JP7498646B2 - Switchgear maintenance device and switchgear maintenance method - Google Patents

Description

This specification discloses technology relating to a switchgear maintenance device and a switchgear maintenance method.

The signal switching circuit described in Patent Document 1 periodically switches the relay contacts from a normally used circuit to a normally unused circuit, causing a current to flow through the contacts and removing the non-conductive coating that has adhered to the surface of the contacts. The relay contacts are switched about once a day or once a week.

JP 2011-238423 A

However, the signal switching circuit described in Patent Document 1 periodically switches the relay contacts, and does not remove foreign matter adhering to the contacts of a switch that opens and closes in accordance with the attachment and detachment of equipment that is detachably mounted on a substrate-related operating machine. Also, as with the signal switching circuit described in Patent Document 1, the non-conductive coating that adheres to relay contacts that remain stationary for long periods of time can be removed periodically. However, the timing for removing foreign matter adhering to the contacts of the switch does not necessarily occur at regular intervals, and there is a demand to know the timing for removal.

In light of these circumstances, this specification discloses a switch maintenance device and a switch maintenance method that can determine the timing for removing foreign matter adhering to the contacts of a switch that opens and closes in accordance with the attachment and detachment of equipment that is detachably mounted on a substrate-related operating machine.

This specification discloses a switch maintenance device that includes a judgment unit. The judgment unit judges whether or not it is time to remove foreign matter attached to the contacts of a switch that opens and closes in accordance with the attachment and detachment of equipment that is detachably mounted on a substrate-related operation machine that performs a specified substrate-related operation on a substrate to produce a substrate product.

This specification also discloses a switch maintenance method that includes a judgment step. The judgment step judges whether or not it is time to remove foreign matter attached to the contacts of a switch that opens and closes in accordance with the attachment and detachment of equipment that is detachably mounted on a substrate-related operation machine that performs a specified substrate-related operation on a substrate to produce a substrate product.

The above-mentioned switch maintenance device includes a judgment unit. Therefore, it is possible to know the timing for removing foreign matter adhering to the contacts of the switch, which opens and closes in accordance with the attachment and detachment of equipment that is detachably mounted on the substrate-related operation machine. The above also applies to the switch maintenance method.

FIG. 2 is a plan view showing a configuration example of a board production line. FIG. 2 is a perspective view showing a configuration example of the replacement system and the component mounting machine of FIG. 1 . 11 is a plan view showing an example of a feeder replacement operation between a conveying device and a component supplying device of a component mounting machine. FIG. FIG. 4 is a circuit diagram showing an example of a detection circuit for detecting attachment/detachment of a device. 2 is a block diagram showing an example of a control block of the switch maintenance device; FIG. 4 is a flowchart showing an example of a control procedure performed by the switch maintenance device. FIG. 2 is a circuit diagram showing an example of a circuit for measuring a resistance value of a contact of a switch. FIG. 1 is a circuit diagram showing an example of a circuit for removing foreign matter adhering to a contact of a switch.

1. Embodiment 1-1. Configuration example of board production line WL0 The switch maintenance device 70 of this embodiment is applied to the board production line WL0. As shown in FIG. 1, the board production line WL0 includes at least one (four in the figure), a component mounting machine 10, a replacement system 30, a conveying device 40, a storage device 50, and a line management device 60. The four component mounting machines 10 are installed along the conveying direction (X direction) of the board 90 shown in FIG. 2. The component mounting machine 10 is included in a board-related operation machine WM0 that performs a predetermined board-related operation on the board 90 to produce a board product 900. The board-related operation by the component mounting machine 10 includes a board 90 loading and unloading operation, a component supply operation, a component picking operation, and a mounting operation. The component mounting machine 10 is provided with, for example, a cassette-type feeder 20 that can be detached.

On the board carrying-in side of the board production line WL0 (left side of the paper in FIG. 1), for example, a storage device 50 used for storing the feeder 20 is installed. In addition, the board production line WL0 is provided with an exchange system 30 and a transport device 40, which perform the supplying, replacing, and recovering operations of the feeder 20. The board production line WL0 may be appropriately modified and added to in accordance with, for example, the type of board product 900 to be produced. Specifically, the board production line WL0 may be appropriately equipped with, for example, a board-related operation machine WM0 such as a solder printer, a solder inspection machine, a reflow oven, and a visual inspection machine. In this way, the board production line WL0 may use various board-related operation machines WM0 to transport the boards 90 in sequence and perform production processes including inspection processes to produce the board products 900.

The substrate-related work machine WM0 that constitutes the substrate production line WL0 is configured to be able to input and output various data to and from the line management device 60 via a network. For example, the storage device 50 has a plurality of slots 51. The storage device 50 holds the feeders 20 installed in each of the plurality of slots 51. The feeders 20 installed in the slots 51 are able to communicate with the line management device 60. As a result, the identification information of the slots 51 of the storage device 50 and the feeders 20 installed in the slots 51 are associated with each other and recorded in the line management device 60.

The line management device 60 also monitors the operating status of the board production line WL0 and provides overall control of the substrate-related operation machines WM0, such as the component mounting machine 10, the exchange system 30, the transport device 40, and the storage device 50. The line management device 60 stores various data for controlling the substrate-related operation machines WM0, the exchange system 30, the transport device 40, and the storage device 50. The line management device 60 transmits various data, such as a production program, when the component mounting machine 10 executes the component mounting process, for example.

1-2. Example of configuration of component mounting machine 10 As shown in Fig. 2, each of the four component mounting machines 10 includes a board transport device 11, a component supply device 12, and a head drive device 13. In this specification, the transport direction of the board 90 is defined as the X direction. The direction perpendicular to the X direction in the horizontal plane is defined as the Y direction. Furthermore, the vertical direction perpendicular to the X and Y directions (the up and down directions on the paper surface of Fig. 2) is defined as the Z direction.

The board transport device 11 is composed of, for example, a belt conveyor and a positioning device. The board transport device 11 sequentially transports the board 90 in the transport direction (X direction) and positions the board 90 at a predetermined position within the machine. After the mounting process by the component mounting machine 10 is completed, the board transport device 11 transports the board 90 out of the component mounting machine 10.

The component supply device 12 supplies components to be mounted on the board 90. The component supply device 12 has a first slot 12a and a second slot 12b in which a plurality of feeders 20 can be mounted. In this embodiment, the first slot 12a is disposed at the upper part of the front side of the component mounting machine 10, and holds the mounted feeder 20 in an operable manner. The operation of the feeder 20 mounted in the first slot 12a is controlled in the mounting process by the component mounting machine 10, and supplies components at a removal section provided at a specified position above the feeder 20. In this way, the first slot 12a can hold the feeder 20 used in the production of the board product 900.

In this embodiment, the second slot 12b is disposed below the first slot 12a and stocks the installed feeders 20. Specifically, the second slot 12b holds the spare feeders 20 to be used in the production of the board product 900. The second slot 12b also temporarily holds the feeders 20 that are no longer needed in the production of the board product 900. The exchange of the feeders 20 between the first slot 12a and the second slot 12b is performed by the transport device 40.

As shown in FIG. 2, the feeder 20 includes a feeder body 21 and a drive unit 22. In this embodiment, the feeder body 21 is formed in a flat box shape. The feeder body 21 detachably (replaceably) holds a reel 23 around which a carrier tape that contains a large number of components is wound. The drive unit 22 includes a sprocket 22a that engages with a feed hole provided in the carrier tape. The drive unit 22 rotates the sprocket 22a to feed and move the carrier tape.

The drive of the drive unit 22 of the feeder 20 is controlled by the control device of the component mounting machine 10. When the feeder 20 is installed in the first slot 12a of the component mounting machine 10, it receives power from the component mounting machine 10 via a connector and is able to communicate with the component mounting machine 10. This allows the component mounting machine 10 to detect the supply and withdrawal of the feeder 20 in the first slot 12a. What has been described above about the first slot 12a also applies to the second slot 12b.

The feeder 20 installed in the first slot 12a controls the feeding operation of the carrier tape that contains the components based on control commands from the component mounting machine 10. As a result, the feeder 20 supplies the components so that they can be picked up by the holding member of the mounting head 13b at the removal section provided at the top of the feeder 20.

The head driving device 13 moves the moving table 13a in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 13b is fixed to the moving table 13a in a replaceable (detachable) manner by a clamp member. The mounting head 13b is moved in the X direction and Y direction together with the moving table 13a by the linear motion mechanism of the head driving device 13. The mounting head 13b uses a holding member to pick up the parts supplied by the part supply device 12. The holding member can be, for example, a suction nozzle that sucks up the parts by supplied negative pressure air, a chuck that grips the parts, or the like.

The mounting head 13b holds the holding member so that it can move in the Z direction and rotate around the Q axis parallel to the Z axis. The mounting head 13b adjusts the position and angle of the holding member depending on the posture of the picked component. The mounting head 13b then mounts the component at the mounting position on the board 90 as instructed by the production program. The total time required for a specified number of cycles of the above-mentioned component pick-and-place cycle and the time required to load and unload the board 90 corresponds to the cycle time for one board 90.

The holding member provided on the mounting head 13b can be changed as appropriate depending on the type of component in the mounting process for mounting the components on the board 90. For example, when the suction nozzle used in the mounting process to be performed is not attached to the mounting head 13b, the component mounting machine 10 attaches the suction nozzle housed in the nozzle station to the mounting head 13b. The nozzle station is removably installed at a predetermined position inside the component mounting machine 10.

1 and 2, the exchange system 30 includes a first rail 31 and a second rail 32. The first rail 31 and the second rail 32 form a running path 30R of the transport device 40. The first rail 31 extends along the transport direction (X direction) of the substrate 90, and is provided between the first slot 12a and the second slot 12b in the vertical direction (Z direction).

The second rail 32 extends along the conveying direction (X direction) of the board 90 and is provided below the second slot 12b in the vertical direction (Z direction). The first rail 31 and the second rail 32 extend over almost the entire area of the conveying direction (X direction) of the board 90 in the board production line WL0. The conveying direction (X direction) of the board 90 corresponds to the arrangement direction of the four component mounting machines 10.

The conveying device 40 is provided so as to be capable of traveling on the travel path 30R formed by the first rail 31 and the second rail 32. The conveying device 40 receives power from a power transmitting unit by non-contact power supply, for example, via a power receiving unit provided opposite the power transmitting unit provided on the first rail 31. The power received by the power receiving unit is used for the travel of the conveying device 40, predetermined work, etc., via a power receiving circuit. The conveying device 40 obtains its position (current position) on the travel path 30R, for example, by a position detection device. The position detection device can detect the above position, for example, by an optical detection method, a detection method using electromagnetic induction, etc.

The above-mentioned predetermined work includes an exchange work for exchanging equipment DD0 used in the production of the board product 900 by the board-related work machine WM0 such as the component mounting machine 10 with the board-related work machine WM0. In this embodiment, the transport device 40 performs the exchange work of the feeder 20 between the component mounting machine 10, which is the board-related work machine WM0, with the feeder 20, which supplies the components to be mounted on the board 90, as equipment DD0. The transport device 40 can also perform the exchange work of the feeder 20 between the storage device 50, with the feeder 20 as equipment DD0.

The conveying device 40 of this embodiment conveys the feeder 20 from the storage device 50 to the first slot 12a or the second slot 12b of the component mounting machine 10, and performs the feeder 20 supplying operation. The conveying device 40 also performs the feeder 20 replacement operation between the first slot 12a and the second slot 12b of the component mounting machine 10. Furthermore, the conveying device 40 conveys the feeder 20 that is no longer needed from the component mounting machine 10 to the storage device 50, and performs the feeder 20 recovery operation.

As shown in FIG. 3, the conveying device 40 includes at least one holding unit 41 (two in the figure) and a control device 42. In this embodiment, each of the two holding units 41 can clamp multiple (two in the figure) feeders 20 simultaneously, and can hold multiple (two) feeders 20 simultaneously. In addition, each of the two holding units 41 can move independently along the attachment/detachment direction of the feeder 20 (Y direction in this embodiment) by, for example, a linear motion mechanism, and can move multiple (two) feeders 20 along the Y direction simultaneously.

Furthermore, the two holding parts 41 can be moved together in the vertical direction (Z direction) by, for example, a linear motion mechanism, and multiple (four) feeders 20 can be moved simultaneously in the Z direction. The conveying device 40 can also be provided with, for example, multiple (four) holding parts 41. In this case, each of the multiple (four) holding parts 41 can clamp one feeder 20 and move the multiple (four) feeders 20 independently in the Y direction and Z direction. The form of the holding part 41 is not limited to a clamping mechanism or a linear motion mechanism, and can take various forms. For example, the holding part 41 can be provided with a protrusion that can fit into a hole provided in the feeder 20. In this case, the protrusion of the holding part 41 fits into the hole of the feeder 20 to hold the feeder 20.

The control device 42 is equipped with a known arithmetic device and memory device, and a control circuit is configured. The control device 42 is communicatively connected to the four component mounting machines 10, the replacement system 30, the storage device 50, and the line management device 60. The control device 42 controls the travel of the conveying device 40, the operation of the two holding units 41, etc. With the above configuration, the conveying device 40 can move to a predetermined position along the first rail 31 and the second rail 32, and perform the replacement work of the feeder 20 at the stopped position.

The storage device 50 can store not only the feeder 20, but also equipment DD0 used in the production of the board product 900 using the board-related work machine WM0. For example, if the board-related work machine WM0 is a component mounting machine 10, the tray unit that stores a tray that stores multiple components and the mounting head 13b are included in the equipment DD0. If the board-related work machine WM0 is a solder printing machine that prints solder on the board 90, the dispense head is included in the equipment DD0. If the board-related work machine WM0 is an inspection machine, the inspection head is included in the equipment DD0. The inspection machine includes a solder inspection machine that inspects the solder printed on the board 90 and a visual inspection machine that inspects the components mounted on the board 90.

The transport device 40 can also supply the above-mentioned equipment DD0 to the substrate-related operation machine WM0, not limited to the feeder 20. Specifically, the transport device 40 can supply the equipment DD0 stored in the storage device 50 to the substrate-related operation machine WM0. The transport device 40 can also collect the equipment DD0 that is no longer needed in the production of the substrate product 900 to the storage device 50.

1-4. Example of the configuration of the switch maintenance device 70 The above-mentioned device DD0 is detachably provided on the substrate-related operation machine WM0. In order to detect the attachment and detachment of the device DD0, the device DD0 or the substrate-related operation machine WM0 is provided with a switch SW0 that opens and closes in accordance with the attachment and detachment of the device DD0.

For example, in this embodiment, the substrate-related operation machine WM0 is a component mounting machine 10 that mounts components on a substrate 90, and the device DD0 is a feeder 20 that supplies components. As described above, the feeder 20 is detachably provided in the first slot 12a or the second slot 12b of the component supply device 12. The feeder 20 is also detachably provided in the slot 51 of the storage device 50. The first slot 12a, the second slot 12b, and the slot 51 are all formed in the pallet member PL0.

Figure 4 shows an example of a detection circuit C0 that detects the attachment and detachment of the device DD0. In this embodiment, the switch SW0 is provided on the feeder 20, which is the device DD0. As shown in Figure 3, the feeder 20 is provided with a protrusion 20a. In addition, the pallet member PL0 is provided with a recess PL0a. For example, when the feeder 20 is mounted in the first slot 12a, the protrusion 20a and the recess PL0a engage with each other, and the contact CP0 of the switch SW0 switches from an open state to a closed state. Conversely, when the feeder 20 is removed from the first slot 12a, the protrusion 20a disengages from the recess PL0a, and the contact CP0 of the switch SW0 switches from a closed state to an open state.

As shown in FIG. 4, the detection circuit C0 includes a voltage source V0, a resistor R1, a detection circuit D0, and a contact CP0. The voltage source V0, the resistor R1, the detection circuit D0, and the contact CP0 are connected in series in this order. For example, assume that the feeder 20 is installed in the first slot 12a and the contact CP0 of the switch SW0 is switched from an open state to a closed state. In this case, the voltage detected by the detection circuit D0 changes from a high-level voltage (approximately equivalent to the DC voltage Vcc output by the voltage source V0) to a low-level voltage (approximately equivalent to the reference voltage of the detection circuit C0 (e.g., zero volts)). This allows the detection circuit D0 to detect that the feeder 20 is installed in the first slot 12a.

Conversely, suppose that the feeder 20 is removed from the first slot 12a and the contact CP0 of the switch SW0 switches from a closed state to an open state. In this case, the voltage detected by the detection circuit D0 changes from a low-level voltage to a high-level voltage. This allows the detection circuit D0 to detect that the feeder 20 has been removed from the first slot 12a. The same applies to the second slot 12b and slot 51.

In this way, when the device DD0 is attached and detached and the switch SW0 is repeatedly opened and closed, foreign matter may adhere to the contact CP0 of the switch SW0. For example, when the device DD0 is used in an atmosphere of low molecular weight siloxane, the low molecular weight siloxane is decomposed by the arc heat generated by the opening and closing of the switch SW0, and silicon oxide is generated on the surface of the contact CP0 of the switch SW0. When the switch SW0 is repeatedly opened and closed, silicon oxide accumulates on the surface of the contact CP0 of the switch SW0, and a silicon oxide film is generated. The silicon oxide film is an insulator and can be a cause of poor conductivity of the contact CP0 of the switch SW0.

Therefore, the circuit board production line WL0 of this embodiment is provided with a switchgear maintenance device 70. When considered as a control block, the switchgear maintenance device 70 has a judgment unit 71. The switchgear maintenance device 70 can also have a guidance unit 72. The switchgear maintenance device 70 can also have a removal unit 73. As shown in FIG. 5, the switchgear maintenance device 70 of this embodiment has the judgment unit 71, the guidance unit 72, and the removal unit 73.

The switchgear maintenance device 70 can also be provided in the line management device 60. The switchgear maintenance device 70 can also be provided in a management device that manages multiple board production lines WL0, on the cloud, etc. As shown in FIG. 5, in this embodiment, the switchgear maintenance device 70 is provided in the line management device 60. Furthermore, the switchgear maintenance device 70 executes control, for example, according to the flowchart shown in FIG. 6. The judgment unit 71 performs the judgment shown in step S11. The guidance unit 72 performs the process shown in step S12. The removal unit 73 performs the process shown in step S13.

1-4-1. Determination unit 71
The determination unit 71 determines whether or not it is time to remove the foreign matter adhering to the contact CP0 of the switch SW0 (step S11 shown in FIG. 6). DD0 is the feeder 20, and the foreign matter is a silicon oxide film formed on the surface of the contact CP0 by an arc generated by opening and closing the switch SW0.

The determination unit 71 may take various forms as long as it can determine whether or not it is time to remove the device. For example, the more the number of times the device DD0 is removed and connected, the more the switch SW0 is repeatedly opened and closed, and the more likely it is that foreign matter will adhere to the surface of the contact CP0. Therefore, the determination unit 71 can determine that it is time to remove the device DD0 when the number of times the device DD0 is removed and connected reaches or exceeds a predetermined number that is set in advance in consideration of poor continuity of the contact CP0 of the switch SW0 due to foreign matter.

As mentioned above, the attachment/detachment of the device DD0 is detected by the detection circuit D0 shown in FIG. 4. In addition, the member on which the device DD0 is mounted (for example, the pallet member PL0 mentioned above) is provided with a control device CU0. Furthermore, the device DD0 is provided with identification information that allows the device DD0 to be identified. When the detection circuit D0 detects that the device DD0 has been mounted on the member (pallet member PL0) and then removed, the control device CU0 transmits the identification information of the device DD0 and attachment/detachment information indicating that the device DD0 has been attached or detached to the line management device 60.

As shown in FIG. 5, the line management device 60 includes a storage device 60m. The storage device 60m can store the number of times each device DD0 has been attached or detached. When the line management device 60 receives identification information and attachment/detachment information of the device DD0 from the control device CU0, it obtains the number of times each device DD0 has been attached or detached, which is stored in association with the identification information, from the storage device 60m. The line management device 60 increments the number of times each device DD0 has been attached or detached once, updating the number of times each device DD0 has been attached or detached, and stores the updated number of times each device DD0 has been attached or detached in the storage device 60m. The above update is repeated each time the device DD0 is attached or detached.

The judgment unit 71 acquires the number of times each device DD0 has been attached and detached from the storage device 60m. The judgment unit 71 judges that it is time to remove a device DD0 whose number of attachments and detachments is equal to or greater than a predetermined number. The judgment unit 71 also judges that it is not time to remove a device DD0 whose number of attachments and detachments is less than the predetermined number. The predetermined number is set in advance, taking into consideration a continuity failure of the contact CP0 of the switch SW0 due to a foreign object. Specifically, the predetermined number can be acquired in advance by simulation, verification using an actual device, or the like. In this way, the judgment unit 71 can easily judge the timing to remove the device DD0 based on the number of attachments and detachments.

In addition, the more foreign matter adheres to the contact CP0 of the switch SW0, the more likely the resistance value of the contact CP0 increases. Therefore, the judgment unit 71 can also judge that it is time to remove the foreign matter when the resistance value of the contact CP0 of the switch SW0 becomes equal to or exceeds a predetermined value that is set in advance in consideration of poor continuity of the contact CP0 of the switch SW0 due to the foreign matter. For example, as shown in FIG. 7, the detection circuit C0 can be equipped with a measurement circuit M0.

The measurement circuit M0 measures the resistance value of the contact CP0 of the switch SW0. For example, the measurement circuit M0 measures the voltage V11 at one end of the resistor R1 (the side of the voltage source V0) and the voltage V12 at the other end of the resistor R1 (the side of the detection circuit D0). The current flowing through the resistor R1 (the normal current UI0 described below) is the voltage difference obtained by subtracting the voltage V12 from the voltage V11, divided by the resistance value of the resistor R1. The resistance value of the contact CP0 of the switch SW0 is the voltage V12 divided by the normal current UI0.

The determination unit 71 acquires the voltages V11 and V12 measured by the measurement circuit M0. The determination unit 71 can acquire the voltages V11 and V12 at any timing. For example, the determination unit 71 can acquire the voltages V11 and V12 each time the number of times the device DD0 is attached or detached reaches an arbitrary number that is less than the predetermined number described above (a number that is set in advance taking into account poor continuity of the contact CP0 of the switch SW0 due to a foreign object). For example, the determination unit 71 may acquire the voltages V11 and V12 each time the device DD0 is attached or detached.

The determination unit 71 can calculate the resistance value of the contact CP0 of the switch SW0 by multiplying the resistance value of resistor R1 by the voltage difference obtained by dividing voltage V12 by voltage V11 minus voltage V12. The determination unit 71 determines that it is time to remove a device DD0 for which the resistance value of the contact CP0 of the switch SW0 is equal to or greater than a predetermined value. The determination unit 71 also determines that it is not time to remove a device DD0 for which the resistance value of the contact CP0 of the switch SW0 is less than the predetermined value.

The above-mentioned predetermined value to be compared with the resistance value of the contact CP0 of the switch SW0 is set in advance, taking into consideration poor continuity of the contact CP0 of the switch SW0 due to a foreign object. Specifically, the above-mentioned predetermined value can be obtained in advance by simulation, verification using an actual device, or the like. In this way, the judgment unit 71 can also judge the removal timing based on the resistance value of the contact CP0 of the switch SW0.

Furthermore, if production of the board product 900 is stopped to remove the foreign matter adhering to the contact CP0 of the switch SW0, production efficiency will decrease. Therefore, the judgment unit 71 may determine that it is time to remove the foreign matter when it is possible to remove the foreign matter while continuing production of the board product 900. This allows the switch maintenance device 70 to obtain the removal timing at which the foreign matter can be removed without decreasing the production efficiency of the board product 900.

For example, when equipment DD0 is held in slot 51 of storage device 50 capable of storing equipment DD0, the equipment DD0 is not being used in the production of board products 900 and is in a state in which foreign matter can be removed. Therefore, when equipment DD0 is held in slot 51 of storage device 50 capable of storing equipment DD0, the determination unit 71 can determine that foreign matter can be removed while continuing production of board products 900.

As described above, the component mounting machine 10, which is the substrate-related work machine WM0, is equipped with a first slot 12a and a second slot 12b. The first slot 12a is capable of holding equipment DD0 used in the production of the board product 900. The second slot 12b is capable of holding spare equipment DD0 to be used in the production of the board product 900, or temporarily holding equipment DD0 that is no longer needed in the production of the board product 900.

When the device DD0 is held in the second slot 12b, the device DD0 is not being used in the production of the board product 900 and is in a state where the foreign matter can be removed. Therefore, when the device DD0 is held in the second slot 12b, the determination unit 71 can determine that the foreign matter can be removed while continuing the production of the board product 900.

The judgment unit 71 can also judge that it is time to remove the foreign object when the number of times the device DD0 is removed and connected is equal to or greater than a predetermined number and the resistance value of the contact CP0 of the switch SW0 is equal to or greater than a predetermined value. The judgment unit 71 can also judge that it is time to remove the foreign object when at least one of the number of times the device DD0 is removed and connected is equal to or greater than a predetermined value and the resistance value of the contact CP0 of the switch SW0 satisfies the above-mentioned conditions and the foreign object can be removed while continuing production of the board product 900.

In either case, when the judgment unit 71 judges that it is time to remove at least one device DD0 (Yes in step S11 shown in FIG. 6), the control by the switchgear maintenance device 70 proceeds to the control shown in step S12. When the judgment unit 71 judges that it is not time to remove all devices DD0 (No in step S11), the control by the switchgear maintenance device 70 is temporarily terminated.

1-4-2. Guide unit 72
When the determining unit 71 determines that it is time to remove the object, the notifying unit 72 notifies the operator that it is time to remove the object (step S12 shown in FIG. 6). The line management device 60 further includes a display device 60d. For example, when the determination unit 71 determines that it is time to remove the waste paper, the guide unit 72 causes the display device 60d to display a message indicating that it is time to remove the waste paper. This allows the worker to know the timing to remove the foreign matter adhering to the contact CP0 of the switch SW0.

When the determination unit 71 determines that it is time to remove the device DD0, the guidance unit 72 can display the fact that it is time to remove the device on the worker's mobile terminal device. The guidance unit 72 can also guide the worker to information that can identify the device DD0 at the removal timing (e.g., identification information), the location of the device DD0 (e.g., pallet member PL0 and slot number), the status of the device DD0 (whether it is being used in the production of the board product 900), and the like. The worker can, for example, replace the device DD0 with a normal device DD0 (a device DD0 with no foreign matter attached to the contact CP0 or a device DD0 with an acceptable level of foreign matter attached to the contact CP0). The worker can also have the removal unit 73 described below remove the foreign matter attached to the contact CP0 via the display device 60d that also functions as an input device or a mobile terminal device.

1-4-3. Removal unit 73
When the determination unit 71 determines that it is time for removal, the removal unit 73 applies a removal current RI0 to a contact CP0 of the switch SW0 to generate an arc at the contact CP0, thereby removing the foreign matter attached to the contact CP0. The removal current RI0 is a current larger than the normal current UI0 that flows through the contact CP0 of the switch SW0 in the production of the board product 900. The removal current RI0 is determined based on the results of simulation, actual machine The identification information can be obtained in advance by verification using the above method.

The removal unit 73 may take various forms as long as it can pass the removal current RI0 through the contact CP0 of the switch SW0 to generate an arc at the contact CP0 and remove the foreign matter attached to the contact CP0. For example, if the foreign matter is the silicon oxide film described above and the normal current UI0 is several milliamperes, the removal current RI0 needs to be several hundred milliamperes to several amperes. Therefore, from the viewpoint of protecting the normal use circuit UC0 that supplies the normal current UI0 to the contact CP0 of the switch SW0, the detection circuit D0 described above, the measurement circuit M0, etc., it is advisable to separately provide a removal use circuit RC0 that supplies the removal current RI0 to the contact CP0 of the switch SW0.

Specifically, the removal unit 73 may switch from the normal use circuit UC0, which supplies the normal current UI0 to the contact CP0 of the switch SW0, to the removal use circuit RC0, which supplies the removal current RI0 to the contact CP0 of the switch SW0, and pass the removal current RI0 through the contact CP0 of the switch SW0. For example, as shown in FIG. 8, the detection circuit C0 may include a voltage source V0, a normal use circuit UC0, a removal use circuit RC0, and a contact CP0. The detection circuit C0 may further include at least the detection circuit D0 of the detection circuit D0 and the measurement circuit M0. As shown in the figure, the detection circuit C0 of this embodiment includes a voltage source V0, a normal use circuit UC0, a removal use circuit RC0, a contact CP0, a detection circuit D0, and a measurement circuit M0.

The normal use circuit UC0 and the removal use circuit RC0 are connected in parallel. The normal use circuit UC0 is equipped with the resistor R1 and the switching switch SW1 described above, and is provided with the detection circuit D0 and measurement circuit M0 described above. The switching switch SW1 is a switch for selectively switching between the normal use circuit UC0 and the removal use circuit RC0. The switching switch SW1 is controlled to a closed state when the normal use circuit UC0 is selected, and is controlled to an open state when the removal use circuit RC0 is selected.

The removal-use circuit RC0 includes a resistor R2 and a switching switch SW2. The resistance value of the resistor R2 is set smaller than that of the resistor R1 so that the removal-use current RI0 can be supplied. For example, if the normal-use current UI0 is one milliampere and the removal-use current RI0 is one hundred milliamperes, the resistance value of the resistor R2 is set to one hundredth of the resistance value of the resistor R1. The switching switch SW2 is a switch for selectively switching between the normal-use circuit UC0 and the removal-use circuit RC0. The switching switch SW2 is controlled to an open state when the normal-use circuit UC0 is selected, and is controlled to a closed state when the removal-use circuit RC0 is selected. The opening and closing control of the switching switches SW1 and SW2 is performed via the control device CU0.

When the determination unit 71 determines that it is time to remove the foreign matter, the removal unit 73 passes a removal current RI0 through the contact CP0 of the switch SW0 to generate an arc at the contact CP0, and removes the foreign matter adhering to the contact CP0. Specifically, when the determination unit 71 determines that it is time to remove the foreign matter, the removal unit 73 controls the contact CP0 of the switch SW0 to an open state. For example, the holding unit 41 of the conveying device 40 shown in FIG. 3 includes an operation unit 41a that can switch the contact CP0 of the switch SW0 of the held device DD0 (feeder 20 in this case) to an open state or a closed state. When the determination unit 71 determines that it is time to remove the foreign matter, the removal unit 73 uses the operation unit 41a to switch the contact CP0 of the switch SW0 to an open state.

With the contact CP0 of the switch SW0 controlled to the open state, the removal unit 73 sends a switching signal to the control device CU0 to switch from the normal use circuit UC0 to the removal use circuit RC0. As a result, the switching switch SW1 is controlled to the open state, and the switching switch SW2 is controlled to the closed state. In this state, the removal unit 73 uses the operation unit 41a to switch the contact CP0 of the switch SW0 to the closed state, and supplies the removal current RI0 from the removal use circuit RC0 to the contact CP0. Then, the removal unit 73 uses the operation unit 41a to switch the contact CP0 of the switch SW0 to the open state. When the contact CP0 of the switch SW0 is switched, an arc is generated at the contact CP0, and the foreign matter attached to the contact CP0 is removed.

The removal unit 73 can also simultaneously remove foreign matter adhering to the contacts CP0 of multiple devices DD0. For example, the removal unit 73 can also simultaneously remove foreign matter adhering to the contacts CP0 of multiple devices DD0 (two in FIG. 3) held in the same holding unit 41. The removal unit 73 can also simultaneously remove foreign matter adhering to the contacts CP0 of multiple devices DD0 (four in FIG. 3) held in different holding units 41. This improves the efficiency of the removal work to remove foreign matter.

When the removal of the foreign matter adhering to the contact CP0 is completed, the removal unit 73 sends a switching signal to the control unit CU0 to switch from the removal use circuit RC0 to the normal use circuit UC0. As a result, the switching switch SW1 is controlled to the closed state, and the switching switch SW2 is controlled to the open state. Note that the removal unit 73 can also remove the foreign matter adhering to the contact CP0 without receiving instructions from the operator when the determination unit 71 determines that it is time for removal.

1-5. Modified Form In the above-described form, when the equipment DD0 is held in the slot 51 of the storage device 50, the determination unit 71 determines that the foreign matter can be removed while continuing the production of the board product 900. Also, when the equipment DD0 is held in the second slot 12b, the determination unit 71 determines that the foreign matter can be removed while continuing the production of the board product 900. However, the removal timing at which the foreign matter can be removed while continuing the production of the board product 900 is not limited to these.

For example, when the device DD0 is a feeder 20, the judgment unit 71 can also judge that the foreign matter can be removed while continuing production of the substrate product 900 when the feeder 20 is held in a slot of a feeder rack that stores the feeder 20. The judgment unit 71 can also judge that the foreign matter can be removed while continuing production of the substrate product 900 when the feeder 20 is held in a slot of a feeder inspection jig that inspects the feeder 20, a feeder automatic maintenance unit that cleans the feeder 20, and adjusts the drive of the feeder 20, etc.

In this way, when device DD0 is held in a slot of a storage facility that stores device DD0, a slot of a maintenance device that performs maintenance on device DD0, or the like, the determination unit 71 can determine that the foreign matter can be removed while continuing production of the board product 900. Also, when device DD0 is held in a slot of a storage facility that stores device DD0, a slot of a maintenance device that performs maintenance on device DD0, or the like, the removal unit 73 can also remove the foreign matter attached to contact CP0.

In the embodiment described above, the equipment DD0 is supplied from the storage device 50 to the second slot 12b by the transport device 40, and is retrieved from the second slot 12b to the storage device 50. However, the equipment DD0 can be transported by various methods. For example, the equipment DD0 can also be transported by a worker or an automated guided vehicle.

In the embodiment described above, the normal use circuit UC0 and the removal use circuit RC0 are connected to the same voltage source V0. The removal unit 73 switches from the normal use circuit UC0 to the removal use circuit RC0, and passes the removal current RI0 through the contact CP0 of the switch SW0. However, the method of supplying the removal current RI0 is not limited to the embodiment described above.

For example, the output voltage of the voltage source V0 can be boosted using only the normal use circuit UC0 to pass the removal current RI0 through the contact CP0 of the switch SW0. However, for example, if the normal use current UI0 is one milliampere and the removal current RI0 is required to be 100 milliamperes, the output voltage of the voltage source V0 when supplying the removal current RI0 is set to 100 times the output voltage when supplying the normal current UI0. Therefore, in this form, the withstand voltages of the normal use circuit UC0, detection circuit D0, measurement circuit M0, etc. must be equal to or greater than the output voltage when supplying the removal current RI0.

2. Switchgear maintenance method What has already been described about the switchgear maintenance device 70 can also be applied to the switchgear maintenance method. Specifically, the switchgear maintenance method includes a determination step. The determination step corresponds to the control performed by the determination unit 71. The switchgear maintenance method can also include a guidance step. The guidance step corresponds to the control performed by the guidance unit 72. The switchgear maintenance method can also include a removal step. The removal step corresponds to the control performed by the removal unit 73.

3. Example of Effects of the Embodiment The switch maintenance device 70 includes a determination unit 71. Therefore, it is possible to know the timing for removing a foreign object attached to the contact CP0 of the switch SW0 that opens and closes in accordance with the attachment and detachment of the device DD0 that is detachably provided on the substrate-related operation machine WM0. The same can be said about the switch maintenance method described above.

10: component mounting machine, 12a: first slot, 12b: second slot, 20: feeder,
50: storage device, 51: slot, 70: switch maintenance device, 71: determination unit,
72: Guide unit, 73: Removal unit, 90: Substrate, 900: Substrate product, DD0: Equipment,
SW0: switch, CP0: contact, UC0: normal use circuit, UI0: normal current,
RC0: Circuit used during removal, RI0: Current during removal, WM0: Substrate-related work machine.

Claims (11)

a determination unit that determines whether or not it is time to remove a foreign object attached to a contact of a switch that opens and closes in response to the installation and removal of a device that is detachably provided in a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate to produce a substrate product,
The judgment unit determines that the foreign object can be removed while continuing production of the board product when the equipment is held in a slot of a storage device capable of storing the equipment, and determines that the timing for removal has arrived when the foreign object can be removed while continuing production of the board product . a determination unit that determines whether or not it is time to remove a foreign object attached to a contact of a switch that opens and closes in response to the installation and removal of a device that is detachably provided in a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate to produce a substrate product,
The substrate-related operating machine includes:
a first slot capable of holding the equipment used in the production of the substrate product;
a second slot capable of preliminarily holding the device to be used in the production of the substrate product or temporarily holding the device that is no longer needed in the production of the substrate product;
Equipped with
The judgment unit determines that the foreign object can be removed while continuing production of the board product when the equipment is held in the second slot, and determines that the timing for removal has arrived when the foreign object can be removed while continuing production of the board product . 3. The switch maintenance device according to claim 1, wherein the judgment unit judges that it is time to remove the foreign object when the number of times the equipment is removed and attached reaches or exceeds a predetermined number that is set in advance taking into account a conductivity defect in the contacts of the switch caused by the foreign object . The switch maintenance device according to any one of claims 1 to 3, wherein the determination unit determines that it is time to remove the foreign object when a resistance value of the contacts of the switch becomes equal to or greater than a predetermined value that is set in advance taking into account a conduction defect of the contacts of the switch due to the foreign object. The switch maintenance device according to any one of claims 1 to 4 , further comprising a guidance unit that, when the determination unit determines that it is time to remove the switch, notifies an operator that it is time to remove the switch. A switch maintenance device as described in any one of claims 1 to 5, comprising a removal unit that, when the judgment unit determines that it is the removal timing, passes a removal current through the contacts of the switch, which is a current larger than the normal current passed through the contacts of the switch in the production of the board product, to generate an arc at the contacts, thereby removing the foreign matter adhering to the contacts. The switch maintenance device according to claim 6, wherein the removal unit switches from a normal use circuit that supplies the normal current to the contacts of the switch to a removal use circuit that supplies the removal current to the contacts of the switch, and passes the removal current through the contacts of the switch. the substrate-related operation machine is a component mounting machine that mounts components on the substrate,
The switch maintenance device according to any one of claims 1 to 7 , wherein the equipment is a feeder that supplies the parts. The switch maintenance device according to any one of claims 1 to 8 , wherein the foreign matter is a silicon oxide film formed on a surface of the contact by an arc generated by opening and closing the switch. a determining step of determining whether or not it is time to remove a foreign object attached to a contact of a switch which opens and closes in response to the installation and removal of a device which is detachably provided in a substrate-related operation machine which performs a predetermined substrate-related operation on a substrate to produce a substrate product ,
The judgment process determines that the foreign object can be removed while continuing production of the board products when the equipment is held in a slot of a storage device capable of storing the equipment, and determines that the timing for removal has come when the foreign object can be removed while continuing production of the board products . a determining step of determining whether or not it is time to remove a foreign object attached to a contact of a switch which opens and closes in response to the installation and removal of a device which is detachably provided in a substrate-related operation machine which performs a predetermined substrate-related operation on a substrate to produce a substrate product ,
The judgment process determines that the foreign object can be removed while continuing production of the board products when the equipment is held in the second slot of the substrate-related processing machine, which has a first slot capable of holding the equipment used in the production of the board products and a second slot capable of holding the equipment on a spare basis that is to be used in the production of the board products or capable of temporarily holding the equipment that is no longer needed in the production of the board products, and determines that the timing for removal has come when the foreign object can be removed while continuing production of the board products .

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