JP7468320B2 - Temperature Sensor Device - Google Patents

Description

The present invention relates to a temperature sensor device that detects the temperature of an object to be measured.

The temperature sensor device shown in Patent Document 1 below is known as an example of a temperature sensor device that can be attached to an object whose temperature is to be detected. This temperature sensor device contains a sensor protector via adhesive or resin inside a mounting bracket, and compared to types that are attached to the object to be measured by the spring force of the bracket, heat from the object to be measured is more easily transferred to the heat-sensitive element inside the sensor protector, allowing the temperature of the object to be measured to be detected with high accuracy. Another advantage of conventional temperature sensor devices is that the sensor protector is less likely to come off the mounting bracket.

However, in conventional temperature sensor devices, an insulating layer such as an air layer may accidentally be present in the heat conduction path from the object to be measured to the sensor protector, leaving room for improvement in terms of thermal responsiveness.

JP 2020-41921 A

The present invention was made in consideration of these circumstances, and its purpose is to provide a temperature detection sensor device with good thermal responsiveness.

In order to achieve the above object, the present invention provides a temperature sensor device that includes a sensor case having a substantially rectangular parallelepiped shape, a heat-sensitive element housed therein, and a wiring connected to one end face of the sensor case;
an attachment member having a bottom portion facing a bottom surface of the sensor case, a side portion extending substantially perpendicularly from the bottom portion and facing a side surface connected to the bottom surface and the one end surface of the sensor case, and an end portion extending substantially perpendicularly from the side portion and facing the other end surface facing in the opposite direction to the one end surface of the sensor case;
a first resin portion disposed in a first gap formed between the end portion and the bottom portion and in contact with the other end face of the sensor case, and a second resin portion disposed in a second gap formed between the side face and the side portion,
The width of the first gap formed between the end portion and the bottom portion is greater than the width of the second gap formed between the side portion and the lateral portion.

The side of the mounting member extends substantially perpendicularly from the bottom surface, so that the side and the side are arranged substantially parallel to each other. Therefore, even if air bubbles are temporarily trapped in the resin during the formation process of the second resin portion, the air bubbles in the resin are easily released upwards before the second resin portion is cured and formed, and the problem of the second resin portion trapping air bubbles inside the resin can be prevented. In addition, since the side and the side are arranged substantially parallel to each other and the second gap formed between them is small, the thermal conductivity between the mounting member and the sensor case is also good. Therefore, such a temperature sensor device prevents an insulating layer such as an air layer from accidentally being interposed in the heat conduction path from the measurement object to the sensor case, and has good thermal responsiveness. In addition, since the width of the first gap in which the first resin portion is arranged is large, the first resin portion serving as an anchor can be formed large, and many hooking portions between the first resin portion and the holding member can be formed, effectively preventing the problem of the sensor case peeling off from the mounting member due to external force.

For example, the temperature sensor device according to the present invention may have a base end connected to the bottom of the mounting member, a tip spaced downward from the bottom in the opposite direction to the sensor case, and a support member for placing the measurement object between the bottom and the tip.

By sandwiching the object to be measured from above and below with the support members, this type of temperature sensor device prevents the mounting member from coming off the object to be measured due to external forces, and has good thermal responsiveness.

Also, for example, the support member may be substantially U-shaped connecting the tip to the base end, and the inner portion of the bent portion of the support member may have a curvature smaller than the curvature of a corner of the object to be measured adjacent to the inner portion.

Such a support member forms an appropriate gap between itself and the object to be measured, and therefore prevents the support member from coming into contact with the object to be measured over a wide area when the temperature sensor device is fixed to the object to be measured, preventing the problem of scratches on the surface of the object to be measured. In addition, by forming an appropriate gap between itself and the object to be measured, the problem of the contact state between the support member and the object to be measured affecting the thermal conduction path from the object to be measured to the thermal sensing element can be prevented, and individual variation in the thermal responsiveness of the temperature sensor device can be suppressed.

Also, for example, the support member may be connected to the bottom closer to the one end face than to the other end face.

Since external forces are often applied to the support member via wiring, by connecting the support member near one end face, this type of temperature sensor device effectively prevents the mounting member from being plastically deformed by external forces, and can stably achieve good thermal response.

Also, for example, the mounting member may have a fixing structure extending along the bottom portion and fixed to the object to be measured,
The fixing structure may be connected to the bottom closer to the other end face than to the one end face.

Since the fixing structure is connected to the bottom near the other end face, the wiring does not get in the way during the fixing process, making such a temperature sensor device easy to fix to the object to be measured. Also, if the fixing structure is connected to the bottom near the other end, there is a concern that the bottom of the fixing structure or mounting member may plastically deform so that the mounting member moves away from the target object due to external forces transmitted through the wiring. However, since the support member connected to the bottom near one end face prevents the mounting member from moving away from the target object due to external forces transmitted through the wiring, such a temperature sensor device is easy to install, has good thermal responsiveness, and can suppress individual variation in the thermal responsiveness of the temperature sensor device.

Also, for example, the mounting member may have a fixing structure extending along the bottom portion and fixed to the object to be measured,
The fixing structure may be a screw hole through which a screw is inserted.
The base end of the support member may be connected to a right side of the bottom when viewed from the one end face side with the bottom located below the sensor case.

When the mounting member is fixed to the object to be measured with a right-handed screw, this type of support member can prevent the mounting member from rotating as the screw turns, causing the bottom to lose contact with the object to be measured. This problem can be prevented by the support member engaging with the object to be measured and preventing the mounting member from rotating. Therefore, this type of temperature sensor device can be easily and accurately fixed to the object to be measured, making it possible to measure temperature with high accuracy.

FIG. 1 is a schematic perspective view showing a state in which a temperature sensor device according to an embodiment of the present invention is fixed to an object to be measured. FIG. 2 is a rear view of the temperature sensor device and the object to be measured shown in FIG. 1 as viewed from one end side. FIG. 3 is a side view of the temperature sensor device shown in FIG. FIG. 4 is a front view of the temperature sensor device shown in FIG. FIG. 5 is a rear view of the temperature sensor device shown in FIG. FIG. 6 is a top view of the temperature sensor device shown in FIG. FIG. 7 is a bottom view of the temperature sensor device shown in FIG. FIG. 8 is a schematic perspective view showing the mounting member, the fixing structure and the support member of the temperature sensor device shown in FIG. 9 is a partial cross-sectional view showing the second resin portion of the temperature sensor device shown in FIG. FIG. 10 is a schematic cross-sectional view showing a heat-sensitive element of the temperature sensor device shown in FIG.

The present invention will now be described with reference to the embodiments shown in the drawings.

Figure 1 is a schematic perspective view showing a state in which a temperature sensor device 10 according to one embodiment of the present invention is fixed to a measurement object 90. As shown in Figure 1, the temperature sensor device 10 has a sensor case 20, an attachment member 40, a support member 50, wiring 80, etc., and is fixed to the measurement object 90 when used. The temperature sensor device 10 detects the temperature of the measurement object 90 by transmitting heat from the measurement object 90 to a heat-sensitive element 27 (see Figure 10) housed inside the sensor case 20.

The object 90 to be measured by the temperature sensor device 10 may be, for example, a wire or a coil through which a current flows, but is not limited thereto. In the example shown in FIG. 1, the temperature sensor device 10 is fixed to the object 90 to be measured by a fixing screw 98, but the method of fixing the temperature sensor device 10 to the object 90 to be measured is not limited to fixing by the fixing screw 98.

As shown in FIG. 1, the sensor case 20 has a generally rectangular parallelepiped shape, and wiring 80 is connected to one end face 21. In the description of the temperature sensor device 10, the longitudinal direction of the sensor case 20 from one end face 21 toward the other end face 22 is defined as the X-axis direction, the direction perpendicular to the X-axis direction and parallel to the mounting surface of the temperature sensor device 10 relative to the object to be measured 90, like the X-axis direction, is defined as the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis directions is defined as the Z-axis direction.

Figure 10 is a schematic cross-sectional view of the temperature sensor device 10 shown in Figure 1 along the XZ plane, showing the internal structure of the sensor case 20. As shown in Figure 10, the sensor case 20 houses a heat-sensing element 27 inside. The heat-sensing element 27 is not particularly limited, but examples thereof include an NTC (Negative Temperature Coefficient) thermistor element and a PTC (Positive Temperature Coefficient) thermistor element. A coating layer made of glass or the like is formed around the heat-sensing element 27.

In addition to the heat-sensitive element 27, the sensor case 20 also contains lead wires 28 that connect the heat-sensitive element 27 to the wiring 80, a lead holding member 29 that holds the lead wires 28, and the like. The lead wires 28 are connected to the wiring 80 by crimping or the like. The heat-sensitive element 27, lead wires 28, and the like are covered and protected by case resin 26 and the like. As shown in FIG. 10, the case resin 26 of the sensor case 20 has two or more resin parts, including an inner resin part that directly contacts the lead wires 28, and the like, and an outer resin part that covers the inner resin part from the outside.

Examples of the case resin 26 include, but are not limited to, epoxy resin, urethane resin, silicone resin, ABS resin, PPS resin, and PBT resin. The wiring 80 is connected to one end face 21, which is the end face on the negative side of the X-axis of the sensor case 20, and a portion of the wiring 80 is embedded inside the case resin 26. The other portion of the wiring 80 is exposed to the outside of the sensor case 20 from the one end face 21.

The wiring 80 is not particularly limited, and may be, for example, a PVC wire, a polyethylene wire, a silicon wire, or a fluorine wire. The core of the wiring 80 is made of a conductive material such as copper, iron, or aluminum. The lead wire 28 is made of a conductive material such as copper, iron, nickel, or dumet wire.

1, the mounting member 40 holds the sensor case 20 in order to mount the sensor case 20 to the measurement object 90. The mounting member 40 and the support member 50 having the fixing structure 60 shown in FIG. 8 can be formed by pressing and bending a plate material made of metal such as copper, copper alloy such as brass, iron, aluminum, stainless steel such as SUS, or other conductive material. That is, the mounting member 40 and the support member 50 can be formed from a single metal plate. However, the mounting member 40 is not limited to this, and may be separate from the support member 50 and the fixing structure 60. By making the mounting member 40 etc. out of a conductive material such as metal, the heat of the measurement object 90 is quickly transferred to the heat-sensitive element 27 in the sensor case 20, so that the temperature sensor device 10 has good thermal response.

8, the mounting member 40 has a bottom 43, a pair of sides, a first side 44a and a second side 44b, extending substantially perpendicularly from the bottom 43, and a first end 42a and a second end 42b, extending substantially perpendicularly from at least one of the pair of sides. The bottom 43 of the mounting member 40 contacts the upper surface of the measurement object 90 when the temperature sensor device 10 is fixed to the measurement object 90 as shown in FIG. 1. In other words, the lower surface 43a of the bottom 43 constitutes the mounting surface for the temperature sensor device 10 relative to the measurement object 90.

Figure 2 is a rear view of the temperature sensor device 10 and mounting member 40 shown in Figure 1, viewed from one end face 21 side (negative X-axis direction side) of the sensor case 20. As shown in Figure 2, the bottom 43 of the mounting member 40 faces the bottom face 23 of the sensor case 20. As shown in Figures 2 and 10, the bottom 43 of the mounting member 40 is part of the path that transfers heat from the measurement object 90 to the heat-sensitive element 27 in the sensor case 20 in the shortest distance.

As shown in FIG. 8, the first side portion 44a and the second side portion 44b, which are a pair of sides of the mounting member 40, are disposed at both ends of the bottom portion 43 in the Y-axis direction. As shown in FIG. 2 and FIG. 8, the first side portion 44a is connected to the end portion of the bottom portion 43 on the Y-axis positive side, and extends upward from the bottom portion 43 (in the Z-axis positive direction) approximately perpendicular to the bottom portion 43. The second side portion 44b is connected to the end portion of the bottom portion 43 on the Y-axis negative side, and similarly to the first side portion 44a, extends upward from the bottom portion 43 (in the Z-axis positive direction) approximately perpendicular to the bottom portion 43. As can be seen from FIG. 2 and FIG. 5, the first side portion 44a and the second side portion 44b are approximately parallel to each other.

As shown in FIG. 2, the first side portion 44a and the second side portion 44b of the mounting member 40 face the first side surface 24a and the second side surface 24b, which are a pair of side surfaces that connect to the bottom surface 23 and one end surface 21 of the sensor case 20. Specifically, the first side portion 44a, which is located on the positive Y-axis side of the sensor case 20, faces the first side surface 24a, which is the side surface of the sensor case 20 on the positive Y-axis side. In addition, the second side portion 44b, which is located on the negative Y-axis side of the sensor case 20, faces the second side surface 24b, which is the side surface of the sensor case 20 on the negative Y-axis side.

3 is a side view of the temperature sensor device 10 shown in FIG. 1 from the negative Y-axis direction. As shown in FIG. 3, the length of the sensor case 20 in the X-axis direction is longer than the length of the second side portion 44b in the X-axis direction, and a portion of the second side surface 24b close to one end face 21 does not face the second side portion 44b and is exposed from the second side portion 44b. The relationship between the first side portion 44a and the first side surface 24a of the sensor case 20 is similar to the relationship between the second side portion 44b and the second side surface 24b. The length of the bottom portion 43 in the X-axis direction is longer than the length of the first side portion 44a and the second side portion 44b in the X-axis direction, and is approximately the same as the length of the sensor case 20 in the X-axis direction.

Figure 4 is a front view of the temperature sensor device 10 shown in Figure 1, as viewed from the other end surface 22 side (X-axis positive side) of the sensor case 20. Also, Figure 6 is a plan view of the temperature sensor device 10 shown in Figure 1, as viewed from above (Z-axis positive side). As shown in Figures 4 and 6, the first end 42a and second end 42b constituting the ends of the mounting member 40 are disposed on the X-axis positive side of the sensor case 20.

As shown in FIG. 6, the first end 42a of the mounting member 40 is connected to the end of the first side 44a on the positive side of the X-axis, and extends from the first side 44a to the negative side of the Y-axis, approximately perpendicular to the first side 44a and the bottom 43. The second end 42b is connected to the end of the second side 44b on the positive side of the X-axis, and extends from the second side 44b to the positive side of the Y-axis, approximately perpendicular to the second side 44b and the bottom 43. As shown in FIG. 6, the first end 42a and the second end 42b are located at approximately the same position in the X-axis direction, and the tip of the first end 42a and the tip of the second end 42b face each other with a small third gap 78 between them.

As shown in Figures 4 and 6, the first end 42a and the second end 42b face one end face 21 of the sensor case 20 and the other end face 22 facing in the opposite direction (positive direction of the X-axis).

As shown in FIG. 4, a first gap 71 is formed between the first end 42a and the second end 42b and the bottom 43. That is, the first end 42a and the second end 42b are not connected to the portions of the first side 44a and the second side 44b close to the bottom 43, and do not cover the lower portion of the other end surface 22 of the sensor case 20. Therefore, the vertical width (width in the Z-axis direction) of the first end 42a and the second end 42b is smaller than the vertical width of the first side 44a and the second side 44b.

1 and 6, the upper surface 25 of the sensor case 20 does not have a portion covered by the mounting member 40, and the entire upper surface 25 is exposed from the mounting member 40. As shown in FIG. 3, the height of the upper surface 25 of the sensor case 20 from the bottom 43 is higher than the height of the upper ends of the first side portion 44a and the second side portion 44b from the bottom 43, and a portion of the sensor case 20 protrudes upward (in the Z-axis direction) from the mounting member 40. However, the position of the upper surface 25 of the sensor case 20 may be the same as the position of the upper ends of the first side portion 44a and the second side portion 44b, or may be lower than the position of the upper ends of the first side portion 44a and the second side portion 44b.

3, a first resin part 74 is disposed in a first gap 71 formed between the first end 42a and the second end 42b and the bottom 43. As shown in FIG. 1, the first resin part 74 contacts the other end surface 22 of the sensor case 20. The first resin part 74 may also contact the X-axis positive side ends of the first side part 44a and the second side part 44b seen from the X-axis negative side through the first gap 71 as shown in FIG. 4.

The first resin part 74 is disposed in the first gap 71 and contacts the other end surface 22 of the sensor case 20, thereby preventing the sensor case 20 from peeling off or coming off from the mounting member 40 due to an external force. In particular, the sensor case 20 is easily subjected to an external force pulling it in the negative direction of the X-axis through the wiring 80 shown in FIG. 1, etc., but even in such a case, the first resin part 74 is caught by the mounting member 40, and the connection between the sensor case 20 and the mounting member 40 can be strongly maintained. This is because the first resin part 74 contacts the first and second ends 42a, 42b, the first and second side parts 44a, 44b, and the bottom part 43 of the mounting member 40, etc., and provides a suitable anchor effect.

Furthermore, the first resin part 74 may extend not only in the first gap 71 but also around the first gap 71. For example, the first resin part 74 may also be disposed in the third gap 78 between the first end 42a and the second end 42b. By disposing a part of the first resin part 74 in the third gap 78, the problem of the sensor case 20 coming off the mounting member 40 due to an external force can be more reliably prevented. As shown in FIG. 4, the third gap 78 formed between the first end 42a and the second end 42b may have a width that increases upward. By the third gap 78 expanding upward, a resin pool of uncured resin can be formed in this portion during assembly of the temperature sensor device 10 described later, and the problem of the uncured resin flowing out excessively to the outside of the mounting member 40 can be prevented.

As shown in FIG. 5, a second gap 72a is formed between a first side surface 24a of the pair of side surfaces of the sensor case 20 and a first side portion 44a of the pair of side portions of the mounting member 40. A second gap 72b is formed between a second side surface 24b of the pair of side surfaces of the sensor case 20 and a second side portion 44b of the pair of side portions of the mounting member 40. A second resin portion 76a is disposed in the second gap 72a, and a second resin portion 76b is disposed in the second gap 72b.

As shown in FIG. 5, the first and second side surfaces 24a, 24b of the sensor case 20 and the first and second side portions 44a, 44b of the mounting member 40 are all substantially parallel to each other, and the second gaps 72a, 72b are formed between the two substantially parallel surfaces that face each other.

Figure 9 is a cross-sectional view of the temperature sensor device 10 taken along the cross-sectional line IX-IX in Figure 6, showing the state in which the sensor case 20 is housed inside the mounting member 40. As shown in Figure 9, the second resin parts 76a, 76b arranged in the second gaps 72a, 72b are also formed around the other end surface 22 of the sensor case 20, and the second resin parts 76a, 76b are connected to the first resin part 74 shown in Figure 4.

9, the width W1 of the first gap 71 formed between the first and second ends 42a, 42b and the bottom 43 is larger than the widths W2a, W2b of the second gaps 72a, 72b formed between the first and second side surfaces 24a, 24b and the first and second side surfaces 44a, 44b. By making the second gaps 72a, 72b smaller, the distance between the side surfaces 42a, 42b of the mounting member 40 and the side surfaces 24a, 24b of the sensor case 20 becomes closer, so that the mounting member 40 can efficiently transfer heat from the measurement object 90 to the sensor case 20. In addition, the side surfaces 24a, 24b of the sensor case 20 have a larger area than the other end surface 22 of the sensor case 20 and are also closer to the heat-sensitive element 27, so this structure contributes to efficient heat conduction from the measurement object 90.

In addition, since the first and second side portions 44a, 44b extend substantially vertically from the bottom portion 43, the average value of the widths W2a, W2b of the second gaps 72a, 72b can be reduced, and therefore the mounting member 40 can efficiently transfer heat from the measurement object 90 to the sensor case 20. Furthermore, since the first and second side portions 44a, 44b extend substantially vertically from the bottom portion 43, even if air bubbles are trapped in the second resin portions 76a, 76b before hardening, the trapped air bubbles can easily move upward through the second gaps 72a, 72b and escape from the resin before complete hardening, thereby preventing the problem of air bubbles remaining in the second resin portions 76a, 76b after hardening. Therefore, such a temperature sensor device 10 prevents an insulating layer such as an air layer from accidentally being interposed in the heat conduction path from the measurement object 90 to the sensor case 20, and has good thermal responsiveness.

In addition, in the temperature sensor device 10, the width W1 of the first gap 71 in which the first resin part 74 is disposed is large, so that the first resin part 74 that serves as an anchor can be formed large, and many hooking portions can be formed between the first resin part 74 and the mounting member 40. Therefore, in such a temperature sensor device 10, the first resin part 74 is firmly joined to the mounting member 40, so that the problem of the sensor case 20 peeling off from the mounting member 40 due to an external force can be effectively prevented.

In addition, since the first resin part 74 and the second resin parts 76a and 76b are connected in the temperature sensor device 10, the problem of the sensor case 20 peeling off from the mounting member 40 due to external force can be more effectively prevented. Furthermore, since the first resin part 74 and the second resin parts 76a and 76b fill the gap between the sensor case 20 and the mounting member 40 in the temperature sensor device 10, the problem of a gap being formed between the mounting member 40 and the sensor case 20, especially in a position close to the heat sensitive element 27, is prevented.

As shown in FIG. 8, the base end 51 of the support member 50 is connected to the bottom 43 of the mounting member 40, and the tip 52 is spaced downward (negative Z-axis direction) from the bottom 43, which is the opposite direction to the sensor case 20. As shown in FIG. 2, in the temperature sensor device 10, the measurement object 90 is placed between the bottom 43 and the tip 52 of the support member 50.

As shown in Figures 2 and 8, the support member 50 has a generally U-shape connecting the tip 52 to the base end 51. As shown in Figure 2, the support member 50 has two bent portions 53a, 54a that bend at approximately 90 degrees between the base end 51 and the tip 52. The inner portions 53aa, 54aa of the bent portions 53a, 54a have a curvature smaller than the curvature of the corners 93a, 94a of the measurement object 90 adjacent to the inner portions 53aa, 54aa.

This creates an appropriate gap between the portion of the support member 50 that is located below the bottom 43 of the mounting member 40 and the object to be measured 90. Such a temperature sensor device 10 prevents contact between the support member 50 and the object to be measured 90 over a wide area when the temperature sensor device 10 is fixed to the object to be measured 90, and prevents the problem of scratches on the surface of the object to be measured 90.

Such a temperature sensor device 10 prevents the problem of the contact state between the support member 50 and the measurement object 90 affecting the heat conduction path from the measurement object 90 to the thermal element 27, and can suppress individual variation in the thermal responsiveness of the temperature sensor device 10. In other words, it is preferable that the portion of the support member 50 located below the bottom 43 is positioned at a predetermined distance from the measurement object 90. In this case, from the viewpoint of preventing the bottom 43 of the mounting member 40 from floating up from the measurement object 90, it is preferable that the gap between the tip 52 of the support member 50 and the measurement object 90 is smaller than the gap between the inner parts 53aa, 54aa and the adjacent corners 93a, 94a.

As shown in FIG. 6, the support member 50 is connected to the bottom 43 of the mounting member 40 closer to one end face 21 than to the other end face 22 of the sensor case 20. Since external forces are often applied to the sensor case 20 and the mounting member 40 to which the sensor case 20 is fixed from the wiring 80, by arranging the support member 50 near the one end face 21 to which the wiring 80 is connected, it is possible to effectively prevent the bottom 43 of the mounting member 40 from floating up from the object to be measured 90.

As shown in FIG. 1, the mounting member 40 has a fixing structure 60 that extends along the bottom 43 and is fixed to the measurement object 90. The fixing structure 60 in the present invention is a through hole 62 as a screw hole through which a screw is inserted, but the fixing structure 60 is not limited to this and may be a joint such as an adhesive or welding.

The fixing structure 60 is connected to the bottom 43 of the mounting member 40 closer to the end face 22 than the end face 21 of the sensor case 20. By arranging the fixing structure 60 on the opposite side of the end face 21 to which the wiring 80 is connected, the wiring 80 does not get in the way when fixing the temperature sensor device 10, making it possible to perform the fixing operation smoothly.

Furthermore, if the fixing structure 60 is disposed on the other end face 22 side, the external force applied from the wiring 80 may cause plastic deformation of the connection between the fixing structure 60 and the bottom 43, causing the bottom 43 of the mounting member to float up from the object to be measured 90. However, the temperature sensor device 10 shown in FIG. 1 has a support member 50 disposed near one end face 21 to which the wiring 80 is connected, preventing the fixing structure 60 and the bottom 43 from plastically deforming and bending.

As shown in FIG. 2, the tip 52 of the support member 50 may be slightly spaced from the mounting member 40. If the deformation of the mounting member 40 due to an external force is within the range of temporary elastic deformation, the deformation of the mounting member 40 is released by removing the external force on the wiring 80, and appropriate contact between the bottom 43 of the mounting member 40 and the measurement target 90 is ensured.

2, it is preferable that the base end 51 of the support member 50 is connected to the right side of the bottom 43 when viewed from one end face 21 side (the negative X-axis direction side) with the bottom 43 positioned below the sensor case 20. As can be seen from FIG. 1, when the fixing screw 98 is rotated clockwise to fix the temperature sensor device 10 to the measurement object 90, the problem of the temperature sensor device 10 rotating clockwise around the fixing structure 60 and becoming misaligned can be prevented by the support member 50 engaging with the measurement object 90.

To manufacture the temperature sensor device 10 shown in Figures 1 to 7, the mounting member 40 and support member 50 shown in Figure 8 are prepared. Next, the internal space surrounded by the bottom 43, first and second side portions 44a, 44b, and first and second ends 42a, 42b of the mounting member 40 is filled with pre-cured resin (such as adhesive). Furthermore, the sensor case 20 is inserted into the internal space of the mounting member 40 filled with adhesive.

As shown in FIG. 6, when the sensor case 20 is inserted into the internal space of the mounting member 40, the uncured resin that has been filled in advance flows uniformly into the first gap 71, the second gaps 72a, 72b, and the third gap 78, around the other end face 22 of the sensor case 20, around the first and second side faces 24a, 24b, and the like. A part of the uncured resin is exposed to the outside while filling the first gap 71, and a protruding part is formed in which a part of the first resin part 74 protrudes from the first gap 71 to the fixing structure 60. The resin is cured to form the first resin part 74 and the second resin parts 76a, 76b, thereby obtaining the temperature sensor device 10 as shown in FIG. 6. Note that the air bubbles caught in the uncured resin move upward through the second gaps 72a, 72b, and are discharged to the outside from the first resin part 74 and the second resin parts 76a, 76b before curing.

Although the present invention has been described above with reference to the embodiments, it goes without saying that the technical scope of the present invention is not limited to the above-described embodiments, but includes many other embodiments and variations. For example, the shapes of the first end 42a and the second end 42b of the mounting member 40 are not limited to the generally symmetrical shapes shown in FIG. 4, and the third gap 78 may be biased toward the first side portion 44a or the second side portion 44b.

10...Temperature sensor device 20...Sensor case 21...One end surface 22...Other end surface 23...Bottom surface 24a...First side surface 24b...Second side surface 25...Top surface 26...Case resin 27...Thermal sensor element 28...Lead wire 29...Lead holding member 40...Mounting member 42a...First end 42b...Second end 43...Bottom portion 43a...Lower surface 44a...First side portion 44b...Second side portion 50...Support member 51...Base end 52...Tip 53a...First bent portion 53aa...Inner portion 54a...Second bent portion 54aa...Inner portion 60...Fixing structure 62...Through hole 71...First gap 72a, 72b...Second gap 74...First resin portion 76a, 76b...Second resin portion 78...Third gap 80...Wiring 90...Measurement object 93a, 94a...Corner portion 98...Fixing screw

Claims (6)

a sensor case having a substantially rectangular parallelepiped shape, housing a heat-sensitive element therein, and having wiring connected to one end face;
an attachment member having a bottom portion facing a bottom surface of the sensor case, a side portion extending substantially perpendicularly from the bottom portion and facing a side surface connected to the bottom surface and the one end surface of the sensor case, and an end portion extending substantially perpendicularly from the side portion and facing the other end surface facing in the opposite direction to the one end surface of the sensor case;
a first resin portion disposed in a first gap formed between the end portion and the bottom portion and in contact with the other end face of the sensor case, and a second resin portion disposed in a second gap formed between the side face and the side portion,
A temperature sensor device, wherein the width of the first gap formed between the end portion and the bottom portion is greater than the width of the second gap formed between the side portion and the lateral portion. The temperature sensor device according to claim 1, in which the base end is connected to the bottom of the mounting member, the tip is spaced downward from the bottom in the opposite direction to the sensor case, and a support member is provided between the bottom and the tip to place the object to be measured. The temperature sensor device according to claim 2, wherein the support member is substantially U-shaped connecting the tip end to the base end, and the inner portion of the bent portion of the support member has a curvature smaller than the curvature of the corner of the measurement object adjacent to the inner portion. The temperature sensor device according to claim 2 or 3, wherein the support member is connected to the bottom closer to the one end face than to the other end face. the mounting member has a fixing structure extending along the bottom portion and fixed to the object to be measured,
The temperature sensor device according to claim 4 , wherein the fixing structure is connected to the bottom portion closer to the other end face than to the one end face. the mounting member has a fixing structure extending along the bottom portion and fixed to the object to be measured,
The fixing structure is a screw hole through which a screw is inserted,
A temperature sensor device as described in any one of claims 2 to 5, characterized in that the base end of the support member is connected to the right side of the bottom when viewed from the one end face side with the bottom positioned below the sensor case.

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