JP7251089B2 - multilayer capacitor - Google Patents

Description

The present invention relates to multilayer capacitors.

As a conventional multilayer capacitor, one described in Patent Document 1 is known. This multilayer capacitor includes an element body, a plurality of terminal electrodes formed on one side surface, and a plurality of terminal electrodes formed on the other side surface. This multilayer capacitor has terminal electrodes of different polarities on the same side surface, thereby reducing the ESL.

JP-A-2002-237429

Here, in multilayer capacitors, it is required to improve strength against bending. In addition, multilayer capacitors are required to further reduce ESL. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a multilayer capacitor capable of achieving low ESL while improving bending strength.

A multilayer capacitor according to the present invention has a first main surface and a second main surface facing each other, and a first side surface and a second side surface formed between the first main surface and the second main surface. a first terminal electrode and a second terminal electrode formed on the first side surface of the element body; and a third terminal electrode and a fourth terminal electrode formed on the second side surface of the element body. a terminal electrode, a plurality of first internal electrodes and a plurality of second internal electrodes facing each other in the element body, and a first terminal member connecting the first terminal electrode and the third terminal electrode; a second terminal member connecting the second terminal electrode and the fourth terminal electrode, wherein the plurality of first internal electrodes are connected to at least one of the first terminal electrode and the third terminal electrode; and the plurality of second internal electrodes are connected to at least one of the second terminal electrode and the fourth terminal electrode, and the first terminal member and the second terminal member are arranged on the first principal surface side. and a mounting portion to be mounted on the circuit board, and the first terminal member and the second terminal member overlap each other when viewed from the facing direction of the first main surface and the second main surface. It has an overlapping area.

This multilayer capacitor includes a first terminal member and a second terminal member having mounting portions mounted on a circuit board on the first principal surface side. As a result, the multilayer capacitor is mounted on the circuit board via the mounting portions of the first terminal member and the second terminal member, so that the bending strength of the multilayer capacitor can be improved. Further, it is possible to make the first terminal electrode and the third terminal electrode the same polarity in one polarity, and make the second terminal electrode and the fourth terminal electrode the same polarity in the other polarity. In this case, a first terminal electrode and a second terminal electrode having different polarities are formed on the first side surface of the element body, and a third terminal electrode having different polarities is formed on the second side surface of the element body. An electrode and a fourth terminal electrode are formed. In this way, since terminal electrodes of different polarities can be formed on the same side surface, a low ESL can be achieved. The first terminal member connects the first terminal electrode and the third terminal electrode, and the second terminal member connects the second terminal electrode and the fourth terminal electrode. When viewed from opposite directions, the first terminal member and the second terminal member have overlapping regions that overlap each other. When the first terminal electrode and the third terminal electrode have the same polarity on one side and the second terminal electrode and the fourth terminal electrode have the same polarity on the other side, the overlapping region has different polarities. Since the terminal members are close to each other, it is possible to reduce the ESL of the multilayer capacitor. As described above, it is possible to provide a multilayer capacitor capable of achieving low ESL while improving bending strength.

The first terminal member and the second terminal member may have an overlapping region on the first major surface side. For example, when the overlapping region is formed on the second main surface side opposite to the mounting surface, the first terminal member and the second terminal member must be extended from the mounting surface side to the second main surface side. should not. That is, the longer the wiring lengths of the first terminal member and the second terminal member, the higher the ESL. On the other hand, when the overlapping region is arranged on the mounting surface side, the wiring lengths of the first terminal member and the second terminal member can be shortened. Thereby, the ESL can be lowered.

An insulating layer may be formed between the first terminal member and the second terminal member in the overlap region. As a result, it is possible to improve the reliability of ensuring insulation between the first terminal member and the second terminal member.

The first terminal member and the second terminal member may have a holding portion that supports the element body from the first main surface side. In this case, the holding portion can prevent the element body from falling off from the first terminal member and the second terminal member.

ADVANTAGE OF THE INVENTION According to this invention, the multilayer capacitor which can achieve low ESL can be provided, improving bending strength.

1 is a schematic perspective view showing a multilayer capacitor according to an embodiment; FIG. 1 is a schematic perspective view showing a multilayer capacitor according to an embodiment; FIG. FIG. 3 is a diagram showing internal electrodes on dielectric layers per layer constituting a multilayer capacitor; 3 is a bottom view of the multilayer capacitor viewed from the mounting surface side; FIG. FIG. 4 is a cross-sectional view of an overlapping region; It is the bottom view which looked at the multilayer capacitor which concerns on a modification from the mounting surface side.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and overlapping descriptions are omitted.

First, the configuration of a multilayer capacitor 100 according to the present embodiment will be described with reference to FIGS. 1 to 4. FIG. 1 and 2 are schematic perspective views showing a multilayer capacitor according to this embodiment. FIG. 3 is a diagram showing internal electrodes on dielectric layers for each layer constituting a multilayer capacitor. FIG. 4 is a bottom view of the multilayer capacitor viewed from the mounting surface side. As shown in FIGS. 1 and 2, the multilayer capacitor 100 includes a capacitor component 1, a terminal member 20A (first terminal member), and a terminal member (second terminal member) 20B. Further, the capacitor component 1 includes an element body 2, a terminal electrode 3A (first terminal electrode), a terminal electrode 3B (second terminal electrode), a terminal electrode 3C (third terminal electrode), and a terminal electrode 3D (fourth terminal electrode).

In the following description, an XYZ coordinate system is set for the multilayer capacitor 100 for description. The X-axis direction and the Y-axis direction are directions orthogonal to each other within the same plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. In FIG. 1, the upper side is the positive side in the Z-axis direction, and the lower side is the negative side in the Z-axis direction. The Z-axis direction corresponds to the "opposing direction" in the claims.

The element body 2 has a pair of main surfaces 2a and 2b facing each other in the Z-axis direction, a pair of side surfaces 2c and 2d facing each other in the Y-axis direction, and a pair of end surfaces 2e and 2f facing each other in the X-axis direction. , have The main surface 2b (first main surface) is arranged on the negative side in the Z-axis direction and faces the surface of the circuit board to be mounted. The principal surface 2b serves as a mounting surface for the circuit board. The main surface 2a (second main surface) is a surface located on the positive side in the Z-axis direction and on the opposite side to the circuit board. The side surface 2c (second side surface) is a surface arranged on the negative side in the Y-axis direction. The side surface 2d (first side surface) is a surface arranged on the positive side in the Y-axis direction. The end surface 2e is a surface arranged on the positive side in the X-axis direction. The end surface 2f is a surface arranged on the negative side in the X-axis direction.

The element body 2 has a rectangular parallelepiped shape having a longitudinal direction in the X-axis direction. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. For example, the length of the element body 2 in the X-axis direction is 5.7 to 2.0 mm, the length in the Y-axis direction is 5.0 to 1.2 mm, and the length in the Z-axis direction is 5.0 mm. It may be ˜1.2 mm.

The element body 2 is configured by laminating a plurality of dielectric layers (dielectric layers 11 shown in FIG. 3) in the Z-axis direction. In the element body 2, the stacking direction of the plurality of dielectric layers coincides with the Z-axis direction. Each dielectric layer is formed from a sintered ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as _BaTiO3 series, Ba(Ti,Zr) _O3 series, or (Ba,Ca) _TiO3 series). Configured. In the actual element body 2, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are invisible.

The terminal electrode 3A and the terminal electrode 3B are formed on the side surface 2d. 3 A of terminal electrodes are arrange|positioned in the position spaced apart from the end surface 2e to the negative side of the X-axis direction. The terminal electrode 3B is arranged at a position spaced apart from the end surface 2f toward the positive side in the X-axis direction. The terminal electrode 3A and the terminal electrode 3B are arranged so as to be separated from each other with the center of the element body 2 in the X-axis direction interposed therebetween. The terminal electrodes 3A and 3B are formed over the entire length of the side surface 2d in the Z-axis direction. In addition, the terminal electrodes 3A and 3B extend around the edges of the main surfaces 2a and 2b. The terminal electrode 3A and the terminal electrode 3B have polarities different from each other. In this embodiment, it is assumed that the terminal electrode 3A is the negative electrode and the terminal electrode 3B is the positive electrode.

Terminal electrode 3C and terminal electrode 3D are formed on side surface 2c. The terminal electrode 3D is arranged at a position spaced apart from the end surface 2e toward the negative side in the X-axis direction. 3 C of terminal electrodes are arrange|positioned in the position spaced apart from the end surface 2f to the positive side of the X-axis direction. The terminal electrode 3C and the terminal electrode 3D are arranged so as to be separated from each other with the center of the base body 2 in the X-axis direction interposed therebetween. The terminal electrodes 3C and 3D are formed over the entire length of the side surface 2d in the Z-axis direction. In addition, the terminal electrodes 3C and 3D wrap around the edges of the main surfaces 2a and 2b. The terminal electrode 3C and the terminal electrode 3D have polarities different from each other. In this embodiment, it is assumed that the terminal electrode 3C is the negative electrode and the terminal electrode 3D is the positive electrode. As a result, the terminal electrodes 3A and 3C intersecting in the oblique direction have the same polarity, and the terminal electrodes 3B and 3D intersecting in the oblique direction have the same polarity.

Next, referring to FIG. 3, the internal structure of multilayer capacitor 100 will be described. As shown in FIG. 3, the multilayer capacitor 100 includes an internal electrode 12 (second internal electrode), an internal electrode 13 (first internal electrode), an internal electrode 14 ( 2nd internal electrode) and an internal electrode 15 (first internal electrode) are provided in this order from the positive side toward the negative side in the Z-axis direction. The multilayer capacitor 100 also includes a plurality of sets of internal electrodes 12 , 13 , 14 , 15 . Multilayer capacitor 100 has a capacitor section inside by laminating internal electrodes 12, 13, 14 and 15 in order with dielectric layer 11 interposed therebetween. The internal electrodes 12, 13, 14, 15 are made of a conductive material such as Ni or Cu. In the stage prior to sintering the element body 2, the shapes of the internal electrodes 12, 13, 14, and 15 are shaped by applying conductive paste on the ceramic green sheets that form the dielectric layer 11 after sintering. A conductor pattern is formed.

The internal electrode 13 is connected to the terminal electrode 3A, and the internal electrode 15 is connected to the terminal electrode 3C. Therefore, the internal electrodes 13 and 15 have the same polarity (negative electrode). The internal electrode 12 is connected to the terminal electrode 3B, and the internal electrode 14 is connected to the terminal electrode 3D. Therefore, the internal electrodes 13 and 15 have the same polarity (positive). The internal electrodes 12, 13, 14, 15 have opposing regions 12a, 13a, 14a, 15a that face each other. The opposing regions 12a, 13a, 14a, and 15a are regions for forming capacitor portions. The opposing regions 12 a , 13 a , 14 a , 15 a have a rectangular shape with a gap so as to expose four edges of the dielectric layer 11 . In addition, the internal electrodes 12, 13, 14, 15 have lead portions 12b, 13b, 14b, 15b that are led out from the opposing regions 12a, 13a, 14a, 15a and connected to the terminal electrodes 3B, 3A, 3D, 3C. have.

As shown in FIGS. 2 and 4, the terminal member 20A is a member that connects the terminal electrode 3A and the terminal electrode 3C. Thus, the terminal member 20A connects the terminal electrodes 3A and 3C, which are the negative electrodes. The terminal member 20B is a member that connects the terminal electrode 3B and the terminal electrode 3D. Thus, the terminal member 20B connects the terminal electrodes 3B and 3D, which are positive electrodes.

The terminal member 20A includes a connecting portion 21A, a holding portion 22A, a foot portion 23A, a mounting portion 24A, a holding portion 26A, a foot portion 27A, and a mounting portion 28A.

The connection portion 21A is a portion extending obliquely between the terminal electrode 3A and the terminal electrode 3C. The connecting portion 21A is arranged at a position on the negative side in the Z-axis direction with respect to the main surface 2b, which is the mounting surface. That is, the connecting portion 21A is arranged so as to face the main surface 2b, which is the mounting surface, in the Z-axis direction. Specifically, the connecting portion 21A has a band-like shape that is inclined toward the negative side in the X-axis direction from the position of the terminal electrode 3A toward the terminal electrode 3C (negative side in the Y-axis direction). are doing. The connection portion 21A has an edge portion 21Aa and an edge portion 21Ab extending in parallel and obliquely to each other (see FIG. 4). The edge portion 21Aa is arranged on the negative side in the X-axis direction with respect to the edge portion 21Ab.

The holding portions 22A and 26A are portions that support the element body 2 from the main surface 2b side, which is the mounting surface of the element body 2. As shown in FIG. The holding portion 22A is arranged so as to expand at a position on the negative side of the terminal electrode 3A in the Z-axis direction, and is connected to the terminal electrode 3A. The holding portion 22A is connected to the positive end of the connecting portion 21A in the Y-axis direction. The holding portion 26A is arranged so as to expand at a position on the negative side of the terminal electrode 3C in the Z-axis direction, and is connected to the terminal electrode 3C. The holding portion 26A is connected to the negative end of the connecting portion 21A in the Y-axis direction.

The leg portion 23A is a portion that extends from the end of the holding portion 22A on the positive side in the Y-axis direction to the negative side in the Z-axis direction. The leg portion 27A is a member that extends from the end portion of the holding portion 26A on the negative side in the Y-axis direction to the negative side in the Z-axis direction. Legs 23A and 27A are members that hold capacitor component 1 in a state of being lifted to the positive side in the Z-axis direction when multilayer capacitor 100 is mounted on a circuit board.

The mounting portions 24A and 28A are provided on the main surface 2b side, which is the mounting surface of the base body 2, and are portions that are connected to the circuit board when mounted on the circuit board. The mounting portion 24A is arranged at a position spaced apart from the terminal electrode 3A toward the negative side in the Z-axis direction. The mounting portion 24A is a member extending from the end of the foot portion 23A on the negative side in the Z-axis direction to the negative side in the Y-axis direction. The mounting portion 28A is arranged at a position spaced apart from the terminal electrode 3C toward the negative side in the Z-axis direction. The mounting portion 28A is a member that extends from the end of the foot portion 27A on the negative side in the Z-axis direction toward the positive side in the Y-axis direction.

Terminal member 20B includes connection portion 21B, holding portion 22B, foot portion 23B, mounting portion 24B, holding portion 26B, foot portion 27B, and mounting portion 28B.

The connecting portion 21B is a portion extending obliquely between the terminal electrode 3B and the terminal electrode 3D. The connection portion 21B is arranged at a position on the negative side in the Z-axis direction with respect to the main surface 2b, which is the mounting surface. That is, the connecting portion 21B is arranged so as to face the main surface 2b, which is the mounting surface, in the Z-axis direction. Specifically, the connection portion 21B has a band-like shape that is inclined toward the positive side in the X-axis direction from the position of the terminal electrode 3B toward the terminal electrode 3D (negative side in the Y-axis direction). are doing. The connection portion 21B has an edge portion 21Ba and an edge portion 21Bb extending in parallel and obliquely to each other (see FIG. 4). The edge portion 21Ba is arranged on the positive side in the X-axis direction with respect to the edge portion 21Bb.

The holding portions 22B and 26B are portions that support the element body 2 from the main surface 2b side, which is the mounting surface of the element body 2. As shown in FIG. The holding portion 22B is arranged so as to expand at a position on the negative side of the terminal electrode 3B in the Z-axis direction, and is connected to the terminal electrode 3B. The holding portion 22B is connected to the positive end portion of the connecting portion 21B in the Y-axis direction. The holding portion 26B is arranged so as to expand at a position on the negative side of the terminal electrode 3D in the Z-axis direction, and is connected to the terminal electrode 3D. The holding portion 26B is connected to the negative end of the connecting portion 21B in the Y-axis direction.

The foot portion 23B is a portion that extends from the end of the holding portion 22B on the positive side in the Y-axis direction to the negative side in the Z-axis direction. The leg portion 27B is a member that extends from the negative end of the holding portion 26B in the Y-axis direction to the negative side in the Z-axis direction. Legs 23B and 27B are members that hold capacitor component 1 in a state of being lifted to the positive side in the Z-axis direction when multilayer capacitor 100 is mounted on a circuit board.

The mounting portions 24B and 28B are portions that are provided on the main surface 2b side, which is the mounting surface of the base body 2, and are connected to the circuit board when mounted on the circuit board. The mounting portion 24B is arranged at a position spaced apart from the terminal electrode 3B toward the negative side in the Z-axis direction. The mounting portion 24B is a member that extends from the end of the foot portion 23B on the negative side in the Z-axis direction to the negative side in the Y-axis direction. The mounting portion 28B is arranged at a position spaced apart from the terminal electrode 3D toward the negative side in the Z-axis direction. The mounting portion 28B is a member that extends from the end of the foot portion 27B on the negative side in the Z-axis direction to the positive side in the Y-axis direction.

The terminal members 20A and 20B may have a structure in which each part is formed by bending a strip-shaped metal plate, or a structure in which metal pieces forming each part are fixed to each other.

As shown in FIG. 4, the terminal member 20A and the terminal member 20B have an overlapping region E1 that overlaps each other when viewed from the opposing direction. In FIG. 4, the overlapping area E1 is hatched. The overlapping region E1 is formed by overlapping the connecting portion 21A and the connecting portion 21B. The overlapping region E1 is formed at the center position when the base body 2 is viewed from the Z-axis direction. The overlapping region E1 has a rhombic shape defined by edge portions 21Aa and 21Ab of the connection portion 21A and edge portions 21Ba and 21Bb of the connection portion 21B. As described above, the connecting portions 21A and 21B are arranged on the negative side of the base body 2 in the Z-axis direction, that is, on the main surface 2b side, which is the mounting surface. Therefore, the terminal members 20A and 20B have an overlapping region E1 on the main surface 2b side in the Z-axis direction.

As shown in FIG. 5, in the overlapping region E1, the connection portion 21A and the connection portion 21B are arranged so as to be separated from each other in the Z-axis direction. Although the connection portion 21B is arranged on the negative side in the Z-axis direction here, the connection portion 21A may be arranged on the negative side in the Z-axis direction. In the overlapping region E1, an insulating portion is formed between the connection portion 21A and the connection portion 21B. In FIG. 5A, the insulating layer 30 is formed between the connecting portion 21A and the connecting portion 21B in the overlapping region E1. The insulating layer 30 is made of an insulating member such as rubber or resin. Further, in FIG. 5B, a space SP is formed between the connecting portion 21A and the connecting portion 21B in the overlapping region E1.

Next, functions and effects of the multilayer capacitor 100 according to this embodiment will be described.

This multilayer capacitor 100 includes terminal members 20A and 20B having mounting portions 24A, 28A, 24B, and 28B mounted on a circuit board on the main surface 2b side. Thereby, the multilayer capacitor 100 is mounted on the circuit board via the mounting portions 24A, 28A, 24B, and 28B of the terminal members 20A and 20B, so that the bending strength of the multilayer capacitor 100 can be improved. The terminal electrodes 3A and 3C have the same polarity at one polarity (negative electrode), and the terminal electrodes 3B and 3D have the same polarity at the other polarity (positive electrode). Accordingly, terminal electrodes 3A and 3B having different polarities are formed on the side surface 2d of the element body 2, and terminal electrodes 3C and 3D having different polarities are formed on the side surface 2c of the element body 2. . In this way, the terminal electrodes 3A and 3B with different polarities are formed on the same side surface 2d, and the terminal electrodes 3C and 3D with different polarities are formed on the same side surface 2c, so that the ESL can be reduced. For example, referring to FIG. 3, a current flowing between the terminal electrode 3A, the lead portion 12b, the lead portion 13b, and the terminal electrode 3B and a current flowing between the terminal electrode 3C, the lead portion 15b, the lead portion 14b, and the terminal electrode 3D The direction of the current is opposite to that of the flowing current. Therefore, the electric fields due to each current cancel each other. Thereby, ESL can be reduced.

The terminal member 20A connects the terminal electrode 3A and the terminal electrode 3C which have the same polarity as the negative electrode, and the terminal member 20B connects the terminal electrode 3B and the terminal electrode 3D which have the same polarity as the positive electrode. When viewed from the Z-axis direction, the terminal member 20A and the terminal member 20B have an overlapping region E1 that overlaps with each other. In the overlapping region E1, the terminal members 20A and 20B of different polarities are adjacent to each other, so that the effect of low ESL can be obtained by canceling out the current directions of the different polarities. That is, the magnetic field generated by the terminal member 20A and the magnetic field generated by the terminal member 20B cancel each other in the overlapping region E1, so that the ESL of the multilayer capacitor 100 can be reduced. As described above, it is possible to provide a multilayer capacitor capable of achieving low ESL while improving bending strength.

The terminal member 20A and the terminal member 20B have an overlapping region E1 on the main surface 2b side. For example, when the overlapping region E1 is formed on the main surface 2a side opposite to the mounting surface, the terminal members 20A and 20B must be extended from the mounting surface side to the main surface 2a side. That is, the longer the wiring lengths of the terminal members 20A and 20B, the higher the ESL. In contrast, when the overlapping region E1 is arranged on the mounting surface side, the wiring lengths of the terminal members 20A and 20B can be shortened. Thereby, the ESL can be lowered.

An insulating layer 30 may be formed between the terminal member 20A and the terminal member 20B in the overlapping region E1. As a result, it is possible to improve the reliability of ensuring insulation between the terminal member 20A and the terminal member 20B.

The terminal member 20A and the terminal member 20B have holding portions 22A, 26A, 22B, and 26B that support the base body 2 from the main surface 2b side. In this case, the holding portions 22A, 26A, 22B, and 26B can prevent the element body 2 from falling off from the terminal members 20A and 20B.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

The shape of the terminal member is not limited to the above embodiment. In addition, the shape, position, size, etc. of the overlapping region may be appropriately changed according to the shape of the terminal member.

For example, a multilayer capacitor 200 having terminal members 40A and 40B shown in FIG. 6 may be employed. The terminal member 40A has a mounting portion 44A at a position corresponding to the terminal electrode 3A and a mounting portion 48A at a position corresponding to the terminal electrode 3C. The terminal member 40A includes a connecting portion 41A extending straight from the position of the terminal electrode 3A to the negative side in the Y-axis direction, a connecting portion 42A extending straight from the position of the terminal electrode 3C to the positive side in the Y-axis direction, and a connecting portion 43A extending straight in the X-axis direction between the connecting portions 41A and 42A at the center position in the Y-axis direction. The connection portion 43A has an edge portion 43Aa extending straight in the X-axis direction on the negative side in the Y-axis direction, and an edge portion 43Ab extending straight in the X-axis direction on the positive side in the Y-axis direction.

The terminal member 40B has a mounting portion 44B at a position corresponding to the terminal electrode 3B and a mounting portion 48B at a position corresponding to the terminal electrode 3D. The terminal member 40B includes a connecting portion 41B extending straight from the position of the terminal electrode 3B to the negative side in the Y-axis direction, a connecting portion 42B extending straight from the position of the terminal electrode 3D to the positive side in the Y-axis direction, A connection portion 43B extending straight in the X-axis direction between the connection portions 41B and 42B is provided at a central position in the axial direction. The connecting portion 43B has an edge portion 43Ba extending straight in the X-axis direction on the negative side in the Y-axis direction and an edge portion 43Bb extending straight in the X-axis direction on the positive side in the Y-axis direction.

The terminal members 40A and 40B have overlapping regions E2 where the connecting portions 43A and 43B overlap. The overlapping region E2 has a rectangular shape with its longitudinal direction in the X-axis direction. In such an overlap region E2, the directions of the current flowing through the connecting portion 43A and the current flowing through the connecting portion 43B are 180° opposite to each other in the X-axis direction. Therefore, the magnetic fields can be satisfactorily canceled in the overlapping region E2. Moreover, since the connecting portions 43A and 43B have the longitudinal direction in the X-axis direction, the electric field can be canceled over a wide range.

The shape of the base body 2 is not limited to a rectangular parallelepiped shape as long as it has a pair of main surfaces facing each other.

2... element body, 2a... main surface (second main surface), 2b... main surface (first main surface, mounting surface), 2c, 2d... side surface, 3A... terminal electrode (first terminal electrode), 3B... Terminal electrode (second terminal electrode), 3C... Terminal electrode (third terminal electrode), 3D... Terminal electrode (fourth terminal electrode), 13, 15... Internal electrode (first internal electrode), 12, 14... Internal electrodes (second internal electrodes), 20A, 40A... Terminal members (first terminal members), 20B, 40B... Terminal members (second terminal members), 22A, 26A, 22B, 26B... Holding portion 24A, 28A, 24B, 28B, 44A, 48A, 44B, 48B... Mounting portion 100, 200... Multilayer capacitor.

Claims (3)

a base body having at least a first main surface and a second main surface facing each other, and a first side surface and a second side surface formed between the first main surface and the second main surface; ,
a first terminal electrode and a second terminal electrode formed on the first side surface of the base body;
a third terminal electrode and a fourth terminal electrode formed on the second side surface of the base body;
a plurality of first internal electrodes and a plurality of second internal electrodes facing each other in the element body;
a first terminal member connecting the first terminal electrode and the third terminal electrode;
a second terminal member connecting the second terminal electrode and the fourth terminal electrode;
the plurality of first internal electrodes are connected to at least one of the first terminal electrode and the third terminal electrode;
the plurality of second internal electrodes are connected to at least one of the second terminal electrode and the fourth terminal electrode;
The first terminal member and the second terminal member have a mounting portion mounted on a circuit board on the first main surface side,
the first terminal member and the second terminal member have overlapping regions that overlap each other when viewed from the facing direction of the first main surface and the second main surface ;
A multilayer capacitor , wherein an insulating layer is formed between the first terminal member and the second terminal member in the overlapping region . 2. The multilayer capacitor according to claim 1, wherein said first terminal member and said second terminal member have said overlapping region on said first main surface side. 3. The multilayer capacitor according to claim 1, wherein said first terminal member and said second terminal member have holding portions for supporting said element body from said first main surface side.

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