JP7483162B1 - Chip accumulation area estimation device, chip removal device, chip accumulation area estimation method and program - Google Patents

Abstract

The chip accumulation area estimation device (2) is configured to include a cutting information acquisition unit (11) that acquires cutting information including any of the following information: information indicating the material of the object to be cut (50) by the processing machine, information indicating the cutting method of the processing machine for the object to be cut (50), or information indicating the tool used when the processing machine cuts the object to be cut (50); and a chip accumulation area estimation unit (12) that estimates a chip accumulation area (56), which is an area where chips generated from the object to be cut (50) accumulate when the processing machine cuts the object to be cut (50), based on the cutting information acquired by the cutting information acquisition unit (11).

Description

The present disclosure relates to a chip accumulation area estimation device, a chip accumulation area estimation method, and a chip removal device.

2. Description of the Related Art There is a chip accumulation region estimation device that estimates a chip accumulation region, which is a region in which chips generated from a cutting object accumulate when a processing machine cuts the cutting object.
As an example of such a chip accumulation region estimation device, Patent Document 1 discloses a machine tool system equipped with a scattering direction calculation unit.
The scattering direction calculation unit acquires from the camera a captured image showing how the processing machine is cutting the workpiece, and calculates a scattering direction of the chips based on the captured image to identify a chip accumulation area.

JP 2021-94624 A

In the machine tool system disclosed in Patent Document 1, even if the scattering direction calculation unit monitors the captured video showing the processing machine cutting the workpiece, it may not be able to confirm the chips generated from the workpiece. For example, poor visibility may occur due to the effects of smoke generated when the processing machine cuts the workpiece, and the scattering direction calculation unit may not be able to confirm the chips even if it monitors the captured video due to the poor visibility. Thus, there was a problem that if the chips could not be confirmed even if the captured video was monitored, the scattering direction calculation unit could not identify the chip accumulation area.

The present disclosure has been made to solve the above-mentioned problems, and aims to provide a chip accumulation area estimation device that can estimate a chip accumulation area, which is the area where chips accumulate, regardless of whether poor visibility is occurring or not.

The chip accumulation area estimation device according to the disclosed technology includes a cutting information acquisition unit that acquires cutting information including information on the cutting object to be cut by the processing machine, or information on the processing machine that performs the cutting, a captured image acquisition unit that acquires captured image of chips generated from the cutting object cut by the processing machine, and a chip accumulation area estimation unit that estimates a chip accumulation area, which is an area where chips accumulate, based on at least one selected from the captured image and the cutting information, based on the condition of the captured image acquired by the captured image acquisition unit.

According to the present disclosure, it is possible to estimate the chip accumulation area, which is the area where chips accumulate, regardless of whether poor visibility is occurring.

1 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a first embodiment. 2 is a hardware configuration diagram showing hardware of a chip accumulation area estimation device 2 according to the first embodiment. FIG. FIG. 2 is a hardware configuration diagram of a computer in the case where the chip accumulation area estimation device 2 is realized by software, firmware, or the like. FIG. 2 is a perspective view showing an example of a processing machine. 4 is a flowchart showing a chip accumulation area estimation method which is a processing procedure of the chip accumulation area estimation device 2. FIG. 11 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a second embodiment. FIG. 11 is a hardware configuration diagram showing hardware of a chip accumulation area estimation device 2 according to a second embodiment. 4 is a flowchart showing a chip accumulation area estimation method which is a processing procedure of the chip accumulation area estimation device 2. FIG. 11 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a third embodiment. FIG. 11 is a hardware configuration diagram showing hardware of a chip accumulation area estimation device 2 according to a third embodiment. 4 is a flowchart showing a chip accumulation area estimation method which is a processing procedure of the chip accumulation area estimation device 2.

In order to explain the present disclosure in more detail, the form for implementing the present disclosure will be described below with reference to the attached drawings.

Embodiment 1.
FIG. 1 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a first embodiment.
FIG. 2 is a hardware configuration diagram showing the hardware of the chip accumulation area estimation device 2 according to the first embodiment.
The chip removal device shown in FIG. 1 includes a learning model 1, a chip accumulation area estimation device 2, and a cleaning liquid injection unit 40.
The chip removing device shown in Fig. 1 includes a learning model 1. However, this is merely an example, and the learning model 1 may be provided outside the chip removing device.

The learning model 1 is realized, for example, by a neural network.
During learning, cutting information and teacher data are provided to the learning model 1. The cutting information includes cutting information including any of information indicating the material of the object 50 (see FIG. 4 ) to be cut by the processing machine, information indicating the cutting method of the processing machine for the object 50, and information indicating the tool used when the processing machine cuts the object 50.
That is, the cutting information may include only one or two of the information indicating the material of the cutting object 50, the information indicating the cutting method of the processing machine, and the information indicating the tool. Furthermore, the cutting information may include all of the information indicating the material of the cutting object 50, the information indicating the cutting method of the processing machine, and the information indicating the tool.
The training data is information that indicates a chip accumulation area, which is an area where chips generated from a cutting object accumulate when the processing machine cuts the cutting object.
During learning, when cutting information and teacher data are given, the learning model 1 learns the chip accumulation area corresponding to the cutting information.
During inference, when cutting information is given, the learning model 1 outputs information indicating the chip accumulation area corresponding to the cutting information.
1, the learning model 1 is provided outside the chip accumulation area estimation device 2. However, this is merely an example, and the learning model 1 may be provided inside the chip accumulation area estimation device 2.

The chip accumulation area estimation device 2 includes a cutting information acquisition unit 11 and a chip accumulation area estimation unit 12 .
The cutting information acquisition unit 11 is realized by, for example, a cutting information acquisition circuit 21 shown in FIG.
The cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut by the processing machine.
The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 12 .

Here, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut by the processing machine. However, this is merely one example, and when the learning model 1 is given, for example, cutting information including information indicating the material of the object to be cut and information indicating the cutting method of the processing machine, and teacher data during learning, and is learning the chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut and information indicating the cutting method of the processing machine.
In addition, when the learning model 1 is given cutting information, for example, including information indicating the material of the object to be cut and information indicating the tool, and teacher data during learning, and is learning the chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut and information indicating the tool.
In addition, when the learning model 1 is given cutting information, for example, including information indicating the material of the object to be cut, information indicating the cutting method of the processing machine, and information indicating the tool, as well as teacher data, and is learning the chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut, information indicating the cutting method of the processing machine, and information indicating the tool.

The chip accumulation area estimation unit 12 is realized by, for example, a chip accumulation area estimation circuit 22 shown in FIG.
The chip accumulation area estimation unit 12 acquires cutting information from the cutting information acquisition unit 11 .
The chip accumulation area estimation unit 12 estimates a chip accumulation area, which is an area where chips generated from the cutting object accumulate when the processing machine cuts the cutting object, based on the cutting information.
Specifically, the chip accumulation area estimation unit 12 provides the cutting information acquired by the cutting information acquisition unit 11 to the learning model 1, and acquires information indicating the chip accumulation area corresponding to the cutting information acquired by the cutting information acquisition unit 11 from the learning model 1.
The chip accumulation area estimation unit 12 outputs information indicating the chip accumulation area to the cleaning liquid injection unit 40 .
1, the chip accumulation area estimation unit 12 provides cutting information to the learning model 1 and acquires information indicating the chip accumulation area corresponding to the cutting information from the learning model 1. However, this is merely an example, and the chip accumulation area estimation unit 12 may acquire information indicating the chip accumulation area from the cutting information based on a rule base, for example.

The cleaning liquid jetting unit 40 acquires information indicating the chip accumulation area from the chip accumulation area estimating unit 12 .
The cleaning liquid jetting unit 40 jets cleaning liquid for washing away chips accumulated in the chip accumulation area estimated by the chip accumulation area estimation unit.

1, it is assumed that each of the cutting information acquisition unit 11 and the chip accumulation area estimation unit 12, which are components of the chip accumulation area estimation device 2, is realized by dedicated hardware as shown in Fig. 2. That is, it is assumed that the chip accumulation area estimation device 2 is realized by a cutting information acquisition circuit 21 and a chip accumulation area estimation circuit 22.
Each of the cutting information acquisition circuit 21 and the chip accumulation area estimation circuit 22 may be, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination of these.

The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware.
The software or firmware is stored as a program in the memory of a computer. The computer means hardware that executes the program, and includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a central processing unit, a processing unit, an arithmetic unit, a microprocessor, a microcomputer, a processor, or a DSP (Digital Signal Processor).

FIG. 3 is a hardware configuration diagram of a computer in the case where the chip accumulation area estimation device 2 is realized by software, firmware, or the like.
When the chip accumulation area estimation device 2 is realized by software, firmware, or the like, a program for causing a computer to execute the respective processing procedures in the cutting information acquisition unit 11 and the chip accumulation area estimation unit 12 is stored in the memory 31. Then, a processor 32 of the computer executes the program stored in the memory 31.

Furthermore, Fig. 2 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, and Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software or firmware, etc. However, this is merely one example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software or firmware, etc.

FIG. 4 is a perspective view showing an example of a processing machine.
The processing machine shown in FIG. 4 includes a table 51 on which a cutting object 50 is placed, and a spindle 52 on which a tool used for cutting the cutting object 50 is attached.
4, the processing machine is covered by a cover 54. When the processing machine cuts the workpiece 50, chips generated from the workpiece 50 are accumulated in a chip accumulation area 56.
4, the chip accumulation region 56 is an area surrounded by a dashed line. The chip accumulation region 56 changes depending on the material of the object 50 to be cut, the cutting method of the machine for cutting the object 50, or the tool used by the machine for cutting the object 50.
For example, the harder the material of the object to be cut 50 is, the farther the chips are scattered and accumulated from the object to be cut 50. If the cutting method of the object to be cut 50 is different, the direction in which the chips are scattered will change. If the tool is different, the direction in which the chips are scattered or the distance they are scattered will change.
The cutting method of the cutting object 50 may be, for example, a cutting method by grinding with a file, or a cutting method by cutting with a saw. Examples of tools include a file, a saw, or a drill.

As shown in FIG. 4 , the processing machine is provided with a plurality of nozzles 53 , and each nozzle 53 sprays the cleaning liquid output from the cleaning liquid spraying unit 40 .
Slopes 55 are provided on both sides of table 51. In the example of Fig. 4, slope 55 is inclined so that the rear side is lower than the front side in the figure. Therefore, the cleaning liquid sprayed from nozzle 53 flows on slope 55 from the front side to the rear side in the figure, and is then discharged outside the processing machine. At this time, cutting chips are discharged outside the processing machine together with the cleaning liquid.

Next, the operation of the chip accumulation area estimation device 2 shown in FIG. 1 will be described.
FIG. 5 is a flowchart showing a chip piled area estimating method which is a processing procedure of the chip piled area estimating device 2.
The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of a processing machine (step ST1 in FIG. 5).
The cutting information includes information indicating the material of the cutting object 50. The cutting information may include information indicating a cutting method of a processing machine or information indicating a tool used when cutting the cutting object 50, instead of information indicating the material of the cutting object 50, or may include all of the information indicating the material of the cutting object 50, the information indicating the cutting method of the processing machine, and the information indicating a tool used when cutting the cutting object 50.
The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 12 .

The chip accumulation area estimation unit 12 acquires cutting information from the cutting information acquisition unit 11 .
The chip accumulation area estimation unit 12 estimates a chip accumulation area 56, which is an area where chips generated from the cutting object 50 accumulate when the machining machine cuts the cutting object 50, based on the cutting information (step ST2 in Figure 5).
Specifically, the chip accumulation area estimation unit 12 provides cutting information to the learning model 1 and obtains information indicating the chip accumulation area 56 corresponding to the cutting information from the learning model 1.
If the information indicating the material of the cutting object 50 contained in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes, and if the information indicating the cutting method of the machining tool contained in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes.
Furthermore, if the information indicating the tool included in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes.
The chip accumulation area estimation unit 12 outputs information indicating the estimated chip accumulation area 56 to the cleaning liquid jetting unit 40 .
The chip accumulation area estimation unit 12 can estimate the chip accumulation area 56 based on cutting information including only information indicating the material of the cutting object 50, cutting information including only information indicating the cutting method of the processing machine, or cutting information including only information indicating the tool. However, the estimation accuracy of the chip accumulation area 56 in the chip accumulation area estimation unit 12 is improved when the cutting information includes two or more pieces of information among information indicating the material, information indicating the cutting method of the processing machine, and information indicating the tool, compared to when the cutting information includes only one piece of information.

The cleaning liquid jetting unit 40 acquires information indicating the chip accumulation area 56 from the chip accumulation area estimation unit 12 .
The cleaning liquid jetting unit 40 selects, from among the multiple nozzles 53, one or more nozzles 53 from which to jet the cleaning liquid, based on the information indicating the chip accumulation region 56.
For example, if a table showing the correspondence between chip accumulation areas 56 and nozzles 53 is prepared as shown below, the cleaning liquid spraying unit 40 will refer to the table and select the nozzle 53 corresponding to the chip accumulation area 56 indicated by the information.

[table]
The chip accumulation region 56 is region A: for example, in FIG. 4, the region on the left and front side. The region on the left side is the first nozzle 53 from the front among the plurality of nozzles 53 arranged on the left side.
The chip accumulation region 56 is region B: for example, in FIG. 4, the region on the left and rear side. The second nozzle 53 from the front and the third nozzle 53 from the front among the nozzles 53 arranged on the left side.
The chip accumulation region 56 is region C: for example, the region on the right side and the front side in FIG. 4. The first nozzle 53 from the front and the second nozzle 53 from the front among the multiple nozzles 53 arranged on the right side: for example, the region on the right side and the rear side in FIG. 4. The chip accumulation region 56 is region D.
→ Among the multiple nozzles 53 arranged on the right side, the third nozzle 53 from the front

When the cleaning liquid jetting unit 40 selects one or more nozzles 53 from which the cleaning liquid is to be jetted, the cleaning liquid jetting unit 40 outputs the cleaning liquid to the selected nozzles 53 , thereby jetting the cleaning liquid from the selected nozzles 53 .
As a result, the chips accumulated in the chip accumulation area 56 are washed away by the cleaning liquid and discharged outside the processing machine.

In the above-described first embodiment, the chip accumulation area estimation device 2 is configured to include a cutting information acquisition unit 11 that acquires cutting information including any of information indicating the material of the cutting object 50 by the processing machine, information indicating the cutting method of the processing machine for the cutting object 50, or information indicating the tool used when the processing machine cuts the cutting object 50, and a chip accumulation area estimation unit 12 that estimates a chip accumulation area 56, which is an area where chips generated from the cutting object 50 are accumulated when the processing machine cuts the cutting object 50, based on the cutting information acquired by the cutting information acquisition unit 11. Therefore, the chip accumulation area estimation device 2 can estimate the chip accumulation area 56 regardless of whether poor visibility occurs.

In the chip accumulation area estimation device 2 shown in Figure 1, the cutting information acquisition unit 11 acquires cutting information including any of the following information: information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine for the object 50, or information indicating the tool used when the processing machine cuts the object 50. However, the cutting information only needs to be information that can be used to estimate the chip accumulation area 56, and the cutting information may include information different from the information indicating the material of the object 50 to be cut, the information indicating the cutting method of the processing machine, and the information indicating the tool.

Embodiment 2.
In embodiment 2, a chip accumulation area estimation device 2 is described that is equipped with a visibility condition determination unit 14 that determines the visibility condition of chips generated from the cutting object 50 based on captured video showing the state in which a machining machine is cutting the cutting object 50.

Fig. 6 is a configuration diagram showing a chip removal device including a chip accumulation region estimation device 2 according to embodiment 2. In Fig. 6, the same reference numerals as in Fig. 1 indicate the same or corresponding parts, and detailed description thereof will be omitted.
Fig. 7 is a hardware configuration diagram showing the hardware of a chip accumulation region estimation device 2 according to embodiment 2. In Fig. 7, the same reference numerals as in Fig. 2 indicate the same or corresponding parts, and therefore detailed description thereof will be omitted.
The chip removal device shown in FIG. 6 includes a learning model 1, a camera 3, a chip accumulation area estimation device 2, and a cleaning liquid injection unit 40.
6 includes a learning model 1 and a camera 3. However, this is merely an example, and each of the learning model 1 and the camera 3 may be provided outside the chip removing device.
The camera 3 captures an image of the processing machine cutting the workpiece 50 , and outputs the captured image to the chip accumulation area estimation device 2 .

The chip accumulation area estimation device 2 shown in FIG. 6 includes a cutting information acquisition unit 11, a captured image acquisition unit 13, a visibility condition determination unit 14, and a chip accumulation area estimation unit 15.
The photographed image acquisition unit 13 is realized by, for example, a photographed image acquisition circuit 23 shown in FIG.
The captured image acquisition unit 13 acquires captured images from the camera 3 .
The captured image acquisition unit 13 outputs the captured image to each of the visibility condition determination unit 14 and the chip accumulation area estimation unit 15.

The visual recognition condition determining unit 14 is realized by, for example, a visual recognition condition determining circuit 24 shown in FIG.
The visibility condition determination unit 14 acquires the captured video from the captured video acquisition unit 13 .
The visibility condition determining unit 14 determines the visibility condition of chips generated from the workpiece 50 based on the captured video.
The visibility condition determination unit 14 outputs the determination result of the visibility condition to the chip accumulation area estimation unit 15 .

The chip accumulation area estimation unit 15 is realized by, for example, a chip accumulation area estimation circuit 25 shown in FIG.
The chip accumulation region estimation unit 15 acquires cutting information from the cutting information acquisition unit 11 .
The chip accumulation area estimation unit 15 acquires the photographed image from the photographed image acquisition unit 13 , and acquires the judgment result of the visibility condition from the visibility condition judgment unit 14 .
If the result of the visibility condition determination by the visibility condition determination unit 14 indicates that the chips are visible, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the captured image.
If the result of the visibility condition judgment by the visibility condition judgment unit 14 indicates that the chips are not visible, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the cutting information, similar to the chip accumulation area estimation unit 12 shown in Figure 1.
The chip accumulation region estimation unit 15 outputs information indicating the chip accumulation region 56 to the cleaning liquid injection unit 40 .

6, it is assumed that each of the components of the chip accumulation area estimation device 2, that is, the cutting information acquisition unit 11, the photographed video acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 15, is realized by dedicated hardware as shown in Fig. 7. That is, it is assumed that the chip accumulation area estimation device 2 is realized by a cutting information acquisition circuit 21, a photographed video acquisition circuit 23, a visibility condition determination circuit 24, and a chip accumulation area estimation circuit 25.
Each of the cutting information acquisition circuit 21, the photographed image acquisition circuit 23, the visibility condition determination circuit 24 and the chip accumulation area estimation circuit 25 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC, an FPGA, or a combination of these.

The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware.
When the chip accumulation area estimation device 2 is realized by software, firmware, or the like, a program for causing a computer to execute the respective processing procedures of the cutting information acquisition unit 11, the photographed image acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 15 is stored in a memory 31 shown in Fig. 3. Then, a processor 32 shown in Fig. 3 executes the program stored in the memory 31.

Furthermore, Fig. 7 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, and Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software or firmware, etc. However, this is merely one example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software or firmware, etc.

Next, the operation of the chip accumulation area estimation device 2 shown in FIG. 6 will be described.
FIG. 8 is a flowchart showing a chip piled area estimating method which is a processing procedure of the chip piled area estimating device 2.
The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of the processing machine (step ST11 in FIG. 8). The cutting information includes any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, and information indicating the tool used when the processing machine cuts the object 50 to be cut.
The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 15 .

The camera 3 captures an image of the processing machine cutting the workpiece 50 , and outputs the captured image to the chip accumulation area estimation device 2 .
The captured image acquisition unit 13 acquires captured images from the camera 3 (step ST12 in FIG. 8).
The captured image acquisition unit 13 outputs the captured image to each of the visibility condition determination unit 14 and the chip accumulation area estimation unit 15.

The visibility condition determination unit 14 acquires the captured video from the captured video acquisition unit 13 .
The visibility condition determining unit 14 determines the visibility condition of chips generated from the workpiece 50 based on the captured video (step ST13 in FIG. 8).
The visibility condition determination unit 14 outputs the determination result of the visibility condition to the chip accumulation area estimation unit 15 .
The visual recognition condition determination process performed by the visual recognition condition determination unit 14 will be described in detail below.

The internal memory of the visibility condition determination unit 14 stores a video image captured when the visibility condition of the chips is good (hereinafter referred to as a "good visibility video image"). Here, it is assumed that the good visibility video image is stored in the internal memory of the visibility condition determination unit 14. However, this is merely an example, and the good visibility video image may be provided to the visibility condition determination unit 14 from outside the visibility condition determination unit 14.
The visual recognition condition determination unit 14 acquires the captured image (hereinafter referred to as “current captured image”) from the captured image acquisition unit 13 .
The visibility condition determination unit 14 calculates the difference between the good visibility image and the currently captured image.
The visibility status determination unit 14 determines that the chip visibility status is poor if the difference is equal to or greater than the threshold, and determines that the chip visibility status is good if the difference is less than the threshold. The threshold may be stored in an internal memory of the visibility status determination unit 14, or may be provided from outside the visibility status determination unit 14. A determination that the chip visibility status is poor corresponds to a determination that the chips cannot be visually recognized, and a determination that the chip visibility status is good corresponds to a determination that the chips can be visually recognized.

Here, the visibility status determination unit 14 calculates the difference between the good visibility video and the current captured video, and determines the visibility status of the chips based on the difference. However, this is merely one example, and the visibility status determination unit 14 may extract edges from each of the good visibility video and the current captured video, and determine the visibility status of the chips based on the difference between the edges extracted from the good visibility video and the edges extracted from the current captured video.
For example, in a situation where smoke or mist is occurring, the number of edges extracted from the currently captured image is reduced compared to the number of edges extracted from the image with good visibility.

The chip accumulation area estimation unit 15 acquires cutting information from the cutting information acquisition unit 11 .
The chip accumulation area estimation unit 15 acquires the photographed image from the photographed image acquisition unit 13 , and acquires the judgment result of the visibility condition from the visibility condition judgment unit 14 .
If the result of the visibility condition judgment by the visibility condition judgment unit 14 indicates that the chips are visible (step ST14 in Figure 8: YES), the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the captured image (step ST15 in Figure 8).
Specifically, the chip accumulation region estimation unit 15 detects the optical flow between a plurality of captured images captured at different times.
The chip accumulation region estimation unit 15 estimates the chip accumulation region 56 by estimating the direction in which the chips are flying and the distance the chips have flown based on the optical flow.
Here, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the optical flow. However, this is merely one example, and the chip accumulation area estimation unit 15 may estimate the chip accumulation area 56 based on the difference between the captured image before the chips are accumulated and the currently captured image.

If the result of the visual condition judgment by the visual condition judgment unit 14 indicates that the chips cannot be seen (step ST14 in Figure 8: NO), the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the cutting information, similar to the chip accumulation area estimation unit 12 shown in Figure 1 (step ST16 in Figure 8).
The chip accumulation region estimation unit 15 outputs information indicating the chip accumulation region 56 to the cleaning liquid injection unit 40 .

In a situation where the chips cannot be seen, the accuracy of estimating the chip accumulation area 56 based on the captured image is likely to be lower than the accuracy of estimating the chip accumulation area 56 based on the cutting information. On the other hand, in a situation where the chips can be seen, the accuracy of estimating the chip accumulation area 56 based on the captured image is likely to be higher than the accuracy of estimating the chip accumulation area 56 based on the cutting information.

In the above-described second embodiment, the chip accumulation area estimation device 2 is configured to include a captured image acquisition unit 13 that acquires a captured image showing the state in which the processing machine is cutting the cutting object 50, and a visibility status determination unit 14 that determines the visibility status of chips generated from the cutting object 50 based on the captured image acquired by the captured image acquisition unit 13. If the judgment result of the visibility status by the visibility status determination unit 14 indicates that the chips are visible, the chip accumulation area estimation unit 15 of the chip accumulation area estimation device 2 estimates the chip accumulation area 56 based on the captured image, and if the judgment result of the visibility status by the visibility status determination unit 14 indicates that the chips are not visible, the chip accumulation area 56 is estimated based on the cutting information acquired by the cutting information acquisition unit 11. Therefore, the chip accumulation area estimation device 2 shown in FIG. 6 can estimate the chip accumulation area 56 regardless of whether or not poor visibility occurs, and may be able to improve the estimation accuracy of the chip accumulation area 56 more than the chip accumulation area estimation device 2 shown in FIG. 1.

Embodiment 3.
In embodiment 3, a chip accumulation area estimation device 2 is described that includes a chip accumulation area estimation unit 16 that estimates a chip accumulation area 56 using a first learning model 4 or a second learning model 5.

Fig. 9 is a configuration diagram showing a chip removal device including a chip accumulation region estimation device 2 according to embodiment 3. In Fig. 9, the same reference numerals as those in Fig. 1 and Fig. 6 indicate the same or corresponding parts, and therefore detailed description thereof will be omitted.
Fig. 10 is a hardware configuration diagram showing the hardware of a chip accumulation region estimation device 2 according to embodiment 3. In Fig. 10, the same reference numerals as those in Fig. 2 and Fig. 7 indicate the same or corresponding parts, and therefore detailed description thereof will be omitted.
The chip removal device shown in FIG. 9 includes a camera 3, a first learning model 4, a second learning model 5, a chip accumulation area estimation device 2, and a cleaning liquid spraying unit 40.
9 includes a camera 3, a first learning model 4, and a second learning model 5. However, this is merely an example, and each of the camera 3, the first learning model 4, and the second learning model 5 may be provided outside the chip removal device.

The first learning model 4 is realized by, for example, a neural network.
During learning, the first learning model 4 is provided with a photographed image showing the processing machine cutting the workpiece 50 and teacher data.
The teaching data is information that indicates a chip accumulation area 56, which is an area where chips generated from the workpiece 50 accumulate when the processing machine cuts the workpiece 50.
When the first learning model 4 is given a photographed image and training data during learning, the first learning model 4 learns the chip accumulation area 56 corresponding to the photographed image. Here, the chip accumulation area 56 corresponding to the photographed image is the chip accumulation area 56 indicated by the training data.
During inference, when a photographed image is given, the first learning model 4 outputs information indicating the chip accumulation area 56 corresponding to the photographed image.

The second learning model 5 is realized, for example, by a neural network.
During learning, cutting information and teacher data are provided to the second learning model 5. The cutting information includes any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, and information indicating the tool used when the processing machine cuts the object 50 to be cut.
The teaching data is information that indicates a chip accumulation area 56, which is an area where chips generated from the workpiece 50 accumulate when the processing machine cuts the workpiece 50.
When the second learning model 5 is given cutting information and teacher data during learning, the second learning model 5 learns the chip accumulation area 56 corresponding to the cutting information. Here, the chip accumulation area 56 corresponding to the cutting information is the chip accumulation area 56 indicated by the teacher data.
During inference, when cutting information is given, the second learning model 5 outputs information indicating the chip accumulation area 56 corresponding to the cutting information.

In the chip removal device shown in FIG. 9, the first learning model 4 and the second learning model 5 are each provided outside the chip accumulation area estimation device 2. However, this is merely one example, and the first learning model 4 and the second learning model 5 may each be provided inside the chip accumulation area estimation device 2.

The chip accumulation area estimation device 2 shown in FIG. 9 includes a cutting information acquisition unit 11, a captured image acquisition unit 13, a visibility condition determination unit 14, and a chip accumulation area estimation unit 16.
The chip accumulation area estimation unit 16 is realized by, for example, a chip accumulation area estimation circuit 26 shown in FIG.
The chip accumulation region estimation unit 16 acquires cutting information from the cutting information acquisition unit 11. The cutting information includes any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, and information indicating the tool used when the processing machine cuts the object 50 to be cut.
The chip accumulation area estimation unit 16 acquires the photographed image from the photographed image acquisition unit 13 , and acquires the judgment result of the visibility condition from the visibility condition judgment unit 14 .
If the visibility condition judgment result by the visibility condition judgment unit 14 indicates that chips are visible, the chip accumulation area estimation unit 16 provides the captured image to the first learning model 4 and obtains information indicating the chip accumulation area 56 corresponding to the captured image from the first learning model 4.
If the visibility condition judgment result by the visibility condition judgment unit 14 indicates that the chips cannot be seen, the chip accumulation area estimation unit 16 provides the cutting information to the second learning model 5 and obtains information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5.
The chip accumulation area estimation unit 16 outputs information indicating the chip accumulation area 56 to the cleaning liquid injection unit 40 .

9, it is assumed that each of the components of the chip accumulation area estimation device 2, that is, the cutting information acquisition unit 11, the photographed video acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 16, is realized by dedicated hardware as shown in Fig. 10. In other words, it is assumed that the chip accumulation area estimation device 2 is realized by the cutting information acquisition circuit 21, the photographed video acquisition circuit 23, the visibility condition determination circuit 24, and the chip accumulation area estimation circuit 26.
Each of the cutting information acquisition circuit 21, the photographed image acquisition circuit 23, the visibility condition determination circuit 24 and the chip accumulation area estimation circuit 26 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC, an FPGA, or a combination of these.

The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware.
When the chip accumulation area estimation device 2 is realized by software, firmware, or the like, a program for causing a computer to execute the respective processing procedures of the cutting information acquisition unit 11, the photographed image acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 16 is stored in a memory 31 shown in Fig. 3. Then, a processor 32 shown in Fig. 3 executes the program stored in the memory 31.

Furthermore, Fig. 10 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, and Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software or firmware, etc. However, this is merely one example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software or firmware, etc.

Next, the operation of the chip accumulation area estimation device 2 shown in FIG. 9 will be described.
FIG. 11 is a flowchart showing a chip piled area estimation method which is a processing procedure of the chip piled area estimation device 2.
The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of a processing machine (step ST21 in FIG. 11).
The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 16 .

The camera 3 captures an image of the processing machine cutting the workpiece 50 , and outputs the captured image to the chip accumulation area estimation device 2 .
The captured image acquisition unit 13 acquires captured images from the camera 3 (step ST22 in FIG. 11).
The captured image acquisition unit 13 outputs the captured image to each of the visibility condition determination unit 14 and the chip accumulation area estimation unit 16.

The visibility condition determination unit 14 acquires the captured video from the captured video acquisition unit 13 .
The visibility condition determining unit 14 determines the visibility condition of chips generated from the workpiece 50 based on the captured video (step ST23 in FIG. 11).
The visibility condition determination unit 14 outputs the visibility condition determination result to the chip accumulation area estimation unit 16 .

The chip accumulation region estimation unit 16 acquires cutting information from the cutting information acquisition unit 11 .
The chip accumulation area estimation unit 16 acquires the photographed image from the photographed image acquisition unit 13 , and acquires the judgment result of the visibility condition from the visibility condition judgment unit 14 .
If the visibility condition judgment result by the visibility condition judgment unit 14 indicates that chips are visible (step ST24 in Figure 11: YES), the chip accumulation area estimation unit 16 provides the captured image to the first learning model 4 and obtains information indicating the chip accumulation area 56 corresponding to the captured image from the first learning model 4 (step ST25 in Figure 11).

If the visibility condition judgment result by the visibility condition judgment unit 14 indicates that the chips cannot be seen (step ST24: NO in Figure 11), the chip accumulation area estimation unit 16 provides the cutting information to the second learning model 5 and obtains information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5 (step ST26 in Figure 11).
The chip accumulation area estimation unit 16 outputs information indicating the chip accumulation area 56 to the cleaning liquid injection unit 40 .

In the above-described third embodiment, there is a first learning model 4 in which a photographed image showing the cutting of the cutting object 50 by the processing machine and teacher data showing the chip accumulation area 56 are given, and the chip accumulation area 56 corresponding to the photographed image is learned, and a second learning model 5 in which cutting information and teacher data showing the chip accumulation area 56 are given, and the chip accumulation area 56 corresponding to the cutting information is learned. The chip accumulation area estimation device 2 shown in FIG. 9 is configured to include a photographed image acquisition unit 13 that acquires a photographed image showing the cutting of the cutting object 50 by the processing machine, and a visibility status determination unit 14 that determines the visibility status of chips generated from the cutting object 50 based on the photographed image acquired by the photographed image acquisition unit 13. In the chip accumulation area estimation device 2 shown in FIG. 9, if the result of the determination of the visibility situation by the visibility situation determination unit 14 indicates that the chips are visible, the chip accumulation area estimation unit 16 provides the photographed image acquired by the photographed image acquisition unit 13 to the first learning model 4, and acquires information indicating the chip accumulation area 56 corresponding to the photographed image from the first learning model 4, and if the result of the determination of the visibility situation by the visibility situation determination unit 14 indicates that the chips are not visible, the chip accumulation area estimation unit 16 provides the cutting information acquired by the cutting information acquisition unit 11 to the second learning model 5, and acquires information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5. Therefore, the chip accumulation area estimation device 2 shown in FIG. 9 can estimate the chip accumulation area 56 regardless of whether poor visibility occurs, and may be able to improve the estimation accuracy of the chip accumulation area 56 more than the chip accumulation area estimation device 2 shown in FIG. 1.

In addition, this disclosure allows for any combination of the embodiments, any modification of any component of each embodiment, or any omission of any component of each embodiment.

The present disclosure is suitable for a chip accumulation area estimation device, a chip accumulation area estimation method, and a chip removal device.

1 Learning model, 2 Chip accumulation area estimation device, 3 Camera, 4 First learning model, 5 Second learning model, 11 Cutting information acquisition unit, 12 Chip accumulation area estimation unit, 13 Photographed image acquisition unit, 14 Visibility status determination unit, 15, 16 Chip accumulation area estimation unit, 21 Cutting information acquisition circuit, 22 Chip accumulation area estimation circuit, 23 Photographed image acquisition circuit, 24 Visibility status determination circuit, 25, 26 Chip accumulation area estimation circuit, 31 Memory, 32 Processor, 40 Cleaning liquid injection unit, 50 Cutting object, 51 Table, 52 Spindle, 53 Nozzle, 54 Cover, 55 Slope, 56 Chip accumulation area.

Claims (12)

a cutting information acquisition unit that acquires cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting;
a captured image acquisition unit for acquiring a captured image of chips generated from a cutting object cut by the processing machine;
and a chip accumulation area estimation unit that estimates a chip accumulation area, which is an area where the chips are accumulated, based on at least one of the captured image and the cutting information, based on the state of the captured image acquired by the captured image acquisition unit.
A chip accumulation area estimation device characterized by the above . a cutting information acquisition unit that acquires cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting;
a captured image acquisition unit for acquiring a captured image of chips generated from a cutting object cut by the processing machine;
a visibility status determination unit that determines a visibility status of the chips included in the captured image based on the captured image ;
and a chip accumulation area estimation unit that, when the determination result of the visibility situation by the visibility situation determination unit indicates that the chips are visible, estimates a chip accumulation area, which is an area where the chips are accumulated , based on the captured image, and, when the determination result of the visibility situation by the visibility situation determination unit indicates that the chips are not visible, estimates the chip accumulation area based on the cutting information.
A chip accumulation area estimation device characterized by the above. The chip accumulation region estimation device according to claim 1 , wherein the state of the captured image includes a visual recognition state of the chips contained in the captured image. The information on the object to be cut by the processing machine includes information indicating a material of the object to be cut,
The chip accumulation area estimation device according to claim 1 or claim 2, characterized in that the information relating to the machining device that performs cutting includes information indicating a cutting method of the machining device for the object to be cut, or information indicating a tool used by the machining device when cutting the object to be cut. 3. The chip accumulation area estimation device according to claim 1 or 2, characterized in that the chip accumulation area estimation unit is provided with the cutting information and teacher data indicating the chip accumulation area, provides the cutting information to a learning model which has learned the chip accumulation area corresponding to the cutting information, obtains information indicating the chip accumulation area based on the cutting information from the learning model, and estimates the chip accumulation area. The learning model in which the chip accumulation area corresponding to the cutting information is learned is a second learning model,
6. The chip accumulation area estimation device according to claim 5, wherein the chip accumulation area estimation unit provides the captured image to a first learning model that is given the captured image and teacher data indicating the chip accumulation area and has learned the chip accumulation area corresponding to the captured image, obtains information indicating the chip accumulation area based on the captured image from the first learning model, and estimates the chip accumulation area. The chip accumulation area estimation device according to claim 1 ;
a cleaning liquid jetting unit that jets a cleaning liquid for washing away the chips accumulated in the chip accumulation area estimated by the chip accumulation area estimation unit. The chip accumulation area estimation device according to claim 2 ,
a cleaning liquid jetting unit that jets a cleaning liquid for washing away the chips accumulated in the chip accumulation area estimated by the chip accumulation area estimation unit. acquiring cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting, by a cutting information acquisition unit;
A step of acquiring, by a captured image acquiring unit, a captured image of chips generated from a cutting object cut by the processing machine;
and estimating a chip accumulation area, which is an area where the chips are accumulated, by a chip accumulation area estimation unit based on at least one selected from the captured image and the cutting information, based on the state of the captured image acquired by the captured image acquisition unit.
A chip accumulation area estimation method comprising : acquiring cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting, by a cutting information acquisition unit;
A step of acquiring, by a captured image acquiring unit, a captured image of chips generated from a cutting object cut by the processing machine;
A step of determining a visibility state of the chips included in the photographed image by a visibility state determination unit based on the photographed image;
and estimating a chip accumulation area, which is an area where the chips are accumulated, by a chip accumulation area estimation unit based on the captured image when the determination result of the visibility situation by the visibility situation determination unit determines that the chips are visible, and estimating the chip accumulation area by the chip accumulation area estimation unit based on the cutting information when the determination result of the visibility situation by the visibility situation determination unit determines that the chips are not visible.
A chip accumulation area estimation method comprising: On the computer,
A process of acquiring cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting;
A process of acquiring a photographed image of chips generated from a cutting object cut by the processing machine;
and a process of estimating a chip accumulation area, which is the area where the chips accumulate, based on at least one selected from the captured image and the cutting information, based on the status of the acquired captured image. On the computer,
A process of acquiring cutting information including information on a cutting object to be cut by a processing machine or information on the processing machine that performs cutting;
A process of acquiring a photographed image of chips generated from a cutting object cut by the processing machine;
A process of determining a visibility state of the chips included in the captured image based on the captured image;
A program for executing a process of estimating a chip accumulation area, which is the area where the chips are accumulated, based on the captured image when the judgment result of the visibility condition determines that the chips are visible, and estimating the chip accumulation area based on the cutting information when the judgment result of the visibility condition determines that the chips are not visible.

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