resin material or metal ions eluting from the metal (hereinafter, these are referred to as "exposed components", and the seeping out of components from rubber or resin and the elution of metal ions from metal are referred to as "exposure"), and similar problems can occur.

The above problem is not limited to rolls, but can occur with any shape of material, including sheet-like, plate-like, or belt-like materials.

The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a substrate having a _SiOX layer capable of preventing various problems caused by the above-mentioned exposed components.

The SiO _X layer-equipped substrate of the present invention is a substrate containing an exposed component, and is provided with a SiO _X layer on the surface layer of the substrate. The substrate can be made of rubber, metal, or resin. The SiO _X layer-equipped substrate of the present invention can also be provided with a plating layer on the outside of the substrate, and a SiO _X layer on the surface layer of the plating layer. The substrate can be in the form of a roll.

The SiO _X layer-equipped substrate of the present invention has a SiO _X layer on the surface of the substrate, and therefore can suppress the seepage of components from inside the substrate and the elution of metal ions, thereby eliminating various problems caused by the seeped components and eluted metal ions.

FIG. 2A is a cross-sectional view showing an example of a substrate having a _SiOX layer according to the present invention, and FIG. 2B is an enlarged view of a portion Ib in FIG. FIG. 1 is a schematic diagram showing an example of an apparatus used for forming a SiO _X layer. 2A is a cross-sectional view showing another example of a substrate having a SiO _X layer according to the present invention; FIG. 2B is a cross-sectional view showing another example of a substrate having a SiO _X layer according to the present invention; FIG.

(Embodiment)
An embodiment of the SiO _X layer-equipped substrate of the present invention will be described with reference to the drawings. Here, the SiO _X layer-equipped substrate is a rubber roll. As an example, the SiO _X layer-equipped substrate shown in Figure 1 (a) and (b) has a SiO _X layer 2 on the surface of a rubber substrate 1.

The rubber base material 1 is the part that will be the base material of the rubber roll. For example, the rubber base material 1 can be made of general-purpose rubber such as ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBD), nitrile rubber (NBR), chloroprene rubber (CR), butyl rubber (IIR), urethane rubber (U), silicone rubber (Si), or fluororubber (F).

In this embodiment, the rubber substrate 1 is a hollow roll, and a core metal (hard tube) 3 is provided on the inside to prevent deformation of the rubber substrate 1. The hard tube 3 can be, for example, a metal pipe, a carbon steel pipe, or a stainless steel pipe.

As shown in Fig. 1(a) and (b), the rubber base material 1 and the hard tube 3 in this embodiment are mounted on the outside of the shaft material 5 via the bearing 4. In this case, it is preferable that the bearing 4 is provided via a metallic flange 6 embedded on both ends of the rubber base material 1. The rubber base material 1 may be a solid material. The rubber base material 1 may also be in a shape other than a roll, such as a cylindrical shape, a conical shape, a flat plate shape, a sheet shape, a spherical shape, a multi-faceted shape, a rod shape, or a belt shape.

The SiO _X layer 2 is a layer (amorphous silicon layer) containing non-crystalline SiO _X formed by the compound of silicon and oxygen, and typical examples include SiO and SiO _2. The SiO _X layer 2 is formed on the surface layer of the rubber substrate 1. The surface layer here means the inner side of the surface of the rubber substrate 1, but also includes the case where the SiO X layer 2 protrudes above the surface of the rubber substrate 1 (is formed on the surface as a film).

In this embodiment, the _SiOx layer 2 has a thickness of about 1 μm, but this thickness is an example, and the film thickness may be thicker or thinner than 1 μm. In either case, the _SiOx layer 2 bites into the surface of the rubber substrate 1, and the surface of the rubber substrate 1 is altered or modified.

The _SiOx layer 2 can be produced, for example, by using the apparatus shown in Fig. 2. In Fig. 2, 7 is a vacuum chamber, 8 is an RF high-frequency power source, 9 is an RF electrode, 10 is a high-voltage pulse power source, and 11 is a gas inlet. An ICP (Inductively Coupled Plasma) power source can also be used instead of the RF high-frequency power source 8.

The rubber substrate 1 is placed in the vacuum chamber 7, and the inside of the vacuum chamber 7 is evacuated. Next, a silicon-containing raw material gas (e.g., HMDSO, HMDS, TMS, etc.) is injected into the vacuum chamber 7 from the gas inlet 11. When a high-frequency voltage is applied by the RF high-frequency power supply 8 while the raw material gas is injected into the vacuum chamber 7, plasma is generated. As a result, the raw material gas in the vacuum chamber 7 reacts, and the surface layer of the rubber substrate 1 is altered or modified, and a glassy SiO _X layer 2 is formed on the surface layer of the rubber substrate 1.

The HMDSO, HMDS, and TMS used as raw materials are not pure silicon (Si) gases but contain elements such as carbon (C) and hydrogen (H), etc. Therefore, the SiO _X structure of the present invention may contain carbon, hydrogen, etc.

When the source gas is supplied, helium (He) or argon (Ar) may be supplied at the same time to facilitate decomposition of the source gas. Also, oxygen (O ₂ ) may be supplied at the same time as the source gas to facilitate formation of SiO _X.

When the _SiOx layer 2 is formed using the apparatus of FIG. 2, the RF output can be set in the range of 50W to 3kW with 500W as the center.

Other Embodiments
In the above embodiment, the rubber base material 1 is mounted on the outside of the shaft material 5 via the bearing 4 as an example. However, as shown in FIG. 3( a ), the rubber base material 1 can also be mounted on the outside of a core material 12 made of various materials such as metal or resin.

When a hard core material 12 is used, as shown in FIG. 3(b), the core material 12 can be used as a base material and the _SiOx layer 2 can be formed directly on the surface thereof.

In the above embodiment, the rubber substrate 1 is in a roll shape, but the rubber substrate 1 can also be in a shape other than a roll, such as a cylindrical shape, a cone shape, a flat plate shape, a sheet shape, a sphere shape, a multi-sided shape, a rod shape, a belt shape, etc.

In the above embodiment, the substrate is a rubber substrate 1, but the substrate may be made of metal or resin. The substrate may also be a metal substrate, a resin substrate, or a substrate with a plated layer on the outside of a rubber substrate (plated substrate).

In the above embodiment, the SiO _X layer 2 is formed by injecting a silicon-containing source gas such as HMDSO, HMDS, or TMS into the vacuum chamber 7, but if the substrate itself contains silicon, the source gas does not need to be injected. In this case, oxygen (O ₂ ) is used as a source gas, and argon (Ar), helium (He), or nitrogen (N) is generated as an excitation gas, and the silicon in the substrate is reacted by using plasma, so that the SiO _X layer 2 can be formed on the surface layer of the substrate. When nitrogen is used as the excitation gas, the SiO _X structure contains nitrogen, but this does not cause any problems.

As in the above embodiment, the _SiOx layer 2 is formed on the surface layer of the substrate, thereby preventing the exposure of exposed components. As a result, problems such as deterioration of quality due to the exposed components (e.g., siloxane) adhering to the film can be eliminated, and various problems caused by the exposed components that have been a problem in the past can be eliminated.

Furthermore, in the case of a conventional rubber roll having a high coefficient of friction and adhesion, there was a problem that the target object would be wrinkled when a thin target object such as a film was processed. However, by forming the _SiOx layer 2 on the surface layer of the substrate as in the above embodiment, the slipperiness and peelability are improved, and such a problem is unlikely to occur.

In addition, as in the above embodiment, the _SiOx layer 2 is formed on the surface of the substrate, which improves heat resistance, wear resistance, and peelability, and therefore reduces wear on the surface of the substrate due to friction. Furthermore, the generation of wear powder due to wear is reduced, which makes it difficult for electronic components such as films and printed circuit boards that come into contact with the substrate to become dirty or damaged.

As in the _SiOX layer-equipped substrate of each of the above-mentioned embodiments, by forming a _SiOX layer 2 on the surface layer of a roll-shaped rubber substrate 1, it can be used as a guide roll, rolling roll, conveying roll, coating roll, dry laminating roll, platen roll, etc. for films, printed circuit boards, glass substrates, etc.

The substrate having a _SiOx layer on the surface of the rubber material of the present invention can be widely used as rollers used in various production lines such as film production lines and semiconductor production lines, as well as in various office equipment such as printers and multifunction machines, and as various other shaped components.

1 Rubber substrate 2 _SiOx layer (amorphous silicon layer)
3 Hard tube 4 Bearing 5 Shaft material 6 Flange 7 Vacuum chamber 8 RF high-frequency power source 9 RF electrode 10 High-voltage pulse power source 11 Gas inlet 12 Core material

Claims (1)

A metal substrate containing an exposed component,
A plating layer is provided on the outer side of the metal base material,
a SiOx layer is provided on a surface layer including an inner side of the surface of the plating layer, the _SiOx layer suppressing the release of metal ions from the metal base material and/or the release of metal ions from the plating layer ;
A substrate having a _SiOx layer.

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