JP7524441B2 - Mounting Equipment - Google Patents

Description

The present invention relates to a mounting device that mounts electronic components on a tape-shaped circuit board on which mounting areas for electronic components are arranged side by side.

The mounting device, also known as a die bonder or flip chip bonder, places electronic components on the mounting area of a tape-shaped circuit board (hereafter referred to as "tape") such as COF tape or TAB tape, and applies pressure and heat while clamping the mounting area and the electronic components. In this way, the mounting device electrically and mechanically connects the electronic components to the mounting area of the tape.

This mounting device has a bonding stage that makes surface contact with the underside of the tape, and a bonding head that holds an electronic component and places it on the tape. The bonding head and bonding stage are heated, and when the electronic component held by the bonding head is pressed against the tape, heat is transferred to the electronic component and the tape, bonding the electrodes of the electronic component to the wiring circuit pattern in the mounting area of the tape.

The tape expands when heated. For this reason, the mounting areas for electronic components (circuits in the mounting area) are uniformly made small in anticipation of the tape expanding when heated. In other words, the bonding head and bonding stage are required to transfer the same amount of heat to each mounting area, and the temperatures of the bonding head and bonding stage are required to be stable.

However, until a certain amount of time has passed since the mounting device started operating, the temperatures of the bonding head and bonding stage are unstable. That is, in the early stages of operation, heat transfers from the bonding head to the bonding stage, causing the temperature of the bonding head to drop. After a certain amount of time has passed, the thermal gradient between the bonding stage and the bonding head becomes gentler, the heat transfer from the bonding head to the bonding stage also decreases, and the temperature begins to stabilize.

In this way, when multiple electronic components are mounted in sequence, the temperature of the bonding head and bonding stage during initial mounting will be different from the temperature of the bonding head and bonding stage during mounting after a certain amount of time has passed. Therefore, during the initial mounting after starting operation, the tape does not stretch as desired, and mounting accuracy decreases.

Here, an aging operation has been proposed in which the bonding head is heated to an equilibrium temperature before the mounting device starts operating (see, for example, Patent Document 1). In Patent Document 1, the aging operation is a fake mounting operation. In the aging operation, in the absence of a semiconductor chip, the bonding head is moved toward and away from a substrate such as a lead frame on a heater rail, just like the mounting operation. As a result, heat transfer to the bonding head occurs during the aging operation, and the temperature of the bonding head stabilizes before this operation. Therefore, the temperature of the bonding head is stable from the initial mounting, and a decrease in the mounting accuracy of electronic components that are initially mounted is suppressed.

JP 2008-270359 A

Patent Document 1 is based on the premise that electronic components are placed on a substrate such as a lead frame. If the technology of Patent Document 1 were applied to a mounting device that mounts electronic components on a tape such as the COF tape described above, the same part of the tape would be exposed to heat for a long period of time during the aging operation, and the same part would repeatedly come into contact with the bonding head, which could damage the thin, flexible tape or the wiring circuit pattern formed on the tape.

One solution is to carry out the aging operation without placing the tape. However, after the aging operation is complete, it is not possible to move on to the actual mounting operation immediately, and the tape must be placed as an intervening step. If this is done, the temperatures of the bonding head and bonding stage may have changed from their stable temperatures by the time the actual mounting operation is started, and the aging operation may become ineffective.

The problem that this invention aims to solve is to provide a mounting device that can perform the main mounting operation while preventing damage to the tape and keeping the temperature stable.

In order to achieve the above object, the mounting device according to the present invention is a mounting device that mounts electronic components in mounting areas arranged side by side on a tape-shaped circuit board, and includes a transport path along which the tape-shaped circuit board is laid out, a tape running means that runs the tape-shaped circuit board on a transport path along the transport path in the main operation in which the mounting is performed, a bonding stage that can be placed on the transport path of the tape-shaped circuit board and supports the tape-shaped circuit board from below, a bonding head that presses and heats the electronic components against the mounting area of the tape-shaped circuit board supported by the bonding stage, and a heater that heats the bonding head or, in addition to the bonding head, the bonding stage, and As an aging operation prior to this main operation, the head and the bonding stage are moved to an off-tape position off the transport path of the tape-shaped circuit board, and are heated by the heater while repeatedly coming into contact or approaching and separating at the off-tape position, and the distance between the bonding head and the bonding stage when they are close to each other is a distance equivalent to the thickness of the electronic component and the tape, or a distance that is the same as the amount of thermal conduction when the electronic component and the tape are present, and the distance between the bonding head and the bonding stage when they are separated is further away than the distance between the bonding head and the bonding stage when they are close to each other.

A cleaner may be provided to clean the bonding head and the bonding stage at a cleaning position off the transport path of the tape-shaped circuit board, and the off-tape position may be set to the cleaning position.

A control unit may be provided to control the aging operation.

The control unit may execute the aging operation upon completion of the placement of the tape-shaped circuit board on the transport path.

The system may include a component supply unit that keeps the electronic components to be mounted on standby, and a pick-up head that receives the next electronic component to be mounted from the component supply unit and passes it to the bonding head, and the bonding head and the pick-up head may be configured to pass the electronic component at the off-tape position during this operation.

The heater may be provided on the bonding head, the bonding stage, or both.

The heater may be placed on the bonding stage during the aging operation.

The present invention makes it possible to perform the mounting operation while keeping the temperature stable and preventing damage to the tape-shaped circuit board.

FIG. 1 is a plan view showing a configuration of a mounting apparatus according to a first embodiment. 1 is a side view showing a configuration of a mounting apparatus according to a first embodiment. FIG. 4 is a schematic diagram showing the position of a heater and the configuration of a control unit. 4A to 4C are schematic diagrams showing a first process of the main operation of the mounting apparatus according to the first embodiment; 11A to 11C are schematic diagrams showing a second process of the main operation of the mounting apparatus according to the first embodiment. 13A and 13B are schematic diagrams showing a third process of the main operation of the mounting apparatus according to the first embodiment. 5 is a time chart showing the timing of raising and lowering the bonding head in the first embodiment. 4A to 4C are schematic diagrams showing a first process of the aging operation of the mounting apparatus according to the first embodiment; 11A to 11C are schematic diagrams showing a second process of the aging operation of the mounting apparatus according to the first embodiment. 5 is a graph comparing the timing of contact and separation between the bonding head and the bonding stage in a main operation and an aging operation according to the first embodiment. FIG. 1A is a time chart showing the timing of contact and separation between the bonding head and the bonding stage during aging operation, FIG. 1B is a graph showing temperature changes in the bonding head, and FIG. 1C is a graph showing temperature changes in the bonding stage, relating to the first embodiment. 5A to 5C are schematic diagrams illustrating a cleaning operation of the mounting apparatus according to the first embodiment. FIG. 11 is a side view showing a configuration of a mounting apparatus according to a second embodiment.

(First embodiment)
(overall structure)
An embodiment of a mounting apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a top view showing the configuration of the mounting apparatus 1. FIG. 2 is a side view showing the configuration of the mounting apparatus 1, and for convenience of explanation, a loader 42 and an unloader 43 described later are omitted. FIG. 3 is a block diagram showing the configuration of a control unit 8 provided in the mounting apparatus 1. The mounting apparatus 1 is also called a die bonder or flip bonder, and presses an electronic component 100 against a mounting area 301 of a tape-shaped circuit board 300 (hereinafter referred to as "tape 300"), and heats the mounting area 301 and the electronic component 100. As a result, the mounting apparatus 1 electrically and mechanically connects the electronic component 100 to the mounting area 301 of the tape 300.

The mounting method is, for example, the COF (Chip On Film) method. The tape 300 is a film made of polyimide or the like, and mounting areas 301 are arranged side by side at regular intervals along the length of the strip. A wiring circuit pattern is formed in the mounting areas 301. The wiring circuit pattern in the mounting areas 301 is formed uniformly small so that it will reach the desired size after stretching, in anticipation of the tape 300 stretching due to heating during mounting.

The electronic component 100 is directly connected to the wiring circuit pattern of the mounting area 301 by bump electrodes. This electronic component 100 is a component used in electronic circuits, and includes chips such as MEMS, semiconductor elements, resistors, and capacitors, and semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, and thyristors, as well as integrated circuits such as ICs and LSIs.

Such a mounting device 1 includes a transport path 41, a loader 42, and an unloader 43 as tape running means. The transport path 41, the loader 42, and the unloader 43 lay down and guide the tape 300 so that it passes through the mounting position 91. The transport path 41, the loader 42, and the unloader 43 also run the tape 300 intermittently so that each mounting area 301 stops at the mounting position 91. The mounting position 91 is the location where the mounting process is planned, and is a fixed position where the electronic component 100 and the tape 300 are planned to be electrically and mechanically connected.

The mounting device 1 also includes a component supply unit 5 and a pickup head 6 as a component supply means. The component supply unit 5 lines up and holds the electronic components 100 in standby. The pickup head 6 receives the electronic components 100 from the component supply unit 5 and transports them to an off-tape position 92. The off-tape position 92 is a position outside the transport path 41 and outside the transport path of the tape 300.

The mounting device 1 further includes a bonding head 2 and a bonding stage 3 as mounting means. The bonding stage 3 is configured to be positionable at the mounting position 91, and supports the underside of the tape 300 with the mounting area 301 stopped at the mounting position 3. The bonding head 2 picks up the electronic component 100 from the pickup head 6 at the off-tape position 92 and transfers it to the mounting position 91. Then, at the mounting position 91, the bonding head 2 presses the electronic component 100 against the mounting area 301 of the tape 300 supported by the bonding stage 3 and heats it.

The main use of the off-tape position 92 is for the transfer of electronic components 100 between the bonding head 2 and the pickup head 6. As described below, this off-tape position 92 also serves as a temperature stabilization position in the pre-processing operation for stabilizing the temperatures of the bonding head 2 and the bonding stage 3.

The mounting device 1 further includes a cleaner 7 that cleans the bonding head 2 and the bonding stage 3 at the off-tape position 92. That is, the off-tape position 92 also serves as a cleaning position where the cleaner 7 cleans the bonding head 2 and the bonding stage 3. As shown in FIG. 3, the mounting device 1 also includes a control unit 8 that controls each of these hardware elements.

(Tape running means)
The transport path 41 has a pair of rails 411 that guide the tape 300. The tape 300 runs intermittently while being guided by both rails 411. The running distance per pitch of the tape 300 matches the center-to-center distance between adjacent mounting areas 301. A loader 42 that pays out the tape 300 and an unloader 43 that winds up the tape 300 are installed on both ends of the transport path 41, and the tape 300 passes through the transport path 41 and is stretched between the loader 42 and the unloader 43.

(Implementation Means)
The bonding head 2 is provided so as to be movable between a mounting position 91 and an off-tape position 92. The bonding head 2 holds the electronic component 100 at the off-tape position 92, moves to the mounting position 91 and descends, heating the electronic component 100 while pressing it against the tape 300 directly below. At the mounting position 91, the bonding stage 3 rises and enters the gap 412 in the transport path 41, and comes into surface contact with the lower surface of the tape 300 that is pressed from above by the bonding head 2, heating the electronic component 100 and the tape 300 while supporting them from below. The bonding stage 3 is also provided so as to be movable to the off-tape position 92.

The bonding head 2 has a flat lower surface. The flat lower surface is a holding surface for the electronic component 100, and suction holes are formed in the holding surface for sucking the electronic component 100. The bonding stage 3 has a flat upper surface. The flat upper surface is a support surface that comes into surface contact with the lower surface of the tape 300.

As shown in FIG. 3, a head-side heater 21 is embedded in the bonding head 2, and a stage-side heater 31 is embedded in the bonding stage 3. The head-side heater 21 and the stage-side heater 31 are, for example, pulse heaters. The head-side heater 21 heats the bonding head 2, and the stage-side heater 31 heats the bonding head 2. The bonding stage 3, which is in surface contact with the tape 300 made of polyimide or the like, has stricter temperature restrictions than the bonding head 2, and the bonding head 2 is at a higher temperature than the bonding stage 3.

The bonding head 2 and the bonding stage 3 are preferably made of a material with a low thermal expansion coefficient. Examples of materials with a low thermal expansion coefficient include SUS304, SUS430, and ceramics. By forming the bonding head 2 and the bonding stage 3 from a material with a low thermal expansion coefficient, misalignment between the electronic component 100 and the mounting area 301 caused by the thermal expansion of the bonding head 2 and the bonding stage 3 is suppressed.

Such a bonding head 2 is attached to a lifting mechanism 22 for lowering at the mounting position 91 and a parallel movement mechanism 23 for moving between the mounting position 91 and the off-tape position 92. The bonding stage 3 is attached to a lifting mechanism 32 for rising at the mounting position 91 and a parallel movement mechanism 33 for moving between the mounting position 91 and the off-tape position 92.

The lifting mechanism 22, the parallel movement mechanism 23, the lifting mechanism 32 and the parallel movement mechanism 33 are, for example, ball screw mechanisms driven by a motor. The movement direction of the lifting mechanism 22 and the lifting mechanism 32 is the up-down direction (Z direction), and the movement direction of the parallel movement mechanism 23 and the parallel movement mechanism 33 is the Y direction passing through the mounting position 91 and the off-tape position 92 at a constant height. In other words, the mounting position 91 and the off-tape position 92 are set on a straight line along the Y direction.

The mounting device 1 further includes a position correction mechanism 24 to which the upper and lower dual-view camera 11 and the bonding head 2 are attached. The upper and lower dual-view camera 11 moves so that it can be inserted directly above the mounting position 91 on the transport path 4, and captures the positions of the electronic component 100 positioned at the mounting position 91 and the mounting area 301. The position correction mechanism 24 is, for example, a ball screw mechanism driven by a motor, and moves the bonding head 2 in a direction along the transport path 4 (X direction) to correct positional deviation along the extension direction of the transport path 4. Positional deviation along a direction perpendicular to the transport path 4 (Y direction) is corrected by the parallel movement mechanism 23.

(Parts supply means)
The component supply unit 5 holds a wafer sheet 200 on which electronic components 100 are arranged in a two-dimensional direction. The electronic components 100 are attached in a face-up state, with the electrode formation surface on which the bump electrodes are formed facing upward. The component supply unit 5 then positions the electronic components 100 one by one at a pickup position 93. The pickup position 93 is where the pickup head 6 picks up the electronic components 100 from the component supply unit 5.

The component supply unit 5 is equipped with a camera 51 for identifying the positional relationship between the electronic component 100 to be picked up and the pick-up position 93, and for accurately positioning the electronic component 100 at the pick-up position 93. The pick-up head 6 has a flat holding surface at its tip for holding the electronic component 100, and the holding surface is formed with suction holes that generate negative pressure. The pick-up head 6 is also attached to a lifting mechanism 61, a parallel movement mechanism 62, and an inversion mechanism 63.

The lifting mechanism 61 moves the pickup head 6 toward or away from the component supply unit 5 at the pickup position 93. The parallel movement mechanism 62 transports the pickup head 6 between the pickup position 93 and the off-tape position 92. The lifting mechanism 61 and the parallel movement mechanism 62 are ball screw mechanisms, for example, like the lifting mechanism 22, the parallel movement mechanism 23, the lifting mechanism 32, and the parallel movement mechanism 33. The inversion mechanism 63 inverts the pickup head 6 holding the electronic component 100 upside down. The inversion mechanism 63 is, for example, a rotary motor that supports the pickup head 6 on a rotating shaft that extends at a constant height, and rotates the rotating shaft 180°.

As a result, the pickup head 6 picks up the electronic component 100 from the component supply unit 5 at the pickup position 93, moves to the off-tape position 92, and delivers the electronic component 100 to the waiting bonding head 2. At this time, since the holding surface of the bonding head 2 faces downward, the pickup head 6 turns upside down between picking up the electronic component 100 at the pickup position 3 and delivering the electronic component 100 to the bonding head 2.

(Cleaner)
The cleaner 7 has grindstones on both the upper and lower surfaces, for example, and is attached to a parallel movement mechanism 71. The parallel movement mechanism 71 moves the cleaner 7 in a direction (X direction) along the transport path 41, thereby moving it from the waiting position to the off-tape position 92. For example, the parallel movement mechanism 71 is a ball screw mechanism driven by a motor. At the off-tape position 92, the cleaner 7 is located between the bonding head 2 and the bonding stage 3. The lowering of the bonding head 2 and the rising of the bonding stage 3 bring the bonding head 2 and the bonding stage 3 into contact with the grindstones present on the upper limit surface of the cleaner 7. Then, by oscillating one side relative to the other, the bonding head 2 and the bonding stage 3 can be cleaned.

(Control Unit)
The control unit 8 is a so-called computer that includes an arithmetic and control device also called a CPU or MPU, a main memory device also called a RAM, an external memory device such as an HDD or SSD, and an interface that transmits and receives control signals to each hardware configuration of the mounting device 1. This control unit 8 controls the mounting device 1 by expanding the programs and data stored in the external memory device into the main memory device, executing the programs in the arithmetic and control device, and outputting drive signals according to the execution results through the interface.

The control unit 8 includes a bonding head control unit 82, which is mainly composed of an arithmetic control unit and an interface, a bonding stage control unit 83, a tape running control unit 84, a pickup control unit 85, a cleaner control unit 87, a heating control unit 88, and a timing unit 89, which are controlled by a program. To explain the bonding head control unit 82 and the bonding stage control unit 83 in more detail, the bonding head control unit 82 includes a lift control unit 822 and a parallel movement control unit 823, and the bonding stage control unit 83 includes a lift control unit 832 and a parallel movement control unit 833.

The timing unit 89 outputs a timing signal. The bonding head control unit 82 outputs a drive signal for raising and lowering the bonding head 2 a predetermined distance and moving it in parallel, while timing it based on the timing signal in accordance with the main operation, pre-processing operation, or cleaning operation. The bonding stage control unit 83 outputs a drive signal for raising and lowering the bonding stage 3 a predetermined distance and moving it in parallel, while timing it based on the timing signal in accordance with the pre-processing operation or cleaning operation. The heating control unit 88 outputs drive signals for turning the head-side heater 21 and the stage-side heater 31 on and off during the main operation and pre-processing operation.

During this operation, the tape travel control unit 84 outputs drive signals for the unwinding and winding of the loader 42 and unloader 43 while timing based on the timing signal. During this operation, the pickup control unit 85 outputs drive signals for a predetermined lifting distance, a predetermined parallel movement distance and reversal angle of the pickup head 6, and a two-dimensional movement distance of the component supply unit 5 while timing based on the timing signal. During cleaning operation, the cleaner control unit 87 outputs a drive signal for a predetermined parallel movement distance of the cleaner 7 based on the timing signal.

(motion)
(Main operation)
4 to 7, the main operation of the mounting apparatus 1 under the control of the control unit 8 will be described. This operation is an operation for mounting the electronic components 100 on the mounting area 301 of the tape 300. This operation is performed after the tape 300 is stretched so as to pass through the transport path 4 and the temperatures of the bonding head 2 and the bonding stage 3 are stabilized by an aging operation described later.

First, as shown in FIG. 4, the component supply unit 5 aligns the electronic component 100 to be picked up at the pickup position 93. The pickup head 6 descends at the pickup position 93, adsorbs and holds the electronic component 100, and then rises again away from the component supply unit 5. The pickup head 6 then heads toward the off-tape position 92. During or after the movement to the off-tape position 92, the pickup head 6 rotates 180°.

The bonding head 2 moves in parallel toward the off-tape position 92 and descends at the off-tape position 92. The bonding head 2 then receives the electronic component 100 from the pickup head 6 by suction and holding it. At this time, the pickup head 3 releases the electronic component 100 by breaking the vacuum or opening to the atmosphere.

As shown in FIG. 5, the bonding head 2 that has received the electronic component 100 heads toward the mounting position 91 and descends at the mounting position 91. The bonding stage 3 supports the tape 300 on the transport path 4 from below at the mounting position 91. The loader 42 and unloader 43 stop the running of the tape 300 and position the mounting area 301 at the mounting position 91.

The bonding head 2 presses the electronic component 100 against the mounting area 301 on the tape 300 and heats it. This pressing and pressure electrically and mechanically connects the electronic component 100 to the mounting area 301.

As shown in FIG. 6, when mounting of one electronic component 100 is completed, the bonding head 2 releases the electronic component 100 and rises, heading toward the off-tape position 92 to receive the next electronic component 100. After delivering the electronic component 100, the pickup head 6 heads toward the pickup position 93 to pick up the next electronic component 100. The component supply unit 5 moves in two dimensions to position the next electronic component 100 at the pickup position 93. The loader 42 and unloader 43 run the tape 300 by unwinding and winding it, and stop the empty mounting area 301 located next to the mounting area 301 where the electronic component 100 is mounted at the mounting position 91.

Figure 7 is a time chart showing the operation timing of the bonding head 2. As shown in Figure 7, the bonding head 2 repeats a close state and a separated state with respect to the bonding stage 3. In the close state, the bonding head 2 approaches the bonding stage 3 in order to press the electronic component 100 against the tape 300 at the mounting position 91 and heat it. The separated state refers to a state in which, after mounting of the electronic component 100 is completed, the bonding head 2 moves away from the bonding stage 3, receives the next electronic component 100 at the off-tape position 92, and brings the electronic component 100 into contact with the mounting area 301, until the bonding head 2 again approaches the bonding stage 3.

The same time S1 is spent in each close state. The same time S2 is spent in each separated state. That is, the bonding head 2 repeats the same approach/separation pattern during this operation. This approach/separation pattern is based on the timing of approaching the bonding stage 3, the time S1 during which it is close, the timing of moving away from the bonding stage 3, and the time S2 during which it is separated; the location of approach and the movement during separation are not included as elements of the approach/separation pattern.

(Cleaning operation)
When mounting of electronic components 100 according to the above-described operation is repeated, dirt and the like adheres to the bonding head 2 and bonding stage 3, so a cleaning operation is performed at preset time intervals or after a preset number of mounting operations. During the cleaning operation, as shown in Fig. 12, the bonding head 2, bonding stage 3, and cleaner 7 move to the off-tape position 92. The bonding head 2 descends and oscillates in contact with the grindstone on the upper surface of the cleaner 7. The bonding stage 3 rises and oscillates in contact with the grindstone on the lower surface of the cleaner 7. When cleaning is completed, the cleaner 7 retreats to a waiting position away from the off-tape position 92.

(Pre-processing operation)
The pre-processing operation of the mounting device 1 under the control of the control unit 8 will be described with reference to Figs. 8 to 11. The pre-processing operation is performed prior to the main operation, and includes a tape installation operation and an aging operation. In the tape installation operation, the loader 42 is caused to pay out the tape 300, the tape 300 is set in the transport path 4, and the tape 300 is wound around the unloader 43. The tape installation operation is completed before the aging operation, or in parallel with the aging operation, by the time the aging operation is completed.

In the aging operation prior to the main operation, the head-side heater 21 and the stage-side heater 31 are turned on to heat the bonding head 2 and the bonding stage 3 under the same operating conditions as the main operation (e.g., the same amount of heat per unit time as the main operation, i.e., the same set temperature as the main operation). The head-side heater 21 and the stage-side heater 31 are continuously turned on until the pre-processing operation is completed and the main operation is started, emitting the same amount of heat per unit time as the main operation, and continuing to heat the bonding head 2 and the bonding stage 3.

During the aging operation, as shown in FIG. 8, both the bonding head 2 and the bonding stage 3 are positioned at the off-tape position 92 and separated from each other during heating. Then, first, the bonding stage 3 is raised to the same height as the height at which the tape 300 is supported, and then, as shown in FIG. 9, the bonding head 2 is lowered. This brings the holding surface of the bonding head 2 into contact with or close to the supporting surface of the bonding stage 3. The closeness is preferably a distance equivalent to the thickness of the electronic component 100 and the tape 300, or a distance that is the same as the amount of thermal conduction when the electronic component 100 and the tape 300 are present.

The separated state shown in FIG. 8 and the contact or proximity state shown in FIG. 9 (hereinafter referred to as the contact or proximity state and simply the contact state) are repeated a predetermined number of times, for example, 20 to 30 times or more. The number of repetitions of 20 to 30 times or more is an example, and the number of repetitions required to achieve a stable temperature can be derived by experience, experiment, calculation, or simulation. The separated state is maintained for the same time S2 as the separated state in this operation shown in FIG. 7. The contact state is maintained for the same time S1 as the proximity state in this operation shown in FIG. 7. That is, as shown in FIG. 10(b), in the aging operation, the bonding head 2 and the bonding stage 3 operate in the same approach/separation pattern as this operation at the off-tape position 92, without the tape 300 and electronic component 100. Note that FIG. 10(a) shows the approach/separation pattern in this operation.

Figure 11 (a) is a time chart showing the timing of the separated and contact states of the bonding head 2 during the aging operation, (b) is a graph showing a schematic diagram of the temperature change of the bonding head 2 during the aging operation, and (c) is a graph showing a schematic diagram of the temperature change of the bonding stage 3 during the aging operation.

As shown in FIG. 11, at the beginning of the aging operation, there is a large temperature difference between the bonding head 2 and the bonding stage 3. The bonding head 2 has a higher temperature than the bonding stage 3. Therefore, during the time S1 when the bonding head 2 and the bonding stage 3 are in contact or in close proximity, the temperature of the bonding head 2 drops significantly and the temperature of the bonding stage 3 rises significantly.

On the other hand, the difference between the bonding head 2 and room temperature is large, and the difference between the bonding stage 3 and room temperature is small. Therefore, during the time S2 when the bonding head 2 and bonding stage 3 are separated, the temperature rise of the bonding head 2 is small, and the temperature drop of the bonding stage 3 is small. Therefore, in FIG. 11, the temperature drop of the bonding head 2 continues, and the temperature rise of the bonding stage 3 continues, until the separated state and the contact state are repeated for the fourth time.

However, because the temperature of the bonding head 2 continues to decrease and the temperature of the bonding stage 3 continues to increase, the temperature difference between the bonding head 2 and the bonding stage 3 becomes smaller in the later stage of the aging operation compared to the initial stage. Therefore, during time S1 when the bonding head 2 and the bonding stage 3 are in contact or close to each other, the temperature decrease of the bonding head 2 becomes smaller than in the initial stage, and the temperature increase of the bonding stage 3 becomes smaller than in the initial stage.

Meanwhile, because the temperature of the bonding head 2 continues to decrease, the difference between the bonding head 2 and room temperature becomes smaller. Also, because the temperature of the bonding stage 3 continues to increase, the difference between the bonding head 3 and room temperature becomes larger. Therefore, during the time S2 when the bonding head 2 and the bonding stage 3 are separated, the temperature increase of the bonding head 2 caused by the head-side heater 21 becomes larger than at the beginning, and the temperature decrease of the bonding stage 3 becomes larger than at the beginning.

Eventually, the temperature drop of the bonding head 2 at time S1 and the temperature rise of the bonding head 2 at time S2 become balanced. Note that FIG. 11 shows a schematic diagram of a state in which the upper temperature limit T1, the lower temperature limit T2, the temperature drop rate, and the temperature rise rate of the bonding head 2 each maintain approximately constant values from the fifth time onwards, and the average value becomes stable at a constant value. Also, the temperature rise of the bonding stage 3 at time S1 and the temperature drop of the bonding stage 3 at time S2 become balanced, and FIG. 11 shows a schematic diagram of a state in which the upper temperature limit T3, the lower temperature limit T4, the temperature drop rate, and the temperature rise rate of the bonding stage 3 each maintain approximately constant values from the fifth time onwards, and the average value becomes stable at a constant value. In other words, the temperatures of the bonding head 2 and the bonding stage 3 become stable with the same temperature change pattern and temperature change amount for each time from the fifth time onwards.

When the above pre-processing operations are completed, the tape 300 has already been laid, and the mounting area 301 on the tape 300 where the electronic components 100 are to be mounted first is positioned at the mounting position 91, so that the main operation can be started immediately. Therefore, with the temperatures of the bonding head 2 and the bonding stage 3 remaining stable, the tape 300 is exposed to a constant average amount of heat from the first mounting to the last mounting, with the same upper temperature limits T1 and T3 (note that T1 ≠ T3), the same lower temperature limits T2 and T4 (note that T2 ≠ T4), the same temperature drop rate, and the same temperature rise rate. This makes the thermal expansion of the mounting area 301 uniform from the first mounting to the last mounting, and all electronic components 100 can be mounted with the same precision in all mounting areas 301.

During this pre-processing operation, the user does not perform trial and error to set stable temperatures for the bonding head 2 and bonding stage 3. In the pre-processing operation, it is sufficient to simply repeat contact or approach and separate the bonding head 2 and bonding stage 3 at the off-tape position 92 at the same timing as this operation.

(Action and Effect)
As described above, the mounting device 1 that mounts the electronic component 100 on the mounting area 301 includes the transport path 4, the bonding head 2, and the bonding stage 3. The tape 300 on which the mounting areas 301 are arranged in a belt direction runs along the transport path 4. The bonding stage 3 can be arranged on the transport path of the tape 300 by the transport path 4, and supports the tape 300 from below. The bonding head 2 holds the electronic component 100 and heats it by pressing it against the mounting area 301 of the tape 300 supported by the bonding stage 3. The bonding head 2 and the bonding stage 3 include a head-side heater 21 and a stage-side heater 31.

Then, as an aging operation prior to the actual mounting operation of mounting the electronic component 100 on the tape 300, the bonding head 2 and the bonding stage 3 are moved to an off-tape position 92 outside the tape 300, and are heated while repeatedly coming into contact or approaching and separating at the off-tape position 92.

This allows the aging operation to be performed with the tape 300 stretched across the transport path 4 or while it is stretched across the transport path 4. More specifically, the mounting area 301 on the tape 300 where the electronic component 100 is first mounted can be positioned at the mounting position 91 at the start of the aging operation or before the aging operation is completed. This prevents the temperatures of the bonding head 2 and the bonding stage 3 from changing from the stable temperature due to the task of stretching the tape 300 after the aging operation, further improving mounting accuracy.

In addition, since the aging operation is performed by moving the tape 300 from the mounting position 92 to an off-tape position 92, which is a position outside the transport path 4 of the tape 300, the tape 300 suspended over the transport path 4 can be prevented from being heated by the heat (radiation heat) of the bonding head 3 during the aging operation. This makes it possible to prevent the tape 300 from experiencing unintended thermal expansion or being damaged by heating. Therefore, it is possible to expect further improvements in mounting accuracy, as well as improved mounting quality.

When the aging operation is performed with the tape 300 stretched across the transport path 4, the aging operation may be automatically started upon completion of positioning of the first mounting area 301 of the tape 300 at the mounting position 91. For example, the control unit 8 receives a signal from the tape running control unit 84 indicating that the first mounting area 301 of the tape 300 has stopped at the mounting position 91. Then, upon receiving this signal, the bonding head control unit 82 and the bonding stage control unit 83 output drive signals so that the movements of the bonding head 2 and the bonding stage 3 are aging operations. This makes it possible to automatically execute and complete the aging operation simply by performing the tape installation operation.

The off-tape position 92 where the aging operation is performed is a position where the cleaner 7 cleans the bonding head 2 and bonding stage 3. This allows the movement mechanism for positioning to the off-tape position 92 to be used for the aging operation. However, as long as the aging operation, cleaning operation, and electronic component 100 transfer operation are performed at positions outside the tape 300, there is no problem in stabilizing the temperatures of the bonding head 2 and bonding stage 3, whether they are performed at the same location or at different locations.

This mounting device 1 is equipped with both a head-side heater 21 and a stage-side heater 31, but it may be equipped with either one as long as the desired temperature can be stabilized. However, if the head-side heater 21 is installed on the bonding head 2, the temperature of the bonding head 2 that is not in contact with the tape 300 can be set higher, and the bonding time between the electronic component 100 and the mounting area 301 of the tape 300 can be shortened. However, in order to stabilize the temperature in a range close to the desired temperature and to stabilize it quickly, it is desirable to also install a stage-side heater 31.

In order to completely simulate this operation, a dummy electronic component 100 and a piece of dummy tape 300 may be placed on top of each other on the bonding stage 3, and the aging operation may be performed while these dummies are sandwiched between them. This also allows the heat transfer behavior via the electronic component 100 and tape 300 to be reproduced, and the temperature stabilized in this operation and the temperature stabilized in aging can be accurately matched. In other words, temperature changes during mounting at the beginning of this operation are further suppressed.

Second Embodiment
In the first embodiment, as an aging operation, the bonding head 2 is configured to alternately repeat contact or proximity with the bonding stage 3 and separation from the bonding stage 3 a predetermined number of times with an operation timing simulating the actual mounting operation. However, the method of heating the bonding head 2 and the bonding stage 3 is not limited to this.

For example, as shown in FIG. 13, the mounting device 1 is equipped with a heater 12 that is installed only during the aging operation and is removed during the actual mounting operation. The heater 12 is placed on the bonding stage 3 by an operator during the aging operation. The bonding head 2 moves toward the bonding stage 3 at the off-tape position 92. Then, the bonding head 2 maintains proximity or contact with the heater 12 on the bonding stage 3 for a predetermined time. In other words, the bonding head 2 approaches or contacts the bonding stage 3 on which the heater 12 is placed. The predetermined time of proximity or contact is the time required to reach a stable temperature, and is derived in advance by experience, experiment, calculation, or simulation.

After a predetermined time has elapsed, the heater 12 may be removed by an operator, or may be held by suction by the bonding head 2 and moved to a location other than the mounting position 91 or the off-tape position 92. In the case of a method in which the heater 12 is removed by the bonding head 2, the actual mounting operation can be automatically started.

In addition to the heater 12, the heater side stage 21 and the stage side stage 31 may also be turned on to provide more heat to the bonding head 2 and the bonding stage 3, thereby shortening the time required for the aging operation. The heater 12 may not be placed on the bonding stage 3, and the heater side stage 21 and the stage side stage 31 may be turned on to perform the aging operation by keeping the heater side stage 21 and the stage side stage 31 in contact or separated for a predetermined period of time only.

The following method can be used to empirically or experimentally derive the specified time. That is, a thermometer such as a thermocouple is placed on the bonding stage 3 or attached to the bonding head 2, and the bonding head 2 and bonding stage 3 are brought into contact or close proximity. The temperature change indicated by the thermometer is observed, and the time required for the temperature to stabilize is measured, and the measurement result is taken as the specified time. Similarly, when the bonding head 2 and bonding stage 3 are repeatedly brought into close and separated states to simulate the actual mounting operation as an aging operation, the number of repetitions can be empirically or experimentally derived by counting the number of repetitions until the temperature stabilizes, as shown in FIG.

Other Embodiments
Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims.

1 Mounting device 11 Upper and lower two-view camera 12 Heater 2 Bonding head 21 Head side heater 22 Lifting mechanism 23 Parallel movement mechanism 24 Position correction mechanism 3 Bonding stage 31 Stage side heater 32 Lifting mechanism 33 Parallel movement mechanism 41 Transport path 411 Rail 412 Gap 42 Loader 43 Unloader 5 Component supply unit 51 Camera 6 Pickup head 61 Lifting mechanism 62 Parallel movement mechanism 63 Reversal mechanism 7 Cleaner 71 Parallel movement mechanism 8 Control unit 82 Bonding head control unit 822 Lifting control unit 823 Parallel movement control unit 83 Bonding stage control unit 832 Lifting control unit 833 Parallel movement control unit 84 Tape running control unit 85 Pickup control unit 87 Cleaner control unit 88 Heating control unit 89 Timer unit 91 Mounting position 92 Outside tape position 93 Pickup position 100 Electronic component 200 Wafer sheet 300 Tape-shaped circuit board, tape 301 Mounting area

Claims (9)

A mounting device that mounts electronic components in mounting areas arranged side by side on a tape-shaped circuit board, comprising:
a tape running means having a transport path along which the tape-shaped circuit board is laid, the tape running means running the tape-shaped circuit board on a transport path along the transport path in a main operation in which the mounting is performed;
a bonding stage that can be placed on the transport path of the tape-shaped circuit board and supports the tape-shaped circuit board from below;
a bonding head that presses and heats the electronic component against the mounting area of the tape-shaped circuit board supported by the bonding stage;
a heater for heating the bonding head or, in addition, the bonding stage;
Equipped with
The bonding head and the bonding stage are
As an aging operation prior to the main operation, the tape-shaped circuit board is moved to an off-tape position away from the transport path,
The heater is heated while repeatedly contacting or approaching and separating from the tape at the position outside the tape,
the distance between the bonding head and the bonding stage when they are close to each other is a distance corresponding to a thickness between the electronic component and the tape, or a distance that is equal to the amount of heat conduction when the electronic component and the tape are present;
A mounting apparatus, characterized in that the distance between said bonding head and said bonding stage when they are separated is greater than the distance between said bonding head and said bonding stage when they are close to each other. a cleaner for cleaning the bonding head and the bonding stage at a cleaning position that is off the transport path of the tape-shaped circuit board;
the off-tape position is set to the cleaning position;
2. The mounting device according to claim 1, A bonding head control unit that controls the movement of the bonding head;
a bonding stage control unit that controls the movement of the bonding stage;
A control unit having a heating control unit that controls the heater,
The control unit is
controlling the bonding head control unit and the bonding stage control unit to move the bonding head and the bonding stage from a mounting position where the main operation is performed to an off-tape position, and moving the bonding head and the bonding stage so as to come into contact with or be close to each other at the off-tape position, and controlling the heating control unit to drive the heater to control the aging operation;
3. The mounting device according to claim 1 or 2, the control unit executes the aging operation after the tape-shaped circuit board has been laid on the transport path;
4. The mounting device according to claim 3, a component supply unit that holds the electronic components to be mounted on the board;
a pickup head that receives the next electronic component to be mounted from the component supply unit and passes it to the bonding head;
Equipped with
the pickup head delivers the electronic component to the bonding head at the off-tape position during the main operation;
5. The mounting device according to claim 1, wherein: the heater is provided in either one or both of the bonding head and the bonding stage;
6. The mounting device according to claim 1, wherein: the heater is placed on the bonding stage during the aging operation;
6. The mounting device according to claim 1, wherein: the bonding head and the bonding stage, in the main operation, repeatedly move in a close proximity state in which the electronic component is pressed against the mounting area for a first time period, and in a spaced state in which the electronic component is spaced further away than the close proximity state for a second time period;
the bonding head repeats a process of coming into contact with or close to the bonding stage for a time period equal to the first time and being separated from the bonding stage for a time period equal to the second time during the aging operation;
8. The mounting device according to claim 1, wherein: the distance between the bonding head and the bonding stage when they approach each other during the aging operation corresponds to a thickness of the electronic component and the tape-shaped circuit board;
8. The mounting device according to claim 1, wherein:

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