JP7208507B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a light emitting device and a manufacturing method thereof.

2. Description of the Related Art Conventionally, translucent members such as epoxy resins and silicone resins have been used as encapsulating resin materials in order to protect light emitting elements mounted in light emitting devices such as LEDs. 2. Description of the Related Art In recent years, silicone-based resin materials having excellent heat resistance are mainly used for translucent members for protecting high-output and high-brightness light-emitting elements mounted in lighting fixtures, backlights of liquid crystal panels, and the like.
The bottom of the package of the light-emitting device is formed by a pair of separated leads and resin, and the wall of the recessed portion of the package is integrally formed with the bottom resin (see, for example, Patent Document 1). A gap may occur at the interface between the lead forming a part of the bottom of the concave portion of the package and the resin forming the wall of the concave portion due to a slight filling failure or stress due to removal of the mold during the package molding process. When the concave portion of the package is filled with a translucent member and cured by heating, the translucent member may leak out of the concave portion from the interface.

JP 2013-077813 A

If the resin, which is a light-transmitting member, leaks onto the lead terminal outside the recess, or if the resin leaks onto the back surface of the lead, it may cause poor contact. Thin walls and short terminal lengths increase the risk of poor lead contact due to leaking translucent material. Therefore, it is desired to reduce the leakage of the translucent member.

An object of the present disclosure is to provide a light-emitting device in which leakage of a translucent member is reduced and a method for manufacturing the same.

A light-emitting device according to an embodiment of the present disclosure includes
a package having a bottom made of leads and a resin, a wall made of the resin, and a recess formed by the bottom and the wall;
a light emitting element disposed on the bottom of the recess;
a translucent member filled in the recess so as to cover the light emitting element;
with
The translucent member contains a filler having a median diameter D50 of 0.2 μm or more and 0.8 μm or less.

Further, a method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes
A package having a bottom made of leads and a resin, a wall made of the resin, and a recess formed by the bottom and the wall, and a light emitting element arranged on the bottom in the recess. the process of preparing,
filling the recess with a liquid resin composition containing a filler having a median diameter D50 of 0.2 μm or more and 0.8 μm or less so as to cover the light emitting element;
a step of heating and curing the liquid resin composition to form a translucent member;
have

According to the light emitting device according to the embodiment of the present disclosure, leakage of the translucent member is reduced. According to the method for manufacturing a light-emitting device according to the embodiment of the present disclosure, it is possible to manufacture a light-emitting device with reduced leakage of the translucent member.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the outline of the light-emitting device which concerns on this embodiment, and is a perspective view which shows the whole light-emitting device. 1 is a diagram schematically showing a light emitting device according to an embodiment, and is a top view of the light emitting device; FIG. FIG. 3 is a diagram schematically showing a light-emitting device according to the present embodiment, and is a cross-sectional view taken along the line III-III in FIG. 2; It is a figure which shows the outline of the light-emitting device which concerns on this embodiment, and is a bottom view of a light-emitting device. 5A is a cross-sectional view of the light-emitting element mounting package in the step of preparing the package and the light-emitting element; Cross-sectional view of light-emitting element mounting package (Fig. 5B), cross-sectional view of light-emitting element mounting package after resin filling (Fig. 5C), cross-sectional view of light-emitting element mounting package after filler sedimentation (Fig. 5D), light emission after curing of filling resin FIG. 5E is a cross-sectional view of the device mounting package; 4 shows a scanning electron micrograph of a cut surface of the upper portion obtained by cutting the light emitting device of Example 1 along the top surface of the bottom portion.

Hereinafter, a light-emitting device and a method for manufacturing the same showing an example of an embodiment of the present disclosure will be described. It should be noted that the drawings referred to in the following description schematically show the present embodiment, and therefore the scales, intervals, positional relationships, etc. of each member may be exaggerated, or illustration of some of the members may be omitted. There may be Also, the scale and spacing of each member may not match between the plan view and the cross-sectional view. Further, in the following description, the same names and symbols basically indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate.

Light-Emitting Device The light-emitting device of the present disclosure will be described with reference to the drawings. FIG. 1 is a perspective view showing an outline of a light emitting device according to this embodiment and showing the entire light emitting device. FIG. 2 is a schematic diagram of the light emitting device according to the present embodiment, and is a top view of the light emitting device. FIG. 3 is a schematic diagram of the light-emitting device according to the present embodiment, and is a cross-sectional view taken along line X1-X1 in FIG. FIG. 4 is a schematic diagram of the light emitting device according to this embodiment, and is a bottom view of the light emitting device.
The light-emitting device 1 is a package having a bottom portion 91 made of lead and resin, a wall portion 31 made of the resin, and a cup-shaped concave portion 8 (cavity) formed by the bottom portion 91 and the wall portion 31. 9 and a light-emitting element 2 arranged on a bottom portion 91 in the recess 8 , and the recess 8 is filled with a translucent member 3 so as to cover the light-emitting element 2 .

The package 9 is composed of first leads 10 , second leads 20 and a resin molding 30 . The package 9 has a substantially rectangular parallelepiped shape as a whole, and has a recess 8 on the upper surface of the bottom 91 of the package 9 . The bottom portion 91 is composed of the first lead 10 , the second lead 20 , and the bottom-constituting resin portion 32 of the resin molding 30 . The first inner lead portion 12 is the first lead portion within the recess 8 and the second inner lead portion 22 is the second lead portion within the recess 8 . The light emitting element 2 is mounted on the second inner lead portion 22 inside the concave portion 8 of the package 9 .

The first lead 10 has a first outer lead portion 11 and a first inner lead portion 12 . The first outer lead portion 11 is a lead portion located outside the wall portion 31 of the resin molded body 30 . Although the shape of the first outer lead portion 11 is a rectangle having the first recessed portion 50 in a plan view, the shape is not limited to this, and other rectangles, a shape having a partial cutout or a through hole may be used. good.

The first inner lead portion 12 is a lead portion positioned inside and under the wall portion 31 of the resin molding 30 . Although the shape of the first inner lead portion 12 is substantially rectangular in plan view, the shape is not limited to this, and may be partially notched, recessed, or provided with a through hole.

The second lead 20 has a second outer lead portion 21 and a second inner lead portion 22 . The second outer lead portion 21 is a lead portion positioned outside the wall portion 31 of the resin molded body 30 . The shape of the second outer lead portion 21 is a rectangle having the second recessed portion 55 in a plan view, but the shape is not limited to this, and other rectangles, a shape having a partial cutout or a through hole may be used. good.

The second inner lead portion 22 is a lead portion positioned inside and under the wall portion 31 of the resin molding 30 . Although the shape of the second inner lead portion 22 is substantially rectangular in plan view, the shape is not limited to this, and may be partially notched, recessed, or provided with a through hole.

The first lead 10 and the second lead 20 are formed on the bottom surface of the light emitting device 1 so as to be exposed to the outside. The outer side of the bottom surface of the light emitting device 1 is the side to be mounted on an external substrate. The first lead 10 and the second lead 20 are spaced apart from each other, and between the first lead 10 and the second lead 20, the bottom-constituting resin portion 32 of the resin molding 30 is formed. intervening.

The length, width, and thickness of the first lead 10 and the second lead 20 are not particularly limited, and can be appropriately selected according to the purpose and application. The material of the first lead 10 and the second lead 20 is preferably copper or a copper alloy, for example, and the outermost surface thereof is preferably coated with a highly reflective metal material such as silver or aluminum. .

The resin molded body 30 includes a wall portion 31 forming the recess 8 and a bottom forming resin portion 32 forming a bottom portion. The wall portion 31 has four rectangular sides formed on the first lead 10 and the second lead 20 . The wall portion 31 is formed so as to sandwich the first lead 10 and the second lead 20 between two sides of the rectangle facing each other. Thereby, the wall portion 31 can fix the first lead 10 and the second lead 20 .

The wall portion 31 is formed so as to form a rectangular recessed portion 8 in plan view, and is formed in a rectangular annular shape in plan view. The inner side surface of the wall portion 31 (the side surface on the side of the recess 8) is formed as a slightly inclined surface so that the recess 8 widens upward. This inner surface reflects the light from the light emitting element 2 on the inclined surface and efficiently guides it upward, which is the light extraction direction. The height, length, width, and shape of the wall portion 31 are not particularly limited, and can be appropriately selected according to the purpose and application.
Further, in the upper surface of the first lead 10 and the upper surface of the second lead 20 under the wall portion 31, a groove portion 40 having a V-shaped vertical cross section is carved. A lower portion of the wall portion 31 is a projecting portion 311 having a projecting shape. The projecting portion 311 has a V shape corresponding to the shape of the groove portion 40 , and the projecting portion 311 is fitted in the groove portion 40 . The groove 40 may be omitted, but by forming the groove 40, the distance from the opening on the recess 8 side of the interface between the first lead 10 or the second lead 20 and the wall 31 to the outer opening of the wall 31 is increased. is long, that is, the distance that the resin travels from the side of the recess 8 to the outside of the wall 31 through the gap existing at the interface between the lead and the wall is long, thereby suppressing resin leakage. The shape of the groove portion 40 and the projecting portion 311 is not limited to the V-shape, and other shapes such as a U-shape may also be used.

The flange portion 33 is formed of the first outer lead portion 11 or the second outer lead portion 21, and projects sideways from the wall portion 31 to form the first outer lead portion 11 and the second outer lead portion 11 and the second outer lead portion 21, respectively. It may be formed with the same length and thickness as the lead portion 21 . In this case, both surfaces of the first outer lead portion 11 and the second outer lead portion 21 and the flange portion 33 may be flush with each other. 1 resin. The length of the first outer lead portion 11 and the second outer lead portion 21 is preferably 0.1 mm or more and 1.5 mm or less from the outer surface of the wall portion 31, but is not limited to this. The lengths of the first outer lead portion 11 and the second outer lead portion 21 projecting outward from the wall portion 31 of the package 9 are equal to the lengths of the first outer lead portion 11 and the second outer lead portion 21 . is preferably 0.01 or more and 0.3 or less with respect to the length 1 of the package 9 in the direction in which .

Examples of the material of the resin molding 30 include thermoplastic resins and thermosetting resins.
In the case of thermoplastic resin, for example, polyamide resin, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, etc. can be used.
In the case of thermosetting resins, for example, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, etc. can be used.
In order to efficiently reflect light on the inner peripheral surface of the wall portion 31 of the resin molded body 30, the resin molded body 30 may contain a light reflecting member. The light reflecting member is, for example, a material with high light reflectance such as titanium oxide, glass filler, silica, alumina, white filler such as zinc oxide. The reflectance of visible light is preferably 70% or more, or 80% or more. In particular, it is preferable that the reflectance is 70% or more, or 80% or more in the wavelength region emitted by the light emitting element. The content of titanium oxide or the like may be 5% by weight or more and 50% by weight or less, preferably 10% by weight to 30% by weight, but is not limited thereto.
The light emitting element 2 is electrically connected to the second lead 20 of the light emitting device 1 via a bump or the like, but may be electrically connected to the second lead 20 via a wire. The shape and size of the light emitting element 2 are not particularly limited. As the emission color of the light emitting element 2, one having an arbitrary wavelength can be selected according to the application. For example, a GaN-based or InGaN-based light emitting element can be used as a blue (light with a wavelength of 430 to 490 nm) light emitting element. As an InGaN-based material, In _X Al _Y Ga _1-XY N (0≦X≦1, 0≦Y≦1, X+Y≦1) or the like can be used.
A wire is a conductive wiring for electrically connecting an electronic component such as the light emitting element 2 or the protection element and the first lead 10 or the second lead 20 . Examples of wire materials include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), Al (aluminum), and alloys thereof. It is preferable to use Au, which is excellent in thermal conductivity and the like. Note that the thickness of the wire is not particularly limited, and can be appropriately selected according to the purpose and application.

Translucent member 3 contains filler 4 . The translucent member 3 covers the light emitting element 2 and the like mounted in the recess 8 . The translucent member 3 is provided to protect the light emitting element 2 and the like from external force, dust, moisture, etc., and to improve heat resistance, weather resistance, and light resistance of the light emitting element 2 and the like.
The translucent member 3 is preferably made of a material having good translucency, such as a thermosetting resin, a thermoplastic resin, or the like. Examples of thermosetting resins include silicone resins, silicone-modified resins, silicone hybrid resins, epoxy resins, epoxy-modified resins, urea resins, diallyl phthalate resins, phenol resins, unsaturated polyester resins, or one or more of these resins. hybrid resins, and the like. In particular, silicone resins or their modified resins or hybrid resins are preferable because they are excellent in heat resistance and light resistance. Translucent member 3 may have a transmittance of 50% or more, preferably 70% or more, and more preferably 85% or more.

For the filler 4, for example, substances with _high light reflectance such as _SiO2 , _TiO2 , _{Al2O3 ,} ZrO2, MgO can be suitably used, and fillers of different materials can be used together. Also, for the purpose of cutting off unwanted wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

As for the size of the filler 4, the median diameter D50 is, for example, 0.2 μm or more and 0.8 μm or less, preferably 0.2 μm or more and 0.7 μm or less, more preferably 0.2 μm or more and 0.6 μm or less, and 0.2 μm or more. It is more preferably 2 μm or more and 0.5 μm or less, and particularly preferably 0.3 μm or more and 0.5 μm or less.
As for the size of the filler 4, the median diameter D10 is, for example, 0.1 μm or more and 0.3 μm or less, preferably 0.15 μm or more and 0.3 μm or less, and more preferably 0.2 μm or more and 0.3 μm or less.
Furthermore, the size of the filler 4 has a median diameter D90 of, for example, 0.7 μm or more and 1 μm or less, preferably 0.7 μm or more and 0.95 μm or less, more preferably 0.7 μm or more and 0.9 μm or less, and 0.7 μm or more and 0.95 μm or less. It is more preferably 7 μm or more and 0.85 μm or less, and particularly preferably 0.7 μm or more and 0.8 μm or less.
The size of filler 4 is important. If the size is too small, the filler 4 together with the resin component will flow from the gap existing at the interface between the first lead 10 and the wall portion 31 or the interface between the second lead 20 and the wall portion 31, and will flow from the opening on the side of the recess 8 to the wall. Leakage to the outside of the portion 31 is facilitated. If the size of the filler 4 is too large, the gap cannot be sufficiently closed and resin leakage cannot be reduced. By setting the size of the filler 4 within the above range, the filler 4 efficiently closes the openings or gaps, and leakage of the translucent member to the outside of the wall portion 31 can be reduced.
As for the size of the filler 4, the D50 is preferably 15% or more and 160% or less, more preferably 30% or more and 100% or less, of the size (height) of the gap from the viewpoint of resin leakage reduction. When the size of the gap is not constant, it is preferable that the size of the filler is within the above range with respect to the maximum size of the gap. The size of the gap is preferably 0.5 μm or more and 3 μm or less.

The difference in the specific gravity of the filler 4 from the resin component of the translucent member 3 can be within 3 g/cm ³ . If the specific gravity of the filler 4 is greater than that of the resin component, the filler 4 tends to settle on the bottom surface of the recess 8 and easily closes the interfacial gap between the lead and the wall, contributing to reducing resin leakage, which is preferable. On the other hand, since the filler 4 having a specific gravity smaller than that of the resin component of the translucent member 3 can slow down the sedimentation speed, excessive uneven distribution can be suppressed.
Regarding the specific gravity of the filler 4, the difference in specific gravity from the resin component of the translucent member 3 is preferably within 0.5 to 3 g/cm ³ , more preferably within 0.8 to 1.2 g/cm ³ . Within this range, the uneven distribution of the filler 4 in the dispenser is reduced, and the filler 4 tends to be unevenly distributed near the bottom surface of the recess 8 . Among these ranges, the specific gravity of the filler 4 is preferably 0.5 to 3 g/cm ³ larger than the specific gravity of the resin component of the light-transmitting member 3 in that the restrictions imposed by means for unevenly distributing the filler are reduced. More preferably 8-1.2 g/cm ³ or greater. For example, a silica filler with a specific gravity of 2.2 g/cm ³ can be suitably used for a silicone resin component with a specific gravity of 1.1 g/cm ³ .

Although the shape of the filler 4 is not particularly limited, it is preferably spherical in terms of reducing resin leakage. The filler 4 may also be hollow particles.

If the filler 4 is surface-modified by surface treatment, resin leakage can be further reduced, which is preferable. It is believed that the surface modification improves the compatibility with the resin component and facilitates the sedimentation of the filler 4 . Organosilane treatment is preferred as the surface treatment. Examples of surface treatment agents include silane coupling agents. Examples of silane coupling agents include various alkoxysilane compounds and silazane compounds.

The filler 4 can improve the light extraction efficiency in the light emitting device 1 by scattering the light emitted by the light emitting element 2 . Therefore, it is preferable that the filler 4 is made of a material having a large difference in refractive index from that of the translucent member 3 . Therefore, when the material of the translucent member 3 is silicone resin (refractive index 1.41 to 1.54), by using silica (refractive index 1.45 to 1.60) or the like, It is possible to increase the light extraction efficiency to the outside.

The amount of the filler 4 added to 100 parts of the resin component constituting the translucent member 3 is preferably 5 parts or more and 50 parts or less, more preferably 15 parts or more and 30 parts or less. When the amount added is large, the effect of reducing resin leakage is high. When the amount added is within this range, the effect of reducing resin leakage is excellent, and the decrease in luminous intensity of the light-emitting device due to the decrease in transmittance due to the increase in the amount of filler is excellent in suppression. The unit of the amount of the filler 4 added, "part", corresponds to the weight of the filler 4 with respect to 100 g of the weight of the resin component forming the translucent member. For example, the amount of filler 4 added of 50 parts means that the amount of filler 4 added is 50 g with respect to 100 g of the resin component of translucent member 3 .

Translucent member 3 may contain a phosphor. Color tone adjustment can be facilitated by containing a phosphor. As the luminous body, a luminous body having a higher specific gravity than the resin component of the translucent member 3 and absorbing the light from the light emitting element 2 to convert the wavelength can be used.
The phosphor is, for example, a yellow phosphor such as YAG (Y ₃ Al ₅ O ₁₂ :Ce) or silicate, or a red phosphor such as CASN (CaAlSiN ₃ :Eu) or KSF (K ₂ SiF ₆ :Mn), etc. can be mentioned.

According to the light emitting device 1, the filler 4 (generally referred to as a light diffusing agent) that is originally added to the translucent member 3 to control the light distribution is used, and the particle diameter of the filler 4 is The filler 4 is made to exist in the vicinity of the bottom surface of the concave portion 8 by appropriately adjusting the addition amount and the like. As a result, it is possible to realize the light-emitting device 1 in which resin leakage from the concave portion is reduced, and problems such as poor contact caused by the resin leakage are suppressed.

Method for Manufacturing Light Emitting Device A method for manufacturing the light emitting device according to this embodiment will be described with reference to FIGS. 5A to 5E.

FIG. 5A is a cross-sectional view of a package mounted with a light-emitting element, showing a step of preparing the package and the light-emitting element in the method of manufacturing the light-emitting device according to this embodiment. 5B and 5C are cross-sectional views of a package in which a light-emitting element is mounted, for showing the resin filling step in the method of manufacturing the light-emitting device according to this embodiment. FIG. 5D is a cross-sectional view of a package in which a light-emitting element is mounted, for showing the filler sedimentation step in the method for manufacturing the light-emitting device according to this embodiment. FIG. 5E is a cross-sectional view of the package in which the light-emitting element is mounted, for showing the resin curing step in the method of manufacturing the light-emitting device according to this embodiment.

As shown in FIG. 5A, the step of preparing the package and the light-emitting element includes the first lead 10, the second lead 20, the bottom portion 91 (bottom portion-constituting resin portion 32) made of resin, and the a step of preparing a package 9 having a wall portion 31, a recess portion 8 formed by the bottom portion 91 and the wall portion 31, and a light emitting element 2 disposed on the second lead 20 in the recess portion 8; is. In the package 9, the bottom-constituting resin portion 32 and the wall portion 31 are integrally molded as a resin molded body 30, and can be manufactured according to, for example, the package manufacturing method described in Japanese Patent Application Laid-Open No. 2016-072607. Not limited. The light emitting element 2 is electrically connected to the second lead 20 by wires or bumps.

As shown in FIG. 5B, the resin filling step is a step of filling the liquid resin composition 6 containing a filler having a median diameter D50 of 0.2 μm or more and 0.8 μm or less so as to cover the light emitting element 2 in the concave portion 8. . In the resin filling process, the filler 4 is added to the silicone resin 5 in advance, and the filler 4 is uniformly dispersed in the silicone resin. The silicone resin is dripped into the recess 8 by a potting method using a dispenser.

As shown in FIG. 5C, after the resin filling process, the fillers 4 having a predetermined particle size are distributed substantially uniformly. In the subsequent filler sedimentation step, the filler 4 can be present in the vicinity of the bottom surface of the concave portion 8, thereby reducing leakage of the resin.

As shown in FIG. 5D , the filler sedimentation process is a process of naturally sedimenting the filler 4 on the bottom surface side of the recess 8 of the package 9 . Sedimentation conditions can be appropriately adjusted so that the filler 4 settles on the bottom surface side of the concave portion 8 according to the properties of the liquid resin composition 6, for example, the specific gravity of the filler 4, the specific gravity and viscosity of the silicone resin 5, and the like.
In addition, when the specific gravity of the filler 4 is sufficiently large and the filler 4 settles on the bottom side of the recess 8 by leaving the package 9 filled with the liquid resin composition 6 still, the settling time can be shortened. . On the other hand, when the specific gravity of the filler 4 is small and the sedimentation of the filler 4 is slow, the filler 4 can be arranged near the side surface and the upper surface of the light emitting element while the filler 4 is arranged on the bottom surface of the recess 8. can increase the dispersion of light from the

As shown in FIG. 5E , the resin curing step is a step of heating and curing the liquid resin composition 6 to form the translucent member 3 . In the resin curing step, the liquid resin composition 6 is heated at 150° C. for 4 hours. When the liquid resin composition 6 is cured by heating to form the translucent member 3, the precipitated filler 4 is fixed near the bottom surface of the recess 8 and contributes to preventing resin leakage.
The resin curing step is preferably performed within 5 hours, more preferably within 3 hours after the liquid resin composition 6 is filled in the concave portion 8 so as to cover the light emitting element 2, and the settling time of the filler 4 is reduced. is preferable in that the leakage of the liquid resin composition 6 can be suppressed while ensuring the If it takes a long time to harden after filling, the liquid resin composition 6 tends to leak. The heating conditions (time, temperature, etc.) can be appropriately adjusted according to the properties of the liquid resin composition 6, for example, the curing temperature of the silicone resin 5, and the like.

As described above, the light-emitting device 1 is manufactured by performing the above-described steps. In each of the above-described steps, one light emitting device 1 was explained, but after a plurality of light emitting devices 1 are formed at once with the leads and the resin moldings being continuous, they are separated into individual pieces, one by one. It may be separated into one light emitting device 1 .

According to the method for manufacturing the light emitting device according to the present embodiment, the particle size of the filler 4 and the like are appropriately adjusted so that the filler 4 settles down to the vicinity of the bottom surface of the recess 8 . As a result, it is possible to manufacture the light-emitting device 1 in which leakage of resin from the concave portion is reduced and problems such as poor contact are suppressed.

EXAMPLES The present invention will be described in more detail with reference to examples and the like, but the present invention is not limited to the examples and the like. Details of constituent materials used in the following examples are as follows. The particle size of the filler (light diffusing agent) is a value determined by a laser diffraction particle size distribution analyzer.

Package 9
Outline of package in plan view: Rectangular (long side 1.6 mm, short side 0.84 mm, short side has recess)
Outer shape of wall portion in plan view: rectangle (long side 1.42 mm, short side 0.8 mm)
Outer shape of wall inner circumference (recess) in plan view: rectangular (long side 1.18 mm, short side 0.54 mm)
Recess height: 0.35mm
Wall thickness: 0.06 (upper wall) to 0.12 mm (lower wall)
Material of the resin part of the bottom part and the wall part: Polyamide resin (model number: NM93FS)
Maximum length of outer lead part: 0.25 mm from the outer wall part
Dimensions of the recessed part of the outer lead part: The shortest distance from the outer wall part is 0.05 mm
Collar length: 0.25 mm from the outer wall surface

Light emitting element 2
Type: Emit blue light with an emission peak wavelength of 455 nm External shape in plan view: Square (0.23 mm on a side)
Height: 120 μm
Mounted quantity: 1

Resin component of liquid resin composition 6 Material: Two-component curable methylphenyl silicone resin (Dow Corning Toray Co., Ltd.)
Specific gravity: 1.1g/ ^cm3
Curing temperature and time: 4 hours at 150° C. Filling height when filling recesses: 0.32 mm

Filler A
Type: Light diffusing agent Material: Silica (SO-C2; Admatechs)
Specific gravity: 2.2g/ ^cm3
Shape: Spherical

Filler B
Type: Light diffuser (surface-treated silica)
Material: Silica (SC2500-SQ; Admatechs)
Specific gravity: 2.2g/ ^cm3
Shape: Spherical Surface treatment: Organosilane treatment

Examples and Comparative Examples A light diffusing agent having an average particle size shown in Table 1 was mixed with the resin component in the amount shown in Table 1 (the amount added to 100 parts by mass of the resin component (silicone resin)) to obtain a liquid resin composition. prepared the product.
140 packages were prepared for each liquid composition, and the liquid resin composition was filled into package recesses and cured by heating (at 150° C. for 4 hours) within 60 minutes to fabricate a light emitting device. In Comparative Example 1, no filler was blended.
After curing, the top surface and back surface of the terminal (outer lead portion) of the light emitting device were observed to confirm the number of packages with resin leakage. In addition, the degree of leakage was classified into "large leakage" and "small leakage" for packages with resin leakage. Judgment of large leakage and small leakage was performed as follows. 60% (0.15 mm from the outer surface of the wall) of the shortest distance (0.25 mm) from the outer surface of the wall constituting the recess to the outer periphery of the terminal (excluding the recess) is set as a leakage judgment line, and resin leakage is determined. When did not exceed the line, it was determined as "small leakage", and when it exceeded, it was determined as "large leakage". If the resin leakage exceeds 60%, the leaked resin will flow into the back surface of the lead, and the possibility of poor contact will be very high.

Table 1 shows the results. Leakage is reduced in Comparative Examples 2 to 5 with filler addition in comparison with Comparative Example 1 with no filler added, but in Examples 1 and 2 with a smaller average filler particle size (D50), the leakage rate is reduced to 10% or less. Since the ratio of large leaks is 0%, problems due to leaks such as poor contact can be reduced. Therefore, the benefits of leakage reduction provided by the present invention become greater as packages become smaller. In addition, in Example 2 using the surface-treated filler, only 2% of small leakage was observed, and the leakage could be further reduced than in Example 1 using the filler that was not surface-treated. Treatment was useful in reducing leakage.

Further, one of the light emitting devices of Example 1 was cut along the top surface of the bottom portion to remove the bottom portion, and the cut surface side of the wall portion and the resin-filled recess was photographed with a scanning electron microscope. A scanning electron micrograph is shown in FIG. FIG. 6A is a photograph showing the whole. FIG. 6B is an enlarged photograph of the area surrounded by a white frame in FIG. 6A. In FIG. 6B, the whitish particulate matter seen in the area surrounded by the white frame is the filler.
As a result of photograph observation, it was confirmed that the filler was present in about 50% to about 90% of the position corresponding to the opening on the concave side of the gap existing at the interface between the upper surface of the lead and the bottom surface of the wall on the bottom surface of the wall. It was confirmed that the filler blocked 30% or more of the opening.

A light-emitting device according to an embodiment of the present disclosure can be used for lighting, a backlight for a liquid crystal panel, and the like.

Reference Signs List 1 light emitting device 2 light emitting element 3 translucent member 4 filler 5 silicone resin 6 liquid resin composition 8 recess 9 package 10 first lead 11 first outer lead 12 first inner lead 20 second lead 21 2nd outer lead part 22 2nd inner lead part 30 resin molding 31 wall part 311 protruding part 32 bottom part forming resin part 33 collar part 40 groove part 50 recessed part 91 bottom part

Claims (15)

a package having a bottom made of leads and a resin, a wall made of the resin, and a recess formed by the bottom and the wall;
a light emitting element disposed on the bottom of the recess;
a translucent member filled in the recess so as to cover the light emitting element;
with
The translucent member contains a filler having a median diameter D50 of 0.2 μm or more and 0.8 μm or less,
The filler blocks 30% or more of the recess-side opening of the gap existing at the interface between the lead and the wall.
Luminescent device. 2. The light-emitting device according to claim 1, wherein D10 of said filler is 0.1 [mu]m or more and 0.3 [mu]m or less. 3. The light-emitting device according to claim 1, wherein D90 of said filler is 0.7 [mu]m or more and 1 [mu]m or less. 4. The light-emitting device according to claim 1, wherein the specific gravity of said filler is within 3 g/cm ³ of the specific gravity of the resin component forming said translucent member. The light-emitting device according to any one of claims 1 to 4, wherein the filler is spherical. The light emitting device according to any one of claims 1 to 5, wherein the resin forming the bottom portion and the wall portion is polyamide. The light-emitting device according to any one of claims 1 to 6, wherein the filler is a surface-treated filler. The light-emitting device according to any one of claims 1 to 7 , wherein the resin forming the translucent member is a silicone resin. 9. The light emitting device according to claim 1 , wherein said lead has a groove shape at said interface, and said wall portion has a shape corresponding to said groove shape at said interface. The light emitting device according to any one of claims 1 to 9 , wherein the lead has an outer lead portion, and the length of the outer lead portion is 0.1 mm or more and 1.5 mm or less from the outer surface of the wall portion. A package having a bottom made of leads and a resin, a wall made of the resin, and a recess formed by the bottom and the wall, and a light emitting element arranged on the bottom in the recess. the process of preparing,
filling the recess with a liquid resin composition containing a filler having a median diameter D50 of 0.2 μm or more and 0.8 μm or less so as to cover the light emitting element;
a step of sedimenting the filler near the bottom surface of the recess;
a step of heating and curing the liquid resin composition to form a translucent member;
has
In the sedimentation step, the filler closes 30% or more of the recess-side opening of the gap existing at the interface between the lead and the wall.
A method for manufacturing a light-emitting device. The manufacturing method according to claim 11 , wherein D10 of the filler is 0.1 µm or more and 0.3 µm or less. 13. The manufacturing method according to claim 11 , wherein D90 of said filler is 0.7 [mu]m or more and 1 [mu]m or less. The production method according to any one of claims 11 to 13 , wherein the liquid resin composition contains a silicone resin, and the specific gravity of the filler differs from the specific gravity of the silicone resin by within 3 g/cm ³ . 15. The manufacturing method according to any one of claims 11 to 14 , wherein the liquid resin composition is cured within 5 hours after filling the recess so as to cover the light emitting element.

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