JP7299142B2 - Mounting machine - Google Patents

Description

The technology disclosed in this specification relates to a mounter.

Patent Literature 1 discloses a component mounter. This component mounter picks up an electronic component with a nozzle attached to a head, and mounts the picked-up electronic component on a circuit board.

JP 2008-218654 A

A component mounter mounts electronic components on a circuit board by operating a plurality of operating units. For this reason, the component mounter is provided with a plurality of power sources and a plurality of wirings for operating each of the plurality of operating units, and an abnormality occurs in the conduction state of any of the plurality of wirings. operation error may occur. In such a case, it is necessary to investigate the state of the wiring in order based on the operation error that has occurred, and many man-hours are required to identify the root cause of the operation error. The present specification provides a technology capable of efficiently identifying a location where an abnormality has occurred in a mounter.

A component mounter disclosed in this specification mounts electronic components on a circuit board. The mounter includes a plurality of power supplies, a plurality of operating units, a plurality of wirings, and an intermediate board. The plurality of wirings electrically connect each of the plurality of power sources and each of the plurality of operating units. The intermediate substrate is arranged between the plurality of power supplies and the plurality of operating units, and the plurality of wirings pass through the intermediate substrate. The intermediate board includes a plurality of output units corresponding to the plurality of wirings, and the output units output whether or not there is an abnormality in the conduction state of the corresponding wirings.

In the component mounter described above, each of the plurality of wirings electrically connecting each of the plurality of power sources and each of the plurality of operating sections passes through the intermediate board. That is, a plurality of wirings are consolidated on the intermediate board. The intermediate board is provided with a plurality of output sections corresponding to the plurality of wirings. That is, in the intermediate board, it is output whether or not there is an abnormality in the conduction state for all of the plurality of wirings. Therefore, when an operation error occurs in the mounter, it is possible to efficiently identify which wiring has an abnormal conduction state by checking each output section of the intermediate board. As described above, in the component mounter described above, it is possible to quickly identify the root cause of an operation error that has occurred in the component mounter without having to check the state of the wiring in order.

The figure which shows typically the structure of the component mounting machine which concerns on an Example. The figure which shows the structure of an intermediate board|substrate. FIG. 2 is a diagram showing the configuration of an electric system of the component mounter according to the embodiment; 4A and 4B are views showing captured images of the intermediate substrate in case A; FIG. 4A and 4B are views showing captured images of an intermediate substrate in case B; FIG.

In one embodiment of the present technology, a determination unit that determines whether or not an abnormality has occurred in at least one continuity state of the plurality of wirings; It may further include an image pickup section that picks up an image of the plurality of output sections provided on the intermediate board when the judgment section makes the judgment.

In such a configuration, the imaging unit images the intermediate board when an abnormality occurs in the conduction state of any one of the plurality of wirings. For this reason, for example, by acquiring in advance an image of the intermediate board when all of the plurality of wirings are in a normal conduction state, the image and the image of the intermediate board captured when an abnormality occurs can be combined. can be compared to determine whether or not an abnormality has occurred in any of the wirings among the plurality of wirings.

An embodiment of the present technology may further include a display unit arranged outside the component mounter and visible by a user. The display unit may display an image of the intermediate substrate when the imaging unit captures an image of the intermediate substrate.

With such a configuration, the user can confirm the captured image of the intermediate substrate when an abnormality occurs in the conduction state of any of the plurality of wirings. Therefore, the user can quickly grasp which wiring has an abnormality, that is, the root cause of an operation error that has occurred in the mounter.

In one embodiment of the present technology, each of the plurality of output units may be configured by an LED (light emitting diode).

(Example)
A component mounter 10 of an embodiment will be described below with reference to the drawings. A component mounter 10 is a device that mounts electronic components 4 on a circuit board 2 . The component mounter 10 is called a surface mounter or a chip mounter. Usually, the component mounter 10 is installed side by side with other board working machines such as a solder printer and a board inspection machine to form a series of mounting lines.

As shown in FIG. 1, the component mounter 10 includes a housing 11, a plurality of component feeders 12, a feeder holding section 14, a head 16, a head moving mechanism 19, a substrate conveying device 20, and an imaging unit 22. , an intermediate substrate 24 , a touch panel 30 , and a control section 32 .

Each component feeder 12 accommodates a plurality of electronic components 4 . The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic components 4 to the head 16 . In this embodiment, component feeder 12 is a tape feeder that accommodates a plurality of electronic components on a roll of tape. Each component feeder 12 has a reel 12a and a tape delivery mechanism 12b.

A long tape 13 accommodating a plurality of electronic components 4 at regular intervals is wound around the reel 12a. The tape 13 has a base tape 13a and a cover tape 13b, and the electronic component 4 is accommodated between the base tape 13a and the cover tape 13b.

The tape feeding mechanism 12b feeds out the tape 13 containing the electronic components 4 from the reel 12a by a constant amount. The feeding amount of the tape 13 by the tape feeding mechanism 12b is set according to the interval between the electronic components 4 accommodated in the tape 13. As shown in FIG. The electronic component 4 on the fed tape 13 is picked up by the head 16 at a predetermined suction position.

As the component mounter 10 continues to operate, the base tape 13a and the cover tape 13b from which the electronic components 4 have been taken out are discharged from the component feeder 12 as empty tapes. The empty base tape 13a is sent to the lower part of the mounter 10 through the duct 40. - 特許庁A cutter 42 is provided at the lower end of the duct 40 . The base tape 13 a sent to the lower part of the mounter 10 is cut to a predetermined length by a cutter 42 and stored in a collection basket 44 . The cover tape 13b, which has become an empty tape, is similarly cut to a predetermined length and then stored in the collection basket 44. As shown in FIG. The specific configuration of the component feeder 12 is not particularly limited. For example, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a bulk-type feeder that randomly accommodates a plurality of electronic components 4 in a container. It can be any of the feeders.

The feeder holding portion 14 has a plurality of slots, and the component feeders 12 are detachably installed in each of the plurality of slots. The feeder holding section 14 may be fixed to the component mounter 10 or may be detachable from the component mounter 10 .

The head 16 is configured such that the nozzle 6 for picking up the electronic component 4 can be attached and detached. A head 16 is fixed to a moving base 17 . The head 16 has an actuator (not shown) for moving the attached nozzle 6 in the Z direction (that is, in the vertical direction), and brings the nozzle 6 closer to and away from the component feeder 12 and the circuit board 2 . For example, the head 16 can pick up the electronic component 4 from the component feeder 12 with the nozzle 6 and mount the electronic component 4 picked up by the nozzle 6 onto the circuit board 2 . In addition, the head 16 is not limited to a configuration in which a single nozzle 6 is attachable and detachable, and a plurality of nozzles 6 may be attachable and detachable.

The head moving mechanism 19 is an XY robot that moves the moving base 17 in the X and Y directions (ie, horizontal direction). The head moving mechanism 19 is composed of guide rails that guide the moving base 17, actuators that move the moving base 17 along the guide rails, and the like. The head moving mechanism 19 is installed above the component feeder 12 and the substrate transfer device 20 .

The board transfer device 20 carries in, supports, and carries out the circuit board 2. The board transfer device 20 transfers the circuit board 2 in the X direction. In this embodiment, the board transfer device 20 includes a pair of belt conveyors, a support device (not shown) attached to the belt conveyors and supporting the circuit board 2 from below, and an actuator (not shown) for driving the belt conveyors. It is composed by

The imaging unit 22 is attached to the moving base 17 . Therefore, when the head 16 moves, the imaging unit 22 also moves together. The imaging unit 22 includes a camera support 22a and a camera 22b. The camera 22b is arranged on the side of the head. The camera 22b is arranged so that the imaging optical axis faces downward. In this embodiment, the camera 22b images the intermediate substrate 24. As shown in FIG. During mounting, the image pickup unit 22 picks up an image of, for example, a mark attached to the circuit board 2 and enables the electronic component 4 to be accurately mounted on the circuit board 2 based on the positional information.

Intermediate substrate 24 is positioned between component feeder 12 and substrate transporter 20 . However, the position where the intermediate substrate 24 is provided is not particularly limited, and it may be provided within a range that can be imaged by the camera 22b. A plurality of wirings of the electrical system of the mounter 10 pass through the intermediate board 24 . That is, the wiring of the electrical system of the component mounter 10 is consolidated on the intermediate board 24 . As shown in FIG. 2, the intermediate substrate 24 has a plurality of output sections 25. As shown in FIG. Each output unit 25 is configured by an LED. Each output unit 25 is connected to a plurality of wirings, which will be described later. As shown in FIG. 2, when the mounter 10 is operating normally (hereinafter referred to as "normal operation"), each output section 25 provided on the intermediate board 24 is lit (indicated by black coloring). there is

As shown in FIG. 1, the housing 11 accommodates a component mounting section (the head 16, the board transfer device 20, etc.). A cover 11 a is provided on the upper portion of the housing 11 . By opening the cover 11a, the inside of the housing 11 can be accessed from the outside. The cover 11a is configured to be switchable between a closed state in which the housing 11 is closed and an open state in which the housing 11 is opened. In this embodiment, switching between the open state and the closed state of the cover 11a is manually performed by the user. However, the switching mechanism for this state is not particularly limited, and may be configured to automatically switch by driving an actuator. The cover 11a can be switched between a locked state in which the cover 11a cannot be moved and an unlocked state in which the cover 11a can be moved by a lock mechanism 64 (see FIG. 3). An electromagnetic lock mechanism using a solenoid coil is used for the lock mechanism 64 . However, the configuration of the lock mechanism 64 is not particularly limited, and various known mechanisms may be used.

The touch panel 30 is a user interface that receives instructions and information from the user. The touch panel 30 also functions as a display section that provides various types of information to the user.

The control section 32 is configured to be able to communicate with each component feeder 12 , feeder holding section 14 , head 16 , moving base 17 , board transfer device 20 , imaging unit 22 and touch panel 30 . The control unit 32 executes processing for mounting the electronic component 4 on the circuit board 2 by controlling the respective units described above. The control section 32 also functions as a determination section that determines whether or not an operation error has occurred in each section of the mounter 10 .

FIG. 3 is a block diagram showing the configuration of the electrical system of the mounter 10. As shown in FIG. As shown in FIG. 3, the mounter 10 has a control box 52, a CPU box 54, and the like. The control box 52 and the CPU box 54 are stored in the control section 32 . The control box 52 and the CPU box 54 are connected to an external power supply (not shown), and power is supplied to the control box 52 and the CPU box 54 from the external power supply. 3, the mounter 10 includes a servo amplifier 56, a safety relay 58, an X-axis drive board 60, a Y-axis drive board 62, an I/O board 63, a lock mechanism 64, a start button 66, a cutter It has a drive coil 68 and a lock sensor 70 .

The servo amplifier 56 outputs signals for driving the XY robot to the X-axis drive board 60 and the Y-axis drive board 62, and supplies power to the motor (not shown) for driving the XY robot. The safety relay 58 is a contact relay having a forced guide contact structure. The X-axis driving board 60 and the Y-axis driving board 62 drive the XY robot (head moving mechanism 19 ) based on signals output from the servo amplifier 56 . The I/O board 63 is an input/output interface for signals output from the CPU box 54, signals output from the lock sensor 70, and the like. The start button 66 is a button for operating the component mounter 10 . When the user operates the start button 66, the mounter 10 starts operating. Cutter drive coil 68 generates electromagnetic force to drive cutter 42 . The lock sensor 70 detects whether the cover 11a is locked or unlocked when the cover 11a is closed.

As shown in FIG. 3, the control box 52 and the CPU box 54 are communicably connected to each other by wiring 110 through the intermediate board 24 . The servo amplifier 56 is connected to the control box 52 by wiring 112 through the intermediate board 24 . Safety relay 58 is connected to control box 52 by wiring 114 through intermediate board 24 . The X-axis drive board 60 and the Y-axis drive board 62 are connected to the servo amplifier 56 by wires 116 and 118 through the intermediate board 24 . The lock mechanism 64, the cutter drive coil 68, and the lock sensor 70 are connected to the CPU box 54 by wires 120, 122, and 124 via the intermediate board 24 and the I/O board 63, respectively. The start button 66 is connected to the CPU box 54 by wiring 126 via the intermediate board 24 . In the following, an example of identifying the root cause of an operation error in the mounter 10 of the present embodiment will be described for each case.

(Case A)
First, case A in which the intermediate board 24 is in the state shown in FIG. 4 will be described. In case A, an error has occurred in the operation of the cutter 42 . First, when the controller 32 determines that an error has occurred in the operation of the cutter 42, the intermediate substrate 24 is imaged by the camera 22b. The captured image of the intermediate substrate 24 is output to the touch panel 30 as shown in FIG. Here, an operation instruction for the cutter 42 is output from the CPU box 54 to the cutter drive coil 68 via the wiring 122 via the intermediate board 24 and the I/O board 63 . However, in this case, as shown in FIG. 4, the output section 25a corresponding to the wiring 122 is not lit (indicated by outline). That is, no signal for driving the cutter 42 is output from the CPU box 54 .

Here, in order for the cutter drive coil 68 to operate, the safety relay 58 must be on. A signal for switching the safety relay 58 from the OFF state to the ON state is output from the control box 52 . The signal is transmitted by wiring 114 via intermediate substrate 24 . However, when the captured image of the intermediate board 24 is compared with the normal state (FIG. 2), the output section 25b corresponding to the wiring 114 is not lit. That is, the safety relay 58 is off.

Here, in order to switch the safety relay 58 to the ON state, the cover 11a must be in the closed and locked state. In case A, the output section 25c corresponding to the wiring 124 connecting the lock sensor 70 and the CPU box 54 is not lit. That is, the lock sensor 70 detects that the cover 11a is in the unlocked state. On the other hand, when confirming the output portion 25d corresponding to the wiring 122, a signal for switching the cover 11a from the unlocked state to the locked state is transmitted from the CPU box 54 through the intermediate substrate 24 and the I/O substrate 63 to the wiring 122. It can be seen that it is output to mechanism 64 (that is, it is illuminated). That is, the instruction for locking the cover 11a is normally output.

As described above, in this case, it can be understood that the error in the operation of the cutter 42 is caused by the defect of the lock mechanism 64 of the cover 11a.

(Case B)
Next, case B in which the intermediate board 24 is in the state shown in FIG. 5 will be described. In case B, even though the start button 66 of the mounter 10 has been operated, the mounter 10 does not operate. First, when the controller 32 determines that the situation has occurred, the intermediate substrate 24 is imaged by the camera 22b. The captured image of the intermediate substrate 24 is output to the touch panel 30 as shown in FIG. Here, when the start button 66 is operated, a signal for operating the mounter 10 is input from the start button 66 to the CPU box 54 via the wiring 126 via the intermediate board 24 . In the captured image, the output section 25e corresponding to the wiring 126 is lit. That is, the signal for operating the mounter 10 is normally input to the CPU box 54 .

When the start button 66 is operated, a signal for switching the safety relay 58 from off to on is output. A signal for switching the safety relay 58 from the OFF state to the ON state is transmitted by the wiring 114 from the control box 52 through the intermediate board 24 as in case A. In this case, the output section 25b corresponding to the wiring 114 is lit. That is, the safety relay 58 is switched to the ON state.

Further, when the start button 66 is operated, a signal for switching the power supply of the servo amplifier 56 from off to on is output. A signal for turning on the power supply of the servo amplifier 56 is output from the control box 52 to the servo amplifier 56 via the wiring 112 via the intermediate board 24 . In this case, the output section 25f corresponding to the wiring 112 is lit. That is, the servo amplifier 56 is switched to the ON state.

When the servo amplifier 56 is powered on, signals for driving the XY robot are sent from the servo amplifier 56 through the intermediate board 24 to the X-axis drive board 60 via the wiring 116 and to the Y-axis drive board 62 via the wiring 118 . , respectively. However, when the captured image of the intermediate board 24 is compared with the normal state (FIG. 2), although the output section 25g corresponding to the wiring 116 is lit, the output section 25h corresponding to the wiring 118 is not lit. That is, it can be seen that the signal is not normally input to the Y-axis drive board 62 .

As described above, in this case, the reason why the component mounter 10 does not operate despite the operation of the start button 66 is that the wiring 118 connected to the Y-axis drive board 62 is defective. can be grasped.

As in the cases described above, in this embodiment, when an operation error occurs in the component mounter 10, it is not necessary to check the state of each wiring in turn, and each output section of the intermediate board 24 is checked. By confirming the output state of 25, the root cause of the operation error can be identified early.

(correspondence relationship)
The control box 52 and the CPU box 54 are examples of the "power supply". The servo amplifier 56, the safety relay 58, the X-axis drive board 60, the Y-axis drive board 62, the lock mechanism 64, and the cutter drive coil 68 are examples of the "operating section." The control unit 32 is an example of a "judgment unit". The camera 22b is an example of the "imaging unit". The touch panel 30 is an example of the "display section".

In the above-described embodiment, two cases have been described as operation errors that occur in the mounter 10 . However, the technique disclosed in this specification can identify the root cause of various operation errors by passing each wiring of the electrical system of the mounter 10 through the intermediate board.

Further, in the above-described embodiment, the touch panel 30 is caused to display an image of the intermediate substrate 24 . However, an image of the intermediate substrate 24 in the normal state may be obtained in advance, and the image and the image of the intermediate substrate 24 in the event of an operation error may be automatically compared by the control unit 32 . In this case, the comparison result (for example, the root cause of the operation error identified by the control unit 32) may be displayed on the touch panel 30. FIG. Furthermore, the touch panel 30 may display an operation procedure for solving the identified operation error.

Further, in the above-described embodiment, when it is determined that an operation error has occurred in the component mounter 10, the intermediate board 24 is imaged by the camera 22b. However, the timing of imaging the intermediate board 24 by the camera 22b is not limited to this. For example, the camera 22b may image the intermediate board 24 at predetermined time intervals while the mounter 10 is in operation. Further, images of the intermediate substrate 24 captured at the predetermined time intervals may be displayed on the touch panel 30 . With such a configuration, it is possible to periodically check the operation status of the component mounter 10, and for example, to detect in advance that an abnormality has occurred in the wiring connected to the operating section that is not operated during the mounting work. can grasp.

The technical elements described in this specification or in the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims as of the filing. In addition, the techniques exemplified in this specification or drawings achieve multiple purposes at the same time, and achieving one of them has technical utility in itself.

2: Circuit board 4: Electronic component 6: Nozzle 10: Component mounter 11: Housing 11a: Cover 12: Component feeder 13: Tape 14: Feeder holder 16: Head 17: Moving base 19: Head moving mechanism 20: Board transfer Device 22: Imaging unit 22a: Camera support section 22b: Camera 24: Intermediate board 25: Output section 30: Touch panel 32: Control section 42: Cutter 44: Collection basket 52: Control box 54: CPU box 56: Servo amplifier 58: Safety Relay 60: X-axis drive board 62: Y-axis drive board 63: I/O board 64: Lock mechanism 66: Start button 68: Cutter drive coil 70: Lock sensor

Claims (5)

A component mounter for mounting electronic components on a circuit board,
multiple power supplies;
a plurality of moving parts;
a plurality of wires electrically connecting each of the plurality of power sources and each of the plurality of operating units;
An intermediate substrate disposed between the plurality of power supplies and the plurality of operating units, through which the plurality of wirings pass,
the intermediate substrate includes a plurality of output units corresponding to the plurality of wirings,
The output unit includes the intermediate substrate that outputs whether or not there is an abnormality in the conduction state of the corresponding wiring.
Component mounting machine. 2. The component mounter according to claim 1, further comprising an imaging section for imaging said plurality of output sections provided on said intermediate board. further comprising a determination unit that determines whether or not an abnormality has occurred in the conduction state of at least one of the plurality of wirings;
3. The component mounter according to claim 2, wherein said imaging section images said plurality of output sections when said determination section determines that at least one of said plurality of wirings is in an abnormal state of continuity. further comprising a display unit arranged outside the component mounter and visible to the user,
4. The component mounter according to claim 2, wherein said display section displays an image of said intermediate board when said intermediate board is imaged by said imaging section. 5. The component mounter according to claim 1, wherein each of said plurality of output units is composed of an LED (light emitting diode).

Images