JP7512941B2 - Transparent conductive film manufacturing apparatus and manufacturing method - Google Patents

Description

The present invention relates to a manufacturing apparatus and method for transparent conductive films.

Transparent conductive films using carbon nanotubes have been known in the past. The transparent conductive film can be used, for example, as a transparent heater to ensure the functionality of a vehicle sensor using a camera, LiDAR, millimeter wave, or the like, or the functionality of a windshield. Specifically, the transparent conductive film used as a transparent heater plays a role in removing icing or fogging that occurs on the vehicle sensor or windshield by heating the vehicle sensor or windshield. In the following description, carbon nanotubes are abbreviated as "CNT."

Patent Document 1 discloses a method for manufacturing a transparent conductive film that is constructed by providing a lattice-like wiring pattern made of CNTs on a transparent substrate. In this manufacturing method, a collection member is formed by first providing a photosensitive resist film having grooves (openings in Patent Document 1) for forming a wiring pattern made of CNTs on a porous filter. Next, CNTs synthesized in the gas phase by chemical vapor deposition or the like are collected by the collection member. The CNTs collected by the collection member are then transferred to a transparent substrate such as a transparent film to form a transparent conductive film.

JP 2014-44839 A

However, the inventors' investigations have revealed that in the manufacturing method described in Patent Document 1, the CNTs that make up the wiring pattern are oriented in random directions relative to the extension direction of the wiring pattern, or are oriented perpendicular to the extension direction of the wiring pattern. Therefore, the transparent conductive film manufactured by the manufacturing method described in Patent Document 1 has a high electrical resistance, which limits its applications.

In view of the above, the present invention aims to provide a manufacturing apparatus and method that make it possible to reduce the electrical resistance of a transparent conductive film that uses CNTs.

In order to achieve the above object, the invention according to claim 1 provides a transparent conductive film manufacturing apparatus comprising a supply passage (10) and a support section (21). The supply passage has a supply port (11) through which a gas containing CNT is supplied, and constitutes a flow path through which a gas containing carbon nanotubes supplied from the supply port flows. The support section supports a capture member (20) downstream of the supply passage, the capture member having a porous film (22) that captures CNT contained in the gas, and a dense film (23) on the surface of the porous film facing the supply port that has grooves (24) for forming a wiring pattern using CNT. The supply passage has an inclined section (13) configured so that the flow direction of the gas from the supply port toward the capture member is oblique or parallel to the longitudinal direction of the grooves in the dense film.

According to this, the CNTs contained in the gas flow with their orientation aligned in the gas flow direction. Therefore, by making the flow direction of the gas flowing through the inclined portion oblique or parallel to the longitudinal direction of the grooves in the dense film, it is possible to increase the degree of orientation of the CNTs captured in the grooves in the longitudinal direction of the grooves. Therefore, the transparent conductive film in which the CNTs captured by this capture member are transferred to a transparent substrate has fewer contact points between the CNTs that make up the wiring pattern, reducing contact resistance and allowing for a lower electrical resistance value.

The invention according to claim 13 is a transparent conductive film manufacturing apparatus comprising a supply passage (10), a support portion (21), and a guide plate (14). The supply passage has a supply port (11) through which a gas containing CNT is supplied, and constitutes a flow path through which the gas containing CNT supplied from the supply port flows. The support portion supports a capture member (20) downstream of the supply passage, the capture member having a porous film (22) that captures CNT contained in the gas, and a dense film (23) in which grooves (24) for forming a wiring pattern by CNT are provided on the surface of the porous film facing the supply port. The guide plate is provided in the supply passage, and makes the flow direction of the gas from the supply port toward the capture member oblique or parallel to the longitudinal direction of the grooves in the dense film.

According to this, the guide plate provided in the supply passage can increase the degree of orientation of the CNTs captured in the grooves of the dense film in the longitudinal direction of the grooves, and can improve the in-plane uniformity of the orientation of the CNTs on the capturing surface of the capturing member. Therefore, the transparent conductive film obtained by transferring the CNTs captured by this capturing member to a transparent substrate can have a lower electrical resistance.
It is possible to make the inventions described in claims 1 to 4 and 6 to 12 dependent on the invention described in claim 13.

The invention according to claim 14 is a transparent conductive film manufacturing apparatus comprising a supply passage (10), a support section (21), and a plurality of exhaust passages (30). The supply passage has a supply port (11) through which a gas containing CNT is supplied, and constitutes a flow path through which the gas containing CNT supplied from the supply port flows. The support section supports a capture member (20) downstream of the supply passage, the capture member having a porous film (22) that captures CNT contained in the gas, and a dense film (23) on the surface of the porous film facing the supply port that has grooves (24) for forming a wiring pattern using CNT. The plurality of exhaust passages are provided on the opposite side of the capture member to the supply passage, and exhaust gas that has passed through the capture member. The plurality of exhaust passages are provided for each of the divided regions obtained by dividing the capture member into a plurality of regions.

This can improve the in-plane uniformity of the amount of CNT captured on the capturing surface of the capturing member, and therefore the transparent conductive film formed by transferring the CNTs captured by the capturing member to a transparent substrate can have reduced variation in the amount of CNT that constitutes the wiring pattern, and can lower the electrical resistance.
It is possible to make the inventions described in claims 1 to 7 and 9 to 12 dependent on the invention described in claim 14.

The invention according to claim 15 is an invention related to a method for manufacturing a transparent conductive film. This manufacturing method includes the following steps: Preparing a collection member having a porous film (22) for collecting CNTs contained in a gas and a dense film (23) having grooves (24) for forming a wiring pattern by CNTs (S10). Installing the collection member on a support part (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing CNTs is supplied (S20). Supplying a gas containing CNTs from the supply port to an inclined part (13) configured so that the flow direction of the gas from the supply port toward the collection member is oblique or parallel to the longitudinal direction of the grooves of the dense film (S30). Transferring the CNTs collected by the collection member to a transparent substrate to form a transparent conductive film (S50).

By making the flow direction of the gas flowing through the inclined portion oblique or parallel to the longitudinal direction of the grooves in the dense film, the degree of orientation of the CNTs captured in the grooves in the longitudinal direction of the grooves can be increased. Therefore, the transparent conductive film in which the CNTs captured by this capture member are transferred to a transparent substrate has fewer contact points between the CNTs that make up the wiring pattern, reducing contact resistance and allowing for a lower electrical resistance value.

The invention according to claim 16 is also an invention relating to a method for manufacturing a transparent conductive film. This manufacturing method includes the following steps. A capture member (20) is prepared, which has a porous film (22) for capturing CNT contained in a gas, and a dense film (23) provided with grooves (24) for forming a wiring pattern using CNTs. The capture member is placed on a support (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing CNTs is supplied (S20). A gas containing CNTs is supplied from the supply port along a guide plate (14) provided in the supply passage so that the angle of incidence of the gas on the collection surface of the capture member on the supply port side is parallel or oblique to the longitudinal direction of the grooves in the dense film (S30). The CNTs captured by the capture member are transferred to a transparent substrate to form a transparent conductive film (S50).

With this, the guide plate provided in the supply passage can increase the degree of orientation of the CNTs captured in the grooves of the dense film in the longitudinal direction of the grooves, and can improve the in-plane uniformity of the orientation of the CNTs on the capturing surface of the capturing member. Therefore, the transparent conductive film formed by transferring the CNTs captured by this capturing member to a transparent substrate can have a lower electrical resistance.

The invention according to claim 17 is also an invention relating to a method for manufacturing a transparent conductive film. This manufacturing method includes the following steps: Preparing a capture member (20) having a porous film (22) for capturing CNT contained in a gas and a dense film (23) provided with grooves (24) for forming a wiring pattern by CNT (S10). Installing the capture member on a support part (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing CNT is supplied (S20). Supplying a gas containing CNT from the supply port (S30). Dividing the capture member into a plurality of regions and discharging the gas that has passed through the capture member from a plurality of exhaust passages (30) provided on the opposite side of the supply passage with respect to the capture member for each divided region (S35). Transferring the CNT captured by the capture member to a transparent substrate to form a transparent conductive film (S50).

This makes it possible to improve the in-plane uniformity of the amount of CNT captured on the capturing surface of the capturing member. Therefore, the transparent conductive film formed by transferring the CNTs captured by this capturing member to a transparent substrate has reduced variation in the amount of CNTs that make up the wiring pattern, and can lower the electrical resistance value.

The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below.

1 is a diagram showing a cross-sectional configuration of a transparent conductive film manufacturing apparatus according to a first embodiment. 2 is a cross-sectional view taken along line II-II of FIG. 1. 2 is a flowchart showing a method for manufacturing a transparent conductive film according to the first embodiment. FIG. 2 is a diagram showing a cross-sectional configuration of a transparent conductive film manufacturing apparatus of a comparative example. 10 is an explanatory diagram for explaining how CNTs are captured in grooves of a capturing member in a transparent conductive film manufacturing apparatus of a comparative example. FIG. 4 is an explanatory diagram for explaining a state in which CNTs are captured in grooves of a capturing member in the transparent conductive film manufacturing apparatus of the first embodiment. FIG. FIG. 2 is a schematic diagram of CNTs constituting a wiring pattern of a transparent conductive film manufactured by a transparent conductive film manufacturing apparatus of a comparative example. 2 is a schematic diagram of CNTs constituting a wiring pattern of a transparent conductive film manufactured by the transparent conductive film manufacturing apparatus of the first embodiment. FIG. 13 is an explanatory diagram for illustrating how CNTs are captured in a groove of a capture member when a gas containing CNTs is supplied from one side in the longitudinal direction of the groove. FIG. FIG. 1 is an explanatory diagram of a method for calculating the orientation degree of CNTs that constitute the wiring pattern of a transparent conductive film. 1 is a graph showing experimental results regarding the relationship between the degree of orientation of CNTs constituting the wiring pattern of a transparent conductive film and the resistance reduction rate of the transparent conductive film. FIG. 11 is a diagram showing a cross-sectional configuration of a transparent conductive film manufacturing apparatus according to a second embodiment. 11 is a cross-sectional view taken along line XI-XI of FIG. 10 . 10 is a flowchart showing a method for manufacturing a transparent conductive film according to a second embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In each of the following embodiments, parts that are the same or equivalent to each other will be given the same reference numerals and their description will be omitted.

First Embodiment
The transparent conductive film manufacturing apparatus and manufacturing method according to the first embodiment will be described with reference to the drawings. The transparent conductive film formed by the manufacturing apparatus and manufacturing method according to the first embodiment has a predetermined wiring pattern made of carbon nanotubes (hereinafter referred to as CNTs) on one side of a thin-film transparent substrate. The transparent conductive film can be used as a transparent heater for ensuring the function of a vehicle sensor using a camera, LiDAR, millimeter wave, etc., or the function of a windshield.

As shown in Figures 1 and 2, the manufacturing apparatus 1 of the first embodiment includes a supply passage 10 that forms a flow path through which a gas containing CNTs flows, and a support portion 21 that supports a capture member 20 downstream of the supply passage 10.

A supply port 11 is provided in the supply passage 10 at a position above and away from the support portion 21. As shown by arrow A in FIG. 1, a gas containing CNTs synthesized in the gas phase, for example by a floating catalyst method, is supplied from the supply port 11 to the inside of the supply passage 10. The supply passage 10 constitutes a flow path through which the gas containing CNTs supplied from the supply port 11 flows. When the gas containing CNTs flows through the supply passage 10 and passes through a capture member 20 arranged on a support portion 21 provided downstream of the supply passage 10, the CNTs contained in the gas are captured by the capture member 20.

The collection member 20 has a porous film 22 and a dense film 23 provided on the surface of the porous film 22 facing the supply port 11. The porous film 22 is a porous filter that allows gas to pass through and can capture CNT contained in the gas. The dense film 23 is a mask that allows almost no CNT and gas to pass through, and is composed of, for example, a photosensitive resist or a thin metal plate. The dense film 23 is provided with a plurality of grooves 24 for forming a predetermined wiring pattern by CNT. The plurality of grooves 24 penetrate the dense film 23 in the thickness direction. The opening width of the plurality of grooves 24 is set to, for example, several μm to several tens of μm, and the pitch of the plurality of grooves 24 is set to, for example, several tens of μm to several hundreds of μm. In FIG. 2, in order to easily show the direction in which the plurality of grooves 24 extend (i.e., the longitudinal direction of the grooves 24), the grooves 24 are drawn thicker and with a wider pitch than the actual one. In addition, in this embodiment, the specified wiring pattern is described as being striped, but this is not limited thereto, and the wiring pattern only needs to have a portion in which a plurality of grooves extend in parallel, and various shapes such as a lattice shape, a hatching shape, a cross-hatching shape, etc. can be adopted.
In the following description, the surface of the dense film 23 of the capture member 20 facing the supply port 11 is referred to as the "capture surface 25 of the capture member 20," the multiple grooves 24 provided in the dense film 23 are referred to as the "grooves 24 of the capture member 20," and the portion of the dense film 23 excluding the grooves 24 is referred to as the "mask portion 26."

As shown in FIG. 1, the supply passage 10 has the above-mentioned supply port 11, an expansion section 12 in which the flow passage area gradually expands from the supply port 11 toward the downstream side, and an inclined section 13 provided downstream of the expansion section 12. The inclined section 13 is configured so that the flow direction of the gas from the supply port 11 toward the collection member 20 is oblique or parallel to the longitudinal direction of the groove 24 of the collection member 20.

As shown in FIG. 1, the center 111 of the supply port 11 is shifted to one side of the longitudinal direction of the groove 24 of the collection member 20 with respect to the imaginary line VL that includes the center of the collection surface 25 of the collection member 20 and is perpendicular to the collection surface 25. Note that FIG. 2 is a cross-sectional view of line II-II in FIG. 1, but the position of the supply port 11 is indicated by a two-dot chain line. In detail, the center 111 of the supply port 11 is shifted to one side of the longitudinal direction of the groove 24 of the collection member 20 from the outer edge 27 of the collection member 20. Therefore, the flow path center line CL of the inclined portion 13 is inclined to one side of the longitudinal direction of the groove 24 of the collection member 20 with respect to the imaginary line VL shown in FIG. 1. As a result, the flow direction of the gas in the inclined portion 13 is oblique or parallel to the longitudinal direction of the groove 24 of the collection member 20.

Specifically, as shown in FIG. 1, the inclined portion 13 is configured so that the elevation angle θ1 of the gas flow velocity vector relative to the collection surface 25 is less than 90° and is in the range of 0° or more in the vicinity directly above the collection surface 25 of the collection member 20. It is more preferable that the inclined portion 13 is configured so that the elevation angle θ1 of the gas flow velocity vector relative to the collection surface 25 is in the range of 25° or less to 0° or more in the vicinity directly above the collection surface 25 of the collection member 20. This makes it possible to increase the degree of orientation of the CNTs captured in the groove 24 of the collection member 20 in the longitudinal direction of the groove 24. The vicinity directly above the collection surface 25 of the collection member 20 is set, for example, at a position about 1 mm away from the collection surface 25 of the collection member 20 toward the supply port 11.

2, the inclined portion 13 is configured so that the angle of incidence θ2 of the gas flow velocity vector with respect to the longitudinal direction of the groove 24 of the capture member 20 is in the range of less than 90° and greater than −90° in a plan view immediately above the capture surface 25 of the capture member 20. It is more preferable that the angle of incidence θ2 of the gas flow velocity vector with respect to the longitudinal direction of the groove 24 of the capture member 20 is in the range of 15° or less to −15° or more in a plan view immediately above the capture surface 25 of the capture member 20. This makes it possible to increase the degree of orientation of the CNTs captured in the groove 24 of the capture member 20 with respect to the longitudinal direction of the groove 24. In this specification, the plan view refers to the state in which the capture surface 25 is viewed from the supply port 11 side perpendicular to the capture surface 25.

Specifically, in the manufacturing apparatus 1 of the first embodiment, the inclined portion 13 is configured so that its flow path center line CL has an elevation angle θ1 in the range of 25° or less to 0° or more with respect to the collection surface 25 of the collection member 20. Also, in the manufacturing apparatus 1 of the first embodiment, the inclined portion 13 is configured so that its flow path center line CL is substantially parallel to an imaginary plane VS that is perpendicular to the collection surface 25 of the collection member 20 and parallel to the longitudinal direction of the groove 24. Note that "substantially parallel" includes not only the state in which the flow path center line CL of the inclined portion 13 and the imaginary plane VS are parallel, but also a positional deviation of a predetermined range (e.g., about ±5°) due to manufacturing tolerances, etc.

Next, a method for manufacturing a transparent conductive film using the manufacturing apparatus 1 of the first embodiment will be described with reference to the flowchart in FIG. 3.

First, in step S10, the collection member 20 having the above-mentioned porous membrane 22 and dense membrane 23 is prepared.
Next, in step S20, the capture member 20 is placed on the support part 21 of the manufacturing apparatus 1. At this time, the capture member 20 is placed on the support part 21 in an orientation such that the supply port 11 of the supply passage 10 is on one side of the groove 24 of the capture member 20 in the longitudinal direction.

Next, in step S30, gas containing CNT is supplied from the supply port 11 to the inside of the supply passage 10. Then, the gas containing CNT flows through the enlarged portion 12 and the inclined portion 13 and passes through the capture member 20. When the gas containing CNT passes through the capture member 20, the CNT contained in the gas is captured by the capture member 20. In this embodiment, the flow direction of the gas from the supply port 11 toward the capture member 20 in the inclined portion 13 is oblique or parallel to the longitudinal direction of the groove 24 of the capture member 20, so that the CNT captured in the groove 24 of the capture member 20 has a high degree of orientation with respect to the longitudinal direction of the groove 24.

Next, in step S40, after a predetermined time has elapsed since the start of the supply of the gas containing CNTs, the capture member 20 is removed from the support portion 21.
Next, in step S50, a transparent substrate (not shown) is placed on the surface of the trapping member 20 facing the dense film 23 on which the CNTs have been trapped, and the transparent substrate is pressed against the trapping member 20. Note that the transparent substrate may be a resin material such as PET (polyethylene terephthalate) or an inorganic material such as quartz glass. Thereafter, the trapping member 20 is removed from the transparent substrate, whereby the CNTs are transferred to the transparent substrate. As a result, a wiring pattern made of CNTs is formed on one surface of the transparent substrate.

Next, in step S60, the transparent substrate on which the CNT wiring pattern has been formed is dipped into a solution containing a dopant substance, or the transparent substrate is coated with a solution containing a dopant substance and then dried to complete the transparent conductive film.

Next, the relationship between the degree of orientation of CNTs in the transparent conductive film and the electrical resistance value will be explained while comparing the transparent conductive film manufacturing apparatus 100 of the comparative example with the transparent conductive film manufacturing apparatus 1 of the first embodiment.

As shown in FIG. 4, in the comparative transparent conductive film manufacturing apparatus 100, the supply passage 10 has a supply port 11 and an enlarged portion 12, but does not have an inclined portion 13. The center 111 of the supply port 11 is located on an imaginary line VL that includes the center of the collection surface 25 of the collection member 20 and is perpendicular to the collection surface 25. Therefore, in the comparative manufacturing apparatus 100, the flow direction of the gas flowing through the enlarged portion 12 from the supply port 11 toward the collection member 20 is approximately perpendicular to the collection surface 25 of the collection member 20.

Figure 5A shows a plan view of the vicinity of the capture surface 25 of the capture member 20 in the comparative manufacturing apparatus 100. Figure 5A shows the direction of the airflow flowing into the groove 24 from the vicinity of the vicinity of the mask portion 26 and the CNTs moving along with the airflow. In the comparative manufacturing apparatus 100, the airflow from the mask portion 26 toward the groove 24 flows into the groove 24 from a direction perpendicular to the longitudinal direction of the groove 24 and passes through the porous membrane 22 exposed in the groove 24. At this time, the CNTs moving along with the airflow enter the groove 24 from a direction perpendicular to the longitudinal direction of the groove 24 like the airflow, and are captured by the porous membrane 22 exposed in the groove 24. Therefore, in the comparative manufacturing apparatus 100, the orientation of the CNTs captured by the porous membrane 22 exposed in the groove 24 of the capture member 20 is random.

In contrast, Figure 5B shows a plan view of the vicinity directly above the collection surface 25 of the collection member 20 in the manufacturing apparatus 1 of the first embodiment. Figure 5B also shows the direction of the airflow flowing into the groove 24 from the vicinity directly above the mask portion 26, and the CNTs moving along with the airflow. In the manufacturing apparatus 1 of the first embodiment, the airflow from the mask portion 26 toward the groove 24 flows into the groove 24 at an angle to the longitudinal direction of the groove 24 and passes through the porous membrane 22 exposed in the groove 24. At this time, the CNTs moving along with the airflow enter the groove 24 at an angle to the longitudinal direction of the groove 24, just like the airflow, and are collected by the porous membrane 22 exposed in the groove 24. Therefore, in the manufacturing device 1 of the first embodiment, the orientation of the CNTs captured in the porous membrane 22 exposed in the groove 24 of the capture member 20 is relatively aligned in the longitudinal direction of the groove 24 (i.e., the degree of orientation of the CNTs is higher than in the comparative example).

Figure 6A is a schematic diagram of CNTs constituting the wiring pattern of a transparent conductive film onto which CNTs collected by the comparative manufacturing apparatus 100 have been transferred. As shown in Figure 6A, when the comparative manufacturing apparatus 100 is used, the orientation of the CNTs constituting the wiring pattern of the transparent conductive film becomes random. As a result, this transparent conductive film has a problem in that the number of contact points between the CNTs constituting the wiring pattern increases, increasing the contact resistance and resulting in a high electrical resistance value.

In contrast, FIG. 6B is a schematic diagram showing CNTs constituting the wiring pattern of a transparent conductive film onto which CNTs collected by the manufacturing apparatus 1 of the first embodiment have been transferred. As shown in FIG. 6B, when the manufacturing apparatus 1 of the first embodiment is used, the orientation of the CNTs constituting the wiring pattern of the transparent conductive film is relatively aligned in the longitudinal direction of the wiring pattern. Therefore, this transparent conductive film has a small number of contact points between the CNTs constituting the wiring pattern, which reduces the contact resistance and allows for a lower electrical resistance value.

Figure 7 is an explanatory diagram for explaining how CNTs are captured in the grooves 24 of the capture member 20 when a gas containing CNTs is supplied from one side of the longitudinal direction of the grooves 24, as in the manufacturing apparatus 1 of the first embodiment. Note that, like Figure 5B, Figure 7 also shows a plan view of the area directly above the capture surface 25 of the capture member 20.

The dashed lines F1 to F8 in Fig. 7 show the airflow flowing into the groove 24 from immediately above the mask portion 26. As shown by the dashed lines F1 to F8, the angle of incidence of the airflow flowing into the groove 24 from a location far from the groove 24 is larger with respect to the longitudinal direction of the groove 24 than the angle of incidence of the airflow flowing into the groove 24 from a location close to the groove 24. Therefore, the angle of the CNTs that move following the airflow flowing into the groove 24 from a location far from the groove 24 will be larger with respect to the longitudinal direction of the groove 24 when collected in the groove 24 than the CNTs that move following the airflow flowing into the groove 24 from a location close to the groove 24. Conversely, CNTs that move following the air current flowing into the groove 24 from a location close to the groove 24 will have a smaller angle with respect to the longitudinal direction of the groove 24 when captured in the groove 24, compared to CNTs that move following the air current flowing into the groove 24 from a location far from the groove 24. For this reason, by making the pitch of the multiple grooves 24 of the capture member 20 as narrow as possible, it is possible to increase the air current flowing into the groove 24 from a location close to the groove 24 and increase the degree of orientation of the CNTs captured in the groove 24.

Here, a method for calculating the degree of orientation of CNTs will be described with reference to FIG.
First, a scanning electron microscope is used to observe the state of the film of the wiring pattern composed of CNTs, and image analysis is performed. Specifically, the image obtained by the scanning electron microscope is binarized and Fourier transformed to create a power spectrum graph as shown in Figure 8. Then, the half-width W of the graph is used to calculate the degree of orientation from the following formula (1).

FIG. 9 is a graph showing the results of an experiment conducted by the inventors regarding the relationship between the degree of orientation of CNTs constituting the wiring pattern of a transparent conductive film and the rate of decrease in electrical resistance of the transparent conductive film.
9, it can be seen that by increasing the degree of orientation from about 7% (i.e., non-orientation) to about 24%, the resistance reduction rate of the transparent conductive film becomes 20% or more. Therefore, the transparent conductive film manufactured using the manufacturing apparatus 1 of the first embodiment can reduce the electrical resistance value by increasing the degree of orientation of the CNTs that make up the wiring pattern.

The transparent conductive film manufacturing apparatus 1 and manufacturing method according to the first embodiment described above have the following effects.

(1) In the transparent conductive film manufacturing apparatus 1, the inclined portion 13 of the supply passage 10 is configured so that the flow direction of the gas from the supply port 11 toward the collection member 20 is oblique or parallel to the longitudinal direction of the groove 24 of the collection member 20.
According to this, the CNTs contained in the gas flow with their orientation aligned in the gas flow direction. Therefore, by providing the inclined portion 13 in the supply passage 10, it is possible to increase the degree of orientation of the CNTs captured in the grooves 24 of the capturing member 20. Therefore, in a transparent conductive film obtained by transferring the CNTs captured by the capturing member 20 to a transparent substrate such as a transparent film, the number of contact points between the CNTs constituting the wiring pattern is reduced, and the contact resistance is reduced, so that the electrical resistance value can be reduced.

(2) In the transparent conductive film manufacturing apparatus 1, the center 111 of the supply port 11 is shifted to one side in the longitudinal direction of the groove 24 of the collection member 20 with respect to an imaginary line VL that includes the center of the collection surface 25 of the collection member 20 and is perpendicular to the collection surface 25.
This makes it possible to make the gas flow direction in the supply passage 10 oblique or parallel to the longitudinal direction of the groove 24 of the collection member 20 .

(3) In the transparent conductive film manufacturing apparatus 1, the inclined portion 13 is configured so that, in the vicinity of directly above the collection surface 25 of the collection member 20, the elevation angle θ1 of the gas flow velocity vector relative to the collection surface 25 is less than 90° and is greater than or equal to 0°.
This can increase the degree of orientation of CNTs captured in grooves 24 of collection member 20. In the vicinity directly above collection surface 25 of collection member 20, the elevation angle θ1 of the gas flow velocity vector with respect to collection surface 25 is more preferably in the range of 25° or less to 0° or more.

(4) In the transparent conductive film manufacturing apparatus, the inclined portion is configured so that, in a planar view near directly above the collection surface of the collection member, the incident angle of the gas flow velocity vector with respect to the longitudinal direction of the groove of the collection member is in a range of less than 90° and greater than −90°.
This can increase the degree of orientation of the CNTs captured in the grooves of the collection member. In a plan view of the vicinity directly above the capturing surface of the collection member, the incident angle of the gas flow velocity vector with respect to the longitudinal direction of the grooves of the collection member is more preferably in the range of 15° or less to −15° or more.

(5) According to the method for manufacturing a transparent conductive film according to the first embodiment, the flow direction of the gas flowing through the inclined portion 13 can be made oblique or parallel to the longitudinal direction of the grooves 24 of the collection member 20, thereby increasing the degree of orientation of the CNTs captured in the grooves 24 of the collection member 20. Therefore, a transparent conductive film in which the CNTs captured by the collection member 20 are transferred to a transparent substrate such as a transparent film has fewer contact points between the CNTs that make up the wiring pattern, reducing the contact resistance, and thus reducing the electrical resistance value.

Second Embodiment
Next, a transparent conductive film manufacturing apparatus 1 and a manufacturing method according to a second embodiment will be described with reference to the drawings.

As shown in FIGS. 10 and 11, the manufacturing apparatus 1 of the second embodiment includes a supply passage 10, a support portion 21, a guide plate 14, an exhaust passage 30, a partition plate 31, a flow control valve 32, a collecting space 33, and the like.
In Fig. 10, the reference numerals of the multiple partition plates 31 shown in cross section are suffixed with the letters a to c. Also, Fig. 11 is a cross section taken along line XI-XI in Fig. 10, but omits the guide plate 14. Also, in Fig. 11, the positions of the ends of the multiple partition plates 31 arranged downstream of the collection member 20 on the side of the collection member 20 are shown by dashed lines or dashed dotted lines labeled with the reference numerals 31a to 31d. In the following description, for convenience of explanation, the reference numerals of the multiple partition plates 31 may be suffixed with the letters a to d.

In the manufacturing device 1 of the second embodiment, the configuration of the supply passage 10, the support portion 21, and the collection member 20 supported by the support portion 21 is the same as that described in the first embodiment, so the description is omitted.

As shown in FIG. 10, a plurality of guide plates 14 are provided inside the supply passage 10. The guide plates 14 are configured to make the flow direction of gas from the supply port 11 toward the collection member 20 oblique or parallel to the longitudinal direction of the groove 24 of the collection member 20. In addition, a predetermined gap S1 is provided between the end of the guide plate 14 on the collection member 20 side and the collection surface 25 of the collection member 20. The predetermined gap S1 is set to, for example, 1 mm or more.

The guide plate 14 is also configured to be changeable to any angle, including parallel to the flow path center line CL of the inclined portion 13. Specifically, as shown by the dashed line 141 in FIG. 10, the guide plate 14 can be changed to any angle around a rotation axis (not shown) provided near the end of the guide plate 14 on the side of the collection member 20. The guide plate 14 is also provided so as to be substantially perpendicular to an imaginary plane VS (see FIG. 11) that is perpendicular to the collection surface 25 of the collection member 20 and parallel to the longitudinal direction of the groove 24. Note that "substantially perpendicular" includes not only the state in which the guide plate 14 and the imaginary plane VS are perpendicular, but also a positional deviation within a predetermined range (e.g., about ±5°) due to manufacturing tolerances, etc.

The guide plate 14 is configured so that the elevation angle θ1 of the gas flow velocity vector relative to the capture surface 25 of the capture member 20 in the vicinity directly above the capture surface 25 is less than 90° and is in the range of 0° or more. It is more preferable that the guide plate 14 is configured so that the elevation angle θ1 of the gas flow velocity vector relative to the capture surface 25 in the vicinity directly above the capture surface 25 of the capture member 20 is in the range of 25° or less to 0° or more. Specifically, in the second embodiment, the guide plate 14 is configured so that the elevation angle θ1 relative to the capture surface 25 of the capture member 20 is in the range of 25° or less to 0° or more.

The exhaust passage 30 is provided on the opposite side of the collection member 20 from the supply passage 10 (i.e., downstream of the collection member 20), and is a passage for discharging gas that has passed through the collection member 20. A plurality of partition plates 31 are provided in the exhaust passage 30. Therefore, a plurality of exhaust passages 30 separated by the plurality of partition plates 31 are formed downstream of the collection member 20.

The partitions 31 are arranged substantially parallel to the flow path center line CL of the inclined portion 13. Note that "substantially parallel" includes not only the state in which the flow path center line CL of the inclined portion 13 and the partitions 31 are parallel, but also includes a positional deviation of a predetermined range (for example, about ±5°) due to manufacturing tolerances, etc. The partitions 31a to 31c shown in the cross-sectional view of FIG. 10 are configured to be substantially perpendicular to a virtual plane VS (see FIG. 11) that is perpendicular to the collection surface 25 of the collection member 20 and parallel to the longitudinal direction of the groove 24. Note that "substantially perpendicular" includes not only the state in which the partitions 31a to 31c and the virtual plane VS are perpendicular, but also includes a positional deviation of a predetermined range (for example, about ±5°) due to manufacturing tolerances, etc. The partitions 31 may include those arranged to be substantially parallel to the virtual plane VS, such as the partition 31d shown by the dashed line in FIG. 11. In addition, the partition plate 31d shown by the dashed line in FIG. 11 is denoted by the reference symbol 31d in FIG. 10 at the end of the partition plate 31d on the side of the collection member 20.

As shown in FIG. 10, the length L1 of the portion of the partition plates 31a to 31c that is substantially parallel to the flow path center line CL of the inclined portion 13 is set to, for example, 150 mm or more. In addition, a predetermined gap S2 is provided between the end of the partition plates 31a to 31d that is on the collection member 20 side and the downstream surface of the collection member 20. The predetermined gap S2 is set to, for example, 1 mm or more.

As described above, in FIG. 11, the positions of the ends of the partition plate 31 arranged downstream of the collection member 20 on the side of the collection member 20 are indicated by dashed or dashed lines marked with the reference characters 31a to 31d. The areas divided by these dashed and dashed lines are referred to as divided areas. In the second embodiment, eight divided areas are formed. The multiple exhaust passages 30 shown in FIG. 10 are provided for each of the divided areas obtained by dividing the collection member 20 into multiple areas.

A collection space 33 is provided downstream of the multiple exhaust passages 30 to collect the gas that has flowed through each of the multiple exhaust passages 30. A fan (not shown) may be provided downstream of the collection space 33. In this case, negative pressure is generated in the collection space 33 and the multiple exhaust passages 30 by driving the fan. At that time, the collection space 33 can equalize the negative pressure in the multiple exhaust passages 30.

In addition, multiple flow control valves 32 are provided in the multiple exhaust passages 30 to control the flow rate of gas flowing through each exhaust passage 30. The flow rate of gas flowing through the multiple exhaust passages 30 can be controlled by adjusting the opening degree of the multiple flow control valves 32.

Next, a method for manufacturing a transparent conductive film using the manufacturing apparatus 1 of the second embodiment will be described with reference to the flowchart in FIG. 12.

First, in step S10, the collection member 20 having the porous membrane 22 and the dense membrane 23 is prepared.
Next, in step S20, the capture member 20 is placed on the support part 21 of the manufacturing apparatus 1. At this time, the capture member 20 is placed on the support part 21 in an orientation such that the supply port 11 of the supply passage 10 is on one side of the groove 24 of the capture member 20 in the longitudinal direction.

Next, in step S25, the angle of the guide plate 14 provided inside the supply passage 10 is adjusted. The guide plate 14 is adjusted so that the elevation angle θ1 of the flow velocity vector of the gas flowing from the inclined portion 13 to the collection member 20 becomes an appropriate angle. At this time, the opening degree of the flow control valve 32 provided in each exhaust passage 30 may also be adjusted.

Next, in step S30, gas containing CNT is supplied from the supply port 11 to the inside of the supply passage 10. The gas containing CNT then flows along the guide plate 14 at the inclined portion 13 and passes through the capture member 20. As the gas containing CNT passes through the capture member 20, the CNT contained in the gas is captured by the capture member 20.

Next, in step S35, the gas that has passed through the capture member 20 is discharged via multiple exhaust passages 30. Note that steps S30 and S35 are performed simultaneously. In the second embodiment, by discharging the gas that has passed through the capture member 20 via multiple exhaust passages 30, it is possible to improve the in-plane uniformity of the amount of CNT captured on the capture surface 25 of the capture member 20.

Next, in step S40, after a predetermined time has elapsed since the start of the supply of the gas containing CNTs, the capture member 20 is removed from the support portion 21.
Next, in step S50, a transparent substrate (not shown) is placed on the surface of the capturing member 20 facing the dense film 23 on which the CNTs have been captured, and the transparent substrate is pressed against the capturing member 20. Thereafter, the capturing member 20 is removed from the transparent substrate, whereby the CNTs are transferred to the transparent substrate. As a result, a wiring pattern made of CNTs is formed on one surface of the transparent substrate.

Next, in step S60, the transparent substrate on which the CNT wiring pattern has been formed is dipped into a solution containing a dopant substance, or the transparent substrate is coated with a solution containing a dopant substance and then dried to complete the transparent conductive film.

The transparent conductive film manufacturing apparatus 1 and manufacturing method according to the second embodiment described above have the following effects.

(1) The transparent conductive film manufacturing apparatus 1 is provided with a guide plate 14 on the inside of the inclined portion 13. The guide plate 14 can make the flow direction of the gas from the supply port 11 toward the collection member 20 oblique or parallel to the longitudinal direction of the grooves 24 of the dense film 23.
This allows the gas flow direction to be controlled by guide plate 14, increasing the degree of orientation of CNTs captured in grooves 24 of capturing member 20, and improving the in-plane uniformity of the orientation of CNTs on capturing surface 25 of capturing member 20. Therefore, a transparent conductive film formed by transferring CNTs captured by this capturing member 20 to a transparent substrate such as a transparent film can have a reduced electrical resistance.

(2) In the transparent conductive film manufacturing apparatus 1, the guide plate 14 is arranged so that the elevation angle θ1 with respect to the capturing surface 25 of the capturing member 20 is in the range of less than 90° and greater than or equal to 0°, and is arranged at a distance of 1 mm or more from the capturing surface 25 of the capturing member 20.
This can increase the degree of orientation of CNTs captured in grooves 24 of collection member 20. In the vicinity directly above collection surface 25 of collection member 20, the elevation angle θ1 of the gas flow velocity vector with respect to collection surface 25 is more preferably in the range of 25° or less to 0° or more.
Furthermore, by setting the distance between guide plate 14 and collection surface 25 to 1 mm or more, gas can also be caused to flow through the portion of collection surface 25 that corresponds to the lower end of guide plate 14, allowing CNTs to be collected.

(3) In the transparent conductive film manufacturing apparatus 1, the guide plate 14 is configured so as to be changeable to any angle, including parallel, with respect to the flow channel center line CL of the inclined portion 13.
This makes it possible to adjust the direction of the gas flowing through inclined portion 13. As a result, it is possible to increase the degree of orientation of CNTs captured in grooves 24 of capturing member 20 and improve the in-plane uniformity of the orientation of CNTs on capturing surface 25 of capturing member 20.

(4) The transparent conductive film manufacturing apparatus 1 includes a plurality of exhaust passages 30 downstream of the collection member 20. The plurality of exhaust passages 30 are provided for each of the divided regions obtained by dividing the collection surface 25 of the collection member 20 into a plurality of regions.
This makes it possible to improve the in-plane uniformity of the amount of CNT captured on capturing surface 25 of capturing member 20. Therefore, a transparent conductive film obtained by transferring CNTs captured by capturing member 20 to a transparent substrate such as a transparent film has reduced variation in the amount of CNT that constitutes the wiring pattern, and can reduce the electrical resistance value.

(5) The transparent conductive film manufacturing apparatus 1 includes a flow control valve 32 in each exhaust passage 30 .
According to this, by controlling the flow rate of gas flowing through each exhaust passage 30 with the flow control valve 32, it is possible to improve the in-plane uniformity of the amount of CNTs captured on the capturing surface 25 of the capturing member 20.

(6) The transparent conductive film manufacturing apparatus 1 includes a collection space 33 downstream of the exhaust passages 30 for collecting the gases that have flowed through the exhaust passages 30 .
According to this, when a fan is provided downstream of the collection space 33, it becomes possible to equalize the negative pressure in the multiple exhaust passages 30, and the in-plane uniformity of the amount of CNT captured on the capturing surface 25 of the capturing member 20 can be improved.

(7) The transparent conductive film manufacturing apparatus 1 includes a partition plate 31 provided between the plurality of exhaust passages 30. The partition plate 31 is provided substantially parallel to the flow path center line CL of the inclined portion 13 and is provided at a distance of 1 mm or more from the collection member 20.
This makes it possible to make the flow direction of gas passing from supply passage 10 through collection member 20 and flowing through multiple exhaust passages 30 oblique or parallel to the longitudinal direction of grooves 24 of collection member 20. As a result, it is possible to increase the degree of orientation of CNTs captured in grooves 24 of collection member 20 and improve the in-plane uniformity of the orientation of CNTs on collection surface 25 of collection member 20.
Furthermore, by providing a distance of 1 mm or more between the collection member 20 and the partition plate 31, it is possible to cause gas to flow also at a portion of the collection surface 25 that corresponds to the upper end of the partition plate 31, thereby allowing CNTs to be collected.

(8) In the transparent conductive film manufacturing apparatus 1, the length L1 of the portion of the partition plate 31 that is provided substantially parallel to the flow path center line CL of the inclined portion 13 is set to, for example, 150 mm or more.
This makes it possible to make the flow direction of gas passing from supply passage 10 through collection member 20 and flowing through multiple exhaust passages 30 oblique or parallel to the longitudinal direction of grooves 24 of collection member 20. As a result, it is possible to increase the degree of orientation of CNTs captured in grooves 24 of collection member 20 and improve the in-plane uniformity of the orientation of CNTs on collection surface 25 of collection member 20.

(9) According to the method for manufacturing a transparent conductive film according to the second embodiment, by flowing a gas containing CNTs along the guide plate 14 toward the collection member 20, it is possible to increase the degree of orientation of the CNTs captured in the grooves 24 of the collection member 20 and improve the in-plane uniformity of the orientation of the CNTs on the collection surface 25 of the collection member 20. Therefore, the transparent conductive film in which the CNTs captured by the collection member 20 are transferred to a transparent substrate such as a transparent film can have a reduced electrical resistance.

(10) Furthermore, according to the method for manufacturing a transparent conductive film according to the second embodiment, the gas that has passed through the collection member 20 is exhausted from a plurality of exhaust passages 30, thereby improving the in-plane uniformity of the amount of CNTs captured on the collection surface 25 of the collection member 20. Therefore, a transparent conductive film in which the CNTs captured by the collection member 20 are transferred to a transparent substrate such as a transparent film has reduced variation in the amount of CNTs that make up the wiring pattern, and can have a lower electrical resistance value.

Other Embodiments
The present invention is not limited to the above-described embodiments, and can be modified as appropriate within the scope of the claims. Furthermore, the above-described embodiments and comparative examples are not unrelated to each other, and can be appropriately combined, except in cases where the combination is clearly impossible.

It goes without saying that in each of the above embodiments, the elements constituting the embodiment are not necessarily essential, except in cases where it is specifically stated that they are essential or where they are clearly considered essential in principle.

In addition, in each of the above embodiments, when the numbers, values, quantities, ranges, etc. of the components of the embodiment are mentioned, they are not limited to the specific numbers, except when it is expressly stated that they are essential or when they are clearly limited in principle to a specific number.

In addition, in each of the above embodiments, when referring to the shape, positional relationship, etc. of components, etc., they are not limited to those shapes, positional relationships, etc., unless specifically stated otherwise or in principle limited to a specific shape, positional relationship, etc.

For example, in the second embodiment, multiple guide plates 14 are arranged inside the supply passage 10, but this is not limiting, and there may be only one guide plate 14. Alternatively, a guide plate 14 may be provided in the supply passage 10 of the manufacturing device 1 described in the first embodiment or comparative example. Alternatively, the guide plate 14 may be removed from the manufacturing device 1 described in the second embodiment.

For example, in the second embodiment, multiple exhaust passages 30 are provided downstream of the collection member 20, but this is not limiting, and the exhaust passage 30 may be a single passage. Alternatively, one or multiple exhaust passages 30 may be provided in the manufacturing apparatus 1 described in the first embodiment or comparative example. Alternatively, the exhaust passage 30 may be removed from the manufacturing apparatus 1 described in the second embodiment.

Reference Signs List 1 Transparent conductive film manufacturing apparatus 10 Supply passage 11 Supply port 13 Inclined portion 20 Collection member 21 Support portion 22 Porous film 23 Dense film 24 Groove

Claims (17)

In a transparent conductive film manufacturing device,
a supply passage (10) having a supply port (11) through which a gas containing carbon nanotubes is supplied and constituting a flow path through which the gas containing carbon nanotubes supplied from the supply port flows;
a support part (21) that supports, on the downstream side of the supply passage, a collection member (20) having a porous membrane (22) that collects carbon nanotubes contained in the gas, and a dense membrane (23) in which grooves (24) for forming a wiring pattern made of carbon nanotubes are provided on the surface of the porous membrane on the supply port side,
The supply passage has an inclined portion (13) configured so that the flow direction of gas from the supply port toward the collection member is oblique or parallel to the longitudinal direction of the grooves of the dense film. The transparent conductive film manufacturing device according to claim 1, wherein the center (111) of the supply port is shifted to one side in the longitudinal direction of the groove of the dense film with respect to an imaginary line (VL) that includes the center of the collection surface (25) on the supply port side of the collection member and is perpendicular to the collection surface. The transparent conductive film manufacturing device according to claim 1 or 2, wherein the inclined portion is configured such that the elevation angle (θ1) of the gas flow velocity vector with respect to the collection surface is less than 90° and is in the range of 0° or more in the vicinity directly above the collection surface on the supply port side of the collection member. The transparent conductive film manufacturing device according to any one of claims 1 to 3, wherein the inclined portion is configured such that the angle of incidence (θ2) of the gas flow velocity vector with respect to the longitudinal direction of the grooves of the dense film is in the range of less than 90° and greater than -90° in a plan view of the vicinity directly above the collection surface of the collection member on the supply port side. The transparent conductive film manufacturing device according to any one of claims 1 to 4, further comprising a guide plate (14) provided on the inclined portion, which makes the flow direction of the gas from the supply port toward the collection member oblique or parallel to the longitudinal direction of the grooves of the dense film. The transparent conductive film manufacturing apparatus according to claim 5, wherein the guide plate is arranged so that the elevation angle with respect to the collection surface of the collection member on the supply port side is less than 90° and is in the range of 0° or more, and a gap of 1 mm or more is provided between the end of the guide plate on the collection member side and the collection member. The transparent conductive film manufacturing device according to claim 5 or 6, wherein the guide plate is configured to be changeable to any angle, including parallel, with respect to the flow channel center line (CL) of the inclined portion. a plurality of exhaust passages (30) provided on the opposite side of the collection member from the supply passage and discharging gas that has passed through the collection member;
8. The transparent conductive film manufacturing apparatus according to claim 1, wherein the exhaust passages are provided for each of a plurality of divided regions obtained by dividing the collection member into a plurality of regions. The transparent conductive film manufacturing apparatus according to claim 8, further comprising a flow control valve (32) in each of the exhaust passages that can adjust the flow rate of the gas flowing through each of the exhaust passages. The transparent conductive film manufacturing apparatus according to claim 8 or 9, further comprising a collection space (33) downstream of the exhaust passages for collecting gases that have flowed through the exhaust passages. A partition plate (31) is provided between the plurality of exhaust passages,
11. The transparent conductive film manufacturing apparatus according to claim 8, wherein the partition plate is disposed substantially parallel to a center line of the flow path of the inclined portion, and a gap of 1 mm or more is provided between the end of the partition plate facing the collection member and the collection member. The transparent conductive film manufacturing apparatus according to claim 11, wherein the portion of the partition plate that is substantially parallel to the center line of the flow channel of the inclined portion has a length of 150 mm or more. In a transparent conductive film manufacturing device,
a supply passage (10) having a supply port (11) through which a gas containing carbon nanotubes is supplied and constituting a flow path through which the gas containing carbon nanotubes supplied from the supply port flows;
a support section (21) for supporting, on the downstream side of the supply passage, a collection member (20) having a porous membrane (22) for collecting carbon nanotubes contained in the gas, and a dense membrane (23) having grooves (24) for forming a wiring pattern made of carbon nanotubes on the surface of the porous membrane facing the supply port;
a guide plate (14) provided inside the supply passage for making the flow direction of gas from the supply port toward the collection member oblique or parallel to the longitudinal direction of the grooves in the dense film. In a transparent conductive film manufacturing device,
a supply passage (10) having a supply port through which a gas containing carbon nanotubes is supplied and constituting a flow path through which the gas containing carbon nanotubes supplied from the supply port flows;
a support section (21) for supporting, on the downstream side of the supply passage, a collection member (20) having a porous membrane (22) for collecting carbon nanotubes contained in the gas, and a dense membrane (23) having grooves (24) for forming a wiring pattern made of carbon nanotubes on the surface of the porous membrane facing the supply port;
a plurality of exhaust passages (30) provided on the opposite side of the collection member from the supply passage and configured to discharge gas that has passed through the collection member;
The apparatus for manufacturing a transparent conductive film, wherein the exhaust passages are provided for each of a plurality of divided regions obtained by dividing the collection member into a plurality of regions. In the method for producing a transparent conductive film,
A collection member (20) is prepared (S10) having a porous film (22) for collecting carbon nanotubes contained in a gas and a dense film (23) provided with grooves (24) for forming a wiring pattern using carbon nanotubes;
The collection member is placed (S20) on a support (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing carbon nanotubes is supplied;
supplying a gas containing carbon nanotubes from the supply port to an inclined portion (13) configured such that a flow direction of the gas from the supply port toward the collection member is oblique or parallel to a longitudinal direction of the groove of the dense film (S30);
The method for producing a transparent conductive film includes transferring the carbon nanotubes collected by the collecting member onto a transparent substrate to form a transparent conductive film (S50). In the method for producing a transparent conductive film,
A collection member (20) is prepared (S10) having a porous film (22) for collecting carbon nanotubes contained in a gas and a dense film (23) provided with grooves (24) for forming a wiring pattern using carbon nanotubes;
The collection member is placed (S20) on a support (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing carbon nanotubes is supplied;
supplying a gas containing carbon nanotubes from the supply port along a guide plate (14) provided in the supply passage so that an incident angle of the gas on the collection surface of the collection member on the supply port side is parallel or oblique with respect to a longitudinal direction of the groove of the dense film (S30);
The method for producing a transparent conductive film includes transferring the carbon nanotubes collected by the collecting member onto a transparent substrate to form a transparent conductive film (S50). In the method for producing a transparent conductive film,
A collection member (20) is prepared (S10) having a porous film (22) for collecting carbon nanotubes contained in a gas and a dense film (23) provided with grooves (24) for forming a wiring pattern using carbon nanotubes;
The collection member is placed (S20) on a support (21) provided downstream of a supply passage (10) having a supply port (11) through which a gas containing carbon nanotubes is supplied;
Supplying a gas containing carbon nanotubes from the supply port (S30);
discharging the gas that has passed through the trapping member from a plurality of exhaust passages (30) provided on the opposite side of the trapping member to the supply passage for each of the divided regions obtained by dividing the trapping member into a plurality of regions (S35);
The method for producing a transparent conductive film includes transferring the carbon nanotubes collected by the collecting member onto a transparent substrate to form a transparent conductive film (S50).

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