JP7505440B2 - Plastic moldings - Google Patents

Description

The disclosed embodiment relates to a resin molded product.

Conventionally, a so-called insert molding technique has been known in which a resin-molded primary molded product is set in a secondary molding die as the molded product, and resin material is poured into the cavity to integrate the resin material with the molded product (see, for example, Patent Document 1).

JP 2017-109372 A

However, in the above conventional technology, when the resin material is poured into the cavity, if the primary molded product, which is the product to be molded, is placed downstream of the flow path of the resin material, the pressure generated when the resin material flows, known as resin pressure, is applied to the primary molded product, and, for example, the end of the primary molded product may be pressed against the mold, causing the part that abuts against the mold to deform.

One aspect of the embodiment has been made in consideration of the above, and aims to provide a resin molded product in which the molded product is less likely to deform even when resin pressure is applied to the molded product when the resin material is poured into the cavity.

A resin molded product according to one aspect of the embodiment includes a molded product including a primary molded resin part made of thermoplastic resin and a circuit board connected to the primary molded resin part, and a secondary molded resin part integrated with the molded product by a molding process using a resin material that is a thermosetting resin . The circuit board is connected to one end of the primary molded resin part located upstream in a first direction, which is the direction in which the resin material flows in the molding process. A pressure-receiving part is provided on the outer periphery of the primary molded resin part to receive a pressure generated when the resin material flows in the molding process. The pressure-receiving part has a pressure-receiving surface that abuts against the mold on a surface that extends in a second direction, which is a direction intersecting the first direction.

According to one aspect of the embodiment, it is possible to provide a resin molded product in which the molded product is less likely to deform even when resin pressure is applied to the molded product when the resin material is poured into the cavity.

FIG. 1 is a side view showing an example of the configuration of a resin molded product according to an embodiment. FIG. 2 is a plan view of the resin molded product shown in FIG. FIG. 3 is a side view showing an example of the configuration of the primary molded product according to the embodiment. FIG. 4 is a plan view of the primary molded product shown in FIG. FIG. 5 is a front view of the primary molded product shown in FIG. FIG. 6 is a plan view of a secondary molding die in a state in which a primary molded product according to the embodiment is disposed between a first die and a second die. FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG. FIG. 8 is a cross-sectional view showing a state in which the first mold and the second mold shown in FIG. 7 are clamped together. FIG. 9 is a diagram showing the direction of pressure that the primary molded product according to the embodiment receives from the secondary molding resin material in the secondary molding step. FIG. 10 is a diagram for explaining a secondary molding process using a primary molded product having no pressure-receiving portion according to the embodiment. FIG. 11 is a front view showing another example of the configuration of the primary molded product according to the embodiment. FIG. 12 is a side view showing another example of the configuration of the primary molded product according to the embodiment. FIG. 13 is a front view of the primary molded product shown in FIG. FIG. 14 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 12 is disposed between the first and second molds before the molds are clamped. FIG. 15 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 12 is disposed between the first and second molds after the molds are clamped. FIG. 16 is a side view showing still another example of the configuration of the primary molded product according to the embodiment. FIG. 17 is a front view of the primary molded product shown in FIG. FIG. 18 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 16 is disposed between the first and second molds before the molds are clamped. FIG. 19 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 16 is disposed between the first and second molds after the molds are clamped.

Below, with reference to the attached drawings, an embodiment of the resin molded product disclosed in the present application will be described in detail. Note that the present invention is not limited to the embodiment described below. In addition, to facilitate understanding of the description, XYZ coordinates are attached to several drawings including FIG. 1 and FIG. 2. The Z axis direction is a direction perpendicular to the main surface of the circuit board included in the resin molded product, and hereinafter, the positive direction of the Z axis may be described as the upward direction, and the negative direction of the Z axis may be described as the downward direction. In addition, when only a part of the configuration of the resin molded product is illustrated, each of the X axis direction, Y axis direction, and Z axis direction is the direction when the resin molded product is completed.

As shown in Figs. 1 and 2, the resin molded product 1 according to the embodiment includes a circuit board 10, a primary molded resin part 20, and a secondary molded resin part 30. A conductive member 11 and electronic components (not shown) are mounted on the circuit board 10. The circuit board 10 is, for example, a double-sided wiring board, but may also be a wiring board with three or more layers.

In the resin molded product 1, the circuit board 10 is sealed with resin including the primary molded resin part 20 and the secondary molded resin part 30, thereby ensuring waterproofing and improving strength. In the example shown in Figures 1 and 2, the resin molded product 1 is configured such that the secondary molded resin part 30 covers the entire circuit board 10, but the resin molded product 1 may also be configured such that the secondary molded resin part 30 covers only a portion of the circuit board 10.

The primary molded resin part 20 has one end 21 joined to an end of the circuit board 10. In the resin molded product 1, the one end 21 of the primary molded resin part 20 is covered by the secondary molded resin part 30, so that the bonding strength between the primary molded resin part 20 and the circuit board 10 is high.

The primary molding resin part 20 is integrated with the conductive member 11 by a primary molding process using a primary molding resin material, and the conductive member 11 and electronic components (not shown) are electrically connected to the circuit board 10 by solder. The primary molding resin material is, for example, a thermoplastic resin such as polyethylene, polypropylene, polystyrene, acrylic resin, ABS resin, or polyvinyl chloride, but may be a resin other than a thermoplastic resin. The primary molding process is, for example, a molding process by injection molding. The primary molding process is performed in the primary molding step. Also, the conductive member 11 is connected to the circuit board 10 by solder, but may also be connected to a cable.

In the primary molded product 2 shown in Figures 3 and 4, one end 21 of the primary molded resin part 20 is joined to the main surface M of the circuit board 10 by the primary molding process. The other end 22 of the primary molded resin part 20 is formed in a cylindrical shape with the left-right direction in Figure 3 as the direction of the cylindrical axis Lc, and the end face 22a in the left-right direction in Figures 3 and 4 is an annular end face.

A pressure receiving portion 23 is provided on the outer periphery of the intermediate portion between one end 21 and the other end 22 of the primary molded resin portion 20, which receives the pressure generated when the secondary molding resin material flows in the secondary molding process. The pressure receiving portion 23 is formed in a convex shape on the outer periphery of the intermediate portion of the primary molded resin portion 20, and has a pressure receiving surface 23a that abuts against the mold during the secondary molding process, as described below. As shown in FIG. 5, the pressure receiving portion 23 is formed in a flange shape and protrudes in a direction away from the cylindrical axis Lc, and the pressure receiving surface 23a of the pressure receiving portion 23 is formed in an annular shape.

In the YZ plane, the pressure-receiving portion 23 is formed so that the thickness in the left-right direction (X-axis direction) in FIG. 3 becomes thinner as it moves away from the center O along the Z-axis shown in FIG. 3. As a result, the pressure-receiving surface 23a is a tapered surface in which the surfaces extending in the Y-axis direction and the Z-axis direction, which are directions intersecting the direction in which the secondary molding resin material flows, are inclined. The closer the pressure-receiving surface 23a is to the center O along the Z-axis in the YZ plane, the closer it is to the other end 22 in the X-axis direction. In addition, the surface 23b of the pressure-receiving portion 23 on the opposite side of the pressure-receiving surface 23a in FIG. 3 is also a tapered surface, and the closer it is to the center O along the Z-axis in the YZ plane, the closer it is to the one end 21 in the X-axis direction. Note that the pressure-receiving surface 23a and the surface 23b may be surfaces parallel to the YZ plane.

Returning to Figures 1 and 2, the explanation of the resin molded product 1 will continue. The secondary molded resin part 30 is integrated with the circuit board 10 and the primary molded resin part 20 by a secondary molding process using a secondary molding resin material. In the example shown in Figures 1 and 2, the secondary molded resin part 30 is joined to the circuit board 10, but the resin molded product 1 may be configured such that the secondary molded resin part 30 is joined only to the primary molded resin part 20.

The resin material for secondary molding is, for example, a thermosetting resin such as phenolic resin, melamine resin, or epoxy resin, but may be a resin other than a thermosetting resin. The secondary molding process is, for example, a molding process by transfer molding. The secondary molding process is performed in a secondary molding process after the primary molding process.

As described above, the resin molded product 1 is provided with a pressure receiving portion 23 that receives the pressure generated when the secondary molding resin material flows in the secondary molding process, i.e., the resin pressure. This suppresses deformation of the primary molded product 2 due to the resin pressure applied to the primary molded product 2 in the secondary molding step where the secondary molding process is performed. The secondary molding will be described below.

As shown in FIG. 6, a secondary molding die 40 is used in the secondary molding process. As shown in FIG. 7, the secondary molding die 40 includes a first die 41 and a second die 42 that form a cavity 43 (see FIG. 8) into which the secondary molding resin material is injected. The first die 41 is a die for forming the lower side of the secondary molded resin part 30, and is also called the lower die. The second die 42 is a die for forming the upper side of the secondary molded resin part 30, and is also called the upper die.

In the secondary molding process, the first mold 41 and the second mold 42 face each other with a gap between them in the vertical direction, and the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the primary molded product 2 is transferred from the transport device to the first mold 41.

Next, one of the first mold 41 and the second mold 42 moves closer to the other, and as shown in FIG. 8, the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 come into contact with each other, and the first mold 41 and the second mold 42 are clamped together. This positions the primary molded product 2 in the cavity 43 formed by the first mold 41 and the second mold 42.

In the state shown in FIG. 8, the pressure-receiving portion 23 is engaged with the recess 41b formed in the first mold 41 and the recess 42b formed in the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction (X-axis direction) in FIG. 6.

In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, the molten secondary molding resin material 33 is injected into the cavity 43. At this time, one end 21 of the primary molded product 2 is subjected to pressure P (resin pressure) by the secondary molding resin material 33 that is generated when the secondary molding resin material 33 injected into the cavity 43 flows through the cavity 43. The pressure direction Dp, which is the direction of pressure P, is the direction from one end 21 to the other end 22 of the primary molded product 2, as shown in FIG. 9, and is the left direction in FIG. 9.

As shown in FIG. 9, the pressure receiving surface 23a of the pressure receiving portion 23 in the primary molded product 2 faces and abuts against the abutment surface 41c of the first mold 41 and the abutment surface 42c of the second mold 42 in the pressure direction Dp, so that the end face 22a of the other end 22 of the primary molded product 2 does not come into contact with the secondary molding die 40 due to the pressure P from the secondary molding resin material 33, and the end face 22a of the other end 22 faces the secondary molding die 40 with a gap in between in the pressure direction Dp.

The other end 22 of the primary molded product 2 is cylindrically formed, and therefore has a thin thickness in the direction perpendicular to the pressure direction Dp. Therefore, if the pressure receiving portion 23 is not provided in the primary molded product 2 and the end face 22a of the other end 22 receives the pressure P from the secondary molding resin material 33, the other end 22 of the primary molded product 2 may be deformed. In particular, since the end face 22a of the other end 22 is not covered with the secondary molding resin material 33, the other end 22 abuts against the mold, and the pressure applied to the other end 22 is greater than when the end face 22a of the other end 22 is covered with the secondary molding resin material 33, and the other end 22 is more likely to be deformed.

Here, an example of a case where a secondary molding process is performed on a primary molded product 2A that does not have a pressure-receiving portion 23 will be described. As shown in FIG. 10, when a secondary molding process is performed on a primary molded product 2A that does not have a pressure-receiving portion 23 using a secondary molding die 40, a pressure-receiving member 44 for receiving pressure P from the secondary molding resin material 33 in the cavity 43 is placed between the end face 22a at the other end 22 of the primary molded resin portion 20 in the primary molded product 2A and the secondary molding die 40.

After clamping the first mold 41 and the second mold 42 together, the molten secondary molding resin material 33 is injected into the cavity 43, and the pressure P from the secondary molding resin material 33 applied to one end 21 of the primary molded resin part 20 is applied to the end face 22a. The other end 22 of the primary molded product 2A is formed cylindrically and has a small thickness in the direction perpendicular to the pressure direction Dp (see FIG. 9). Therefore, the other end 22 of the primary molded resin part 20 of the secondary molded product 1A may be deformed as shown in FIG. 10.

Therefore, the pressure-receiving portion 23 is formed so that its thickness in the direction perpendicular to the pressure direction Dp is greater than that of the other end 22 so that the pressure-receiving portion 23 is less likely to deform even when the one end 21 receives pressure P. This suppresses deformation of the primary molded product 2 due to the pressure applied to the primary molded product 2 in the secondary molding process.

In addition, in the secondary molding process, the portions of the primary molded product 2 other than one end 21 are not covered with the secondary molding resin material 33, and the pressure receiving surface 23a of the pressure receiving portion 23 is formed in the area not covered with the secondary molding resin material 33. Therefore, the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33 can be received with high precision by the pressure receiving surface 23a of the pressure receiving portion 23.

In addition, as shown in FIG. 5, the pressure-receiving surface 23a of the pressure-receiving portion 23 is formed in a circular ring shape on the outer periphery of the primary molded resin portion 20, so that the area of the pressure-receiving surface 23a can be made large, and the force applied to the primary molded product 2 by the pressure applied to one end 21 of the primary molded product 2 can be dispersed by the pressure-receiving surface 23a. Therefore, the pressure applied to the pressure-receiving surface 23a can be reduced compared to when the pressure-receiving surface 23a is not formed in a circular ring shape and the area of the pressure-receiving surface 23a is not large.

The thickness of the pressure-receiving portion 23 in the pressure direction Dp increases toward the contact surfaces 41a, 42a where the first mold 41 and the second mold 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding mold 40.

The shape of the pressure-receiving portion 23 is not limited to the shape shown in FIG. 5, and does not have to be annular, for example, as shown in FIG. 11. The pressure-receiving surface 23a shown in FIG. 11 has two pressure-receiving surfaces 23a formed with a gap between them in the left-right direction in FIG. 11.

The position and configuration of the pressure-receiving portion in the primary molded product 2 are not limited to the above-mentioned example. The primary molded product 2 shown in Figures 12 and 13 has a pressure-receiving portion 24 instead of the pressure-receiving portion 23. The pressure-receiving portion 24 is formed in a concave shape in the direction approaching the cylindrical axis on the outer periphery of the intermediate portion located between one end 21 and the other end 22 of the primary molded resin part 20, and has a pressure-receiving surface 24a that abuts against the secondary molding die 40 during the secondary molding process.

The pressure-receiving portion 24 is formed in a concave shape on the outer periphery of the middle part of the primary molded resin portion 20, and the pressure-receiving surface 24a of the pressure-receiving portion 24 is formed in an annular shape. The pressure-receiving surface 24a of the pressure-receiving portion 24 is a tapered surface, and in the YZ plane shown in FIG. 12, the closer it is to the center O along the Z axis, the closer it is to the other end portion 22 in the X-axis direction. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding die 40.

As shown in FIG. 14, the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the primary molded product 2 is transferred from the transport device to the first mold 41. Then, one of the first mold 41 and the second mold 42 moves vertically, and the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 abut against each other, and the first mold 41 and the second mold 42 are clamped. As a result, the primary molded product 2 is positioned in the cavity 43 formed by the first mold 41 and the second mold 42, as shown in FIG. 15.

In the state shown in FIG. 15, the pressure-receiving portion 24 is engaged with the convex portion 41d formed on the first mold 41 and the convex portion 42d formed on the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction in FIG. 15.

In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, molten secondary molding resin material 33 is injected into the cavity 43. At this time, like the pressure receiving surface 23a of the pressure receiving portion 23, the pressure receiving surface 24a of the pressure receiving portion 24 receives the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33. Because the pressure receiving surface 24a of the pressure receiving portion 24 is not covered with the secondary molding resin material 33, it can accurately receive the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33.

In addition, since the pressure-receiving surface 24a is supported by the one end portion 21, deformation of the primary molded product 2 is suppressed. In addition, since the pressure-receiving surface 24a is formed in an annular shape on the outer periphery of the primary molded resin part 20, the area of the pressure-receiving surface 24a can be made large, and the pressure applied to the pressure-receiving surface 24a can be reduced, similar to the pressure-receiving surface 23a. Note that the shape of the pressure-receiving surface 24a does not have to be annular.

The primary molded product 2 shown in Figures 16 and 17 has a pressure receiving part 25 instead of the pressure receiving parts 23 and 24. The pressure receiving part 25 is formed in a convex shape on the outer periphery of the other end 22 of the primary molded resin part 20, and has a pressure receiving surface 25a that abuts against the secondary molding die 40 during the secondary molding process. Like the pressure receiving part 23, the pressure receiving part 25 protrudes in a flange shape in a direction away from the cylindrical axis Lc, and the pressure receiving surface 25a of the pressure receiving part 25 is formed in an annular shape. The pressure receiving surface 25a of the pressure receiving part 25 is a tapered surface, and is formed so that the closer it is to the center O along the Z axis in the YZ plane shown in Figure 16, the farther it is from the one end 21 in the X-axis direction. Note that in the primary molded product 2 shown in Figures 16 and 17, the pressure receiving part 25a and the end surface 22a are on the same plane.

As shown in FIG. 18, the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the transport device transfers the primary molded product 2 to the first mold 41. Then, one of the first mold 41 and the second mold 42 moves vertically, and the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 abut against each other, and the first mold 41 and the second mold 42 are clamped. As a result, the primary molded product 2 is positioned in the cavity 43 formed by the first mold 41 and the second mold 42, as shown in FIG. 19.

In the state shown in FIG. 19, the pressure-receiving portion 25 is engaged with the recess 41e formed in the first mold 41 and the recess 42e formed in the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction in FIG. 19.

In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, molten secondary molding resin material 33 is injected into the cavity 43. At this time, like the pressure receiving surface 23a of the pressure receiving portion 23, the pressure receiving surface 25a of the pressure receiving portion 25 receives the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33. Because the pressure receiving surface 25a of the pressure receiving portion 25 is not covered with the secondary molding resin material 33, it can accurately receive the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33.

In addition, since the pressure-receiving surface 25a is formed in an annular shape on the outer periphery of the primary molded resin portion 20, the area of the pressure-receiving surface 25a can be made large, and the pressure applied to the pressure-receiving surface 25a can be reduced, similar to the pressure-receiving surface 23a. In addition, since the thickness of the pressure-receiving portion 25 in a direction perpendicular to the pressure direction Dp (see FIG. 9) is thicker than the thickness of the other end portion 22 in a direction perpendicular to the pressure direction Dp, deformation of the pressure-receiving portion 25 is suppressed. Note that the shape of the pressure-receiving surface 25a does not have to be annular.

The thickness of the pressure-receiving portion 25 in the pressure direction Dp increases toward the contact surfaces 41a, 42a where the first mold 41 and the second mold 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding mold 40.

As described above, the resin molded product 1 according to the first embodiment includes the primary molded product 2 and the secondary molded resin part 30 that is integrated with the primary molded product 2 by the secondary molding process using the secondary molding resin material 33. The primary molded product 2 is an example of a molded product, the secondary molding resin material 33 is an example of a resin member, the secondary molding process is an example of a molding process, and the secondary molded resin part 30 is an example of a molded resin part. On the outer periphery of the primary molded product 2, pressure-receiving parts 23, 24, and 25 that receive the pressure generated when the secondary molding resin material 33 flows in the secondary molding process are provided. The pressure-receiving parts 23, 24, and 25 have pressure-receiving surfaces 23a, 24a, and 25a that abut against the secondary molding die 40 on a surface that extends in a second direction that is a direction intersecting the first direction in which the secondary molding resin material 33 flows in the secondary molding process. The second direction is a direction intersecting the main surface M of the circuit board 10, and is the Y-axis direction and the Z-axis direction. In other words, the second direction is a direction along the YZ plane. The first direction is the pressure direction Dp described above, and is the positive direction of the X-axis. This makes it possible to prevent deformation of the primary molded product 2 in the resin molded product 1, even if resin pressure is applied to the molded product when the resin material is poured into the cavity.

In addition, the pressure-receiving portions 23, 24, and 25 are formed to be concave or convex in the second direction. This makes it easy to form the pressure-receiving portions 23, 24, and 25.

In addition, the end face 22a of the primary molded product 2 located downstream in the first direction is not covered with the secondary molding resin material 33. This makes it possible to prevent pressure from being applied to the end face 22a during the molding process of the resin molded product 1, and makes it possible to make the primary molded product 2 less likely to deform even if the other end 22 is prone to deformation.

The other end 22 of the primary molded product 2, which is the downstream end in the first direction, is formed into a cylindrical shape with the first direction as the cylindrical axis direction. This makes it possible for the pressure-receiving parts 23, 24, and 25 of the resin molded product 1 to make it difficult for the other end 22, which is formed into a cylindrical shape that is easily deformed, to deform.

The pressure-receiving portions 23, 24, and 25 are formed in an annular shape on the outer periphery of the primary molded resin portion 20. This allows the pressure applied to the pressure-receiving surface 23a to be reduced during the molding process of the resin molded product 1, compared to when the pressure-receiving surface 23a is not formed in an annular shape and the area of the pressure-receiving surface 23a is not large.

The secondary molding die 40 also includes a first die 41 and a second die 42 that form a cavity 43 into which the secondary molding resin material 33 is injected. The secondary molding die 40 is an example of a die. The pressure-receiving portions 23, 25 have a thickness in the first direction that increases toward the contact surfaces 41a, 42a where the first die 41 and the second die 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding die 40.

Further advantages and modifications may readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof.

REFERENCE SIGNS LIST 1, 1A Resin molded product 2, 2A Primary molded product 10 Circuit board 20 Primary molded resin part 21 One end 22 Other end 22a End face 23, 24, 25 Pressure-receiving part 23a, 24a, 25a Pressure-receiving surface 30 Secondary molded resin part 33 Resin material for secondary molding 40 Secondary molding die 41 First die 41a, 42a, 41c, 42c Abutment surface 42 Second die 43 Cavity 44 Pressure-receiving member

Claims (6)

A molded product including a primary molded resin part formed of a thermoplastic resin and a circuit board connected to the primary molded resin part;
a secondary molded resin portion that is integrated with the molded product by a molding process using a resin material that is a thermosetting resin ;
the circuit board is connected to one end of the primary molded resin part located upstream in a first direction, which is a direction in which the resin material flows during the molding process;
the one end is covered with a secondary molded resin portion by the molding process,
The outer periphery of the primary molded resin part is
a pressure receiving portion is provided that receives a pressure generated when the resin material flows during the molding process;
The pressure receiving portion is
a pressure-receiving surface extending in a second direction intersecting the first direction and contacting a mold; The pressure receiving portion is
The resin molded product according to claim 1 , wherein the resin molded product is formed in a concave or convex shape in the second direction. The resin molded product according to claim 1 , wherein an end face of the primary molded resin portion located downstream in the first direction is not covered with the resin material. The other end portion of the primary molded resin portion downstream in the first direction is
The resin molded product according to claim 1 , wherein the resin molded product is formed in a cylindrical shape with the first direction being a cylindrical axis direction. The pressure receiving portion is
The resin molded product according to claim 1 , wherein the first molded resin portion is formed in an annular shape on an outer periphery of the first molded resin portion . The mold is
a first mold and a second mold for forming a cavity into which the resin material is injected;
The pressure receiving portion is
The resin molded product according to any one of claims 1 to 5, wherein the thickness in the first direction increases toward a contact surface where the first mold and the second mold are in contact with each other.

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