JP7426874B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

The technology disclosed in this specification relates to a substrate processing apparatus and a substrate processing method. Substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for flat panel displays (FPDs) such as organic EL (electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. These include substrates, photomask substrates, ceramic substrates, solar cell substrates, and the like.

2. Description of the Related Art Conventionally, in the manufacturing process of semiconductor substrates (hereinafter simply referred to as "substrates"), various processes have been performed on the substrates using substrate processing apparatuses.

As a method for holding a substrate during substrate processing, a vacuum chuck using vacuum suction or a Bernoulli chuck using Bernoulli's theorem is used.

Japanese Patent Application Publication No. 2018-164067

In suction type chucks such as vacuum chucks using vacuum suction or Bernoulli chucks based on Bernoulli's theorem, chuck pins and the like in clamping type chucks are not used. Therefore, for example, it is not possible to employ a contact type sensor using a chuck pin, so there is a problem that the holding position of the substrate is likely to shift.

The technology disclosed in this specification was developed in view of the problems described above, and is a technology for appropriately holding a substrate in a substrate processing apparatus using a suction chuck.

A first aspect of the technology related to the substrate processing apparatus disclosed in the present specification includes a substrate holder for adsorbing and holding a substrate to be processed, and a rotation of the substrate held by the substrate holder. an imaging unit for capturing an imaging range including an outer edge of the rotating substrate at a plurality of locations and outputting a plurality of image data of the substrate; and a plurality of image data of the substrate. A detection unit for detecting a plurality of positions of the outer edge portion of the substrate and a periodic change in the position of the plurality of detected outer edge portions by performing matching processing using reference image data for each. a calculation unit for calculating the amount of deviation of the substrate based on the substrate, a convex portion is continuously formed on the upper surface of the substrate along the outer edge portion, and the detection unit is configured to By using the inner surface in the matching process between the reference image data and the plurality of image data, a plurality of positions of the outer edge portion of the substrate are detected .

A second aspect of the technology disclosed in this specification is related to the first aspect, and the imaging unit images the substrate from a direction inclined with respect to a main surface of the substrate.

A third aspect of the technology disclosed in the present specification is related to the first or second aspect, and changes the holding position of the substrate in the substrate holder based on the calculated displacement amount of the substrate. The apparatus further includes a position changing section for changing the position.

A fourth aspect of the technology disclosed in the present specification is related to any one of the first to third aspects, and is radially outward of the outer edge of the substrate held by the substrate holder. The device further includes at least one guide pin located at the guide pin.

A fifth aspect of the technology disclosed herein is related to the fourth aspect, and the plurality of guide pins are arranged intermittently along the outer edge of the substrate.

A sixth aspect of the technology disclosed in the present specification is related to any one of the first to fifth aspects, and the calculation unit is configured to calculate Moving average processing or polynomial approximation processing is performed on the graph showing the periodic changes in position.

A seventh aspect of the technology disclosed in the present specification is related to any one of the first to sixth aspects, and the diameter of the substrate holder is larger than the diameter of the substrate.

An eighth aspect of the technology related to the substrate processing method disclosed in the present specification includes a step of adsorbing and holding a substrate to be processed, a step of rotating the held substrate, and a step of rotating the substrate. A step of capturing an imaging range including the outer edge of the substrate at a plurality of locations, outputting a plurality of image data of the substrate, and performing a matching process using reference image data for each of the plurality of image data, a step of detecting a plurality of positions of the outer edge portions of the substrate; and a step of calculating a displacement amount of the substrate based on a periodic change in the detected positions of the plurality of outer edge portions , A convex portion is continuously formed on the upper surface of the substrate along the outer edge portion, and the step of detecting a plurality of positions of the outer edge portion of the substrate includes detecting the inner surface of the convex portion based on the reference image data and the plurality of convex portions. This step is a step of detecting a plurality of positions of the outer edge portion of the substrate by using the matching process with the image data of the substrate .

According to the first to eighth aspects of the technology disclosed in the present specification, in a substrate processing apparatus using a suction type chuck, by calculating the displacement amount of the substrate based on a periodic change in the position of the outer edge, It is possible to grasp the amount of deviation from the appropriate position for holding the substrate.

In addition, objects, features, aspects, and advantages related to the technology disclosed herein will become more apparent from the detailed description and accompanying drawings set forth below.

FIG. 1 is a plan view showing an example of the configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a side view showing an example of the configuration of the central portion of the substrate processing apparatus in the width direction. FIG. 2 is a side view showing an example of the configuration of the left part of the substrate processing apparatus. FIG. 3 is a diagram schematically showing an example of the configuration of a processing unit. FIG. 3 is a side view showing an example of the configuration of position adjustment pins. FIG. 3 is a side view showing an example of the configuration of position adjustment pins. FIG. 3 is a cross-sectional view of the substrate. FIG. 3 is a cross-sectional view of the substrate. FIG. 3 is a cross-sectional view of the substrate. FIG. 2 is a diagram showing an example of a connection relationship between each element of the substrate processing apparatus and a control device. FIG. 2 is a diagram conceptually showing the functional configuration of a control device. FIG. 3 is a diagram showing a substrate held on a plate of a spin chuck. 7 is a flowchart showing the position detection operation of the outer edge of the substrate. 7 is a graph showing an example of periodic changes in the position coordinates of the outer edge of the substrate. 7 is a graph showing an example of periodic changes in the position coordinates of the outer edge of the substrate. FIG. 3 is a diagram showing a substrate held on a plate of a spin chuck.

Embodiments will be described below with reference to the accompanying drawings. In the following embodiments, detailed features and the like are shown for technical explanation, but these are merely examples, and not all of them are necessarily essential features for the embodiments to be implemented.

Note that the drawings are shown schematically, and for convenience of explanation, structures are omitted or simplified as appropriate in the drawings. Further, the mutual relationship between the sizes and positions of the structures shown in different drawings is not necessarily described accurately and may be changed as appropriate. Further, even in drawings such as plan views that are not cross-sectional views, hatching may be added to facilitate understanding of the content of the embodiments.

In addition, in the following description, similar components are shown with the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

In addition, in the description below, when a component is described as "comprising," "includes," or "has," unless otherwise specified, it is an exclusive term that excludes the presence of other components. It's not an expression.

In addition, in the description below, even if ordinal numbers such as "first" or "second" are used, these terms may not be used to facilitate understanding of the content of the embodiments. They are used for convenience and are not limited to the order that can occur based on these ordinal numbers.

In addition, in the descriptions below, specific positions or directions such as "top", "bottom", "left", "right", "side", "bottom", "front" or "back" are meant. However, these terms are used for convenience to make it easier to understand the content of the embodiments, and the positions and directions when actually implemented are different from each other. It is unrelated.

<Embodiment>
A substrate processing apparatus and a substrate processing method according to this embodiment will be described below.

<About the configuration of the substrate processing equipment>
FIG. 1 is a plan view showing an example of the configuration of a substrate processing apparatus 1 according to the present embodiment. The substrate processing apparatus 1 is an apparatus that processes a substrate W (for example, a semiconductor wafer).

The substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, an organic electro-luminescence (EL) substrate, a flat panel display (FPD) substrate, an optical display substrate, a magnetic disk substrate, an optical disk substrate, a magneto-optical disk. substrate, photomask substrate, or solar cell substrate.

The substrate processing apparatus 1 includes an indexer section 2. The indexer section 2 includes a plurality of (for example, four) carrier mounting sections 3 and a transport mechanism 4.

Each carrier placement unit 3 places one carrier C thereon. The carrier C accommodates a plurality of substrates W. Carrier C is, for example, a front opening unified pod (FOUP). The transport mechanism 4 can access the carriers C placed on all the carrier placement sections 3.

Further, the substrate processing apparatus 1 includes a processing block 5 . Processing block 5 is connected to indexer section 2 .

The processing block 5 includes a placing section 6, a plurality of processing units 7, and a transport mechanism 8. The mounting section 6 places a plurality of substrates W thereon. Each processing unit 7 processes one substrate W. The transport mechanism 8 can access the placing section 6 and all the processing units 7. The transport mechanism 8 transports the substrate W to the mounting section 6 and the processing unit 7.

The mounting section 6 is arranged between the transport mechanism 4 and the transport mechanism 8. The transport mechanism 4 can also access the mounting section 6. The transport mechanism 4 transports the substrate W to the mounting section 6. The mounting section 6 places the substrate W that is transported between the transport mechanism 4 and the transport mechanism 8 .

The substrate processing apparatus 1 also includes a control device 9 . The control device 9 controls the transport mechanism 4, the transport mechanism 8, and the processing unit 7.

<About the indexer section>
Next, the indexer section 2 will be explained with reference to FIG. The indexer unit 2 includes a conveyance space 32 . The conveyance space 32 is arranged behind the carrier mounting section 3 . The conveyance space 32 extends in the width direction Y. The transport mechanism 4 is installed in the transport space 32. The transport mechanism 4 is arranged behind the carrier mounting section 3.

The transport mechanism 4 includes a hand 33 and a hand drive section 34. The hand 33 supports one substrate W in a horizontal position. The hand 33 supports the substrate W by contacting the lower surface of the substrate W. The hand drive section 34 is connected to the hand 33. The hand drive section 34 moves the hand 33.

FIG. 2 is a side view showing an example of the configuration of the central portion of the substrate processing apparatus 1 in the width direction Y. As shown in FIG. The hand driving section 34 includes a rail 34a, a horizontal moving section 34b, a vertical moving section 34c, a rotating section 34d, and a forward/backward moving section 34e.

The rail 34a is fixedly installed. The rail 34a is arranged at the bottom of the transport space 32. The rail 34a extends in the width direction Y. The horizontal moving part 34b is supported by the rail 34a. The horizontal moving part 34b moves in the width direction Y with respect to the rail 34a.

The vertical moving section 34c is supported by the horizontal moving section 34b. The vertical moving section 34c moves in the vertical direction Z with respect to the horizontal moving section 34b. The rotating part 34d is supported by the vertical moving part 34c. The rotating part 34d rotates with respect to the vertical moving part 34c. The rotating portion 34d rotates around the rotation axis A1. The rotation axis A1 is parallel to the vertical direction Z. The advancing/retreating portion 34e reciprocates in one horizontal direction determined by the orientation of the rotating portion 34d.

The hand 33 is fixed to the forward/backward moving section 34e. The hand 33 is movable in parallel in the horizontal direction and in the vertical direction Z. The hand 33 is rotatable around the rotation axis A1.

<About processing blocks>
Next, the arrangement of each element of the processing block 5 will be explained with reference to FIG. The processing block 5 includes a transport space 41 . The conveyance space 41 is arranged at the center of the processing block 5 in the width direction Y. The conveyance space 41 extends in the front-rear direction X. The conveyance space 41 is in contact with the conveyance space 32 of the indexer section 2.

The mounting section 6 and the transport mechanism 8 are installed in the transport space 41. The mounting section 6 is arranged in front of the transport mechanism 8. The mounting section 6 is arranged at the rear of the transport mechanism 4. The mounting section 6 is arranged between the transport mechanism 4 and the transport mechanism 8.

The processing units 7 are arranged on both sides of the transport space 41. The processing unit 7 is arranged so as to surround the side of the transport mechanism 8 . Specifically, the processing block 5 includes a processing section 42 and a processing section 43. The processing section 42, the conveyance space 41, and the processing section 43 are arranged in this order in the width direction Y. The processing section 42 is arranged to the right of the transport space 41. The processing section 43 is arranged to the left of the transport space 41.

FIG. 3 is a side view showing an example of the configuration of the left part of the substrate processing apparatus 1. As shown in FIG. In the processing section 43, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the processing section 43, six processing units 7 are arranged in two rows in the front-rear direction X and in three stages in the up-down direction Z.

Although not shown, in the processing section 42, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the processing section 42, six processing units 7 are arranged in two rows in the front-rear direction X and in three stages in the up-down direction Z.

<About the transport mechanism>
Next, the structure of the transport mechanism 8 will be described with reference to FIGS. 1 and 2. The transport mechanism 8 includes a hand 61 and a hand drive section 62. The hand 61 supports one substrate W in a horizontal position. The hand drive section 62 is connected to the hand 61. The hand driving section 62 moves the hand 61.

The hand drive section 62 includes a support column 62a, a vertical movement section 62b, a rotation section 62c, and a forward/backward movement section 62d. The support column 62a is fixedly installed. The support column 62a extends in the vertical direction Z.

The vertical moving part 62b is supported by the support column 62a. The vertical moving part 62b moves in the vertical direction Z with respect to the support column 62a. The rotating part 62c is supported by the vertical moving part 62b. The rotating part 62c rotates with respect to the vertical moving part 62b. The rotating part 62c rotates around the rotation axis A2. The rotation axis A2 is parallel to the vertical direction Z. The advancing/retreating portion 62d reciprocates in one horizontal direction determined by the orientation of the rotating portion 62c.

Next, the basic structure of the processing unit 7 will be explained with reference to FIG. 3. Each processing unit 7 includes a spin chuck 10 and a processing cup 12. The spin chuck 10 holds one substrate W. The spin chuck 10 holds the substrate W in a horizontal position. The processing cup 12 is arranged so as to surround the spin chuck 10 on the side. The processing cup 12 receives the processing liquid.

The processing unit 7 is classified into a processing unit 7A and a processing unit 7B depending on the structure of the spin chuck 10. The spin chuck 10 of the processing unit 7A is called a Bernoulli chuck or a Bernoulli gripper. The Bernoulli chuck is suitable for holding a relatively thin substrate W. The spin chuck 10 of the processing unit 7B is called a mechanical chuck or a mechanical gripper. A mechanical chuck is suitable for holding a relatively thick substrate W.

For example, each of the six processing units 7 arranged in the processing section 42 is a processing unit 7A. For example, each of the six processing units 7 arranged in the processing section 43 is a processing unit 7B.

FIG. 4 is a diagram schematically showing an example of the configuration of the processing unit 7A. In FIG. 4, illustration of the processing cup 12 is omitted.

The spin chuck 10 includes a plate 101. Plate 101 has a substantially disk shape. Plate 101 has a top surface 102. Upper surface 102 is approximately horizontal. Upper surface 102 is generally flat. The diameter of the plate 101 is larger than the diameter of the substrate W in plan view.

The spin chuck 10 includes a rotation drive section 92. The rotation drive unit 92 is connected to the lower part of the plate 101. The rotation drive section 92 rotates the plate 101. The plate 101 is rotated about the rotation axis A3 by the rotation drive unit 92. The rotation axis A3 is parallel to the vertical direction Z. The rotation axis A3 passes through the center of the plate 101.

The fixing pin 103 projects upward from the top surface 102 of the plate 101. The fixing pin 103 contacts the lower surface 16 of the substrate W. More specifically, the fixing pin 103 contacts the lower surface 16 at the peripheral edge of the substrate W. Thereby, the fixing pins 103 support the substrate W at a position higher than the upper surface 102 of the plate 101.

The fixing pin 103 does not contact the upper surface 17 of the substrate W. The fixing pins 103 allow the substrate W to move upward relative to the fixing pins 103. The fixing pin 103 does not contact the outer edge 20 of the substrate W. The fixing pins 103 themselves allow the substrate W to slide relative to the fixing pins 103. In this way, the fixing pins 103 themselves do not hold the substrate W.

The spin chuck 10 includes a gas outlet 104. Gas outlet 104 is formed on top surface 102 of plate 101 . The gas outlet 104 is arranged at a position overlapping the substrate W supported by the fixing pin 103 in plan view. The gas outlet 104 blows gas upward. The gas outlet 104 blows gas between the upper surface 102 of the plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas flows along the lower surface 16 of the substrate W supported by the fixing pins 103.

As a result, the gas outlet 104 sucks the substrate W. Specifically, negative pressure is created by the gas flowing along the lower surface 16 of the substrate W. That is, the atmospheric pressure that the lower surface 16 of the substrate W receives is smaller than the atmospheric pressure that the upper surface 17 of the substrate W receives. Therefore, a downward force acts on the substrate W according to Bernoulli's principle. That is, the substrate W is sucked downward. The substrate W is sucked toward the gas outlet 104 and the plate 101. However, the gas outlet 104 does not contact the substrate W. Plate 101 also does not come into contact with substrate W.

The substrate W is supported and kept in a predetermined position by the gas outlet 104 sucking the substrate W downward and by the fixing pins 103 coming into contact with the lower surface 16 of the substrate W. Due to the suction force acting on the substrate W, the substrate W does not slide horizontally with respect to the fixing pins 103. That is, the spin chuck 10 attracts and holds the substrate W on the plate 101.

The gas outlet 104 includes one outlet 105 and multiple outlets 106. The air outlet 105 is arranged at the center of the upper surface 102 of the plate 101. The air outlet 105 is arranged on the rotation axis A3 of the plate 101.

The air outlet 106 is arranged radially outward of the rotation axis A3 of the plate 101 than the air outlet 105 is. The air outlet 106 is arranged radially inward of the rotation axis A3 of the plate 101 with respect to the fixed pin 103. For example, the air outlets 106 are arranged on a circumference around the rotation axis A3 in a plan view.

The processing unit 7A includes a gas supply path 107 and a gas supply path 108. The gas supply path 107 supplies gas to the outlet 105 . The gas supply path 108 supplies gas to the outlet 106 . A portion of the gas supply path 107 and a portion of the gas supply path 108 are formed inside the plate 101.

A first end of gas supply path 107 is connected to gas supply source 109 . A second end of the gas supply path 107 is connected to the air outlet 105.

A first end of the gas supply path 108 is connected to a gas supply source 109. A second end of the gas supply path 108 is connected to the air outlet 106.

The gas supplied to the outlet 105 and the outlet 106 is, for example, nitrogen gas or air. The gas supplied to the outlet 105 and the outlet 106 is, for example, high pressure gas or compressed gas.

The processing unit 7A includes an adjustment section 111 and an adjustment section 112. The adjustment section 111 is provided in the gas supply path 107. The adjustment section 112 is provided in the gas supply path 108.

The adjustment unit 111 adjusts the flow rate of gas blown out from the outlet 105. That is, the adjustment unit 111 adjusts the flow rate of gas supplied to the blower outlet 105. The adjustment unit 112 adjusts the flow rate of gas blown out from the outlet 106. That is, the adjustment unit 112 adjusts the flow rate of gas supplied to the blower outlet 106.

As the flow rate of gas blown out from the blow-off port 105 increases, the suction force acting on the substrate W increases. Moreover, as the flow rate of gas blown out from the blow-off port 106 increases, the suction force acting on the substrate W increases.

Adjustment section 111 and adjustment section 112 can operate independently of each other. Therefore, the flow rate of the gas blown out by the outlet 105 and the flow rate of the gas blown out by the outlet 106 can be adjusted independently from each other. Adjustment unit 111 and adjustment unit 112 each include, for example, a flow rate adjustment valve. Each of the adjustment section 111 and the adjustment section 112 may further include an on-off valve.

By adjusting the flow rate of the gas by the adjustment unit 111 and the adjustment unit 112, the gas is blown out from the air outlet 105 and the air outlet 106 so as to absorb the deflection of the substrate W, for example, even when a thin substrate W is adsorbed. Gas flow rate can be controlled.

The processing unit 7A includes a plurality of position adjustment pins and a plurality of guide pins (both not shown here). The position adjustment pin can contact the outer edge portion 20 of the substrate W supported by the fixing pin 103, and can adjust the position of the substrate W in the horizontal direction. The position adjustment pins are arranged intermittently along the outer edge 20 of the substrate W, for example, at every 30° rotation in the circumferential direction of the substrate W. The guide pin is a pin for preventing the substrate W, which is attracted by the Bernoulli chuck, from coming off the spin chuck 10 due to a malfunction in the holding state. , are arranged at positions that do not contact the substrate W. The guide pins are arranged intermittently along the outer edge 20 of the substrate W, for example, at every 30° rotation in the circumferential direction of the substrate W.

The processing unit 7A includes a processing liquid supply section 121. The processing liquid supply unit 121 supplies the processing liquid to the substrate W.

The processing liquid supply section 121 includes a nozzle 122. The nozzle 122 discharges the processing liquid onto the substrate W. The nozzle 122 is provided movably between a processing position and a retreat position. In FIG. 4, the nozzle 122 located in the processing position is shown in dotted lines. Further, in FIG. 4, the nozzle 122 located at the retracted position is shown by a solid line.

The processing position is a position above the substrate W held on the plate 101 of the spin chuck 10. When the nozzle 122 is in the processing position, the nozzle 122 overlaps the substrate W held on the plate 101 of the spin chuck 10 in plan view. On the other hand, when the nozzle 122 is in the retracted position, the nozzle 122 does not overlap the substrate W held on the plate 101 of the spin chuck 10 in plan view.

The processing liquid supply section 121 includes piping 123. Piping 123 supplies processing liquid to nozzle 122 . Piping 123 has a first end and a second end. A first end of piping 123 is connected to processing liquid supply source 124 . A second end of piping 123 is connected to nozzle 122 .

The processing unit 7A includes an adjustment section 125. Adjustment section 125 is provided in piping 123. The adjustment unit 125 adjusts the flow rate of the processing liquid that the processing liquid supply unit 121 supplies to the substrate W. That is, the adjustment unit 125 adjusts the flow rate of the processing liquid discharged by the nozzle 122.

The processing unit 7A includes an imaging section 127 such as a CCD camera. The imaging unit 127 images the substrate W supported by the fixing pins 103. The imaging unit 127 images an imaging range including, for example, the outer edge portion 20 of the substrate W supported by the fixing pin 103 and the peripheral portion of the spin chuck 10. The imaging unit 127 is disposed above the spin chuck 10, for example, and has an optical axis that is inclined with respect to the main surface of the substrate W. The image data of the substrate W captured by the imaging unit 127 is output to the control device 9 through wired or wireless communication means.

5 and 6 are side views showing an example of the configuration of the position adjustment pin 113. FIG. 5 shows the position adjustment pin 113 in the retracted position. FIG. 6 shows the alignment pin 113 in the alignment position.

The position adjustment pin 113 is fixed to the shaft portion 114. The shaft portion 114 extends downward from the position adjustment pin 113. The shaft portion 114 is supported by the plate 101. The position adjustment pin 113 is supported by the plate 101 via the shaft portion 114.

The shaft portion 114 is rotatable about the rotation axis A4 with respect to the plate 101. The rotation axis A4 is parallel to the vertical direction Z. The rotation axis A4 passes through the center of the shaft portion 114. The position adjustment pin 113 is arranged at a position eccentric from the rotation axis A4 of the shaft portion 114. The shaft portion 114 rotates under the control of the control device 9, for example.

As the shaft portion 114 rotates with respect to the plate 101, the position adjustment pin 113 moves in the horizontal direction with respect to the plate 101. Specifically, the position adjustment pin 113 pivots around the rotation axis A4. Thereby, the position adjustment pin 113 approaches the rotation axis A3 of the plate 101 and moves away from the rotation axis A3 of the plate 101.

As the position adjustment pin 113 approaches the rotation axis A3 of the plate 101, the position adjustment pin 113 moves to the adjustment position. That is, the position adjustment pin 113 contacts the outer edge portion 20 of the substrate W supported by the fixed pin 103. Further, the position adjustment pin 113 pushes the outer edge portion 20 of the substrate W that is in contact with the position adjustment pin 113 toward the rotation axis A4. The substrate W is adjusted to a predetermined position by pushing the outer edge 20 of the substrate W by a plurality of position adjustment pins 113 provided at different positions. On the other hand, as the position adjustment pin 113 moves away from the rotation axis A3 of the plate 101, the position adjustment pin 113 moves to the retracted position. The position adjustment pin 113 is separated from the outer edge 20 of the substrate W supported by the fixed pin 103.

FIG. 7 is a cross-sectional view of the substrate W1. FIG. 8 is a cross-sectional view of the substrate W2. FIG. 9 is a cross-sectional view of the substrate W3. Note that in this embodiment, when simply referring to a substrate or a substrate W, the substrate W1, the substrate W2, and the substrate W3 are indicated without distinction.

The substrate body 11A of the substrate W1 shown in FIG. 7 includes a main portion 13A and a peripheral portion 212. The main portion 13A is formed with a concave portion 14 that is more recessed than the peripheral portion 212. The recessed portion 14 is formed by, for example, a grinding process.

The substrate body 11B of the substrate W2 shown in FIG. 8 includes a main portion 13B and a peripheral portion 212. The recess 14 is not formed in the main portion 13B.

The substrate body 11C of the substrate W3 shown in FIG. 9 includes a main portion 13C and a peripheral portion 212. The main portion 13C is formed with a concave portion 14 that is more recessed than the peripheral portion 212. A glass protection plate 15 is provided on the surface of the substrate body 11C opposite to the surface on which the recess 14 is formed.

The substrate W1 may be composed only of the substrate body 11A. Alternatively, the substrate W1 may include at least one of a resin film, a resin tape, a resin sheet, and a resin film in addition to the substrate main body 11A.

The substrate W2 may be composed only of the substrate body 11B. Alternatively, the substrate W2 may include at least one of a resin film, a resin tape, a resin sheet, a resin film, and the protective plate 15 in addition to the substrate main body 11B.

The substrate W3 includes a substrate main body 11C and a protection plate 15. The protection plate 15 is attached to the substrate main body 11C, for example. The substrate W3 may further include at least one of a resin film, a resin tape, a resin sheet, and a resin film.

The main portion 13A of the substrate W1 is thinner than the main portion 13B of the substrate W2. The thickness of the main portion 13A of the substrate W1 is thinner than the combined thickness of the main portion 13C of the substrate W3 and the protective plate 15. The substrate W1 has lower rigidity than the substrates W2 and W3. The substrate W1 is more flexible than the substrates W2 and W3.

Specifically, the main portion 13A of the substrate W1 has a thickness T1. The main portion 13B of the substrate W2 has a thickness T2. The combined thickness of the main portion 13C of the substrate W3 and the protective plate 15 has a thickness T3.

Thickness T1 is smaller than thickness T2. Thickness T1 is smaller than thickness T3. The thickness T1 is, for example, greater than or equal to 10 [μm] and less than or equal to 200 [μm]. The thickness T2 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T3 is, for example, 800 [μm] or more and 1200 [μm] or less.

The peripheral edge portion 212 of the substrate W1 has a thickness T4. The peripheral edge portion 212 of the substrate W2 has a thickness T5. The peripheral portion 212 of the substrate W3 has a thickness T6.

The thickness T4 is, for example, the same as the thickness T5. Thickness T4 is smaller than thickness T6. The thickness T4 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T5 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T6 is, for example, 1400 [μm] or more and 2200 [μm] or less.

<About the control device>
FIG. 10 is a diagram showing an example of the connection relationship between each element of the substrate processing apparatus 1 and the control device 9. As shown in FIG.

The hardware configuration of the control device 9 is similar to that of a general computer. That is, the control device 9 includes a central processing unit (CPU) 71 that performs various calculation processes, and a read-only memory (ROM) that is a read-only memory that stores basic programs. ) 72, a random access memory (RAM) 73 which is a readable and writable memory that stores various information, and a non-transitory storage section 74 that stores a control application (program) or data. Equipped with.

The CPU 71, ROM 72, RAM 73, and storage section 74 are connected to each other by bus wiring 75 and the like.

The control application or data may be provided to the control device 9 in a state recorded on a non-transitory recording medium (eg, semiconductor memory, optical media, magnetic media, etc.). In this case, a reading device for reading the control application or data from the recording medium is preferably connected to the bus wiring 75.

Further, the control application or data may be provided to the control device 9 from a server or the like via a network. In this case, it is preferable that a communication unit that performs network communication with an external device is connected to the bus wiring 75.

An input section 76 and a display section 77 are connected to the bus wiring 75. The input unit 76 includes various input devices such as a keyboard and a mouse. The operator inputs various information to the control device 9 via the input section 76. The display section 77 is composed of a display device such as a liquid crystal monitor, and displays various information.

The control device 9 is an actuating section of each processing unit (for example, the adjusting section 125, the adjusting section 111, the adjusting section 112, the rotation drive section 92, the imaging section 127, etc.) or the actuating section of the transport mechanism 4 or the transport mechanism 8. etc. and control their operations.

FIG. 11 is a diagram conceptually showing the functional configuration of the control device 9. As shown in FIG. As an example is shown in FIG. 11, the control device 9 includes an operation control section 901 that controls the operation of each component in the substrate processing apparatus 1 via the respective operation sections, and a substrate W imaged by the imaging section 127. A detection unit 902 that detects the presence or absence of the substrate W based on image data of the substrate W, and further a detection unit 902 that detects the position of the substrate W, and a calculation that calculates the amount of deviation of the substrate W based on the position of the substrate W detected by the detection unit 902. 903. Here, the amount of displacement of the substrate W refers to the amount of movement of the substrate W that occurs during one rotation of the substrate W in a direction along the main surface of the substrate W or in a direction intersecting the main surface of the substrate W. When the position of the substrate W changes periodically as the substrate W rotates, it refers to the maximum value (amplitude) of the amount of movement in one period.

<About detecting the position of the outer edge and calculating the amount of deviation>
Next, position detection of the outer edge portion 20 of the substrate W by the substrate processing apparatus according to this embodiment will be described with reference to FIG. 12. FIG. 12 is a diagram showing the substrate W2 held on the plate 101 of the spin chuck 10. In this state, a matching window 201 used for position detection is set on the outer edge 20 of the substrate W2.

In the matching window 201, a region of interest (ROI) 201A is further set for matching processing (template matching) using reference image data.

Here, in FIG. 12, a part of the position adjustment pin 113 is included in the ROI 201A, but it is desirable that no structure other than the outer edge portion 20 of the substrate W2 is included in the ROI 201A. However, other structures near the outer edge 20 of the substrate W2 (for example, the guide pin 213 disposed on the radially outer side of the substrate W held on the plate 101 of the spin chuck 10, similar to the position adjustment pin 113) ), the position of the outer edge 20 of the substrate W2 can be detected with high accuracy as described later.

Next, a nozzle position detection operation by the substrate processing apparatus according to the present embodiment will be described with reference to FIG. 13. FIG. 13 is a flowchart showing the position detection operation of the outer edge portion 20 of the substrate W (including the substrate W1, the substrate W2, and the substrate W3).

First, the imaging unit 127 captures a plurality of images including the outer edge portion 20 of the rotating substrate W (step ST101). The imaging unit 127 then outputs the obtained plurality of image data to the control device 9. Note that the imaging unit 127 may capture a moving image of the rotating substrate W. At this time, it is desirable that the substrate W be rotated at a low speed, such as 30 rpm. On the other hand, the detection unit 902 registers reference image data (template) for template matching in the storage unit 74 of the control device 9 or the like (step ST102). Here, the reference image data is, for example, image data of the outer edge portion 20 of the substrate W held on the plate 101 of the spin chuck 10.

Next, the detection unit 902 in the control device 9 detects the matching window 201 for one of the plurality of image data (or image data corresponding to each frame of the recorded video) output from the imaging unit 127. and set the ROI 201A in the matching window 201. Then, the detection unit 902 performs template matching between the image data overlapping the ROI 201A and the reference image data (step ST103). Here, the ROI 201A is set, for example, along the outer edge 20 of the substrate W at the matching window 201. During template matching, the matching window 201 is searched while moving the ROI 201A to find a location where the image data overlapping the ROI 201A and the reference image data have a high degree of similarity.

Then, the detection unit 902 determines whether template matching is successful. If the template matching is successful, the positional coordinates (for example, XYZ axis coordinates) of the outer edge 20 of the substrate W are registered based on the matched image data.

Matching processing is similarly performed on other image data. Then, the detection unit 902 outputs data regarding a plurality of position coordinates of the outer edge portion 20 of the substrate W to the calculation unit 903.

Next, the calculation unit 903 calculates the amount of deviation of the substrate W based on the data regarding the plurality of position coordinates output from the detection unit 902 (step ST104).

Specifically, the calculation unit 903 arranges a plurality of position coordinates of the outer edge portion 20 of the substrate W in time series, and examines changes over time. Note that the data regarding each position coordinate includes data on the position coordinate and data on the time at which the position coordinate was acquired.

Then, the calculation unit 903 calculates the maximum value of the movement amount (amplitude A) in one cycle as the deviation amount of the substrate W based on the periodic change in the position coordinates of the outer edge portion 20 corresponding to the rotation period of the substrate W. do. Changes in the positional coordinates of the outer edge portion 20 can be investigated, for example, by using any one of the plurality of positional coordinates as a reference and plotting the difference between that positional coordinate and other positional coordinates. Note that the amplitude A corresponds to the amount of movement in a direction along the main surface of the substrate W, a direction intersecting the main surface of the substrate W, or a direction including both.

FIG. 14 is a graph showing an example of periodic changes in the positional coordinates of the outer edge portion 20 of the substrate W2. In FIG. 14, the vertical axis indicates position coordinates, and the horizontal axis indicates time. Note that the vertical axis in FIG. 14 indicates relative position coordinates, and corresponds to, for example, a difference from one position coordinate among a plurality of acquired position coordinates.

The solid line shown in FIG. 14 is the position coordinate detected by the matching process, and as shown in FIG. 14, the position coordinate changes periodically. However, in the case of FIG. 14, as shown in FIG. 12, because the position adjustment pin 113 located near the outer edge 20 of the substrate W2 is included in the ROI 201A, the position coordinates detected by the matching process are There is some blurring.

In such a case, the calculation unit 903 smoothes the graph by, for example, performing a moving average process to calculate the average value for each interval (for example, 5 frames) in a time series while shifting the interval. Find the amplitude A. The dotted line in FIG. 14 represents the change in position coordinates after smoothing by the moving average process. By doing so, the amplitude A, that is, the amount of deviation of the substrate W can be calculated with high accuracy.

FIG. 15 is a graph showing an example of periodic changes in the positional coordinates of the outer edge portion 20 of the substrate W2. In FIG. 15, the vertical axis indicates position coordinates, and the horizontal axis indicates time. Note that, as in the case of FIG. 14, the vertical axis in FIG. 15 indicates relative position coordinates, and corresponds to, for example, the difference with one position coordinate among the plurality of acquired position coordinates.

The solid line shown in FIG. 15 is the position coordinate detected by the matching process, and as shown in FIG. 15, the position coordinate changes periodically. However, in FIG. 15, as in the case of FIG. 14, since the position adjustment pin 113 located near the outer edge 20 of the substrate W2 is included in the ROI 201A, the position coordinates detected by the matching process are shaken. There is.

In such a case, the calculation unit 903 smoothes the graph by performing polynomial approximation processing that calculates an approximate curve using the least squares method, the Savitzky-Golay (SG) method, etc., and then calculates the amplitude A. demand. The dotted line in FIG. 15 represents the change in position coordinates after smoothing by the SG method. By doing so, the amplitude A, that is, the amount of deviation of the substrate W can be calculated with high accuracy.

<About a modification of outer edge position detection>
FIG. 16 is a diagram showing the substrate W1 held on the plate 101 of the spin chuck 10. Similar to the case shown in FIG. 12, a matching window 201 used for position detection is set on the outer edge portion 20A of the substrate W1. Further, in the matching window 201, an ROI 201A for matching processing is set.

In this case, since the peripheral edge 212 of the substrate W1 included in the ROI 201A is formed to protrude beyond the recess 14, the inner surface of the peripheral edge 212, which is a convex portion, also detects the position coordinates of the outer edge 20A of the substrate W1. It can be taken into consideration as a shape feature for By doing so, it is possible to improve the matching accuracy of the outer edge portion 20A of the substrate W1.

<About changing the holding position of the board>
Further, the operation control unit 901 can change the holding position of the substrate W on the plate 101 of the spin chuck 10 based on the displacement amount of the substrate W calculated by the calculation unit 903.

Specifically, the operation control section 901 changes the position of the position adjustment pin 113 by rotating the shaft section 114 so as to change the holding position of the substrate W according to the amplitude A at the timing when the amplitude A becomes maximum. Adjust. Then, the position of the substrate W is adjusted so that the amount of deviation of the substrate W is offset.

Note that a threshold value for the amount of deviation may be set in advance, and the operation control unit 901 may change the holding position of the substrate W when the amount of deviation exceeds the threshold value. In addition, the number of excess values may be set, and the first threshold for changing the retention position of the board W using the position adjustment pin 113, and the substrate W is too large, so the substrate treatment is too large. A second threshold (>first threshold) may be set for stopping the process.

<About the effects produced by the embodiments described above>
Next, examples of effects produced by the embodiment described above will be shown. In addition, in the following description, the effects will be described based on the specific configurations shown in the embodiments described above, but examples will not be included in the present specification to the extent that similar effects are produced. may be replaced with other specific configurations shown.

According to the embodiment described above, the substrate processing apparatus includes a substrate holding section, a rotation section, an imaging section 127, a detection section 902, and a calculation section 903. Here, the substrate holder corresponds to, for example, the plate 101. Further, the rotating section corresponds to, for example, the rotation driving section 92 and the like. The plate 101 attracts and holds the substrate W to be processed. The rotation drive unit 92 rotates the substrate W held on the plate 101. The imaging unit 127 images an imaging range including the outer edge 20 or the outer edge 20A of the rotating substrate W at a plurality of locations. Further, the imaging unit 127 outputs a plurality of image data of the substrate W. The detection unit 902 detects a plurality of positions of the outer edge portion 20 (or outer edge portion 20A) of the substrate W by performing matching processing on each of the plurality of image data using the reference image data. The calculation unit 903 calculates the amount of shift of the substrate W based on periodic changes in the detected positions of the plurality of outer edges 20 (or outer edges 20A).

According to such a configuration, in a substrate processing apparatus using a suction chuck, the position of the outer edge 20 (or outer edge 20A) of the substrate W is detected using a plurality of image data, and the position of the outer edge 20 (or By calculating the amount of deviation of the substrate W based on periodic changes in the position of the outer edge portion 20A), it is possible to grasp the amount of deviation from the appropriate position for holding the substrate W. That is, it is possible to ascertain the shift in the holding position of the substrate W and change the holding position of the substrate W as necessary without employing a contact type sensor using a chuck pin or the like. In addition, since the amount of deviation of the substrate W is calculated based on periodic changes in the position of the outer edge portion 20 detected in a plurality of image data, any one of the detected position coordinates of the outer edge portion 20 is used as a reference, and other Even when the difference with the position coordinates is calculated, the amount of displacement of the substrate W can be obtained in the same way.

In addition, in the case where other configurations illustrated in the present specification are appropriately added to the above configuration, that is, when other configurations in the present specification that are not mentioned as the above configurations are appropriately added. Even if there is, the same effect can be produced.

Further, according to the embodiment described above, the imaging unit 127 images the substrate W from a direction inclined with respect to the main surface of the substrate W. According to such a configuration, it is possible to detect the position coordinates of the outer edge portion 20 including both the amount of movement in the direction along the main surface of the substrate W and the amount of movement in the direction intersecting the main surface of the substrate. , it is possible to take measures such as changing the holding position of the substrate W in consideration of the amount of deviation of the substrate W in both directions.

Further, according to the embodiment described above, the substrate processing apparatus includes a position changing unit that changes the holding position of the substrate W on the plate 101 based on the calculated displacement amount of the substrate W. Here, the position change unit corresponds to, for example, the operation control unit 901. According to such a configuration, the position of the position adjustment pin 113 is adjusted by the operation control unit 901 so that the amount of displacement of the substrate W is offset, so that the substrate W can be held at an appropriate position.

Further, according to the embodiment described above, a convex portion is formed on the substrate W1 along the outer edge portion 20A. Here, the convex portion corresponds to, for example, the peripheral edge portion 212 having a convex shape relative to the concave portion 14 of the substrate W1. The detection unit 902 detects a plurality of positions of the outer edge portion 20A of the substrate W1 by using the side surface of the peripheral edge portion 212 of the substrate W1 for matching processing between the reference image data and a plurality of image data. According to such a configuration, in the matching process with the reference image data, a geometric feature for the matching process is added to the image, so it is possible to improve the matching accuracy of the outer edge portion 20A of the substrate W1. . Therefore, for example, even if the matching accuracy of the outer edge 20 is reduced due to the guide pin 213 being disposed radially outward of the outer edge 20, the position of the outer edge 20A of the substrate W1 can be appropriately detected. can do.

Further, according to the embodiment described above, the substrate processing apparatus includes at least one substrate disposed on the radially outer side of the outer edge portion 20 (or outer edge portion 20A) of the substrate W held on the plate 101. A guide pin 213 is provided. According to such a configuration, it is possible to prevent the substrate W, which is attracted by the Bernoulli chuck, from coming off the spin chuck 10 due to a malfunction in the holding state.

Further, according to the embodiment described above, the plurality of guide pins 213 are intermittently arranged along the outer edge 20 (or outer edge 20A) of the substrate W. According to such a configuration, by arranging a plurality of guide pins 213 in the circumferential direction, it is possible to more reliably prevent the substrate W being attracted by the Bernoulli chuck from coming off from the spin chuck 10 due to a malfunction in the holding state. Can be suppressed.

Further, according to the embodiment described above, the calculation unit 903 calculates the movement of the graph showing periodic changes in the positions of the outer edge portions 20 (or outer edge portions 20A) of the plurality of detected substrates W. Performs average processing or polynomial approximation processing. According to such a configuration, the amplitude A, that is, the amount of deviation of the substrate W can be calculated with high accuracy by using the change in the position coordinates smoothed by these approximation processes.

Further, according to the embodiment described above, the diameter of the plate 101 is larger than the diameter of the substrate W. According to such a configuration, since the entire surface of the substrate W is included in the range overlapping with the plate 101 in plan view, the substrate W can be sufficiently attracted. On the other hand, it is difficult to detect the position of the outer edge 20 of the substrate W using a line sensor or the like because the plate 101 is always arranged in an overlapping position on the outer edge 20 of the substrate W. The position of the outer edge portion 20 can be detected by capturing an image of the outer edge portion 20 and performing matching processing using the image.

According to the embodiments described above, the substrate processing method includes the steps of adsorbing and holding the substrate W to be processed, rotating the held substrate W, and rotating the substrate W. A process of capturing an imaging range including the outer edge part 20 (or outer edge part 20A) at a plurality of locations and outputting a plurality of image data of the substrate W, and a matching process using reference image data for each of the plurality of image data. Based on the step of detecting a plurality of positions of the outer edge portion 20 (or outer edge portion 20A) of the substrate W and the periodic change in the position of the plurality of detected outer edge portions 20 (or outer edge portion 20A), The method also includes a step of calculating a displacement amount of the substrate W.

According to such a configuration, in a substrate processing apparatus using a suction type chuck, the position of the outer edge 20 (or outer edge 20A) of the substrate W is detected using a plurality of image data, and the position of the outer edge 20 (or By calculating the amount of deviation of the substrate W based on periodic changes in the position of the outer edge portion 20A), it is possible to grasp the amount of deviation from the appropriate position for holding the substrate W.

Note that if there are no particular restrictions, the order in which each process is performed can be changed.

In addition, if other configurations exemplified in the specification of the present application are appropriately added to the above configuration, that is, if other configurations in the specification of the present application that are not mentioned as the above configurations are appropriately added. Even if there is, the same effect can be produced.

<About modifications of the embodiment described above>
In the embodiment described above, it has been shown that the detection unit 902 detects the position of the substrate W by matching processing, but the detection unit 902 detects the position of the substrate W by, for example, referring to the brightness in image data. The presence or absence of itself may also be detected.

In the embodiment described above, the spin chuck 10 is a Bernoulli chuck, but it may also be a vacuum chuck using another suction method, for example, a vacuum suction method.

In the embodiments described above, the materials, materials, dimensions, shapes, relative arrangement relationships, implementation conditions, etc. of each component may be described, but these are just one example in all aspects. However, it is not limited to what is described in the specification of this application.

Accordingly, countless variations and equivalents, not illustrated, are envisioned within the scope of the technology disclosed herein. For example, this includes cases in which at least one component is modified, added, or omitted.

In addition, in the embodiments described above, if a material name is stated without being specified, unless there is a contradiction, the material may contain other additives, such as alloys, etc. shall be included.

1 Substrate processing apparatus 2 Indexer section 3 Carrier mounting section 4, 8 Transport mechanism 5 Processing block 6 Mounting section 7, 7A, 7B Processing unit 9 Control device 10 Spin chuck 11A, 11B, 11C Substrate body 12 Processing cup 13A, 13B , 13C Main part 14 Recessed part 15 Protective plate 16 Lower surface 17, 102 Upper surface 20, 20A Outer edge 32, 41 Transfer space 33, 61 Hand 34, 62 Hand drive part 34a Rail 34b Horizontal movement part 34c, 62b Vertical movement part 34d, 62c Rotating part 34e, 62d Advance/retreat moving part 42, 43 Processing section 62a Support column 71 CPU
72 ROM
73 RAM
74 Storage section 75 Bus wiring 76 Input section 77 Display section 92 Rotation drive section 101 Plate 103 Fixing pin 104 Gas outlet 105, 106 Air outlet 107, 108 Gas supply path 109 Gas supply source 111, 112, 125 Adjustment section 113 Position adjustment Pin 114 Shaft 121 Processing liquid supply unit 122 Nozzle 123 Piping 124 Processing liquid supply source 127 Imaging unit 201 Matching window 201A ROI
212 Peripheral portion 213 Guide pin 901 Operation control section 902 Detection section 903 Calculation section

Claims (8)

a substrate holder for adsorbing and holding a substrate to be processed;
a rotating section for rotating the substrate held by the substrate holding section;
an imaging unit for capturing an imaging range including an outer edge of the rotating substrate at a plurality of locations, and outputting a plurality of image data of the substrate;
a detection unit for detecting a plurality of positions of the outer edge portion of the substrate by performing matching processing on each of the plurality of image data using reference image data;
a calculation unit for calculating a displacement amount of the substrate based on a detected periodic change in the position of the plurality of outer edge portions ;
A convex portion is continuously formed on the upper surface of the substrate along the outer edge portion,
The detection unit detects a plurality of positions of the outer edge portion of the substrate by using an inner surface of the convex portion in the matching process between the reference image data and the plurality of image data.
Substrate processing equipment. The substrate processing apparatus according to claim 1,
The imaging unit images the substrate from a direction inclined with respect to a main surface of the substrate.
Substrate processing equipment. The substrate processing apparatus according to claim 1 or 2,
further comprising a position changing unit for changing a holding position of the substrate in the substrate holding unit based on the calculated displacement amount of the substrate;
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 3 ,
further comprising at least one guide pin disposed radially outward of the outer edge of the substrate held by the substrate holder;
Substrate processing equipment. The substrate processing apparatus according to claim 4 ,
the plurality of guide pins are intermittently arranged along the outer edge of the substrate;
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 5 ,
The calculation unit performs moving average processing or polynomial approximation processing on a graph showing the periodic change in the position of the outer edge portion of the plurality of substrates detected.
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 6 ,
The diameter of the substrate holding part is larger than the diameter of the substrate.
Substrate processing equipment. A process of adsorbing and holding the substrate to be processed;
rotating the held substrate;
capturing an imaging range including an outer edge of the rotating substrate at a plurality of locations, and outputting a plurality of image data of the substrate;
detecting a plurality of positions of the outer edge portion of the substrate by performing matching processing on each of the plurality of image data using reference image data;
calculating a displacement amount of the substrate based on the detected periodic change in the position of the plurality of outer edge portions ,
A convex portion is continuously formed on the upper surface of the substrate along the outer edge portion,
The step of detecting a plurality of positions of the outer edge of the substrate includes detecting a plurality of positions of the outer edge of the substrate by using an inner surface of the convex portion in the matching process between the reference image data and the plurality of image data. This is a process of detecting multiple positions of parts.
Substrate processing method.

Images