JP7307980B2 - 運動装置 - Google Patents
運動装置 Download PDFInfo
- Publication number
- JP7307980B2 JP7307980B2 JP2021564750A JP2021564750A JP7307980B2 JP 7307980 B2 JP7307980 B2 JP 7307980B2 JP 2021564750 A JP2021564750 A JP 2021564750A JP 2021564750 A JP2021564750 A JP 2021564750A JP 7307980 B2 JP7307980 B2 JP 7307980B2
- Authority
- JP
- Japan
- Prior art keywords
- concave cavity
- stage
- rotary
- tray
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Linear Motors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本特許出願は、2019年04月30日に出願され、出願番号が201910363238.3であり、発明名称が「運動装置」である中国特許出願と、2019年07月12日に出願され、出願番号が201910628196.1であり、発明名称が「運動装置」である中国特許出願の優先権を主張しており、上記出願の全文は引用により本文に組み込まれる。
トレイと、
前記トレイの下方に位置する回転ステージであって、前記回転ステージの上面に環状の上部凹状キャビティが設けられ、前記回転ステージの下面に下部凹状キャビティが設けられ、前記上部凹状キャビティと前記下部凹状キャビティの前記回転ステージの上面に垂直な投影方向への投影が互いにずれている回転ステージと、
前記環状の上部凹状キャビティ内に収容された回転モータであって、前記回転ステージに対して固定された回転モータ固定子と、前記トレイに対して固定された回転モータ移動子と、を含む回転モータと、
前記下部凹状キャビティ内に位置し、前記回転ステージを駆動して垂直移動させることができるように構成された垂直移動装置と、
前記下部凹状キャビティ内に位置し、前記回転ステージの重力補償を可能にするように構成された磁気浮上重力補償装置と、を備える運動装置を提供する。
外面に内側磁気リングが被せて設けられたボイスコイルモータ固定子と、
外面に外側磁気リングが被せて設けられたボイスコイルモータ移動子と、を含む。
一実施例において、前記回転ステージは前記環状の上部凹状キャビティ内に位置する回転グレーチングルーラーを備える。
一実施例において、前記回転モータ移動子と前記環状の上部凹状キャビティの内周壁との間に一つの軸受のみが設置されている。
図2は本発明に係る運動装置の断面図である;
図3は本発明に係る運動装置の平面図であって、トレイが取り外されている;
図4は本発明に係る磁気浮上重力補償装置の斜視図である;
図5は本発明に係る磁気浮上重力補償装置の断面図である;
図6は本発明に係る回転ステージベースの平面斜視図である;
図7は本発明に係る回転ステージベースの底面斜視図である;
図8は本発明に係る精密運動装置のボイスコイルモータの断面図である;
図9は本発明に係る磁気浮上重力補償装置のレイアウトの別の実施例である;
図10は本発明に係る磁気浮上重力補償装置の別の実施例である。
Claims (7)
- トレイと、
前記トレイの下方に位置する回転ステージであって、前記回転ステージの上面に環状の上部凹状キャビティが設けられ、前記回転ステージの下面に下部凹状キャビティが設けられ、前記上部凹状キャビティと前記下部凹状キャビティとの前記回転ステージの上面に垂直な投影方向への投影が互いにずれている回転ステージと、
前記環状の上部凹状キャビティ内に収容された回転モータであって、前記回転ステージに対して固定された回転モータ固定子と、前記トレイに対して固定された回転モータ移動子とを含む回転モータと、
前記下部凹状キャビティ内に位置し、前記回転ステージを駆動して垂直移動させることができるように構成された垂直移動装置と、
前記下部凹状キャビティ内に位置し、前記回転ステージの重力補償を可能にするように構成された磁気浮上重力補償装置と、を備え、
前記下部凹状キャビティは複数の下部凹状キャビティを含み、前記垂直移動装置および前記磁気浮上重力補償装置は、それぞれ異なる下部凹状キャビティ内に位置することを特徴とする運動装置。 - 前記複数の下部凹状キャビティは、中心凹状キャビティと周部凹状キャビティとを含み、前記中心凹状キャビティは、平面位置が前記環状の上部凹状キャビティによって囲まれ、前記垂直移動装置を収容するためのものであり、前記周部凹状キャビティは、前記環状の上部凹状キャビティの外周に位置し、前記磁気浮上重力補償装置を収容するためのものであることを特徴とする請求項1に記載の運動装置。
- ワークを前記トレイに載置するまたは前記トレイから搬出するように構成された上下シート装置をさらに備えることを特徴とする請求項1に記載の運動装置。
- 前記垂直移動装置はボイスコイルモータを備え、前記ボイスコイルモータは中空構造であり、前記トレイは真空チャック装置であることを特徴とする請求項1に記載の運動装置。
- 前記下部凹状キャビティは、4つの周部凹状キャビティを含み、各前記周部凹状キャビティは、1つの磁気浮上重力補償装置を収容することを特徴とする請求項2に記載の運動装置。
- 前記回転ステージは前記環状の上部凹状キャビティ内に位置する回転グレーチングルーラーを備えることを特徴とする請求項1に記載の運動装置。
- 前記回転モータ移動子と前記環状の上部凹状キャビティの内周壁との間に一つの軸受のみが設置されていることを特徴とする請求項1に記載の運動装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023040320A JP7587297B2 (ja) | 2019-04-30 | 2023-03-15 | 運動装置 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910363238.3 | 2019-04-30 | ||
CN201910363238 | 2019-04-30 | ||
CN201910628196.1 | 2019-07-12 | ||
CN201910628196.1A CN110176407B (zh) | 2019-04-30 | 2019-07-12 | 运动装置 |
PCT/CN2020/086368 WO2020221096A1 (zh) | 2019-04-30 | 2020-04-23 | 运动装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023040320A Division JP7587297B2 (ja) | 2019-04-30 | 2023-03-15 | 運動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022530826A JP2022530826A (ja) | 2022-07-01 |
JP7307980B2 true JP7307980B2 (ja) | 2023-07-13 |
Family
ID=67700049
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021564750A Active JP7307980B2 (ja) | 2019-04-30 | 2020-04-23 | 運動装置 |
JP2023040320A Active JP7587297B2 (ja) | 2019-04-30 | 2023-03-15 | 運動装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023040320A Active JP7587297B2 (ja) | 2019-04-30 | 2023-03-15 | 運動装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US12327752B2 (ja) |
JP (2) | JP7307980B2 (ja) |
KR (2) | KR102677414B1 (ja) |
CN (2) | CN210073772U (ja) |
WO (1) | WO2020221096A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210073772U (zh) * | 2019-04-30 | 2020-02-14 | 上海隐冠半导体技术有限公司 | 运动装置 |
CN110440112B (zh) * | 2019-09-04 | 2024-06-14 | 上海隐冠半导体技术有限公司 | 垂向运动装置 |
CN110587554A (zh) * | 2019-10-24 | 2019-12-20 | 上海隐冠半导体技术有限公司 | 一种微动台及具有该微动台的运动装置 |
CN110906832B (zh) * | 2019-11-04 | 2021-09-03 | 上海天庹智能设备有限公司 | 一种负压定位测量装置及其测量方法 |
CN110677007B (zh) * | 2019-11-06 | 2025-05-30 | 上海隐冠半导体技术有限公司 | 一种音圈电机及运动装置 |
CN112661069B (zh) * | 2020-12-16 | 2022-08-12 | 江苏华阳重工股份有限公司 | 一种用于工程机械的旋转移动装置 |
CN112847285A (zh) * | 2021-03-10 | 2021-05-28 | 上海隐冠半导体技术有限公司 | 一种气浮垂向运动装置 |
CN113732851B (zh) * | 2021-11-05 | 2022-02-01 | 四川明泰微电子有限公司 | 一种用于半导体晶圆背面打磨的装置 |
CN120038690B (zh) * | 2025-04-23 | 2025-07-18 | 常州市荣江机电有限公司 | 一种卷扬机配件加工用智能定位设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002323584A (ja) | 2001-02-22 | 2002-11-08 | Nikon Corp | アクチュエータ、ステージ、露光装置、デバイスの製造方法、及び免震装置 |
JP2012256516A (ja) | 2011-06-09 | 2012-12-27 | Hitachi High-Technologies Corp | ステージ装置およびステージ装置の制御方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01146605A (ja) * | 1987-12-04 | 1989-06-08 | Toshiba Corp | 縦形移動テーブル装置 |
JP2793613B2 (ja) * | 1989-01-27 | 1998-09-03 | 日立金属株式会社 | ボイスコイルモータ |
US5642298A (en) * | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
JP3720515B2 (ja) * | 1997-03-13 | 2005-11-30 | キヤノン株式会社 | 基板処理装置及びその方法並びに基板の製造方法 |
JPH10270535A (ja) * | 1997-03-25 | 1998-10-09 | Nikon Corp | 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法 |
JPH11284052A (ja) * | 1998-01-30 | 1999-10-15 | Nikon Corp | 基板搬送方法、基板搬送装置、及び露光装置、並びにデバイス製造方法 |
JP3732763B2 (ja) * | 2001-07-13 | 2006-01-11 | 住友重機械工業株式会社 | ステージ装置 |
IL156330A (en) | 2003-06-05 | 2009-12-24 | Nova Measuring Instr Ltd | Article transfer system |
US6779278B1 (en) * | 2003-07-17 | 2004-08-24 | Nanometrics Incorporated | Compact rotating stage |
JP4747665B2 (ja) * | 2005-05-11 | 2011-08-17 | 大日本印刷株式会社 | 成膜装置及び成膜方法 |
CN101177199B (zh) * | 2007-12-04 | 2012-11-28 | 南京大学 | 谐振式多工位转台 |
CN101206410A (zh) * | 2007-12-17 | 2008-06-25 | 上海微电子装备有限公司 | 工件台平衡质量定位系统 |
JP2010109244A (ja) * | 2008-10-31 | 2010-05-13 | Oki Electric Ind Co Ltd | モジュール及びその製造方法 |
CN201436604U (zh) * | 2009-05-27 | 2010-04-07 | 上海微电子装备有限公司 | 重力补偿器 |
CN102129175B (zh) * | 2010-01-19 | 2013-01-16 | 上海微电子装备有限公司 | 一种气浮支撑的旋转台 |
KR20130040805A (ko) * | 2010-04-07 | 2013-04-24 | 가부시키가이샤 야스카와덴키 | θZ 구동 장치 및 스테이지 장치 |
DE102012002266A1 (de) * | 2012-02-01 | 2013-08-01 | Benjamin Reutzsch | Linearführung für Schwebeantriebe |
CN103309176B (zh) * | 2013-06-17 | 2015-07-22 | 清华大学 | 一种带升降真空爪的六自由度微动台 |
CN104122759A (zh) * | 2014-04-28 | 2014-10-29 | 清华大学 | 一种平面电动机驱动的磁悬浮粗微动一体掩模台 |
JP6330623B2 (ja) * | 2014-10-31 | 2018-05-30 | 東京エレクトロン株式会社 | 成膜装置、成膜方法及び記憶媒体 |
KR101675271B1 (ko) * | 2015-10-30 | 2016-11-14 | 서우테크놀로지 주식회사 | 연삭장치 및 그가 적용된 반도체 스트립 그라인더 |
JP6890438B2 (ja) * | 2017-03-03 | 2021-06-18 | 株式会社Screenホールディングス | 浮上量算出装置、塗布装置および塗布方法 |
CN210073772U (zh) * | 2019-04-30 | 2020-02-14 | 上海隐冠半导体技术有限公司 | 运动装置 |
-
2019
- 2019-07-12 CN CN201921088503.3U patent/CN210073772U/zh active Active
- 2019-07-12 CN CN201910628196.1A patent/CN110176407B/zh active Active
-
2020
- 2020-04-23 KR KR1020217039162A patent/KR102677414B1/ko active Active
- 2020-04-23 US US17/594,766 patent/US12327752B2/en active Active
- 2020-04-23 WO PCT/CN2020/086368 patent/WO2020221096A1/zh active IP Right Grant
- 2020-04-23 JP JP2021564750A patent/JP7307980B2/ja active Active
- 2020-04-23 KR KR1020237042585A patent/KR102646040B1/ko active Active
-
2023
- 2023-03-15 JP JP2023040320A patent/JP7587297B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002323584A (ja) | 2001-02-22 | 2002-11-08 | Nikon Corp | アクチュエータ、ステージ、露光装置、デバイスの製造方法、及び免震装置 |
JP2012256516A (ja) | 2011-06-09 | 2012-12-27 | Hitachi High-Technologies Corp | ステージ装置およびステージ装置の制御方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110176407A (zh) | 2019-08-27 |
KR20220002620A (ko) | 2022-01-06 |
US20220216088A1 (en) | 2022-07-07 |
JP2023063474A (ja) | 2023-05-09 |
US12327752B2 (en) | 2025-06-10 |
CN210073772U (zh) | 2020-02-14 |
WO2020221096A1 (zh) | 2020-11-05 |
KR102677414B1 (ko) | 2024-06-24 |
KR20230169490A (ko) | 2023-12-15 |
JP7587297B2 (ja) | 2024-11-20 |
JP2022530826A (ja) | 2022-07-01 |
CN110176407B (zh) | 2024-05-24 |
KR102646040B1 (ko) | 2024-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7307980B2 (ja) | 運動装置 | |
JP2974535B2 (ja) | 位置決め装置 | |
CN101801817B (zh) | 具备集成到室壁上的电动机的基片加工装置 | |
JP4974118B2 (ja) | 多軸真空モータアセンブリ | |
US7997567B2 (en) | Stage apparatus | |
CN100573340C (zh) | 二自由度电机执行机构及相应的六自由度微动台 | |
CN103309176B (zh) | 一种带升降真空爪的六自由度微动台 | |
JP5387760B2 (ja) | θZ駆動装置およびステージ装置 | |
JP2011119320A (ja) | θZ駆動装置およびそれを備えたステージ装置、検査装置 | |
CN215177650U (zh) | 一种具有安装腔的微动台及运动装置 | |
CN102722089A (zh) | 一种无接触式粗精动叠层六自由度定位装置 | |
CN110587554A (zh) | 一种微动台及具有该微动台的运动装置 | |
CN218018407U (zh) | 运动台 | |
CN105509644B (zh) | 基于两个平面光栅的气浮台三自由度位移测量系统 | |
CN103105743B (zh) | 带平面衍射光栅测量的具有六自由度粗动台的掩膜台系统 | |
CN210678600U (zh) | 一种微动台及具有该微动台的运动装置 | |
CN116661260A (zh) | 微动台系统 | |
JP3728008B2 (ja) | 軸受装置および位置決め装置 | |
CN220271733U (zh) | 微动台系统 | |
KR102756973B1 (ko) | 척 회전부가 구비된 스테이지장치 | |
CN214428605U (zh) | 一种运动装置及工作平台 | |
CN102951607A (zh) | 磁悬浮式定位平台 | |
JP2010151322A (ja) | Xyステージ | |
JP5271966B2 (ja) | リニアモータを内蔵した立型xzスライド装置 | |
WO2025134501A1 (ja) | 駆動装置、位置決め装置、処理装置、デバイス製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211129 |
|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A529 Effective date: 20211129 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211129 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230315 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230620 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230626 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7307980 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |