JP7292186B2 - Drilling device and drilling method - Google Patents

Description

The present invention relates to a drilling apparatus and a drilling method for drilling holes in a substrate such as a printed circuit board placed on a processing table.

2. Description of the Related Art In a drilling apparatus for drilling a substrate, if the substrate placed on the processing table has a bent and raised portion, it becomes difficult to drill a hole with an accurate depth when machining a blind hole.
This phenomenon will be schematically described below with reference to FIG. In FIG. 7, P is the contact point when the drill 30 is about to drill a blind hole in the substrate 50 placed on the processing table 40, and H is electrically detected when the drill 30 contacts the contact point P. is the surface height of the substrate 50 to be measured. This surface height H is the height when the substrate 50 is not under pressure from above.
The substrate here includes at least the original printed circuit board to be processed, and may include the upper plate placed thereon and the lower plate interposed between the processing table. The same applies to the explanation of The upper plate is made of a conductive material to prevent the occurrence of burrs and the like, and the lower plate is made of a resin material to prevent the drill from penetrating through the printed circuit board and coming into contact with the processing table.

When drilling a blind hole, the surface height H is detected each time a hole is drilled, and drilling is performed up to a point V with a predetermined depth L1 based on the detected surface height H.
During normal machining, after the drill 30 contacts the contact point P of the substrate 50, it is applied with a predetermined pressure and descends. Since 50 receives pressure from the drill 30, it sinks toward the machining table 40 as indicated by the dotted line, and the contact point P sinks by L3.
Since the surface height H is detected when the drill 30 contacts the contact point P, if the contact point P sinks by L3, the machining depth of the blind hole will be L2, which is shorter by the length L3.

JP 2016-16458 A

As described above, if the substrate has a bent and raised portion, it becomes difficult to drill a hole with an accurate depth when machining a blind hole.
As a technique for dealing with variations in substrate thickness, for example, as disclosed in Patent Document 1, there is a technique in which the retraction position of the drill is changed for each processing position, but the substrate bends and rises. Case issues are not considered.
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to improve processing accuracy when drilling blind holes in a substrate that has a portion that bends and rises.

In order to solve the above problems, a representative drill processing apparatus among the inventions disclosed in the present application includes a substrate pressing portion for pressing a substrate placed on a processing table, and a drilling portion for drilling a hole in the substrate. In a drilling apparatus comprising: a drill contact detection section that detects contact of a drill with the surface of the board; and a control section that controls drilling of the board by the drill, the control section controls a first operation of detecting a first surface height of the substrate at a specific position of the substrate based on a detection signal from the drill contact detection unit while the substrate is being pressed; is not pressed, a second operation is performed to detect the second surface height of the substrate at or around the specific position based on the detection signal from the drill contact detection unit, and the first surface height and The method is characterized in that when the second surface height difference exceeds a predetermined value, control is performed so that at least a region including the specific position is not processed.

In a typical drilling method disclosed in the present application, a substrate placed on a processing table is pressed by a substrate pressing portion, and a drill for drilling a hole in the substrate is brought into contact with the surface of the substrate by a drill contact detection portion. In the drilling method for detecting that the drilling is performed, the first surface of the substrate is detected at a specific position of the substrate based on the detection signal from the drill contact detection unit while the substrate is pressed by the substrate pressing unit. a first step of detecting a height; and a second surface height of the substrate at or around the specific position based on a detection signal from the drill contact detection unit while the substrate is not pressed by the substrate pressing unit. a second step of detecting the height of the surface; and a second step of controlling not to process an area including at least the specific position when the difference between the first surface height and the second surface height exceeds a predetermined value. 3 steps .

The typical features of the invention disclosed in the present application are as described above, but features not described here are applied to the embodiments described below, and are also included in the scope of claims. As shown.

Advantageous Effects of Invention According to the present invention, it is possible to improve processing accuracy when drilling a blind hole in a substrate that has a portion that bends and rises.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the drilling apparatus used as Example 1 of this invention. FIG. 4 is a diagram for explaining divisional areas set on a substrate in Example 1 of the present invention; It is a figure which shows the state in which the drill protruded from the pressure foot. 4 is a flow chart in a drilling apparatus according to first and second embodiments of the present invention; 1 is a flow chart in a drilling device that is Embodiment 1 of the present invention. 6 is a flow chart in a drilling apparatus that is Embodiment 2 of the present invention. It is a figure for demonstrating typically the phenomenon in a prior art.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
Embodiment 1 FIG. 1 is a diagram showing the configuration of a drilling apparatus that is Embodiment 1 of the present invention. Each component and connection line in FIG. 1 show what is considered to be necessary mainly for explaining this embodiment, and do not show everything necessary as a drilling apparatus.
In FIG. 1, reference numeral 1 denotes a substrate including at least a printed circuit board to be drilled, and a conductor layer is present on the surface of this substrate 1 . As this conductor layer, the above-described upper plate may be used as a conductor. Reference numeral 2 denotes a processing table on which a substrate 1 is placed; The spindle unit 3 is vertically driven by a spindle vertical drive 6 .

The processing table 2 is horizontally driven by a table drive unit 7 and positioned so that the drill 4 faces the position where the substrate 1 is to be drilled.
A pressure foot 8 for pressing the substrate 1 during drilling is engaged with the lower side of the spindle 5 via a cylinder 9 . The spindle unit 3 and the pressure foot 8 are vertically engaged with each other with a predetermined distance therebetween, and when the spindle unit 3 descends, it descends together with the spindle unit 3 until the pressure foot 8 contacts the surface of the substrate 1. . After the pressure foot 8 abuts on the surface of the substrate 1, the pressure foot 8 stays at that position and only the spindle unit 3 descends independently so that the drill 4 can drill a hole. When the spindle unit 3 is lifted after boring, the pressure foot 8 is also lifted from a certain position.

Reference numeral 13 denotes a drill contact detection section (hereinafter referred to as D detection section) that detects the surface height of the substrate 1 by detecting that the tip of the drill 4 descends and contacts the substrate 1 . The D detection unit 13 is, for example, one that utilizes the axial voltage generated in the rotor shaft in the spindle 5 as known in Japanese Patent Application Laid-Open No. 2003-1548, or one that is known in Japanese Patent Application Laid-Open No. 2015-223685. The change in capacitance between the drill 4 and the ground when the tip of the drill 4 contacts the conductor layer of the substrate 1 is utilized. A surface detection signal DS is output from the D detector 13 when the tip of the drill 4 contacts the substrate 1 .
When drilling a blind hole, the height of the tip of the drill 4 when this surface detection signal DS is output corresponds to H in FIG. .

Reference numeral 15 denotes an overall control unit that controls the entire drilling apparatus by controlling the rotation of the drill 4, etc., and includes several components inside.
Reference numeral 16 denotes a spindle drive control section for controlling the spindle vertical drive section 6 while recognizing the current height of the tip of the drill 4 based on feed position information from the spindle vertical drive section 6; is a table driving control unit that controls the table driving unit 7 while recognizing the two-dimensional position of the processing table 2 by means of .

On the surface of the substrate 1 here, as shown in FIG. 2, a plurality of partitioned areas S1 to S9 of equal size are logically set. Among the segmented regions S1 to S9, the segmented regions S1 to S8 are located along the edges of the substrate 1, and the segmented region S9 is located in the central portion. A surface height detection point Z for detecting the surface height is set at the center position of each of the segmented regions S1 to S9.
Returning to FIG. 1, the overall control unit 15 stores information specifying the machining position, information specifying the segmented regions S1 to S9, coordinate information specifying the surface height detection point Z, and the like.
Reference numerals 18 and 19 denote a height detection storage unit A for storing the surface height of the substrate 1 based on the feed position information from the spindle vertical drive unit 6 when the D detection unit 13 detects the surface detection signal DS, respectively. This is the height detection storage unit B. FIG. Reference numeral 20 denotes a processing control information storage unit for storing information indicating whether or not the object is to be processed.
The operations of the height detection storage unit A18, the height detection storage unit B19, and the processing control information storage unit 20 will be described later, but each has a data storage area corresponding to each of the segmented areas S1 to S9. .

The overall control unit 15 has control functions other than those described here, and is also connected to blocks not shown. The overall control unit 15 is configured, for example, mainly by a program-controlled processing device, and each constituent element and connection line therein include logical ones. Also, part of each component may be provided separately from the overall control unit 15 .
When starting to process the substrate 1, the overall control unit 15 performs control so that the following operations are performed according to the flow charts shown in FIGS.

In the initial state of the drilling device, the tip of the drill 4 is at a higher position than the retracted position during normal drilling. First, one sectioned area of the substrate 1 (in the following description, for example, the sectioned area S1 at the edge) is designated (step 41). Next, the machining table 2 is positioned so that the surface height detection point Z can be machined, and the spindle unit 3 is lowered from the state shown in FIG. 1 in the same manner as during normal drilling (step 42). As a result, the pressure foot 8 first comes into contact with the substrate 1 to hold it down, and then the tip of the drill 4 comes into contact with the surface height detection point Z of the substrate 1, and the surface detection signal DS is output. The surface height of the substrate 1 at this time is written in the data storage area corresponding to the partitioned area S1 in the height detection storage section A18 (step 43).
The surface height of the substrate 1 detected by pressing the substrate 1 with the pressure foot 8 in this manner will be referred to as a surface height A hereinafter.

Next, while the machining table 2 remains at the same position as before, the spindle unit 3 is raised to bring the tip of the drill 4 to the same height as the initial state (step 44). In this state, the cylinder 9 is actuated to retract the pressure foot 8 so that the drill 4 protrudes from the pressure foot 8 as shown in FIG. 3, after which the spindle unit 3 is lowered (step 45 ).
As a result, when the tip of the drill 4 touches the surface height detection point Z of the substrate 1, the surface detection signal DS is output, and the surface height of the substrate 1 at this time corresponds to the divided area S1 in the height detection storage unit B19. (step 46).
The height of the substrate 1 detected when the tip of the drill 4 comes into contact with the substrate 1 without pressing the substrate 1 with the pressure foot 8 is hereinafter referred to as the surface height B. FIG.

Thereafter, the difference C is calculated from the surface height A stored in the height detection storage unit A18 and the surface height B stored in the height detection storage unit B19, and the divided area S1 in the processing control information storage unit 20 is calculated. (step 47).
During normal processing, the pressure of the pressure foot 8 against the substrate 1 is higher than the pressure applied by the drill 4, and even if the substrate 1 is raised, it is corrected and sinks toward the processing table 2. - 特許庁
A large difference C means that the degree of sinking explained with reference to FIG.
Therefore, the difference C, which is the largest allowable error, is experimentally obtained and set as a predetermined value, and it is determined whether or not the difference C calculated in step 47 is equal to or less than the predetermined value (step 48).

In step 48, if the difference C is equal to or less than the predetermined value (YES), the error is permissible, and the processing target flag F1 indicating that the processing is to be performed corresponds to the segmented region S1 in the processing control information storage unit 20. Write to the data storage area (step 49). If the difference C exceeds a predetermined value (NO), an unacceptable error is generated, and a non-processing flag F2 indicating that the difference C is not to be processed is set to the data corresponding to the segmented region S1 in the processing control information storage unit 20. Write to storage area (step 50).

After the above operations are completed, according to steps 51 and 52, the difference C is similarly checked for each of the remaining segmented regions S2 to S9, and a flag indicating whether or not to be processed is stored in the processing control information storage unit. The data is stored in data storage areas corresponding to each of the 20 segmented areas S2 to S9.
After the operation according to the flow charts of FIGS. 4 and 5 is completed, the overall control unit 15 checks the contents of the processing control information storage unit 20 in advance before starting the processing of the substrate 1, and indicates that the processing is to be processed. The order of processing is determined for the segmented regions in which the target flag F1 is stored, and control is performed so that the processing is performed sequentially.

According to the first embodiment described above, when the processing accuracy cannot be ensured due to the presence of a bent and raised region on the substrate 1, only the regions where the processing accuracy can be ensured are processed, and the region where the processing accuracy cannot be ensured is not processed. As a result, it is possible to improve the machining accuracy and eliminate wasted machining time in areas where the machining accuracy cannot be ensured in the first place.

In the first embodiment, a segmented region having a difference C exceeding a predetermined value is not processed. 2 is described below. Here, only points different from the first embodiment will be described.
The configuration of the drilling device is the same as in FIG.
When starting to process the substrate 1, the overall control unit 15 performs control so that the following operations are performed according to the flow charts shown in FIGS.

In Example 2, as in Example 1, the same operations as steps 41 to 48 in FIG. 4 are performed.
In step 48, if the difference C is equal to or smaller than the predetermined value (YES), a correction unnecessary flag F3 indicating that correction of the processing depth is unnecessary is set in the data storage area corresponding to the partitioned area S1 in the processing control information storage unit 20. (step 61).
In step 48, if the difference C exceeds a predetermined value (NO), a correction value α for the depth to be machined is obtained based on the difference C (step 62). The correction value α in this case will be explained in FIG. 7, when the contact point P sinks due to the pressure from the drill 30 and the point V at the original machining depth L1 is lowered to the point W at the machining depth L4. , is an addition value for obtaining the machining depth L4 from the original machining depth L1.
The relationship between the correction value α and the difference C may be obtained in advance by experiments or the like, registered in a table, and obtained based on the difference C using this table. Alternatively, a correlation function between the difference C and the correction value α may be obtained in advance by experiments or the like, and the difference C may be obtained by a calculation formula.
In the next step 63, a correction required flag F4 indicating that the machining depth needs to be corrected and the correction value α obtained as described above are stored in a data storage area corresponding to the segmented area S1 in the machining control information storage unit 20. Write.

After the above operations are completed, according to steps 64 and 65, each of the other remaining segmented regions S2 to S9 is similarly examined to determine whether correction of the machining depth is necessary. , and the correction required flag F4 and the correction value α for the segmented region requiring correction of the machining depth correspond to the segmented region of the machining control information storage unit 20. stored in the data storage area.
After completing the operations according to the flow charts of FIGS. 4 and 6, the overall control unit 15 determines the processing order of the segmented regions S1 to S9, and performs control so that the processing is performed sequentially. In this case, immediately before processing each segmented region, the storage area corresponding to the segmented region in the processing control information storage unit 20 is checked, and if the correction required flag F4 is written, the The correction value α is added to the existing machining depth L1 for machining.

According to the second embodiment described above, when the processing accuracy cannot be ensured due to the presence of a bent and raised region on the substrate, the processing depth is corrected to ensure the processing accuracy. can be eliminated.

Although the present invention has been specifically described above based on the embodiments, it goes without saying that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. , including various modifications.
For example, in the first embodiment, only the segmented regions having the difference C less than or equal to the predetermined value are processed, and the segmented regions having the difference C exceeding the predetermined value are not processed. If even one segmented area exists, the substrate may be regarded as a defective product and the entire substrate may not be processed.

In the above embodiment, the number of segmented areas is nine, but the number of segmented areas may be reduced or increased, gaps may be provided between segmented areas, and the size of each segmented area may not be the same. In short, it may be determined according to the state of the protrusion of the substrate 1 and the like, and for example, it may be limited to the four corners and the central portion of the substrate 1 .
Furthermore, although the surface heights A and B in each segmented region are detected at the same surface height detection point Z, they do not necessarily have to be exactly at the same position, and may be detected as necessary depending on the state of the bulging of the substrate. It may be deviated, and may be around the surface height detection point Z.

Further, in the above embodiment, only the center position is set as a representative for detecting the surface height of each of the segmented regions S1 to S9, but the center position does not necessarily have to be used.
Further, by increasing the number of surface height detection positions in each of the segmented regions S1 to S9, even one surface height detection position having a difference C exceeding a predetermined value exists, or the average value of the difference C is less than a predetermined value. If the value exceeds the value, the segmented area may not be processed in the first embodiment, or the processed depth may be corrected in the segmented area in the second embodiment.

In the above embodiment, the height detection storage section A18, the height detection storage section B19, and the processing control information storage section 20 are separate storage sections, but they may be integrated into one storage section. In this case, in the storage area corresponding to each of the segmented areas S1 to S9, in the first embodiment, the surface height A, the surface height B, and the processing target flag F1, or the surface height A, the surface height B, and the processing A non-target flag F2 may be stored. In the second embodiment, the surface height A, the surface height B, and the correction unnecessary flag F3, or the surface height A, the surface height B, the correction necessary flag F4, and the correction value α may be stored.

Further, in the second embodiment, all the segmented regions in which the difference C exceeds the predetermined value are processed by correcting the processing depth, but it is not always possible to obtain an appropriate correction value α in advance. Therefore, it is also possible to classify divided regions in which the difference C exceeds a predetermined value into two types, that is, regions that can be corrected and regions that cannot be corrected according to the magnitude of the difference C, and to correct only the regions that can be corrected.

1: substrate, 2: processing table, 3: spindle unit, 4: drill,
5: spindle, 6: spindle vertical drive, 7: table drive,
8: pressure foot, 9: cylinder, 13: drill contact detector,
15: overall control unit, 16: spindle drive control unit, 17: table drive control unit,
18: height detection storage unit A, 19: height detection storage unit B, 20: processing control information storage unit,
S1 to S9: division area, Z: surface height detection point

Claims (7)

A substrate pressing portion for pressing a substrate placed on a processing table, a drill contact detection portion for detecting contact of a drill for making a hole in the substrate with the surface of the substrate, and the substrate by the drill. and a control unit for controlling drilling, wherein the control unit controls a specific position of the substrate based on a detection signal from the drill contact detection unit while the substrate is pressed by the substrate pressing unit. a first operation of detecting a first surface height of the substrate with the substrate pressing portion, and in a state where the substrate is not pressed by the substrate pressing portion, based on the detection signal from the drill contact detection portion, at or around the specific position performing a second operation of detecting a second surface height of the substrate, and detecting a region including at least the specific position when a difference between the first surface height and the second surface height exceeds a predetermined value; A drilling device characterized in that it is controlled so as not to be processed. 2. The drilling apparatus according to claim 1, wherein said specific positions are set within areas along the edge of said substrate and within a central area. 3. The drilling apparatus according to claim 1, wherein a plurality of said specific positions are set in said region, and when the average value of said differences at each exceeds said predetermined value, said region includes at least said specific positions. A drilling device characterized in that it is controlled so as not to be processed. A substrate pressing portion for pressing a substrate placed on a processing table, a drill contact detection portion for detecting contact of a drill for making a hole in the substrate with the surface of the substrate, and the substrate by the drill. and a control unit for controlling drilling, wherein the control unit controls a specific position of the substrate based on a detection signal from the drill contact detection unit while the substrate is pressed by the substrate pressing unit. a first operation of detecting a first surface height of the substrate with the substrate pressing portion, and in a state where the substrate is not pressed by the substrate pressing portion, based on the detection signal from the drill contact detection portion, at or around the specific position performing a second operation of detecting a second surface height of the substrate, and when a difference between the first surface height and the second surface height exceeds a predetermined value, in a region including at least the specific position A drilling apparatus characterized in that control is performed so that drilling is performed by correcting a predetermined drilling depth based on the difference. 5. The drilling apparatus according to claim 4, wherein said specific position is set within a region along the edge of said substrate and a region located in the central portion of said substrate. A drilling method, wherein a substrate pressing unit presses a substrate placed on a processing table, and a drill contact detection unit detects that a drill for drilling a hole in the substrate comes into contact with the surface of the substrate. a first step of detecting a first surface height of the substrate at a specific position of the substrate based on a detection signal from the drill contact detection unit while the substrate is pressed by the substrate pressing unit; a second step of detecting a second surface height of the substrate at or around the specific position based on the detection signal from the drill contact detection unit in a state where the substrate is not pressed by the unit; and a third step of controlling a region including at least the specific position not to be processed when the difference between the surface height and the second surface height exceeds a predetermined value. . A drilling method, wherein a substrate pressing unit presses a substrate placed on a processing table, and a drill contact detection unit detects that a drill for drilling a hole in the substrate comes into contact with the surface of the substrate. a first step of detecting a first surface height of the substrate at a specific position of the substrate based on a detection signal from the drill contact detection unit while the substrate is pressed by the substrate pressing unit; a second step of detecting a second surface height of the substrate at or around the specific position based on the detection signal from the drill contact detection unit in a state where the substrate is not pressed by the unit; When the difference between the surface height and the second surface height exceeds a predetermined value, control is performed so that processing is performed by correcting a predetermined drilling depth based on the difference in at least a region including the specific position. A drilling method characterized by comprising a third step of:

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