JP7507416B2 - Work line management device, work line management method, and electronic circuit board manufacturing system - Google Patents

Description

The present invention relates to a work line management device and a work line management method for managing a work line that manufactures electronic circuit boards, and an electronic circuit board manufacturing system.

A production line that manufactures electronic circuit boards with components mounted on them, equipped with multiple work devices including mounting devices and inspection devices, is known to include multiple inspection devices that inspect the condition of the boards after work has been performed (for example, Patent Document 1). The production line (surface mounting line) described in Patent Document 1 is equipped with a component inspection device that detects the position of the terminals of the components after mounting, and an appearance inspection device that inspects the state of the solder after reflow and judges the quality of the solder joints from the positions of the terminals detected by the component inspection device. The component inspection device and appearance inspection device work together to identify the positions of the terminals that are buried in the solder and cannot be seen from the outside after reflow, improving the accuracy of inspecting and judging the condition of the solder joints.

JP 2015-148507 A

However, in the conventional technology including Patent Document 1, although multiple work devices (inspection devices) work together to perform a specific inspection, such as the state of solder joints, with high accuracy, there are cases where multiple other work devices on a work line perform different tasks based on the work result information of one work device, and there is also a demand for work based on the same work result information as before the reconfiguration even in a work line that has been reconfigured by adding or changing work devices according to the type and quality level of the electronic circuit boards being manufactured, leaving room for further improvement in order to flexibly share work result information between work devices on a work line.

The present invention aims to provide a work line management device, a work line management method, and an electronic circuit board manufacturing system that can flexibly coordinate work result information on a work line made up of multiple work devices.

The work line management device of the present invention is a work line management device that manages a work line composed of a plurality of work devices that perform work for manufacturing an electronic circuit board having components mounted on a board, and is equipped with an information collection unit that collects work result information transmitted from the plurality of work devices, and an information transmission unit that transmits information included in the work result information as transmission information corresponding to the transmission conditions set for each of the work devices to a work device corresponding to the transmission conditions , wherein the work result information includes information of defective parts on the board, and the transmission information includes an instruction for the work device corresponding to the transmission conditions not to determine that the defective parts are a mounting defect .

The work line management method of the present invention is a work line management method for managing a work line composed of a plurality of work devices that perform work to manufacture electronic circuit boards having components mounted on a board, and includes collecting work result information transmitted from a plurality of work devices, and based on transmission conditions set for each of the work devices, transmitting information contained in the work result information as transmission information corresponding to the transmission conditions to a work device corresponding to the transmission conditions , wherein the work result information includes information on defective parts on the board, and the transmission information includes an instruction for the work device corresponding to the transmission conditions not to determine that the defective parts are a mounting defect .

The electronic circuit board manufacturing system of the present invention is an electronic circuit board manufacturing system including a work line composed of a plurality of work devices that perform work for manufacturing an electronic circuit board having components mounted on a board, and a work line management device that manages the work line, wherein the work line management device includes an information collection unit that collects work result information transmitted from the plurality of work devices, and an information transmission unit that transmits information included in the work result information as transmission information corresponding to the transmission conditions set for each of the work devices to a work device that corresponds to the transmission conditions, wherein the work devices perform work based on the received transmission information , the work result information includes information of defective parts on the board, and the work devices that receive the transmission information do not determine that the defective parts are mounting defects .

The present invention makes it possible to flexibly link work result information on a work line made up of multiple work devices.

FIG. 1 is a configuration explanatory diagram of an electronic circuit board manufacturing system according to an embodiment of the present invention; FIG. 1 is a block diagram showing a configuration of a control system of an electronic circuit board manufacturing system according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing an example of condition setting information used in the production line management device according to the embodiment of the present invention; FIG. 13 is an explanatory diagram showing an example of a transmission condition setting screen displayed on the production line management device according to an embodiment of the present invention; 1A and 1B are explanatory diagrams showing an example of a transmission condition used in an operation line management device according to an embodiment of the present invention; FIG. 1 is a flow chart showing a method for managing a production line according to an embodiment of the present invention;

One embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation, and can be modified as appropriate depending on the specifications of the electronic circuit board manufacturing system, work line, work line management device, and work device. In the following, corresponding elements in all drawings are given the same reference numerals, and duplicate explanations will be omitted.

First, the configuration of electronic circuit board manufacturing system 1 will be described with reference to Figures 1 and 2. Electronic circuit board manufacturing system 1 includes a work line L made up of multiple work devices that perform work to manufacture electronic circuit boards with components mounted on boards, and a work line management device 3 that manages work line L. Work line L includes, in order from the upstream side in the board transport direction (left side in Figure 1), the following work devices: board supply device M1, printing device M2, solder inspection device M3, mounting devices M4 to M6, mounting inspection device M7, reflow device M8, adhesion inspection device M9, X-ray inspection device M10, electrical property inspection device M11, and board recovery device M12.

In FIG. 2, each of the operation devices M1 to M12 includes a control unit 22, a memory unit 23, an operation unit 24, a display unit 25, and a communication unit 26. The operation unit 24 has a board transport mechanism with a belt conveyor, transports boards, and performs work to manufacture electronic circuit boards on the transported boards. The control unit 22 controls the operation unit 24 to perform work to manufacture electronic circuit boards based on the work data stored in the memory unit 23 and instructions sent from the operation line management device 3. The display unit 25 is a display device such as a liquid crystal panel, and displays various data stored in the memory unit 23 as well as the operation status of the operation unit 24. The communication unit 26 is a communication interface, and transmits and receives data between the operation line management device 3 and the other operation devices M1 to M12 via the wired or wireless communication network 2.

In Figures 1 and 2, the board transport mechanism of each of the work devices M1 to M12 is connected to the board transport mechanisms of the upstream and downstream work devices M1 to M12, and transports boards in sequence from the upstream side to the downstream work devices M1 to M12. Note that the work line L is a group of work devices connected via the communication network 2, and the work devices do not need to be physically connected to each other by the board transport mechanism. Furthermore, the work line L is not limited to the above configuration. For example, the work line L does not need to include all of the work devices M1 to M12 described above, and the number of mounting devices M4 to M6 may be one, two, or four or more.

Next, referring to FIG. 1, the configuration of each of the work devices M1 to M12 that make up the work line L will be described. Board supply device M1 has the function of removing boards from a rack and supplying them to downstream equipment by controlling a supply work unit (work unit 24) including a rack that stores multiple boards using a supply control unit (control unit 22) based on board supply data (work data) stored in a supply memory unit (memory unit 23). Board supply device M1 also has a reader in the supply work unit that reads board IDs recorded on marks such as one-dimensional codes, two-dimensional codes, or RFIDs attached to boards as a supply work unit, and has the function of reading the board IDs of boards to be supplied to downstream equipment using the reader.

The printing device M2 has a function of executing a printing operation in which paste-like solder is applied (deposited) onto a board through a mask by the printing control unit (control unit 22) controlling the printing operation unit (operation unit 24) based on solder printing data (operation data) stored in the printing memory unit (memory unit 23). The printing operation unit also includes a mask cleaning unit (not shown) that performs mask cleaning to remove solder adhering to the underside of the mask as a printing operation unit. The printing device M2 performs mask cleaning every time solder is applied to a predetermined number of boards, and also performs mask cleaning according to instructions sent from the work line management device 3. Note that the device that applies solder to the board is not limited to the printing device M2, and may be, for example, a solder applicator.

In FIG. 1, the solder inspection device M3 has a function of performing a solder inspection operation in which the solder deposition state and the like are inspected by imaging the surface of the board after solder has been deposited, by controlling a solder inspection work unit (work unit 24) including a solder inspection camera that images the surface of the board, based on solder inspection data (work data) stored in a solder inspection memory unit (memory unit 23) with a solder inspection control unit (control unit 22). The mounting devices M4 to M6 have a function of performing a component mounting operation in which components are mounted on the deposited solder, by controlling a mounting work unit (work unit 24) with a mounting control unit (control unit 22) based on mounting data (work data) stored in a mounting memory unit (memory unit 23).

The mounting inspection device M7 has a function of performing a mounting inspection operation in which the mounting inspection control unit (control unit 22) controls the mounting inspection work unit (work unit 24) including a mounting inspection camera that images the surface of the board based on the mounting inspection data (work data) stored in the mounting inspection memory unit (memory unit 23), thereby imaging the surface of the board after components are mounted on the deposited solder, and inspecting the positions and mounting conditions of the mounted components. The reflow device M8 has a function of performing a reflow operation in which the reflow control unit (control unit 22) controls the reflow work unit (work unit 24) based on the reflow data (work data) stored in the reflow memory unit (memory unit 23), thereby heating the board on which the components are mounted, melting the solder, solidifying it, and fixing it to the board.

In FIG. 1, the adhesion inspection device M9 has a function of performing adhesion inspection work in which an adhesion inspection control unit (control unit 22) controls an adhesion inspection work unit (work unit 24) including an adhesion inspection camera that images the surface of the board based on adhesion inspection data (work data) stored in an adhesion inspection memory unit (memory unit 23), thereby capturing an image of the surface of the board after the solder has been stuck and inspecting the state of the stuck solder, etc.

The X-ray inspection device M10 has the function of performing X-ray inspection work to inspect the bonding state by performing non-contact fluoroscopic observation and cross-sectional observation of the board after the solder has solidified, by controlling the X-ray inspection control unit (control unit 22) to the X-ray inspection work unit (work unit 24) including an X-ray sensor based on the X-ray inspection data (work data) stored in the X-ray inspection memory unit (memory unit 23). In other words, the X-ray inspection device M10 is a non-contact inspection device that inspects the bonding state of the board after the solder has solidified without contact.

In FIG. 1, the electrical characteristic inspection device M11 has a function of performing an electrical characteristic inspection operation in which a probe is brought into contact with the electrodes of the board after the solder has been fixed, and the electrical characteristics of the board are measured and the joining state is inspected, by controlling the electrical characteristic inspection control unit (control unit 22) of the electrical characteristic inspection work unit (work unit 24) based on the electrical characteristic inspection data (work data) stored in the electrical characteristic inspection memory unit (memory unit 23). The board recovery device M12 has a function of recovering electronic circuit boards with soldered components and storing them in a rack, by controlling the recovery control unit (control unit 22) of the recovery work unit (work unit 24) including a rack for storing multiple boards based on the board recovery data (work data) stored in the recovery memory unit (memory unit 23).

Next, the configuration of the control system of the electronic circuit board manufacturing system 1 will be described with reference to FIG. 2. The electronic circuit board manufacturing system 1 comprises a work line L made up of a plurality of work devices M1 to M12, and a work line management device 3 that manages the work line L. The work line management device 3 comprises a processing device 10, a management memory unit 11 which is a memory device, an input/output display unit 16, and a management communication unit 17. The management memory unit 11 stores work result information 12, condition setting information 13, transmission conditions 14, transmission information 15, etc.

The processing device 10 is a data processing device such as a CPU, and includes an information collection unit 18, a condition setting unit 19, and an information transmission unit 20 as internal processing units. The work line management device 3 does not need to be configured as a single computer, but may be configured as multiple devices. For example, all or part of the storage device and data processing device may be provided in the cloud via a server.

In FIG. 2, the input/output display unit 16 is a device such as a touch panel that has an input function for inputting operation commands and data, and a display function for displaying various data and data input screens. Note that the input/output display unit 16 is not limited to a device in which the input function and the display function are integrated. For example, the input function may be performed by an input device such as a keyboard, touch panel, mouse, or voice, and the display function may be performed by a display device such as an LCD panel. The management communication unit 17 is a communication interface that transmits and receives data to and from the work devices M1 to M12 that make up the work line L via the communication network 2.

In FIG. 2, the information collection unit 18 continuously collects work result information 12 transmitted from multiple work devices M1 to M12 on the work line L while the work line L is manufacturing electronic circuit boards, and stores the information in the management memory unit 11. Specifically, the information collection unit 18 collects work result information 12 from the board supply device M1, including the board ID of the board supplied to the downstream printing device M2. The information collection unit 18 also collects work result information 12 from the printing device M2, including the board ID of the board on which the printing work was performed, the printing conditions, etc.

In addition, the information collecting unit 18 collects from the solder inspection device M3 work result information 12 including the board ID of the board on which the solder inspection work was performed, defective solder locations where the solder deposition state is defective, and the solder positions of specific locations where the deposition state is not defective but has a large amount of deviation or where the deposition amount is too much or too little. In addition, if the board is a multi-panel board composed of multiple individual boards, the information collecting unit 18 collects from the solder inspection device M3 work result information 12 including defective board information that identifies individual boards for which it has been decided not to perform further work due to a defective solder deposition state.

In FIG. 2, the information collection unit 18 collects work result information 12 from mounting devices M4 to M6, including the board ID of the board on which component mounting work was performed, the mounting conditions, specific locations where the amount of position correction when transferring the component to the board was not within the error range but was greater than the specified range, and the mounting position of specific locations where the nozzle was unable to hold the component properly and a retry was performed. The information collection unit 18 also collects work result information 12 from mounting inspection device M7, including the board ID of the board on which mounting inspection work was performed, the amount of positional deviation of the mounted component, mounting defect locations where the mounting state is poor, the positions of specific locations where the mounting state is not yet defective but the amount of positional deviation is large, and defective board information identifying individual boards on which it was decided not to perform further work due to the poor mounting state.

The information collecting unit 18 also collects from the adhesion inspection device M9 work result information 12 including the board ID of the board on which the adhesion inspection work was performed, the amount of misalignment of the mounted components, the defective adhesion points where the solder is poorly adhered, the positions of specific points where the adhesion state is not yet defective but the amount of misalignment is large, and defective board information identifying individual boards on which it has been decided not to perform further work due to the poor adhesion state. The information collecting unit 18 also collects from the X-ray inspection device M10 work result information 12 including the board ID of the board on which the X-ray inspection work was performed, the defective joint points where the solder joint state is poor, the positions of specific points where it has been determined that the solder joint state is not good and an electrical characteristic inspection is necessary, and defective board information identifying individual boards on which it has been determined not to perform further work due to the poor joint state.

In FIG. 2, the information collection unit 18 collects work result information 12 from the electrical characteristic inspection device M11, including the board ID of the board on which the electrical characteristic inspection work was performed, the location of the electrical characteristic points where the measurement results of the electrical characteristics of the solder joints are poor, etc. In this way, the work result information 12 includes information on the defective points on the board (poor solder points, defective mounting points, poor adhesion points, poor joint points, and poor electrical characteristic points), information on specific points of solder deposition on the board, and information on specific mounting points.

In FIG. 2, the condition setting unit 19 creates transmission conditions 14 that specify the conditions for creating transmission information 15 to be transmitted to other work devices M1-M12 from the work result information 12 collected from the work devices M1-M12. Specifically, the condition setting unit 19 displays a transmission condition setting screen operated by the worker on the input/output display unit 16, and creates the transmission conditions 14 based on the information set on the transmission condition setting screen. The condition setting unit 19 displays the transmission condition setting screen on the input/output display unit 16 based on the condition setting information 13 stored in the management memory unit 11.

Now, referring to FIG. 3, an example of the condition setting information 13 will be described. The condition setting information 13 includes, for each "number" 30, an "information source" 31, a "direction" 32, an "information destination" 33, and a "setting item" 34. The information source 31 is information that specifies the work device M1-M12 that transmits the work result information 12. The direction 32 is information that specifies the direction in which the transmission information 15 is transmitted from the information source 31 as the base point, with "B" indicating feedback that is transmitted upstream and "F" indicating feedforward that is transmitted downstream. The information destination 33 is information that specifies the work device M1-M12 that transmits the transmission information 15 created based on the work result information 12 collected from the information source 31.

Setting item 34 is information that specifies the items to be transmitted as transmission information 15. Setting item 34 "Adjustment parameters" indicates that adjustment parameters that optimize the work of upstream work devices M1 to M12 are transmitted based on the inspection results of downstream work devices M1 to M12. "Mask cleaning instruction" indicates that printing device M2 transmits an instruction to perform temporary mask cleaning based on the inspection results of solder inspection work by solder inspection device M3. "Defective board information" indicates that in the case of multiple boards, downstream work devices M1 to M12 transmit an instruction not to perform work on individual boards for which upstream work devices M1 to M12 have decided not to perform further work.

That is, the production line management device 3 has an analysis unit that analyzes the acquired information, and a data generation unit that generates adjustment parameters, generates mask cleaning instructions, or generates instructions not to perform work. Alternatively, it may cooperate with an analysis unit and data generation unit configured separately from the production line management device 3. Note that the production line management device 3 does not need to have an analysis unit or data generation unit, in which case it transmits information necessary for adjustment parameters that optimize the work of the upstream production devices M1 to M12, information necessary for instructions for the printing device M2 to perform temporary mask cleaning, or information necessary for instructions for the downstream production devices M1 to M12 not to perform work to individual boards for which the upstream production devices M1 to M12 have decided not to perform further work.

In FIG. 3, "Inspection stop position" indicates that the downstream work devices M1-M12 send an instruction not to inspect defective locations determined to be defective by the upstream work devices M1-M12. "Additional work position" indicates that the downstream work devices M1-M12 send an instruction to perform additional work to a specific location identified by the upstream work devices M1-M12. "Simple inspection position" indicates that the downstream work devices M1-M12 send an instruction to perform work using a simple program to a specific location identified by the upstream work devices M1-M12.

"Mounting abort position" indicates that the mounting devices M4 to M6 send an instruction not to perform component mounting work at defective solder locations where the solder deposition condition has been determined to be defective by the solder inspection device M3. "Mounting position correction information" indicates that a mounting position correction value is sent to correct the mounting position used in component mounting work by the mounting devices M4 to M6, based on the amount of positional deviation detected by the mounting inspection device M7 or adhesion inspection device M9.

In FIG. 3, for example, the condition setting information 13 numbered 30 "1" specifies that "adjustment parameters" for optimizing the printing work and "mask cleaning instructions" to perform temporary mask cleaning are fed back to the printing device M2 based on the work result information 12 collected from the solder inspection device M3. Also, the condition setting information 13 numbered 30 "2" specifies that "defective board information" that identifies individual boards on which component mounting work will not be performed and "mounting stop positions" where component mounting work will not be performed are fed forward to the mounting devices M4 to M6 based on the work result information 12 collected from the solder inspection device M3.

Next, referring to FIG. 4, an example of a transmission condition setting screen 40 displayed by the condition setting unit 19 on the input/output display unit 16 will be described. On the transmission condition setting screen 40, a "transmission/reception destination" setting frame 41, a "transmission item" setting frame 42, a "back" button 43, and a "confirm" button 44 are displayed.

The "Destination" setting frame 41 displays, for each work device that makes up the work line L, a radio button for exclusively selecting the "source" for sending the work result information 12, and a check box for selecting the "destination" for sending the transmission information 15. In the example of Figure 4, the mounting inspection device M7 is exclusively selected as the "source". The mounting devices M4 to M6, the adhesion inspection device M9, the X-ray inspection device M10, and the electrical characteristic inspection device M11 are each selected as the "destination".

In FIG. 4, the "Transmission item" setting frame 42 displays "transmission items" that can be transmitted as transmission information 15, and check boxes for selecting the "transmission items" to be transmitted, corresponding to the "source" and "destination" selected in the "transmission/reception destination" setting frame 41. The condition setting unit 19 displays, in the "transmission item" setting frame 42, the "transmission items" that correspond to the "source" and "destination" selected in the "transmission/reception destination" setting frame 41, based on the condition setting information 13 stored in the management memory unit 11.

When the "Back" button 43 is operated, the screen transitions to the previous screen. When the "Confirm" button 44 is operated, the condition setting unit 19 creates a transmission condition 14 based on the information set in the "Destination" setting frame 41 and the "Item to be sent" setting frame 42, and stores the created transmission condition 14 in the management storage unit 11. The worker can flexibly create transmission conditions 14 for each of the work devices M1 to M12 that make up the work line L by repeating the steps of selecting a "source" and a "destination" in the "Destination" setting frame 41 on the transmission condition setting screen 40, selecting an "item to be sent" in the "Item to be sent" setting frame 42, and then pressing the "Confirm" button 44.

After the "Confirm" button 44 is operated, it may be determined whether the "source" and "destination" that satisfy the set "transmission item" are set. As shown in FIG. 3, the setting item 34 has a corresponding information source 31 and information destination 33 set. If the "source" and "destination" are not set to satisfy the selected "transmission item", the information set in the "setting item" cannot be sent to the information destination 33. Therefore, for example, if the "source" and "destination" that satisfy the "transmission item" are not set, the condition setting unit 19 may notify the operator of a setting error. Also, if the "source" and "destination" that satisfy the "transmission item" are not set, the condition setting unit 19 may automatically correct and set the "source" and "destination" to satisfy the "transmission item".

Next, an example of the transmission conditions 14 will be described with reference to FIG. 5. The transmission conditions 14 are set for each of the work devices M1 to M12. FIG. 5(a) is an example of the transmission conditions 14 set for the mounting device M4, and FIG. 5(b) is an example of the transmission conditions 14 set for the X-ray inspection device M10. The transmission conditions 14 include "result information" 51 and "transmission items" 52 for each "number" 50. The result information 51 is information that specifies the information included in the work result information 12 collected from the work devices M1 to M12. The transmission items 52 are information that specifies the information to be included in the transmission information 15 to be transmitted to the work devices M1 to M12.

In FIG. 5(a), for example, transmission condition 14 numbered 50 as "1" indicates that transmission information 15 including a mounting cancellation instruction (transmission item 52) not to perform component mounting work on a specific individual board of the board with that board ID is transmitted to mounting device M4 based on defective board information (result information 51) included in work result information 12 collected from solder inspection device M3.

Transmission condition 14 with number 50 set to "2" indicates that transmission information 15 including a mounting stop position (transmission item 52) indicating that component mounting work will not be performed at the solder defect location on the board with that board ID is transmitted to mounting device M4 based on the solder defect location (result information 51) contained in work result information 12 collected from solder inspection device M3. In this way, even if the work result information 12 is collected from the same work device (solder inspection device M3), by appropriately specifying result information 51 and transmission item 52 in transmission condition 14, it is possible to flexibly link the work result information 12.

In FIG. 5(b), the transmission condition 14 numbered 50 as "16" indicates that transmission information 15 including adjustment parameters (transmission items 52) for optimizing the X-ray inspection work is transmitted to the X-ray inspection device M10 based on the characteristic inspection results (result information 51) included in the work result information 12 collected from the electrical characteristic inspection device M11.

In FIG. 2, the information transmitting unit 20 includes a transmission information creating unit 21 as an internal processing unit. The transmission information creating unit 21 creates transmission information 15 based on the transmission conditions 14 and the work result information 12 collected from the work devices M1 to M12 on the work line L, and stores the information in the management storage unit 11. The information transmitting unit 20 transmits the created transmission information 15 to the work devices M1 to M12 corresponding to the transmission conditions 14. That is, based on the transmission conditions 14 set for each of the work devices M1 to M12, the information transmitting unit 20 transmits the information included in the work result information 12 as transmission information 15 corresponding to the transmission conditions 14 to the work devices M1 to M12 corresponding to the transmission conditions 14.

The transmission conditions 14 may include the timing of transmission. It is preferable that the transmission information 15 is transmitted at a timing corresponding to the setting item. For example, if any one of defective board information, mounting stop position, inspection stop position, simple inspection position, and additional work position is set, it is preferable that the transmission information 15 is transmitted at a timing such that it is received before the board corresponding to the transmission information 15 is transported to the destination work device M1 to M12.

The work devices M1 to M12 that receive the transmission information 15 perform work according to the instructions included in the transmission information 15. For example, the mounting device M4 that receives the transmission information 15 created based on the transmission condition 14 with the number 50 of FIG. 5(a) being "1" does not perform component mounting work on the specific individual boards of the board with the matching board ID.

Furthermore, when the X-ray inspection device M10 receives transmission information 15 including inspection stop position information created based on transmission condition 14 of "13" (number 50 in FIG. 5B), it does not perform X-ray inspection work on the stuck defective parts of the board with the matching board ID. In other words, when the work result information 12 includes information on defective parts on the board (faulty mounting parts, stuck defective parts, and poor connection parts), the transmission information 15 includes an instruction for the operation device (sticking inspection device M9, X-ray inspection device M10, electrical characteristic inspection device M11) corresponding to transmission condition 14 not to perform work on the defective parts. In this way, manufacturing efficiency can be improved by omitting inspection of defective parts determined to be defective by the upstream operation device (sticking inspection device M9, X-ray inspection device M10).

The X-ray inspection device M10 performs an X-ray inspection of the corresponding defective adhesion area and determines the corresponding area as a defective area, but does not have to notify the worker of the defect. In other words, the transmission information 15 may include an instruction for the work device corresponding to the transmission condition 14 not to determine the defective area as a mounting defect.

In addition, the X-ray inspection device M10, which receives the transmission information 15 including the additional inspection position information created based on the transmission condition 14 of "14" in FIG. 5B, performs additional X-ray inspection work on the specific part of the board that matches the board ID. That is, when the work result information 12 includes information on the specific part of the solder deposition on the board or the specific part of the mounting, the transmission information 15 includes an instruction for the operation device corresponding to the transmission condition 14 (mounting inspection device M7, adhesion inspection device M9, X-ray inspection device M10, electrical characteristic inspection device M11) to perform additional work on the specific part. In this way, by performing additional work only on the specific part that could not be judged good or bad by the upstream operation device (solder inspection device M3, mounting inspection device M7, adhesion inspection device M9, X-ray inspection device M10), it is possible to improve manufacturing efficiency while maintaining mounting quality.

In addition, the X-ray inspection device M10, which receives the transmission information 15 including the simplified inspection position information created based on the transmission condition 14 of "15" in FIG. 5(b), performs an X-ray inspection operation using a simplified program on a specific location of the board that matches the board ID. That is, when the work result information 12 includes information on the mounting inspection on the board (adhesion inspection result, X-ray inspection result), the transmission information 15 includes an instruction for the operation device (X-ray inspection device M10, electrical characteristic inspection device M11) that has a normal program and a simplified program corresponding to the transmission condition 14 to switch to the simplified program and perform the operation. In this way, the specific location that is judged to be good by the upstream operation device (adhesion inspection device M9, X-ray inspection device M10) can be inspected using a simplified program that omits the inspection items, thereby improving manufacturing efficiency while maintaining the mounting quality.

Next, the work line management method by the work line management device 3 will be described along the flow of FIG. 6. It is assumed that the management memory unit 11 of the work line management device 3 stores transmission conditions 14 that have already been set by the condition setting unit 19 or the like. First, the information collection unit 18 collects work result information 12 transmitted from a plurality of work devices M1 to M12 (ST1: work result information collection process). Next, the transmission information creation unit 21 creates transmission information 15 corresponding to the transmission conditions 14 from information contained in the collected work result information 12 based on the transmission conditions 14 set for each of the work devices M1 to M12 (ST2: transmission information creation process).

The information transmission unit 20 then transmits the created transmission information 15 to the work devices M1 to M12 according to the transmission conditions 14 (ST3: transmission information transmission process). While the work line L is manufacturing electronic circuit boards (No in ST4), the process returns to the work result information collection process (ST1) and the transmission information creation process (ST2) and the transmission information transmission process (ST3) are repeatedly executed. This allows for flexible coordination of work result information 12 in the work line L, which is made up of multiple work devices M1 to M12.

As described above, the electronic circuit board manufacturing system 1 of this embodiment includes a work line L composed of multiple work devices M1 to M12, and a work line management device 3 that manages the work line L. The work line management device 3 includes an information collection unit 18 that collects work result information 12 transmitted from the multiple work devices M1 to M12, and an information transmission unit 20 that transmits information included in the work result information 12 as transmission information 15 corresponding to the transmission conditions 14 to the work devices M1 to M12 corresponding to the transmission conditions 14 based on the transmission conditions 14 set for each of the work devices M1 to M12. The work devices M1 to M12 then perform work based on the received transmission information 15. This allows for flexible coordination of the work result information 12 on the work line L composed of multiple work devices M1 to M12.

A further modification of the present embodiment described above is described below. In FIG. 4, mounting inspection device M7 is selected as the source, and mounting devices M4, M5, and M6, adhesion inspection device M9, X-ray inspection device M10, and electrical characteristic inspection device M11 are selected as destinations. Non-essential destinations from these selected work devices do not need to be selected. For example, if mounting device M4 does not require adjustment parameters or mounting position correction information from mounting inspection device M7 or if the device manufacturer is different and adjustment parameters or mounting position correction information cannot be used correctly, mounting device M4 does not need to be selected as the destination. By not selecting non-essential destinations, the amount of information sent and received can be reduced.

In addition, in FIG. 4, the mounting inspection device M7 is exclusively selected as the transmission source, but the solder inspection device M3, adhesion inspection device M9, and X-ray inspection device M10 may also be selected as transmission sources at the same time. By selecting all or some of these devices as transmission sources, the accuracy of the adjustment parameters and mounting position correction information is improved. In other words, it is possible to select all or some of the transmission sources with overlapping "setting items" in FIG. 3 multiple times.

The work line management device, work line management method, and electronic circuit board manufacturing system of the present invention have the effect of flexibly linking work result information on a work line made up of multiple work devices, and are useful in the field of mounting components on boards.

1 Electronic circuit board manufacturing system 3 Work line management device M1 Board supply device (work device)
M2 Printing device (working device)
M3 Solder inspection device (working device)
M4 to M6 Mounting equipment (working equipment)
M7 Mounting inspection device (working device)
M8 Reflow device (working device)
M9 Sticking inspection device (working device)
M10 X-ray inspection device (working device)
M11 Electrical characteristic inspection device (working device)
M12 Substrate recovery device (working device)

Claims (15)

A work line management device that manages a work line that is made up of a plurality of work devices that perform work for manufacturing an electronic circuit board having components mounted on a board,
an information collecting unit that collects work result information transmitted from a plurality of work devices;
an information transmission unit that transmits information included in the work result information as transmission information corresponding to a transmission condition set for each of the work devices to the work device corresponding to the transmission condition ,
the work result information includes information on defective locations on the substrate,
The transmission information includes an instruction for a work device corresponding to the transmission condition not to determine the defective portion as a mounting defect . The work line management device according to claim 1, wherein the plurality of work devices include at least two of the following: a solder inspection device that captures and inspects the surface of the board after solder has been deposited; a mounting device that mounts components on the deposited solder; a mounting inspection device that captures and inspects the surface of the board after components have been mounted on the deposited solder; a solder adhesion inspection device that captures and inspects the surface of the board after the solder has been fixed; a non-contact inspection device that non-contactly inspects the bonding state of the board after the solder has been fixed; and an electrical characteristic inspection device that measures and inspects the electrical characteristics of the board after the solder has been fixed. the work result information includes information on defective locations on the substrate,
The production line management device according to claim 1 , wherein the transmission information includes an instruction for a maintenance device corresponding to the transmission condition not to perform maintenance on the defective portion. The work result information includes information on a specific portion of solder deposition on the board or information on a specific portion of mounting,
The work line management device according to claim 1 , wherein the transmission information includes an instruction for a work device corresponding to the transmission condition to perform an additional work on the specific location. the work result information includes information on mounting inspection of the board,
3. The work line management device according to claim 1, wherein the transmission information includes an instruction for a work device having a normal program and a simple program, among the work devices corresponding to the transmission condition, to switch to the simple program and perform the work. 1. A work line management method for managing a work line that is made up of a plurality of work devices that perform work for manufacturing an electronic circuit board having components mounted on a board, comprising:
Collecting work result information transmitted from a plurality of work devices;
transmitting information included in the work result information to a work device corresponding to the transmission conditions based on transmission conditions set for each of the work devices ,
the work result information includes information on defective locations on the substrate,
The transmission information includes an instruction for a mounting device corresponding to the transmission condition not to determine the defective portion as a mounting defect. 7. The work line management method of claim 6, wherein the plurality of working devices include at least two of a solder inspection device that images and inspects the surface of the board after solder has been deposited, a mounting device that mounts components on the deposited solder, a mounting inspection device that images and inspects the surface of the board after components have been mounted on the deposited solder, a solder adhesion inspection device that images and inspects the surface of the board after the solder has solidified, a non-contact inspection device that non-contactly inspects the bonding state of the board after the solder has solidified, and an electrical characteristic inspection device that measures and inspects the electrical characteristics of the board after the solder has solidified. the work result information includes information on defective locations on the substrate,
8. The production line management method according to claim 6 , wherein the transmission information includes an instruction for a maintenance device corresponding to the transmission condition not to perform maintenance on the defective portion. The work result information includes information on a specific portion of solder deposition on the board or information on a specific portion of mounting,
The work line management method according to claim 6 or 7 , wherein the transmission information includes an instruction for a work device corresponding to the transmission condition to perform additional work on the specific location. the work result information includes information on mounting inspection of the board,
8. The work line management method according to claim 6 , wherein the transmission information includes an instruction for a work device having a normal program and a simple program, among the work devices corresponding to the transmission condition, to switch to the simple program and perform work. An electronic circuit board manufacturing system including a work line including a plurality of work devices that perform work for manufacturing an electronic circuit board having components mounted on a board, and a work line management device that manages the work line,
The production line management device includes:
an information collecting unit that collects work result information transmitted from a plurality of work devices;
an information transmission unit that transmits information included in the work result information as transmission information corresponding to a transmission condition set for each of the work devices to the work device corresponding to the transmission condition,
The work device performs work based on the received transmission information ,
the work result information includes information on defective locations on the substrate,
The operation device that receives the transmitted information does not determine that the defective portion is a mounting defect. 12. The electronic circuit board manufacturing system of claim 11, wherein the plurality of working devices include at least two of a solder inspection device that images and inspects the surface of the board after solder has been deposited, a mounting device that mounts components on the deposited solder, a mounting inspection device that images and inspects the surface of the board after components have been mounted on the deposited solder, a solder adhesion inspection device that images and inspects the surface of the board after the solder has been fixed, a non-contact inspection device that non-contactly inspects the bonding state of the board after the solder has been fixed, and an electrical characteristic inspection device that measures and inspects the electrical characteristics of the board after the solder has been fixed . the work result information includes information on defective locations on the substrate,
13. The electronic circuit board manufacturing system according to claim 11 , wherein the operation device that has received the transmitted information does not perform operation on the defective portion. The work result information includes information on a specific portion of solder deposition on the board or information on a specific portion of mounting,
The electronic circuit board manufacturing system according to claim 11 , wherein the operation device that receives the transmitted information performs an additional operation on the specific location. the work result information includes information on mounting inspection of the board,
13. The electronic circuit board manufacturing system according to claim 11 , wherein among the operation devices that have received the transmitted information, those that have a normal program and a simple program switch to the simple program and perform the operation.

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