JP7230904B2 - Displays and electronics - Google Patents

Description

The present technology relates to display devices. More specifically, the present invention relates to a display device that displays an image by light emission from an organic EL (Organic Electro-Luminescence) element, and an electronic device equipped with the display device.

An organic EL element requires wiring mounting in order to input a signal for displaying an image. Further, in order to improve yield and performance, other semiconductor devices are sometimes mounted on the substrate of the organic EL element. When a conventional organic EL element is mounted on a wiring board or a circuit board, the organic EL may be thermally denatured due to the influence of heat during mounting, resulting in a decrease in efficiency and a change in chromaticity. Conventionally, as a countermeasure against heat generation in an organic EL element, for example, a technique has been proposed in which a plurality of light shielding portions having different thermal resistances are formed to dissipate the heat inside the panel (see, for example, Patent Document 1).

JP-A-2008-234841

In the conventional technology described above, the light shielding portion of the organic EL element is used to dissipate heat. However, this conventional heat dissipation mechanism promotes heat dissipation from the wiring through which current flows and the light emitting element itself, and in a high temperature environment (for example, about 200 ° C) that occurs during mounting, it is impossible to suppress the transfer to the organic EL. Have difficulty.

The present technology has been created in view of such circumstances, and aims to suppress the transfer of heat to the organic EL in a high-temperature environment that occurs during mounting.

The present technology has been made to solve the above-described problems, and a first aspect of the present technology is to provide an organic EL layer of an organic EL element formed on a substrate and the organic EL layer provided in the substrate. A display device and an electronic device comprising a cooling layer that suppresses heat transfer to an EL layer, and a cooling pad that is connected to the cooling layer and receives cooling from the outside. As a result, the cooling layer is cooled via the cooling pad, which has the effect of suppressing heat transfer to the organic EL layer.

Moreover, in this first aspect, the cooling layer is preferably made of a metal material. For example, by using a metal material with good thermal conductivity such as aluminum, an effect of improving the cooling effect is brought about.

Further, in this first aspect, the heat generating source may be formed in the effective pixel area of the organic EL element, and the heat generation source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element may be separated from each other. may be formed between

Moreover, in this first aspect, the cooling layer may be further formed in the vicinity of the anode electrode of the organic EL element. This provides an effect of cooling the anode electrode and further suppressing heat transfer to the organic EL layer.

Further, in this first aspect, the cooling layer may have a larger area as it is closer to a heat generation source outside the effective pixel region of the organic EL element. As a result, the closer to the heat generating source, the more the cooling effect is enhanced, thereby improving the cooling efficiency.

Moreover, in this first aspect, the cooling layer may include a portion that contacts the organic EL layer. This provides an effect of improving the cooling effect by performing cooling directly.

Further, in this first aspect, the cooling layer may be connected to the anode electrode in the area whose surface is covered with the light shielding layer in the effective pixel area of the organic EL element. This has the effect of suppressing heat transfer to the organic EL layer via the dummy pixels.

Moreover, in this first aspect, the cooling layer may be formed by further extending from the vicinity of the anode electrode. This provides an effect of cooling normal pixels and further suppressing heat transfer to the organic EL layer.

Moreover, in this first aspect, the cooling layer may be further connected to the cathode electrode of the organic EL element. As a result, both ends of the dummy pixel are made to have the same potential, thereby suppressing inter-pixel leakage and reducing color mixture.

According to the present technology, an excellent effect of suppressing heat transfer to the organic EL in a high-temperature environment that occurs during mounting can be achieved. Note that the effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

It is a figure showing an example of a top view of display 10 in an embodiment of this art. It is a figure showing an example of a conceptual diagram of display 10 in an embodiment of this art. It is a figure showing an example of a top view of pixel array 100 in a 1st embodiment of this art. It is a figure which shows an example of sectional drawing of the pixel array 100 in 1st Embodiment of this technique. It is a figure which shows an example of the top view of the pixel array 100 in 2nd Embodiment of this technique. It is a figure which shows an example of sectional drawing of the pixel array 100 in 2nd Embodiment of this technique. It is a figure showing an example of a top view of display 10 in a 3rd embodiment of this art. It is a figure which shows an example of sectional drawing of the display apparatus 10 in 3rd Embodiment of this technique. It is a figure which shows an example of sectional drawing of the pixel array 100 in 4th Embodiment of this technique. It is a figure which shows an example of the top view of the pixel array 100 in 5th Embodiment of this technique. It is a figure which shows an example of sectional drawing of the pixel array 100 in 5th Embodiment of this technique. It is a figure which shows an example of sectional drawing of the display apparatus 10 in 6th Embodiment of this technique. It is a figure showing appearance of smart phone 401 which is the 1st example of application of an embodiment of this art. It is a figure which shows the external appearance seen from the front (object side) of the digital camera 411 which is the 2nd application example of embodiment of this technique. It is a figure which shows the external appearance seen from the back of the digital camera 411 which is the 2nd application example of embodiment of this technique. It is a figure showing appearance of HMD431 which is the 3rd example of application of an embodiment of this art.

Hereinafter, a form for carrying out the present technology (hereinafter referred to as an embodiment) will be described. Explanation will be given in the following order.
1. First embodiment (example of cooling wiring)
2. Second embodiment (example in which the cooling wiring is extended to the vicinity of the anode electrode)
3. Third embodiment (example of cooling wiring wall)
4. Fourth Embodiment (Example of Forming Wide Area Cooling Wiring Near Anode Electrode)
5. Fifth Embodiment (Example of Changing Layout of Dummy Pixels)
6. Sixth Embodiment (An example in which both ends of a dummy pixel are set to the same potential)
7. Application example

<1. First Embodiment>
[overview]
Drawing 1 is a figure showing an example of a top view of display 10 in an embodiment of this art.

The display device 10 in this embodiment includes a pixel array 100 , driver ICs (Driver Integrated Circuits) 200 arranged on both sides of the pixel array 100 , and cooling pads 300 .

The pixel array 100 has pixels of organic EL elements arranged in a matrix (array). An organic EL element is a diode (OLED: Organic Light Emitting Diode) having a structure in which an organic material film (organic EL layer) is sandwiched between an anode (anode electrode) and a cathode (cathode electrode). Pixel array 100 is formed over a substrate 110, such as a silicon substrate.

Driver IC 200 is an integrated circuit for controlling and driving the pixels. By providing the driver IC 200 independently of the pixel array 100 as in this example, yield and performance can be improved.

The cooling pad 300 is a pad that receives external cooling outside the effective pixel area of the pixel array 100 . The cooling pad 300 is desirably made of a metal material with good thermal conductivity, such as aluminum. Cooling wiring in the substrate 110 is connected to the cooling pad 300 as will be described later. When the driver IC 200 is mounted, the cooling pad 300 is cooled while being externally cooled by a Peltier device or the like.

FIG. 2 is a diagram showing an example of a conceptual diagram of the display device 10 according to the embodiment of the present technology.

In order to mount the driver IC 200 on the substrate 110, an anisotropic conductive film (ACF: Anisotropic Conductive Film) or solder is used as the material of the joint portion 290. FIG. Heat is applied by a heater having a temperature of about 350° C. for thermocompression bonding. At this time, the temperature applied to the substrate 110 during mounting is, for example, about 200.degree.

A cooling wiring 120 connected to the cooling pad 300 is provided on the substrate 110 of the display device 10 so that the inside of the substrate 110 is cooled. Even if the temperature applied to the substrate 110 when the driver IC 200 is mounted on the substrate 110 is, for example, about 200° C., by adding cooling of about −10° C. to the cooling pad 300, the heat can be transferred to the organic EL layer. can be suppressed.

[Configuration of display device]
FIG. 3 is a diagram showing an example of a plan view of the pixel array 100 according to the first embodiment of the present technology.

In a pixel array 100, normal pixels 101 for displaying are arranged in a matrix. Dummy pixels 109 are formed between the pixels 101 along the column direction, for example. The dummy pixels 109 are pixels not intended for display, and are shielded from light emission to the outside. In the first embodiment, a cooling wiring is connected to the anode electrode of the dummy pixel 109 for cooling. Note that the dummy pixels 109 may be formed along the row direction.

FIG. 4 is a diagram showing an example of a cross-sectional view of the pixel array 100 according to the first embodiment of the present technology.

In the pixel array 100 , the anode electrode 131 of the organic EL element is arranged on the substrate 110 . An organic EL layer 132 is arranged on the anode electrode 131, and a cathode electrode 133 is further arranged thereon. That is, the anode electrode 131, the organic EL layer 132 and the cathode electrode 133 constitute a diode of the organic EL element. A window 139 is formed between the pixels as a barrier separating the pixels. In this example and the following examples, the cathode electrode 133 is shown linear for convenience, but actually has an uneven shape along the shape of the window 139 .

An adhesive and a protective film 141 are formed on the cathode electrode 133, and a color filter layer 142 is further formed thereon. The color filter layer 142 is an optical filter having a property of passing predetermined colors.

In a normal pixel 101 for display, the color filter layer 142 passes colors such as red, blue, and green according to specific arrangement rules. This color filter layer 142 has a light shielding portion called a black matrix between pixels. Further, in the first embodiment, dummy pixels 109 not intended for display are provided, and the color filter layer 142 shields the dummy pixels 109 from light with a black matrix.

A glass substrate 143 is provided as a counter substrate on the color filter layer 142 .

In this first embodiment, the substrate 110 is provided with the cooling wiring 120 , which is connected to the anode electrodes of the dummy pixels 109 . That is, the cooling wiring 120 has a portion in contact with the organic EL layer 132 . The anode electrode of the dummy pixel 109 and the cooling wiring 120 are desirably made of a metal material with good thermal conductivity, such as aluminum, like the cooling pad 300 . As described above, the cooling wiring 120 is connected to the cooling pad 300. When the driver IC 200 or the like is mounted, the cooling pad 300 is cooled while mounting, thereby preventing heat transfer to the organic EL layer 132. can be suppressed. In addition, the cooling wiring 120 is an example of the cooling layer described in the claims.

As described above, according to the first embodiment of the present technology, by connecting the cooling wiring 120 to the anode electrode of the dummy pixel 109 , cooling from the cooling pad 300 is promoted, and heat is transferred to the organic EL layer 132 . Transmission can be suppressed.

<2. Second Embodiment>
In the first embodiment described above, the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, but in the second embodiment, the cooling wiring 120 is further routed to the vicinity of the anode electrode of the normal pixel 101. This further improves the cooling effect.

[Configuration of display device]
FIG. 5 is a diagram showing an example of a plan view of the pixel array 100 according to the second embodiment of the present technology. FIG. 6 is a diagram showing an example of a cross-sectional view of the pixel array 100 according to the second embodiment of the present technology.

In the second embodiment, the cooling wiring 122 is formed by further extending from the cooling wiring 120 connected to the anode electrode of the dummy pixel 109 to the vicinity of the anode electrode 131 of the normal pixel 101 . Thereby, the cooling effect is improved by further expanding the cooling area.

As described above, according to the second embodiment of the present technology, heat transfer to the organic EL layer 132 is further enhanced by forming the cooling wiring 122 extending to the vicinity of the anode electrode 131 of the normal pixel 101. can be suppressed.

<3. Third Embodiment>
In the first and second embodiments described above, the cooling wiring 120 is provided within the effective pixel area of the substrate 110, but a similar cooling layer may be provided outside the effective pixel area. In this third embodiment, an example in which a cooling layer is provided outside the effective pixel area will be described.

[Configuration of display device]
FIG. 7 is a diagram showing an example of a plan view of the display device 10 according to the third embodiment of the present technology. FIG. 8 is a diagram showing an example of a cross-sectional view of the display device 10 according to the third embodiment of the present technology.

In this third embodiment, a cooling wiring wall 310 is provided between the pixel array 100 and the driver IC 200 on the substrate 110 . The cooling wiring wall 310 is connected to the cooling pad 300 and formed to separate the pixel array 100 and the driver IC 200 within the substrate 110 . Like the cooling wiring 120, the cooling wiring wall 310 is desirably made of a metal material with good thermal conductivity such as aluminum. The cooling wiring wall 310 is an example of the cooling layer described in the claims.

When mounting the driver IC 200 and the like, heat transfer to the effective pixel area can be blocked by mounting while cooling the cooling pad 300 as in the first embodiment described above.

Even when the cooling wiring wall 310 is provided, the cooling wiring 120 described in the first and second embodiments may be further provided.

As described above, according to the third embodiment of the present technology, by providing the cooling wiring wall 310 between the pixel array 100 and the driver IC 200, heat is transferred to the effective pixel region including the organic EL layer 132. Transmission can be suppressed.

<4. Fourth Embodiment>
In the first and second embodiments described above, the cooling wiring 120 is connected to the anode electrode of the dummy pixel 109, but the dummy pixel 109 does not necessarily have to be provided. However, since the anode electrode 131 of the normal pixel 101 is an independent wiring, the cooling wiring 120 cannot be connected. Therefore, in the fourth embodiment, cooling is performed by providing cooling wiring with a large area in the vicinity of the anode electrode 131 of the normal pixel 101 .

[Configuration of display device]
FIG. 9 is a diagram showing an example of a cross-sectional view of the pixel array 100 according to the fourth embodiment of the present technology.

In this fourth embodiment, the cooling wiring 123 connected to the cooling wiring 120 is provided near the anode electrode 131 of the normal pixel 101 . The cooling wiring 123 is arranged at a position closer to the anode electrode 131 than the cooling wiring 120 .

Further, in the fourth embodiment, a wide area for the normal pixels 101 is ensured without providing the dummy pixels 109 . A cooling wiring 123 is formed in the vicinity of the anode electrode 131 of the normal pixel 101 . Since the dummy pixels 109 are not provided, the light emitting area within the effective pixel region can be increased.

As described above, according to the fourth embodiment of the present technology, it is possible to suppress the transfer of heat to the organic EL layer 132 without narrowing the light emitting area in the effective pixel region by the dummy pixels.

<5. Fifth Embodiment>
In the first and second embodiments described above, the dummy pixels 109 are assumed to have uniform sizes, but the layout of the dummy pixels 109 is not limited to this. In the fifth embodiment, the cooling efficiency is improved by changing the size of the dummy pixel 109 so that the cooling area is widened in the portion near the mounting joint 290 .

[Configuration of display device]
FIG. 10 is a diagram showing an example of a plan view of the pixel array 100 according to the fifth embodiment of the present technology. FIG. 11 is a diagram showing an example of a cross-sectional view of the pixel array 100 according to the fifth embodiment of the present technology.

In this fifth embodiment, the size of the dummy pixel 109 is made larger as it is closer to the mounting joint 290 . A cooling wiring 120 is connected to the anode electrode of the dummy pixel 109 for cooling. The area of the anode electrode of the dummy pixel 109 increases as it approaches the junction 290 , and the cooling effect increases as it approaches the junction 290 . On the other hand, the closer to the junction 290, the higher the temperature during mounting. Therefore, the overall cooling efficiency can be improved by enhancing the cooling effect in the region closer to the joint 290 where the temperature during mounting is high.

As described above, according to the fifth embodiment of the present technology, heat transfer to the organic EL layer 132 can be efficiently performed by increasing the size of the dummy pixel 109 closer to the mounting joint 290 . can be effectively suppressed.

<6. Sixth Embodiment>
In the first and second embodiments described above, cooling is performed by connecting the cooling wiring 120 to the anode electrode of the dummy pixel 109 . In the sixth embodiment, by connecting the cooling wiring 120 to the cathode electrode of the dummy pixel 109, the anode potential and the cathode potential of the dummy pixel 109 are set to the same potential.

[Configuration of display device]
FIG. 12 is a diagram showing an example of a cross-sectional view of the display device 10 according to the sixth embodiment of the present technology.

In this sixth embodiment, the cathode electrode 133 and the cooling wiring 120 are connected outside the effective pixel area. A connection portion between the cathode electrode 133 and the cooling wiring 120 is sealed with a sealing material 190 .

Cathode electrode 133 is a common line shared by all normal pixels 101 and dummy pixels 109 . The anode electrode of the dummy pixel 109 is connected to the cooling wiring 120, and by connecting the cathode electrode 133 and the cooling wiring 120, the anode electrode and the cathode electrode 133 of the dummy pixel 109 have the same potential. As a result, inter-pixel leakage can be suppressed, and color mixture can be reduced. Therefore, an organic EL element with high color purity can be constructed.

As described above, according to the sixth embodiment of the present technology, by connecting the cathode electrode 133 and the cooling wiring 120, the anode potential and the cathode potential of the dummy pixel 109 are set to the same potential, and inter-pixel leakage is prevented. can be suppressed. Accordingly, it is possible to provide an organic EL device with reduced color mixture and high color purity.

<7. Application example>
Examples of electronic devices to which the display devices of the above-described embodiments can be applied will be described below.

FIG. 13 is a diagram showing the appearance of a smartphone 401 that is a first application example of the embodiment of the present technology. This smartphone 401 includes an operation unit 403 that receives operation input from a user, and a display unit 405 that displays various information. This display unit 405 can be configured by the display device of the above-described embodiment.

FIG. 14 is a diagram showing the appearance of a digital camera 411 as a second application example of the embodiment of the present technology, viewed from the front (object side). FIG. 15 is a diagram showing the appearance of a digital camera 411 as a second application example of the embodiment of the present technology, viewed from behind. This digital camera 411 includes a main body (camera body) 413, an interchangeable lens unit 415, and a grip 417 that is held by the user during photography. The digital camera 411 also includes a monitor 419 that displays various types of information, and an EVF (electronic viewfinder) 421 that displays a through-the-lens image observed by the user during shooting. This monitor 419 and EVF 421 can be configured by the display device of the above-described embodiments.

FIG. 16 is a diagram showing the appearance of an HMD 431 that is a third application example of the embodiment of the present technology. This HMD (Head Mounted Display) 431 includes a glasses-type display section 433 that displays various information, and an ear hook section 435 that is hooked to the user's ear when worn. This display unit 433 can be configured by the display device of the above-described embodiment.

Several examples of electronic devices to which the display device according to each embodiment can be applied have been described above. Electronic devices to which the display device according to each embodiment can be applied are not limited to those exemplified above. The present invention can be applied to display devices installed in electronic devices in all fields that perform display based on an image signal input from the outside or an image signal generated inside, such as a game device.

In addition, the above-described embodiment shows an example for embodying the present technology, and the matters in the embodiment and the matters specifying the invention in the scope of claims have corresponding relationships. Similarly, the matters specifying the invention in the scope of claims and the matters in the embodiments of the present technology with the same names have corresponding relationships. However, the present technology is not limited to the embodiments, and can be embodied by various modifications to the embodiments without departing from the scope of the present technology.

It should be noted that the effects described in this specification are only examples and are not limited, and other effects may be provided.

Note that the present technology can also have the following configuration.
(1) an organic EL layer of an organic EL element formed on a substrate;
a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer;
a cooling pad connected to the cooling layer and receiving cooling from the outside.
(2) The display device according to (1), wherein the cooling layer is made of a metal material.
(3) The display device according to (1) or (2), wherein the cooling layer is formed within an effective pixel region of the organic EL element.
(4) The display device according to (1) or (2), wherein the cooling layer is formed between a heat source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element. .
(5) The display device according to any one of (1) to (3), wherein the cooling layer is further formed in the vicinity of the anode electrode of the organic EL element.
(6) The display device according to any one of (1) to (3), wherein the cooling layer has a larger area as it is closer to a heat generating source outside the effective pixel area of the organic EL element.
(7) The display device according to any one of (1) to (3), wherein the cooling layer includes a portion that contacts the organic EL layer.
(8) The display according to any one of (1) to (3), wherein the cooling layer is connected to an anode electrode in a region whose surface is covered with a light shielding layer within an effective pixel region of the organic EL element. Device.
(9) The display device according to (8), wherein the cooling layer is formed by further extending from the vicinity of the anode electrode.
(10) The display device according to (8), wherein the cooling layer is further connected to a cathode electrode of the organic EL element.
(11) an organic EL layer of an organic EL element formed on a substrate; a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer; An electronic device comprising a display unit comprising a cooling pad that receives cooling of the air.

REFERENCE SIGNS LIST 10 display device 100 pixel array 101 normal pixel 109 dummy pixel 110 substrate 120, 122, 123 cooling wiring 131 anode electrode 132 organic EL layer 133 cathode electrode 139 window 141 protective film 142 color filter layer 143 glass substrate 190 sealing material 200 driver IC
290 Joint 300 Cooling pad 310 Cooling wiring wall 405 Display

Claims (10)

an organic EL layer of an organic EL element formed on a substrate;
a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer;
a cooling pad connected to the cooling layer and receiving external cooling ;
The cooling layer is connected to the anode electrode in the region whose surface is covered with the light shielding layer in the effective pixel region of the organic EL element.
display device. 2. The display device according to claim 1 , wherein the cooling layer is formed by further extending from the vicinity of the anode electrode. 2. The display device according to claim 1 , wherein said cooling layer is further connected to a cathode electrode of said organic EL element. an organic EL layer of an organic EL element formed on a substrate;
a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer;
a cooling pad connected to the cooling layer to receive external cooling;
and
The cooling layer is formed between a heat source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element.
display device. an organic EL layer of an organic EL element formed on a substrate;
a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer;
a cooling pad connected to the cooling layer to receive external cooling;
and
The cooling layer has a larger area as it is closer to a heat generating source outside the effective pixel area of the organic EL element.
display device. an organic EL layer of an organic EL element formed on a substrate;
a cooling layer provided in the substrate to suppress heat transfer to the organic EL layer;
a cooling pad connected to the cooling layer to receive external cooling;
and
The cooling layer has a portion in contact with the organic EL layer.
display device. An organic EL layer of an organic EL element formed on a substrate, a cooling layer provided in the substrate for suppressing heat transfer to the organic EL layer, and a cooling layer connected to the cooling layer for external cooling. a display comprising a cooling pad for receiving ;
The cooling layer is connected to the anode electrode in the region whose surface is covered with the light shielding layer in the effective pixel region of the organic EL element.
Electronics. An organic EL layer of an organic EL element formed on a substrate, a cooling layer provided in the substrate for suppressing heat transfer to the organic EL layer, and a cooling layer connected to the cooling layer for external cooling. a display comprising a cooling pad for receiving ;
The cooling layer is formed between a heat source outside the effective pixel area of the organic EL element and the effective pixel area of the organic EL element.
Electronics. An organic EL layer of an organic EL element formed on a substrate, a cooling layer provided in the substrate for suppressing heat transfer to the organic EL layer, and a cooling layer connected to the cooling layer for external cooling. a display comprising a cooling pad for receiving ;
The cooling layer has a larger area as it is closer to a heat generating source outside the effective pixel area of the organic EL element.
Electronics. An organic EL layer of an organic EL element formed on a substrate, a cooling layer provided in the substrate for suppressing heat transfer to the organic EL layer, and a cooling layer connected to the cooling layer for external cooling. a display comprising a cooling pad for receiving ;
The cooling layer has a portion in contact with the organic EL layer.
Electronics.

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