JP7257675B2 - Method for dividing brittle material substrate - Google Patents

Description

TECHNICAL FIELD The present invention relates to singulation by dividing a brittle material substrate, and more particularly to a method of obtaining two kinds of pieces having different sizes by scribing and breaking.

As a method of singulating (chipping) to obtain a large number of individual pieces (chips) by dividing a brittle material substrate at a plurality of locations, scribe lines are formed in advance at respective planned division positions on one main surface of the substrate. After performing the scribing process, a break bar is brought into contact with the position to be cut from the other main surface side, and the break bar is further pushed in, thereby extending the crack from the scribe line in the thickness direction of the substrate. is already known (see Patent Document 1, for example).

Such a method is, for example, a case of obtaining device chips (individual pieces) by dividing a device mother substrate in which a glass wafer is used as a base substrate and a predetermined device structure is formed on the base substrate using resin, metal, or the like. Applies to That is, a large number of device chips can be obtained by dividing a device mother substrate, which is produced by two-dimensionally repeating device structure patterns on a glass wafer, by the above-described scribing process and breaking process.

JP 2016-30364 A

In the device mother substrate described above, a region (large size region) having a planar size larger than a device chip region (normal size region) having a device structure, such as a TEG, is formed at one or more locations. may be Even in such a case, there is a need to obtain device chips by suitably performing individualization by scribing and breaking.

However, in general, the length of the cutting edge (blade length) of the break bar used in the breaking process is larger than the size of the object to be divided so that the object can be divided between any two points on the circumference of the object to be divided. Therefore, for example, when trying to divide a device mother board in which a large-sized area and a normal-sized area coexist as described above, depending on the layout of both areas, a break bar may apply to the large-sized area that does not need to be divided. contact may occur. In such a case, there is a possibility that the crack may extend to the large-size region, further extend to other normal-size regions, and be broken at a location different from the original.

It is conceivable to suppress the occurrence of such cracks by devising the cutting order, but the relative movement between the break bar and the device mother board becomes complicated, which reduces productivity and causes misalignment of the cutting points. Unfavorable because it increases the probability. In the first place, depending on the positional relationship between the large-size area and the normal-size area, it may be inevitable that the break bar comes into contact with the large-size area.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for suitably dividing a brittle material substrate into individual pieces of different sizes.

In order to solve the above problems, the first aspect of the invention divides a brittle material substrate into small-sized pieces and large-sized pieces larger than the small-sized pieces along predetermined cutting positions. In the dividing method, on one main surface side of the brittle material substrate, at the planned dividing positions defined around all the regions that will become the small-sized individual pieces and the large-sized individual pieces after division. a scribing step for forming scribe lines along the brittle material substrate; a breaking step of dividing the brittle material substrate into the small-sized pieces and the large-sized pieces by pushing in all of the break bar abutting positions, wherein the breaking step includes: (a) the cutting edge angle θ of the break bar is 50° to 90°, (b) the curvature radius R of the cutting edge tip of the break bar is 100 μm to 300 μm, (c) the pushing amount is 60 μm to 100 μm, (d) A descending speed of the break bar when pushing the break bar into the substrate is 10 mm/s to 100 mm/s.

According to a second aspect of the invention, there is provided the method for cutting a brittle material substrate according to the first aspect, wherein in the breaking step, after the breaking operation for one of the break bar abutment positions is completed, the next break bar abuts. The shift feed of the substrate for performing the breaking operation with respect to the contact position is performed only in one direction in which the break bar contact positions are arranged at a predetermined pitch.

The invention of claim 3 is the method for dividing a brittle material substrate according to claim 1 or claim 2, wherein a small-size piece is provided on the brittle material substrate in a region that will become the small-size piece after division. A pattern consisting of a size pattern and a large size pattern provided in the region to be the large size piece is provided, and in the scribing step, the brittle material substrate exposed from between the patterns is subjected to , forming the scribe line.

According to the inventions of claims 1 to 3, a brittle material substrate can be suitably divided into small-sized pieces and large-sized pieces.

In particular, according to the second aspect of the invention, the brittle material substrate can be divided into small-sized pieces and large-sized pieces with excellent versatility and productivity.

2 is a schematic plan view of a mother substrate 10; FIG. FIG. 3 is a diagram showing a state of a partial region RE on the mother substrate 10; 4A and 4B are diagrams schematically showing how a mother substrate 10 is subjected to a scribing process; FIG. FIG. 4 is a diagram schematically showing how a mother substrate 10 is subjected to a breaking process; 2 is a plan view of a partial region RE of a mother substrate 10 subjected to a breaking process, viewed from the base substrate 1 side; FIG. FIG. 10 is a plan view showing the state of the partial region RE while the mother substrate 10 is being subjected to the breaking process; FIG. 10 is a plan view showing the partial region RE after the mother substrate 10 has been successfully subjected to the breaking process;

<Target of division>
FIG. 1 is a schematic plan view of a mother substrate 10 to be cut according to this embodiment. FIG. 2 is a diagram showing a state of a partial region RE on the mother substrate 10 shown in FIG. In FIG. 1, the direction along the orientation flat 10f and the direction perpendicular to the orientation flat 10f in one main surface of the mother substrate 10 are defined as the x-axis direction and the y-axis direction, respectively, and the direction perpendicular to the main surface is defined as the z-axis direction. , with right-handed xyz coordinates. This coordinate system shall also be followed in subsequent figures.

2(a) is a plan view (xy plan view) of the partial region RE, and FIG. 2(b) is a cross-sectional view (zx cross-sectional view) taken along line A-A' in FIG. 2(a).

As shown in FIG. 2, mother substrate 10 has a configuration in which predetermined patterns 2 are two-dimensionally arranged on one main surface of base substrate 1 in one or more layers made of resin, metal, or the like. In other words, mother substrate 10 has pattern 2 on one main surface side. The other main surface of base substrate 1 on which pattern 2 is not provided also serves as the other main surface of mother substrate 10 .

The base substrate 1 is a brittle material substrate having a planar size (diameter) of about 20 cm to 30 cm and a thickness of about 0.1 mm to 1.0 mm, and is exemplified by a glass wafer.

The pattern 2 has a small-sized pattern 2a of a predetermined size as a basic pattern, but also includes a large-sized pattern 2b having a plane size larger than that of the small-sized pattern 2a on a part of the mother substrate 10.例文帳に追加The large-sized pattern 2b is arranged in at least one portion of the mother substrate 10 so as to be surrounded by the small-sized pattern 2a. The partial area RE exemplifies this situation. For example, the small size pattern 2a is a pattern forming a predetermined device structure, and the large size pattern 2b is a TEG. In such a case, solder balls may be formed on the top surface of the pattern 2 .

The individual patterns 2 adjacent to each other are separated from each other, and the base substrate 1 is exposed in the streets ST that are the gaps between the patterns 2 . On the motherboard 10, the streets ST include a first street ST1 that is the gap between the small-sized patterns 2a, a second street ST2 that is the gap between the large-sized patterns 2b, the small-sized pattern 2a, and the large-sized pattern 2b. There is a third street ST3 which is a gap between .

In FIG. 2, both the small-size pattern 2a and the large-size pattern 2b are rectangular in plan view for the sake of simplicity of illustration. ST can be thought of as the space between rectangles circumscribing each pattern 2 .

When both the small-size pattern 2a and the large-size pattern 2b are rectangular in plan view, the size of the short side of the small-size pattern 2a is about 0.5 mm to 2.0 mm, and the size of the long side is 0. 0.5 mm to 2.0 mm. The size of the short side of the large-sized pattern 2b is about 1.0 mm to 4.0 mm, and the size of the long side is about 1.5 mm to 6.0 mm.

The width of the first street ST1 is approximately 30 μm to 100 μm, the width of the second street ST2 is approximately 20 μm to 200 μm, and the width of the third street ST3 is approximately 30 μm to 200 μm.

The mother substrate 10 is divided into individual pieces each including the individual patterns 2 along predetermined dividing positions on the streets ST. In other words, the planned division positions are provided around all the regions that will become individual pieces after division.

A region of the mother substrate 10 that becomes individual pieces including the small-sized pattern 2a by being divided is referred to as a small-sized singulated region 10a, and a region that becomes individual pieces including the large-sized pattern 2b is referred to as a large-sized singulated region 10a. This is referred to as singulation region 10b. In other words, the division of the mother substrate 10 performed in the method according to the present embodiment is a process of dividing the mother substrate 10 into a plurality of small-sized singulated regions 10a and a plurality of large-sized singulated regions 10b. .

More specifically, in the present embodiment, the pattern 2 is repeatedly arranged in each of the x-axis direction and the y-axis direction, which are orthogonal to each other. It is divided at the position Px and the y division planned position Py along the y-axis direction. The x planned division position Px and the y planned division position Py are determined in the center of each street ST in the first street ST1 and the second street ST2.

Further, among the x planned division positions Px, the position where the large-sized pattern 2b does not exist in the extending direction is referred to as the 1st x planned division position Px1, and the position where the large-sized pattern 2b exists is referred to as the 2nd x planned division position Px2. It is assumed that Similarly, among the y planned division positions Py, the position where the large-sized pattern 2b does not exist in the extending direction is referred to as the first y planned division position Py1, and the position where the large-sized pattern 2b exists is referred to as the second y planned division position Py2. We will call it.

<Summary of division processing>
Next, the outline of the division processing performed in this embodiment will be described. The division processing is realized by performing scribe processing and subsequent break processing.

FIG. 3 is a diagram schematically showing how the mother substrate 10 is subjected to the scribing process. The scribing process can be performed using a known scribing device 100 .

The scribing device 100 mainly includes a stage 101 capable of supporting a scribing object downward in a horizontal posture, and a scribing wheel (cutter wheel) 102 which is a disk-shaped member having a cutting edge 102e on the outer edge. The scribing wheel 102 is held by the scribing device 100 in a rotatable manner in the vertical plane.

More specifically, the scribing wheel 102 is a disk-shaped member (scribing tool) with a diameter of 2 mm to 3 mm, and has a cutting edge 102e having an isosceles triangular cross-sectional view on its outer peripheral surface. At least the cutting edge 102e is made of diamond. The angle (edge angle) α of the cutting edge 102e is preferably 100° to 135°.

When the mother substrate 10 is to be cut, one main surface of the mother substrate 10 on which the pattern 2 is provided is the upper surface (the surface to be scribed), and the other main surface is the mounting surface for the stage 101. It is placed and fixed on the stage 101 and positioned.

More specifically, prior to the scribing process, the other main surface of the mother substrate 10 is adhered to a holding tape (eg, dicing tape) DT stretched over a substantially annular ring (eg, dicing ring) RG in advance. It is said that Then, the mother substrate 10 is placed and fixed on the stage 101 by placing and fixing the ring RG formed by attaching the mother substrate 10 to the holding tape DT in such a manner on the stage 101 .

In addition, FIG. 3 shows a state when a certain y-partition planned position Py is targeted for scribing.

When performing a scribing operation along the y planned cutting positions Py, the mother substrate 10 is mounted and fixed on the stage 101 so that the individual y planned cutting positions Py and the rotating surface of the scribing wheel 102 are parallel to each other. Then, each y planned division position Py is positioned so that the y planned division position Py and the rotation plane of the scribing wheel 102 are positioned in the same vertical plane (a plane perpendicular to the drawing), The scribing wheel 102 applies a predetermined load (referred to as a scribing load) to the mother substrate 10 (strictly speaking, on the underlying substrate 1 exposed at the streets ST) along the y-dividing position Py. be rolled. Such pressure-contact rolling is realized, for example, by horizontally moving the stage 101 relative to the scribing wheel 102 by a driving mechanism (not shown). Then, a scribe line is formed along the y planned division position Py on the base substrate 1 exposed in the street ST. The scribe line is preferably formed so that the vertical crack reaches from the surface of the base substrate 1 to a depth of about 20 to 50% of the thickness of the substrate. When forming a scribe line in such a manner, the scribing speed (the speed at which the scribing wheel 102 is moved relative to the stage 101) is preferably 100 mm/s to 300 mm/s.

In the present embodiment, the scribing operation, which is a combination of such positioning and the press-contact rolling of the scribing wheel 102, is performed on all y-dividing positions Py separated by a predetermined pitch in the x-axis direction. It is performed sequentially from one end side of the direction. That is, after the scribing operation for one y planned division position Py is completed, the mother substrate 10 is shifted to perform the scribing operation for the next y planned division position Py. The relative movement of the scribing wheel 102 to the y dividing position Py to be subjected to the scribing process) is performed only in one direction in the x-axis direction.

A scribing operation along the x-predetermined division position Px is performed in a similar manner.

When the 2x-predetermined division position Px2 and the 2y-th predetermine division position Py2 shown in FIG. 2 are to be scribed, the large size singulation region 10b (the large size pattern 2b) intervenes in the extending direction. Therefore, during the scribing operation, the 2x-predetermined dividing position Px2 or the 2y-predetermined dividing position Py2 determined in the first street ST1 is used so that the scribe line is not formed in the large-sized singulated region 10b. The scribing wheel 102 that has been pressed and rolled along the scribing wheel 102 reaches the 1y-predetermined cutting position Py1 or the 1x-predetermined cutting position Px1 defined on the third street ST3 orthogonal to them, immediately before or at the time of reaching , is once lifted and moved in the x-axis direction or the y-axis direction above the large-sized singulated region 10b. Then, at the location where the 2x-predetermined cutting position Px2 or the 2y-predetermined cutting position Py2 is provided in front of it, it is lowered again and pressed along the 2x-predetermined cutting position Px2 or the 2nd y-predetermined cutting position Py2. be rolled.

The mother substrate 10 for which the scribing process for all the planned cutting positions has been completed is subsequently subjected to the breaking process. FIG. 4 is a diagram schematically showing how the mother substrate 10 is subjected to the breaking process. Break processing can be performed using a known break device 200 .

The breaking device 200 comprises a support 201 whose surface is at least made of an elastic material and which can support the object to be broken in a horizontal position downward, and a break bar which is a plate-like member having a cutting edge 202e having a triangular cross-sectional view vertically downward. 202 are mainly provided.

As the support 201, for example, a configuration in which a plate-like elastic body is placed and fixed on the upper surface of a metal member having a flat upper surface can be employed.

The break bar 202 is a plate-like metal (for example, cemented carbide) member provided with an isosceles triangular cutting edge 202e extending in the cutting edge direction. In FIG. 4, the break bar 202 is shown such that the blade extension direction is perpendicular to the drawing. In addition, the blade length of the break bar 202 is larger than the plane size of the mother substrate 10 so that the breaking can be performed in the entire blade length direction by one breaking operation.

FIG. 4 shows a state in which a certain y-partition planned position Py on which a scribe line SL is formed by scribing is targeted for break processing.

After the scribing process, the mother substrate 10 is applied to the holding tape DT stretched over the ring RG and subjected to the breaking process. However, as shown in FIG. 4, during the breaking process, the one main surface side exposed during the scribing process is covered with the protective film PF. The protective film covers the pattern 2 in such a manner that its edges are attached to the ring RG. The mother substrate 10 after the scribing process is placed on the support 201 together with the ring RG, the holding tape DT, and the protective film PF, with the other main surface facing upward and the one main surface facing downward. Fixed. That is, the protective film PF is placed and fixed in a state of contact with the support 201 .

When performing a breaking operation along the y planned breaking positions Py, the mother substrate 10 is placed and fixed on the support 201 so that the respective y planned breaking positions Py and the blade length direction of the break bar 202 are parallel to each other. be done. Then, each y planned division position Py is positioned so that the y planned division position Py and the break bar 202 are positioned in the same vertical plane (a plane perpendicular to the drawing), and then the break bar 202 is , and is lowered toward the y division planned position Py as indicated by an arrow AR1. After the cutting edge 202e of the break bar 202 abuts on the holding tape DT, the break bar 202 is further pushed in by a predetermined distance (referred to as a pushing amount) z.

In this way, when the break bar 202 is lowered toward the planned y-dividing position Py of the mother substrate 10 in the posture where the scribe line SL is positioned downward, and is further pushed by a predetermined amount, the y line is separated from the scribe line SL. The crack extends in the thickness direction (perpendicular to the peripheral surface of the mother substrate 10) along the planned division position and extends to the other main surface of the mother substrate 10, which is the upper surface, more specifically, the base substrate 1 is held. It reaches the adhered surface of the tape DT.

However, since the blade length of the break bar 202 is larger than the size of the mother substrate 10, during the breaking operation, the break bar 202 does not have a scribe line formed thereunder and does not need to be divided into large-sized singulation regions 10b. may also come into contact with In other words, the contact position of the break bar 202 includes at least the area above the scribe line formation position, and may also include the range of the large singulated region 10b where the scribe line is not formed. In this embodiment, in such a case, the breaking operation is performed so as not to cause unnecessary division of large-sized singulated region 10b. The details will be described later.

In the present embodiment, the breaking operation targeting the y planned breaking position Py, which is a combination of such positioning and lowering of the break bar 202, is applied to all breaks spaced apart at a predetermined pitch in the x-axis direction. With respect to the bar abutment position, it is performed sequentially from one end side in the x-axis direction. That is, after completing the breaking operation with respect to the break bar abutting position including one y planned breaking position Py, the mother board 10 is shifted to perform the breaking operation with respect to the break bar abutting position including the next y planned breaking position Py. Feeding (relative movement of the break bar 202 from the break bar abutment position after the break processing is completed to the break bar abutment position to be next subjected to the break processing) is performed only in one x-axis direction.

Break processing along the x-division planned position Px is also performed in a similar manner.

In the mother substrate 10 after the breaking process, the small-sized singulated regions 10a and the large-sized singulated regions 10b are separated from each other and are in contact with each other. It is held by the holding tape DT. The mother substrate 10 in such a state is subjected to an expanding process for separating the adjacent regions by stretching the holding tape DT. As a result, the small-sized singulated regions 10a and the large-sized singulated regions 10b are separated from each other and obtained as individual pieces. As described above, the mother substrate 10 is divided into individual pieces of a desired size.

<Details of break processing>
FIG. 5 is a plan view of the partial region RE of the mother substrate 10 subjected to the breaking process after the scribing process, viewed from the other main surface side (from the side opposite to the one main surface provided with the pattern 2). . In other words, FIG. 5 shows the mother substrate 10 placed on the support member 201 of the breaking device 200 in the attitude shown in FIG. 4, viewed from above vertically.

However, in FIG. 5, for the sake of convenience, the patterns 2 (the small size pattern 2a and the large size pattern 2b) provided on one main surface side are indicated by dashed lines.

Further, in FIG. 5, an x scribe line SLx formed along the x planned division position Px and a y scribe line SLy formed along the y planned division position Py on the surface side by the scribing process are shown at two points. It is indicated by a dashed line. More specifically, of the former, the line formed along the 1x planned dividing position Px1 is defined as the 1x scribe line SLx1, and the line formed along the 2x planned dividing position Px2 is defined as the 2x scribe line SLx2. and Among the latter, the first y scribe line SLy1 is formed along the first y planned dividing position Py1, and the second y scribe line SLy2 is formed along the second y planned dividing position Py2.

The first x scribe line SLx1 and the first y scribe line SLy1 are formed over the entire x-axis direction and y-axis direction, respectively. On the other hand, the second x scribe line SLx2 and the second y scribe line SLy2 are at intersections with the first y scribe line SLy1 and the first x scribe line SLx1 orthogonal to them, respectively, or just before crossing the first y scribe line SLy1 and the first x scribe line SLx1. is the terminal end. In the partial region RE shown in FIG. 5, intersections I1 to I6 between the first x scribe line SLx1 and the second y scribe line SLy2 and intersections I7 to I12 between the first y scribe line SLy1 and the second x scribe line SLx2 are shown. there is

As described above, during the breaking operation, the break bar 202 also abuts on the large-size singulation region 10b, which does not have a scribe line formed therebelow and does not need to be divided. In FIG. 5, such a contact position of the break bar 202 with no scribe line below is indicated by a dotted line Lx in the x-axis direction and a dotted line Ly in the y-axis direction. For example, if the formation position of the second x scribe line SLx2 is to be subjected to the break processing, not only above the formation position of the pair of second x scribe lines SLx2 located on the left and right in the drawing, but also the dotted line between them The position of Lx is also the break bar contact position.

FIG. 6 is a plan view showing the state of the partial region RE while the mother substrate 10 shown in FIG. 5 is being subjected to the breaking process. Furthermore, FIG. 7 is a plan view showing the partial region RE after the mother substrate 10 shown in FIG. 5 has been subjected to a good breaking process.

Specifically, in FIG. 6, the break processing targeting the break bar abutting position including the forming position of the y scribe line SLy (that is, targeting the y division planned position Py) is located on the left side in the drawing view. It shows a state in the middle when it is executed in order from the break bar abutment position including the y scribe line SLy. In FIG. 6, a thick solid line indicates the parting line DL formed in the mother substrate 10 as a result of the crack extending from the y scribe line SLy extending to the other main surface.

First, in order to cut the mother substrate 10 at the first y-predetermined cutting position Py1, when performing the breaking operation targeting the break bar contact position including the formation position of the first y scribe line SLy1, naturally, It is sufficient that the dividing line DL is formed. In FIG. 6, the dividing line DL formed at the first y-predetermined dividing position Py1 in such a manner is shown as a (first) dividing line DL1.

On the other hand, in order to divide the mother substrate 10 at the second y-predetermined dividing position Py2, when the breaking operation is performed targeting the break bar abutting positions including the formation position of the second y scribe line SLy2, the scribe line is formed downward. The break bar 202 abuts not only on the position where it is formed, but also on the position indicated by the dotted line Ly where it is not formed, and is pushed by a predetermined pushing amount z over the entire length of the blade.

Therefore, originally, the dividing line DL should be formed only at the position where the second y scribe line SLy2 is formed, as shown as the (second) dividing line DL2 in FIG. Crack extension from the 1x scribe line SLx1 extends beyond the positions of intersections I1 to I6 with the 1x scribe line SLx1 to the large size singulated region 10b, and not only the formation position of the 2nd y scribe line SLy2 but also the large size A dividing line DL reaching the singulation region 10b may be formed. In FIG. 6, such a dividing line DL is illustrated as a dividing line DL2α.

Note that even if the dividing line DL2α is formed along the second y scribe line SLy2 at the position where the second y scribe line SLy2 is formed, that is, along the second y planned dividing position Py2, which is also the blade span direction, the scribe line is not formed. The large-size singulated regions 10b that are not cut are not necessarily formed along the blade length direction.

In the present embodiment, by suitably determining the conditions of the breaking process, the breaking along the forming position of each y scribe line SLy is performed while the shift feed of the break bar 202 is set to only one direction in the x-axis direction. In the case of continuous breaking, the break is suitably realized with the formation position of the first y scribe line SLy1 as the break contact position, and the break contact position including the formation position of the second y scribe line SLy2 is targeted. Also at this time, the dividing lines are formed so as not to cross the intersections I1 to I6 with the first x scribe line SLx1 that divides the large singulated region 10b. Likewise, when breaking along the formation position of the x scribe line SLx is continuously performed while the break bar 202 is shifted and fed only in one direction in the y-axis direction, the formation position of the first x scribe line SLx1 is similarly applied. and the break contact position including the formation position of the second x scribe line SLx2. The dividing line is formed without crossing the intersections I7 to I12 with the first y scribe line SLy1.

Specifically, break processing is performed under the following conditions:
(a) the angle of the cutting edge 202e (cutting edge angle) θ: 50° to 90°;
(b) Curvature radius R of tip of cutting edge 202e: 100 μm to 300 μm;
(c) pushing amount z: 60 μm to 100 μm;
(d) Lowering speed of break bar 202: 10 mm/s to 100 mm/s.

By satisfying these conditions (a) to (d), in the mother substrate 10, as shown in FIG. A break line DL1 is formed, and a second break line DL2 is formed along the 2x-predetermined division position Px2 and the 2nd y-predetermined division position Py2 but does not extend to the large-sized singulated region 10b. be done. This is because the radius of curvature R of the tip of the cutting edge 202e is relatively large with respect to the thickness of the substrate, so that the force for spreading the substrate laterally becomes greater, and the excessive pressing of the break bar 202 causes the large-sized singulated region 10b. It is considered that this is because the deformation of can be suppressed.

After that, by performing the above-described expanding process on the mother substrate 10 on which the first dividing line DL1 and the second dividing line DL2 are formed, the individual pieces including the small-sized pattern 2a and the individual pieces including the large-sized pattern 2b are formed. is obtained.

When the cutting edge angle θ and the radius of curvature R are smaller than the above ranges, and when the pushing amount z and the descending speed of the break bar 202 are larger than the above ranges, the break bar 202 is pressed to separate the large-sized singulated region 10b. The deformation is large, and the second dividing line DL2 is formed even in the large-sized singulated region 10b, which is not preferable.

On the other hand, when the cutting edge angle θ and the radius of curvature R are larger than the above ranges, and when the pushing amount z and the descending speed of the break bar 202 are smaller than the above ranges, cracks extending from the scribe line do not reach the opposite surface. This is not preferable because it means that there is no division.

As described above, according to the present embodiment, a mother substrate in which a plurality of small-sized patterns and a plurality of large-sized patterns are mixed is divided into small-sized individual pieces including the former and large-sized pieces including the latter. The process of dividing into individual pieces can be suitably realized by a scribing process along the planned dividing position and a subsequent breaking process that satisfies the conditions (a) to (d).

In particular, during the breaking process, it is possible to preferably prevent large-sized individual pieces from being unnecessarily split while the break bar is brought into contact with a position where splitting is unnecessary.

Note that depending on the thickness and type of the substrate, after the scribing process, the breaking process may be performed only around the individual pieces of the large-sized singulated area as described above. Measures that can suppress division are also conceivable. However, the relative movement operation of the break bar with respect to the mother board becomes complicated, and there is a possibility that the positioning accuracy may deteriorate. In the first place, depending on the layout of the large-sized singulated regions on the mother board, other large-sized singulated regions exist on the extension line of the planned division position set around a certain large-sized singulated region. In such cases, the anticipatory break as described above cannot occur.

On the other hand, according to the method according to the present embodiment, regardless of the layout of the large-sized region on the mother substrate, the shift feed of the planned division position is performed only in one direction, while the position to be divided is preferably shifted at all the planned division positions. Since it can be divided, it can be said to be excellent in terms of versatility and productivity.

1 base substrate 2 pattern 2a small size pattern 2b large size pattern 10 mother substrate 10a small size singulation region 10b large size singulation region 100 scribing device 101 stage 102 scribing wheel 102e cutting edge (of scribing wheel) 200 breaking device 201 support Body 202 Break bar 202e Cutting edge (of break bar) DL Parting line DT Holding tape PF Protective film Px x planned parting position Py y parting planned position RG ring SL scribe line ST street

Claims (3)

A method of dividing a brittle material substrate into small-sized pieces and large-sized pieces larger than the small-sized pieces along predetermined cutting positions, the method comprising:
A scribe line is formed along the predetermined dividing position around all the regions that will become the small-sized pieces and the large-sized pieces after division on one main surface side of the brittle material substrate. , a scribing step, and
Pushing the break bar by a predetermined push amount from the other main surface side of the brittle material substrate at the break bar contact position including at least the position above the formation position of the scribe line is defined as all the break bar contact positions. a breaking step of dividing the brittle material substrate into the small size pieces and the large size pieces by performing
with
In the break step,
(a) setting the edge angle θ of the break bar to 50° to 90°;
(b) setting the radius of curvature R of the cutting edge tip of the break bar to 100 μm to 300 μm;
(c) the pressing amount is 60 μm to 100 μm,
(d) setting the descending speed of the break bar to 10 mm/s to 100 mm/s when pushing the break bar into the substrate;
A method for dividing a brittle material substrate, characterized by: The method for dividing a brittle material substrate according to claim 1,
In the breaking step, after completing the breaking operation for one of the break bar abutting positions, the substrate is shifted to perform the breaking operation for the next break bar abutting position. performed only in one direction of the direction in which they are arranged at a predetermined pitch,
A method for dividing a brittle material substrate, characterized by: The method for dividing a brittle material substrate according to claim 1 or claim 2,
A pattern is provided on the brittle material substrate, which consists of a small-sized pattern provided in a region that will become the small-sized individual pieces after division and a large-sized pattern provided in a region that will become the large-sized individual pieces. become,
In the scribing step, the scribe line is formed on the brittle material substrate exposed between the patterns.
A method for dividing a brittle material substrate, characterized by:

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