JP7476928B2 - Display device - Google Patents

Description

The present invention relates to a display device.

In a display device, partitions may be provided that separate pixels or sub-pixels from each other (see Patent Documents 1 and 2). The partitions can, for example, make it possible to use light efficiently or prevent color mixing.

JP 2018-189920 A JP 2015-064391 A

The present invention aims to provide a display device with excellent heat dissipation properties.

According to one aspect of the present invention, a display device is provided that includes a transparent substrate having a first main surface and a second main surface, a black matrix provided on the first main surface and having a plurality of first through holes, a resin layer provided on the black matrix and having a plurality of second through holes at the positions of the first through holes, and a reflective layer that at least partially covers the side walls of each of the second through holes and the upper surface of the resin layer, a light control device installed to face the first main surface, an adhesive layer interposed between the black matrix substrate and the light control device and bonding them together, a heat sink located outside the laminate of the black matrix substrate, the light control device, and the adhesive layer, and a heat conductor that conducts heat from the reflective layer to the heat sink.

According to another aspect of the present invention, the light control device is a display device according to the above aspect that includes a plurality of light emitting elements.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the light control device includes a plurality of light emitting diodes.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the black matrix substrate further includes a plurality of wavelength conversion layers each provided in at least a portion of the plurality of second through holes.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the black matrix substrate further includes a color filter including a plurality of colored layers each disposed at at least some of the positions of the plurality of first through holes.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the reflective layer includes a layer made of a metal or an alloy.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the heat sink includes a back surface heat sink arranged to face the black matrix substrate with the light control device and the adhesive layer sandwiched therebetween.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the rear surface heat sink is a rear surface heat sink layer provided on the light control device.

According to yet another aspect of the present invention, the display device according to any of the above aspects is provided, in which the heat sink is provided on the second main surface and includes a front heat sink layer that opens at the positions of the plurality of first through holes.

According to yet another aspect of the present invention, there is provided a display device according to the above aspect, in which the front heat dissipation layer has a black surface.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the heat transfer body is at least partially provided outside the laminate.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the heat transfer body at least partially covers the end face of the laminate.

According to yet another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the heat transfer body includes a main heat transfer body provided outside the laminate and an auxiliary heat transfer body provided on the reflective layer at the periphery of the black matrix substrate.

According to yet another aspect of the present invention, there is provided a black matrix substrate including: a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; a resin layer provided on the black matrix and having a plurality of second through holes respectively at the positions of the plurality of first through holes; and a reflective layer at least partially covering each of the side walls of the plurality of second through holes and an upper surface of the resin layer; a front heat dissipation layer provided on the second main surface and opening at the positions of the plurality of first through holes ; and a heat conductor thermally connecting the reflective layer and the front heat dissipation layer .

According to yet another aspect of the present invention, there is provided a heat dissipating black matrix substrate according to the above aspect, in which the front heat dissipation layer has a black surface.

According to yet another aspect of the present invention, there is provided a heat dissipative black matrix substrate according to any of the above aspects, wherein the black matrix substrate further includes a plurality of wavelength conversion layers each provided in at least a portion of the plurality of second through holes.

According to yet another aspect of the present invention, there is provided a heat dissipating black matrix substrate according to any of the above aspects, in which the black matrix substrate further includes a color filter including a plurality of colored layers each disposed at at least some of the positions of the plurality of first through holes.

According to yet another aspect of the present invention, there is provided a heat dissipating black matrix substrate according to any of the above aspects, in which the reflective layer includes a layer made of a metal or an alloy.

The present invention provides a display device with excellent heat dissipation properties.

FIG. 1 is a plan view showing a part of a display device according to a first embodiment of the present invention. FIG. 2 is an equivalent circuit diagram of the display device shown in FIG. 3 is a cross-sectional view taken along line III-III of the display device shown in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV of the display device shown in FIG. FIG. 5 is a plan view showing a part of a black matrix substrate included in the display device of FIG. FIG. 6 is a cross-sectional view showing a part of a display device according to a second embodiment of the present invention. FIG. 7 is another cross-sectional view showing a part of the display device according to the second embodiment of the present invention. FIG. 8 is a plan view showing a part of a black matrix substrate included in a display device according to a first modified example. FIG. 9 is a plan view showing a part of a black matrix substrate included in a display device according to a second modified example.

Below, an embodiment of the present invention will be described with reference to the drawings. The embodiment described below is a more specific embodiment of any of the above aspects. The items described below can be incorporated into each of the above aspects, either alone or in combination.

The embodiments shown below are merely examples of configurations for embodying the technical idea of the present invention, and the technical idea of the present invention is not limited by the materials, shapes, structures, etc. of the components described below. Various modifications can be made to the technical idea of the present invention within the technical scope defined by the claims.

In addition, elements having the same or similar functions are given the same reference symbols in the drawings referred to below, and duplicate explanations will be omitted. In addition, the drawings are schematic, and the relationship between dimensions in one direction and dimensions in another direction, and the relationship between the dimensions of one component and the dimensions of another component, etc. may differ from the actual ones.

<1> First embodiment Fig. 1 is a plan view showing a part of a display device according to a first embodiment of the present invention. Fig. 2 is an equivalent circuit diagram of the display device shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III of the display device shown in Fig. 1. Fig. 4 is a cross-sectional view taken along line IV-IV of the display device shown in Fig. 1. Fig. 5 is a plan view showing a part of a black matrix substrate included in the display device of Fig. 1. Note that in Fig. 1, the area surrounded by a dashed line represents an opening of a first through-hole on the transparent substrate 31 side of a black matrix 32, as described later.

The display device 1A shown in Figures 1 to 4 is a micro LED display capable of color display using an active matrix driving method, with each sub-pixel containing a light-emitting diode (LED).

In each figure, the X direction and the Y direction are parallel to the display surface of the display device 1A and intersect with each other. According to one example, the X direction and the Y direction are perpendicular to each other. The Z direction is perpendicular to the X direction and the Y direction. In other words, the Z direction is the thickness direction of the display device 1A.

As shown in FIG. 2, the display device 1A includes a video signal line VSL, a power supply line PSL, a scanning signal line SSL, a pixel PX, a video signal line driver VDR, and a scanning signal line driver SDR.

The video signal lines VSL and power supply lines PSL each extend in the Y direction and are arranged alternately in the X direction. The scanning signal lines SSL each extend in the X direction and are arranged in the Y direction.

The pixels PX are arranged in the X and Y directions. Each pixel PX includes a first sub-pixel PXR, a second sub-pixel PXG, and a third sub-pixel PXB. The first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB are arranged corresponding to the intersections of the video signal lines VSL and the scanning signal lines SSL.

The first subpixel PXR, the second subpixel PXG, and the third subpixel PXB emit light of different colors. Here, as an example, the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB emit red light, green light, and blue light, respectively.

In each pixel PX, the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB are arranged in this order in the X direction. The arrangement order of the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB in each pixel PX can be changed.

Here, the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB form a stripe arrangement. The first subpixel PXR, the second subpixel PXG, and the third subpixel PXB may form other arrangements, such as a delta arrangement and a mosaic arrangement.

Each of the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB includes a light-emitting element D, a drive control element DR, a switch SW, and a capacitor C.

The light-emitting element D is a light-emitting diode. The light-emitting diode is, for example, a light-emitting diode made of an inorganic material. A light-emitting diode made of an inorganic material can be obtained, for example, by singulating a laminate having a similar layer structure into a plurality of parts. The light-emitting element D may be an electroluminescence element, which is a light-emitting diode made of an organic material. The cathode of the light-emitting element D is connected to a ground electrode. Here, as an example, the light-emitting element D is a blue light-emitting diode made of an inorganic material that emits blue light.

The drive control element DR and the switch SW are field effect transistors. Here, the drive control element DR is a p-channel thin-film transistor, and the switch SW is an n-channel thin-film transistor. The drive control element DR has a gate connected to the drain of the switch SW, a source connected to the power supply line PSL, and a drain connected to the anode of the light-emitting element D. The switch SW has a gate connected to the scanning signal line SSL, and a source connected to the video signal line VSL.

The capacitor C is, for example, a thin-film capacitor. One electrode of the capacitor C is connected to the gate of the drive control element DR, and the other electrode is connected to the power supply line PSL.

The first subpixel PXR further includes a first wavelength conversion layer 36R and a first colored layer 33R as shown in Figures 3 and 4.

The first wavelength conversion layer 36R is disposed to face the light-emitting element D of the first subpixel PXR. The first wavelength conversion layer 36R converts the light emitted by the light-emitting element D of the first subpixel PXR into a first light of a specific color. For example, the first wavelength conversion layer 36R converts the blue light emitted by the light-emitting element D of the first subpixel PXR into red light.

The first colored layer 33R is disposed to face the light-emitting element D of the first subpixel PXR with the first wavelength conversion layer 36R sandwiched therebetween. The first colored layer 33R transmits light after wavelength conversion by the first wavelength conversion layer 36R and absorbs light that has not been wavelength-converted by the first wavelength conversion layer 36R. The first colored layer 33R is, for example, a red colored layer that transmits red light after wavelength conversion by the first wavelength conversion layer 36R and absorbs blue light and the like that has not been wavelength-converted by the first wavelength conversion layer 36R.

The second subpixel PXG further includes a second wavelength conversion layer 36G and a second colored layer 33G as shown in FIG. 3.

The second wavelength conversion layer 36G is disposed to face the light-emitting element D of the second subpixel PXG. The second wavelength conversion layer 36G converts the light emitted by the light-emitting element D of the second subpixel PXG into a second light having a different color from the first light. For example, the second wavelength conversion layer 36G converts the blue light emitted by the light-emitting element D of the second subpixel PXG into green light.

The second colored layer 33G is disposed so as to face the light-emitting element D of the second subpixel PXG with the second wavelength conversion layer 36G sandwiched therebetween. The second colored layer 33G transmits light after wavelength conversion by the second wavelength conversion layer 36G and absorbs light that has not been wavelength converted by the second wavelength conversion layer 36G. The second colored layer 33G is, for example, a green colored layer that transmits green light after wavelength conversion by the second wavelength conversion layer 36G and absorbs blue light and the like that has not been wavelength converted by the second wavelength conversion layer 36G.

The third subpixel PXB further includes a base layer 33B and a filling layer 36B as shown in FIG. 3.

The filling layer 36B is disposed to face the light-emitting element D of the third subpixel PXB. The filling layer 36B is, for example, a colorless and transparent layer. The filling layer 36B may be omitted.

The base layer 33B is disposed so as to face the light-emitting element D of the third subpixel PXB with the filling layer 36B sandwiched therebetween. The base layer 33B transmits the light emitted by the light-emitting element D of the third subpixel PXB as third light. The base layer 33B is, for example, a colorless light-transmitting layer or a blue-colored layer that transmits the blue light emitted by the light-emitting element D of the third subpixel PXB.

The video signal line driver VDR and the scan signal line driver SDR are mounted on the display panel using a chip on glass (COG) as shown in FIG. 2. The video signal line driver VDR and the scan signal line driver SDR may be mounted using a tape carrier package (TCP) instead of a COG mounting.

The video signal line driver VDR is connected to the video signal line VSL and the power supply line PSL. The video signal line driver VDR outputs a voltage signal as a video signal to the video signal line VSL.

The scanning signal line driver SDR is connected to the scanning signal line SSL. The scanning signal line driver SDR outputs a voltage signal as a scanning signal to the scanning signal line SSL. The power supply line PSL may be connected to the scanning signal line driver SDR instead of being connected to the video signal line driver VDR.

The display device 1A will now be described in further detail.
As shown in Figures 3 and 4, the display device 1A includes a light control device 2, a black matrix substrate 3A, an adhesive layer 4, a heat sink 5A, and a heat conductor consisting of a main heat conductor 6A and an auxiliary heat conductor 7.

The light control device is a device that emits light toward a black matrix substrate and can adjust at least one of the intensity of the light and the time for emitting the light for each pixel or each subpixel. The light control device 2 shown in Figures 3 and 4 includes a substrate 21, a semiconductor layer 22, conductor layers 23A, 23B, 23C, and 23D, insulating layers 24A, 24B, and 24C, a light emitting element 25, a partition layer 26, a filling layer 27, and a conductor layer 28.

The substrate 21 includes an insulating substrate such as a glass substrate. The substrate 21 may further include an undercoat layer provided on the main surface of the insulating substrate facing the black matrix substrate 3A. The undercoat layer is, for example, a laminate of a silicon nitride layer and a silicon oxide layer sequentially laminated on the insulating substrate. The substrate 21 may be a semiconductor substrate such as a silicon substrate. The substrate 21 may be either rigid or flexible.

The semiconductor layers 22 are arranged on the main surface of the substrate 21 facing the black matrix substrate 3A. The semiconductor layers 22 are, for example, polysilicon layers. The semiconductor layers 22 are semiconductor layers of thin-film transistors constituting the drive control elements DR or the switches SW. Each semiconductor layer 22 includes a source and a drain, and a channel region interposed between them.

The conductor layer 23A is a conductor pattern provided on the main surface of the substrate 21. The conductor layer 23A constitutes the video signal line VSL, the power supply line PSL, the source electrode SE, the drain electrode DE, and the lower electrode (not shown) of the capacitor C. The source electrode SE and the drain electrode DE are connected to the source and drain of the semiconductor layer 22, respectively. The conductor layer 23A is made of a metal or an alloy. The conductor layer 23A may have a single-layer structure or a multi-layer structure.

The insulating layer 24A covers the conductor layer 23A and the main surface of the substrate 21. The insulating layer 24A can be formed using, for example, TEOS (tetraethyl orthosilicate). The gate insulating film of each thin-film transistor constituting the drive control element DR or the switch SW is part of the insulating layer 24A. The dielectric layer of each capacitor C is another part of the insulating layer 24A.

The conductor layer 23B is a conductor pattern provided on the insulating layer 24A. The gate electrode GE of each thin film transistor constituting the drive control element DR or switch SW is part of the conductor layer 23B. Each gate electrode GE faces the channel region of the semiconductor layer 22 with the insulating layer 24A sandwiched therebetween. The upper electrode (not shown) of each capacitor C is another part of the conductor layer 23B. Each upper electrode faces the lower electrode of the capacitor C including this upper electrode with the insulating layer 24A sandwiched therebetween. The conductor layer 23B is made of a metal or an alloy. The conductor layer 23B may have a single-layer structure or a multi-layer structure.

The insulating layer 24B covers the conductor layer 23B and the insulating layer 24A. The insulating layer 24B is an interlayer insulating film. The insulating layer 24B is made of an inorganic insulator such as silicon oxide. The insulating layer made of an inorganic insulator can be formed by, for example, plasma CVD (chemical vapor deposition).

As shown in FIG. 4, the conductor layer 23C is a conductor pattern provided on the insulating layer 24B. The conductor layer 23C constitutes the scanning signal line SSL. The source electrode SE and the drain electrode DE may be provided on the insulating layer 24B instead of on the insulating layer 24A. That is, the scanning signal line SSL and the source electrode SE and the drain electrode DE may be formed by the conductor layer 23C.

The insulating layer 24C covers the conductor layer 23C and the insulating layer 24B. The insulating layer 24C is a passivation film. The insulating layer 24C is made of an inorganic insulator such as silicon nitride.

The conductor layer 23D is a conductor pattern provided on the insulating layer 24C. The conductor layer 23D constitutes electrode pads arranged in the X direction and the Y direction corresponding to the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB. A through hole is provided in the laminate consisting of the insulating layers 24A, 24B, and 24C at the position of the drain electrode DE connected to the drain of the drive control element DR. Each electrode pad is connected to the drain electrode DE via this through hole. The conductor layer 23D is made of, for example, a metal or an alloy. The conductor layer 23D may have a single-layer structure or a multi-layer structure.

The contour of the orthogonal projection of each electrode pad onto a plane perpendicular to the Z direction is spaced apart from and surrounds the orthogonal projection onto the plane ahead of the light-emitting element 25 placed on the electrode pad. That is, the electrode pad has a larger dimension in the direction perpendicular to the Z direction compared to the light-emitting element 25. Therefore, the electrode pad also serves as a reflective layer that reflects light traveling toward the substrate 21. The electrode pad does not have to fulfill this role as a reflective layer. In this case, the reflective layer that fulfills this role may or may not be provided separately from the electrode pad.

The light-emitting element 25 shown in Figures 3 and 4 is the light-emitting element D shown in Figure 2. The light-emitting element 25 is disposed on an electrode pad.

Here, the light-emitting element 25 is a light-emitting diode made of an inorganic material. Note that a substrate including a light-emitting diode as the light-emitting element 25 is sometimes called an "LED substrate."

The light-emitting element 25 has a multi-layer structure including multiple layers, for example, a first layer 251, a second layer 252, and a third layer 253. Here, the stacking direction of the layers included in the light-emitting element 25 is the Z direction. This stacking direction may be perpendicular to the Z direction.

Each light-emitting element 25 includes an anode and a cathode. The light-emitting element 25 has an anode and a cathode on one side. The anode of the light-emitting element 25 is connected to an electrode pad via a bonding wire (not shown). When the light-emitting element 25 has an anode on one side and a cathode on the other side, the light-emitting element 25 may be bonded to the electrode pad and the anode may be connected to the electrode pad by die bonding using a conductive material such as a conductive paste as a bonding material. When the light-emitting element 25 has an anode and a cathode on one side, the conductor layer 28 may be omitted, and electrode pads for connecting to the cathode of the light-emitting element 25 may be further provided on the insulating layer 24C, and wiring connected to these electrode pads may be further provided between the insulating layers, and the light-emitting element 25 may be bonded to the electrode pad and the conductor layer 28 and the anode and cathode may be connected to the electrode pads by flip-chip bonding.

The dimensions of the light-emitting element 25 in the X and Y directions are preferably in the range of 1 to 100 μm, more preferably in the range of 5 to 80 μm, and even more preferably in the range of 10 to 60 μm. The dimensions of the light-emitting element 25 in the Z direction are preferably in the range of 1 to 20 μm, more preferably in the range of 1 to 15 μm, and even more preferably in the range of 1 to 10 μm.

The partition layer 26 is provided on the insulating layer 24C. The partition layer 26 has through holes at the positions of the electrode pads. The light-emitting elements 25 are located in these through holes. The partition layer 26 is made of, for example, a resin. Such a partition layer 26 can be formed by photolithography using a photosensitive resin. The partition layer 26 may include a resin layer having through holes and a reflective layer that covers the side walls of the through holes and, optionally, the upper surface of the resin layer. The reflective layer may have a single-layer structure or a multi-layer structure. The layers included in the reflective layer are, for example, metals, alloys, or transparent dielectrics. The partition layer 26 may be omitted.

The filling layer 27 fills the gap between the light emitting element 25 and the partition layer 26. The filling layer 27 is a light transmitting layer that transmits the light emitted by the light emitting element 25. The filling layer 27 also serves as a protective layer that protects the light emitting element 25 and the joint between the light emitting element 25 and the electrode. The filling layer 27 is made of, for example, a resin. It is preferable that the refractive index of the filling layer 27 is different from the refractive index of the material that constitutes the surface of the partition layer 26.

The conductor layer 28 is provided on the partition layer 26 and the filling layer 27. The cathode of the light-emitting element 25 is connected to the conductor layer 28. When the conductor layer 28 is made of a conductive transparent oxide, it can be provided so as to cover the entire cathode of the light-emitting element 25. When the conductor layer 28 is made of a metal or an alloy, it is preferable that the conductor layer 28 is provided so as to partially cover the cathode of the light-emitting element 25.

The black matrix substrate 3A faces the light control device 2. Specifically, the black matrix substrate 3A faces the substrate 21 with the light emitting element 25 and the like sandwiched therebetween.

The black matrix substrate 3A includes a transparent substrate 31, a black matrix 32, a resin layer 34, a reflective layer 35, a color filter including a first colored layer 33R and a second colored layer 33G, a base layer 33B, a first wavelength conversion layer 36R, a second wavelength conversion layer 36G, and a filling layer 36B.

The transparent substrate 31 is transparent to visible light. The transparent substrate 31 is, for example, a colorless substrate. The transparent substrate 31 may have a single-layer structure or a multi-layer structure. The transparent substrate 31 is made of, for example, glass, a transparent resin, or a combination thereof. The transparent substrate 31 may be hard or flexible. The transparent substrate 31 has a first main surface facing the dimming device 2 and a second main surface that is the back surface of the first main surface.

The black matrix 32 is provided on the first main surface of the transparent substrate 31. The black matrix 32 is a black layer that blocks visible light. The black matrix 32 is made of, for example, a mixture containing a binder resin and a colorant. The colorant is, for example, a black pigment or a mixture of pigments that exhibit black color through subtractive color mixing, for example, a mixture containing a blue pigment, a green pigment, and a red pigment.

The black matrix 32 has first through holes at the positions of the light-emitting elements 25. The opening of each first through hole on the transparent substrate 31 side has a larger dimension in the direction perpendicular to the Z direction than the light-emitting elements 25.

Here, the opening of the first through hole on the transparent substrate 31 side has a shape extending in the Y direction as shown by the dashed line in FIG. 1. Each portion of the black matrix 32 corresponding to the pixel PX includes a first through hole provided at the position of the first sub-pixel PXR, a first through hole provided at the position of the second sub-pixel PXG, and a first through hole provided at the position of the third sub-pixel PXB, and these three first through holes are arranged in the X direction. A plurality of first through hole groups each consisting of these three first through holes are arranged in the X direction and the Y direction. The distance between adjacent first through hole groups in the X direction is larger than the distance between first through holes included in the same through hole group. The distance between adjacent first through hole groups in the Y direction is also larger than the distance between first through holes included in the same through hole group.

The aperture ratio of the black matrix 32 is preferably in the range of 5 to 66%, more preferably in the range of 5 to 40%, and even more preferably in the range of 5 to 20%. Light-emitting diodes made of inorganic materials can emit light brightly even when the light-emitting surface is small, and also have a long life. Therefore, when the light-emitting element 25 is a light-emitting diode made of inorganic materials, a bright display is possible even if the aperture ratio of the black matrix 32 is reduced. Furthermore, by reducing the aperture ratio of the black matrix 32, reflection of external light can be suppressed, and a deeper black color can be displayed, thereby achieving a higher contrast ratio.

The thickness of the black matrix 32 is preferably in the range of 1 to 30 μm, more preferably in the range of 1 to 15 μm, and even more preferably in the range of 1 to 5 μm. A thick black matrix 32 is advantageous in achieving high light blocking properties. However, if the black matrix 32 is made thick, the light may not reach the depths of the coating film made of the photosensitive black composition with sufficient intensity during pattern exposure, making it difficult to achieve high shape precision.

The resin layer 34 is provided on the black matrix 32 as shown in Figs. 3 and 4. According to one example, the resin layer 34 is transparent. In this case, the resin layer 34 may be colored or colorless. The resin layer 34 may have light scattering properties. Assuming that the transparent resin layer 34 has a thickness of, for example, 5 µm, it is desirable that the maximum transmittance of light having a wavelength in the range of 350 to 480 nm incident in the thickness direction is 20% or more.

The resin layer 34 has second through holes at the positions of the first through holes. These second through holes constitute a second through hole group corresponding to the above-mentioned first through hole group. Each of the second through hole groups consists of three second through holes arranged in the X direction here. The second through hole groups are arranged in a first direction and a second direction that intersect with each other, here the X direction and the Y direction.

5, the distance W _x 1 between adjacent second through hole groups in the X direction is greater than the distance W1 between second through holes included in the same through hole group, and the distance W _y 1 between adjacent second through hole groups in the Y direction is also greater than the distance W1 between second through holes included in the same through hole group.

Distance W1 is preferably in the range of 5 to 80 μm, more preferably in the range of 5 to 40 μm, and even more preferably in the range of 5 to 20 μm.

The distance W _x 1 is preferably in the range of 5 to 250 μm, more preferably in the range of 50 to 250 μm, and even more preferably in the range of 100 to 250 μm.

The distance W _y 1 is preferably in the range of 5 to 250 μm, more preferably in the range of 5 to 100 μm, and even more preferably in the range of 5 to 50 μm.

The ratio W _x 1/W 1 of the distance W _x 1 to the distance W 1 is preferably in the range of 0.1 to 50, more preferably in the range of 2 to 20, and further preferably in the range of 5 to 15. The distance W _x 1 may be equal to the distance W 1 or may be smaller than the distance W 1.

The ratio W _y 1/W 1 of the distance W _y 1 to the distance W 1 is preferably in the range of 0.1 to 50, more preferably in the range of 0.1 to 10, and even more preferably in the range of 0.1 to 5. The distance W _y 1 may be equal to the distance W 1 or may be smaller than the distance W 1.

Here, the second through-hole is provided such that the contour of the orthogonal projection of the opening on the transparent substrate 31 side onto the first main surface (hereinafter referred to as the second contour) surrounds the contour of the orthogonal projection of the first through-hole onto the first main surface (hereinafter referred to as the first contour). The second contour does not have to surround the first contour. In a structure in which the second contour surrounds the first contour, the effect of stray light on the display is smaller than in a structure in which the second contour does not surround the first contour.

The portion of the resin layer 34 that is sandwiched between adjacent second through holes has a forward tapered cross-sectional shape. This portion may have a rectangular cross-sectional shape, a reverse tapered cross-sectional shape, or another cross-sectional shape.

The thickness of the resin layer 34 is preferably in the range of 5 to 50 μm, more preferably in the range of 5 to 40 μm, and even more preferably in the range of 10 to 25 μm. If the thickness of the resin layer 34 is small, it is difficult to increase the total thickness of the layers formed in the second through holes. If the resin layer 34 is made thicker, the shape accuracy of the partition portion sandwiched between adjacent second through holes decreases.

The reflective layer 35 at least partially covers the side walls of each of the second through holes and the upper surface of the resin layer 34. Here, as shown in FIG. 3 to FIG. 5, the reflective layer 35 covers the entire side walls of each of the second through holes, the entire upper surface of the resin layer 34, and the part of the black matrix 32 that is not covered by the resin layer 34. The reflective layer 35 may not cover a part of the side walls of the second through holes. For example, the reflective layer 35 may not cover at least one of the part of at least one side wall of the second through hole that is near the black matrix 32 and the part of at least one side wall of the second through hole that is near the upper surface of the resin layer 34. The reflective layer 35 may not cover the part of the black matrix 32 that is not covered by the resin layer 34.

The portion of the reflective layer 35 located within the second through-hole opens at the position of the first colored layer 33R, the second colored layer 33G, or the base layer 33B. The area S2 of each of these openings is preferably larger than the area S1 of the opening of the first through-hole. The ratio S2/S1 of the area S2 to the area S1 is preferably in the range of 1 to 100, more preferably in the range of 1 to 30, and even more preferably in the range of 1 to 2.

The reflective layer 35 may have a single-layer structure or a multi-layer structure. The layers contained in the reflective layer 35 are, for example, metals, alloys, or transparent dielectrics. From the viewpoint of thermal conductivity, it is preferable that the reflective layer 35 includes a layer made of a metal or an alloy. According to one example, the reflective layer 35 is made of aluminum or an aluminum alloy.

The thickness of the reflective layer 35 covering the upper surface of the resin layer 34 is preferably in the range of 100 to 5000 nm, and more preferably in the range of 100 to 1000 nm. Increasing the thickness of the reflective layer 35 improves the thermal conductivity in the in-plane direction. However, increasing the thickness of the reflective layer 35 increases the manufacturing cost.

The reflective layer 35 can be formed, for example, by performing deposition by a vapor phase deposition method such as sputtering or vacuum deposition, formation of an etching mask, and etching such as wet etching in this order. The etching mask can be formed by photolithography using a photosensitive resin. The transparent resin layer used as the etching mask may or may not be removed after the above etching.

As shown in Figures 3 and 4, the first colored layer 33R fills the first through-hole at the position of the first sub-pixel PXR. As described above, here, the first colored layer 33R is a red colored layer.

As shown in FIG. 3, the second colored layer 33G fills the first through-hole at the position of the second subpixel PXG. As described above, here, the second colored layer 33G is a green colored layer.

As shown in FIG. 3, the base layer 33B fills the first through-hole at the position of the third subpixel PXB. As described above, in this case, it is a colorless light-transmitting layer or a blue-colored layer.

The first wavelength conversion layer 36R is provided on the first colored layer 33R and fills at least the bottom of the second recess. The first wavelength conversion layer 36R is a layer containing a phosphor such as a quantum dot phosphor and a transparent resin. As described above, here, the first wavelength conversion layer 36R converts the blue light emitted by the light-emitting element D of the first subpixel PXR into red light.

The second wavelength conversion layer 36G is provided on the second colored layer 33G and fills at least the bottom of the second recess. The second wavelength conversion layer 36G is a layer containing a phosphor such as a quantum dot phosphor and a transparent resin. As described above, the second wavelength conversion layer 36G converts the blue light emitted by the light-emitting element D of the second subpixel PXG into red light.

The filling layer 36B is provided on the base layer 33B and fills at least the bottom of the second recess. As described above, the filling layer 36B is a colorless and transparent layer. In this case, the filling layer 36B is made of, for example, a transparent resin.

The adhesive layer 4 is interposed between the light control device 2 and the black matrix substrate 3A, and bonds them to each other. The adhesive layer 4 transmits the light emitted by the light emitting element 25. The adhesive layer 4 is, for example, a colorless and transparent layer. The adhesive layer 4 is made of an adhesive or a pressure sensitive adhesive.

The heat sink 5A is located outside the laminate of the dimming device 2, the black matrix substrate 3, and the adhesive layer 4. Here, the heat sink 5A is a back surface heat sink arranged to face the black matrix substrate 3 with the dimming device 2 and the adhesive layer 4 sandwiched therebetween. More specifically, the heat sink 5A here is a back surface heat dissipation layer arranged on the dimming device 2.

The heat sink 5A is made of a highly thermally conductive material. The highly thermally conductive material is, for example, a metal such as copper, aluminum, iron, silver, titanium, molybdenum, tantalum, tungsten, or niobium; an alloy containing one or more of these metals; a carbide such as tungsten carbide; a carbon material such as graphite, graphene, carbon nanotubes, or diamond; another insulating ceramic; or a composite material containing one or more of these. The heat sink 5A may have a single-layer structure or a multi-layer structure.

The heat sink 5A has a flat surface. The heat sink 5A with a flat surface can be formed, for example, by forming a film on the dimmer 2. Alternatively, the heat sink 5A with a flat surface can be provided on the dimmer 2 by attaching it to the dimmer 2. The heat sink 5A with a flat surface makes it easy to form the heat sink 5A or to install the heat sink 5A on the dimmer 2.

The heat sink 5A may have an uneven surface. For example, the heat sink 5A may have multiple fins or pins on its surface. Such a heat sink 5A has a large surface area and excellent heat dissipation properties.

The ratio _SRB /S _B of the apparent area _SRB of the heat sink 5A to the area S _B of the back surface of the light control device 2 is preferably 0.5 or more, and more preferably 0.8 or more. The larger the ratio _SRB /S _B is, the higher the heat dissipation performance is. The upper limit of the ratio _SRB /S _B is, for example, 1. The ratio _SRB /S _B may be greater than 1.

The minimum thickness of the heat sink 5A is preferably 100 μm or more, and more preferably 1000 μm or more. Increasing the minimum thickness of the heat sink 5A increases the heat capacity of the heat sink 5A and decreases the thermal resistance of the heat sink 5A. There is no upper limit to the minimum thickness of the heat sink 5A, but increasing the minimum thickness of the heat sink 5A will make the display device 1A thicker. From this perspective, it is preferable that the minimum thickness of the heat sink 5A is 5 mm or less.

The heat transfer body is at least partially provided outside the laminate. The heat transfer body conducts heat from the reflecting layer 35 to the heat sink 5A. Here, the heat transfer body at least partially covers the end face of the laminate. As a result, the heat transfer body is in contact with the reflecting layer 35 and the heat sink 5A at the position of the end face of the laminate. It is preferable that the heat transfer body is in contact with the reflecting layer 35 and the heat sink 5A over substantially the entire circumference of the laminate.

As described above, the heat transfer body here consists of the main heat transfer body 6A and the auxiliary heat transfer body 7.
The main heat conductor 6A is provided outside the stack. Here, the main heat conductor 6A at least partially covers the end face of the stack. In one example, the main heat conductor 6A is a member made of a highly thermally conductive material and attached to the end face of the stack. In another example, the main heat conductor 6A is a layer made of a highly thermally conductive material and formed on the end face of the stack.

The auxiliary heat conductor 7 is provided on the reflective layer 35 at the peripheral portion of the black matrix substrate 3. In one example, the auxiliary heat conductor 7 is a member made of a highly thermally conductive material and provided on the reflective layer 35 at the peripheral portion of the black matrix substrate 3. In another example, the auxiliary heat conductor 7 is a layer made of a highly thermally conductive material and formed on the reflective layer 35 at the peripheral portion of the black matrix substrate 3. Here, the auxiliary heat conductor 7 is in contact with the reflective layer 35 and the main heat conductor 6A. Thus, the auxiliary heat conductor 7 assists in the transfer of heat from the reflective layer 35 to the main heat conductor 6A. The auxiliary heat conductor 7 can be omitted.

As described above, the main heat transfer body 6A and the auxiliary heat transfer body 7 are made of a highly thermally conductive material. For example, the highly thermally conductive material may be one exemplified for the heat sink 5A. Each of the main heat transfer body 6A and the auxiliary heat transfer body 7 may have a single-layer structure or a multi-layer structure.

In this display device 1A, the light-emitting element 25 is the main heat source. A portion of the heat generated in the light-emitting element 25 is conducted to the heat sink 5A installed outside the laminate via the reflective layer 35 and the heat conductor. Therefore, this display device 1A is less likely to accumulate heat inside the laminate, and has excellent heat dissipation properties.

Because the display device 1A has such excellent heat dissipation properties, it is less susceptible to degradation, brightness reduction, and color shift, as described below.

In recent years, in order to expand the use of display devices, there is a need for display devices with higher output and higher brightness in order to improve outdoor visibility. However, when the output of a display device using light-emitting diodes is increased, the heat generated by the light-emitting diodes can cause problems such as thermal deterioration of wiring and sealing resins located in the vicinity of the diodes. In addition, phosphors such as quantum dots cause thermal deterioration and a decrease in brightness and color shift when emitting light at high temperatures (a shift in the wavelength that shows the maximum intensity in the visible range; hereinafter referred to as wavelength shift). In particular, in a display device that includes light-emitting diodes and has a structure in which a pair of substrates are bonded together via an adhesive layer, the light-emitting diodes, which are the heat source, are isolated from the atmosphere, so heat is likely to accumulate inside. Therefore, in a high-brightness display device that converts the short-wavelength light (blue light or ultraviolet light) emitted by the light-emitting diodes into blue, green, and red light using phosphors such as quantum dots to perform full-color display, excellent heat dissipation is required.

As described above, in the display device 1A described above, a portion of the heat generated in the light-emitting element 25 is conducted to the heat sink 5A installed outside the laminate via the reflective layer 35 and the heat conductor. Therefore, in this display device 1A, heat is less likely to accumulate inside the laminate, and the inside is less likely to become excessively hot. Therefore, the display device 1A is less likely to experience deterioration of quantum dots, reduction in brightness, and color shift (wavelength shift).

In addition, in the display device 1A, the heat sink 5A is provided on the back surface, so the heat sink 5A does not interfere with the display. Therefore, various structures can be adopted for the heat sink 5A.

In addition, a structure in which a partition layer including a resin layer having through holes and a metal layer covering the resin layer is provided on a black matrix substrate is advantageous for repairing the LED substrate before bonding the LED substrate to the black matrix substrate. This will be described below.

In order to improve the brightness of micro LED displays, it is effective to increase the reflectance of the partitions separating the light-emitting diodes. Also, in order to prevent color mixing between adjacent pixels, it is necessary to increase the light-blocking properties of the partitions. For these reasons, there is a demand for partitions that combine high reflectance and light-blocking properties.

By adopting a structure in which a reflective layer is formed on a resin layer having through holes in a partition layer containing partitions, it is possible to achieve ease of manufacturing, high reflectance, and high light blocking properties.

To form a resin layer having through holes, it is desirable to use well-known photolithography, which includes exposure and development processes. However, it is difficult to form a uniform film of photoresist on an LED substrate, which has a surface with large height differences. In addition, when forming the resin layer, there is a risk of defects occurring in the LED substrate during processes in which the substrate comes into contact with solutions, such as photoresist application and development.

To solve the above problems, a protective film can be formed on the light-emitting diode. However, if a defect is found in the light-emitting diode after the protective film is formed, the LED substrate cannot be repaired, which results in a lower yield.

When a partition layer including a resin layer having through holes and a metal layer covering the resin layer is provided on a black matrix substrate, it is not necessary to form a tall partition on the LED substrate, and in some cases, the partition can be omitted from the LED substrate. Therefore, it is possible to achieve ease of manufacture, high reflectance, and high light blocking properties without reducing yield.

<2> Second embodiment Fig. 6 is a cross-sectional view showing a part of a display device according to a second embodiment of the present invention, and Fig. 7 is another cross-sectional view showing a part of a display device according to the second embodiment of the present invention.

The display device 1B shown in Figures 6 and 7 is similar to the display device 1A described above, except that it employs the following configuration. That is, the display device 1B includes a heat sink 5B and a main heat conductor 6B instead of a heat sink 5A and a main heat conductor 6A. In addition, in the display device 1B, the black matrix substrate 3 and the heat sink 5B constitute a heat dissipating black matrix substrate. The heat dissipating black matrix substrate can further include an auxiliary heat conductor 7.

The heat sink 5B is a front heat sink layer provided on the second main surface of the transparent substrate 31. The heat sink 5B is open at the position of the first through hole provided in the black matrix 32.

The heat sink 5B is made of a highly thermally conductive material. As the highly thermally conductive material, for example, the materials exemplified for the heat sink 5B can be used. The heat sink 5B may have a single-layer structure or a multi-layer structure.

The heat sink 5B preferably has a black surface. The surface or entirety of the heat sink 5B having a black surface contains, for example, one or more of chromium, copper oxide nitride, carbon nanotubes, graphite, and graphene. The heat sink 5B having a black surface can fulfill a similar role to the black matrix 32.

The ratio S _RF /S _F of the apparent area S _RF of the heat sink 5B to the overall area S _F of the black matrix substrate 3 is preferably 0.5 or more, and more preferably 0.8 or more. The larger the ratio S _RB /S _B , the higher the heat dissipation performance. However, if the ratio S _RB /S _B is excessively large, there is a possibility that part of the light from the black matrix substrate 3 will be blocked by the heat sink 5B. The ratio S _RF /S _F is preferably 0.995 or less, and more preferably 0.98 or less.

The thickness of the heat sink 5B is preferably 0.1 μm or more, and more preferably 10 μm or more. Increasing the thickness of the heat sink 5B increases the heat capacity of the heat sink 5B and decreases the thermal resistance of the heat sink 5B. However, if the heat sink 5B is made excessively thick, when the display surface is observed from an oblique direction, part of the light from the black matrix substrate 3 is likely to be blocked by the heat sink 5B. From this perspective, it is preferable that the minimum thickness of the heat sink 5B is 1 mm or less.

The main heat conductor 6B is provided outside the laminate of the light control device 2, the black matrix substrate 3, and the adhesive layer 4. Here, the main heat conductor 6B at least partially covers the end face of the laminate. In one example, the main heat conductor 6B is a member made of a highly thermally conductive material and attached to the end face of the laminate. In another example, the main heat conductor 6B is a layer made of a highly thermally conductive material and formed on the end face of the laminate.

The main heat transfer body 6B is made of a highly thermally conductive material. For example, the highly thermally conductive material exemplified for the heat sink 5A can be used. The main heat transfer body 6B may have a single-layer structure or a multi-layer structure.

Like display device 1A, display device 1B also has excellent heat dissipation properties. Therefore, display device 1B is less susceptible to deterioration of quantum dots, reduction in brightness, and color shift (wavelength shift).

In addition, the display device 1B has a heat sink 5B on its front surface. In electronic devices that include a display device, the display device is typically installed in a housing so that its front surface is exposed to the outside of the electronic device and its back surface is adjacent to the internal space of the housing. Therefore, when the display device 1A is mounted in an electronic device, heat exchange is likely to occur between the heat sink 5B and the outside air.

Furthermore, in the display device 1B, a partition layer including a resin layer having through holes and a metal layer covering the resin layer is provided on the black matrix substrate, so there is no need to form a tall partition on the LED substrate, and in some cases, the partition can be omitted from the LED substrate. Therefore, ease of manufacture, high reflectance, and high light blocking properties can be achieved without reducing yield.

<3> Modifications Various modifications are possible for the display device and the heat dissipating black matrix substrate described above, as exemplified below.

Figure 8 is a plan view showing a part of a black matrix substrate included in a display device according to a first modified example. Figure 9 is a plan view showing a part of a black matrix substrate included in a display device according to a second modified example.

The black matrix substrate 3A shown in FIG. 8 is similar to the black matrix substrate 3 described with reference to FIG. 1 to FIG. 5, except that the reflective layer 35 has a plurality of slits SL1 each extending in the Y direction and arranged in the X direction. The black matrix substrate 3B shown in FIG. 9 is similar to the black matrix substrate 3 described with reference to FIG. 1 to FIG. 5, except that the reflective layer 35 has a plurality of slits SL1 each extending in the X direction and arranged in the Y direction. In this way, the reflective layer 35 may be provided with openings such as slits.

The heat conductor that thermally connects the reflective layer 35 and the heat sink 5A or 5B may be provided inside the laminate of the light control device 2, the black matrix substrate 3, and the adhesive layer 4. For example, in the display device 1A, the main heat conductor 6A and the auxiliary heat conductor 7 may be omitted, and one or more through holes extending in the Z direction may be provided in the light control device 2, the side walls of these through holes may be coated with a highly thermally conductive material or these through holes may be filled with a highly thermally conductive material, and further, an auxiliary heat conductor made of a highly thermally conductive material may be provided between the main heat conductor made of a highly thermally conductive material and the reflective layer 35 in these through holes. Alternatively, in the display device 1B, the main heat conductor 6A and the auxiliary heat conductor 7 may be omitted, and one or more through holes extending in the Z direction may be provided in the black matrix substrate 3, the side walls of these through holes may be coated with a highly thermally conductive material or these through holes may be filled with a highly thermally conductive material, and the reflective layer 35 may be thermally connected to the heat sink 5B via the heat conductor made of a highly thermally conductive material in these through holes.

A circuit provided in the dimmer 2 or the like may have a configuration different from that shown in FIG.
For example, the video signal line driver VDR may supply a current signal as a video signal to the video signal line VSL. In this case, each of the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB may be configured such that, during a write period in which a video signal is written, the gate-source voltage of the drive control element DR is set to a value corresponding to this current signal, and during a light emission period, a drive current having a magnitude corresponding to the gate-source voltage is passed to the light-emitting element D. Furthermore, instead of employing a circuit for displaying an image by an active matrix drive method, the light control device 2 may employ a circuit for displaying an image by a passive matrix drive method.

Instead of using a blue light-emitting diode as the light-emitting element 25, an ultraviolet light-emitting diode may be used. In this case, the filling layer 36B is a wavelength conversion layer that converts the light emitted by the light-emitting element 25 of the third subpixel PXB into a third light having a different color from the first light and the second light. For example, the first wavelength conversion layer 36R, the second wavelength conversion layer 36G, and the filling layer 36B convert the ultraviolet light emitted by the light-emitting element 25 into red light, green light, and blue light, respectively.

Instead of using a single type of light-emitting diode as the light-emitting element 25, multiple types of light-emitting diodes may be used; for example, red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes may be used in the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB, respectively. In this case, instead of the first colored layer 33R and the second colored layer 33G, a layer similar to that described above for the base layer 33B may be provided, and instead of the first wavelength conversion layer 36R and the second wavelength conversion layer 36G, a layer similar to that described above for the filling layer 36B may be provided.

Although the above display device is capable of displaying color images, the display device may also display monochrome images. For example, in display device 1A, the first subpixel PXR and the second subpixel PXG are omitted, a blue light-emitting diode is used as the light-emitting element 25, and the filling layer 36B is a wavelength conversion layer that converts blue light to yellow light. When the filling layer 36B converts a portion of the blue light incident thereon into yellow light and transmits the remainder, it is possible to display white by additively mixing blue and yellow colors.

The black matrix substrate may further include an overcoat layer interposed between the black matrix 32 and the resin layer 34. The overcoat layer may include a transparent resin and one or more of an ultraviolet absorbing agent, a yellow pigment, and transparent particles. The overcoat layer containing an ultraviolet absorbing agent can absorb stray light that enters the resin layer 34 when the stray light is ultraviolet light.

The display device may be other than a micro LED display, such as an organic electroluminescent display device, although the display device preferably includes light emitting elements.
The invention as originally claimed is set forth below.
[1]
a black matrix substrate including: a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; a resin layer provided on the black matrix and having a plurality of second through holes at positions corresponding to the plurality of first through holes; and a reflective layer at least partially covering each sidewall of the plurality of second through holes and an upper surface of the resin layer;
A light control device disposed to face the first main surface;
an adhesive layer interposed between the black matrix substrate and the light control device and bonding them together;
a heat sink located outside a laminate of the black matrix substrate, the light control device, and the adhesive layer;
a heat conductor that conducts heat from the reflective layer to the heat sink;
A display device comprising:
[2]
2. The display device according to item 1, wherein the light control device includes a plurality of light emitting elements.
[3]
2. The display device according to claim 1, wherein the light control device includes a plurality of light emitting diodes.
[4]
2. The display device according to item 1, wherein the black matrix substrate further includes a plurality of wavelength conversion layers respectively provided in at least some of the second through holes.
[5]
2. The display device according to item 1, wherein the black matrix substrate further includes a color filter including a plurality of colored layers disposed at positions of at least some of the plurality of first through holes.
[6]
2. The display device according to item 1, wherein the reflective layer includes a layer made of a metal or an alloy.
[7]
2. The display device according to item 1, wherein the heat sink includes a back surface heat sink provided to face the black matrix substrate with the light control device and the adhesive layer sandwiched therebetween.
[8]
8. The display device according to item 7, wherein the rear surface heat sink is a rear surface heat sink layer provided on the light control device.
[9]
2. The display device according to item 1, wherein the heat sink includes a front heat sink layer provided on the second main surface and opening at the positions of the plurality of first through holes.
[10]
10. The display device according to item 9, wherein the front heat dissipation layer has a black surface.
[11]
2. The display device according to item 1, wherein at least a portion of the heat transfer body is provided outside the laminate.
[12]
Item 12. The display device according to item 11, wherein the heat transfer body at least partially covers an end face of the laminate.
[13]
Item 12. The display device according to item 11, wherein the heat conductor includes a main heat conductor provided outside the laminate and an auxiliary heat conductor provided on the reflective layer at the periphery of the black matrix substrate.
[14]
a black matrix substrate including: a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; a resin layer provided on the black matrix and having a plurality of second through holes at positions corresponding to the plurality of first through holes; and a reflective layer at least partially covering each sidewall of the plurality of second through holes and an upper surface of the resin layer;
a front heat dissipation layer provided on the second main surface and opening at the positions of the first through holes;
A heat dissipating black matrix substrate comprising:
[15]
Item 15. The heat-dissipating black matrix substrate according to item 14, wherein the front heat-dissipating layer has a black surface.

1A...display device, 1B...display device, 2...light control device, 3...black matrix substrate, 3A...black matrix substrate, 3B...black matrix substrate, 4...adhesive layer, 5A...heat sink, 5B...heat sink, 6A...main heat conductor, 6B...main heat conductor, 7...auxiliary heat conductor, 21...substrate, 22...semiconductor layer, 23A...conductor layer, 23B...conductor layer, 23C...conductor layer, 23D...conductor layer, 24A...insulating layer, 24B...insulating layer, 24C...insulating layer, 25...light emitting element, 26...partition layer, 27...filling layer, 28...conductor layer, 31...transparent substrate, 32...black matrix, 33B...underlayer, 33 G...second colored layer, 33R...first colored layer, 34...resin layer, 35...reflective layer, 36B...filling layer, 36G...second wavelength conversion layer, 36R...first wavelength conversion layer, 251...first layer, 252...second layer, 253...third layer, C...capacitor, D...light-emitting element, DR...drive control element, PSL...power supply line, PX...pixel, PXB...third sub-pixel, PXG...second sub-pixel, PXR...first sub-pixel, SDR...scanning signal line driver, SL1...slit, SL2...slit, SSL...scanning signal line, SW...switch, VDR...video signal line driver, VSL...video signal line, W1...distance, W _x1 ...distance, W _y1 ...distance.

Claims (15)

a black matrix substrate including: a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; a resin layer provided on the black matrix and having a plurality of second through holes at positions corresponding to the plurality of first through holes; and a reflective layer at least partially covering each sidewall of the plurality of second through holes and an upper surface of the resin layer;
A light control device disposed to face the first main surface;
an adhesive layer interposed between the black matrix substrate and the light control device and bonding them together;
a heat sink located outside a laminate of the black matrix substrate, the light control device, and the adhesive layer;
a heat conductor that conducts heat from the reflective layer to the heat sink. The display device according to claim 1, wherein the light control device includes a plurality of light-emitting elements. The display device according to claim 1, wherein the dimming device includes a plurality of light-emitting diodes. The display device according to claim 1, wherein the black matrix substrate further includes a plurality of wavelength conversion layers each disposed in at least a portion of the plurality of second through holes. The display device according to claim 1, wherein the black matrix substrate further includes a color filter including a plurality of colored layers each disposed at at least some of the positions of the plurality of first through holes. The display device according to claim 1, wherein the reflective layer includes a layer made of a metal or an alloy. The display device according to claim 1, wherein the heat sink includes a back surface heat sink arranged to face the black matrix substrate with the light control device and the adhesive layer sandwiched therebetween. The display device according to claim 7, wherein the rear surface heat sink is a rear surface heat sink layer provided on the light control device. The display device according to claim 1, wherein the heat sink includes a front heat sink layer provided on the second main surface and opening at the positions of the first through holes. The display device according to claim 9, wherein the front heat dissipation layer has a black surface. The display device according to claim 1, wherein at least a portion of the heat transfer body is provided outside the laminate. The display device according to claim 11, wherein the heat transfer body at least partially covers the end face of the laminate. The display device according to claim 11, wherein the heat transfer body includes a main heat transfer body provided outside the laminate and an auxiliary heat transfer body provided on the reflective layer at the periphery of the black matrix substrate. a black matrix substrate including: a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; a resin layer provided on the black matrix and having a plurality of second through holes at positions corresponding to the plurality of first through holes; and a reflective layer at least partially covering each sidewall of the plurality of second through holes and an upper surface of the resin layer;
a front heat dissipation layer provided on the second main surface and opening at the positions of the first through holes ;
a heat conductor that thermally connects the reflective layer and the front heat dissipation layer;
A heat dissipating black matrix substrate comprising: The heat dissipating black matrix substrate according to claim 14, wherein the front heat dissipation layer has a black surface.