JP7252871B2 - SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE USING SUBSTRATE STRUCTURE - Google Patents

Description

The present disclosure relates to a base structure and an electronic device using the base structure.

For example, Patent Document 1 (surface acoustic wave device) is known as an electronic device using an acoustic wave chip. The surface acoustic wave device disclosed in Patent Document 1 includes a circuit wiring board, a surface acoustic wave element mounted on the circuit wiring board, and a seal enclosing the side surface of the surface acoustic wave element and joined to the circuit wiring board. and a resin. A space is located between the circuit wiring board and the surface acoustic wave element.

JP 2017-175427 A

There is a need for durable substrate structures and electronic devices.

A base structure according to one aspect of the present disclosure includes:
a substrate having a first surface and a first pad located on the first surface;
a joining member overlaid on the first surface and provided with a first opening surrounding the first pad;
has
The joining member has a reinforcing material and a base material impregnated with the reinforcing material.

An electronic device according to one aspect of the present disclosure includes:
a substrate having a first surface and a first pad located on the first surface;
a joining member overlaid on the first surface and provided with a first opening surrounding the first pad;
a first chip facing the first surface through the first opening;
a first bump bonding the first chip and the first pad;
a sealing portion that covers the outer peripheral surface of the first chip and is joined to the base by the joining member;
has
The joining member has a reinforcing material and a base material impregnated with the reinforcing material.

According to the above configuration, the durability of the base structure and the electronic device can be improved.

1 is a perspective view of a base structure according to embodiments; FIG. FIG. 2 is a cross-sectional view taken along line II-II of the base structure shown in FIG. 1; 3 is an enlarged view of III shown in FIG. 2; FIG. FIG. 4A is a diagram showing a substrate produced by firing a laminate in which a plurality of ceramic green sheets are laminated, and FIG. 4B shows a joining member having first and second openings. FIG. 4C is a diagram illustrating a substrate structure created by overlaying a bonding member on a substrate; FIG. FIG. 5A is a diagram showing contacting the base structure and the object, FIG. 5B is a diagram showing crimping the base structure and the object, and FIG. It is a Vc enlarged view. 3 is a modification of the base structure shown in FIG. 2; FIG. 2 is a perspective view of an electronic device using the base structure shown in FIG. 1; FIG. 8 is a cross-sectional view of the electronic device shown in FIG. 7 taken along line VIII-VIII; 9 is a perspective view of a first chip or a second chip shown in FIG. 8; FIG. 9 is an X enlarged view shown in FIG. 8; FIG. FIG. 11A is a diagram illustrating the periphery of a first chip of an electronic device in a first modification, and FIG. 11B is a diagram illustrating the periphery of a first chip of an electronic device in a second modification.

Embodiments of the present disclosure will be described below with reference to the accompanying drawings. 1, Fr indicates front, Rr indicates rear, Le indicates left, Ri indicates right, Up indicates upper, and Dn indicates lower. It should be noted that each drawing to be referred to is shown schematically, and details may be omitted.

[Embodiment]
(Base structure)
Please refer to FIG. For example, an object Ob including electronic components Pa1 and Pa2 is joined to the base structure 10 . For example, the base structure 10 constitutes a part of the package of the electronic components Pa1 and Pa2, and contributes to the mediation of electrical connection between the electronic components Pa1 and Pa2 and a circuit board (not shown). The object Ob to be joined to the base structure 10 may be larger than the base structure 10 or smaller than the base structure 10 .

Please refer to FIGS. For example, the base structure 10 has a base 20 and a joining member 40 overlaid on the base 20 .

(substrate)
The shape of the substrate 20 is arbitrary. The substrate 20 shown in FIG. 1 is a flat substrate. The substrate 20 having a flat plate shape may have a rectangular shape, a circular shape, or an elliptical shape in plan view. Furthermore, the base body 20 may have a cubic shape, a cylindrical shape, or the like as a whole.

The Young's modulus of the substrate 20 is, for example, 250-420 GPa. The coefficient of thermal expansion of the substrate 20 is, for example, 5-12 ppm/K.

As one aspect, the substrate 20 is a double-sided board having a total of two conductor layers only on the top and bottom surfaces. As one aspect, the substrate 20 is a single-layer substrate having a conductor layer only on the top surface. As one aspect, the substrate 20 is a multi-layer board having three or more conductor layers. In this embodiment, a multi-layer substrate is shown.

The substrate 20 shown in FIG. 2 has an insulating substrate main body 21 and conductors 30 positioned inside and on the surface (outside) of the substrate main body 21 .

The material of the base body portion 21 is arbitrary. For example, the material of the base body portion 21 may be an inorganic material or an organic material. Examples of inorganic materials include ceramics and amorphous materials in which a plurality of inorganic particles are bonded together. Examples of organic materials include resins. The resin may contain fillers, for example. In this embodiment, the case where the material of the base body portion 21 is an inorganic material is taken as an example.

The base body 21 shown in FIG. 2 has a first surface 21a on which the joining member 40 is superimposed, a second surface 21b located on the opposite side of the first surface 21a, and the first surface 21a and the second surface 21b. and a third surface 21c connecting the

The conductor 30 includes a plurality of pads 31A-31D positioned on the first surface 21a of the base body 21, a plurality of terminals 32A-32F positioned on the second surface 21b, and these pads 31A-31D and terminals 32A-32F. and an internal conductor 33 that connects and is positioned inside the base body portion 21 . Hereinafter, one arbitrarily selected from among the plurality of pads 31A to 31D will be simply referred to as pad 31, and one arbitrarily selected from among the plurality of terminals 32A to 32F will be simply referred to as terminal 32.

The size and shape of the pads 31A-31D are arbitrary. For example, the thickness of the pads 31A-31D is 1 μm or more and 30 μm or less. The thicknesses of the pads 31A to 31D may all be the same, or the thicknesses may be different. Different thicknesses are possible. The shape of the pads 31A to 31D in plan view may be circular, elliptical, or rectangular, for example. The pads 31A to 31D may all have the same shape, or only some of the pads 31A may have different shapes in relation to the other pads 31B, 31C, and 31D.

The number of pads 31 can be set arbitrarily. For example, the number of pads 31 may be four or more, or may be eight or more. The number of pads 31 may be set according to the number of terminals 32 . The number of terminals 32 can be set arbitrarily.

The size and shape of the terminals 32A-32F are arbitrary. As one aspect, the terminals 32A-32F may have a rectangular flat plate shape. As one aspect, the terminals 32A to 32F may have a needle shape with a predetermined length in the vertical direction. The plurality of terminals 32A to 32F may all have the same size, may have different sizes, or may include terminals with different sizes and terminals with the same size. good too.

The internal conductor 33 is composed of via conductors and conductor patterns. These via conductors and conductor patterns are continuous with each other. The diameter of the via conductor may be, for example, 60 μm or more and 200 μm or less. The via conductor may have, for example, a circular cross-sectional shape or a rectangular cross-sectional shape. The conductor pattern is layered. The thickness of the conductor pattern may be, for example, 10 μm or more and 100 μm or less.

In addition to the above configuration, the upper surface of the substrate 20 may be coated with a solder resist.

(joining member)
Please refer to FIG. The bonding member 40 is superimposed on the base 20 and contributes to bonding between the base 20 and the object Ob. The bonding member 40 may be stacked while being bonded to the base 20 or may be stacked without being bonded to the base 20 .

The shape of the joining member 40 is arbitrary. The joining member 40 shown in FIG. 1 has a layered shape (including a flat plate shape). The joining member 40 may have a rectangular shape or a circular shape in plan view. The shape of the joining member 40 may be changed according to the shape of the surface of the base 20 on which the joining member 40 is placed.

In plan view, the joining member 40 may be slightly larger than the first surface 21 a or smaller than the first surface 21 a of the base 20 . The size of the joining member 40 in plan view may be the same as the size of the first surface 21a. The thickness of the joining member 40 may be 1/2 or less, 1/4 or less, 1/8 or less, or 1/2 the thickness of the base 20. or more. The thickness of the joining member 40 is, for example, 15 μm or more and 100 μm or less.

The bonding member 40 (base material 60 to be described later) may be a cured member or a semi-cured (uncured) member. The semi-cured bonding member 40 is, for example, a member that is cured by applying heat. For example, the object Ob is joined to the joining member 40 by bringing the object Ob into contact with the joining member 40 that has melted and hardening the joining member 40 while the object Ob is in contact with the joining member 40 .

On the other hand, the cured bonding member 40 is a member that is bonded to the object Ob by hardening while the molten object Ob is in contact with the bonding member 40 . Note that the hardened bonding member 40 may be a member that is melted by the application of heat, brought into contact with the object Ob in the molten state, and then hardened to be bonded to the object Ob.

Young's modulus of the joint member 40 is, for example, 15 to 150 GPa. The Young's modulus of the joining member 40 is smaller than the Young's modulus of the substrate 20 containing ceramic, for example. The thermal expansion coefficient of the joining member 40 is, for example, 1-8 ppm/K. The thermal expansion coefficient of the joining member 40 is smaller than that of the substrate 20 containing ceramic, for example.

The joining member 40 has a reinforcing material 50 and a base material 60 impregnated with this reinforcing material 50 .

Please refer to FIG. The joining member 40 has two openings 40 a and 40 b that open to the upper and lower surfaces of the joining member 40 . One opening 40a (the opening 40a located on the left side in FIG. 2) is called the first opening 40a, and the other opening 40b (the opening 40b located on the right side in FIG. 2) is called the second opening. 40b. In the first opening 40a, a through hole 50a (first hole portion 50a described later) formed in the reinforcing member 50 and a through hole 61 formed in the base material 60 (first through hole 61 described later) overlap. It is composed by On the other hand, the second opening 40b includes a through hole 50b (second hole 50b described later) formed in the reinforcing member 50 and a through hole 62 formed in the base material 60 (second through hole 62 described later). are composed by overlapping The inner surface of the first opening 40a surrounds the pads 31A and 31B, and the inner surface of the second opening 40b surrounds the pads 31C and 31D.

The size and shape of the first opening 40a and the second opening 40b are arbitrary. The first opening 40a and the second opening 40b may have the same size, or may have different sizes. The first opening 40a and the second opening 40b in plan view may be rectangular, circular, or elliptical. The first opening 40a and the second opening 40b in plan view may have the same shape, or may have different shapes.

(reinforcing material)
The reinforcement member 50 that constitutes the joint member 40 will be described. In one aspect, stiffener 50 is a fabric. The fabric may be woven or non-woven. FIG. 2 shows a reinforcing material 50 which is a woven fabric. The density of the reinforcing material 50 is set arbitrarily. For example, the warp density and the weft density may each be set within a range of 10 to 100 threads/25 mm.

The size and shape of the reinforcing member 50 are arbitrary. The reinforcing material 50 may be larger than the base material 60 , may be the same size as the base material 60 , or may be smaller than the base material 60 when viewed through the plane. Further, the thickness of the reinforcing material 50 may be, for example, 1 or less of the thickness of the base material 60, or may be 2/3 or less of the thickness of the base material 60. It may be 1/3 or less of the thickness. Note that the reinforcement member 50 may be thicker than the base member 60 . The thickness of the reinforcing member 50 is, for example, 15 μm or more and 100 μm or less. The reinforcing member 50 may have, for example, a rectangular shape or a circular shape when viewed through a plane.

The reinforcing material 50 shown in FIG. 2 has warp yarns 51 extending in the front-rear direction and weft yarns 52 crossing the warp yarns 51 and extending in the left-right direction. Also refer to FIG. The warp yarn 51 is formed by gathering a plurality of fiber portions 51a extending in the front-rear direction. On the other hand, the weft thread 52 is formed by gathering a plurality of fiber portions 52a extending in the left-right direction.

The warp yarns 51 and the weft yarns 52 may be composed of, for example, only glass fibers, or may be composed only of carbon fibers. Furthermore, the warp yarns 51 and the weft yarns 52 may be partly made of glass fiber and the rest made of a material other than glass (for example, carbon fiber). If the warp yarns 51 and weft yarns 52 contain glass fibers, it can be said that the reinforcing material 50 (fabric) is glass cloth. The glass cloth may contain, for example, glass containing silicon dioxide (SiO ₂ ) as a main component.

The warp yarn 51 may have an elongated shape in which a plurality of fiber portions 51a are arranged in the horizontal direction when viewed in a cross section perpendicular to the direction in which the warp yarn 51 extends. On the other hand, the weft thread 52 may have an elongated shape in which a plurality of fiber portions 52a are arranged in the horizontal direction when viewed in a cross section perpendicular to the direction in which the weft thread 52 extends. The glass cloth (cloth) can be thinned by forming the warp yarn 51 and the weft yarn 52 in such a shape. This makes the base structure 10 compact.

Most of the reinforcing material 50 shown in FIG. 2 is covered with the base material 60 . From another point of view, most of the reinforcement member 50 is located inside the base material 60 and part of the reinforcement member 50 is exposed outside from the surface of the base material 60 . For example, the upper surface of the reinforcing member 50 may be exposed to the outside from the upper surface of the base material 60 , or the side surface thereof may be exposed to the outside from the side surface of the base material 60 . However, in other aspects, the reinforcing member 50 may be wholly located inside the base member 60 .

The proportion of the portion of the reinforcing material 50 located outside the base material 60 may be greater than the proportion of the portion of the reinforcing material 50 located inside the base material 60 , or the proportion of the portion of the reinforcing material 50 located inside the base material 60 It may be smaller than the ratio of the site located. The reinforcing material 50 may expose 1% or less of the total volume to the outside, may expose 5% or less of the total volume to the outside, or expose 10% or less of the total volume to the outside. , 50% or less of the total volume may be exposed to the outside, or 50% or more of the total volume may be exposed to the outside.

As shown in FIG. 2 , the reinforcing member 50 is provided with two through holes 50 a and 50 b that open to the upper and lower surfaces of the reinforcing member 50 . Hereinafter, the through hole 50a forming the first opening 40a is referred to as the first hole 50a (through hole located on the left side in FIG. 2), and the through hole 50b forming the second opening 40b is referred to as the second hole 50b. (the through hole located on the right side in FIG. 2). The pads 31A and 31B are positioned inside the first hole 50a, and the pads 31C and 31D are positioned inside the second hole 50b.

By the way, the base material 60 shown in FIG. A through hole 62 is provided. The first through hole 61 forms the first opening 40a together with the first hole 50a, and the second through hole 62 forms the second opening 40b together with the second hole 50b. These first hole portion 50a and second hole portion 50b, along with the first through hole 61 and the second through hole 62, are formed by laser or punching, for example. A portion of the base material 60 other than the first through hole 61 and the second through hole 62 (a portion filled with the material forming the base material 60) is called a solid portion 63. As shown in FIG.

Let us return to the description of the reinforcing member 50 (the first hole portion 50a and the second hole portion 50b). The size and shape of the first hole portion 50a and the second hole portion 50b are arbitrary. For example, the first hole portion 50a may be smaller than the first through hole 61, may be the same size as the first through hole 61, or may be larger than the first through hole 61. . The first hole portion 50 a shown in FIG. 2 is smaller than the first through hole 61 . Specifically, in plan view, the area of the region surrounded by the periphery of the first hole portion 50 a is smaller than the area of the region surrounded by the periphery of the first through hole 61 . Further, the second hole portion 50b shown in FIG. 2 is smaller than the second through hole 62. As shown in FIG. Specifically, in plan view, the area of the region surrounded by the periphery of the second hole portion 50b is smaller than the area of the region surrounded by the periphery of the second through hole 62 .

Please refer to FIGS. A part of the reinforcing material 50 shown in FIG. . In the example shown in FIG. 3, the fiber portions 51a of the warp yarns 51 and the fiber portions 52a of the weft yarns 52 are joined at the portions of the reinforcing member 50 exposed to the outside of the base material 60 from the inner walls 61a and 62a. That is, it can be said that the portion of the reinforcing member 50 exposed to the outside of the base material 60 has a portion where a plurality of fiber portions are joined to each other.

In addition, having a portion where a plurality of fiber portions are joined to each other is interpreted in a broad sense, and includes, for example, the case where only the fiber portion 52a of the weft 52 and the fiber portion 52a of the weft 52 are joined. , the case where only the fiber portion 51a of the warp yarn 51 and the fiber portion 51a of the warp yarn 51 are joined.

Next, the entire portion of the reinforcing member 50 exposed to the outside from the inner walls 61a and 62a will be seen. As one aspect, the portions of the reinforcing member 50 exposed from the inner walls 61a, 62a are continuous along the inner walls 61a, 62a, and the entirety thereof has a frame shape. As one aspect, the portions of the reinforcing material 50 exposed from the inner walls 61a and 62a are entirely discontinuous, and the fiber portions 51a and/or the fiber portions 52a protrude toward the center of the inner walls 61a and 62a in plan view. have everywhere.

The width (horizontal length) of the portion of the reinforcing member 50 exposed to the outside of the base material 60 from the inner walls 61a and 62a may be, for example, 20 μm or less, or may be 10 μm or less. However, it may be 5 μm or less, 1 μm or less, or 20 μm or more. The width may be the same in the circumferential direction, or may be different in each portion in the circumferential direction. The same applies to the size of the portion exposed from the surface of the base material 60 (the portion of the reinforcing member 50) other than the inner walls 61a and 62a.

Finally, the relationship between the reinforcing member 50 and the pads 31A-31D will be described. In the reinforcing member 50 shown in FIG. 3, the portions of the reinforcing member 50 exposed from the inner walls 61a and 62a have upper surfaces located above the pads 31A to 31D. However, for example, the portions of the reinforcing member 50 exposed from the inner walls 61a and 62a do not have to be located above the pads 31A to 31D.

(base material)
In the joint member 40 shown in FIG. 2 , the base material 60 generally forms the outer shape of the joint member 40 . Therefore, for the size and shape of the base material 60, for example, the size and shape of the joining member 40 can be used.

Please refer to FIG. The base material 60 is made of resin, for example. Examples of resins include thermosetting resins such as epoxy resins, phenol resins, melamine resins, bismaleimide triazine resins, urea resins and unsaturated polyester resins. The base material 60 may be in a cured state or in an uncured (for example, semi-cured) state. When the base material 60 is in an uncured state, the combination of the base material 60 and the reinforcing material 50 (joining member 40) is prepreg.

Again, the pads 31A to 31D are positioned inside the first opening 40a and the second opening 40b formed in the joint member 40. As shown in FIG. Pads 31A and 31B (hereinafter referred to as first pads 31A and 31B) are located inside the first opening 40a, and pads 31C and 31D (hereinafter referred to as second pads) are located inside the second opening 40b. 31C and 31D) are located. The first pads 31A and 31B are surrounded by the inner wall 61a of the first through hole 61 forming the first opening 40a, and the second pads 31C and 31D are surrounded by the second through hole forming the second opening 40b. 62 is surrounded by an inner wall 62a.

Next, one example of a method for manufacturing a base structure will be described.

See FIG. 4A. The substrate 20 can be produced by laminating a plurality of ceramic green sheets to form a laminate and then firing the laminate. See also FIG. 4B. The joining member 40 can be produced, for example, by making through-holes (first opening 40a and second opening 40b) in a sheet-like member having cloth such as glass cloth therein by laser or punching. . When the first opening 40a and the second opening 40b are opened with a laser, the heat of the laser may bond a plurality of fiber portions constituting the glass cloth located inside. still,

See also FIG. 4C. After the substrate 20 and the joining member 40 are prepared, the joining member 40 is placed on the upper surface of the substrate 20 . At this time, the joining member 40 may be joined to the upper surface of the base 20 or may not be joined to the upper surface of the base 20 .

An example of a method of bonding an object to a base structure will now be described.

Please refer to FIGS. In FIG. 1, an example object Ob mounted on a base structure 10 is shown in exploded perspective view. For example, the object Ob includes electronic components Pa1 and Pa2 (chips 70 and 80 to be described later) connected to the pads 31A to 31D, and a part (lower surface) of these electronic components Pa1 and Pa2, and the remaining portions (upper surface and side surface). ) and a sealing portion 90 covering the . The electronic components Pa1 and Pa2 have their lower surfaces connected to the pads 31A to 31D exposed from the sealing portion 90. As shown in FIG. The sealing portion 90 may be resin, for example.

Please refer to FIG. One example of a method of bonding the object Ob to the base structure 10 will be described. For example, as shown in FIG. 5A, bumps 3A to 3D are formed on pads 31A to 31D of the base structure 10, and the object Ob is placed on the base structure 10 so that the electronic components Pa1 and Pa2 are in contact with the bumps 3A to 3D. placed on top of the Next, as shown in FIG. 5B, the bumps 3A to 3D are melted to electrically connect the electronic components Pa1 and Pa2 to the pads 31A to 31D. At this time, the semi-cured bonding member 40 is cured to bond the object Ob to the base structure 10 . However, the object Ob and the base structure 10 may be joined by melting the sealing portion 90 .

5A and 5B, the method of bonding the object Ob to the base structure 10 by integrally bonding the electronic components Pa1 and Pa2 and the sealing portion 90 to the base structure 10 has been described. However, for example, the electronic components Pa1 and Pa2 are electrically connected to the pads 31A to 31D via the bumps 3A to 3D, and then the molten resin is applied to the upper surface of the bonding member 40 so as to cover the electronic components Pa1 and Pa2. The target object Ob may be joined to the base structure 10 by supplying and curing this. The resin may be supplied to the upper surface of the joining member 40 by, for example, screen printing or a dispenser. The resin may be in an uncured (liquid or semi-cured) state or in a cured state. The resin may be powder.

Furthermore, in addition to the above method, for example, the electronic components Pa1 and Pa2 are electrically connected to the pads 31A to 31D via the bumps 3A to 3D, and then a sheet-like resin is formed so as to cover the electronic components Pa1 and Pa2. may be placed on the upper surface of the joining member 40 and pressurized and heated to cure the resin and join the object Ob to the base structure 10 . In addition, when the sheet-like resin is melted and/or cured, the resin may be adhered to the bonding member 40 by applying pressure.

See FIG. 5C. In order to join the object Ob to the base structure 10, the sealing portion 90 (resin) may be melted. When the sealing portion 90 (resin) is melted in this manner, the melted resin tends to flow into, for example, the first opening 40a and the second opening 40b (see FIG. 2). For example, when molten resin flows into the first opening 40a and the second opening 40b, the resin that has flowed into the inner wall 61a of the first through hole 61 and/or the second through hole 62 formed in the base material 60 It proceeds along the inner wall 62a (see FIG. 2). After that, the melted resin reaches the portions of the reinforcing member 50 exposed from the inner walls 61a and 62a. This reduces the flow of molten resin toward the base 20 .

Again, the joining member 40 before being joined to the object Ob may be an uncured member or a cured member. From another point of view, the base structure 10 may be distributed with the bonding member 40 in an uncured state, or may be distributed with the bonding member 40 in a cured state. However, even if the bonding member 40 is in an uncured state, the bonding member 40 will be in a cured state when it is bonded to the object Ob. Note that the uncured bonding member 40 may be cured before the molten resin supplied (arranged) on the upper surface of the bonding member 40 when bonding to the object Ob. It may be cured later than the molten resin supplied to the upper surface.

Please refer to FIGS. 5A-5C. 5A to 5C show diagrams of bonding one object Ob to one base structure 10. FIG. However, in a state in which a plurality of base structures 10 are arranged, a plurality of objects Ob may be simultaneously bonded to the plurality of base structures 10 provided.

Please refer to FIG. The joining member 40 has a reinforcing material 50 and a base material 60 impregnated with the reinforcing material 50 . As a result, the strength of the joint member 40 can be improved as compared with the case where the joint member 40 is composed only of the base material 60 . As a result, a durable base structure 10 can be provided.

By increasing the strength of the bonding member 40, the first opening 40a formed in the bonding member 40 can be enlarged while ensuring the strength of the base structure 10. FIG. As a result, it is possible to improve the degree of freedom in positioning the first pads 31A and 31B positioned inside the first opening 40a. Furthermore, it is possible to improve the degree of freedom in size and shape of the electronic components Pa1 and Pa2 electrically connected to the first pads 31A and 31B.

Please refer to FIGS. In addition, the joint member 40 has a first opening 40a surrounding the first pads 31A, 31B. As a result, the first pads 31A and 31B can be exposed to the outside of the base structure 10 while the first pads 31A and 31B are positioned inside the first opening 40a formed in the bonding member 40 . As a result, in the base structure 10 having the reinforcing member 50 surrounding the first pads 31A, 31B, the object Ob and the first pads 31A, 31B can be electrically connected easily. Thereby, productivity can be improved in bonding the object Ob to the base structure 10 .

Please refer to FIGS. The reinforcing material 50 is a cloth (woven fabric or non-woven fabric) in which a plurality of fiber portions intersect (Fig. 2 shows a woven fabric in which the fiber portions 51a of the warp yarns 51 and the fiber portions 52a of the weft yarns 52 intersect). ). Since the reinforcing material 50 is cloth, the base material 60 is impregnated into the reinforcing material 50 with a plurality of continuous fiber portions. As a result, the strength of the joining member 40 can be improved as compared with the case where the reinforcing member 50 is discontinuous. Thereby, a more durable base structure 10 can be provided.

The reinforcing material 50 is glass cloth. By using glass cloth as the reinforcing material 50, the strength of the joining member 40 can be further improved. As a result, a stronger base structure 10 can be provided.

At least a portion of the reinforcing material 50 is exposed outside from the surface of the base material 60 . As a result, the surface roughness of the joint member 40 is increased. As the surface roughness increases, for example, when the object Ob and the joining member 40 are joined by the anchor effect, the two are brought into closer contact with each other. As a result, it is possible to provide the base structure 10 capable of strongly bonding the object Ob.

Please refer to FIG. The reinforcing member 50 has a portion exposed to the outside of the base material 60 from the inner wall 61 a of the first through hole 61 . For example, when the object Ob is melted before being joined to the joining member 40, the object Ob may flow into the first through hole 61 and go toward the first pads 31A and 31B. However, since the reinforcing material 50 has a portion exposed to the outside of the base material 60 from the inner wall 61a, the melted object Ob that has flowed into the first through-hole 61 is separated from the inner wall 61a of the reinforcing material 50 Touch exposed areas. As a result, it is possible to reduce the tendency of the melted object Ob to move toward the first pads 31A and 31B.

In addition, the object Ob that has flowed into the first through hole 61 can be cured while being in contact with the portion of the reinforcing material 50 exposed from the inner wall 61a. As a result, the object Ob is also joined to the reinforcing material 50 . As a result, it is possible to provide the base structure 10 that is more strongly bonded to the object Ob.

Please refer to FIG. A portion of the reinforcing material 50 exposed from the base material 60 has a portion where a plurality of fiber portions are joined together. This makes it possible to further reduce the melted object Ob (see FIG. 1) from moving toward the first pads 31A and 31B.

[Modification]
Please refer to FIG. FIG. 6 shows a base 120 (base structure 110) in a modified example of the present disclosure. Reference numerals are used for parts common to the base 20 (base structure 10) of the embodiment, and detailed description thereof is omitted.

(substrate)
The substrate 120 shown in FIG. 6 includes an insulating substrate body portion 121, a fiber body 22 positioned inside the substrate body portion 121, and electronic components Pa1 and Pa2 (FIG. 6) positioned inside and on the surface of the substrate body portion 121. 1) and a conductor 30 connected thereto. The Young's modulus of the substrate 20 is, for example, 12-40 GPa. The thermal expansion coefficient of the joining member 40 is, for example, 4-12 ppm/K.

The material of the base body portion 121 is, for example, a thermosetting resin. Thermosetting resins include, for example, epoxy resins, phenol resins, melamine resins, bismaleimide triazine resins, urea resins and unsaturated polyester resins.

The fibrous body 22 is, for example, non-woven fabric or woven fabric. The fibrous body 22 may be composed only of glass fibers, or may be composed only of carbon fibers, for example. Further, the fibrous body 22 may be partially composed of glass fiber and the rest composed of a material other than glass (for example, carbon fiber). When the fibrous body 22 contains glass fibers, it can be said that the fibrous body 22 is a glass cloth. The glass cloth may contain, for example, glass containing silicon dioxide (SiO ₂ ) as a main component.

It should be noted that the fibrous body 22 included in the base structure 110 in the modified example is not an essential component for forming the base 120 . Therefore, in the base structure 110, the fiber body 22 can be eliminated from the base 120 as needed.

Next, an electronic device in which an object is bonded to a base structure will be described.

(electronic device)
Please refer to FIG. FIG. 7 shows an electronic device 1 according to an embodiment, in which a mounting body 2 as an example of an object Ob (see FIG. 1) is bonded to a base structure 10 . Also refer to FIG. The electronic device 1 shown in FIG. 8 includes the base structure 10 of the embodiment described above. A detailed description of the parts that are common to the contents described in the embodiment will be omitted. In addition, about a code|symbol, the number used by embodiment is diverted.

The electronic device 1 is mounted on an external device, for example, by connecting the terminals 32A to 32F to the external device by soldering or the like.

(Base structure)
The base structure 10 has the structure already explained. However, the bonding member 40 included in the base structure 10 (electronic device 1) is a cured member. Note that the joint member 40 may be larger than the mounting body 2 , may have the same size as the mounting body 2 , or may be smaller than the mounting body 2 when seen through a plane.

(implementation body)
The mounting body 2 is mounted (bonded) to the base structure 10 via the bonding member 40 . The mounting body 2 shown in FIG. 8 includes a first chip 70 connected to the first pads 31A and 31B, a second chip 80 connected to the second pads 31C and 31D, and the first chip 70 and the second chip and a sealing portion 90 that covers 80 and is joined to the joining member 40 (base structure 10).

The first chip 70 and the second chip 80 are, for example, elastic wave chips capable of outputting a predetermined electric signal by utilizing the characteristic that an elastic wave propagates when an electric signal is input. The elastic wave may be SAW (Surface Acoustic Wave) or BAW (Bulk Acoustic Wave), for example. The acoustic wave chip may be, for example, a chip having an acoustic wave resonator or a chip having an acoustic wave filter. The first chip 70 and the second chip 80 may be MEMS (Micro Electro Mechanical Systems). Also refer to FIG. FIG. 9 schematically shows a chip with a 1-port SAW resonator. For example, such a first chip 70 and a second chip 80 are connected to the first pads 31A, 31B and the second pads 31C, 31D and mounted on the base structure 10 .

(first chip)
Please refer to FIG. The first chip 70 is positioned above the first opening 40a formed in the joint member 40 (positioned in contact with the joint member 40) and faces the first surface 21a through the first opening 40a. At the same time, they are joined to first pads 31A and 31B via bumps 3A and 3B (first bumps 3A and 3B to be described later). A space in which the bumps 3A, 3B and the first pads 31A, 31B are interposed is provided between the first chip 70 and the first surface 21a.

The first chip 70 shown in FIG. 8 has a portion positioned outside the first through hole 61 formed in the base material 60 when viewed in the thickness direction of the joining member 40 (reinforcing material 50). It can also be said that the side surface 70 a of the first chip 70 has a portion located outside the first through hole 61 when viewed in the thickness direction of the joining member 40 . A portion of the first chip 70 located outside the first through hole 61 overlaps the solid portion 63 of the base material 60 when viewed in the thickness direction of the first chip 70 .

When focusing only on the side surface 70 a of the first chip 70 and the solid portion 63 , even if the side surface of the first chip 70 overlaps the solid portion 63 when viewed in the thickness direction of the bonding member 40 , Alternatively, 70% or more of the whole may overlap with the solid portion 63, 40% or more of the whole may overlap, or the ratio of overlapping with the solid portion 63 may be 40% or less. For example, when the solid portion 63 overlaps the entire side surface of the first chip 70 , the first chip 70 closes the first through hole 61 formed in the base material 60 . The first chip 70 and the second chip 80 are covered with the sealing portion 90 except for the bottom surface.

See FIG. For example, the first chip 70 includes a chip substrate 71, an IDT electrode 73 (excitation electrode 73) located on the chip substrate 71, a pair of reflectors 74 and 75 sandwiching the IDT electrode 73, and the IDT electrode 73 and connection portions 78 and 79 connecting the electrode portions 76 and 77 and the IDT electrode 73 .

The size and shape of the chip substrate 71 are arbitrary. The chip substrate 71 may have a rectangular flat plate shape, or may have a circular flat plate shape. The thickness of the chip substrate 71 is, for example, 100 μm or more and 500 μm or less.

The chip substrate 71 may be, for example, a member whose entirety is made of a piezoelectric material, or may be a member having a piezoelectric film formed on a substrate. A chip substrate 71 shown in FIG. 9 has a base portion 71a and a piezoelectric portion 71b positioned on the upper surface of the base portion 71a.

The material of the base portion 71a is arbitrary. The base portion 71a may be made of, for example, a semiconductor containing silicon or the like, a ceramic containing aluminum oxide, or a single crystal material such as sapphire. The base portion 71a may be, for example, a substrate made of only one material, or may be a member in which a plurality of substrates each containing a different material are stacked. For example, the coefficient of thermal expansion of the base portion 71a is smaller than that of the piezoelectric portion 71b.

The piezoelectric portion 71b shown in FIG. 9 is a flat substrate. The piezoelectric portion 71b is a substrate that generates elastic waves on the surface when a signal is input to the IDT electrode 73 (when a voltage is applied). The piezoelectric portion 71b may be adhered to the base portion 71a with an adhesive containing an organic material or an inorganic material, or may be directly attached to the base portion 71a.

The piezoelectric portion 71b may be, for example, thinner than the base portion 71a or thicker than the base portion 71a. For example, the thickness of the piezoelectric portion 71b may be 1/2 or less, 1/10 or less, or 1/30 or less of the thickness of the base portion 71a. It may be 1/2 or more.

The piezoelectric portion 71b shown in FIG. 9 has the same size as the base portion 71a when viewed in the thickness direction of the chip substrate 71. As shown in FIG. However, the piezoelectric portion 71b may be smaller than the base portion 71a or larger than the base portion 71a in plan view. The material of the piezoelectric portion 71b is, for example, crystal (SiO2), lithium niobate (LiNbO3) single crystal, lithium tantalate (LiTaO3) single crystal, or the like.

The IDT electrode 73 shown in FIG. 9 is composed of two interdigitated comb-like electrodes (metal layers). These two comb-shaped electrodes are connected to electrode portions 76 and 77 via connection portions 78 and 79 .

The material of the IDT electrode 73 is, for example, aluminum, copper, or an alloy thereof. The IDT electrode 73 may be, for example, a single-layered electrode, or may be an electrode in which a plurality of layered electrodes are stacked.

The IDT electrode 73 shown in FIG. 9 includes two bus bars 73a and 73b extending in a predetermined direction (for example, the propagation direction of elastic waves) and facing a pair of reflectors 74 and 75 at both ends, and these two bus bars 73a and 73b. It has electrode fingers 73c and 73d perpendicular to the busbars 73a and 73b.

The electrode fingers 73c extend from the busbar 73a toward the busbar 73b, and the electrode fingers 73d extend from the busbar 73b toward the busbar 73a. The electrode finger 73c is connected only to the busbar 73a, and the electrode finger 73d is connected only to the busbar 73b.

The number of electrode fingers 73c and 73d is arbitrary. The plurality of electrode fingers 73c and 73d are arranged alternately so as to mesh with each other. The distance (pitch) between adjacent electrode fingers 73c and 73d is arbitrary. By changing this distance (pitch), the frequency of the elastic wave propagating through the piezoelectric portion 71b changes. Specifically, an elastic wave whose wavelength is half the distance between the electrode fingers 73c and 73d propagates through the piezoelectric portion 71b. Therefore, the distance between the electrode finger 73c and the electrode finger 73d may be appropriately set so as to generate an elastic wave at a desired frequency.

The reflectors 74 and 75 can reflect the elastic waves propagated from the IDT electrodes 73 toward the IDT electrodes 73 . The elastic waves reflected by the reflectors 74 and 75 reach the IDT electrode 73 , are converted into signals, and are output to the outside of the first chip 70 . The reflectors 74 and 75 are positioned together with the IDT electrode 73 on the lower surface of the piezoelectric portion 71b. That is, the reflectors 74 and 75 and the IDT electrode 73 are positioned outside the sealing portion 90 (see FIG. 8).

Reflectors 74 and 75 shown in FIG. 9 include two busbars 74a and 74b extending in a predetermined direction (direction in which elastic waves propagate), and two busbars 74a and 74b perpendicular to these two busbars 74a and 74b and connected to the two busbars 74a and 74b. and a strip electrode 74c. Each of the reflectors 74 and 75 is provided with a plurality of strip electrodes 74c.

Also refer to FIG. The IDT electrode 73 and the pair of reflectors 74 and 75 overlap the first opening 40a when viewed through the plane. As a result, the IDT electrode 73 and the reflectors 74 and 75 are positioned in the space created between the chip substrate 41 and the substrate 20 . As a result, propagation of elastic waves in the piezoelectric portion 71b is facilitated. Incidentally, the IDT electrode 73 and the reflectors 74 and 75 may each be covered with an insulating protective film.

Note that FIG. 9 shows the first chip 70 having only one IDT electrode 73 and one pair of reflectors 74 and 75 . However, the first chip 70 may have multiple IDT electrodes 73 and pairs of reflectors 74 and 75 . Furthermore, a plurality of IDT electrodes may constitute a ladder filter or a multimode filter. The same applies to the second chip 80, which will be described later.

(Second chip)
Please refer to FIG. The description of the first chip 70 may be incorporated into the description of the second chip 80 . At this time, the chip substrate 71 is connected to the chip substrate 81, the IDT electrode 73 is connected to the IDT electrode 83, the reflectors 74 and 75 are connected to the reflectors 84 and 85, the electrode portions 76 and 77 are connected to the electrode portions 86 and 87, and the connection portion 78 is connected. , 79 can be read as connecting portions 88 and 89 . Further, the busbars 73a, 73b and the electrode fingers 73c, 73d constituting the IDT electrodes 73 can be read as the busbars 83a, 83b and the electrode fingers 83c, 83d. The strip electrode 74c can be read as the busbars 83a, 83b and the strip electrode 84c. The second chip 80 is located above the second through hole 62, faces the first surface 21a, and connects the second pads 31C and 31D via bumps 3C and 3D (second bumps 3C and 3D to be described later). is joined to

The shape and dimensions of the first chip 70 and the shape and dimensions of the second chip 80 may be the same or different.

In one aspect, the first chip 70 and the second chip 80 may be electrically connected via terminals 32B (see FIG. 8). By connecting the first chip 70 and the second chip 80 via the terminals 32B, the electronic device 1 can configure, for example, a branching filter (eg, duplexer). For example, the first chip 70 is a filter that passes only electrical signals having frequencies in the passband region for transmission, and the second chip 80 is a filter that passes only electrical signals having frequencies in the passband region for reception. may be The communication band for transmission and the communication band for reception do not overlap each other.

The first chip 70 and the second chip 80 are electrically connected to the first pads 31A, 31B and the second pads 31C, 31D via bumps 3A to 3D, respectively. The bumps 3A and 3B connecting the first chip 70 and the first pads 31A and 31B are hereinafter referred to as first bumps 3A and 3B, and the bumps 3C and 3D connecting the second chip 80 and the second pads 31C and 31D are referred to as first bumps 3A and 3B. are called second bumps 3C and 3D.

(first bump)
The first bumps 3A and 3B shown in FIG. 8 are located inside the first through holes 61 (the first openings 40a formed in the bonding member 40) formed in the base material 60. As shown in FIG. It can also be said that the first bumps 3A and 3B are positioned within a region surrounded by the inner wall 61a of the first through-hole 61 . The first bumps 3A, 3B connect the electrode parts 76, 77 (see FIG. 9) of the first chip 70 and the first pads 31A, 31B of the base structure 10 . The second bumps 3C and 3D contribute to the mounting of the first chip 70 on the base structure 10. As shown in FIG.

The size of the first bumps 3A and 3B is arbitrary. For example, the sizes of the electrode portions 76, 77 and/or the first pads 31A, 31B may be changed as appropriate. The thickness of first bumps 3A and 3B is smaller than the thickness of bonding member 40 . As a result, the first bumps 3A and 3B are accommodated within the area surrounded by the base structure 10, the inner wall 61a of the first through hole 61, and the first chip . This region may be in a vacuum or may be filled with a predetermined gas (for example, an inert gas containing nitrogen or the like, carbon dioxide, or the like).

The first bumps 3A, 3B are, for example, solder. The solder may or may not contain lead. Solders containing lead include, for example, Pb—Sn alloy solders. Examples of lead-free solder include Au--Sn alloy solder, Au--Ge alloy solder, Sn--Ag alloy solder, and Sn--Cu alloy solder. Incidentally, the first bumps 3A and 3B may be a conductive adhesive material in which a conductive filler is mixed with a thermosetting resin or the like.

(second bump)
The second bumps 3C and 3D are located inside the second through holes 62 (the second openings 40b formed in the bonding member 40) formed in the base material 60. As shown in FIG. It can also be said that the second bumps 3C and 3D are positioned within the area surrounded by the inner wall 62a of the second through hole 62. As shown in FIG. The second bumps 3C and 3D connect the electrode portions 86 and 87 of the second chip 80 and the second pads 31C and 31D of the base structure 10, respectively. The second bumps 3C and 3D contribute to the mounting of the second chip 80 on the base structure 10. As shown in FIG.

The size, shape and material of the first bumps 3A, 3B may be applied to the second bumps 3C, 3D. However, the size, shape and material of the second bumps 3C and 3D may differ from the size, shape and material of the first bumps 3A and 3B.

(sealing part)
A sealing portion 90 shown in FIG. 8 covers the first chip 70 and the second chip 80 so that the lower surfaces of the first chip 70 and the second chip 80 are exposed. The material of the sealing portion 90 contains an organic material or an inorganic material. Examples of organic materials include resins (thermosetting resins). Thermosetting resins include epoxy resins, phenolic resins, melamine resins, bismaleimide triazine resins, urea resins, unsaturated polyester resins, and the like. Examples of inorganic materials include amorphous materials in which a plurality of inorganic particles are bonded together. The material of the sealing portion 90 may be the same as the material of the base material 60 or may be different from the material of the base material 60 . Furthermore, the sealing portion 90 may contain a filler.

The Young's modulus of the sealing portion 90 is, for example, 20 GPa or less. For example, the Young's modulus of the sealing portion 90 is smaller than the Young's modulus of the joining member 40 . The thermal expansion coefficient of the sealing portion 90 is, for example, 4-70 ppm/K. For example, the thermal expansion coefficient of the sealing portion 90 is greater than that of the joining member 40 .

Please refer to FIG. 8 and FIG. The sealing portion 90 shown in FIG. 8 includes a lower surface portion 91 joined to the joining member 40, an upper surface portion 92 located on the opposite side of the lower surface portion 91, and a side surface portion 93 connecting the lower surface portion 91 and the upper surface portion 92. a first recess 94 recessed from the lower surface portion 91 toward the upper surface portion 92 and in which the first chip 70 is located; A second concave portion 95 where two chips 80 are located, a first hanging portion 96 extending from the lower surface portion 91 along the inner wall 61a of the first through hole 61 toward the base structure 10, and a second and a second hanging portion 97 extending toward the base structure 10 along the inner wall 62 a of the through hole 62 .

The proportion of the lower surface portion 91 joined to the joining member 40 can be set arbitrarily. The lower surface portion 91 may be entirely joined to the joint member 40, 80% or more of the whole may be joined to the joint member 40, or 60% or more of the whole may be joined to the joint member 40. Alternatively, 60% or less of the whole may be joined to the joining member 40 .

The first hanging portion 96 and the second hanging portion 97 are in close contact with portions of the reinforcing member 50 exposed from the inner walls 61a and 62a of the first through hole 61 and the second through hole formed in the base material 60, respectively. In the example shown in FIG. 8 , the sealing portion 90 having the first hanging portion 96 and the second hanging portion 97 extends to a portion of the reinforcing member 50 exposed from the base material 60 and extends to a portion joined to the reinforcing member 50 . It can be said that it has

The joining member 40 has a reinforcing material 50 and a base material 60 impregnated with the reinforcing material 50 . Thereby, the strength of the joint member 40 can be improved as compared with the case where the joint member 40 is made of only the base material 60 . Accordingly, even when heat is applied to the sealing portion 90 , deformation of the sealing portion 90 is reduced by the bonding member 40 . When the deformation of the sealing portion 90 is reduced, the stress (load) applied to the first chip 70 is reduced. Alternatively, if the deformation of the sealing portion 90 is reduced, it is possible to reduce the risk of applying unintended stress to the first chip 70 . As a result, a durable electronic device 1 can be provided. As a result, the possibility that the characteristics of the first chip 70 are degraded can be reduced.

The first chip 70 is connected to the first pads 31A and 31B via the first bumps 3A and 3B located inside the first through holes 61 together with the first pads 31A and 31B. As a result, the first pads 31A, 31B and the first bumps 3A, 3B are surrounded by the inner walls 61a of the first through holes 61 formed in the reinforcing material 50. As shown in FIG. As a result, the load applied to the first bumps 3A, 3B and the first pads 31A, 31B can also be reduced.

The linear expansion coefficient of the joining member 40 is smaller than that of the sealing portion 90 . As a result, when heat is applied to the bonding member 40 and the sealing portion 90, the bonding member 40 is smaller in thermal expansion. As a result, expansion of the sealing portion 90 is further reduced through the joint member 40 . That is, it is possible to provide the electronic device 1 with more durability.

The sealing portion 90 has a portion joined to a portion of the reinforcing member 50 exposed from the base material 60 of the reinforcing member 50 . Since a part of the sealing portion 90 is joined to the reinforcing member 50, the joining member 40 and the sealing portion 90 are brought into closer contact with each other, and the two are joined more strongly. As a result, a more durable electronic device 1 can be provided.

The first chip 70 has a portion positioned outside the first through hole 61 formed in the base material 60 in a plan perspective view of the first surface 21a. Thereby, for example, the first chip 70 can be mounted on the base structure 10 . As a result, for example, in the production of the electronic device 1, the risk of the first chip 70 falling into the first through hole 61 can be reduced. As a result, it is possible to provide the electronic device 1 with high production efficiency.

The joint member 40 has a second opening 40b at a location where the second chip 80 is positioned. Furthermore, the second chip 80 is bonded to the second pads 31C, 31D located on the first surface 21a via the second bumps 3C, 3D. As a result, the second pads 31C and 31D are positioned inside the second opening 40b formed in the joint member 40. As shown in FIG. As a result, the load applied to the second pads 31C, 31D and the second bumps 3C, 3D can be reduced.

In addition, since the joint member 40 has the second opening 40b, for example, all of the first pads 31A, 31B and the second pads 31C, 31D can be arranged inside the first opening 40a. , there is no need to increase the size of the first opening 40a. As a result, through holes can be formed in the joint member 40 in accordance with the arrangement of the first pads 31A, 31B and the second pads 31C, 31D. Thereby, reduction in the volume of the joint member 40 can be suppressed. That is, it is possible to provide the electronic device 1 with more durability.

Next, an electronic device in the first modified example will be described.

See FIG. 11A. FIG. 11A shows an electronic device 201 according to the first modified example of the present disclosure. For the parts common to the electronic device 1 of the embodiment, reference numerals are used and detailed explanations are omitted.

(First through hole and second through hole)
The first through hole 261 and the second through hole 262 shown in FIG. 11A have the same size as the first chip 70 and the second chip 80 (see FIG. 8), respectively, when viewed in the thickness direction of the base material 260. is. From another point of view, it can be said that the side surface of the first chip 70 entirely overlaps the inner wall 261a of the first through hole 261 when the first surface 21a is viewed through the plane. Further, it can be said that the side surface of the second chip 80 entirely overlaps the inner wall 262a of the second through-hole 262 when viewed through the first surface 21a. For example, since the side surface of the first chip 70 overlaps the inner wall 261a of the first through hole 261 as described above, the direct load applied from the bonding member 240 to the first chip 70 is suppressed and the sealing is prevented. The joint area of the joint member 240 with respect to the stop portion 90 can be increased. As a result, a more durable electronic device 201 can be provided. In addition, when the first surface 21a is viewed through the plane, the side surfaces of the first chip 70 and the second chip 80 and the inner walls 261a and 262a of the first through hole 261 and the second through hole 262 overlap each other. This means that the deviation is 10 μm or less.

Next, an electronic device in the second modified example will be described.

See FIG. 11B. FIG. 11B shows an electronic device 301 according to the second modified example of the present disclosure. For the parts common to the electronic device 1 of the embodiment, reference numerals are used and detailed explanations are omitted.

(First through hole and second through hole)
A first through hole 361 and a second through hole 362 shown in FIG. 11B are larger than the first tip 70 and the second tip 80, respectively, when viewed in the thickness direction of the base material 360. As shown in FIG. From another point of view, the first chip 70 is located inside the first through hole 361 formed in the base material 360 and is surrounded by the inner wall 261a of the first through hole 361 when viewed from above the first surface 21a. It can be said that there is The second chip 80 is positioned inside the second through hole 362 formed in the base material 360 and surrounded by the inner wall 362 a of the second through hole 362 when viewed through the first surface 21 a from above. As a result, contact between the first tip 70 and the second tip 80 and the joining member 340 can be avoided.

Note that the base structure and the electronic device in the present disclosure are not limited to the above-described embodiments and modifications, and may be implemented in various forms. Some examples in which the forms of the base structure and the electronic device are modified are introduced below.

For example, in embodiments the joining member was joined to the underside of the object. However, the bonding member may be bonded to surfaces other than the bottom surface of the object (eg, top surface and/or side surface). Furthermore, the portion of the base on which the joining member 40 is superimposed may be the side surface (side surface portion) of the base or the lower surface (lower surface portion) of the base.

In the embodiment, an example of the joint member configured by the reinforcing material and the base material has been described. However, the joining member may contain filler or the like in addition to these. In the bonding member 40, an example in which one cloth (glass cloth) is impregnated with the base material has been described. The base material may be impregnated. That is, a plurality of cloths may be positioned inside the joining member.

In the embodiment, an example of the reinforcing member with the first opening and the second opening has been described. However, the reinforcing member may have three or more openings. The number of openings can be appropriately changed according to the number of chips (acoustic wave chips) mounted on the base structure. The same applies to the number of through holes formed in the base material. When the electronic device has only one chip, the bonding member may have two or more through holes, or when the electronic device has two or more chips, the bonding member has through holes. may be only one.

In the embodiments, the case where the first chip and the second chip are positioned above the first opening and the second opening has been described. However, the first chip and the second chip may have a part located inside the first opening and/or the second opening. Even in such a case, it can be said that the first chip and the second chip face the first surface through the first opening and/or the second opening.

In this embodiment, an example in which the electronic device includes two acoustic wave chips has been described. However, the number of acoustic wave chips included in the electronic device may be only one, or may be three or more. Furthermore, in the embodiments, the elastic wave chip in which the first chip and the second chip are 1-port resonators has been described. However, the first chip and/or the second chip may also be two-port resonators. That is, the first chip and the second chip do not necessarily have to be the same elastic wave chip. Further, the electronic device in the present disclosure may include electronic components (electronic elements) other than elastic waves.

1, 101, 201, 301... electronic device 3A, 3B... first bump 3C, 3D... second bump 10, 110, 210, 310... base structure 20... base 31A, 31B... first pad 31C, 31D... second 2 pads 40, 240, 340... Joining member 40a, 240a, 340a... First opening 40b, 240b, 340b... Second opening 50... Reinforcing member 51a... Fiber part 52a... Fiber part 60, 260, 360... Base material 61, 261, 361 First through hole 61a, 261a, 361a Inner wall 70 First chip 80 Second chip 90 Sealing part Ob Object

Claims (13)

a substrate having a first surface and a first pad located on the first surface;
a joining member overlaid on the first surface and provided with a first opening surrounding the first pad;
a first chip facing the first surface through the first opening;
a first bump bonding the first chip and the first pad;
a sealing portion that covers the outer peripheral surface of the first chip;
has
The joining member has a reinforcing material and a base material impregnated with the reinforcing material,
At least a portion of the reinforcing member is exposed from the surface of the base material and is not covered with the sealing portion.
electronic device. The part is exposed from the inner wall of the first opening
The electronic device of claim 1 . The first chip has a region in which an elastic wave is generated, facing the base through a space formed by the first opening,
The part surrounds the space in plan view
3. The electronic device according to claim 2. The electronic device according to any one of claims 1 to 3, wherein the reinforcing material is a cloth in which a plurality of fiber portions intersect. The electronic device according to claim 4 , wherein the reinforcing material is glass cloth . 6. The electronic device according to claim 4, wherein the portion of the reinforcing member exposed to the outside of the base material has portions where the plurality of fiber portions are joined. The electronic device according to any one of claims 1 to 6 , wherein the linear expansion coefficient of the joining member is smaller than the linear expansion coefficient of the sealing portion. 2. The sealing portion is bonded to the base by the bonding member, and the sealing portion has a portion bonded to a portion of the reinforcing material exposed from the base material . The electronic device according to any one of claims 1 to 7 . 9. The electronic device according to any one of claims 1 to 8 , wherein the first chip has a portion positioned outside the first opening when viewed from above the first surface. 9. The electronic device according to any one of claims 1 to 8 , wherein the side surface of the first chip overlaps the inner wall of the first opening when seen from above the first surface. The electronic device according to any one of claims 1 to 8 , wherein the first chip is surrounded by the inner wall of the first opening when viewed through the first surface. a second pad located on the first surface;
a second chip facing the first surface;
a second bump bonding the second chip and the second pad;
has
The electronic device according to any one of claims 1 to 11 , wherein the joining member has a second opening at a location where the second chip is positioned. A base structure used for manufacturing the electronic device according to any one of claims 1 to 12,
the substrate;
The bonding member after curing , or a prepreg to be the bonding member in which the base material is in an uncured state ;
A base structure having a

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