JP7301172B2 - 蛍光体変換器の接合 - Google Patents
蛍光体変換器の接合 Download PDFInfo
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- JP7301172B2 JP7301172B2 JP2021571912A JP2021571912A JP7301172B2 JP 7301172 B2 JP7301172 B2 JP 7301172B2 JP 2021571912 A JP2021571912 A JP 2021571912A JP 2021571912 A JP2021571912 A JP 2021571912A JP 7301172 B2 JP7301172 B2 JP 7301172B2
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
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Description
粒子110のD50値は、例えば、0.2μmより大きく、かつ20μm未満であってよく、いくつかの実施形態では、粒子110のD50値は、例えば、1μmより大きく、かつ10μm未満であってよい。ここで、Dは粉体粒子の直径を表し、D50は累積直径が50%となる点(又は50%の粒子が通過するサイズ)を意味し、平均粒子サイズ又は中央径といってよい。
(Ba、Sr、Ca)AlSiN3:Eu及び(Ba、Sr、Ca)2Si5-xAlxOxN8-x:Eu:
これらの化合物では、ユウロピウム(Eu)は実質的に又は二価のみであり、示された二価カチオンの1つ以上を置換する。
M1-x-y-zZzAaBbCcDdEeN4-nOn:ESx、REyM=二価のMg(マグネシウム)、Mn(マンガン)、Zn(亜鉛)、及びZn(亜鉛)からなる群より選択され;Zは一価のNa(ナトリウム)、K(カリウム)及びRb(ルビジウム)からなる群より選択され;Aは、二価のMg(マグネシウム)、Mn(マンガン)、Zn(亜鉛)及びCd(カドミウム)からなる群より選択され、(さらにAは、特に二価のMg(マグネシウム)、Mn(マンガン)、及びZn(亜鉛)からなる群より選択され、さらにより特に、二価のMg(マグネシウム)、Mn(マンガン)からなる群より選択され);B=三価のB(ホウ素)、Al(アルミニウム)及びGa(ガリウム)からなる群より選択され、C=四価のSi(シリコン)、Ge(ゲルマニウム)、Ti(チタン)及びHf(ハフニウム)からなる群より選択され;Dは、一価のLi(リチウム)及びCu(銅)からなる群より選択され;Eは、P(元素蛍光体)、V(バナジウム)、Nb(ニオブ)及びTa(タンタル)からなる群より選択され;ESは、二価Eu(ユウロピウム)、Sm(サマリウム)及びイッテルビウムからなる群より選択され、特に、二価Eu及びSmからなる群より選択され;RE=は、三価のCe(セリウム)、Pr(プラセオジウム)、Nd(ネオジム)、Sm(サマリウム)、Eu(ユウロピウム)、Gd(ガドリニウム)、Tb(テルビウム)、Dy(ジスプロシウム)、Ho(ホルミウム)、Er(エルビウム)及びTm(ツリウム)からなる群より選択され;0≦x≦0.2;0≦y≦0.2;0<x+y≦0.4;0≦z<1;0≦n≦0.5;0≦a≦4(例えば、2≦a≦3等)、0≦b≦4、0≦c≦4;0≦d≦4;0≦e≦4;a+b+c+d+e=4;及び2a+3b+4c+d+5e=10-y-n+zである。特に、z≦0.9、例えばz≦0.5である。さらに、特にx+y+z≦0.2である。
AがSc、Y、Tb、Gd、及びLuからなる群より選択され、かつ、BがAl及びGaからなる群より選択されるA3B5O12:Ce3+である。好ましくは、Mは少なくとも1以上のY及びLuを含み、かつBは少なくともAlを含む。これらの物質の効率は最も優れてよい。特定の実施形態では、第2の発光物質は、A3B5O12:Ce3+の系の少なくとも2つの発光物質を含み、ここで、Aは、Y及びLuからなる群から選択され、Bは、Alからなる群から選択され、Y:Lu比は、少なくとも2つの発光物質について異なる。例えば、それらのうちの1つは、Y3Al5O12:Ce3+等のYに純粋に基づいていてよく、それらのうちの1つは、(Y0.5Lu0.5)3Al5O12:Ce3+等のY,Luに基づく系であってよい。ガーネットの実施形態としては、特にA3B5O12ガーネットがあげられ、ここで、Aは少なくともイットリウム又はルテチウムを含み、Bは少なくともアルミニウムを含む。当該ガーネットは、セリウム(Ce)、プラセオジウム(Pr)、又はセリウムとプラセオジウムと併用されてドープされてよいが、特にCeでドープされてよい。Bはアルミニウム(Al)を含んでよいが、Bは部分的にガリウム(Ga)及び/又はスカンジウム(Sc)及び/又はインジウム(In)を含んでよく、特にAlの約20%、特に約10%までのAl(すなわち、Bイオンは、実質的には、Alの90以上のモル%及びGa、Sc及びInの1つ又は複数のモル%の10以下のモル%からなる)を含んでよく、Bは、特にガリウムを約10%以下含んでよい。他の変形では、B及びOは、少なくとも部分的にSi及びNで置換されてよい。元素Aは、特に、イットリウム(Y)、ガドリニウム(Gd)、テルビウム(Tb)及びルテチウム(Lu)からなる群から選択されてよい。さらに、Gd及び/又はTbは、特に、Aの約20%までのみ存在する。特定の実施形態では、ガーネット発光物質は、(Y1-xLux)3Al5O12:Ceを含み、xは、0以上、1以下である。用語「:Ce」又は「:Ce3+」(又は類似の用語)は、発光物質中の金属イオンの一部(すなわち、ガーネット中の「M」イオンの一部)が、Ce(又は、用語(複数可)が「:Yb」のように、他の発光種)に置換することを示す。例えば、(Y1-xLux)3Al5O12:Ceと仮定すると、Y及び/又はLuの一部がCeに置換される。この表記は、当業者には公知である。CeはMの代わりに10%以下であり、Ce濃度は0.1~4%、特に0.1~2%(M比)であり、1%Ceと10%Yを仮定すると、(Y0.1Lu0.89Ce0.01)3Al5O12となる。ガーネット中のCeは、当業者に知られているように、実質的に又は単に3価の状態である。
赤色発光物質は、Mn4+(すなわち、A位置)でドープされたM2AX6系であり、Mは、Li、Na、K、Rb、Cs、NH4(特に少なくともカリウム(K)を含む)からなる群より選択される一価のカチオンを含み、Aは、Si、Ti、Ge、Sn、及びZrからなる群より選択される四価のカチオンを含み、特に少なくともシリコン(Si)を含み、Xは、F、Cl、Br、及びIからなる群より選択される一価のアニオンを含むが、少なくともFを含む。一例を挙げると、Mが少なくともKを含む場合、これは、種又は一価カチオンM(又はMのホスト格子位置)がKの>0%を100%まで含む実施形態を意味してよい。したがって、例えば、(K0.01Rb0.99)SiF6:Mn、RbKSiF6:Mn、及びK2SiF6:Mn等の実施形態が含まれる。
無機被覆140は、原子層堆積によって堆積されてよい。ALDはパルス化学気相成長(CVD)プロセスであり、サイクル当たり1原子層の物質を適用することで薄層が成長できる。当該プロセスは自己制限的であり、図1cに示すように、粒子上の被覆であっても極めて制御されコンフォーマルになる。
蛍光体変換器130は、蛍光体を含むいかなる自己支持体であってよい。例えば、蛍光体変換器本体130は、ガラス又はシリコーンマトリックス中に含まれ、プレート、小板又は他の形状に形成された蛍光体であってよい。蛍光体変換器本体130は、セラミックタイル又はプレートであるルミラミック(商標)であってよい。当該セラミックタイルは、粉末プレス/圧密後の焼結及びダイシング、粉砕又は研磨等の機械的処理の工程を含むセラミック処理によって製造される自立型多結晶物質である。焼結工程は、セラミック蛍光体粒子をともに融合し、多結晶体又はセラミックタイルを形成する。その全体が参照により本明細書に援用される特許文献1には、さらに、蛍光体変換器本体130として用いられうる様々なルミラミック(商標)が記載されている。
構成要素120は、基板、例えば、透明ガラス、サファイア又はシリコン基板、又は反射性基板であってよく、当該基板に結合された蛍光体変換器本体130を用いて、他の装置を形成することができる。
Claims (13)
- 以下の:
表面がある構成要素;
前記構成要素に接合され、かつ、前記構成要素の表面と向かい合う表面がある、蛍光体変換器本体;かつ
前記構成要素と前記蛍光体変換器本体との間の接合層;
を含む、装置であって、前記接合層は以下の:
前記構成要素の表面と前記蛍光体変換器本体の表面との間にあり、かつ、それらと接触する、複数の粒子;並びに
前記粒子の少なくとも一部、前記構成要素の表面の少なくとも一部、及び前記蛍光体変換器本体の表面の少なくとも一部にあり、かつそれらと接触する無機被覆;
を含み、
前記粒子は少なくとも1つの発光物質を含み、かつ、
前記構成要素の表面と前記蛍光体変換器本体の表面との間の距離が1μm~20μmである、
装置。 - 前記粒子のD50のサイズが、0.2μmより大きくかつ20μm未満である、請求項1記載の装置。
- 前記粒子が、SCASN及び258型蛍光体、SLA型蛍光体、ガーネット蛍光体、及びMn(V)ドープフッ化物からなる群から選択される少なくとも1つの発光物質を含む、請求項1に記載の装置。
- 前記発光物質が、前記蛍光体変換器本体に含まれる蛍光体と同一材料である、請求項3に記載の装置。
- 前記無機被覆が金属酸化物を含む、請求項1に記載の装置。
- 前記無機被覆が、Al2O3、SiO2、SnO2、CrO2、ZrO2、HfO2、Ta2O5、TiO2、ZnO、TiN、TaN、V2O5、PtO2、B2O3、CdSのうちの少なくとも1つを含む、請求項1に記載の装置。
- 前記無機被覆の厚さは、50nm~500nmである、請求項1に記載の装置。
- 前記蛍光体変換器本体は、セラミックタイルである、請求項1に記載の装置。
- 前記構成要素が発光ダイオードを含み、上部の表面がGaNである、請求項1に記載の装置。
- 以下の:
構成要素の表面上に複数の粒子を堆積させる工程;
前記構成要素の反対側の粒子上に蛍光体変換器本体を配置する工程;かつ
原子層堆積法を用いて、前記構成要素と前記蛍光体変換器本体との間の粒子上に無機被覆を堆積させる工程;
を含む、方法であって、ここで、
前記粒子は少なくとも1つの発光物質を含み、
前記構成要素の表面と前記蛍光体変換器本体の表面との間の距離が1μm~20μmである、
方法。 - 前記粒子のD50のサイズが、D50で0.2μmより長く20μm未満である、請求項10に記載の方法。
- 前記無機被覆の厚さが、50nm~500nmであり、かつ、Al2O3、SiO2、SnO2、CrO2、ZrO2、HfO2、Ta2O5、TiO2、ZnO、TiN、TaN、V2O5、PtO2、B2O3、又はCdSのうちの少なくとも1つを含む、請求項10に記載の方法。
- 前記粒子が、SCASN及び258型蛍光体、SLA型蛍光体、ガーネット蛍光体、及びMn(V)ドープフッ化物からなる群から選択される少なくとも1つの発光物質を含む、請求項10に記載の方法。
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| US12027651B2 (en) | 2021-01-06 | 2024-07-02 | Lumileds Llc | Lateral light collection and wavelength conversion for a light-emitting device |
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| US20200203567A1 (en) * | 2018-12-21 | 2020-06-25 | Lumileds Holding B.V. | Led package with increased contrast ratio |
| US11362243B2 (en) * | 2019-10-09 | 2022-06-14 | Lumileds Llc | Optical coupling layer to improve output flux in LEDs |
| US11177420B2 (en) * | 2019-10-09 | 2021-11-16 | Lumileds Llc | Optical coupling layer to improve output flux in LEDs |
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2020
- 2020-05-04 JP JP2021571912A patent/JP7301172B2/ja active Active
- 2020-05-04 CN CN202080041252.2A patent/CN114008800B/zh active Active
- 2020-05-04 KR KR1020227000046A patent/KR102411413B1/ko active Active
- 2020-05-04 WO PCT/EP2020/062258 patent/WO2020244857A1/en not_active Ceased
- 2020-05-04 EP EP20723123.4A patent/EP3980509B1/en active Active
- 2020-05-06 US US16/867,799 patent/US11257986B2/en active Active
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| US20120074835A1 (en) | 2010-09-27 | 2012-03-29 | Alan Piquette | LED Wavelength-Coverting Plate with Microlenses in Multiple Layers |
| JP2016100485A (ja) | 2014-11-21 | 2016-05-30 | 日亜化学工業株式会社 | 波長変換部材及びその製造方法ならびに発光装置 |
| US20180122993A1 (en) | 2016-11-03 | 2018-05-03 | Lumileds Llc | Inorganic bonded devices and structures |
| JP2019537058A (ja) | 2016-11-03 | 2019-12-19 | ルミレッズ リミテッド ライアビリティ カンパニー | 無機結合装置及び構造体 |
| US20190044038A1 (en) | 2017-08-03 | 2019-02-07 | Lumileds Llc | Method of manufacturing a light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020244857A1 (en) | 2020-12-10 |
| CN114008800B (zh) | 2023-03-24 |
| EP3980509B1 (en) | 2023-02-22 |
| CN114008800A (zh) | 2022-02-01 |
| US11257986B2 (en) | 2022-02-22 |
| EP3980509A1 (en) | 2022-04-13 |
| KR102411413B1 (ko) | 2022-06-22 |
| US20200388726A1 (en) | 2020-12-10 |
| KR20220006658A (ko) | 2022-01-17 |
| JP2022529746A (ja) | 2022-06-23 |
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