JP7360375B2 - Sensor unit, pressure sensor unit, and pressure detection device - Google Patents

Description

The present invention relates to a sensor unit, a pressure sensor unit, and a pressure detection device having an electrostatic protection function.

Various sensor chips that detect physical quantities such as pressure and temperature are widely used, and in recent years, they have become more accurate and smaller.

This high-precision, compact sensor chip is susceptible to damage such as deterioration of detection accuracy due to the intrusion of high-voltage static electricity from the external environment. In this way, intrusion of static electricity from the outside may be blocked (Patent Document 1).

However, since the sensor chip functions by being electrically connected, if static electricity superimposes and enters the connection line, damage may occur as well. If it is necessary to provide a protection function against static electricity superimposed on the connection line, a conductive pattern for connecting the static electricity protection element should be placed in the middle of the connection line on the board for connecting the sensor chip to an external device. A protection circuit is added by forming it separately.

International Publication No. 2015/194105

However, in the case of such a sensor chip, when adding a substrate having a conductive pattern to connect an electrostatic protection element, the cost increases significantly due to changes in design and manufacturing process.

In addition, if the sensor unit is built into the case so that the sensor chip is not exposed to the outside, the outer shape of the sensor unit itself must be made compact, and it can be installed in a small space together with the board for connection. It will be laid out.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a sensor unit that allows the addition of an electrostatic protection element in a compact manner without modifying the connection structure of connection lines, and has a protection function against superimposed static electricity without increasing costs significantly. With the goal.

One aspect of the invention of a sensor unit that solves the above problem includes a sensor chip to which connection lines for power and signals are connected and which outputs a detection signal according to the external environment while being supplied with power, and a sensor chip at a preceding stage of the sensor chip. a protection element that protects the sensor chip from static electricity coming onto the connection line, the sensor unit is housed in a case, and the sensor chip is arranged inwardly away from the inner surface of the case. In addition, while the connection line is wired on the inner surface of the case, there are relay connection terminals that are electrically connected to each other so as to relay the connection line and the sensor chip, and a wire inside the case. a protective element installation member for positioning and holding the protective element at a location adjacent to the relay connecting terminal and connecting the protective element to the relay connecting terminal so as to be able to function between the sensor chip and the connecting line; It is characterized by comprising the following.

According to one aspect of the present invention, a protection element is installed at a location adjacent to the relay connection terminal that connects the sensor chip inside the case and the connection line on the inside surface of the case and relays power and signals. The electrostatic protection element, which is positioned and held using the member, can be conductively connected to the connection line.

In other words, by making one connection to the relay connection terminal that connects the sensor chip to the connection line, an adjacent electrostatic protection element can be added in a compact space without changing the connection structure between the sensor chip and the connection line. It can be installed.

Therefore, a sensor unit having a protection function against superimposed static electricity can be provided without a large increase in cost.

FIG. 1 is a diagram showing a pressure detection device equipped with a pressure sensor unit, which is an example of a sensor unit according to a first embodiment of the present invention, and is a vertical cross-sectional view showing a schematic overall configuration thereof. FIG. 2 is a front view showing the connection structure of the connection line. FIG. 3 is a perspective view showing the connection structure of the connection line. FIG. 4 is a perspective view showing the shape of the relay connection terminal. FIG. 5 is a perspective view showing how the relay connection terminal is connected to the connection line and the protection board. FIG. 6 is a diagram showing the protective board, in which (a) is a perspective view showing one side, and (b) is a perspective view showing the other side. FIG. 7 is a diagram showing the protective board, in which (a) shows the solder pattern on one side, (b) shows the element pattern on the other side, and (c) shows the relay pattern that makes these patterns conductive. FIG. FIG. 8 is a longitudinal cross-sectional side view taken along line VIII-VIII in FIG. 2, showing the soldering work of the relay connection terminal to the connection line and the protection board. FIG. 9 is a diagram showing the conventional pressure detection device, in which (a) is a vertical cross-sectional view showing a schematic overall configuration, and (b) is a front view showing the connection structure of the connection line. FIG. 10 is a longitudinal cross-sectional side view taken along line XX in FIG. 9(b), showing the soldering work of the relay connection terminal to the connection line in the conventional structure. FIG. 11 is a diagram showing a pressure detection device equipped with a pressure sensor unit, which is an example of a sensor unit according to a second embodiment of the present invention, and is a vertical cross-sectional view showing a schematic overall configuration thereof. FIG. 12 is a front view showing the connection structure of the connection line. FIG. 13 is a longitudinal cross-sectional side view taken along line XIII-XIII in FIG. 12, showing the soldering work of the relay connection terminal to the connection line and the protection element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First embodiment>
1 to 8 are diagrams showing a pressure detection device equipped with a pressure sensor unit, which is an example of a sensor unit according to a first embodiment of the present invention.

In FIG. 1, a pressure detection device 100 has a pressure sensor unit 10 attached to a location where pressure is measured as a physical quantity of the external environment, and outputs pressure information detected by a pressure sensor chip 11 to a connected external device M. It is manufactured in The pressure detection device 100 of the present embodiment connects a pressure sensor unit 10 housed in a waterproof case 20 made of resin to a pipe through which a fluid such as gas or liquid whose pressure is to be detected is guided by a metal joint member. It is constructed so that it can be connected by connecting at 30.

Here, the waterproof case 20 is made into a cylindrical shape capable of housing the pressure sensor unit 10, and has a step opening 20b formed by bending one end inward, and a base plate 28 to which the joint member 30 is fixed. The periphery is connected. This joint member 30 has a female thread 30s formed therein so that it can be screwed onto a pipe or the like to be subjected to pressure measurement, and allows fluid supplied from the pipe in the direction of arrow P through a port 30a communicating with the female thread 30s. This realizes introduction into the pressure chamber 28A on the downstream side of the base plate 28.

The pressure sensor unit 10 includes a stainless steel housing 12 that is manufactured in a short cylindrical shape and has one axial end surface 12a bonded and fixed to a base plate 28, and a pressure sensor chip 11 installed inside the inner cylinder of the housing 12. A metal chip mount member 13 is disposed at the center of the interior spaced from the inner surface of the waterproof case 20, and a metal chip mount member 13 is filled around the chip mount member 13 in the inner cylinder of the housing 12 to close it. It is constructed with a hermetic glass 14 that fixes a member passing through the inner cylinder.

Further, in the pressure sensor unit 10, a metal diaphragm 32 is bonded and fixed to one end surface 12a of the housing 12. The diaphragm 32 forms an airtight pressure chamber 28A on the base plate 28 side, and isolates the installation space of the pressure sensor chip 11 on the chip mount member 13 side in the housing 12 from the pressure chamber 28A.

In this pressure sensor unit 10, a predetermined amount of silicone oil PM (fluorine The liquid chamber LR is filled with an inert liquid or the like) and functions as a liquid chamber LR.

Thereby, the pressure sensor chip 11 is prevented from being damaged by the diaphragm 32 avoiding direct contact with the fluid to be detected that enters the pressure chamber 28A from the pipe connected to the joint member 30. A pressure corresponding to the fluid pressure entering the pressure chamber 28A is generated in the liquid chamber LR via the diaphragm 32, and a detection signal corresponding to the fluid pressure can be output.

Here, the pressure sensor chip 11 is electrically connected to the input/output terminal group 40 connected to the connection line 38 from the external device M via the conduction wire 11w, so that the pressure sensor chip 11 is supplied with power and receives a detection signal. It is installed to output pressure information. Further, the liquid chamber LR between the hermetic glass 14 and the diaphragm 32 in the inner cylinder of the housing 12 is filled with silicone oil PM via an oil filling pipe 44. The input/output terminal group 40 and the oil filling pipe 44 are fixed in a penetrating state by filling the hermetic glass 14 while being positioned and held together with the chip mount member 13 in the inner cylinder of the housing 12. After the oil filling pipe 44 is filled with oil, the oil filling pipe 44 is closed by crushing it as shown by the two-dot chain line in the figure.

Note that the diaphragm 32 can be damaged by external force or sudden pressure inside the pressure chamber 28A due to the diaphragm protection cover 34 having a plurality of communication holes 34a being bonded and fixed to one end surface 12a of the housing 12. is now being prevented. Further, a metal potential adjustment member 17 is fixed to one end surface 14a of the hermetic glass 14 between the pressure sensor chip 11 and the diaphragm 32, and this potential adjustment member 17 is described in, for example, Japanese Patent No. 3987386. As also shown, it is connected to a terminal connected to the zero potential of the circuit of the pressure sensor chip 11.

The input/output terminal group 40 consists of a total of eight terminals, two power supply terminals 40a, one output signal terminal 40a, and five adjustment terminals 40a, and is made of a resin terminal block. They are aligned and held by the 24 disk portions 24d. The terminal block 24 includes a cylindrical portion 24t that is short in the axial direction around a disk portion 24d, and is positioned and supported by being installed and fixed such that one end side of the cylindrical portion 24t overlaps the other end surface 12b of the housing 12. There is. In the input/output terminal group 40, both ends of each terminal 40a penetrate through both sides of the hermetic glass 14 in the inner cylinder of the housing 12, and the pressure sensor chip 11 is electrically connected to one end via a conductive wire 11w. On the other hand, the relay connection terminal 36 held in the cylindrical portion 24t of the terminal block 24 is electrically connected to the other end side of the power supply terminal 40a and the output signal terminal 40a, and is connected to the external device M. It is relay-connected to the core wire 38a of the connection line 38 that is connected.

Here, the adjustment terminal 40a of the input/output terminal group 40 is used to optimize the sensitivity, accuracy, etc. of the pressure sensor chip 11 before it is assembled into the pressure detection device 100 and the production of the pressure sensor unit 10 is completed. It is prepared for connecting an adjustment device (not shown) when performing the optimization process, and the connection with the adjustment device etc. is canceled after the optimization process.

Note that only four input/output terminals 40 are shown. Further, the terminal block 24 is attached with an end cap 24E that closes the opposite end of the housing 12 in the cylindrical portion 24t. The waterproof case 20 is waterproofed by filling the space between the housing 12 and the terminal block 24 with a sealing material 26 such as urethane resin.

The relay connection terminal 36 is extended in a parallel direction facing the disc part 24d of the terminal block 24 that holds the input/output terminal group 40 in a parallel state, and passes through the cylindrical part 24t of the input/output terminal group 40. A chip-side connecting portion 36t conductively connected to the other end side of the power supply terminal 40a and the output signal terminal 40a, and the chip-side connecting portion 36t is separated from the housing 12 on the outside of the cylindrical portion 24t of the terminal block 24. A line-side connection portion 36m is provided, which is bent and extended in the direction and electrically connected to the core wire 38a of the connection line 38 from the external device M by soldering with molten solder MS. Note that the relay connection terminal 36 is fixed with an adhesive AB together with a protection board 50, which will be described later, while penetrating the cylindrical portion 24t of the terminal block 24.

By the way, as shown in FIGS. 2 and 3, three connection lines 38, a power line 38P, a grounding line 38G, and an output signal line 38S, are extended from the external device M in a direction along the cylindrical portion 24t of the terminal block 24. The pressure sensor unit 10 is connected to the pressure sensor unit 10 using a narrow space on the inner surface of the waterproof case 20.

On the other hand, the relay connection terminal 36 includes a power terminal 36P for a power source, a ground terminal 36G, and an output signal terminal 36S, which maintain an insulated state from each other, corresponding to each of the connection lines 38 (38P, 38G, 38S). It is equipped with The chip-side connection portions 36t of these terminals 36P, 36G, and 36S are positioned and supported through the cylindrical portion 24t of the terminal block 24, and as shown in FIGS. 4 and 5, the chip-side connection portions 36t are extended. The line-side connection portions 36m of these terminals 36P, 36G, and 36S, which are bent in a direction perpendicular to the direction, are formed wide at the base end side of the chip-side connection portions 36t so as to have a shape parallel to the bent corners. The abutting end 36e is abutted against the bottom surface 25b of the groove 25 of the terminal block 24 to which the adhesive AB is applied, and is bonded and fixed by the adhesive AB.

Thereby, the connection line 38 can be easily soldered by simply holding each core wire 38a along the line side connection portion 36m of the relay connection terminal 36, and the chip connected to the pressure sensor chip 11 can be easily soldered. It can be electrically connected to the side connection portion 36t.

In the pressure sensor unit 10 of this embodiment, when static electricity generated within the external device M or in the middle of the wiring between the external device M and the external device M enters (is superimposed on) the connection line 38, the characteristics of the pressure sensor chip 11 deteriorate, etc. Therefore, a protection board (with a protection element installed) that mounts an electrostatic protection element, for example, a constant voltage diode (so-called Zener diode) 51, is installed in front of the pressure sensor chip 11 connected to the connection line 38. member) 50 is installed.

As a result, in the pressure sensor unit 10, the abnormal voltage caused by the intrusion of static electricity from the connection line 38 is suppressed to a constant voltage or less, and the pressure sensor chip 11 is prevented from being damaged due to characteristic deterioration. can be prevented.

As shown in FIG. 6, the protection board 50 is located on the opposite side of the line side connection part 36m of the relay connection terminal 36 and extends so as to be continuous with the chip side connection part 36t. It is manufactured to a size that allows it to be installed in a narrow space between the cylindrical portion 24t of the terminal block 24 and the inner surface of the waterproof case 20 while being adjacent to the cylindrical portion 24t of the terminal block 24. This protective substrate 50 has a pattern for connection with the relay connection terminal 36 formed on one side, and a pattern for mounting the constant voltage diode 51 on the other side.

As shown in FIG. 7, this protective board 50 has a wiring pattern 55 formed thereon which conductively connects each of the power terminal 36P and output signal terminal 36S of the relay connection terminal 36 to the ground terminal 36G with a constant voltage diode 51 interposed therebetween. Specifically, the wiring pattern 55 is formed so that the anode of the constant voltage diode 51 is electrically connected to the ground terminal 36G. The wiring pattern 55 has a soldering surface (solder pattern) 56 formed on one side (one of the front and back sides) and two constant voltage diodes 51 formed on the other side (the other side of the front and back). It includes an element pattern 57 that is electrically connected, and a relay pattern 58 that electrically connects the soldering surface 56 and the element pattern 57.

In detail, the soldering surface 56 on one side of the protection board 50 is the outer surface of the chip side connection part 36t located outside the cylindrical part 24t of the terminal block 24 and on the opposite side of the line side connection part 36m of the relay connection terminal 36. A soldering surface having a desired area is formed at a position in contact with one side of the periphery of the protective substrate 50 so that it can be easily and reliably soldered while facing the protective substrate 50 . The element pattern 57 on the other side of the protection board 50 is extended from the periphery on the back side of the soldering surface 56, and both electrodes 51a and 51b are soldered to the power line 38P and the output signal line 38S of the connection line 38, respectively. As a result, a circuit pattern is formed that is electrically connected to the ground line 38G of the connection line 38 and connected in common with the constant voltage diode 51 interposed therebetween.
The relay pattern 58 of the protection board 50 has a concave concave portion 50r formed on the peripheral side surface where the soldering surface 56 of the protection board 50 is formed, and the soldering surface 56 and the element It is formed so as to be electrically connected to the pattern 57.

As a result, the pressure sensor unit 10 allows the abnormal voltage of static electricity that enters the power line 38P and output signal line 38S of the connection line 38 to be bypassed (released) to the ground line 38G side by the function of the respective constant voltage diodes 51. ) The static electricity can be suppressed to below a constant voltage, and it is possible to prevent the static electricity from directly invading the pressure sensor chip 11 and causing characteristic deterioration and damage.

Here, in this embodiment, the case where the protection board 50 is soldered to the chip side connection part 36t of the relay connection terminal 36 in an extended position will be explained as an example, but the protection board 50 is soldered to the chip side connection part 36t of the relay connection terminal 36 in an extended position. The connecting terminal 36 may be soldered to the line side connecting portion 36m in an extended position and installed along the inner surface of the waterproof case 20 together with the connecting line 38. Further, although a case will be described as an example in which a recess 50r is provided on the periphery of the protective substrate 50 and conductive connection is made between the soldering surface 56 and the element pattern 57, the present invention is not limited to this. The conductive connection may be made by forming a pattern, or the conductive connection may be made by forming through holes penetrating the front and back sides thereof.

Furthermore, during the work of connecting the core wire 38a of the connection line 38 to the relay connection terminal 36, the pressure sensor unit 10 holds the protection board 50 so as to be attached to a position adjacent to the relay connection terminal 36, as shown in FIG. By simply doing this, it is possible to complete the soldering work of the soldering surface 56 of the protection board 50 together with the core wire 38a of the connection line 38 to the line side connection portion 36m and chip side connection portion 36t of the relay connection terminal 36.

As a result, the pressure sensor unit 10 is equipped with the voltage regulator diode 51, similar to the case of the pressure sensor unit 210 installed in the conventional pressure detection device 200 shown in FIG. In other words, without increasing the number of man-hours from the conventional process shown in FIG. The pressure sensor unit 10 can be manufactured by installing the protective substrate 50 so that the voltage diode 51 functions effectively.

In this way, in the pressure sensor unit 10 of the present embodiment, the protection board 50 is positioned in a small space adjacent to the relay connection terminal 36 exposed on the outer surface 24o of the cylindrical portion 24t of the terminal block 24, The constant voltage diode 51 can be installed in the front stage of the pressure sensor chip 11 by simply soldering the connection line 38 to the connecting line 38. A protection function against static electricity superimposed on the connection line 38 can be provided.

<Second embodiment>
11 to 13 are diagrams showing a pressure detection device equipped with a pressure sensor unit, which is an example of a sensor unit according to a second embodiment of the present invention. Since this embodiment is configured in substantially the same manner as the above-described embodiment, similar configurations are given the same reference numerals, description thereof will be omitted, and characteristic portions will be described.

In FIG. 11, the pressure detection device 100 of this embodiment is equipped with a pressure sensor unit 60 equipped with a constant voltage diode 51 without using the protection substrate 50 of the above-described embodiment, and the pressure detected by the pressure sensor chip 11 is It is made to output information to a connected external device M.

Specifically, as shown in FIGS. 12 and 13, the terminal block 24 is attached to the outer surface of the cylindrical portion 24t with the chip-side connection portion 36t of the relay connection terminal 36 connected to the input/output terminal group 40 in a conductive manner. By applying (filling) adhesive AB into the groove 25 recessed at 24o, the relay connection terminal 36 is positioned and fixed at a desired position. The groove 25 of the cylindrical portion 24t of the terminal block 24 has a slit (not shown) formed in the bottom surface 25b into which the chip-side connection portion 36t of each terminal 36P, 36G, and 36S of the relay connection terminal 36 can be inserted. By abutting the abutting end 36e of the relay connection terminal 36 against the abutting end 36e of the relay connection terminal 36, the chip side connection portion 36t can be positioned at a position where it is electrically connected to the input/output terminal group 40.

In short, the terminal block 24 extends from the line side connection part 36m side, which is formed wider than the tip side of the chip side connection part 36t of the relay connection terminal 36 to be conductively connected to the input/output terminal group 40, to the abutting end part 36e. A concave groove 25 is formed to ensure a space (capacity) capable of accommodating between the outer surface 24o and the bottom surface 25b of the cylindrical portion 24t.

As a result, the groove 25 of the terminal block 24 is filled with the adhesive AB, so that the chip side connection portion 36t of the relay connection terminal 36 maintains a state in which it is electrically connected to the input/output terminal group 40. It is positioned and fixed to the cylindrical portion 24t.

In the pressure sensor unit 60 of this embodiment, the groove 25 is formed so that the two voltage regulator diodes 51 can be accommodated by shifting them in the circumferential direction of the cylindrical portion 24t of the terminal block 24. , lead wires 51w extending from both ends are formed to be solderable at the same time as the core wire 38a of the connection line 38 for each terminal 36P, 36G, 36S of the line side connection portion 36m of the relay connection terminal 36.

Therefore, the constant voltage diode 51 is held within the groove 25 of the terminal block 24 adjacent to the line side connection portion 36m of the relay connection terminal 36, and is positioned and fixed by the adhesive AB. That is, the groove 25 formed in a concave shape on the outer surface 24o of the cylindrical portion 24t of the terminal block 24 functions as a holding part of a setting jig that holds the constant voltage diode 51 on the terminal block 24 of the pressure sensor unit 60. The terminal block 24 can be used as a protective element installation member.

Thereby, this pressure sensor unit 60 positions and fixes the two constant voltage diodes 51 in the space in the groove 25 adjacent to the relay connection terminal 36 attached to the terminal block 24, and relays the lead wire 51w. Each of the terminals 36P, 36G, and 36S of the line side connection portion 36m of the connection terminal 36 can be soldered together with the core wire 38a of the connection line 38 at the same time, so that they can be electrically connected so as to function at the front stage of the sensor chip 11.

Therefore, in the pressure sensor unit 60, as in the above-described embodiment, the abnormal voltage of static electricity that enters the power line 38P and the output signal line 38S of the connection line 38 is transferred to the ground line 38G side by the function of the respective constant voltage diodes 51. The voltage can be suppressed to a constant voltage or lower by bypassing (escape), and it is possible to prevent the static electricity from directly invading the pressure sensor chip 11 and causing characteristic deterioration and damage.

Further, when the pressure sensor unit 60 connects the core wire 38a of the connection line 38 to the relay connection terminal 36, the lead wire 51w of the constant voltage diode 51 is connected to each terminal 36P, 36G, and 36S of the line side connection portion 36m in the vicinity. In other words, the soldering work can be completed at the same time when the positions are adjacent to each other, without using the protection board 50 of the above-described embodiment, and without adding the soldering work of installing the constant voltage diode 51. Thus, the constant voltage diode 51 can be manufactured to function effectively without increasing the number of man-hours from the conventional process of soldering the core wire 38a of the connection line 38 to the line side connection portion 36m of the relay connection terminal 36.

In this way, in the pressure sensor unit 60 of this embodiment, as in the above-described embodiment, the constant voltage diode 51 is positioned and fixed at a location adjacent to the relay connection terminal 36 exposed on the outer surface 24o of the cylindrical portion 24t of the terminal block 24. By simply soldering the relay connection terminal 36 and the connection line 38, the voltage regulator diode 51 can be installed in the front stage of the pressure sensor chip 11, without increasing the soldering process (significant increase in cost). The connection line 38 can be provided with a protection function against superimposed static electricity.

Here, in the above-mentioned embodiment, the case where the constant voltage diode 51 is housed in the groove 25 and positioned and fixed will be explained as an example, but the present invention is not limited to this. A pair of facing ribs protruding from 24o and sandwiching the constant voltage diode 51 may be formed to hold the constant voltage diode 51 in position. In this case, the lead wire 51w of the constant voltage diode 51 and the core wire 38a of the connection line 38 are set at approximately the same distance from the outer surface 24o of the terminal block 24, so that the line side connection portion 36m of the relay connection terminal 36 can be easily connected to the line side connection portion 36m of the relay connection terminal 36. It may also be possible to make it solderable.

The scope of the invention is not limited to the exemplary embodiments shown and described, but also includes all embodiments giving equivalent effect to the object of the invention. Furthermore, the scope of the invention is not limited to the combinations of inventive features delineated by each claim, but may be defined by any desired combination of specific features of each and every disclosed feature. .

10, 60...Pressure sensor unit 11...Pressure sensor chip 12...Housing 20...Waterproof case 24...Terminal block 24t...Cylinder part 24o...Outer surface 25...Groove 28A...Pressure chamber 30...Joint Member 32...Diaphragm 36...Relay connection terminal 36G...Ground terminal 36P...Power terminal 36S...Output signal terminal 36e...Abutting end 36m...Line side connection part 36t...Chip side connection part 38... ... Connection line 38G ... Grounding wire 38P ... Power line 38S ... Output signal line 38a ... Core wire 50 ... Protective board 50r ... Recess 51 ... Constant voltage diode 55 ... Wiring pattern 56 ... Soldering surface (solder pattern)
57... Element pattern 58... Relay pattern 100... Pressure detection device LR... Liquid chamber M... External device

Claims (5)

A sensor chip to which connection lines for power and signals are connected and outputs a detection signal according to the external environment while being supplied with power, and a sensor chip that protects the sensor chip from static electricity that rides on the connection line in the preceding stage of the sensor chip. A sensor unit housed in a case, comprising:
The sensor chip is arranged inwardly away from the inner surface of the case, and the connection line is wired on the inner surface of the case,
a relay connection terminal that is electrically connected to the connection line and the sensor chip so as to relay the connection line and the sensor chip;
The protection element is positioned and held at a location adjacent to the relay connection terminal in the case, and is electrically connected to the relay connection terminal to enable the protection element to function between the sensor chip and the connection line. A protection that functions as a protective element installation member, is formed in a size that can be adjacent to the relay connection terminal in the case, and has a wiring pattern that mounts the protective element and connects the protective element to the connection line. A substrate and
It is equipped with
The connection line includes a power line and a ground line for the power supply, and a signal line for the signal,
The relay connection terminal has a chip side connection part that extends so as to be connectable to the inner sensor chip side, and a line side connection part that extends from the chip side connection part so that it can be connected to the connection line side. Equipped with
The wiring pattern of the protection board is formed with a soldering surface that is electrically connected to the chip-side connection portion or the line-side connection portion of the relay connection terminal,
The protective substrate includes an element pattern formed on one of the front and back sides to electrically connect the protection element, a solder pattern formed on the other side of the front and back to function as the soldering surface, and the element pattern on the front and back sides. and a relay pattern that extends and connects the solder pattern in a conductive state . In the relay connection terminal, the soldering surface of the protection board is soldered to the line side connection part or the chip side connection part at the same time as the core wire of the connection line, so that the protection element can function in the front stage of the sensor chip. The sensor unit according to claim 1, wherein the sensor unit is electrically connected to the sensor unit. The relay pattern is formed in a concave shape formed by recessing the peripheral edge between the front and back surfaces of the protective substrate, or in a through hole penetrating the front and back sides of the protective substrate, and is formed in a through hole penetrating the front and back sides of the protective substrate, and connects the element pattern on the front and back sides and the element pattern on the front and back sides. The sensor unit according to claim 1, wherein the solder pattern is electrically connected. A pressure sensor unit comprising a pressure sensor chip that detects pressure as the sensor chip in the sensor unit according to any one of claims 1 to 3 above. The pressure sensor unit according to claim 4 includes the case in which the sensor chip is housed together with the relay connection terminal and the protection element, and the connection line is housed and connected in the case. Characteristic pressure detection device.

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