JP7453183B2 - Chip repair method and chip repair system - Google Patents

Description

The present invention relates to a chip repair method and system for mounting a replenishment chip on a repair target board having a repair target part that requires repair processing. For example, it relates to repair processing of a board on which electronic components and semiconductor chips such as micro LEDs are mounted.

2. Description of the Related Art There is known an apparatus that picks up chip components such as semiconductor devices and electronic components one by one, aligns and mounts them at predetermined positions set on a substrate (for example, Patent Document 1).

Furthermore, a technique is known in which a plurality of microchips (for example, micro LED chips, etc.) are picked up and these chips are mounted on a substrate all at once (for example, Patent Document 2).

A large number of semiconductor chips mounted on a substrate are inspected for quality, those determined to be defective are removed, and non-defective chips are remounted (i.e., repaired) (for example, as described in patent documents 3).

Japanese Patent Application Publication No. 11-274240 Japanese Patent Application Publication No. 2018-163900 Japanese Patent Application Publication No. 11-8338

For example, in the case of high-definition displays such as televisions, computer monitors, and portable information terminals, there is a strict requirement to reduce pixel defects, so repair processing is often required at many locations. is also irregular. In such cases, the method of picking up, positioning, and crimping replenishment tips one by one at the location to be repaired is difficult to position and control the load when picking up, and to control the load and temperature when crimping. It was time consuming and unproductive.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip repair method and device that can perform quick and stable processing and improve productivity even when there are irregular and large numbers of places to repair a repair chip. shall be.

In order to solve the above problems, one aspect of the present invention is as follows:
A chip repair method in which a replenishment chip is mounted on a repair target board having a repair target part that requires repair processing,
a transfer carrier preparation step of preparing a transfer carrier holding a replenishment chip;
A chip transfer step in which the repair target part of the repair target board and the replenishment chip held in the transfer carrier are aligned and faced, and the replenishment chip is transferred from the transfer carrier to the repair target board. has
In the transfer carrier preparation step,
The arrangement information of the parts to be repaired on the repair target board is acquired, and in the chip transfer step, all the parts to be repaired and the replenishment chips are made to have the same positional relationship with the parts to be repaired and the replenishment chips facing each other. Another feature is that the replenishment chip is placed and held on a transfer carrier.

Moreover, another aspect according to the present invention is
A chip repair system that mounts a replenishment chip on a repair target board having a repair target part that requires repair processing,
a repair position output device that outputs location information of a repair target part on a repair target board;
a transfer carrier preparation device for preparing a transfer carrier holding a replenishment chip;
A chip transfer device that aligns and faces a repair target part of a repair target board and a replenishment chip held in a transfer carrier, and transfers the replenishment chip from the transfer carrier to the repair target board. Equipped with
The carrier preparation device for transfer is
Based on the location information of the repair target part output from the repair position output device, all the repair target parts and the replenishment chip are located at the same position with the repair target part and the replenishment chip facing each other in the chip transfer step. Relatedly, the replenishment chip is arranged and held on a transfer carrier.

Even when there are irregular and large numbers of locations where the repair tip should be repaired, the process can be performed quickly and stably, and productivity can be improved.

1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. FIG. 2 is a plan view showing an example of a repair target substrate to be repaired by applying the present invention and a transfer carrier used for repair. FIG. 1 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIG. 1 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIG. 1 is a sectional view showing a main part of an example of a form embodying the present invention. FIG. 1 is a schematic diagram showing a main part of an example of a form embodying the present invention. It is a flow diagram in an example of the form which embodies the present invention. It is a flow diagram in an example of the form which embodies the present invention. It is a flow diagram in an example of the form which embodies the present invention. FIG. 1 is a sectional view showing a main part of an example of a form embodying the present invention. FIG. 2 is a schematic diagram showing a main part of another example of a form embodying the present invention. FIG. 3 is a cross-sectional view showing a main part of another example of a form embodying the present invention.

EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated using figures.
In the following explanation, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal direction is expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is expressed as the Z direction. do. Further, the X direction is expressed as back/front, and the Y direction is expressed as left/right. Furthermore, in the Z direction, the direction that opposes gravity is expressed as up, and the direction in which gravity acts is expressed as down. Further, the direction of rotation about the X direction as the center axis is defined as the φ direction, and the direction of rotation about the Z direction as the center axis is defined as the θ direction.

FIG. 1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. FIG. 1 shows a schematic diagram of a chip repair system 1 according to the present invention.

The chip repair system 1 mounts a replenishment chip Cb on a repair target board W1 having a repair target part Cx that requires repair processing. Note that "mounting" of chips in this context is limited to the state in which they are firmly fixed to each other via solder or conductive resin so that they do not fall off or shift even when external force or vibration is applied (also called completely fixed). However, it also includes a state where they are temporarily stuck together due to not-so-strong bonding force or adhesive force (also referred to as temporary fixation).

Specifically, the chip repair system 1 includes a repair position output device 2, a transfer carrier preparation device 3, a surface condition modification device 4, a chip transfer device 5, a transfer robot (not shown), etc. There is.

FIG. 2 is a plan view showing an example of a repair target substrate W1 to be repaired by applying the present invention and a transfer carrier W2 used for repair. FIG. 2A shows a state in which non-defective chips Ca and repair target parts Cx that require repair are mixed and arranged in the repair target board W1. FIG. 2B shows how the replenishment chip Cb is arranged on the transfer carrier W2.

In addition, the surface of the repair target board W1 on the side where the repair target part Cx is located (that is, the side on which the replenishment chip Cb is mounted) is called the upper surface or front surface, and the opposite side is called the lower surface or back surface. Further, the surface of the transfer carrier W2 on the side that holds the replenishment chip Cb (that is, the side on which the adhesive layer B is formed) is called the front surface, and the opposite side is called the back surface.

On the front side of the repair target board W1, good chips Ca are arranged in a matrix at a predetermined pitch, and the area where there is no good chip Ca is a repair target part Cx. Further, an alignment mark M1 is attached to the front surface of the repair target substrate W1, and relative positions (coordinates: Xcx, Ycx) of the repair target part Cx are respectively defined with reference to the alignment mark M1.

On the other hand, an alignment mark M2 is attached to the front surface of the transfer carrier W2, and the alignment marks M1 and M2 are set to have an equal interval Px in the X direction and an equal interval Py in the Y direction. There is. Then, when the front surfaces of the repair target substrate W1 and the transfer carrier W2 are arranged to face each other so that the alignment marks M1 and M2 overlap each other, the repair target part Cx and the replenishment chip Cb are arranged facing each other in the same positional relationship. As shown, a replenishment chip Cb (coordinates: Xcb, Ycb) is arranged on the front surface of the transfer carrier W2 with reference to the alignment mark M2.

Note that a plurality of batch processing areas R (for example, R1 to R4) having a plurality of repair target parts Cx are set on the repair target substrate W1, and the batch processing area R is an effective processing area (for example, R1 to R4) of the transfer carrier W2. It is set in correspondence with the range in which heating and pressure conditions can be made generally uniform during chip transfer.

The repair position output device 2 outputs location information of the repair target portion Cx on the repair target board W1.

FIG. 3 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIG. 3 schematically shows a repair position output device 2 according to the present invention.

Specifically, the repair position output device 2 detects at which position within the repair target board W1 the repair target part Cx is located, and outputs it as placement information J of the repair target part Cx.

More specifically, the repair position output device 2 can be configured as a part of an optical inspection device (also referred to as a visual inspection device), and includes a substrate holding table 21, an imaging camera 22, a processing section 23, and a moving section 24. etc.

The substrate holding stand 21 holds the repair target substrate W1 in a predetermined posture.
Specifically, the substrate holding stand 21 supports the lower surface of the repair target substrate W1 and holds it in a horizontal state. More specifically, the substrate holding stand 21 is composed of a plate-like member with a flat holding surface (that is, the side in contact with the lower surface of the repair target substrate W1), and pores and grooves are formed in the holding surface. has been done. These pores and grooves are connected to a negative pressure suction means via a switching valve, etc., and when the negative pressure suction means is operated with the repair target substrate W1 placed on the holding surface, these pores and grooves A suction force is generated in the space formed by the substrate W1 to be repaired and the substrate W1 to be repaired. Therefore, the repair target substrate W1 is attracted to and held by the holding surface.

The imaging camera 22 images the external appearance of the alignment mark M1, good chips Ca, defective chips (damaged, misaligned, missing, unlit, etc.) on the top surface of the repair target substrate W1 at a predetermined observation magnification.
Specifically, the imaging camera 22 is arranged above the repair target board W1, and is arranged so as to look down on a part or the entire top surface of the repair target board W1. The imaging camera 22 outputs a video signal and image data corresponding to the captured image to the outside. Note that the imaging camera 22 is fixed to a device frame (not shown) or the like via a connecting fitting or the like.

The processing unit 23 acquires and processes images (that is, video signals and image data) output from the imaging camera 22, and outputs position information J of the repair target portion Cx. Specifically, the processing unit 23 determines the quality of the chip included in the image, detects the positions of the alignment mark M1, the good chip Ca, the defective chip, etc. included in the image, and determines the quality of the repair target part Cx. It has a configuration that calculates the position (for example, the relative position with respect to the reference position of the alignment mark M1 and the repair target substrate W: coordinate data, etc.) and outputs the position information J. More specifically, the processing unit 23 can be exemplified by a computer having an image processing function.

The moving unit 24 is for moving the substrate holding table 21 and the imaging camera 22 relatively. Specifically, the moving unit 24 includes a mechanism (for example, an XY stage) that moves the substrate holding table 21 in the XY directions at a predetermined speed and stops it at a predetermined location.

Since the repair position output device 2 has such a configuration, it detects where a defective chip or a missing part (that is, the repair target part Cx) is placed in the repair target board W1, and outputs the repair target part. Coordinate data, etc. (that is, arrangement information J) of each Cx can be output. Note that for the multiple batch processing areas R (R1 to R4 in this example) set in the repair target board W1, the alignment mark M1 in the area is set for each batch processing area R (R1 is illustrated as an example in the figure). The positional information J of the repair target part Cx is linked to the address number of the batch processing area R, etc., and output.

The transfer carrier preparation device 3 prepares a transfer carrier W2 holding a replenishment chip Cb. Furthermore, based on the arrangement information J of the repair target part Cx outputted from the repair position output device 2, the transfer carrier preparation device 2 causes the repair target part Cx and the replenishment chip Cb to face each other during chip transfer. The replenishment chip Cb is arranged and held on the transfer carrier W2 so that all the repair target parts Cx and the replenishment chip Cb have the same positional relationship.

Specifically, the transfer carrier preparation device 3 acquires the placement information J of the repair target portion Cx output from the repair position output device 2, and performs the repair so that the alignment marks M1 and M2 overlap each other during chip transfer. Transfer is performed using the alignment mark M2 as a reference so that when the front surfaces of the target substrate W1 and the transfer carrier W2 are placed facing each other, the repair target part Cx and the replenishment chip Cb are placed facing each other in the same positional relationship. A replenishment chip Cb is placed on the front side of the carrier W2. That is, the replenishment chips Cb on the transfer carrier W2 are arranged with the alignment mark M2 as a reference so as to be symmetrical with the repair target portion Cx of the repair target substrate W1 (see FIG. 2).

More specifically, the transfer carrier preparation device 3 determines at which position on the transfer carrier W2 the replenishment chip Cb should be placed based on the placement information J of the repair target portion Cx (that is, the placement information J2). is calculated for each of the batch processing areas R (R1 to R4 in this example), and the replenishment chips Cb are placed on the transfer carrier W2 based on the placement information J2. For example, when the X-axis is the axis of symmetry, this placement information J2 is a replenishment tip with reference to the alignment mark M2 so that the coordinates in the Y direction are opposite to the repair target Cx included in the placement information J. Set the coordinates of Cb. For example, the repair target part Cx is placed at the coordinates (Xcx, Ycx): (10, -10), (10, -30), (30, -30), etc. of the repair target board W1 with the front side facing up. If so, place the transfer chip Cb at coordinates (Xcb, Ycb): (10, 10), (10, 30), (30, 30), etc. on the transfer carrier W2 with the front side facing up. do. Therefore, when the repair target substrate W1 and the transfer carrier W2 are aligned and placed facing each other so that the alignment marks M1 and M2 overlap, the transfer chip Cb has the coordinates (x, y): (10, -10), Since they are located at (10, -30), (30, -30), etc., the replenishment chip Cb can be superimposed on the repair target part Cx in the same positional relationship.

FIG. 4 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIG. 4 shows an outline of the transfer carrier preparation device 3 according to the present invention, and the transfer carrier W2 arranged for the repair target portion Cx in the batch processing area R (R1 in this example) set on the repair target substrate W1. The positional relationship with the replenishment chip Cb is shown.

More specifically, the transfer carrier preparation device 3 includes a carrier holding section 31, a chip supply substrate holding section 32, imaging cameras 33, 34, a pick and place section 35, a control section 39, and the like.

The carrier holding section 31 holds the transfer carrier W2 in a predetermined posture.
Specifically, the carrier holding section 31 supports the back surface of the transfer carrier W2 and holds it in a horizontal state.
More specifically, the carrier holding section 31 is composed of a plate-like member with a flat holding surface (that is, the side in contact with the back surface of the transfer carrier W2), and the holding surface has pores and grooves. It is formed. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the back side of the transfer carrier W2 under negative pressure.

The chip supply board holding section 32 holds the chip supply board W3 in a predetermined posture. Specifically, the chip supply board W3 supplies replenishment chips Cb. A large number of supplementary chips Cb are arranged at a predetermined pitch on the upper surface of the chip supply board W3.
More specifically, the chip supply board holding section 32 is composed of a plate-like member with a flat holding surface (that is, the side in contact with the lower surface of the chip supply board W3), and the holding surface has pores and grooves. is formed. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the lower surface side of the chip supply substrate W3 in a negative pressure state.

The imaging camera 33 images the alignment mark M2 on the front surface of the transfer carrier W2 at a predetermined observation magnification.
Specifically, the imaging camera 33 is arranged above the transfer carrier W2, and is arranged so as to look down on a part or the entire front surface of the transfer carrier W2.

The imaging camera 34 images the alignment mark M3 on the top surface of the chip supply board W3 at a predetermined observation magnification.
Specifically, the imaging camera 34 is arranged above the chip supply board W3, and is arranged so as to look down on a part or the entire top surface of the chip supply board W3.
The imaging cameras 33 and 34 then output video signals and image data corresponding to the captured images to the control unit 39. Note that the imaging cameras 33 and 34 are fixed to a device frame (not shown) or the like via a connecting fitting or the like.

The pick-and-place unit 35 is a device that picks up the replenishment chips Cb one by one from the chip supply board W3 and arranges the replenishment chips Cb at predetermined positions on the transfer carrier W2. Specifically, the pick-and-place section 35 includes a holding section that holds the replenishment chip Cb by suction or the like, a moving section (such as a transfer robot) that moves the holding section horizontally and vertically, and the like. has been done.
More specifically, the pick and place section 35 includes an X-axis actuator 35X, a Y-axis actuator 35Y, a Z-axis actuator 35Z, a holding head 35H, and the like.
The X-axis actuator 35X moves the holding head 35 in the X direction, the Y-axis actuator 35Y moves the holding head 35 in the Y direction, and the Z-axis actuator 35Z moves the holding head 35 in the Z direction at a predetermined speed. It is something that makes it stand still.
The holding head 35H temporarily holds the replenishment chip Cb.
Specifically, the holding head 35H has a lower surface made of a soft or hard member, and holds the upper surface of the replenishment chip Cb by the adhesive force, negative pressure suction force, electrostatic force, etc. of the surface of the member. or release the hold.

The control section 39 controls each section of the transfer carrier preparation device 3.
Specifically, the control unit 39 has the following functions.
- Acquire the position information J of the repair target part Cx output from the repair position output device 2.
- Control the switching valves of the carrier holding section 31 and the chip supply substrate holding section 32 to hold or release the transfer carrier W2 and the chip supply substrate W3.
- Based on the images including the alignment marks M2 and M3 acquired from the imaging cameras 33 and 34, for each batch processing area R (R1 to R4 in this example) set within the repair target board W1, The arrangement position J2 of the replenishment chip Cb on the transfer carrier W2 is calculated so that the repair target part Cx and the replenishment chip Cb have the same positional relationship. Specifically, the coordinates for arranging the replenishment chip Cb are calculated so as to be line symmetrical with the repair target part Cx. More specifically, based on the arrangement information J of the repair target part Cx, the arrangement information J2 of the replenishment chip Cb is calculated, which is linked with address information etc. for each transfer carrier W2 corresponding to the batch processing area R. Then, the replenishment chip Cb is placed on the transfer carrier W2 based on the placement information J2.
- Control the pick-and-place unit 35 to transfer the replenishment chip Cb from the chip supply substrate W3 side to the transfer carrier W2 side according to the arrangement position J2 of the replenishment chip Cb.
- Output the arrangement information J2 of the replenishment chip Cb, which is linked with address information etc. for each transfer carrier W2 corresponding to the batch processing area R.
More specifically, the control unit 39 is composed of a computer and its program.

Because of this configuration, when the transfer carrier W2 prepared using the transfer carrier preparation device 3 is aligned and opposed to the repair target substrate W1 during chip transfer, which will be described in detail later, all The repair target part Cx and the replenishment chip Cb have the same positional relationship.

The surface condition modification device 4 modifies the surface condition of the exposed portion of the adhesive layer B where the replenishment chips Cb are not arranged, of the transfer carrier W2 holding the replenishment chips Cb on the adhesive layer B. It is.

Specifically, the surface condition modification device 4 is configured to perform plasma treatment on the front surface of the transfer carrier W2 to form minute irregularities on the surface of the exposed portion of the adhesive layer B.

FIG. 5 is a sectional view showing a main part of an example of a form embodying the present invention. FIG. 5A shows how the surface of the transfer carrier W2 is modified using the surface condition modification device 4. FIG. 5(b) shows the state after the surface of the transfer carrier W2 has been modified using the surface state modification device 4.

More specifically, the surface state modification device 4 includes a carrier holding section 41 and a plasma irradiation section 42.

The carrier holding section 41 holds the transfer carrier W2 in a predetermined posture.
Specifically, the carrier holding section 31 holds the transfer carrier W2 so that the front side (the replenishment chip Cb and the adhesive layer B) of the transfer carrier W2 faces the plasma irradiation section 42 side.
More specifically, the carrier holding section 41 is composed of a plate-like member with a flat upper surface (that is, the side that contacts the back surface of the transfer carrier W2), and has pores and grooves formed on the upper surface. There is. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the back side of the transfer carrier W2 under negative pressure.

The plasma irradiation unit 42 modifies the surface condition of the adhesive layer B formed on the front surface of the transfer carrier W2.
Specifically, the plasma irradiation unit 42 introduces a reactive gas into a closed space or a semi-closed space called a chamber in a vacuum or reduced pressure state, and applies high alternating current to electrodes arranged inside or around the space. By applying a voltage, plasma (electrons, ions, radicals, etc.) is generated and filled in the space, and the plasma is emitted (that is, irradiated) from the space to the outside.
More specifically, the plasma irradiation section 42 may use argon gas, oxygen, CF4 gas, or the like as a reactive gas.

Since the surface condition modification device 4 has such a configuration, by performing ablation or chemical etching on the surface of the exposed portion of the adhesive layer B, a fine uneven shape is formed on the surface of the exposed portion. (that is, modify the surface state).

The chip transfer device 5 aligns and faces the repair target portion Cx of the repair target substrate W1 and the replenishment chip Cb held on the transfer carrier W2, and transfers the replenishment chip Cb from the transfer carrier W2 to the repair target. It is to be transferred (that is, mounted) onto the substrate W1.

Specifically, the chip transfer device 5 uses the placement information J of the repair target portion Cx outputted from the repair position output device 2 and the placement information linked to the transfer carrier W2 outputted from the transfer carrier preparation device 3. J2, recognizes the alignment mark M1 attached to the repair target substrate W1 and the alignment mark M2 attached to the transfer carrier W2, and aligns the repair target substrate W1 and the transfer carrier W2 so that they face each other. The replenishment chip Cb is transferred from the transfer carrier W2 to the repair target substrate W1 by applying heat or load to the repair target substrate W1 from the transfer carrier W2 and then peeling off the transfer carrier W2. ing. Note that the transfer of the replenishment chips Cb is performed in batch for each batch processing area R.

FIG. 6 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIG. 6 shows a schematic configuration of the chip transfer device 5 according to the present invention and an operational image of chip transfer.

More specifically, the chip transfer device 5 includes a substrate holding table 51, a carrier holding section 52, imaging cameras 53, 54, a moving section 55, a control section 56, and the like.

The substrate holding stand 51 holds the repair target substrate W1 in a predetermined posture.
Specifically, the substrate holding stand 51 supports the lower surface of the repair target substrate W1 and holds it in a horizontal state. More specifically, the substrate holding stand 51 is composed of a plate-like member with a flat holding surface (that is, the side in contact with the lower surface of the repair target substrate W1), and pores and grooves are formed in the holding surface. has been done. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the lower surface side of the repair target substrate W1 in a negative pressure state.

The carrier holding section 52 holds the transfer carrier W2 in a predetermined posture.
Specifically, the carrier holding section 52 supports the back surface of the transfer carrier W2 and holds it in a horizontal state. More specifically, the carrier holding section 52 is composed of a plate-like member with a flat holding surface (that is, the side that contacts the back surface of the transfer carrier W2), and the holding surface has pores and grooves. It is formed. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the back side of the transfer carrier W2 under negative pressure. Further, the carrier holding section 52 includes means (such as a heater) for heating the transfer carrier W2 to a predetermined temperature.

The imaging camera 53 is a device (that is, a recognition unit) that images the alignment mark M1 on the top surface of the repair target substrate W1 at a predetermined observation magnification.
Specifically, the imaging camera 53 is arranged above the repair target board W1, and is arranged so as to look down on a part or the entire top surface of the repair target board W1.

The imaging camera 54 is a device (that is, a recognition means) that images the alignment mark M2 on the front surface of the transfer carrier W2 at a predetermined observation magnification.
Specifically, the imaging camera 54 is arranged above the transfer carrier W2, and is arranged so as to look down on a part or the entire front surface of the transfer carrier W2.
The imaging cameras 53 and 54 then output video signals and image data corresponding to the captured images to the control unit 39. Note that the imaging cameras 53 and 54 are fixed to an apparatus frame (not shown) or the like via a connecting fitting or the like.

The moving unit 55 moves the transfer carrier W2 relative to the repair target substrate W1 and changes the positions of the imaging cameras 53 and 54.
Specifically, based on a command from the control unit 56, the moving unit 55 rotates the carrier holding unit 52 in the φ direction to turn it upside down, or moves or rotates it by a predetermined amount in the XYZθ directions to a predetermined position or An example is a mechanism that allows the body to remain stationary in its posture.

The control section 56 controls each section of the chip transfer device 5.
Specifically, the control unit 56 has the following functions.
- Acquire the position information J of the repair target part Cx output from the repair position output device 2.
- Obtain the arrangement information J2 of the replenishment chip Cb, which is output from the transfer carrier preparation device 3 and is linked with address information etc. for each transfer carrier W2.
- Control the switching valves of the substrate holding table 51 and carrier holding table 52 to hold or release the repair target substrate W1 and transfer carrier W2.
- For each batch processing area R (R1 to R4 in this example) set within the repair target board W1, the repair target board W1 is The transfer carrier W2 is aligned and placed opposite to the transfer carrier W2. Specifically, the transfer carrier W2 is reversed around the X axis (in other words, in the φ direction) so that the front side faces down, and the substrate to be repaired W1 and the transfer carrier W2 are placed on the front side so that the alignment marks M1 and M2 overlap. Align the surfaces by placing them facing each other. By doing so, the replenishment chip Cb can be superimposed on the repair target part Cx in the same positional relationship.
- Adjust the temperature of the heater built into the carrier holding stand 52.
- Pressurize the transfer carrier W2 toward the repair target substrate W1 side, and transfer the replenishment chips Cb from the chip supply substrate W3 side to the transfer carrier W2 side.
- Separate the transfer carrier W2 from the repair target substrate W1, and peel off the replenishment chip Cb from the transfer carrier W2.
More specifically, the control unit 56 is composed of a computer and its program.

Since the chip transfer device 5 has such a configuration, the repair target portion Cx of the repair target substrate W1 and the replenishment chip Cb held on the transfer carrier W2 are aligned and faced, and the transfer carrier The replenishment chip Cb can be transferred from W2 to the repair target substrate W1.

The transfer robot (not shown) holds the repair target substrate W1 and the transfer carrier W2 and moves it to a desired location. Specifically, the transfer robot supports the back surface of the repair target substrate W1 or the transfer carrier W2 and holds it by suction, or grips the outer peripheral side surface (side clamp) and transfers the substrate from a predetermined location to another. An example is a configuration in which the device is moved to a location and the suction holding or grip is released. More specifically, the transfer robot includes a hand section that holds the repair target substrate W1 and the transfer carrier W2, and a multi-axis actuator (also known as a multi-axis robot or articulated robot) that moves the hand section horizontally and vertically. ).

[Operation flow]
Below, detailed steps will be given while illustrating the operation flow of a chip repair method for mounting a replenishment chip Cb on a repair target board W1 having a repair target part Cx that requires repair processing using the above-described chip repair system 1. Explain.

FIG. 7 is a flow diagram in an example of a form embodying the present invention.

The chip repair method according to the present invention includes a transfer carrier preparation step s1 and a chip transfer step s2.
In the transfer carrier preparation step s1, a transfer carrier W2 holding a replenishment chip Cb is prepared.
In the chip transfer step s2, the repair target portion Cx of the repair target substrate W1 and the replenishment chip Cb held on the transfer carrier W2 are aligned and faced, and the replenishment chip Cb is repaired from the transfer carrier W2. It is transferred onto the target substrate W1.

FIG. 8 is a flow diagram in an example of a form embodying the present invention. FIG. 8 shows a detailed flow of the transfer carrier preparation step s1 according to the present invention.

Specifically, in the transfer carrier preparation step s1, the following processing is performed.
First, the arrangement information J of the repair target section Cx on the repair target board W1 is acquired (step s11). The arrangement information J of the repair target portion Cx is outputted using, for example, the above-described repair position output device 2, and is acquired by the above-described transfer carrier preparation device 2.

Next, using the transfer carrier preparation device 2, it is calculated where on the transfer carrier W2 the replenishment chip Cb is to be placed (step s12). At this time, the replenishment chips Cb are arranged so that all the repair target parts Cx and the replenishment chips Cb are line-symmetrical with the repair target part Cx and the replenishment chip Cb facing each other during chip transfer. Information J2 is calculated.

Then, in the transfer carrier preparation device 2, the pickup place unit 35 arranges and holds the replenishment chips Cb from the chip supply board W3 at a predetermined position on the transfer carrier W2 according to the calculated replenishment chip Cb placement information J2. (Step s13).

Thereafter, the above-mentioned surface condition modification device 4 is used to modify the surface condition of the exposed portion of the adhesive layer B where the replenishment chips Cb of the transfer carrier W2 are not arranged (step s14).
Specifically, as shown in FIG. 5A, the front surface (that is, the exposed portion Bn of the adhesive layer B) of the transfer carrier W2 is irradiated with plasma P from the plasma irradiation unit 42 for a predetermined period of time. By doing so, as shown in FIG. 5(b), minute irregularities are formed on the surface Bs of the exposed portion of the adhesive layer B where the replenishment chip Cb is not placed.

FIG. 9 is a flow diagram in an example of a form embodying the present invention. FIG. 9 shows a detailed flow of the chip transfer step s2 according to the present invention.

Specifically, in the chip transfer step s2, the following process is performed using the chip transfer device 5.
First, the arrangement information J of the repair target part Cx on the repair target board W1 is acquired from the repair position output device 2, and the repair target board W1 is held on the board holding stand 51 (step s21).
Subsequently, the arrangement information J2 of the replenishment chip Cb, which is associated with address information etc. for each transfer carrier W2, is obtained from the transfer carrier preparation device 3, and the transfer carrier W2 is held on the carrier holding table 52 (step s22).
Then, the alignment mark M1 of the repair target substrate W1 and the alignment mark M2 of the transfer carrier W2 are read, and the repair target substrate W1 and the transfer carrier W2 are aligned and placed facing each other (step s23). At this time, for each batch processing area R (R1 to R4 in this example) set within the repair target substrate W1, a transfer carrier W2 corresponding to each area is held, aligned, and placed facing each other.

Thereafter, the transfer carrier W2 is pressed against the repair target substrate W1 side, and the replenishment chip Cb arranged on the transfer carrier W2 is transferred onto the repair target substrate W1 side (step s24). Then, the repair target substrate W1 and the transfer carrier W2 are separated (step s25), and the transfer carrier W2 is carried out (step s26).
Then, it is determined whether or not to transfer to the next batch processing area R (step s27), and if transfer is to be performed, the above steps s22 to s27 are repeated. If transfer is not to be performed, the repair target substrate W1 is carried out (step s28), and the series of steps ends.

FIG. 10 is a sectional view showing a main part of an example of a form embodying the present invention. FIG. 10A shows the state when the repair target substrate W1 and the transfer carrier W2 are aligned and placed facing each other (step s23), and FIG. FIG. 10C shows the state when transferring to the target substrate W1 (step s24), and the state after separating the repair target substrate W1 and transfer carrier W2 (step s25). has been done.

With the tip repair method and tip repair system 1 according to the present invention, even when there are irregular and large numbers of places to repair a repair tip, the process can be performed quickly and stably, and productivity can be improved. Can be done.

[About surface modification]
Furthermore, the surface condition modification device 4 and the surface modification step s14 perform plasma treatment on the front surface of the transfer carrier W2 to form minute irregularities on the surface of the exposed portion of the adhesive layer B. , the adhesion with the normal chip Ca already mounted on the repair target substrate W1 can be reduced or eliminated. Therefore, even if the degree of adhesion between the normal chip Ca and the repair target substrate W1 is weak, not only can the transfer carrier W2 after chip transfer be peeled off smoothly, but also the normal chip Ca may be displaced or fall off. This is preferable because it can prevent.

In addition, in the above description, plasma treatment was illustrated as a specific example of surface modification of the exposed portion of the adhesive layer B. Plasma treatment is preferable because it allows rapid and reliable modification treatment to be performed only on a very small surface layer of the adhesive layer B.
However, the surface modification is not limited to plasma treatment, and the adhesive strength of the surface of the exposed portion of the adhesive layer B may be weakened by other means or methods. For example, fine irregularities may be formed by scanning and irradiating the surface of the exposed portion of the adhesive layer B with a laser beam. Alternatively, minute irregularities may be formed on the surface by spraying fine particles of dry ice, water, ice, etc., or a mold release agent (silicon), etc.

In addition, in the above description, the configuration and procedure for surface modification of the exposed portion of the adhesive layer B have been illustrated in embodying the present invention. However, when the degree of adhesion between the normal chip Ca and the repair target substrate W1 is extremely strong, the time required to peel off the transfer carrier W2 does not increase significantly, and the normal chip Ca does not become misaligned or fall off. In such a case, surface modification is not essential and may be omitted, allowing rapid and stable processing to be performed and productivity to be improved.

Note that the surface condition modification device 4 may be provided within the transfer carrier preparation device 3 or may be provided within the chip transfer device 4, or the transfer carrier W2 may be provided within the transfer carrier preparation device 3. It may also be provided in a transport device (such as a transfer robot) that transports the chips from the chip to the chip transfer device 5 or in the transport path of the transfer carrier W2.

[About batch processing]
Note that in the above description, a plurality of batch processing areas R having a plurality of repair target parts Cx are set on the repair target substrate W1, and the batch processing area R corresponds to the transfer carrier W2. Then, in the transfer carrier preparation step s1, a plurality of replenishment chips Cb are arranged and held in the transfer carrier W2 based on the arrangement information J of the plurality of repair target parts Cx in the batch processing area R, and the chip transfer In step s2, a procedure is illustrated in which a plurality of replenishment chips Cb are transferred from the transfer carrier W2 to a plurality of repair target parts Cx in the batch processing area R at once.

According to such a configuration and procedure, even if the repair target substrate W1 has a large area, the vertical and horizontal dimensions and area of the batch processing area R are limited and the processing is divided into a plurality of areas, so that the replenishment chip Cb This is preferable because it makes it easier to uniformize the conditions for heating and pressurizing the area. Further, regardless of the number of replenishment chips Cb in the batch processing area R, heating and pressurization can be applied to the normal chips Ca and the replenishment chips Cb. Therefore, the heat and load applied to each replenishment chip Cb are not affected by the arrangement of the replenishment chips Cb, and the same conditions can always be repeatedly reproduced, which is preferable. Furthermore, if a plurality of normal chips Ca and replenishment chips Cb are placed in the batch processing area R, the pressurized load will be distributed to each chip, so crimping and transfer will be possible with a slight load (also called zero load). This is preferable because it allows

[About batch processing area]
Note that in the above description, a configuration is shown in which a plurality of batch processing areas R (in this example, four, R1 to R4) are set on the repair target board W1.
With such a configuration, the processing time is reduced even if a large number of replenishment chips Cb are included because the positions are positioned for each batch processing area R (R1 to R4) and multiple replenishment chips Cb are transferred at once. This is preferable because it does not increase the amount of water and can be processed quickly. Further, even if a large number of batch processing areas R are set, a configuration can be adopted in which a plurality of transfer carrier preparation devices 3 are provided and the work of arranging replenishment chips Cb on the transfer carrier W2 is performed in parallel. This is preferable because it enables faster processing.

However, how to divide and set multiple batch processing areas R for the repair target substrate W1 depends on the vertical and horizontal dimensions of the effective processing area of the transfer carrier W2, the vertical and horizontal dimensions of the repair target substrate W1, and the repair target part Cx. It may be determined as appropriate based on the distribution range, etc. At this time, the areas may be divided so that overlapping areas do not occur, or may be set so that they partially overlap.

In the above description, a configuration is shown in which a plurality of batch processing areas R are set on the repair target substrate W1, but if the repair target substrate W1 is not very large in area, the transfer carrier W2 has the same size as the repair target substrate W1. Alternatively, the replenishment chip Cb may be transferred to all the repair target parts Cx at once.

[Modified example]
[About chip transfer alignment]
Note that in the above description, the chip transfer device 5 is provided with imaging cameras 53 and 54 as recognition means, and the arrangement is illustrated in which the alignment marks M1 and M2 are separately imaged.
However, in embodying the present invention, a configuration may be adopted in which the alignment marks M1 and M2 are imaged by the same recognition means.
Specifically, as the recognition means, a device (so-called two-view camera) that is located between the repair target substrate W1 and the transfer carrier W2 and simultaneously images the alignment mark M1 and the alignment mark M2 will be exemplified.

A two-field camera has a configuration in which the imaging area that is incident on and imaged by one image sensor is divided into two, and one imaging area images the upper side, and the other imaging area images the lower side.
Specifically, in the two-view camera, the repair target substrate W1 to be aligned and the transfer carrier W2 are arranged facing each other, and the lens tip of the two-view camera is placed between them, and the alignment marks M1 and M2 attached to these are arranged to face each other. Images are simultaneously captured and video signals and image data corresponding to the captured images are output to the control unit 39.

If the recognition means has such a configuration, the repair target substrate W1 and the transfer carrier W2 are aligned while facing each other, and after alignment, the number of actuators (also referred to as the number of axes) to be driven can be reduced or driven. This is preferable because the movement stroke of the actuator can be shortened and the positional accuracy of chip transfer can be improved.

[About chip transfer alignment/position information]
Note that in the above description, a configuration is shown in which the alignment marks M1 and M2 are recognized when aligning the repair target substrate W1 and the transfer carrier W2 in the chip transfer device 5.
However, positional information other than the alignment marks M1 and M2 may be used to align the repair target substrate W1 and the transfer carrier W2.

For example, instead of the alignment mark M1 attached to the repair target board W1, position information J of the repair target part Cx of the repair target board W1 may be calculated and used. Alternatively, the position information J of the mounted non-defective chip Ca that has already been mounted on the repair target board W1 may be calculated and used. On the other hand, instead of the alignment mark M21 attached to the transfer carrier W2, position information J2 of the replenishment chip Cb held on the transfer carrier W2 may be calculated and used.

It is preferable to perform chip transfer using a recognition means having such a configuration because even if the repair target portion Cx or the replenishment chip Cb is minute, positioning can be performed with high precision.

However, in embodying the present invention, the recognition means is not an essential configuration, and the recognition means is not an essential component, and the recognition means is not required, and the repair target substrate W1 and the transfer carrier W2 are aligned so that the outer shapes of the repair target substrate W1 and the transfer carrier W2 are aligned at predetermined positions. It may also be configured to align by clamping the side surfaces.

[About preparation of transfer carrier]
In the above description, as an example of the transfer carrier preparation device 3, a configuration is shown in which the transfer carrier preparation device 3 is temporarily held (temporarily placed) by a pick-and-place method. However, in embodying the present invention, the transfer carrier preparation device 3B is not limited to this configuration, and may have a configuration as described below (also referred to as a laser lift-off method).

The transfer carrier preparation device 3B is a device that irradiates the replenishment chips Cb with a laser beam LB and transfers and arranges the replenishment chips Cb one by one from the chip supply substrate W3 to predetermined positions on the transfer carrier W2.

FIG. 11 is a schematic diagram showing a main part of another example of a form embodying the present invention. FIG. 11 shows an outline of the transfer carrier preparation device 3B.

Specifically, the transfer carrier preparation device 3B includes a carrier holding section 31, a chip supply substrate holding section 32B, imaging cameras 33, 34, a laser transfer section 36, a moving section 37, a control section 39B, and the like.

The carrier holding section 31 holds the transfer carrier W2 in a predetermined posture.
Specifically, the carrier holding section 31 supports the back surface of the transfer carrier W2 and holds it in a horizontal state.
More specifically, the carrier holding part 31 is composed of a plate-like member with a flat upper surface (that is, the side that contacts the back surface of the transfer carrier W2), and pores and grooves are formed on the upper surface. ing. These pores and grooves are connected to a negative pressure suction means via a switching valve or the like, and are used to maintain the back side of the transfer carrier W2 under negative pressure.

The chip supply board holding section 32B holds the chip supply board W3 in a predetermined posture. The chip supply board W3 supplies replenishment chips Cb. A large number of supplementary chips Cb are arranged at a predetermined pitch on the lower surface of the chip supply board W3.
Specifically, the chip supply substrate holding section 32B has a configuration in which the chip supply substrate W3 is placed oppositely above the transfer carrier W2 held by the carrier holding section 31 while maintaining a predetermined interval G therebetween.
More specifically, the chip supply board holding section 32B includes a frame body and a holding mechanism (not shown) that support the outer peripheral part of the chip supply board W3 outside the area where the replenishment chips Cb are arranged from the bottom surface. There is. This frame has a roughly L-shaped cross-sectional shape (see inside the dotted ellipse) with a concave inner circumferential side on the top surface, and is equipped with a holding mechanism (not shown) that restricts displacement in the horizontal and vertical directions. ing. The holding mechanism holds the chip supply board W3 horizontally or vertically, and prevents the chip supply board W3 from shifting due to negative pressure, electrostatic force, or the like.

The imaging camera 33 images the alignment mark M2 on the front surface of the transfer carrier W2 at a predetermined observation magnification.
Specifically, the imaging camera 33 is arranged above the transfer carrier W2, and is arranged so as to look down on a part or the entire front surface of the transfer carrier W2.

The imaging camera 34 images the alignment mark M3 on the lower surface of the chip supply board W3 at a predetermined observation magnification.
Specifically, the imaging camera 34 is arranged below the chip supply board W3, and is arranged so as to look up at part or the entire bottom surface of the chip supply board W3.
The imaging cameras 33 and 34 then output video signals and image data corresponding to the captured images to the control unit 39B. Note that the imaging cameras 33 and 34 are fixed to a device frame (not shown) or the like via a connecting fitting or the like.

The laser transfer unit 36 is a device that irradiates the replenishment chips Cb one by one from the chip supply substrate W3 with a laser beam to transfer them to predetermined positions on the transfer carrier W2.
Specifically, the laser transfer unit 36 aligns and places the transfer carrier W2 before transferring the replenishment chips Cb and the chip supply board W3 provided with a large number of replenishment chips Cb to face each other, and supplies the chips. By irradiating the replenishment chip Cb with a laser beam from the substrate W3 side, the replenishment chip Cb is transferred from the chip supply substrate W3 side to the transfer carrier W2 side.
More specifically, the laser transfer section 36 includes a laser oscillator 36L, a beam scanning section 36S, and the like.

The laser oscillator 36L outputs a laser beam LB.
Specifically, in the laser oscillator 36L, the power and irradiation ON/OFF of the laser beam LB are controlled based on a control signal from the control unit 39B.
The beam scanning section 36S changes the irradiation position of the laser beam LB. Specifically, a device called a galvano scanner that includes a mirror and a mechanism for changing its rotation angle can be exemplified. More specifically, the beam scanning unit 36S can change the irradiation position of the laser beam LB in the XY directions so as to cover the range where the replenishment chips Cb to be transferred to the transfer carrier W2 are arranged.

The moving section 37 relatively moves the transfer carrier W2, the laser transfer section 36, and the chip supply substrate W3.
Specifically, the moving unit 37 is configured to move and stationary the frame of the chip supply board holding unit 32B that holds the chip supply board W3 in the XY directions, and to rotate and stand still in the θ direction. . More specifically, the moving section 37 can be exemplified by an XYθ stage mechanism. The control section 39B controls each section of the transfer carrier preparation device 3B.
Specifically, the control unit 39B has the following functions.
- Acquire the position information J of the repair target part Cx output from the repair position output device 2.
- Controls the switching valve of the carrier holding section 31 and the holding mechanism of the chip supply substrate holding section 32B to hold or release the transfer carrier W2 and the chip supply substrate W3.
- The moving unit 37 is controlled based on images acquired from the imaging cameras 33 and 34, and the transfer carrier W2 and the chip supply substrate W3 are aligned and placed facing each other.
- Control the laser transfer unit 36 to irradiate the replenishment chip Cb with a laser beam LB to transfer the replenishment chip Cb from the chip supply substrate W3 side to the transfer carrier W2 side.
- Output the arrangement information J2 of the replenishment chip Cb, which is linked with address information etc. for each transfer carrier W2 corresponding to the batch processing area R.
More specifically, the control unit 39B is composed of a computer and its program.

FIG. 12 is a sectional view showing a main part of another example of a form embodying the present invention.
It is. FIGS. 12(a) and 12(b) illustrate chip transfer by the laser lift-off method. In FIG. 12(a), a transfer carrier W2 before chip transfer and a chip supply substrate W3 are aligned and placed facing each other, and a laser beam LB is supplied to the replenishment chip Cb to be transferred. It is shown that the light is being irradiated over the substrate W3. FIG. 12B shows a state after the replenishment chip Cb irradiated with the laser beam LB is moved (that is, transferred) from the chip supply substrate W3 side to the transfer carrier W2. Note that the replenishment chips Cb that are not irradiated with the laser beam LB remain held on the chip supply board W3 side.

In the above description, the transfer carrier preparation device 3B shows a configuration in which the replenishment chips Cb are arranged for one transfer carrier W2, but the replenishment chips Cb are arranged for a plurality of transfer carriers W2. It may also be a configuration in which it is arranged. Alternatively, the chip repair system 1 may have a configuration in which a plurality of transfer carrier preparation devices 3B are provided and the transfer carriers W2 are prepared by parallel processing.

[About repair position output]
Note that in the above description, the repair position output device 2 (specifically, an optical inspection device) has been illustrated as a configuration that outputs the arrangement information J of the repair target portion Cx of the repair target board W1. In embodying the present invention, the repair position output device 2 is not limited to an optical inspection device, and can take various modifications. For example, a configuration may include a line sensor, a displacement sensor, etc. in place of the above-mentioned imaging camera 22, or positional information may be provided by electrical testing (continuity testing, insulation testing, etc.) using electrical probe testing, etc. It may be configured to acquire and output J.

1 Chip repair system 2 Repair position output device (inspection device, etc.)
3, 3B Transfer carrier preparation device 4 Surface condition modification device 5 Chip transfer device 21 Substrate holding stand 22 Imaging camera 23 Processing section 24 Moving section 31 Carrier holding section 33, 32B Chip supply substrate holding section 33, 34 Imaging camera 35 Pick And place section 35H Holding head 36 Laser transfer section 37 Moving section 39, 39B Control section 41 Carrier holding section 42 Plasma irradiation section 51 Substrate holding stand 52 Carrier holding stand 53, 54 Imaging camera 55 Moving section (bonding head, heating/pressure mechanism)
56 Control unit W1 Repair target board W2 Transfer carrier W3 Chip supply board Ca Good chip Cx Repair target part (defective chip)
Cb Refill tip R Batch processing area M1, M2, M3 Alignment mark G Gap
B Adhesive layer Bn Adhesive layer (unmodified surface)
Bs Modified adhesive layer surface (after plasma treatment, etc.)
J Location information of repair target part J2 Location information of replenishment chip LB Laser beam

Claims (8)

A chip repair method in which a replenishment chip is mounted on a repair target board having a repair target part that requires repair processing,
a transfer carrier preparation step of preparing a transfer carrier holding the replenishment chip;
aligning and facing the repair target portion of the repair target substrate and the replenishment chip held by the transfer carrier, and transferring the replenishment chip from the transfer carrier to the repair target substrate; a chip transfer step;
An adhesive layer is formed on the surface of the transfer carrier,
After holding the replenishment chip on the adhesive layer, a surface state modification step of modifying the surface state of an exposed portion of the adhesive layer where the replenishment chip is not arranged;
In the transfer carrier preparation step,
The arrangement information of the repair target part on the repair target board is acquired, and in the chip transfer step, all the repair target parts and the replenishment chip are placed in the same position with the repair target part and the replenishment chip facing each other. A chip repair method characterized in that the replenishment chip is placed and held on the transfer carrier so as to be related to the above. 2. The chip repair method according to claim 1, wherein a plurality of batch processing areas having a plurality of said repair target parts are set on said repair target board. In the transfer carrier preparation step, the plurality of replenishment chips are arranged and held on the transfer carrier based on the arrangement information of the plurality of repair target parts in the batch processing area,
3. In the chip transfer step, a plurality of the replenishment chips are transferred from the transfer carrier to a plurality of the repair target parts in the batch processing area at once. Chip repair method. In the chip transfer step,
positional information on any of the alignment mark attached to the repair target board, the repair target part of the repair target board, and the mounted chip already mounted on the repair target board;
Using the alignment mark attached to the transfer carrier or the position information of the replenishment chip held on the transfer carrier,
The chip repair method according to any one of claims 1 to 3, characterized in that the repair target portion and the replenishment chip are aligned. In the chip transfer step,
positional information on any of the alignment mark attached to the repair target board, the repair target part of the repair target board, and the mounted chip already mounted on the repair target board;
The alignment mark attached to the transfer carrier or the position information of the replenishment chip held on the transfer carrier,
The chip repair method according to any one of claims 1 to 4, characterized in that the chips are acquired by the same recognition means. The chip according to any one of claims 1 to 5 , wherein the surface state modification step includes performing plasma treatment to form minute irregularities on the surface of the exposed portion of the adhesive layer. Repair method. A chip repair system that mounts a replenishment chip on a repair target board having a repair target part that requires repair processing,
a repair position output device that outputs placement information of the repair target part on the repair target board;
a transfer carrier preparation device that prepares a transfer carrier holding the replenishment chip;
aligning and facing the repair target portion of the repair target substrate and the replenishment chip held by the transfer carrier, and transferring the replenishment chip from the transfer carrier to the repair target substrate; Equipped with a chip transfer device,
An adhesive layer is formed on the surface of the transfer carrier,
comprising a surface condition modification device that modifies the surface condition of an exposed portion of the adhesive layer where the replenishment chips are not arranged, of the transfer carrier holding the replenishment chips on the adhesive layer;
The transfer carrier preparation device includes:
Based on the arrangement information of the repair target part outputted from the repair position output device, all the repair target parts and the replenishment chip are placed in a state where the repair target part and the replenishment chip face each other during the chip transfer. A chip repair system characterized in that the replenishment chip is arranged and held on the transfer carrier so that the replenishment chip and the chip are in the same positional relationship. The chip transfer device includes:
position information of an alignment mark attached to the repair target board, the repair target part of the repair target board, and any one of a plurality of mounted chips already mounted on the repair target board;
8. The apparatus according to claim 7 , further comprising a recognition means for acquiring an alignment mark attached to the transfer carrier or position information of the replenishment chip held on the transfer carrier. Chip repair system.

Images