JP7254002B2 - Measuring method and test equipment - Google Patents

Description

The present invention relates to a measuring method and testing apparatus for measuring the strength of a test piece.

Grinding strain is generated on the back surface of the wafer as the back surface of the semiconductor wafer is ground. Furthermore, cutting strain is generated on the side surface of the semiconductor device chip as a result of dicing with a cutting blade after grinding. The strength of the semiconductor device chip is reduced due to grinding distortion and grinding distortion.

As a method for measuring the strength of a semiconductor device chip, a testing apparatus using three-point bending defined by SEMI (Semiconductor Equipment and Materials International) standard G86-0303 is generally used (see, for example, Patent Document 1). .

JP 2005-17054 A

In the conventional test apparatus disclosed in Patent Document 1, etc., a worker takes out a predetermined chip (test piece) from a wafer divided into chips, sets it in the test apparatus, and measures the strength, which is troublesome. rice field. In the conventional testing apparatus disclosed in Patent Document 1 and the like, after the chip is broken, the strength of another chip is measured in a state in which foreign matter such as chip fragments adhere to the support surface that supports the chip. , there is a problem that accurate measurement cannot be performed.

The present invention has been made in view of such problems, and its object is to provide a measuring method and a testing apparatus that enable accurate strength measurement even when measuring the strength of a plurality of test pieces. That is.

In order to solve the above-described problems and achieve the object, the measuring method of the present invention is a measuring method for measuring the strength of a test piece, which includes a support surface that supports the lower surface of the test piece and is spaced apart from each other by a predetermined distance. an indenter extending in parallel with the long supports disposed above the long supports and between the pair of long supports; Moving means for moving the indenter relatively closer to the test piece supported by the pair of long support portions, and measuring the load with which the indenter presses the test piece supported by the pair of long support portions. a load measuring means for holding the test piece; a collet for holding the test piece; a device preparation step of preparing a chip breaking device having a moving means; a test piece held by the collet; a load detection step of pressing the test piece with the indenter to break it, and detecting the load when the test piece breaks with the load measuring means; and a cleaning step of holding the collet with the collet moving means, moving the collet to the mounting position, and cleaning the support surface with the cleaning tool.

In the measuring method, the collet includes a suction-holding surface that suction-holds the test piece, and the cleaning tool cleans the held surface that is suction-held by the collet and the supporting surface behind the held surface. a body portion made of a porous material including a cleaning surface; and in the cleaning step, foreign matter on the support surface is sucked through the cleaning tool by the collet, and the cleaning surface of the cleaning tool is coated with foreign matter. Foreign matter may be adsorbed.

In the measuring method, in the cleaning step, the cleaning tool sucked and held by the collet may be slid on the support surface to remove foreign matter on the support surface.

The test apparatus of the present invention is a test apparatus for measuring the strength of a test piece, and includes a pair of long supports including a support surface for supporting the lower surface of the test piece and arranged at a predetermined distance from each other. , an indenter extending parallel to the long support arranged above the long support and between the pair of long supports, and a test in which the indenter is supported by the pair of long supports moving means for moving relatively close to the piece; load measuring means for measuring the load with which the indenter presses the test piece supported by the pair of long support portions; a collet for holding the test piece; a test piece conveying means having collet moving means for moving the collet between a pick-up position for picking up the test piece and a placement position for placing the test piece on the pair of long supports; and cleaning the support surfaces of the pair of long support portions with a cleaning tool containing cleaning tool for cleaning the support surfaces of the long support parts of the above. and a cleaning means, wherein the test piece conveying means also serves as the cleaning means.

ADVANTAGE OF THE INVENTION This invention is effective in making it possible to measure intensity|strength correctly, even when measuring the intensity|strength of a several test piece.

FIG. 1 is a perspective view showing a part of a configuration example of a test apparatus according to Embodiment 1. FIG. FIG. 2 is a perspective view of the essential parts of the testing apparatus shown in FIG. 3 is a perspective view of a wafer to be measured by the testing apparatus shown in FIG. 1. FIG. FIG. 4 is a cross-sectional view showing a push-up mechanism and the like of the test apparatus shown in FIG. 5 is a perspective view of a pick-up mechanism of the chip transfer unit of the testing apparatus shown in FIG. 1. FIG. FIG. 6 is a perspective view showing a strength measuring mechanism of the testing apparatus shown in FIG. 1; 7 is a perspective view showing a pressing unit of the strength measuring mechanism shown in FIG. 6. FIG. 8 is a perspective view of a support unit of the strength measuring mechanism shown in FIG. 6; FIG. FIG. 9 is a perspective view of the cleaning tool support of the test apparatus shown in FIG. 1; 10 is a perspective view showing a cleaning tool supported by the cleaning tool support shown in FIG. 9; FIG. 11 is a cross-sectional view taken along line XI--XI in FIG. 10. FIG. FIG. 12 is a flow chart showing the flow of the measurement method according to the first embodiment. FIG. 13 is a cross-sectional view showing a state in which predetermined chips of the wafer and the push-up mechanism are aligned in the load detection step of the measuring method shown in FIG. 14 is a cross-sectional view showing a state in which a predetermined chip on the wafer shown in FIG. 13 is pushed up by the pushing-up mechanism. 15 is a cross-sectional view showing a state in which the collet holds the predetermined tip shown in FIG. 14 by suction. 16 is a cross-sectional view showing a state in which a pair of elongated support portions of the support unit supports the chip in the load detection step of the measuring method shown in FIG. 12. FIG. 17 is a cross-sectional view showing a state in which the tip shown in FIG. 16 is pressed by the indenter and is in contact with the upper ends of the support projections of the long support portion. FIG. 18 is a cross-sectional view showing a broken state of the chip shown in FIG. 19 is a perspective view showing a state in which the cleaning tool is suction-held on the lower surface of the collet in the cleaning step of the measuring method shown in FIG. 12. FIG. 20 is a cross-sectional view showing a state in which the cleaning tool shown in FIG. 19 is cleaning the upper ends of the support projections of the pair of long support portions; FIG. 21 is a cross-sectional view of a cleaning tool used in the measuring method according to Embodiment 2. FIG. 22 is a cross-sectional view showing a state in which the cleaning tool is cleaning the upper ends of the support protrusions of the pair of long support portions in the cleaning step of the measurement method according to the second embodiment; FIG. 23 is a cross-sectional view showing a state in which the cleaning tool is cleaning the upper ends of the support projections of the pair of long support portions in the cleaning step of the measurement method according to Embodiment 3. FIG. FIG. 24 is a flow chart showing the flow of the measurement method according to the modification of the first, second, and third embodiments.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A test apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a part of a configuration example of a test apparatus according to Embodiment 1. FIG. FIG. 2 is a perspective view of the essential parts of the testing apparatus shown in FIG. 3 is a perspective view of a wafer to be measured by the testing apparatus shown in FIG. 1. FIG.

The test apparatus 1 shown in FIGS. 1 and 2 according to the first embodiment breaks chips 14, which are test pieces individually divided from the wafer 10 shown in FIG. It is a chip breaking device to measure.

(wafer)
In Embodiment 1, the wafer 10 is a disk-shaped semiconductor wafer, an optical device wafer, or the like having a substrate 11 made of silicon, sapphire, gallium, or the like. In the wafer 10, devices 13 are formed in regions partitioned in a grid pattern by a plurality of division lines 12 formed in a grid pattern on the front surface 11-1 of the substrate 11. As shown in FIG. In Embodiment 1, the wafer 10 is supported by the annular frame 16 with the adhesive tape 15, which is a support member having the annular frame 16 attached to the outer peripheral edge, adhered to the lower surface 11-2, thereby constituting the wafer unit 17. are doing. That is, in Embodiment 1, the wafer 10 is supported by the adhesive tape 15 . Further, the wafer 10 is singulated into individual chips 14 along division lines 12 . Note that the chip 14 includes a portion of the substrate 11 and the device 13 .

In the first embodiment, the wafer 10 has the devices 13 formed on the front surface 11-1 of the substrate 11. However, in the present invention, the test apparatus 1 divides the wafer 10 into individual chips 14 in a so-called post-process. The device 13 may not be formed on the surface 11-1 when used to evaluate the adequacy of the processing conditions.

(test equipment)
As shown in FIG. 1, the testing apparatus 1 includes a cassette mounting table 3 provided on an apparatus main body 2 on which a cassette 4 containing a plurality of wafer units 17 is mounted, and a loading/unloading table for loading/unloading the wafer units 17 into/from the cassette 4 . A unit 5, a pair of temporary placement rails 6 on which the wafer unit 17 unloaded from the cassette 4 or the wafer unit 17 before being loaded into the cassette 4 is temporarily placed, a frame fixing unit 7, and a control unit 400. .

The cassette 4 is a storage container that stores a plurality of wafer units 17 at intervals in the Z-axis direction parallel to the vertical direction, and is provided with an opening 8 for taking in and out the wafers 10 . The cassette mounting table 3 has the cassette 4 mounted on its upper surface, and moves the cassette 4 up and down in the Z-axis direction.

A pair of temporary placement rails 6 are provided on both ends in the width direction of the opening 8 of the cassette 4 placed on the apparatus main body 2 and placed on the cassette placing table 3, and extend linearly in the Y-axis direction parallel to the horizontal direction. ing. The pair of temporary placement rails 6 are arranged parallel to each other and spaced apart from each other along the X-axis direction perpendicular to the Y-axis direction and parallel to the horizontal direction. The annular frame 16 of the wafer unit 17 is temporarily placed on the pair of temporary placement rails 6 .

The frame fixing unit 7 includes an annular frame support member 18, an annular frame pressing member 19 arranged above and fixed to the frame support member 18, and a lifting mechanism (not shown) for raising and lowering the frame support member 18. The upper surface of the frame support member 18 is positioned flush with the upper surface of the temporary placement rail 6 before being lifted, and the annular frame 16 of the wafer unit 17 is placed thereon. In the frame fixing unit 7, when the annular frame 16 of the wafer unit 17 is placed on the upper surface of the frame support member 18, the elevating mechanism lifts the frame support member 18, and the frame holding member 19 and the frame support member 18 are separated from each other. The wafer unit 17 is fixed by sandwiching the annular frame 16 therebetween.

The loading/unloading unit 5 is provided so as to be movable in the Y-axis direction by a moving mechanism (not shown). The loading/unloading unit 5 unloads the wafer unit 17 from the cassette 4, temporarily places it on the temporary placement rail 6, and then unloads the wafer unit 17 to the upper surface of the frame support member 18 where the frame fixing unit 7 is lowered. It is placed on the upper surface of the frame support member 18 . Further, the carry-in/out unit 5 carries the wafer unit 17 on the upper surface of the frame support member 18 from which the frame fixing unit 7 has been lowered into the cassette 4 via the temporary placement rails 6 .

As shown in FIG. 2, the test apparatus 1 includes a moving mechanism 30 for moving the frame fixing unit 7 in the Y-axis direction and the X-axis direction, a push-up mechanism 50, an imaging camera 60, and a test piece transport means. It has a chip transport unit 20 , a chip observation mechanism 100 and an intensity measurement mechanism 200 .

The moving mechanism 30 includes an X-axis moving mechanism 32 which is provided on the apparatus main body 2 and moves the moving table 40 in the X-axis direction, and a moving table 40 which is moved in the X-axis direction by the X-axis moving mechanism 32. and a Y-axis moving mechanism 42 for moving the frame fixing unit 7 in the Y-axis direction. The X-axis moving mechanism 32 moves the moving table 40 , that is, the frame fixing unit 7 in the X-axis direction between a position aligned with the pair of temporary placement rails 6 in the Y-axis direction and a position apart from the pair of temporary placement rails 6 . Each moving mechanism 32, 42 includes well-known ball screws 36, 46 rotatably provided around the axis, well-known motors 38, 48 for rotating the ball screws 36, 46 around the axis, and a moving table 40 or frame. Known guide rails 34, 44 are provided to support the fixed unit 7 so as to be movable in the X-axis direction or the Y-axis direction.

(Push-up mechanism)
FIG. 4 is a cross-sectional view showing a push-up mechanism and the like of the test apparatus shown in FIG. The push-up mechanism 50 is arranged below the frame fixing unit 7 positioned away from the pair of temporary placement rails 6 by the X-axis movement mechanism 32 . The push-up mechanism 50 is provided in the recess 9 of the apparatus main body 2 and pushes up any chip 14 of the wafer unit 17 fixed to the frame fixing unit 7 above the adhesive tape 15 .

As shown in FIG. 4 , the push-up mechanism 50 includes an outer layer portion 51 formed in a hollow columnar shape, and a quadrangular prism-shaped push-up portion 52 arranged inside the outer layer portion 51 . A plurality of suction grooves 54 are formed concentrically along the circumferential direction of the outer layer portion 51 in the upper surface 53 of the outer layer portion 51 . Each of the suction grooves 54 is connected to a suction source 57 such as an ejector via a suction path 55 and an opening/closing valve 56 formed inside the push-up mechanism 50 .

The push-up portion 52 includes a first push-up pin 52-1 formed in the shape of a square pillar, a second push-up pin 52-2 formed in the shape of a hollow square pillar and surrounding the first push-up pin 52-1, and a hollow square pillar. and a fourth push-up pin 52-4 formed in the shape of a hollow square column and surrounding the third push-up pin 52-3. The first push-up pin 52-1, the second push-up pin 52-2, the third push-up pin 52-3, and the fourth push-up pin 52-4 are each connected to an elevating mechanism (not shown) composed of a motor or the like. It is connected and moves up and down along the Z-axis direction.

The push-up mechanism 50 raises the push-up portion 52 in a state where the wafer unit 17 is positioned upward, and pushes up the chip 14 arranged at a position overlapping the push-up portion 52 . The push-up mechanism 50 sucks and holds the chip 14 on the upper surface of the outer layer portion 51 via the adhesive tape 15 by sucking the suction groove 54 on the upper surface of the outer layer portion 51 by the suction source 57 . The push-up mechanism 50 sucks and holds the chip 14 via the adhesive tape 15 on the upper surface, and pushes up the predetermined chip 14 above the adhesive tape 15 by raising the push-up part 52 . Note that the dimensions of the push-up mechanism 50 are appropriately adjusted according to the size of the chip 23 .

The imaging camera 60 is arranged at a position capable of imaging the entire wafer 10 of the wafer unit 17 fixed by the frame fixing unit 7 above the recess 9 . The imaging camera 60 has an imaging device for imaging the entire wafer 10 fixed by the frame fixing unit 7 . The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The imaging camera 60 photographs the entire wafer 10 of the wafer unit 17 fixed by the frame fixing unit 7, and obtains an image for aligning the predetermined chip 14 of the wafer 10 with the push-up mechanism 50, etc. The obtained image is output to the control unit 400 .

(Chip transfer unit)
5 is a perspective view of a pick-up mechanism of the chip transfer unit of the testing apparatus shown in FIG. 1. FIG. The chip transfer unit 20 has a pick-up mechanism 70 and a collet moving mechanism 80 as collet moving means.

The pickup mechanism 70 picks up a predetermined chip 14 pushed up by the push-up mechanism 50 from the wafer 10 divided into a plurality of chips 14 and supported by the adhesive tape 15 . As shown in FIG. 5 , the pickup mechanism 70 includes a movable base 72 that is moved in the Y-axis direction and the Z-axis direction by the collet moving mechanism 80 , and an X-axis moving base 72 that moves away from the collet moving mechanism 80 . and a collet 76 provided at the tip of the arm 74 to hold the chip 14 .

A collet 76 is attached to the lower end of the tip of the arm 74 . The lower surface 79 of the collet 76 is connected to a suction source 77 such as an ejector through a suction path 73 and an on-off valve 75, and is sucked by the suction source 77 to form a suction holding surface for holding the tip 14 by suction. . That is, the collet 76 has a lower surface 79 that is a suction holding surface. The pick-up mechanism 70 sucks and holds the chip 14 pushed up by the push-up mechanism 50 on the lower surface 79 of the collet 76 , and is lifted by the collet moving mechanism 80 to pick up the predetermined chip 14 from the adhesive tape 15 .

Further, in the first embodiment, the test apparatus 1 may include a load cell, which is measuring means for measuring the load applied to the chip 14 when the chip 14 is picked up from the adhesive tape 15 , on the upper surface side of the push-up mechanism 50 . The load cell outputs measurement results to the control unit 400 . In addition, in the present invention, a load cell, which is measuring means, may be provided on the lower surface 79 side of the collet 76 of the pickup mechanism 70 .

The collet moving mechanism 80 moves between a pickup position where the chip 14 is picked up from the adhesive tape 15 and a mounting position where the chip 14 is mounted on a supporting projection 213 (shown in FIG. 8) of the strength measuring mechanism 200, which will be described later. It moves the collet 76 . The collet moving mechanism 80 includes a second Y-axis moving mechanism 82 that is provided on the apparatus main body 2 and moves the moving table 90 in the Y-axis direction, and a second Y-axis moving mechanism 82 that moves the moving table 90 in the Y-axis direction. and a Z-axis moving mechanism 92 for moving the moving base 72, that is, the pickup mechanism 70 in the Z-axis direction.

The second Y-axis moving mechanism 82 moves the moving table 90, that is, the pickup mechanism 70, along the Y-axis direction from the pickup position where the upper surface and the lower surface 79 of the outer layer portion 51 of the push-up mechanism 50 face each other in the Z-axis direction toward the strength measuring mechanism 200. to move. Each moving mechanism 82, 92 includes known ball screws 86, 96 rotatably provided around the axis, known motors 88, 98 for rotating the ball screws 86, 996 around the axis, and a moving table 90 or pickup. Known guide rails 84, 94 are provided to support the mechanism 70 so as to be movable in the Y-axis direction or the Z-axis direction.

The chip observation mechanism 100 images and observes the top surface 11-1, the bottom surface 11-2 and the side surface of the chip 14. FIG. As shown in FIGS. 1 and 2, the tip observation mechanism 100 includes a lower imaging unit 102, a side imaging unit 112, and a tip 14, which are arranged next to the push-up mechanism 50 on the apparatus main body 2 in the Y-axis direction. A chip reversing mechanism 150 for reversing upside down is provided.

The lower imaging unit 102 includes a lower imaging camera 103 that images the chip 14 held by the collet 76 of the pickup mechanism 70 from below. The downward imaging camera 103 is arranged at a position overlapping the movement path of the collet 76 . In the bottom imaging unit 102 , the bottom imaging camera 103 captures an image of the chip 14 from below and outputs the captured image to the control unit 400 .

The side imaging unit 112 is for imaging the chip 14 from the side, that is, the side surface of the chip 14 . The side imaging unit 112 is arranged next to the lower imaging unit 102 in the Y-axis direction, and in the first embodiment, is arranged on the side farther from the push-up mechanism 50 than the lower imaging unit 102 .

The side imaging unit 112 includes a columnar chip support base 114 that supports the chip 14 and a side imaging camera 113 that captures an image of the side of the chip 14 .

The chip support base 114 extends upward from the device main body 2 and is arranged at a position aligned with the lower imaging camera 103 in the Y-axis direction (that is, at a position overlapping the moving path of the collet 76). The chip support table 114 has a flat upper surface parallel to the horizontal direction, and supports the chip 14 conveyed by the collet 76 of the pickup mechanism 70 on the upper surface. Further, the tip support 114 is connected to a rotation drive source (not shown), and is rotated by the rotation drive source about an axis parallel to the Z-axis direction.

The side imaging camera 113 is arranged at a position capable of photographing the side surface of the chip 14 arranged on the upper surface of the chip support base 114 . The side imaging camera 113 has an imaging element for imaging the side surface of the chip 14 . The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The side imaging camera 113 captures an image of the side surface of the chip 14 placed on the upper surface of the chip support base 114 and outputs the captured image to the control unit 400 .

Since the test apparatus 1 is provided with the chip support 114 at a position overlapping the moving path of the collet 76 , the chip 14 can be placed on the upper surface of the chip support 114 by the collet 76 .

The side imaging unit 112 images one side surface of the chip 14 supported by the chip support base 114 with the side imaging camera 113 . Thereafter, after rotating the chip support base 114 by a predetermined angle, the other side surface of the chip 14 is imaged by the side imaging camera 113 . In this way, the side imaging unit 112 captures images of all side surfaces of the chip 14 (for example, four side surfaces of the chip 14 ) by the side imaging camera 113 , and determines the thickness of the chip 14 and the thickness of the chip 14 . An image including the chipping size and the like is obtained, and the obtained image is output to the control unit 400 . In addition, the lateral imaging unit 112 can adjust the horizontal direction (angle) of the tip 14 when the tip 14 is placed on the strength measuring mechanism 200 by controlling the rotation angle of the tip support 114 .

The chip observation mechanism 100 captures images of the top surface 11-1, the bottom surface 11-2, and the side surface of the chip 14 picked up by the collet 76 using the bottom imaging unit 102 and the side imaging unit 112 described above. In the present invention, the side imaging camera 113 for imaging the side surface of the chip 14 may be provided at a position capable of imaging the side surface of the chip 14 held by the collet 76 . In this case, since the side surface of the chip 14 can be observed without supporting the chip 14 on the chip support base 114, the lower surface 11-2 of the chip 14 and the like can be prevented from being damaged by arranging the chip 14 on the chip support base 114. can.

The chip reversing mechanism 150 is arranged above the chip support base 114 of the side imaging unit 112 . The tip reversing mechanism 150 is configured to be able to rotate the base portion 151 by 180° around an axis parallel to the X-axis direction while holding the tip 14 at the tip.

When the chip 14 is turned upside down, the chip turning mechanism 150 rotates the base portion 151 by 180° from the position indicated by the solid line in FIGS. 1 and 2 at the position indicated by the dotted line. The tip reversing mechanism 150 sucks and holds the tip 14 at the tip, rotates the base 151 by 180°, and inverts the tip 14 upside down.

The tip 14 reversed by the tip reversing mechanism 150 is sucked and held by the collet 76 of the pickup mechanism 70 , and after the suction and holding of the tip of the tip reversing mechanism 150 is stopped, the collet 76 is moved to the collet moving mechanism 80 . It is transported onto the lower imaging unit 102 or to the intensity measurement mechanism 200 . In this manner, the tip inverting mechanism 150 inverts the tip 14 upside down.

(strength measurement mechanism)
FIG. 6 is a perspective view showing a strength measuring mechanism of the testing apparatus shown in FIG. 1; 7 is a perspective view showing a pressing unit of the strength measuring mechanism shown in FIG. 6. FIG. 8 is a perspective view of a support unit of the strength measuring mechanism shown in FIG. 6; FIG.

The strength measuring mechanism 200 is measuring means for measuring the bending strength of the chip 14 picked up by the pickup mechanism 70 . The strength measurement mechanism 200 is arranged next to the tip observation mechanism 100 in the Y-axis direction, and in the first embodiment, is arranged on the side farther from the push-up mechanism 50 than the tip observation mechanism 100 is. Further, in the first embodiment, the strength measuring mechanism 200 is arranged at a position overlapping the moving path of the collet 76 .

The strength measuring mechanism 200 includes a lower container 201, a support unit 210, a pressing unit 220 (shown in FIG. 7), and a fragment ejection unit 260, as shown in FIG. The lower container 201 is arranged on the apparatus main body 2 and is formed in a box shape with an opening 202 formed on the upper side.

The support unit 210 supports the chip 14 which has been picked up by the collet 76 of the pickup mechanism 70 and whose top surface 11-1, bottom surface 11-2 and side surfaces have been imaged by the chip observation mechanism 100. FIG. The support unit 210 is accommodated in the lower container 201 and arranged at a position overlapping the movement path of the collet 76 . For this reason, the collet moving mechanism 80 moves the collet 76 from the position facing the push-up mechanism 50 in the Z-axis direction to the position facing the support unit 210 in the Z-axis direction.

As shown in FIG. 8, the support unit 210 includes a pair of long support portions 205 that support the chip 14, a position of each of the long support portions 205 in the X-axis direction, and an interval 212 between the pair of long support portions 205. and a support base moving mechanism 219 for changing the width of the . A pair of long support portions 205 are arranged with a predetermined distance 212 in the X-axis direction. Each elongated support 205 comprises a support base 211 and a contact member 214 .

The support base 211 is formed in a rectangular parallelepiped shape. The support bases 211 of the pair of long support portions 205 are spaced apart from each other in the X-axis direction, and a space 212 is provided between them. In addition, the pair of support bases 211 are arranged such that the longitudinal direction of the upper surface thereof is along the Y-axis direction. A pair of support bases 211 has a chip 14 whose bending strength is to be measured on the upper surface side arranged by a collet 76 or the like. In the first embodiment, the lower surface 11-2 side of the chip 14 is placed on the support base 211. FIG.

The support pedestals 211 have columnar (rod-like) support projections 213 protruding upward at the edge portions adjacent to each other on the top surface, and the top surface other than the edge portions described above is covered with a contact member 214 . The support projection 213 is made of metal such as stainless steel, is arranged parallel to the Y-axis direction, and supports the bottom surface 11-2 side of the chip 14 . In addition, in Embodiment 1, the cross-sectional shape of the upper surface of the support projection 213 is formed into a curved surface that protrudes upward.

The contact member 214 is made of a material (for example, sponge rubber) that is softer than the support projection 213, and is formed in a plate shape with a constant thickness. The contact member 214 has a rectangular planar shape, and the thickness of the contact member 214 in a non-deformed state is greater than the amount of protrusion from the upper surface of the support protrusion 213 .

The contact member 214 supports the chip 14 by overlapping the lower surface 11-2 of the chip 14 on its upper surface. For this purpose, the upper surface of the contact member 214 supports the lower surface 11-2 of the chip 14. FIG. In addition, in the first embodiment, the upper surface of the contact member 214 that is not deformed is arranged about 1 mm above the upper end of the support projection 213 . For this reason, the chip 14 placed on the support table 211 contacts the upper surface of the contact member 214 with the lower surface 11-2 spaced from the support protrusion 213. As shown in FIG. Also, when the indenter 227 presses the tip 14, the contact member 214 is deformed to come into contact with the lower surface 11-2 of the tip 14 and support the lower surface 11-2. For this reason, the upper end 213-1 of the support protrusion 213 is a support surface that supports the lower surface 11-2 of the chip 14. FIG. That is, the long support portion 205 includes upper ends 213-1 of the support protrusions 213, which are support surfaces for supporting the lower surface 11-2 of the chip .

A support table moving mechanism 219 moves each support table 211 in the X-axis direction, and rotates a ball screw 216 rotatably provided on a fixed plate 215 fixed to the apparatus main body 2 and the ball screw 216. and a guide rail 218 that supports each support base 211 movably in the X-axis direction.

The pressing unit 220 presses the chip 14 supported by the support unit 210 with an indenter 227, measures the load applied to the pressing unit 220 when the chip 14 is pressed, and presses the chip 14 supported by the support unit 210. It is destructive. The pressing unit 220 is provided above the lower container 201 .

As shown in FIGS. 6 and 7, the pressing unit 220 includes a moving mechanism 230 as moving means, a moving base 221, and an indenter 227. As shown in FIGS.

The moving mechanism 230 moves the indenter 227 relatively close to the tip 14 supported by the pair of long support portions 205 in the Z-axis direction. The moving mechanism 230 includes a support plate 231 extending upward from the device main body 2 and fixed to the device main body 2, a ball screw 232 supported by the support plate 231 so as to be rotatable about its axis, and the ball screw 232 being an axis. It has a motor 233 that rotates and a guide rail 234 that supports the movable base 221 so as to be movable in the Z-axis direction.

The longitudinal directions of the support plate 231, ball screw 232 and guide rail 234 are parallel to the Z-axis direction. The ball screw 232 is screwed into a screw hole provided in the movable base 221 . A guide rail 234 is attached to the support plate 231 . The moving mechanism 230 moves the indenter 227 in the Z-axis direction via the moving base 221 by rotating the ball screw 232 around the axis by the motor 233 .

The movable base 221 is formed in a rectangular parallelepiped shape, and is connected to a cylindrical first support member 222 extending downward on the lower surface side. A certain load measuring instrument 223 is fixed. The load measuring device 223 measures the load with which the indenter 227 presses the chip 14 supported by the pair of long support portions 205 and outputs the measurement result to the control unit 400 . That is, the test apparatus 1 includes a load measuring instrument 223 that measures the load with which the indenter 227 presses the chip 14 supported by the pair of long support portions 205 .

A holding member 225 is attached to the lower side of the load measuring device 223 via a cylindrical second supporting member 224 . The clamping member 225 is formed in a substantially gate shape when viewed from the front, and an indenter 227 for pressing the chip 14 supported by the pair of long support portions 205 is fixed between a pair of clamping surfaces 226 facing each other. there is

The indenter 227 is positioned above the elongated supports 205 and above the spacing 212 between the pair of elongated supports 205 and extends parallel to the support projections 213 of the elongated supports 205 . The indenter 227 is formed in a tapered plate-like shape, the width of which becomes narrower downward, and the lower end thereof is formed into a downwardly convex curved surface. In the present invention, the shape of the indenter 227 is not limited to this. The lower end of the indenter 227 is supported by the holding member 225 in parallel with the Y-axis direction, and the lower end is arranged above the space 212 between the pair of long support portions 205 .

A pair of plate-shaped connection members 229 are attached to both side surfaces of the movable base 228 . The connection member 229 extends downward from the side surface of the movable base 228 and has a lower end located below the lower end of the holding member 225 .

Further, the pressing unit 220 includes an upper container 240 and an air supply unit 250, as shown in FIG. The upper container 240 is attached to the lower end of the connecting member 229 , has an opening at the bottom, and is formed in a box shape capable of accommodating the pair of support bases 211 of the support unit 210 . The upper container 240 is arranged below the holding member 225 and is provided with an indenter insertion hole 241 through which an indenter 227 can be passed.

The upper container 240 is made of, for example, a transparent material (glass, plastic, etc.). Also, the upper container 240 is sized to be able to enter the lower container 201 through the opening 202 . Therefore, when the pressing unit 220 is moved downward by the moving mechanism 230 , the upper container 240 is inserted into the lower container 201 and covers the upper side of the support unit 210 .

The air supply unit 250 blows air onto the tip of the indenter 227 . The air supply unit 250 includes a nozzle 251 that injects air toward the indenter 227 and an air supply source 253 that supplies air to the nozzle 251 through an on-off valve 252 .

The nozzle 251 is formed in a pipe shape, is passed through the nozzle insertion hole of the upper container 240 , and has its tip facing the tip of the depressor 227 in the upper container 240 . The air supply unit 250 blows air from a nozzle 251 onto the tip of the indenter 227 to remove foreign matter adhering to the tip of the indenter 227, the upper surface of the contact member 214, and the like.

The debris ejection unit 260 ejects the debris 141 (shown in FIG. 18) of the chips 14 present inside the lower container 201 . The fragment discharge unit 260 includes a fragment discharge path 261 forming a path for discharging the fragments 141 of the chip 14 and a suction source 263 connected to the fragment discharge path 261 via an on-off valve 262 .

One end of the fragment discharge path 261 is connected to a fragment discharge port penetrating the bottom of the lower container 201 , and the other end is connected to a suction source 263 via an on-off valve 262 .

The debris discharge unit 260 discharges the debris 141 out of the lower container 201 by opening the on-off valve 262 and causing the suction source 263 to suck the debris discharge path 261 .

The intensity measurement mechanism 200 also includes an imaging camera 270 that takes an image of the inside of the lower container 201 . The imaging camera 270 images the chip 14 supported by the support unit 210, the tip of the indenter 227, and the like.

When measuring the bending strength of the chip 14 , the strength measuring mechanism 200 moves a pair of Along with adjusting the position of the support bases 211 in the X-axis direction, a gap 212 having a width corresponding to the dimensions of the chip 14 is formed between the pair of support bases 211 . The strength measuring mechanism 200 has a chip 14 placed on a pair of support bases 211 by collets 76 or the like. At this time, the chip 14 is supported by a pair of support bases 211 at both ends and overlapped with the space 212 at the center.

If the bottom surface 11-2 of the chip 14 comes into contact with the support protrusions 213 when the chip 14 is placed on the pair of support bases 211, the bottom surface 11-2 of the chip 14 may be damaged by the impact during placement. In this case, the bending strength of the tip 14 changes, and it may become difficult to measure the bending strength of the plurality of chips 14 under the same conditions.

For this reason, in the first embodiment, the strength measuring mechanism 200 is provided with the contact member 214 made of a flexible material on the upper surface side of the support base 211 so that the upper surface of the contact member 214 is positioned above the upper end of the support protrusion 213. . In the first embodiment, when the chip 14 is placed on the pair of support bases 211 , the chip 14 contacts the upper surface of the contact member 214 without contacting the support projections 213 and is supported by the upper surface. As a result, the strength measuring mechanism 200 can prevent the lower surface 11-2 side of the chip 14 from contacting the support protrusion 213 and being damaged when the chip 14 is arranged, and can suppress changes in the bending strength of the chip 14. FIG.

In the strength measuring mechanism 200, the moving base 221, the indenter 227, the upper container 240, etc. are lowered by the moving mechanism 30, the upper container 240 is inserted into the lower container 201, and the pair of long supports 205 are formed by the upper container 240. is covered, the indenter 227 and the like are further lowered by the moving mechanism 30, the load (force in the Z-axis direction) applied to the indenter 227 by the pressing of the chip 14 is measured by the load measuring device 223, and the measurement result is appropriately transmitted to the control unit The tip 14 is destroyed by the indenter 227 while outputting to 400 . The strength measuring mechanism 200 performs a three-point bending test using a pair of support protrusions 213 and an indenter 227 of the tip 14, measures the bending strength (bending strength) of the tip 14 by the three-point bending test, and obtains the measurement result. to the control unit 400 .

(Cleaning Tool Storage Section, Cleaning Tool)
The test apparatus 1 also includes a cleaning tool support section 130 that is a cleaning tool storage section. FIG. 9 is a perspective view of the cleaning tool support of the test apparatus shown in FIG. 1; 10 is a perspective view showing a cleaning tool supported by the cleaning tool support shown in FIG. 9; FIG. 11 is a cross-sectional view taken along line XI--XI in FIG. 10. FIG.

The cleaning tool support section 130 accommodates (supports) a cleaning tool 160 for cleaning the upper ends 213 - 1 of the support projections 213 of the pair of long support sections 205 . In the first embodiment, the cleaning tool support section 130 is arranged next to the lower imaging unit 102 in the Y-axis direction (that is, at a position overlapping the movement path of the collet 76). In Embodiment 1, the cleaning tool support section 130 is arranged between the lower imaging camera 103 of the lower imaging unit 102 and the chip support base 114 . The cleaning tool support part 130 is formed in a columnar shape erected from the apparatus main body 2 and sucks and holds the cleaning tool 160 on the upper surface 131 by being sucked from the suction source.

In the first embodiment, the cleaning tool 160 is formed in a plate shape having a planar shape of 10 mm square and a thickness of about 1 mm. Further, in Embodiment 1, the cleaning tool 160 is made of nonwoven fabric.

(Controller unit)
The control unit 400 controls each of the above-described units of the test apparatus 1 to cause the test apparatus 1 to perform test operations on each chip 14 . The control unit 400 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. is a computer having The arithmetic processing device of the control unit 400 performs arithmetic processing according to the computer program stored in the storage device, and outputs control signals for controlling the test device 1 to the above-described control signals of the test device 1 via the input/output interface device. output to each unit that

The control unit 400 is connected to a display unit 300 which is display means having a display screen 301 for displaying the state of test operation, images, etc., and is connected to the control unit 400 so that an operator can transmit information such as information to the control unit 400 of the test apparatus 1 . is connected to a touch panel 302, which is an input means used when inputting . The display unit 300 is configured by a liquid crystal display device or the like. The touch panel 302 is superimposed on the display screen 301 of the display unit 300 .

(Measuring method)
Next, this specification demonstrates the measuring method which concerns on Embodiment 1 based on drawing. FIG. 12 is a flow chart showing the flow of the measurement method according to the first embodiment. The measuring method is a method for measuring the bending strength of the tip 14, and as shown in FIG. 12, includes an apparatus preparation step ST1, a load detection step ST2, and a cleaning step ST5.

(Equipment preparation step)
The apparatus preparation step ST1 is a step of preparing the test apparatus 1, which is the chip breaking apparatus described above. In the first embodiment, in the apparatus preparation step ST1, the operator places the cassette 4 containing a plurality of wafer units 17 on the cassette mounting table 3, places the cleaning tool 160 on the upper surface 131 of the cleaning tool supporting portion 130, and touches the touch panel. 302 is operated to input test content information to the control unit 400 . In the device preparation step ST1, when the control unit 400 receives the test start instruction from the operator, the test device 1 sucks and holds the cleaning tool 160 on the upper surface 131 of the cleaning tool supporting portion 130, and proceeds to the load detection step ST2.

(Load detection step)
FIG. 13 is a cross-sectional view showing a state in which predetermined chips of the wafer and the push-up mechanism are aligned in the load detection step of the measuring method shown in FIG. 14 is a cross-sectional view showing a state in which a predetermined chip on the wafer shown in FIG. 13 is pushed up by the pushing-up mechanism. 15 is a cross-sectional view showing a state in which the collet holds the predetermined tip shown in FIG. 14 by suction. 16 is a cross-sectional view showing a state in which a pair of elongated support portions of the support unit supports the chip in the load detection step of the measuring method shown in FIG. 12. FIG. 17 is a cross-sectional view showing a state in which the tip shown in FIG. 16 is pressed by the indenter and is in contact with the upper ends of the support projections of the long support portion. FIG. 18 is a cross-sectional view showing a broken state of the chip shown in FIG.

In the load detection step ST2, the chip 14 supported by the collet 76 is placed on the pair of long support portions 205, and then the chip 14 supported by the pair of long support portions 205 is pressed by the indenter 227 and broken. , the load measuring device 223 detects the load when the chip 14 breaks. In the first embodiment, in the load detection step ST2, the control unit 400 controls the loading/unloading unit 5 to unload the wafer unit 17 including the wafers 10 to be tested from the cassette 4 and temporarily place them on the pair of temporary placement rails 6. Then, the loading/unloading unit 5 is controlled to place the annular frame 16 of the wafer unit 17 temporarily placed on the temporary placement rail 6 on the lowered frame supporting member 18 of the frame fixing unit 7 . The control unit 400 controls the frame fixing unit 7 to raise the frame support member 18 to fix the wafer unit 17 with the frame fixing unit 7 , and then controls the moving mechanism 30 to fix it with the frame fixing unit 7 . Then, the wafer unit 17 is positioned on the push-up mechanism 50 .

The control unit 400 causes the imaging camera 60 to image the wafer 10 of the wafer unit 17 fixed to the frame fixing unit 7 . The control unit 400 aligns the predetermined chip 14 of the wafer 10 with the push-up mechanism 50, as shown in FIG. The control unit 400 controls the push-up mechanism 50 to raise the push-up portion 52 of the push-up portion 52 to push up the predetermined tip 14 as shown in FIG. As shown in FIG. 15, the control unit 400 controls the pick-up mechanism 70 and the like to suck and hold a predetermined chip 14 on the collet 76 . The control unit 400 controls the chip observation mechanism 100 to capture images of the top surface 11-1, the bottom surface 11-2, and the side surface determined by the test content information, acquire these images, and store them in the storage device. The bottom surface 11 - 2 of the chip 14 is placed on the pair of elongated supports 205 of the strength measuring mechanism 200 .

In the first embodiment, in the load detection step ST2, the control unit 400 controls the strength measuring mechanism 200 to lower the upper container 240 and the like by the moving mechanism 230, insert the upper container 240 into the lower container 201, and move the upper container 240 down. A container 240 covers the upper side of the pair of elongated supports 205 . In the load detection step ST2, the control unit 400 controls the strength measuring mechanism 200 to further lower the indenter 227 and the like by the moving mechanism 30, and as shown in FIG. The -1 side is brought into contact with the tip 14 and pressed by the indenter 227 . Also, the load (force in the Z-axis direction) applied to the indenter 227 by pressing the tip 14 is measured by the load measuring device 223, and the measurement result is output to the control unit 400 as appropriate.

In the load detection step ST2, the control unit 400 controls the strength measuring mechanism 200 to further lower the indenter 227 and the like, further press the tip 14 with the indenter 227, and deform the contact member 214 supporting the tip 14. , the tip 14 is bent. As a result, as shown in FIG. 17, the lower surface 11-2 of the chip 14 comes into contact with the support projections 213 of the support table 211, the chip 14 is supported by the pair of support projections 213, and the indenter 227 presses the chip 14. This load increases. At this time, depending on the flexibility of the contact member 214, only deformation of the contact member 214 may occur and the chip 14 may not bend.

In the load detection step ST2, the control unit 400 controls the strength measuring mechanism 200 to further lower the indenter 227 so that the pressing force applied from the indenter 227 to the tip 14 exceeds a predetermined value. Chip 14 is destroyed as shown. When the chip 14 is destroyed, the load measured by the load measuring device 223 changes from the maximum value to zero. Therefore, the strength measuring mechanism 200 can detect the timing at which the tip 14 is broken from the change in the load value measured by the load measuring device 223 . Also, the maximum value of the load measured by the load measuring device 223 corresponds to the bending strength of the chip 14 .

When the chip 14 is destroyed, fragments 141 of the chip 14 scatter. Here, when the chip 14 is pressed by the indenter 227 , the upper container 240 covers the chip 14 and the pair of support bases 211 of the support unit 210 . As a result, the fragment 141 of the tip 14 is prevented from scattering outside the strength measuring mechanism 200 .

As described above, since the upper container 240 prevents the fragments 141 from scattering, the operator of the strength measuring mechanism 200 can omit wearing protective equipment such as goggles when testing the bending strength of the chip 14 . This prevents deterioration in the visibility of the components of the strength measuring mechanism 200 (the indenter 227 and the like) and the tip 14 due to the wearing of protective equipment.

When the tip 14 is pressed by the indenter 227 , foreign matter (fragment 141 of the tip 14 , etc.) may adhere to the indenter 227 . Since this foreign matter may affect the accuracy of the test, it is preferably removed. In the first embodiment, after measuring the bending strength of the chip 14 , the strength measuring mechanism 200 blows air onto the indenter 227 by the air supply unit 250 to remove foreign matter adhering to the indenter 227 . In the present invention, there is no limitation on the timing of removing foreign matter from the indenter 227 or the like using the air supply unit 250 . For example, after the test of one chip 14 is completed, the removal of the foreign matter is performed as necessary until the test of the next chip 14 is performed.

Also, the air injected toward the tip of the indenter 227 flows inside the upper container 240 and is also blown onto the pair of long support members 205 . As a result, foreign matter (fragments 141 of the chip 14, etc.) adhering to the upper surfaces of the support projections 213 and the contact members 214 are blown away by the air and removed. As a result, when performing the next test, it is possible to prevent foreign matter from contacting the bottom surface 11-2 of the chip 14 and damaging the chip 14. FIG.

In addition, when the tip of the nozzle 256 is arranged toward the upper surface of the support base 211 , the air jetted from the nozzle 256 is strongly blown to the upper surface side of the support base 211 . In this case, the foreign matter adhering to the support projections 213 and the contact members 214 may be blown away by the air and soared inside the upper container 240, and then adhere to the support projections 213 and the contact members 214 again. In this case, it is difficult to properly remove the foreign matter from the upper surface of the contact member 214 .

On the other hand, in the strength measuring mechanism 200 according to the first embodiment, the tip of the nozzle 256 blows air toward the tip of the indenter 227, so the momentum of the air blown onto the upper surface of the support table 211 is moderately weakened. As a result, the strength measuring mechanism 200 can appropriately remove foreign matter from the upper surface side of the contact member 214 .

As the chip 14 is repeatedly tested and foreign matter is removed by the air supply unit 250 , fragments 141 of the chip 14 are accumulated inside the lower container 201 . Therefore, in the first embodiment, the strength measuring mechanism 200 uses the fragment discharge unit 260 to collect the fragments 141 accumulated inside the lower container 201 . The strength measuring mechanism 200 can quickly remove the debris 141 by using the debris ejection unit 260 without manually cleaning the inside of the opening 202 of the lower container 201 .

In the strength measuring mechanism 200, the upper container 240 is formed smaller than the opening 202 of the lower container 201, and the upper container 240 is formed with an indenter insertion hole 241 into which an indenter 227 is inserted. . Therefore, even if the upper container 240 is lowered toward the lower container 201, the strength measuring mechanism 200 does not seal the opening 202 of the lower container 201 with the upper container 240, so that the fragment 141 of the chip 14 is removed from the fragment outlet. When sucking, outside air is easily taken into the opening 202, and the fragments 141 of the chip 14 can be sucked smoothly.

When the strength measuring mechanism 200 destroys the chip 14, the control unit 400 of the test apparatus 1 determines whether or not to end the measuring method (step ST3). In the first embodiment, the control unit 400 determines to end the measurement method when all the chips 14 of all the wafer units 17 in the cassette 4 are destroyed (step ST3: Yes). In the first embodiment, the control unit 400 determines that the measurement method will not end unless all the chips 14 of all the wafer units 17 in the cassette 4 are destroyed (step ST3: No), and it is time to clean. It is determined whether or not (step ST4).

The cleaning timing is the timing of cleaning the upper end 213-1 of the support projection 213 with the cleaning tool 160, for example, each time one chip 14 is destroyed or each time a predetermined number of chips 14 are destroyed. It is stored in the storage device of the control unit 400 as part of the information.

When the control unit 400 of the test apparatus 1 determines that it is not the cleaning timing (step ST4: No), it returns to the load detection step ST2. When the control unit 400 of the test apparatus 1 determines that it is the cleaning timing (step ST4: Yes), the process proceeds to the cleaning step ST5.

(cleaning step)
19 is a perspective view showing a state in which the cleaning tool is suction-held on the lower surface of the collet in the cleaning step of the measuring method shown in FIG. 12. FIG. 20 is a cross-sectional view showing a state in which the cleaning tool shown in FIG. 19 is cleaning the upper ends of the support projections of the pair of long support portions; FIG.

In the first embodiment, the cleaning step ST5 holds the cleaning tool 160 with the collet 76 after performing the load detection step ST2, moves the cleaning tool 160 to the mounting position with the collet moving mechanism 80, and moves the upper end 213-1 of the support protrusion 213. is cleaned with the cleaning tool 160 .

In Embodiment 1, in the cleaning step ST5, the control unit 400 controls the strength measuring mechanism 200 to lift the upper container 240 and the like by the moving mechanism 230, thereby exposing the pair of long support portions 205. FIG. In the cleaning step ST5, the control unit 400 controls the collet moving mechanism 80 to bring the collet 76 to face the cleaning tool 160 supported by the cleaning tool support portion 130, and then lowers the collet 76 so that the cleaning tool 160 are brought into contact with each other, the suction holding of the cleaning tool support portion 130 is stopped, and the cleaning tool 160 is held on the lower surface 79 of the collet 76 by suction. In the cleaning step ST5, the control unit 400 controls the collet moving mechanism 80 to bring the cleaning tool 160 sucked and held on the lower surface 79 of the collet 76 into contact with the upper end 213-1 of the support protrusion 213, as shown in FIG. .

In the first embodiment, in the cleaning step ST5, the control unit 400 controls the collet moving mechanism 80 and the support base moving mechanism 219 to reciprocate the pair of long support portions 205 in the X-axis direction within a predetermined range for a predetermined time. At the same time, the collet 76 is reciprocated within a predetermined range in the Y-axis direction, and the cleaning tool 160 is slid on the upper end 213-1 of the support projection 213 to remove foreign matter such as the fragment 141 from the upper end 213-1 of the support projection 213. Remove. In the first embodiment, in the cleaning step ST5, the control unit 400 stops the reciprocating movement of the collet 76 and the pair of long support portions 205 after a predetermined time has elapsed, controls the collet moving mechanism 80, and cleans the collet 76. The cleaning tool 160 is transported to the cleaning tool support section 130, and the cleaning tool 160 is held by suction on the upper surface 131 of the cleaning tool support section 130. After completing the cleaning of the upper end 213-1 of the support protrusion 213, the process proceeds to the load detection step ST2. return. For this purpose, the test apparatus 1 continuously measures the bending strength of the plurality of chips 14 .

Thus, in the first embodiment, in the cleaning step ST5, the cleaning tool 160 sucked and held by the collet 76 is slid over the upper end 213-1 of the support projection 213 to remove the fragments 141 and the like of the upper end 213-1 of the support projection 213. Foreign matter is removed from the upper end 213-1 of the support projection 213. FIG. Further, in the first embodiment, the cleaning tool 160 in which the collet 76 is supported by the cleaning tool supporting part 130 cleans the upper ends 213-1 of the support projections 213 of the pair of long support parts 205, so that the chip conveying unit 20 is , the cleaning tool 160 housed (supported) in the cleaning tool support 130 also serves as cleaning means for cleaning the upper ends 213-1 of the support projections 213 of the pair of long support parts 205. As shown in FIG.

As described above, in the measuring method and testing apparatus 1 according to the first embodiment, after performing the load detection step ST2, the cleaning tool 160 is held by the collet 76 and moved to the mounting position by the collet moving mechanism 80. In order to perform the cleaning step ST5 of cleaning the upper ends 213-1 of the support projections 213 of the pair of long support portions 205 with the cleaning tool 160, the upper ends 213-1 of the support projections 213 supporting the chip 14 are removed in the load detection step ST2. Foreign matter such as fragments 141 can be removed, and as a result, even when measuring the flexural strength of a plurality of chips 14, the flexural strength of each chip 14 can be measured accurately.

[Embodiment 2]
A measuring method and a testing apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. 21 is a cross-sectional view of a cleaning tool used in the measuring method according to Embodiment 2. FIG. 22 is a cross-sectional view showing a state in which the cleaning tool is cleaning the upper ends of the support protrusions of the pair of long support portions in the cleaning step of the measurement method according to the second embodiment; FIG. In addition, FIG.21 and FIG.22 attach|subjects the same code|symbol to the same part as Embodiment 1, and abbreviate|omits description.

The measuring method and testing apparatus 1 according to Embodiment 2 are the same as those in Embodiment 1 except that the configuration of the cleaning tool 160-2 for cleaning the upper end 213-1 of the support projection 213 differs from that in Embodiment 1. The cleaning tool 160-2 used in the measuring method and testing apparatus 1 according to the second embodiment has the same planar shape as the cleaning tool 160 according to the first embodiment, and as shown in FIG. and a sealing portion 162 made of a non-air-permeable material covering the entire outer peripheral surface of the main body 161 .

The body portion 161 is formed in a flat plate shape, has a held surface 163 which is held by suction on the lower surface 79 of the collet 76, and an upper end 213-1 of the support projection 213 on the back surface of the held surface 163, and a cleaning tool support portion. and a cleaning surface 164 which is held by suction to the upper surface 131 of 130 . The held surface 163 is the upper surface of the body portion 161 , and the cleaning surface 164 is the lower surface of the body portion 161 and is exposed without being covered by the seal portion 162 .

In the measurement method according to the second embodiment, in the cleaning step ST5, the control unit 400 causes the cleaning surface 164 of the cleaning tool 160-2 to contact the upper end 213-1 of the support projection 213 as shown in FIG. , the collet moving mechanism 80 and the support base moving mechanism 219 are controlled to reciprocate the pair of elongated support portions 205 in the X-axis direction for a predetermined period of time and to reciprocate the collet 76 in the Y-axis direction within a predetermined range. . At this time, the test apparatus 1 removes foreign matter such as the fragments 141 on the upper end 213-1 of the support projection 213 with the collet 76 through the body portion 161 of the cleaning tool 160-2 by the suction holding force of the lower surface 79 of the collet 76. By suctioning, the cleaning surface 164 of the cleaning tool 160-2 is caused to adsorb foreign matter such as the fragment 141. As shown in FIG.

In the second embodiment, in the cleaning step ST5, the control unit 400 stops the reciprocating movement of the collet 76 and the pair of long support portions 205 after a predetermined time has elapsed, and controls the collet moving mechanism 80, as in the first embodiment. Then, the cleaning tool 160 is conveyed to the cleaning tool support portion 130 by the collet 76, and the cleaning tool 160-2 is held by suction on the upper surface 131 of the cleaning tool support portion 130, thereby cleaning the upper end 213-1 of the support projection 213. When finished, the process returns to the load detection step ST2.

Since the measuring method and testing apparatus 1 according to the second embodiment performs the cleaning step ST5 after performing the load detection step ST2, debris from the upper end 213-1 of the support projection 213 supporting the chip 14 is detected in the load detection step ST2. Foreign matter such as 141 can be removed. As a result, even when measuring the flexural strength of a plurality of chips 14, the flexural strength of each chip 14 can be measured accurately.

In addition, in the cleaning step ST5, the measuring method and testing apparatus 1 according to the second embodiment adsorb foreign substances such as fragments 141 to the cleaning tool 160-2, so that foreign substances such as fragments 141 can be removed from the upper ends of the support projections 213. .

[Embodiment 3]
A measuring method and a testing apparatus according to Embodiment 3 of the present invention will be described with reference to the drawings. 23 is a cross-sectional view showing a state in which the cleaning tool is cleaning the upper ends of the support projections of the pair of long support portions in the cleaning step of the measurement method according to Embodiment 3. FIG. In addition, FIG. 23 attaches|subjects the same code|symbol to the same part as Embodiment 1, and abbreviate|omits description.

The measuring method and testing apparatus 1 according to Embodiment 3 are the same as those in Embodiment 1 except that the configuration of cleaning tool 160-3 for cleaning upper end 213-1 of support projection 213 is different. A cleaning tool 160-3 used in the measuring method and testing apparatus 1 according to the third embodiment is made of a non-breathable material, and has the same planar shape as the cleaning tool 160 according to the first embodiment. In addition, as shown in FIG. 23, a held portion 165 sucked and held by the lower surface 79 of the collet 76 and a suction opening 166 connected to the outer edge of the held portion 165 and facing the upper end 213-1 of the support projection 213 are provided. and a frame-shaped portion 167 .

The held portion 165 is formed in a flat plate shape having the same planar shape as the cleaning tool 160 according to the first embodiment. The inner edge of the suction opening 166 of the frame-shaped portion 167 is positioned outside the support projections 213 when the cleaning tool 160-3 cleans the upper ends 213-1 of the support projections 213 of the pair of long support portions 205. FIG. The lower surface of the frame-shaped portion 167 has a suction opening 166 that forms a cleaning surface 168 that cleans the upper end 213-1 of the support projection 213 and that is suction-held on the upper surface 131 of the cleaning tool support portion .

The cleaning tool 160-3 is connected to a suction source 172 through a flexible hose 171 in the frame-shaped portion 167. As shown in FIG. Hose 171 is sufficiently long to allow cleaning tool 160-3 to move from cleaning tool support 130 to elongated support 205. FIG. In Embodiment 3, the hose 171 is provided with an on-off valve 173 .

In the measurement method according to the third embodiment, in the cleaning step ST5, the control unit 400 positions the upper end 213-1 of the support projection 213 within the suction opening 166 and the upper end 213-1 of the support projection 213, as shown in FIG. 1 and the cleaning surface 168 of the cleaning tool 160-3 are positioned on the same plane, the on-off valve 173 is opened, the inside of the frame-shaped portion 167 is sucked by the suction source 172, and through the suction opening 166, Foreign matter such as the fragment 141 on the upper end 213-1 of the support projection 213 is sucked and removed.

In the third embodiment, in the cleaning step ST5, the control unit 400 closes the on-off valve 173 after a predetermined time has elapsed, controls the collet moving mechanism 80, and conveys the cleaning tool 160 to the cleaning tool support section 130 with the collet 76. Then, the cleaning tool 160-3 is sucked and held on the upper surface 131 of the cleaning tool support portion 130, the cleaning of the upper end 213-1 of the support projection 213 is finished, and the process returns to the load detection step ST2.

Since the measuring method and testing apparatus 1 according to Embodiment 3 performs the cleaning step ST5 after performing the load detection step ST2, debris from the upper end 213-1 of the support projection 213 that supports the chip 14 is detected in the load detection step ST2. Foreign matter such as 141 can be removed. As a result, even when measuring the flexural strength of a plurality of chips 14, the flexural strength of each chip 14 can be measured accurately.

In the cleaning step ST5, the measuring method and testing apparatus 1 according to the third embodiment sucks and removes foreign matter such as fragments 141 through the suction opening 166 of the cleaning tool 160-3. Foreign matter such as fragments 141 can be removed from the .

[Modification]
Measurement methods according to modifications of Embodiments 1, 2 and 3 of the present invention will be described with reference to the drawings. FIG. 24 is a flow chart showing the flow of the measurement method according to the modification of the first, second, and third embodiments. In addition, FIG. 24 attaches|subjects the same code|symbol to the same part as Embodiment 1, and abbreviate|omits description.

As shown in FIG. 24, the test apparatus 1 according to the modification of Embodiments 1, 2, and 3 is the same as that of Embodiment 1 except that the cleaning step ST5 is performed before the load detection step ST2. be.

Since the measuring method and testing apparatus 1 according to the modification performs the cleaning step ST5, foreign matter such as the fragment 141 can be removed from the upper end 213-1 of the support projection 213 that supports the chip 14 in the load detection step ST2. Even when measuring the bending strength of the tip 14, there is an effect that the bending strength of the tip 14 can be measured accurately.

Further, since the measuring method and testing apparatus 1 according to the modification performs the cleaning step ST5 before performing the load detection step ST2, the debris 141 or the like is removed from the upper end 213-1 of the support projection 213 before the load detection step ST2. It is possible to suppress the adhesion of foreign matter.

It should be noted that the present invention is not limited to the above-described embodiments and the like. That is, various modifications can be made without departing from the gist of the present invention. In Embodiments 1 and 2 described above, both the collet 76 and the pair of long support portions 205 are reciprocated in the cleaning step ST5. At least one of 76 and the pair of long support portions 205 should be reciprocated. Moreover, in the embodiment, the measuring method and testing apparatus 1 measures the bending strength of the tip 14, but in the present invention, the strength of various test pieces other than the tip 14 may be measured.

1 Test equipment (chip destruction equipment)
11-2 Lower surface 14 Chip (test piece)
20 chip transport unit (specimen transport means, cleaning means)
76 collet 79 lower surface (suction holding surface)
80 collet moving mechanism (collet moving means)
130 cleaning tool support (cleaning tool storage part)
141 Debris (foreign object)
160, 160-2, 160-3 cleaning tool 161 main body 163 held surface 164 cleaning surface 205 long support 213-1 upper end (support surface)
223 load measuring instrument (load measuring means)
227 indenter 230 moving mechanism (moving means)
ST1 Equipment preparation step ST2 Load detection step ST5 Cleaning step

Claims (4)

A measuring method for measuring the strength of a test piece,
A pair of long supports including a support surface for supporting the lower surface of the test piece and arranged at a predetermined distance from each other, and arranged above the long supports and between the pair of long supports an indenter extending parallel to the elongated support portion, a moving means for moving the indenter relatively close to the test piece supported by the pair of elongate support portions; A load measuring means for measuring the load pressing the test piece supported by the elongate support, a collet for holding the test piece, a pick-up position for picking up the test piece, and the test piece on the pair of elongate supports. a device preparation step of preparing a chip breaking device having collet moving means for moving the collet between a mounting position and a mounting position;
The test piece held by the collet was placed on the pair of long support portions, and then the test piece supported by the pair of long support portions was pressed by the indenter to break, and the test piece was broken. a load detection step of detecting an actual load with the load measuring means;
a cleaning step of holding a cleaning tool by the collet and moving it to the placement position by the collet moving means to clean the support surface with the cleaning tool before or after performing the load detection step;
measurement method with The collet includes a suction holding surface for holding the test piece by suction,
The cleaning tool has a main body made of a porous material including a surface to be held by the collet by suction and a cleaning surface for cleaning the support surface behind the surface to be held,
2. The measuring method according to claim 1, wherein in the cleaning step, foreign matter on the support surface is sucked by the collet through the cleaning tool to cause the foreign matter to adhere to the cleaning surface of the cleaning tool. 2. The measuring method according to claim 1, wherein in the cleaning step, the cleaning tool sucked and held by the collet is slid on the support surface to remove foreign substances on the support surface from the support surface. A test device for measuring the strength of a test piece,
a pair of elongated support portions including a support surface for supporting the lower surface of the test piece and arranged at a predetermined distance from each other;
an indenter disposed above the elongate supports and between the pair of elongate supports and extending parallel to the elongate supports;
moving means for moving the indenter relatively close to the test piece supported by the pair of long support portions;
a load measuring means for measuring the load with which the indenter presses the test piece supported by the pair of long support portions;
a collet holding a test piece; and collet moving means for moving the collet between a pick-up position for picking up the test piece and a mounting position for mounting the test piece on the pair of long supports. a test strip transport means;
a cleaning tool storage unit that stores a cleaning tool for cleaning the support surfaces of the pair of long support parts;
cleaning means for cleaning the support surfaces of the pair of long support portions with the cleaning tool housed in the cleaning tool housing;
A test apparatus, wherein the test piece conveying means also serves as the cleaning means.

Images