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JP7424278B2 - lighting equipment - Google Patents

lighting equipment Download PDF

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JP7424278B2
JP7424278B2 JP2020190741A JP2020190741A JP7424278B2 JP 7424278 B2 JP7424278 B2 JP 7424278B2 JP 2020190741 A JP2020190741 A JP 2020190741A JP 2020190741 A JP2020190741 A JP 2020190741A JP 7424278 B2 JP7424278 B2 JP 7424278B2
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board
fitting hole
bottom wall
housing
lighting device
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JP2022079882A (en
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将人 竹内
正人 吉川
真之 金子
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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  • Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

本発明は、照明装置に関する。 The present invention relates to a lighting device.

従来、天井に取り付けされるハウジングと、ハウジングの下方に設けられるレンズカバーと、ハウジングの上方側に設けられた、光源を有する基板と、基板を覆う基板カバーを備えた室内照明灯が知られている(例えば、特許文献1参照)。 Conventionally, an indoor lighting lamp has been known that includes a housing that is attached to the ceiling, a lens cover that is provided below the housing, a board that has a light source that is provided above the housing, and a board cover that covers the board. (For example, see Patent Document 1).

特許文献1に記載の室内照明灯においては、ハウジングの爪を基板カバーの孔に嵌合させることにより、基板カバーをハウジングに取り付ける。 In the indoor lighting lamp described in Patent Document 1, the board cover is attached to the housing by fitting the claws of the housing into the holes in the board cover.

特開2018-192881号公報JP2018-192881A

しかしながら、特許文献1に記載の室内照明灯においては、基板カバーが孔を有するため、基板カバーを射出成型するための金型に、孔を形成するためのスライド金型が必要であり、それによって製造コストが増加している。 However, in the indoor lighting lamp described in Patent Document 1, since the board cover has a hole, a slide mold for forming the hole is required in the mold for injection molding the board cover. Manufacturing costs are increasing.

本発明の目的は、スライド金型を用いずに射出成型することができる、ハウジングの爪を嵌合させるための嵌合孔を有する基板カバーを備えた照明装置を提供することにある。 An object of the present invention is to provide a lighting device that can be injection molded without using a slide mold and includes a substrate cover that has a fitting hole for fitting a claw of a housing.

本発明の一態様は、上記目的を達成するために、下記[1]~[3]の照明装置を提供する。 In order to achieve the above object, one aspect of the present invention provides the following lighting devices [1] to [3].

[1]底壁、及び前記底壁に連続した、嵌合孔を有する側壁を有する、基板カバーと、前記嵌合孔に嵌合する爪を有するハウジングと、前記爪を前記嵌合孔に嵌合させることにより、前記基板カバーの前記底壁と前記ハウジングとに挟まれて固定される、発光素子が配線板に実装された基板と、前記ハウジングに取り付けられた、発光面となるレンズと、を備え、前記側壁が、その先端側の第1の部分と前記底壁側の第2の部分に段差を設ける段差部を有し、前記嵌合孔のうちの少なくとも一部が、前記第1の部分の前記段差部側の縁に開口する、前記底壁側に金型を抜くことができる切り欠きにより構成され、かつ前記底壁を基準として前記配線板の側面よりも高い位置にある、照明装置。
[2]前記嵌合孔の全てが、前記底壁側に金型を抜くことができる切り欠きにより構成される、上記[1]に記載の照明装置。
[3]前記基板の露出した全ての導電部の前記嵌合孔からの距離が5mm以上である、上記[1]又は[2]に記載の照明装置。
[1] A board cover having a bottom wall and a side wall continuous with the bottom wall and having a fitting hole, a housing having a claw that fits into the fitting hole, and a housing that fits the claw into the fitting hole. A board on which a light emitting element is mounted on a wiring board, which is fixed between the bottom wall of the board cover and the housing by fitting together, and a lens that is attached to the housing and serves as a light emitting surface. , the side wall has a stepped portion that provides a step between a first portion on the front end side and a second portion on the bottom wall side, and at least a portion of the fitting hole is connected to the first portion on the bottom wall side. a notch that opens at the edge of the stepped portion side of the portion and allows the mold to be removed from the bottom wall side, and is located at a higher position than the side surface of the wiring board with respect to the bottom wall; lighting equipment.
[2] The lighting device according to [1], wherein all of the fitting holes are formed by cutouts on the bottom wall side through which a mold can be removed.
[3] The lighting device according to [1] or [2] above, wherein the distance from the fitting hole to all exposed conductive parts of the substrate is 5 mm or more.

本発明によれば、スライド金型を用いずに射出成型することができる、ハウジングの爪を嵌合させるための嵌合孔を有する基板カバーを備えた照明装置を提供することができる。 According to the present invention, it is possible to provide a lighting device that can be injection molded without using a slide mold and includes a substrate cover that has a fitting hole for fitting a claw of a housing.

図1(a)、(b)は、本発明の実施の形態に係る照明装置の斜視図である。FIGS. 1A and 1B are perspective views of a lighting device according to an embodiment of the present invention. 図2は、本発明の実施の形態に係る照明装置の分解斜視図である。FIG. 2 is an exploded perspective view of the lighting device according to the embodiment of the invention. 図3(a)は、基板カバーの嵌合孔近傍を拡大した、照明装置の側面図である。図3(b)は、図3(a)の切断線A-Aに沿って切断された照明装置の垂直断面図である。FIG. 3A is an enlarged side view of the lighting device, showing the vicinity of the fitting hole of the board cover. FIG. 3(b) is a vertical cross-sectional view of the lighting device taken along cutting line AA in FIG. 3(a). 図4(a)は、本発明の実施の形態に係る基板カバーの特徴を模式的に表した断面模式図である。図4(b)、(c)は、比較例としての従来の基板カバーの特徴を模式的に表した断面模式図である。FIG. 4(a) is a schematic cross-sectional view schematically showing the characteristics of the substrate cover according to the embodiment of the present invention. FIGS. 4(b) and 4(c) are schematic cross-sectional views schematically showing the characteristics of a conventional board cover as a comparative example. 図5(a)、(b)は、本発明の実施の形態に係る基板カバーを射出成型する工程を示す模式断面図である。FIGS. 5A and 5B are schematic cross-sectional views showing a process of injection molding a substrate cover according to an embodiment of the present invention. 図6(a)、(b)は、比較例に係る基板カバーを射出成型する工程を示す模式断面図である。FIGS. 6A and 6B are schematic cross-sectional views showing a process of injection molding a substrate cover according to a comparative example.

〔実施の形態〕
(照明装置の構成)
図1(a)、(b)は、本発明の実施の形態に係る照明装置1の斜視図である。図1(a)は、後述するレンズ50側から見た斜視図であり、図1(b)は、後述する基板カバー10側から見た斜視図である。図2は、照明装置1の分解斜視図である。
[Embodiment]
(Configuration of lighting device)
FIGS. 1A and 1B are perspective views of a lighting device 1 according to an embodiment of the present invention. FIG. 1(a) is a perspective view as seen from the lens 50 side, which will be described later, and FIG. 1(b) is a perspective view as seen from the substrate cover 10 side, which will be described later. FIG. 2 is an exploded perspective view of the lighting device 1.

照明装置1は、車両の天井に取り付けられる照明装置であり、典型的には、自動車のリア席側の天井に取り付けられる照明装置である。 The lighting device 1 is a lighting device that is attached to the ceiling of a vehicle, and is typically a lighting device that is attached to the ceiling of the rear seat side of the automobile.

照明装置1は、底壁11、及び底壁11に連続した、嵌合孔13(13a~13c)を有する側壁12を有する、基板カバー10と、嵌合孔13に嵌合する外側に突出した爪22(22a~22c)を有する側壁21を有するハウジング20と、側壁12の内側から爪22を嵌合孔13に嵌合させることにより、基板カバー10の底壁11とハウジング20とに挟まれて固定される、光源である発光素子32及び発光素子32の動作を切り替えるスイッチ33が実装された基板30と、ハウジング20に取り付けられた、発光面となるレンズ50と、を備える。 The lighting device 1 includes a substrate cover 10 having a bottom wall 11 and a side wall 12 continuous with the bottom wall 11 and having fitting holes 13 (13a to 13c), and a substrate cover 10 that protrudes outward and fits into the fitting holes 13. The housing 20 has a side wall 21 having claws 22 (22a to 22c), and by fitting the claws 22 into the fitting holes 13 from inside the side wall 12, the housing 20 is sandwiched between the bottom wall 11 of the board cover 10 and the housing 20. The housing 20 includes a substrate 30 on which a light-emitting element 32 as a light source and a switch 33 for switching the operation of the light-emitting element 32 are mounted, and a lens 50 as a light-emitting surface attached to the housing 20.

基板30は、配線板31と、配線板31に実装された発光素子32、スイッチ33、及び発光素子32に電力を供給するためのケーブルなどを接続するための電源コネクタ34を有する。発光素子32は、例えば、発光ダイオード素子である。発光素子32の個数や配置は特に限定されない。スイッチ33は、ボタンを押し込むことにより電流のオン、オフを切り替え、発光素子32の点灯と消灯を切り替える押しボタンスイッチである。 The board 30 includes a wiring board 31 , a light emitting element 32 mounted on the wiring board 31 , a switch 33 , and a power connector 34 for connecting a cable for supplying power to the light emitting element 32 . The light emitting element 32 is, for example, a light emitting diode element. The number and arrangement of the light emitting elements 32 are not particularly limited. The switch 33 is a push button switch that turns on and off the current and turns the light emitting element 32 on and off by pressing the button.

基板カバー10は、基板30を覆って保護する部材であり、基板30を覆った状態で基板カバー10をハウジング20に取り付けることにより、基板30を固定することができる。基板カバー10は、例えば、ポリプロピレンなどの樹脂からなる。 The board cover 10 is a member that covers and protects the board 30, and by attaching the board cover 10 to the housing 20 while covering the board 30, the board 30 can be fixed. The board cover 10 is made of resin such as polypropylene, for example.

ハウジング20の爪22を有する側壁21と、基板カバー10の嵌合孔13を有する側壁12は、基板カバー10をハウジング20に取り付ける際に弾性変形し、爪22が嵌合孔13に達したときにその復元力によって爪22を嵌合孔13に嵌合させる。ハウジング20の爪22a、22b、22cは、それぞれ基板カバー10の嵌合孔13a、13b、13cに嵌合する。 The side wall 21 of the housing 20 having the claws 22 and the side wall 12 of the board cover 10 having the fitting holes 13 are elastically deformed when the board cover 10 is attached to the housing 20, and when the claws 22 reach the fitting holes 13. Then, the claw 22 is fitted into the fitting hole 13 by its restoring force. The claws 22a, 22b, and 22c of the housing 20 fit into the fitting holes 13a, 13b, and 13c of the board cover 10, respectively.

ハウジング20は、基板30が取り付けられる側の部分に、発光素子32から発せられる光を取り込むための開口部25を有する。また、ハウジング20は、基板30が取り付けられる側と反対側の部分に、発光素子32から発せられる光を放出するための開口部26を有する。ハウジング20は、例えば、ポリプロピレンなどの樹脂からなり、発光素子32から発せられる光を透過しない性質を有する。 The housing 20 has an opening 25 on the side where the substrate 30 is attached for taking in the light emitted from the light emitting element 32. Furthermore, the housing 20 has an opening 26 for emitting light emitted from the light emitting element 32 on the side opposite to the side to which the substrate 30 is attached. The housing 20 is made of, for example, a resin such as polypropylene, and has a property of not transmitting light emitted from the light emitting element 32.

また、ハウジング20は、クリップ60を固定するためのクリップ取り付け部24を有する。クリップ60は、照明装置1を車内の天井に取り付けるための部品であり、取り付け時に弾性変形し、その復元力によって天井の取り付け部に固定される。 Further, the housing 20 has a clip attachment part 24 for fixing the clip 60. The clip 60 is a component for attaching the lighting device 1 to the ceiling of the vehicle interior, and is elastically deformed when attached, and is fixed to the attachment portion of the ceiling by its restoring force.

レンズ50は、開口部26を覆うようにハウジング20に取り付けられる。レンズ50は、例えば、ポリカーボネートなどの樹脂からなり、発光素子32から発せられる光を透過する性質を有する。 Lens 50 is attached to housing 20 so as to cover opening 26 . The lens 50 is made of resin such as polycarbonate, and has a property of transmitting light emitted from the light emitting element 32.

また、照明装置1は、ハウジング20のスイッチノブ取り付け部23に取り付けられた、スイッチ33を操作するためのスイッチノブ40を備える。スイッチノブ40を指などで押し込むことにより、スイッチ33のボタンを押して電流のオン、オフを切り替えることができる。 The lighting device 1 also includes a switch knob 40 for operating the switch 33, which is attached to the switch knob attachment part 23 of the housing 20. By pushing the switch knob 40 with a finger or the like, the button of the switch 33 can be pressed to turn the current on or off.

図2に示されるように、照明装置1を構成する各部品の組み付け方向は一方向に統一されており、ロボットによる自動組立を行う場合であっても、容易に照明装置1を組み立てることができる。 As shown in FIG. 2, the assembly direction of each component constituting the lighting device 1 is unified to one direction, and the lighting device 1 can be easily assembled even when automatic assembly is performed by a robot. .

(スライド金型を必要としない嵌合孔の構造)
図3(a)は、基板カバー10の嵌合孔13b近傍を拡大した、照明装置1の側面図である。図3(b)は、図3(a)の切断線A-Aに沿って切断された照明装置1の垂直断面図である。
(Fitting hole structure that does not require a slide mold)
FIG. 3A is an enlarged side view of the lighting device 1, showing the vicinity of the fitting hole 13b of the board cover 10. FIG. 3(b) is a vertical sectional view of the lighting device 1 taken along the cutting line AA in FIG. 3(a).

図2、図3(a)、(b)に示されるように、側壁12は、その先端12a側の第1の部分12bと底壁11側の第2の部分12cに段差を設ける段差部12dを有する。そして、嵌合孔13bが、第1の部分12bの段差部12d側の縁12eに開口する、底壁11側に金型を抜くことができる切り欠きにより構成される。また、側壁21の第2の部分12cが基板30の配線板31の側面に対向する位置にあり、第1の部分12bに設けられた嵌合孔13bは、底壁11を基準として配線板31の側面よりも高い位置にある。 As shown in FIGS. 2, 3(a) and 3(b), the side wall 12 has a stepped portion 12d that has a step between a first portion 12b on the tip 12a side and a second portion 12c on the bottom wall 11 side. has. The fitting hole 13b is formed by a notch that opens at the edge 12e of the first portion 12b on the step portion 12d side and allows the mold to be removed from the bottom wall 11 side. Further, the second portion 12c of the side wall 21 is located at a position facing the side surface of the wiring board 31 of the board 30, and the fitting hole 13b provided in the first portion 12b is formed on the wiring board 31 with the bottom wall 11 as a reference. located higher than the sides of the

第1の部分12bは、第2の部分12cよりも外側に位置する。すなわち、底壁11の面内方向の底壁11からの距離が第2の部分12cよりも大きい。そして、基板カバー10をハウジング20に取り付ける際に、側壁21が側壁12の内側に入り込み、側壁12の内側から爪22が嵌合孔13に嵌合する。 The first portion 12b is located outside the second portion 12c. That is, the distance from the bottom wall 11 in the in-plane direction of the bottom wall 11 is larger than the second portion 12c. Then, when attaching the board cover 10 to the housing 20, the side wall 21 enters inside the side wall 12, and the claw 22 fits into the fitting hole 13 from inside the side wall 12.

図4(a)は、本発明の実施の形態に係る基板カバー10の特徴を模式的に表した断面模式図である。図4(b)、(c)は、比較例としての基板カバー100a、100bの特徴を模式的に表した断面模式図である。 FIG. 4(a) is a schematic cross-sectional view schematically showing the characteristics of the board cover 10 according to the embodiment of the present invention. FIGS. 4(b) and 4(c) are schematic cross-sectional views schematically showing the characteristics of substrate covers 100a and 100b as comparative examples.

図4(b)に示される基板カバー100aの側壁120に設けられた嵌合孔130aは、底壁110側に金型を抜くことができる形状を有していない。このため、基板カバー100aを射出成型するための金型に、嵌合孔130aを形成するためのスライド金型が必要となる。 The fitting hole 130a provided in the side wall 120 of the substrate cover 100a shown in FIG. 4(b) does not have a shape that allows the mold to be removed from the bottom wall 110 side. Therefore, a slide mold for forming the fitting hole 130a is required in the mold for injection molding the substrate cover 100a.

図5(a)、(b)は、本発明の実施の形態に係る基板カバー10を射出成型する工程を示す模式断面図である。図5(a)は、金型内に樹脂を射出して基板カバー10を成型した状態を示し、図5(b)は、成型された基板カバー10から金型を抜く工程を示している。図5(a)、(b)に示されるように、図の上下方向に抜く金型70a、70bのみを用いて、スライド金具を用いずに嵌合孔13bを形成することができる。このため、製造コストを抑えることができる。 FIGS. 5A and 5B are schematic cross-sectional views showing a process of injection molding the substrate cover 10 according to the embodiment of the present invention. FIG. 5(a) shows a state in which the board cover 10 is molded by injecting resin into a mold, and FIG. 5(b) shows the process of removing the mold from the molded board cover 10. As shown in FIGS. 5A and 5B, the fitting hole 13b can be formed using only the molds 70a and 70b that are cut in the vertical direction in the figure, without using a slide fitting. Therefore, manufacturing costs can be reduced.

図6(a)、(b)は、比較例に係る基板カバー100aを射出成型する工程を示す模式断面図である。図6(a)は、金型内に樹脂を射出して基板カバー100aを成型した状態を示し、図6(b)は、成型された基板カバー100aから金型を抜く工程を示している。図6(a)、(b)に示されるように、嵌合孔130aを形成するためには、図の上下方向に抜く金型71a、71bのみならず、水平方向に抜くスライド金型71cが必要とされる。 FIGS. 6A and 6B are schematic cross-sectional views showing a process of injection molding a substrate cover 100a according to a comparative example. FIG. 6(a) shows a state in which the board cover 100a is molded by injecting resin into a mold, and FIG. 6(b) shows the process of removing the mold from the molded board cover 100a. As shown in FIGS. 6(a) and 6(b), in order to form the fitting hole 130a, not only molds 71a and 71b that are drawn in the vertical direction in the figure, but also a slide mold 71c that is drawn in the horizontal direction are used. Needed.

図4(c)に示される基板カバー100bの嵌合孔130bは、側壁120の底壁110側の縁120aに開口する切り欠きから構成され、底壁110側に金型を抜くことができる形状を有する。しかしながら、側壁120が段差部を有しないため、嵌合孔130bの一部が基板30の配線板31の側面と同じ高さにあり、配線板31の側面が嵌合孔130bを介して基板カバー100bの外側に露出する。 The fitting hole 130b of the board cover 100b shown in FIG. 4(c) is configured with a notch that opens at the edge 120a of the side wall 120 on the bottom wall 110 side, and has a shape that allows the mold to be pulled out on the bottom wall 110 side. has. However, since the side wall 120 does not have a step, a part of the fitting hole 130b is at the same height as the side surface of the wiring board 31 of the board 30, and the side surface of the wiring board 31 is inserted into the board cover through the fitting hole 130b. Exposed to the outside of 100b.

このため、例えば、照明装置に取り付けられた基板カバー100bを作業員が手で持つ際に、指が配線板31に接触する又は充分に接近して、静電気放電により電子回路の誤動作や半導体素子の損傷などが引き起こされるおそれがある。また、照明装置は基板カバー100bが上側を向く状態で車内の天井に取り付けられるが、配線板31の側面が嵌合孔130bを介して基板カバー100bの外側に露出しているため、結露による天井からの水垂れが生じたときに、基板30に水が付着して短絡などが生じるおそれがある。 For this reason, for example, when a worker holds the board cover 100b attached to the lighting device, his or her fingers may come into contact with the wiring board 31 or come close enough to the wiring board 31, causing electrostatic discharge that may cause malfunctions in electronic circuits and damage to semiconductor devices. Otherwise, damage may occur. Furthermore, although the lighting device is installed on the ceiling inside the vehicle with the board cover 100b facing upward, since the side surface of the wiring board 31 is exposed to the outside of the board cover 100b through the fitting hole 130b, condensation may When water drips from the substrate 30, there is a risk that the water will adhere to the substrate 30 and cause a short circuit.

基板カバー10の嵌合孔13bは、基板30の配線板31と異なる高さに位置するため、照明装置1に取り付けられた基板カバー10に作業員が触れるようなときにも、静電気放電の発生が抑えられる。また、基板カバー10が上側を向く状態で車内の天井に取り付けられたときに基板30の下方に嵌合孔13bが位置するため、結露による天井からの水垂れが生じたときでも、水が嵌合孔13bを通って基板30に付着することを抑制できる。 Since the fitting hole 13b of the board cover 10 is located at a different height from the wiring board 31 of the board 30, electrostatic discharge can occur even when a worker touches the board cover 10 attached to the lighting device 1. can be suppressed. In addition, since the fitting hole 13b is located below the board 30 when the board cover 10 is attached to the ceiling of the car with the board facing upward, even if water drips from the ceiling due to condensation, water will not Adhesion to the substrate 30 through the matching hole 13b can be suppressed.

なお、基板カバー10の嵌合孔13の全て(嵌合孔13a~13c)が、底壁11側に金型を抜くことができる切り欠きにより構成されることが好ましい。この場合、全ての嵌合孔13を、スライド金型を用いずに形成することができるため、2つの金型70a、70bのみを用いて、すなわち二方向抜き金型を用いて基板カバー10を射出成型することができ、基板カバー10の製造コストをより低減することができる。 Note that it is preferable that all of the fitting holes 13 (fitting holes 13a to 13c) of the substrate cover 10 be formed by cutouts on the bottom wall 11 side through which the mold can be removed. In this case, all the fitting holes 13 can be formed without using a slide mold, so the board cover 10 can be formed using only the two molds 70a and 70b, that is, using a two-way punching mold. It can be injection molded, and the manufacturing cost of the board cover 10 can be further reduced.

また、静電気放電の発生をさらに効果的に抑えるためには、基板30の露出した全ての導電部の嵌合孔13(13a~13c)からの距離が5mm以上であることが好ましい。この条件を満たすために、配線板31上の導電部の配置を調整するなどの方法をとることができる。 Further, in order to more effectively suppress the occurrence of electrostatic discharge, it is preferable that the distance from the fitting hole 13 (13a to 13c) of all exposed conductive parts of the substrate 30 is 5 mm or more. In order to satisfy this condition, methods such as adjusting the arrangement of conductive parts on the wiring board 31 can be taken.

なお、嵌合孔13aは、基板30の電源コネクタ34の実装位置に対向して設けられており、基板30の導電部(例えば、実装部品の電極や検査用電極)には近接していない。このため、嵌合孔13aは配線板31の側面よりも高い位置になくてもよく、例えば、図4(c)に示される嵌合孔130bのような構造を有してもよい。 Note that the fitting hole 13a is provided opposite to the mounting position of the power supply connector 34 on the board 30, and is not close to a conductive part of the board 30 (for example, an electrode of a mounted component or an electrode for inspection). Therefore, the fitting hole 13a does not need to be located at a higher position than the side surface of the wiring board 31, and may have a structure like the fitting hole 130b shown in FIG. 4(c), for example.

(実施の形態の効果)
上記実施の形態によれば、ハウジング20の爪22を嵌合させるための嵌合孔13を有する基板カバー10を射出成型する際に、少なくとも一部の嵌合孔13を、スライド金型を用いずに成型することができる。これにより、基板カバー10を備えた照明装置1の製造コストを抑えることができる。
(Effects of embodiment)
According to the embodiment described above, when injection molding the substrate cover 10 having the fitting holes 13 for fitting the claws 22 of the housing 20, at least some of the fitting holes 13 are formed using a slide mold. It can be molded without any process. Thereby, the manufacturing cost of the lighting device 1 including the board cover 10 can be suppressed.

以上、本発明の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。また、上記の実施の形態は特許請求の範囲に係る発明を限定するものではない。また、実施の形態の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない点に留意すべきである。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. Furthermore, the above embodiments do not limit the claimed invention. Furthermore, it should be noted that not all combinations of features described in the embodiments are essential for solving the problems of the invention.

1 照明装置
10 基板カバー
11 底壁
12 側壁
12a 先端
12b 第1の部分
12c 第2の部分
12d 段差部
12e 縁
13(13a~13c) 嵌合孔
20 ハウジング
21 側壁
22(22a~22c) 爪
30 基板
31 配線板
32 発光素子
50 レンズ
1 Lighting device 10 Board cover 11 Bottom wall 12 Side wall 12a Tip 12b First portion 12c Second portion 12d Step portion 12e Edge 13 (13a to 13c) Fitting hole 20 Housing 21 Side wall 22 (22a to 22c) Claw 30 Board 31 Wiring board 32 Light emitting element 50 Lens

Claims (3)

底壁、及び前記底壁に連続した、嵌合孔を有する側壁を有する、基板カバーと、
前記嵌合孔に嵌合する爪を有するハウジングと、
前記爪を前記嵌合孔に嵌合させることにより、前記基板カバーの前記底壁と前記ハウジングとに挟まれて固定される、発光素子が配線板に実装された基板と、
前記ハウジングに取り付けられた、発光面となるレンズと、
を備え、
前記側壁が、その先端側の第1の部分と前記底壁側の第2の部分に段差を設ける段差部を有し、
前記嵌合孔のうちの少なくとも一部が、前記第1の部分の前記段差部側の縁に開口する、前記底壁側に金型を抜くことができる切り欠きにより構成され、かつ前記底壁を基準として前記配線板の側面よりも高い位置にあ前記側壁の前記第2の部分よりも高い位置で前記嵌合孔と前記爪が嵌合している、
照明装置。
a substrate cover having a bottom wall and a side wall continuous with the bottom wall and having a fitting hole;
a housing having a claw that fits into the fitting hole;
a board on which a light emitting element is mounted on a wiring board, the board being sandwiched and fixed between the bottom wall of the board cover and the housing by fitting the claw into the fitting hole;
a lens that is attached to the housing and serves as a light emitting surface;
Equipped with
The side wall has a step portion that provides a step between a first portion on the tip side and a second portion on the bottom wall side,
At least a part of the fitting hole is configured by a notch that opens at the edge of the first portion on the step side and allows the mold to be removed from the bottom wall, and the bottom wall is located at a higher position than the side surface of the wiring board with reference to , and the fitting hole and the pawl fit into each other at a position higher than the second portion of the side wall;
lighting equipment.
前記嵌合孔の全てが、前記底壁側に金型を抜くことができる切り欠きにより構成される、
請求項1に記載の照明装置。
All of the fitting holes are formed by cutouts on the bottom wall side through which the mold can be removed.
The lighting device according to claim 1.
前記基板の露出した全ての導電部の前記嵌合孔からの距離が5mm以上である、
請求項1又は2に記載の照明装置。
A distance of all exposed conductive parts of the substrate from the fitting hole is 5 mm or more,
The lighting device according to claim 1 or 2.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025362A (en) 2010-07-28 2012-02-09 Koito Mfg Co Ltd Indoor light for vehicle

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4741729Y1 (en) * 1969-11-26 1972-12-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025362A (en) 2010-07-28 2012-02-09 Koito Mfg Co Ltd Indoor light for vehicle

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