JP7206431B2 - Radiation detector, radiation detector manufacturing method, and image processing method - Google Patents

Description

The present invention relates to a radiation detector, a radiation detector manufacturing method, and an image processing method.

For example, the following radiation detector may be used to acquire an X-ray transmission image of the oral cavity over a wide range. That is, a wiring board, a plurality of image sensors mounted on the wiring board, a plurality of fiber optic plates each fixed on the plurality of image sensors, a scintillator layer provided on the plurality of fiber optic plates, A radiation detector comprising As such a radiation detector, Patent Document 1 describes an X-ray image sensor in which adjacent fiber optic plates are brought into contact with each other at the corners on the light incident surface side.

JP-A-8-211155

However, in the X-ray image sensor described in Patent Document 1, positional deviation is likely to occur between the light incident surface of one fiber optic plate and the light incident surface of the other fiber optic plate. There is a possibility that an X-ray transmission image cannot be obtained with high accuracy.

An object of the present invention is to provide a radiation detector capable of acquiring a radiation image over a wide range with high accuracy, a method for manufacturing the radiation detector, and an image processing method.

The radiation detector of the present invention comprises a wiring substrate, a first image sensor and a second image sensor adjacent to each other on the wiring substrate, a first fiber optic plate adjacent to each other on the first image sensor and the second image sensor, and a second fiber optic plate; and a scintillator layer provided on the first fiber optic plate and the second fiber optic plate, the first fiber optic plate having a first light input surface, a first light output surface, and a first light output surface. , a first side surface connecting the first light incident surface and the first light emitting surface, and a first light incident area of the first light incident surface and a first light emitting area of the first light emitting surface; The second fiber optic plate has a second light input surface, a second light output surface, and a second side connecting the second light input surface and the second light output surface. , the light can be guided between the second light incident area of the second light incident surface and the second light emitting area of the second light emitting surface, and the second light incident area side of the first light incident area one side and one side of the second light incident area on the side of the first light incident area are in contact with each other, the first light emitting area is located on the first light receiving area of the first image sensor, The second light emitting area is located on the second light receiving area of the second image sensor, and is located on one side of the first side on the side of the second fiber optic plate and on the side of the first fiber optic plate on the second side. One sides are contoured and in contact with each other.

In this radiation detector, light is generated in the scintillator layer when radiation is incident on the scintillator layer. Then, the light incident on the first fiber optic plate from the scintillator layer is guided from the first light incident area to the first light emitting area and enters the first light receiving area of the first image sensor. On the other hand, the light incident on the second fiber optic plate from the scintillator layer is guided from the second light incident area to the second light emitting area and enters the second light receiving area of the second image sensor. Here, one side of the first light incident area on the second light incident area side and one side of the second light incident area on the first light incident area side are in contact with each other. Therefore, the light generated in the scintillator layer is continuously detected by the first image sensor and the second image sensor. One side surface of the first side surface on the side of the second fiber optic plate and one side surface of the second side surface on the side of the first fiber optic plate are shaped along each other and are in contact with each other. Therefore, positional deviation is less likely to occur between the first light incident surface of the first fiber optic plate and the second light incident surface of the second fiber optic plate. Therefore, according to this radiation detector, a radiographic image can be obtained over a wide range with high accuracy.

In the radiation detector of the present invention, the distance between one side of the first light emitting region on the side of the second light emitting region and one side of the second light emitting region on the side of the first light emitting region is the second light receiving region in the first light receiving region. The distance between the side of the area and the side of the second light receiving area on the side of the first light receiving area is greater than the distance between the side of the first light emitting area on the side of the second light emitting area and the side of the first light emitting area on the side of the second light receiving area. located on or inside the one side, and the side of the second light emitting region on the side of the first light emitting region is on or inside the side of the second light receiving region on the side of the first light receiving region may be located in According to this configuration, while relaxing the positioning accuracy of the first fiber optic plate and the second fiber optic plate with respect to the first image sensor and the second image sensor, the light is guided by each of the first fiber optic plate and the second fiber optic plate. The emitted light can be reliably detected by the first image sensor and the second image sensor.

The radiation detector of the present invention further includes a storage section provided on the wiring board, and the storage section includes one side of the first light emitting region on the second light emitting region side and one side of the first light receiving region on the second light receiving region side. A first deviation amount from one side and a second deviation amount between one side of the second light output area on the side of the first light emitting area and one side of the second light receiving area on the side of the first light receiving area may be stored. . According to this configuration, one continuous radiographic image can be generated based on the first shift amount and the second shift amount.

In the radiation detector of the present invention, the outer edges of the mutually continuous first light entrance surface and the second light entrance surface, and the mutually continuous outer edges of the first light exit surface and the second light exit surface are measured by the thickness of the wiring board. When viewed from a direction, it may include a first light receiving area and a second light receiving area. According to this configuration, the first fiber optic plate and the second fiber optic plate have a sufficient thickness on the radiation incident side of the first light receiving region and the second light receiving region (that is, the first light entrance surface and the first light exit surface). surface, thickness corresponding to the distance between the second light entrance surface and the second light exit surface), the radiation of the first light receiving region and the second light receiving region Deterioration can be suppressed.

In the radiation detector of the present invention, the first image sensor has a first circuit region adjacent to the first light receiving region, the second image sensor has a second circuit region adjacent to the second light receiving region, When viewed from the thickness direction of the wiring board, the outer edges of the first light entrance surface and the second light entrance surface that are continuous with each other, and the outer edges of the first light exit surface and the second light exit surface that are continuous with each other are the It may include one light receiving region, a first circuit region, a second light receiving region and a second circuit region. According to this configuration, the first fiber optic plate and the second fiber optic plate have a sufficient thickness (that is, thickness corresponding to the distance between the first light entrance surface and the first light exit surface, and thickness corresponding to the distance between the second light entrance surface and the second light exit surface). It is possible to suppress deterioration of the light receiving region, the first circuit region, the second light receiving region, and the second circuit region due to radiation.

A method for manufacturing a radiation detector according to the present invention is a method for manufacturing the above-described radiation detector, wherein one side surface on the side of the second fiber optic plate in the first side surface and one side surface on the side of the first fiber optic plate in the second side surface obtaining a first fiber optic plate and a second fiber optic plate bonded together in and after obtaining a first light entrance surface of the first fiber optic plate and a second light entrance surface of the second fiber optic plate After the step of polishing the surface and the step of polishing, forming a scintillator layer on the first fiber optic plate and the second fiber optic plate, and on the first image sensor and the second image sensor mounted on the wiring substrate B. bonding the first fiber optic plate and the second fiber optic plate.

In this method of manufacturing a radiation detector, the steps of obtaining a first fiber optic plate and a second fiber optic plate bonded to each other; polishing the light incident surface, the first light incident surface of the first fiber optic plate and the second light incident surface of the second fiber optic plate can be easily and reliably made flush with each other. Moreover, by performing the step of forming the scintillator layer in a state in which the first light incident surface and the second light incident surface are flush with each other, it is possible to suppress the occurrence of distortion or the like in the scintillator layer. Therefore, according to this radiation detector manufacturing method, it is possible to reliably manufacture a radiation detector capable of accurately acquiring a radiographic image over a wide range.

In the manufacturing method of the radiation detector of the present invention, in the joining step, the scintillator layer is formed on the first fiber optic plate and the second fiber optic plate, and then the first image sensor mounted on the wiring board. and a first fiber optic plate and a second fiber optic plate may be cemented on the second image sensor. In this case, the scintillator layers formed on the first fiber optic plate and the second fiber optic plate can be inspected before being joined to the relatively expensive first image sensor and second image sensor. Even if there is a defect in the first image sensor and the second image sensor, the increase in manufacturing cost can be suppressed.

In the radiation detector manufacturing method of the present invention, the scintillator layer may be made of CsI. Here, since the scintillator layer is formed in advance on the first fiber optic plate and the second fiber optic plate, the corrosiveness of CsI causes damage to the first image sensor, the second image sensor, and the wiring board. can be suppressed.

In the manufacturing method of the radiation detector of the present invention, in the bonding step, the first fiber optic plate and the second fiber optic plate are bonded onto the first image sensor and the second image sensor mounted on the wiring board, A scintillator layer may then be formed over the first fiber optic plate and the second fiber optic plate. In this case, since the scintillator layer having a lower strength than other members is formed last, it is possible to suppress damage to the scintillator layer.

In the manufacturing method of the radiation detector of the present invention, in the polishing step, the first light incident surface of the first fiber optic plate and the second light incident surface of the second fiber optic plate are ground, and the first fiber optic plate and the second light exit surface of the second fiber optic plate may be polished. In this case, in the step of bonding the first fiber optic plate and the second fiber optic plate onto the first image sensor and the second image sensor, the first light emitting area of the first fiber optic plate and the first light emitting area of the first image sensor The distance to the light receiving area and the distance between the second light emitting area of the second fiber optic plate and the second light receiving area of the second image sensor can be made uniform. Therefore, in this case, it is possible to more reliably manufacture a radiation detector capable of accurately acquiring a radiation image over a wide range.

A method for manufacturing a radiation detector according to the present invention is a method for manufacturing the above-described radiation detector, wherein a scintillator layer is formed on the first fiber optic plate and the second fiber optic plate, and the scintillator layer is mounted on the wiring substrate. After bonding the first and second fiber optic plates onto the first and second image sensors, and after forming and bonding, a first shift amount and a second shift amount are measured. and storing the first deviation amount and the second deviation amount in a storage unit provided on the wiring board after the measuring process.

According to this radiation detector manufacturing method, since the first and second deviation amounts unique to each radiation detector are stored in the storage unit, the stored first and second deviation amounts Based on this, a radiation detector capable of accurately generating one radiographic image can be manufactured.

An image processing method of the present invention is an image processing method using the above-described radiation detector, wherein one side of the first light emitting region on the side of the second light emitting region and one side of the first light receiving region on the side of the second light receiving region and a second deviation amount between one side of the second light emitting region on the side of the first light emitting region and one side of the second light receiving region on the side of the first light receiving region; After the step, the first electrical signal output from the first image sensor via the wiring board, the second electrical signal output from the second image sensor via the wiring board, the first deviation amount and the second 2) generating one radiographic image based on the amount of deviation.

According to this image processing method, since the first deviation amount and the second deviation amount unique to each radiation detector are acquired, one sheet of radiation is obtained based on the acquired first deviation amount and the second deviation amount. Images can be generated with high accuracy.

According to the present invention, it is possible to obtain a radiographic image over a wide range with high accuracy.

1 is a cross-sectional view of a radiation detector of one embodiment; FIG. 2 is a cross-sectional view of the radiation detector along line II-II shown in FIG. 1; FIG. 2 is a cross-sectional view of the radiation detector along line III-III shown in FIG. 1; FIG. It is a figure for demonstrating the manufacturing method of the radiation detector of one Embodiment. It is a figure for demonstrating the manufacturing method of the radiation detector of one Embodiment. It is a figure for demonstrating the manufacturing method of the radiation detector of one Embodiment. It is a figure for demonstrating the manufacturing method of the radiation detector of one Embodiment. It is a figure for demonstrating the image-processing method of one Embodiment. It is a figure for demonstrating the image-processing method of one Embodiment. It is a figure for demonstrating the image-processing method of one Embodiment. It is a figure for demonstrating the modification of a radiation detector. It is a figure for demonstrating the modification of a radiation detector. It is a figure for demonstrating the modification of a radiation detector. It is a figure for demonstrating the modification of a radiation detector.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and redundant explanations are omitted.
[Configuration of Radiation Detector]

As shown in FIGS. 1 and 2, the radiation detector 1 includes a wiring board 2, a first image sensor 3 and a second image sensor 4, a first FOP (first fiber optic plate) 5 and a second FOP (fiber An optical plate) 6 , a scintillator layer 7 , a protective layer 8 and a housing 9 are provided. The wiring board 2 has a front surface 2a and a back surface 2b facing each other. Hereinafter, one direction parallel to the front surface 2a and the rear surface 2b is the X-axis direction, a direction parallel to the front surface 2a and the rear surface 2b and parallel to the X-axis direction is the Y-axis direction, and a direction in which the front surface 2a and the rear surface 2b face each other (wiring substrate 2) as the Z-axis direction, each configuration will be described in detail.

The first image sensor 3 and the second image sensor 4 are adjacent to each other on the wiring board 2 . More specifically, the first image sensor 3 and the second image sensor 4 are mounted on the surface 2a of the wiring board 2 and are adjacent to each other in the X-axis direction.

The first image sensor 3 is configured by providing a first light receiving region 31 and first circuit regions 32 and 33 on a first semiconductor substrate 30 . The first image sensor 3 is, for example, a solid-state imaging device such as CCD/CMOS. The first light receiving region 31 is composed of a plurality of pixels that perform photoelectric conversion. The first circuit regions 32 and 33 are signal readout circuits such as shift registers.

The first light receiving region 31 is provided on the surface 30 a of the first semiconductor substrate 30 opposite to the wiring substrate 2 . The first light receiving region 31 has, for example, a rectangular shape having a pair of sides perpendicular to the X-axis direction and a pair of sides perpendicular to the Y-axis direction when viewed from the Z-axis direction. Each first circuit region 32 , 33 is adjacent to the first light receiving region 31 . More specifically, the first circuit area 32 is provided on the second image sensor 4 side with respect to the first light receiving area 31 . The first circuit region 33 is provided on one side of the first light receiving region 31 in the Y-axis direction. Each first circuit region 32 , 33 is electrically connected to the wiring board 2 by wires 11 .

The second image sensor 4 is configured by providing a second light receiving region 41 and second circuit regions 42 and 43 (see FIG. 3) on a second semiconductor substrate 40 . The second image sensor 4 is, for example, a solid-state imaging device such as CCD/CMOS. The second light receiving region 41 is composed of a plurality of pixels that perform photoelectric conversion. The second circuit regions 42 and 43 are signal readout circuits such as shift registers.

The second light receiving region 41 is provided on the surface 40 a of the second semiconductor substrate 40 opposite to the wiring substrate 2 . The second light receiving region 41 has, for example, a rectangular shape having a pair of sides perpendicular to the X-axis direction and a pair of sides perpendicular to the Y-axis direction when viewed from the Z-axis direction. Each second circuit region 42 , 43 is adjacent to the second light receiving region 41 . More specifically, the second circuit region 42 is provided on the side opposite to the first image sensor 3 with respect to the second light receiving region 41 . The second circuit region 43 is provided on one side of the second light receiving region 41 in the Y-axis direction. Each of the second circuit regions 42 and 43 is electrically connected to the wiring board 2 by wires 11 .

The first FOP 5 and the second FOP 6 are adjacent to each other on the first image sensor 3 and the second image sensor 4, respectively. More specifically, the first FOP 5 and the second FOP 6 are fixed to the surface 30a of the first semiconductor substrate 30 and the surface 40a of the second semiconductor substrate 40 with an adhesive or the like, and are adjacent to each other in the X-axis direction.

The first FOP 5 has a first light entrance surface 51 , a first light exit surface 52 and a first side surface 53 . The first light incident surface 51 is the surface opposite to the first image sensor 3 . The first light exit surface 52 is a surface on the first image sensor 3 side. The first side surface 53 is a surface connecting the first light entrance surface 51 and the first light exit surface 52 . The first FOP 5 has, for example, a rectangular plate shape having a pair of side surfaces perpendicular to the X-axis direction and a pair of side surfaces perpendicular to the Y-axis direction as first side surfaces 53 .

Each of the plurality of optical fibers constituting the first FOP 5 has a first light entrance surface 51 and a first light exit surface 51 such that the light exit end is located on the opposite side of the second FOP 6 in the X-axis direction with respect to the light entrance end. It is inclined at an angle of, for example, 67° with each of the surfaces 52 . In the first FOP 5 , an optical fiber whose light incident end is located on the first light incident surface 51 and whose light emitting end is located on the first light emitting surface 52 is guided from the first light incident surface 51 to the first light emitting surface 52 . It is an optical fiber capable of light. In the first FOP 5, the first light incident area 54 is formed on the first light incident surface 51 by the light incident ends of the plurality of optical fibers capable of guiding light, and the light emitting ends of the plurality of optical fibers capable of guiding light form the first light incident region 54. A first light emitting area 55 is formed on one light emitting surface 52 . That is, in the first FOP 5 , light can be guided between the first light incident area 54 of the first light incident surface 51 and the first light exit area 55 of the first light exit surface 52 . Each of the first light incident area 54 and the first light emitting area 55 has, for example, a rectangular shape having a pair of sides perpendicular to the X-axis direction and a pair of sides perpendicular to the Y-axis direction.

The second FOP 6 has a second light entrance surface 61 , a second light exit surface 62 and a second side surface 63 . The second light incident surface 61 is the surface opposite to the second image sensor 4 . The second light exit surface 62 is the surface on the second image sensor 4 side. The second side surface 63 is a surface connecting the second light entrance surface 61 and the second light exit surface 62 . The second FOP 6 has, for example, a rectangular plate shape having a pair of side surfaces perpendicular to the X-axis direction and a pair of side surfaces perpendicular to the Y-axis direction as second side surfaces 63 .

Each of the plurality of optical fibers constituting the second FOP 6 has a second light entrance surface 61 and a second light exit surface such that the light exit end is located on the opposite side of the first FOP 5 in the X-axis direction with respect to the light entrance end. It is inclined at an angle of, for example, 67° with each of the surfaces 62 . In the second FOP 6 , an optical fiber whose light incident end is located on the second light incident surface 61 and whose light emitting end is located on the second light emitting surface 62 is guided from the second light incident surface 61 to the second light emitting surface 62 . It is an optical fiber capable of light. In the second FOP 6, a second light incident area 64 is formed on the second light incident surface 61 by the light incident ends of the plurality of optical fibers capable of guiding light, and the second light incident area 64 is formed by the light emitting ends of the plurality of optical fibers capable of guiding light. A second light emitting area 65 is formed on the second light emitting surface 62 . That is, in the second FOP 6 , light can be guided between the second light incident area 64 of the second light incident surface 61 and the second light exit area 65 of the second light exit surface 62 . Each of the second light incident area 64 and the second light emitting area 65 has, for example, a rectangular shape having a pair of sides perpendicular to the X-axis direction and a pair of sides perpendicular to the Y-axis direction.

A side 54a of the first light incidence region 54 on the side of the second light incidence region 64 and a side 64a of the second light incidence region 64 on the side of the first light incidence region 54 are in contact (line contact) with each other. The first light emitting area 55 is positioned above the first light receiving area 31 of the first image sensor 3 . A side 55a of the first light emitting region 55 on the second light emitting region 65 side is positioned on or inside the side 31a of the first light receiving region 31 on the second light receiving region 41 side. The second light emitting area 65 is positioned above the second light receiving area 41 of the second image sensor 4 . A side 65a of the second light emitting region 65 on the side of the first light emitting region 55 is positioned on or inside the side 41a of the second light receiving region 41 on the side of the first light receiving region 31. The distance between the side 55 a of the first light emitting region 55 and the side 65 a of the second light emitting region 65 is greater than the distance between the side 31 a of the first light receiving region 31 and the side 41 a of the second light receiving region 41 . Here, when viewed from the Z-axis direction, the outer edge of the first light receiving region 31 includes the outer edge of the first light emitting region 55, and the outer edge of the second light receiving region 41 includes the outer edge of the second light emitting region 65. Including the outer edge.

Here, when each of the plurality of optical fibers constituting the first FOP 5 is inclined with respect to the light input end so that the light output end is located on the opposite side of the second FOP 6 in the X-axis direction, the first FOP 5 The angle (tilt angle) formed by each of the plurality of optical fibers constituting the . Further, when each of the plurality of optical fibers constituting the second FOP 6 is inclined with respect to the light input end so that the light output end is located on the opposite side of the first FOP 5 in the X-axis direction, the second FOP 6 is Let θ2 be the angle (tilt angle) formed by each of the plurality of constituent optical fibers with respect to each of the second light entrance surface 61 and the second light exit surface 62 . Furthermore, let T be the thickness of each of the first FOP 5 and the second FOP 6 . In this case, assuming that the distance between one side 55a of the first light emitting region 55 and one side 65a of the second light emitting region 65 is D1, D1=T(1/tan θ1+1/tan θ2). Therefore, when the distance between the side 31a of the first light receiving region 31 and the side 41a of the second light receiving region 41 is D2, the first FOP 5 is arranged so as to satisfy D1>D2, that is, T(1/tan θ1+1/tan θ2)>D2. and the inclination angle θ2 of the plurality of optical fibers forming the second FOP 6 can be determined.

As shown in FIG. 3, the outer edges E1 of the first light incident surface 51 and the second light incident surface 61 that are continuous with each other are the first light receiving area 31, the first circuit area 32, and the first light receiving area 31, when viewed from the Z-axis direction. 33, a second light receiving area 41 and second circuit areas 42,43. Similarly, the outer edges E2 of the first light emitting surface 52 and the second light emitting surface 62 that are continuous with each other are the first light receiving region 31, the first circuit regions 32 and 33, the second light receiving region 31, the first circuit regions 32 and 33, and the second light receiving region 31 when viewed from the Z-axis direction. A region 41 and second circuit regions 42 and 43 are included. It should be noted that illustration of the housing 9 is omitted in FIG.

As shown in FIGS. 1 and 2, one side surface 53a of the first side surface 53 of the first FOP 5 on the side of the second FOP 6 and one side surface 63a of the second side surface 63 of the second FOP 6 on the side of the first FOP 5 are shaped along each other. and are in contact with each other (surface contact). The first FOP 5 and the second FOP 6 are joined to each other by an adhesive or the like at the one side surface 53a and the one side surface 63a that are in contact with each other. In the state in which the first FOP 5 and the second FOP 6 are joined together, the first light incident surface 51 and the second light incident surface 61 are positioned on the same plane (for example, a plane perpendicular to the Z axis). The light exit surface 52 and the second light exit surface 62 are located on the same plane (for example, a plane perpendicular to the Z axis).

A scintillator layer 7 is provided on the first FOP 5 and the second FOP 6 . More specifically, the scintillator layer 7 is formed on the first light incident surface 51 of the first FOP 5 and the second light incident surface 61 of the second FOP 6 so as to cover the first light incident area 54 and the second light incident area 64. ing. The scintillator layer 7 is made of CsI, GOS, or the like, for example, and generates light in response to incident radiation.

The protective layer 8 covers the surface of the scintillator layer 7 excluding the surface in contact with the first FOP 5 and the second FOP 6 . The protective layer 8 is made of parylene or the like, and protects the scintillator layer 7 from moisture or the like.

The housing 9 accommodates the wiring board 2 , the first image sensor 3 , the second image sensor 4 , the first FOP 5 , the second FOP 6 , the scintillator layer 7 and the protective layer 8 . The housing 9 is made of plastic, for example, and protects the wiring board 2, the first image sensor 3, the second image sensor 4, the first FOP 5, the second FOP 6, the scintillator layer 7, and the protective layer 8 from external forces. , is transparent to radiation.

The wiring substrate 2 is provided with a storage section 21 and electrode pads 22 . The storage unit 21 is configured by, for example, a memory. A cable 23 extending outside through the wall of the housing 9 is connected to the electrode pad 22 . The cable 23 is used for the input/output of electrical signals to/from the wiring board 2, the supply of electric power, and the like.

The storage unit 21 stores the first deviation amount between the side 55 a of the first light emitting area 55 of the first FOP 5 and the side 31 a of the first light receiving area 31 of the first image sensor 3 and the second light emitting area 65 of the second FOP 6 . A second deviation amount between one side 65a and one side 41a of the second light receiving area 41 of the second image sensor 4 is stored. When the side 55a of the first light emitting region 55 is located on the side 31a of the first light receiving region 31, the storage unit 21 stores 0 as the first shift amount. When the side 65a of the second light emitting region 65 is located on the side 41a of the second light receiving region 41, the storage unit 21 stores 0 as the second shift amount.
[Method for manufacturing radiation detector]

A method for manufacturing the radiation detector 1 described above will be described. First, as shown in FIG. 4(a), an FOP block 10 is prepared. A plurality of optical fibers forming the FOP block 10 extend in a direction perpendicular to the main surface 10a of the FOP block 10, as schematically indicated by a two-dot chain line in FIG. 4(a). Subsequently, the FOP block 10 is cut at a plane inclined at an angle of, for example, 23° with the principal plane 10a, and as shown in FIG. Get block 60. 4B, each of the plurality of optical fibers forming the first FOP block 50 has an angle of, for example, 67° with the first main surface 50a of the first FOP block 50, as schematically shown by the two-dot chain line. It is tilted with the Similarly, each of the plurality of optical fibers forming the second FOP block 60 is inclined with respect to the second main surface 60a of the second FOP block 60 at an angle of 67°, for example.

Subsequently, as shown in FIG. 5(a), the plurality of optical fibers forming the first FOP block 50 and the plurality of optical fibers forming the second FOP block 60 are separated into the first main surface 50a and the second main surface 50a. The first FOP block 50 and the second FOP block 60 are joined to each other with an adhesive or the like such that the farther away from 60a, the farther away they are from each other. Subsequently, as shown in FIG. 5(b), the first FOP block 50 and the second FOP block 60 that are joined to each other are separated by planes perpendicular to and parallel to the first major surface 50a and the second major surface 60a. By cutting, as shown in FIG. 5(c), a plurality of first FOPs 5 and second FOPs 6 joined together are obtained. The above is the process of obtaining the first FOP 5 and the second FOP 6 which are joined together at the one side surface 53a of the first side surface 53 and the one side surface 63a of the second side surface 63 .

Subsequently, the first light entrance surface 51 of the first FOP 5 and the second light entrance surface 61 of the second FOP 6 are polished, and the first light exit surface 52 of the first FOP 5 and the second light exit surface 62 of the second FOP 6 are polished ( process of polishing). As a result, the first light entrance surface 51 and the second light entrance surface 61 are flush with each other, and the first light exit surface 52 and the second light exit surface 62 are flush with each other. The first light entrance surface 51 and the second light entrance surface 61 may be ground, and then the first light exit surface 52 and the second light exit surface 62 may be ground, or alternatively, the first light exit surface may be ground. 52 and the second light exit surface 62 may be polished, and then the first light entrance surface 51 and the second light entrance surface 61 may be polished.

On the other hand, as shown in (a) of FIG. 6, the first image sensor 3 and the second image sensor 4 are mounted on the wiring board 2 provided with the storage section 21 and the electrode pads 22 . Further, as shown in FIG. 6B, the scintillator layer 7 is formed on the first FOP 5 and the second FOP 6 so as to cover the first light incidence region 54 of the first FOP 5 and the second light incidence region 64 of the second FOP 6. (step of forming and bonding). Here, the scintillator layer 7 is formed on the first FOP 5 and the second FOP 6 by vapor-depositing a scintillator material on the first FOP 5 and the second FOP 6 . Subsequently, as shown in FIG. 7A, a protective layer 8 is formed to cover the surface of the scintillator layer 7 excluding the surfaces in contact with the first FOP 5 and the second FOP 6 .

Subsequently, as shown in (b) of FIG. 7, a first FOP 5 having a scintillator layer 7 and a protective layer 8 provided on the first image sensor 3 and the second image sensor 4 mounted on the wiring board 2; The second FOP 6 is joined with an adhesive or the like (step of forming and joining). At this time, the first light emitting area 55 of the first FOP 5 is located on the first light receiving area 31 of the first image sensor 3 and the second light emitting area 65 of the second FOP 6 is located on the second light receiving area 41 of the second image sensor 4 . Positioning is carried out so that it lies on top. The first FOP 5 and the second FOP 6 may be bonded onto the first image sensor 3 and the second image sensor 4 mounted on the wiring board 2, and then the scintillator layer 7 may be formed on the first FOP 5 and the second FOP 6. . For example, when the scintillator layer 7 is a film type, the first FOP 5 and the second FOP 6 are bonded on the first image sensor 3 and the second image sensor 4, and then the scintillator layer 7 is formed on the first FOP 5 and the second FOP 6. By sticking, the scintillator layer 7 can be formed on the first FOP 5 and the second FOP 6 .

Subsequently, as shown in FIG. 1, the wiring board 2, the first image sensor 3, the second image sensor 4, the first FOP 5, the second FOP 6, the scintillator layer 7 and the protective layer 8 are accommodated in the housing 9, and the wiring board A cable 23 connected to the second electrode pad 22 is pulled out through the wall of the housing 9 .

Subsequently, the cable 23 is connected to the image processing apparatus, and a radiographic image is acquired for a reference prepared in advance. Here, when one side 55a of the first light emitting region 55 of the first FOP 5 is located inside the one side 31a of the first light receiving region 31 of the first image sensor 3, the one side 55a of the first light emitting region 55 is positioned inside the one side 31a. and one side 31 a of the first light receiving region 31 , an area lacking pixel values is generated in the reference radiographic image. Similarly, when one side 65a of the second light emitting region 65 of the second FOP 6 is located inside the one side 41a of the second light receiving region 41 of the second image sensor 4, the one side 65a of the second light emitting region 65 is located. and one side 41 a of the second light receiving region 41 , an area lacking pixel values is generated in the radiographic image for the reference. Therefore, the first deviation amount and the second deviation amount are measured based on the reference radiographic image (measuring step).

Subsequently, the first shift amount and the second shift amount are stored in the storage unit 21 provided on the wiring board 2 (step of storing). Note that when the side 55a of the first light emitting region 55 is located on the side 31a of the first light receiving region 31, the first shift amount is zero. Similarly, when the side 65a of the second light emitting region 65 is positioned on the side 41a of the second light receiving region 41, the second shift amount is zero. The radiation detector 1 is obtained by the above.
[Image processing method]

An image processing method using the radiation detector 1 described above will be described. Here, a case of acquiring an intraoral X-ray transmission image as a radiographic image will be described.

First, the cable 23 is connected to the image processing device. Note that the wiring board 2 may be provided with a signal transmission section, and the wiring board 2 and the image processing apparatus may be wirelessly connected. Subsequently, the image processing apparatus acquires the first deviation amount and the second deviation amount from the storage unit 21 via the cable 23 (acquisition step). Subsequently, the housing 9 is placed in the oral cavity, and an intraoral X-ray transmission image is captured. Subsequently, the image processing device acquires the first electrical signal output from the first image sensor 3 and the second electrical signal output from the second image sensor 4 via the wiring board 2 and the cable 23. . Subsequently, the image processing device generates one X-ray transmission image based on the first electrical signal, the second electrical signal, and the first shift amount and the second shift amount (process of generating).

More specifically, when the image processing apparatus generates one X-ray transmission image without considering the first shift amount and the second shift amount, as shown in FIG. A gap (a region lacking pixel values) is formed between the image A2 and the image A2 based on the second electrical signal. As shown in FIG. 9, the gap corresponds to the first deviation amount S1 and the second deviation amount S2. Therefore, the image processing apparatus removes the gap in consideration of the first shift amount S1 and the second shift amount S2, so that the image A1 based on the first electrical signal is displayed without the gap, as shown in FIG. and the image A2 based on the second electrical signal are combined to generate a single X-ray transmission image A10.
[Action and effect]

As described above, in the radiation detector 1 , light is generated in the scintillator layer 7 when radiation (for example, X-rays) is incident on the scintillator layer 7 . The light incident on the first FOP 5 from the scintillator layer 7 is guided from the first light incident area 54 to the first light emitting area 55 and enters the first light receiving area 31 of the first image sensor 3 . On the other hand, the light incident on the second FOP 6 from the scintillator layer 7 is guided from the second light incident area 64 to the second light emitting area 65 and enters the second light receiving area 41 of the second image sensor 4 . Here, the side 54a of the first light incident region 54 on the side of the second light incident region 64 and the side 64a of the second light incident region 64 on the side of the first light incident region 54 are in contact with each other. Therefore, the light generated by the scintillator layer 7 is continuously detected by the first image sensor 3 and the second image sensor 4 . One side surface 53a of the first side surface 53 on the side of the second FOP 6 and one side surface 63a of the second side surface 63 on the side of the first FOP 5 are shaped along each other and are in contact with each other. Therefore, positional deviation is less likely to occur between the first light incident surface 51 of the first FOP 5 and the second light incident surface 61 of the second FOP 6 . Therefore, according to the radiation detector 1, a radiographic image can be obtained over a wide range with high accuracy.

In the radiation detector 1, the distance between the side 55a of the first light emission region 55 on the side of the second light emission region 65 and the side 65a of the second light emission region 65 on the side of the first light emission region 55 is the first It is larger than the distance between the side 31a of the light receiving region 31 on the side of the second light receiving region 41 and the side 41a of the second light receiving region 41 on the side of the first light receiving region 31 . A side 55a of the first light emitting region 55 on the side of the second light emitting region 65 is located on or inside the side 31a of the first light receiving region 31 on the side of the second light receiving region 41, A side 65a of the second light emitting region 65 on the side of the first light emitting region 55 is positioned on or inside the side 41a of the second light receiving region 41 on the side of the first light receiving region 31. With this configuration, while relaxing the positioning accuracy of the first FOP 5 and the second FOP 6 with respect to the first image sensor 3 and the second image sensor 4, the light guided by the first FOP 5 and the second FOP 6 can be transferred to the first image sensor 3 and the second image sensor 4 respectively. 2 can be reliably detected by the image sensor 4 .

In the radiation detector 1, the storage section 21 provided on the wiring board 2 is arranged such that the side 55a of the first light emitting region 55 on the side of the second light emitting region 65 and the side 55a of the first light receiving region 31 on the side of the second light receiving region 41 side. A first deviation amount from the side 31a, and a second deviation between the side 65a of the second light emitting region 65 on the side of the first light emitting region 55 and the side 41a of the second light receiving region 41 on the side of the first light receiving region 31 remember the quantity. With this configuration, one continuous radiographic image can be generated based on the first shift amount and the second shift amount.

Further, in the radiation detector 1, when the outer edge E1 of the first light incident surface 51 and the second light incident surface 61 which are continuous with each other is viewed from the Z-axis direction, the first light receiving area 31, the first circuit area 32, 33, a second light receiving region 41 and second circuit regions 42, 43 (hereinafter referred to as "first light receiving region 31, etc."). Similarly, the outer edges E2 of the first light exit surface 52 and the second light exit surface 62 that are continuous with each other include the first light receiving area 31 and the like when viewed from the Z-axis direction. With this configuration, the first FOP 5 and the second FOP 6 have a sufficient thickness (that is, a thickness corresponding to the distance between the first light incident surface 51 and the first light emitting surface 52) on the radiation incident side of the first light receiving region 31 and the like. , a thickness corresponding to the distance between the second light incident surface 61 and the second light emitting surface 62), deterioration of the first light receiving region 31 and the like due to radiation can be suppressed.

Further, in the radiation detector 1, each of the plurality of optical fibers forming the first FOP 5 is inclined at an angle other than 90° with the first light receiving region 31 of the first image sensor 3. is inclined at an angle other than 90° with respect to the second light receiving region 41 of the second image sensor 4 . With this configuration, deterioration of the first light-receiving region 31 due to radiation can be suppressed, for example, compared to the case where each of the plurality of optical fibers forming the first FOP 5 forms an angle of 90° with the first light-receiving region 31 . Similarly, for example, deterioration of the second light receiving region 41 due to radiation can be suppressed compared to the case where each of the plurality of optical fibers forming the second FOP 6 forms an angle of 90° with the second light receiving region 41 . Moreover, in both the first FOP 5 and the second FOP 6, since each of the plurality of optical fibers constituting them is inclined, the degree of deterioration of the first light receiving region 31 due to radiation and the deterioration of the second light receiving region 41 due to radiation are different. Therefore, it becomes difficult for the output value from the first light-receiving region 31 and the output value from the second light-receiving region 41 to differ due to the difference in the degree of deterioration due to radiation.

Further, in the manufacturing method of the radiation detector 1, the steps of obtaining the first FOP 5 and the second FOP 6 that are joined together, and polishing the first light incident surface 51 of the first FOP 5 and the second light incident surface 61 of the second FOP 6 are performed. , the first light incident surface 51 of the first FOP 5 and the second light incident surface 61 of the second FOP 6 can be easily and reliably flushed. Moreover, when the scintillator layer 7 is formed by vapor deposition through the step of forming the scintillator layer 7 in a state in which the first light incident surface 51 and the second light incident surface 61 are flush with each other, or Even when the scintillator layer 7 is formed by sticking, it is possible to suppress the occurrence of distortion or the like in the scintillator layer 7 . Therefore, according to the manufacturing method of the radiation detector 1, it is possible to reliably manufacture the radiation detector 1 capable of accurately acquiring a radiographic image over a wide range.

Further, in the manufacturing method of the radiation detector 1, the scintillator layer 7 is formed on the first FOP 5 and the second FOP 6, and then on the first image sensor 3 and the second image sensor 4 mounted on the wiring board 2, The first FOP 5 and the second FOP 6 are joined together. In this case, the scintillator layer 7 formed on the first FOP 5 and the second FOP 6 can be inspected before bonding to the relatively expensive first image sensor 3 and the second image sensor 4. Therefore, for example, a defect in the scintillator layer 7 can be detected. If there is, the first image sensor 3 and the second image sensor 4 are not wasted, and as a result, an increase in manufacturing cost can be suppressed.

Moreover, in the manufacturing method of the radiation detector 1, the scintillator layer 7 is formed of CsI. Here, since the scintillator layer 7 is formed in advance on the first FOP 5 and the second FOP 6, the first image sensor 3, the second image sensor 4, and the wiring board 2 are prevented from being damaged due to the corrosiveness of CsI. can be suppressed.

In the manufacturing method of the radiation detector 1, in the step of polishing, the first light entrance surface 51 of the first FOP 5 and the second light entrance surface 61 of the second FOP 6 are polished, and the first light exit surface 52 of the first FOP 5 and the second light entrance surface 61 of the second FOP 6 are polished. The second light exit surface 62 of the second FOP 6 is polished. In this case, in the step of bonding the first FOP 5 and the second FOP 6 onto the first image sensor 3 and the second image sensor 4, the first light emitting region 55 of the first FOP 5 and the first light receiving region 31 of the first image sensor 3 The distance and the distance between the second light emitting area 65 of the second FOP 6 and the second light receiving area 41 of the second image sensor 4 can be made uniform. Therefore, in this case, it is possible to more reliably manufacture the radiation detector 1 capable of accurately acquiring a radiation image over a wide range.

Further, in the method for manufacturing the radiation detector 1, since the first deviation amount and the second deviation amount unique to each radiation detector 1 are stored in the storage unit 21, the stored first deviation amount and the second deviation amount are stored. It is possible to manufacture the radiation detector 1 capable of accurately generating one radiographic image based on the quantity.

In addition, in the image processing method using the radiation detector 1, since the first deviation amount and the second deviation amount unique to each radiation detector 1 are acquired, the acquired first deviation amount and the second deviation amount One sheet of radiographic image can be generated with high accuracy based on.
[Modification]

The invention is not limited to the embodiments described above. For example, the first light incident region 54 of the first FOP 5 and the second light incident region 64 of the second FOP 6 are in contact (line contact) at the side 54a of the first light incident region 54 and the side 64a of the second light incident region 64, respectively. ), it may have a shape other than a rectangular shape (for example, a polygonal shape other than a rectangular shape). In some cases, along one side 54 a of the first light incident area 54 , an optical fiber that cannot guide light (for example, an optical fiber with a part of the light incident end missing) may exist partially. Similarly, along one side 64 a of the second light incident area 64 , there may be a part of an optical fiber that cannot guide light (for example, an optical fiber with a part of the light incident end missing).

Also, each of the first FOP 5 and the second FOP 6 is rectangular if the one side 53a of the first side 53 and the one side 63a of the second side 63 are shaped along each other and are in contact with each other (surface contact). It may have a shape other than a plate shape (for example, a polygonal plate shape other than a rectangular plate shape). As an example, the one side surface 53a and the one side surface 63a may be inclined with respect to the first light incident surface 51 and the second light incident surface 61 at an angle other than 90°.

One side 54a of the first light incident region 54 and one side 64a of the second light incident region 64 are in contact (line contact) with each other, and one side 53a of the first side 53 and one side 63a of the second side 63 are along each other. 11A, a plurality of optical fibers forming the first FOP 5 (or a plurality of optical fibers forming the second FOP 6) are shown in FIG. ) may extend in a direction perpendicular to the first light entrance surface 51 and the second light entrance surface 61 .

One side 54a of the first light incident region 54 and one side 64a of the second light incident region 64 are in contact (line contact) with each other, and one side 53a of the first side 53 and one side 63a of the second side 63 are along each other. 11B, the length of the first FOP 5 and the length of the second FOP 6 in the X-axis direction are different from each other, as shown in FIG. 11B. may Also, if the same condition is satisfied, the length of the first FOP 5 and the length of the second FOP 6 in the Y-axis direction may be different from each other, as shown in FIG. 12(a). Also, if the same condition is satisfied, the first FOP 5 and the second FOP 6 may be arranged in a state of being shifted from each other in the Y-axis direction, as shown in FIG. 12(b).

The radiation detector 1 further includes a third FOP 13 having a third light entrance surface 131, a third light exit surface 132 and a third side surface 133, as shown in FIG. may be arranged in series. In the configuration shown in FIG. 13, in the FOPs adjacent to each other, one side of one light incidence area on the side of the other light incidence area and one side of the other light incidence area on the side of the one light incidence area are in contact with each other (line contact). ), and one side surface of one FOP side on the other FOP side and one side surface of the other FOP side on the one FOP side exhibit a shape along each other and are in contact with each other (surface contact). there is In addition, the third FOP 13 is provided on the third image sensor 12 having the third light receiving area 121 . A plurality of optical fibers forming the second FOP 6 arranged between the first FOP 5 and the third FOP 13 extend in a direction perpendicular to the second light incident surface 61 .

14, the radiation detector 1 includes a third FOP 13 having a third light entrance surface 131, a third light exit surface 132, and a third side surface 133, a fourth light entrance surface 141, a third light A fourth FOP 14 having an exit surface (not shown) and a fourth side surface 143 may be further provided, and the first FOP 5, second FOP 6, third FOP 13, and fourth FOP 14 may be arranged in a matrix. In the configuration shown in FIG. 14, in the FOPs adjacent to each other, one side of one light incidence area on the side of the other light incidence area and one side of the other light incidence area on the side of the one light incidence area are in contact with each other (line contact). ), and one side surface of one FOP side on the other FOP side and one side surface of the other FOP side on the one FOP side exhibit a shape along each other and are in contact with each other (surface contact). there is The third FOP 13 is provided on the third image sensor 12 having the third light receiving area 121, and the fourth FOP 14 is provided on the fourth image sensor (not shown) having the fourth light receiving area.

Further, the outer edge E1 of the first light entrance surface 51 and the second light entrance surface 61 that are continuous with each other, and the outer edge E2 of the first light exit surface 52 and the second light exit surface 62 that are continuous with each other are In this case, at least the first light receiving region 31 and the second light receiving region 41 should be included. Even in that case, it is possible to suppress deterioration of at least the first light receiving region 31 and the second light receiving region 41 due to radiation.

Moreover, in the manufacturing method of the radiation detector 1, at least the first light incident surface 51 and the second light incident surface 61 of the first FOP 5 and the second FOP 6 which are joined to each other should be polished. Even in that case, the scintillator layer 7 can be formed on the first FOP 5 and the second FOP 6 with the first light incident surface 51 and the second light incident surface 61 flush with each other. can be suppressed.

Further, in the manufacturing method of the radiation detector 1, in the bonding step, the first FOP 5 and the second FOP 6 are bonded onto the first image sensor 3 and the second image sensor 4 mounted on the wiring board 2, and then the second FOP 5 and the second FOP 6 are bonded. A scintillator layer 7 may be formed on the first FOP 5 and the second FOP 6 . In this case, since the scintillator layer 7 having a lower strength than other members is formed last, it is possible to suppress damage to the scintillator layer 7 .

Moreover, in the manufacturing method of the radiation detector 1 , it is not necessary to store the first shift amount and the second shift amount in the storage section 21 provided on the wiring board 2 . In that case, in the image processing method using the radiation detector 1, for example, the image processing device reads out the first shift amount and the second shift amount separately stored in the storage unit, thereby obtaining the first shift amount and the second shift amount. Acquiring the amount of deviation (acquiring step), and the image processing device generates one X-ray transmission image based on the first electrical signal, the second electrical signal, and the first amount of deviation and the second amount of deviation. may be used (step of generating). Further, in an X-ray transmission image generated by the image processing apparatus without considering the first shift amount and the second shift amount, a gap generated between an image based on the first electrical signal and an image based on the second electrical signal By extracting (the region lacking the pixel value) based on the pixel value, the first deviation amount and the second deviation amount are acquired (acquisition step), and the image processing device outputs the first electrical signal and the second electrical signal. A single X-ray transmission image may be generated based on the signal and the first shift amount and the second shift amount (step of generating).

Further, in the manufacturing method of the radiation detector 1, the scintillator layer 7 is formed on the first FOP 5 and the second FOP 6, and the first FOP 5 and the second image sensor 4 mounted on the wiring board 2 are formed. 2FOP 6 is joined (step of forming and joining), after that, the first displacement amount and the second displacement amount are measured (step of measuring), and then the first The shift amount and the second shift amount may be stored (step of storing). In that case, it is not essential to prepare in advance the first FOP 5 and the second FOP 6 that are joined together, and to polish the first light entrance surface 51 of the first FOP 5 and the second light entrance surface 61 of the second FOP 6.

In addition, "the wiring board, the first image sensor and the second image sensor that are adjacent to each other on the wiring board, and the first fiber optic plate and the second fiber optic plate that are adjacent to each other on the first image sensor and the second image sensor" and a scintillator layer provided on the first fiber optic plate and the second fiber optic plate, wherein the first fiber optic plate has a first light entrance surface, a first light exit surface, and a first light entrance surface. It has a first side surface that connects the surface and the second light emitting surface, and guides light between the first light incident area of the first light incident surface and the first light emitting area of the first light emitting surface. The second fiber optic plate has a second light entrance surface, a second light exit surface, and a second side surface connecting the second light entrance surface and the second light exit surface, and the second light entrance surface Light can be guided between the second light incident area of the surface and the second light emitting area of the second light emitting surface, one side of the first light incident area on the side of the second light incident area, and One side of the second light incident area on the side of the first light incident area is in contact with each other, the first light emitting area is positioned on the first light receiving area of the first image sensor, and the second light emitting area can implement the following method for a "radiation detector" (referred to as "another type of radiation detector") located on the second light receiving area of the second image sensor.

That is, in another embodiment of the method for manufacturing a radiation detector, "a scintillator layer is formed on the first fiber optic plate and the second fiber optic plate, and the first image sensor and the second image sensor mounted on the wiring board are bonding a first fiber optic plate and a second fiber optic plate on two image sensors; measuring first and second deviation amounts after forming and bonding; and a step of storing the first shift amount and the second shift amount in a storage unit provided on the wiring board."

According to the method of manufacturing a radiation detector of another aspect, since the first deviation amount and the second deviation amount unique to each radiation detector are stored in the storage unit, the stored first deviation amount and the second deviation amount are stored. It is possible to manufacture a radiation detector capable of accurately generating one radiographic image based on the two deviation amounts.

Further, in another aspect of the image processing method using another aspect of the radiation detector, "one side of the first light emitting area on the side of the second light emitting area and the side of the first light receiving area on the side of the second light receiving area obtaining a first deviation amount from one side and a second deviation amount between one side of the second light output area on the first light emitting area side and one side of the second light receiving area on the first light receiving area side; after the step, the first electrical signal output from the first image sensor via the wiring board, the second electrical signal output from the second image sensor via the wiring board, the first deviation amount and and generating one radiographic image based on the second shift amount."

According to this other form of image processing method, since the first deviation amount and the second deviation amount unique to each radiation detector are acquired, based on the acquired first deviation amount and the second deviation amount, A single radiographic image can be generated with high accuracy.

DESCRIPTION OF SYMBOLS 1... Radiation detector, 2... Wiring board, 3... First image sensor, 4... Second image sensor, 5... First FOP (first fiber optic plate), 6... Second FOP (second fiber optic plate), 7 Scintillator layer 21 Storage unit 31 First light receiving region 31a One side 32, 33 First circuit region 41 Second light receiving region 41a One side 42, 43 Second circuit region 51 1st light entrance surface 52 1st light exit surface 53 1st side surface 53a 1 side surface 54 1st light entrance area 54a 1 side 55 1st light exit area 55a 1 side 61... Second light incident surface 62... Second light emitting surface 63... Second side surface 63a... One side surface 64... Second light incident area 64a... One side 65... Second light emitting area 65a... One side .

Claims (15)

a wiring board;
a first image sensor and a second image sensor adjacent to each other on the wiring substrate;
a first fiber optic plate and a second fiber optic plate adjacent to each other on the first image sensor and the second image sensor;
a scintillator layer provided on the first fiber optic plate and the second fiber optic plate;
The first fiber optic plate has a first light incident surface and a first light exit surface, wherein a first light incident region of the first light incident surface and a first light of the first light exit surface. light can be guided between the output region,
The second fiber optic plate has a second light entrance surface and a second light exit surface, wherein a second light entrance area of the second light entrance surface and a second light beam of the second light exit surface. light can be guided between the output region,
one side of the first light exit surface on the second light exit surface side and one side of the second light exit surface on the first light exit surface side are in contact with each other,
one side of the first light incident area on the second light incident area side and one side of the second light incident area on the first light incident area side are in contact with each other;
The first light emitting area is located on the first light receiving area of the first image sensor,
The second light emitting area is located on the second light receiving area of the second image sensor,
The plurality of optical fibers that make up the first fiber optic plate extend in a direction that intersects the direction in which the plurality of optical fibers that make up the second fiber optic plate extend,
radiation detector. The distance between one side of the first light emitting region on the side of the second light emitting region and one side of the second light emitting region on the side of the first light emitting region is the second light receiving region side of the first light receiving region. larger than the distance between one side and one side of the second light receiving region on the side of the first light receiving region,
the one side of the first light emitting region on the second light emitting region side is located on or inside the one side of the first light receiving region on the second light receiving region side,
2. The one side of the second light emitting region on the side of the first light emitting region is located on or inside the one side of the second light receiving region on the side of the first light receiving region. The radiation detector according to . Further comprising a storage unit provided on the wiring board,
The storage unit stores a first shift amount between the one side of the first light emitting region on the second light emitting region side and the one side of the first light receiving region on the second light receiving region side, and the second 3. The radiation detection according to claim 2, wherein a second deviation amount between said one side of said light emitting region on said first light emitting region side and said one side of said second light receiving region on said first light receiving region side is stored. vessel. Outer edges of the first light incident surface and the second light incident surface that are continuous with each other include the first light emitting area and the second light emitting area when viewed from the thickness direction of the wiring board. A radiation detector according to any one of claims 1 to 3. The outer edges of the first light entrance surface and the second light entrance surface that are continuous with each other, and the outer edges of the first light exit surface and the second light exit surface that are continuous with each other are viewed from the thickness direction of the wiring board. A radiation detector according to any one of claims 1 to 4, comprising said first light receiving area and said second light receiving area, if any. The first image sensor has a first circuit region adjacent to the first light receiving region,
The second image sensor has a second circuit region adjacent to the second light receiving region,
The outer edges of the first light entrance surface and the second light entrance surface that are continuous with each other, and the outer edges of the first light exit surface and the second light exit surface that are continuous with each other are arranged in the thickness direction of the wiring board. 6. The radiation detector of claim 5, comprising said first light receiving area, said first circuit area, said second light receiving area and said second circuit area when viewed from above. The radiation detector according to any one of claims 1 to 6, wherein said plurality of optical fibers constituting said first fiber optic plate extend in a direction perpendicular to said first light incident surface. the plurality of optical fibers constituting the first fiber optic plate are inclined with respect to a direction perpendicular to the first light incident surface;
The radiation detector according to any one of claims 1 to 6, wherein said plurality of optical fibers constituting said second fiber optic plate are inclined with respect to a direction perpendicular to said second light incident surface. . A method for manufacturing the radiation detector according to any one of claims 1 to 8,
obtaining the first fiber optic plate and the second fiber optic plate bonded together;
polishing the first light incident surface of the first fiber optic plate and the second light incident surface of the second fiber optic plate after the acquiring step;
After the polishing step, forming the scintillator layer on the first fiber optic plate and the second fiber optic plate, and on the first image sensor and the second image sensor mounted on the wiring substrate and a step of bonding the first fiber optic plate and the second fiber optic plate. In the bonding step, the scintillator layer is formed on the first fiber optic plate and the second fiber optic plate, and then the first image sensor and the second image mounted on the wiring board. 10. The method of manufacturing a radiation detector according to claim 9, wherein the first fiber optic plate and the second fiber optic plate are bonded on the sensor. 11. The method of manufacturing a radiation detector according to claim 10, wherein the scintillator layer is made of CsI. In the bonding step, the first fiber optic plate and the second fiber optic plate are bonded onto the first image sensor and the second image sensor mounted on the wiring board, and then the second image sensor is mounted on the wiring board. 10. The method of manufacturing a radiation detector according to claim 9, wherein said scintillator layer is formed on said one fiber optic plate and said second fiber optic plate. In the polishing step, the first light incident surface of the first fiber optic plate and the second light incident surface of the second fiber optic plate are polished, and the first light incident surface of the first fiber optic plate is polished. The method of manufacturing a radiation detector according to any one of claims 9 to 12, wherein the emission surface and the second light emission surface of the second fiber optic plate are polished. A method for manufacturing the radiation detector according to claim 3,
The scintillator layer is formed on the first fiber optic plate and the second fiber optic plate, and the first fiber optic is formed on the first image sensor and the second image sensor mounted on the wiring board. bonding a plate and the second fiber optic plate;
measuring the first shift amount and the second shift amount after the forming and bonding;
A method of manufacturing a radiation detector, comprising: storing the first deviation amount and the second deviation amount in the storage unit provided on the wiring board after the measuring step. An image processing method using the radiation detector according to claim 2,
a first deviation amount between the one side of the first light emitting region on the second light emitting region side and the one side of the first light receiving region on the second light receiving region side; obtaining a second deviation amount between the side of the first light emitting region and the side of the second light receiving region on the side of the first light receiving region;
After the obtaining step, a first electrical signal output from the first image sensor via the wiring board, a second electrical signal output from the second image sensor via the wiring board, and and generating one radiographic image based on the first shift amount and the second shift amount.

Images